JP5973689B1 - Printed wiring board and method for manufacturing printed wiring board - Google Patents

Abstract

A printed wiring board (1) for mounting components via solder, comprising a laminated structure in which a substrate material layer (5) and a patterned conductor layer (6) are laminated on the surface of the substrate material layer (2), a coating layer (3) in which an opening (16) having an opening shape corresponding to predetermined information of the component is formed, covering the surface of the laminate other than the soldering, and the opening And a symbol part (17) representing the predetermined information of the part.

Description

  The present invention relates to a printed wiring board having a symbol mark and a manufacturing method thereof.

  The printed wiring board is formed with rectangles, round figures and arrows indicating the position, size, polarity direction, etc. of the electronic components to be mounted, and symbol marks indicating the numbers of the electronic components and the abbreviations of the model numbers. ing. The symbol mark is formed by printing non-conductive ink on an insulating film made of a solder resist. By forming such a symbol mark, it is possible to easily mount and repair components on the printed wiring board.

  As prior art relating to the formation of the symbol mark, for example, Patent Document 1 and Patent Document 2 disclose a printed wiring board including the symbol mark. In particular, Patent Document 1 discloses a printed wiring board including a symbol mark with a moisture absorption identification function that allows visual confirmation of moisture absorption. Patent Document 2 discloses a printed wiring board in which the number of symbol marks formed is larger than that of wiring patterns and the like.

JP 2007-305639 A JP 2008-135680 A

  However, since the symbol mark is formed on the insulating film, the thickness of the symbol mark is added to the printed wiring board, making it difficult to reduce the thickness of the printed wiring board itself. Further, since the adhesion between the solder resist and the symbol mark material is low, the symbol mark itself is peeled off or chipped, resulting in a problem of the printed wiring board itself.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a printed wiring board that is reduced in thickness and prevented from peeling and chipping, and a method for manufacturing the same. is there.

In order to achieve the above object, a printed wiring board of the present invention is a printed wiring board on which components are mounted via solder, in which a substrate material layer and a patterned conductor layer are stacked on the surface of the substrate material layer. A laminate having a laminated structure, a coating layer that covers the surface of the laminate other than the solder, and has an opening having an opening shape corresponding to predetermined information of the component, and filling the opening have a, a symbol section representing the predetermined information of the component, the coating layer has a first insulating film formed on the surface of the laminate, and a second insulating film formed on said first insulating film The opening is formed in the second insulating film so as to expose the first insulating film .

In order to achieve the above object, the printed wiring board manufacturing method of the present invention is a printed wiring board manufacturing method for mounting components via solder, and is patterned on the surface of the substrate material layer. A preparatory step of preparing a laminate including a structure in which conductor layers are laminated, and a coating layer including an opening having an opening shape corresponding to predetermined information of the component on the surface of the laminate other than the soldering. a coating layer forming step of forming, the insulation material filled in the opening of the coating layer, is to have a, a symbol portion forming step of forming a symbol section representing the predetermined information of the component.

  According to the present invention, it is possible to provide a printed wiring board in which the thickness is reduced and peeling and chipping are prevented, and a manufacturing method capable of manufacturing the printed wiring board.

It is a partial expanded sectional view of the printed wiring board concerning the example of the present invention. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view in the manufacturing process of a printed wiring board shown like FIG. It is a partial expanded sectional view of the printed wiring board which concerns on the modification of this invention.

  Hereinafter, embodiments of the present invention will be described in detail based on examples and modifications with reference to the drawings. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for explaining the embodiments and the modification schematically show the printed wiring board and its constituent members according to the present invention, and are partially emphasized, enlarged, reduced, or deepened for better understanding. Omitted etc., there are cases where the printed wiring board and its constituent members do not accurately represent the scale, shape, or the like. Furthermore, various numerical values used in the embodiments and the modification examples may be shown as examples, and can be variously changed as necessary.

<Example>
(Structure of printed wiring board)
First, the structure of a printed wiring board according to an embodiment of the present invention will be described in detail with reference to FIG. Here, FIG. 1 is a partially enlarged sectional view of the printed wiring board according to the present embodiment.

  As shown in FIG. 1, a printed wiring board 1 according to the present embodiment includes a laminate 2, a first coating layer 3 formed on the first surface 2 a side of the laminate 2, and a second of the laminate 2. It has the 2nd coating layer 4 formed in the surface 2b side. The laminate 2 includes a substrate material layer 5, a first conductor layer 6 formed on the first surface 5 a of the substrate material layer 5, and a second conductor formed on the second surface 5 b of the substrate material layer 5. It is composed of layer 7. Further, the first coating layer 3 is composed of a first insulating film 11 and a second insulating film 12, and the second coating layer 4 is composed of a third insulating film 13 and a fourth insulating film 14.

  The substrate material layer 5 may be an insulating layer composed only of an insulating material, or a substrate in which a plurality of insulating layers and a plurality of conductor layers serving as inner wirings are stacked to form via holes, through holes, and the like. It may be a material. The first conductor layer 6 and the second conductor layer 7 are patterned, and function as outer layer wiring of the printed wiring board 1 and connection pads for components for mounting. In this embodiment, the constituent material of the first conductor layer 6 and the second conductor layer 7 is copper, but other metal materials such as gold and silver may be used.

  As can be seen from FIG. 1, the first insulating film 11 is a part of the first surface 2 a of the multilayer body 2 so as to surround the first conductor layer 6 by being separated from the first conductor layer 6 by a predetermined distance. Is covered. Further, since the second insulating film 12 is formed only on the first insulating film 11, the second insulating film 12 is separated from the first conductor layer 6 by a predetermined distance and surrounds the first conductor layer 6. In other words, the first coating layer 3 is part of the first surface 2a of the multilayer body 2 so as to surround the first conductor layer 6 at a predetermined distance from the first conductor layer 6. And has an opening 15. Here, the first coating layer 3 is a region to which solder used for mounting a component is attached, and a region where the first coating layer 3 is formed is a region that does not need to be soldered.

  In the present embodiment, the film thicknesses of the first insulating film 11 and the second insulating film 12 are different, and the film thickness of the second insulating film 12 is larger than the film thickness of the first insulating film 11. Yes. For example, the film thickness of the first insulating film 11 is 20 μm, and the film thickness of the second insulating film 12 is 30 μm. Note that the film thickness difference between the first insulating film 11 and the second insulating film 12 is not essential, and the film thickness difference can be eliminated or the first insulating film can be removed depending on the characteristics and cost required for the printed wiring board 1. The film 11 may be thickened.

  Here, the thickness of the first insulating film 11 is set to be generally larger than the thickness of the first conductor layer 6. However, the first conductor layer 6 may be thicker than the first insulating film 11, or the first conductor layer 6 may protrude from the opening 15.

  Furthermore, in the present embodiment, the first insulating film 11 and the second insulating film 12 are made of a solder resist that is the same insulating material. By selecting such a material, the adhesion between the first insulating film 11 and the second insulating film 12 can be improved, and defects such as peeling at the interface between the first insulating film 11 and the second insulating film 12 can be achieved. Can be prevented. However, it is not necessary for the insulating materials to be completely matched, and if the adhesion between the first insulating film 11 and the second insulating film 12 can be kept good, characteristics required for the printed wiring board 1 and An optimum insulating material may be selected according to the cost.

  As shown in FIG. 1, an opening 16 having a desired opening shape is formed in the second insulating film 12. As the first coating layer 3, an opening 16 that is a recess that does not penetrate the first coating layer 3 is formed. Here, the opening shape of the opening 16 corresponds to predetermined information such as a position, a size, a polarity, or an abbreviation of a number or a model of a component mounted on the printed wiring board 1. The opening 16 is filled with non-conductive ink which is an insulating material, and a first symbol portion 17 is formed. Therefore, the planar shape of the first symbol portion 17 when the printed wiring board 1 is viewed in plan is a figure, arrow, symbol, character, or the like indicating the predetermined information. That is, in the present embodiment, the conventional symbol mark does not protrude from the coating layer, and the first symbol portion 17 functioning as a symbol mark is embedded in the first coating layer 3 and its surface is exposed. .

  By preventing the first symbol portion 17 from protruding in this manner, the first symbol portion 17 can be prevented from being chipped, broken, and peeled off. Further, the printed wiring board 1 can be reduced in thickness by the thickness of the first symbol portion 17 as compared with the case where the conventional symbol mark protrudes from the coating layer.

  In the present embodiment, the insulating material constituting the first symbol portion 17 is different from the insulating materials of the first insulating film 11 and the second insulating film 12 that form the first coating layer 3. This is to improve the visibility of the first symbol portion 17. If the visibility of the first symbol portion 17 can be increased, the insulating material of the first symbol portion 17 and the insulating material of the first insulating film 11 and the second insulating film 12 have the same composition or a similar composition ( The same material may be used. As a result, the adhesion between the first symbol portion 17 and the second insulating film 12 can be enhanced.

  On the other hand, on the second surface 2 b side of the multilayer body 2, as shown in FIG. 1, the third insulating film 13 covers the second surface 2 b of the multilayer body 2 so as to cover the second conductor layer 7. Is covered. The fourth insulating film 14 is formed on the third insulating film 13. Therefore, the second conductor layer 7 is embedded in the second coating layer 4 (that is, in the third insulating film 13). Due to the structure of the second coating layer 4, no solder is applied to the second conductor layer 7 in this embodiment. The thickness relationship between the second conductor layer 7, the third insulating film 13, and the fourth insulating film 14 can be adjusted as appropriate, but it is assumed that the second conductor layer 7 is not exposed. It becomes.

  The film thicknesses of the third insulating film 13 and the fourth insulating film 14 are also different, and the film thickness of the fourth insulating film 14 is larger than the film thickness of the third insulating film 13. For example, the thickness of the third insulating film 13 is 20 μm, and the thickness of the fourth insulating film 14 is 30 μm. Note that the film thickness difference between the third insulating film 13 and the fourth insulating film 14 is not essential, and the film thickness difference can be eliminated or the third insulating film can be removed depending on the characteristics and cost required for the printed wiring board 1. The film 13 may be thickened.

  Furthermore, the third insulating film 13 and the fourth insulating film 14 are both composed of a solder resist that is the same insulating material. By selecting such a material, the adhesion between the third insulating film 13 and the fourth insulating film 14 can be improved, and defects such as peeling at the interface between the third insulating film 13 and the fourth insulating film 14 can be achieved. Can be prevented. However, it is not necessary that the insulating materials completely match each other. If the adhesion between the third insulating film 13 and the fourth insulating film 14 can be kept good, the characteristics required for the printed wiring board 1 and An optimum insulating material may be selected according to the cost. The first insulating film 11, the second insulating film 12, the third insulating film 13, and the fourth insulating film 14 may be made of the same insulating material, so that the manufacturing cost can be further reduced. .

  As shown in FIG. 1, an opening 18 having a desired opening shape is also formed in the fourth insulating film 14. As the second coating layer 4, an opening 18 that is a recess that does not penetrate the second coating layer 4 is formed. Similarly to the opening shape of the opening 16, the opening shape of the opening 18 also corresponds to predetermined information such as the position, size, polarity, or abbreviation of the number or type of the component mounted on the printed wiring board 1. The opening 18 is filled with non-conductive ink, which is an insulating material, and a second symbol portion 19 is formed. Accordingly, the planar shape of the second symbol portion 19 when the printed wiring board 1 is viewed in plan is a figure, arrow, symbol, character, or the like indicating the predetermined information. That is, also on the second surface 2b side of the stacked body 2, the second symbol portion 19 functioning as a symbol mark is embedded in the second coating layer 4 and its surface is exposed.

  By preventing the second symbol portion 19 from protruding in this manner, the second symbol portion 19 can be prevented from being chipped, broken, and peeled off. Further, the printed wiring board 1 can be reduced in thickness by the thickness of the second symbol portion 19 as compared with the case where the conventional symbol mark protrudes from the coating layer.

  In the present embodiment, the insulating material constituting the second symbol portion 19 is also different from the insulating materials of the third insulating film 13 and the fourth insulating film 14 that form the second coating layer 4. This is to improve the visibility of the second symbol portion 19. If the visibility of the second symbol portion 19 can be increased, the insulating material of the second symbol portion 19 and the insulating materials of the third insulating film 13 and the fourth insulating film 14 are made to have the same or similar composition. Good. As a result, the adhesion between the second symbol portion 19 and the fourth insulating film 14 can be enhanced.

  In FIG. 1, only the first conductor layer 6 exposed on the first surface 2 a side of the multilayer body 2 is shown for convenience of explanation of the embodiment, but it is embedded in the first insulating film 11. Other conductive layers may be formed. Similarly, another exposed conductive layer may be formed on the second surface 2b side of the multilayer body. About formation of the said conductive layer, it changes suitably according to the characteristic and pattern which are required for the printed wiring board 1, and the kind and quantity of the components to mount.

(Printed wiring board manufacturing method)
Next, the manufacturing process of the printed wiring board 1 according to the embodiment of the present invention will be described in detail with reference to FIGS. Here, FIGS. 2 to 8 are partially enlarged cross-sectional views in the manufacturing process of the printed wiring board shown in the same manner as FIG.

  First, as shown in FIG. 2, the laminated body 2 which is a structural member of the printed wiring board 1 which concerns on a present Example is prepared (preparation process). In this embodiment, a substrate having a structure in which the substrate material layer 5 and the first conductor layer 6 and the second conductor layer 7 formed on the surface of the substrate material layer 5 are laminated is used as the laminate 2. It was. Here, the first conductor layer 6 and the second conductor layer 7 are patterned corresponding to connection terminals of electronic components such as a semiconductor chip, a resistor, and a capacitor to be mounted on the printed wiring board 1, or a desired one. Patterning for forming electrical wiring is performed.

  Next, as shown in FIGS. 3 and 4, the first insulating film 11 is formed by performing ink-jet drawing using an ink-jet method using a coating apparatus for applying the solder resist 20 that is an insulating material (first insulating film 11). Insulating film forming step). In this embodiment, as shown in FIG. 3, the coating apparatus includes a print head 23 including an inkjet head 21 and an ultraviolet light source 22. With such a configuration of the print head 23, when the solder resist 20 is applied in the main scanning direction of the print head 23, ultraviolet irradiation can be performed immediately after the application. That is, the solder resist 20 can be applied and cured by a single movement of the print head 23 in the main scanning direction, and the temporary curing time (for example, about 20 minutes) is shortened compared to the screen printing method. can do. Further, the resolution of the inkjet head 21 in the present embodiment is 300 dpi, but the resolution can be changed as appropriate.

  As a specific step of forming the first insulating film 11, the solder resist 20 is formed by an inkjet method on the first surface 5 a of the substrate material layer 5 so as to surround and surround the formation region of the first conductor layer 6. Apply. That is, the solder resist 20 is applied so as to expose the peripheral portion of the first conductor layer 6 without covering the entire first surface 2a of the multilayer body 2. In this embodiment, ink jet drawing is performed at a resolution of 1200 dpi to form the first insulating film 11. Here, since the resolution of the inkjet head 21 is 300 dpi, the inkjet head 21 is moved a plurality of times in the sub-scanning direction to increase the number of dots in a certain region.

  Next, as shown in FIG. 5, the second insulating film 12 is formed by performing ink jet drawing by an ink jet method using the coating apparatus used in the first insulating film forming step (second insulating film forming step). . As a specific step of forming the second insulating film 12, the solder resist 20 is applied only on the surface of the first insulating film 11 by the inkjet method, and the opening 15 is formed. At this time, the region corresponding to the first symbol portion 17 to be the symbol mark is drawn so as not to apply the solder resist 20, and the opening corresponding to the first symbol portion 17 (that is, the predetermined information of the mounted component). 16 will also be formed.

  In the present embodiment, ink jet drawing is performed at a resolution of 1800 dpi, and the second insulating film 12 is formed. Here, since the resolution of the inkjet head 21 is 300 dpi, the inkjet head 21 is moved a plurality of times in the sub-scanning direction to increase the number of dots in a certain region.

  In addition, the coating layer formation process was implemented by implementing the 1st insulating film formation process and the 2nd insulating film formation process which were mentioned above.

  Next, as shown in FIG. 6, the first symbol portion 17 is formed by performing ink-jet drawing using an ink-jet method using the coating apparatus used in the first insulating film forming step (symbol portion forming step). As a specific step of forming the first symbol portion 17, the first symbol portion 17 is formed by applying ink as an insulating material by an ink jet method so as to fill the opening 16. At this time, the ink application dimension is preferably set smaller than the width of the opening 16. This is to prevent ink from leaking from the openings 16 due to spreading of the ink. Moreover, it is preferable to perform temporary curing after spreading along the opening shape of the opening 16 without immediately curing the applied ink. This is because the opening 16 can be reliably filled with ink, and the predetermined information of the mounted component can be more accurately indicated by the planar shape of the first symbol portion 17. Therefore, in the present embodiment, in the symbol portion forming process, unlike the first insulating film forming process and the second insulating film forming process, temporary curing immediately after application of the insulating material used for the ultraviolet light source 22 is not performed. It will be.

  Next, as shown in FIG. 7, the third insulating film 13 is formed by performing ink jet drawing by an ink jet method using the coating apparatus used in the first insulating film forming step. As a specific step of forming the third insulating film 13, a solder resist 20 is applied on the second surface 5 b of the substrate material layer 5 by an ink jet method so as to embed the second conductor layer 7. In this embodiment, since the resolution of drawing related to the formation of the third insulating film 13 is also 1200 dpi, the inkjet head 21 is moved a plurality of times in the sub-scanning direction to increase the number of dots in a certain region.

  Next, as shown in FIG. 8, the fourth insulating film 14 is formed by performing ink jet drawing using an ink jet method using the coating apparatus used in the first insulating film forming step. As a specific step of forming the fourth insulating film 14, a solder resist 20 is applied on the third insulating film 13 by an inkjet method. At this time, an area corresponding to the second symbol portion 19 to be a symbol mark is drawn so that the solder resist 20 is not applied, and an opening corresponding to the second symbol portion 19 (that is, predetermined information of a component to be mounted). 18 will be formed. In this embodiment, since the resolution of drawing related to the formation of the fourth insulating film 14 is also 1800 dpi, the inkjet head 21 is moved a plurality of times in the sub-scanning direction to increase the number of dots in a certain region.

  Next, as shown in FIG. 1, the second symbol portion 19 is formed by performing ink-jet drawing by an ink-jet method using the coating apparatus used in the first insulating film forming step. As a specific step of forming the second symbol portion 19, the second symbol portion 19 is formed by applying ink as an insulating material by an ink jet method so as to fill the opening 18. At this time, the ink application dimension is preferably set smaller than the width of the opening 18, as in the formation of the first symbol portion 17 described above. In addition, it is preferable to perform the temporary curing after the applied ink spreads along the opening shape of the opening 18 without immediately performing the temporary curing.

  Thereafter, heat treatment (post cure) is performed, and the first insulating film 11, the second insulating film 12, the third insulating film 13, the fourth insulating film 14, the first symbol portion 17, and the second symbol portion 19 are completely formed. Harden. Accordingly, the first coating layer 3 made of the first insulating film 11 and the second insulating film 12, the second coating layer 4 made of the third insulating film 13 and the fourth insulating film 14, and the first symbol portion filling the opening 16. 17 and the second symbol part 19 filling the opening 18 are firmly formed, and the manufacture of the printed wiring board 1 is completed.

  In the method of manufacturing the printed wiring board 1 according to the present embodiment, the opening 16 of the first coating layer 3 is formed without applying a non-conductive ink on the coating layer and forming a protruding symbol mark. The first symbol portion 17 and the second symbol portion 19 are formed so as to fill the opening 18 of the second coating layer 4. For this reason, the printed wiring board 1 can be thinned by the thickness of the first symbol portion 17 and the second symbol portion 19. Further, since the first symbol portion 17 and the second symbol portion 19 do not protrude from the first coating layer 3 and the second coating layer 4, the first symbol portion 17 and the second symbol portion 19 are prevented from being peeled off and chipped. be able to.

  Further, since the first insulating film 11, the second insulating film 12, the third insulating film 13, the fourth insulating film 14, the first symbol portion 17, and the second symbol portion 19 are formed by the same coating apparatus, The positional accuracy can be improved, and the yield of the printed wiring board 1 can be improved. As a result, it is possible to reduce the environmental load by reducing the number of discarded products.

  Further, since the first insulating film 11, the second insulating film 12, the third insulating film 13, and the fourth insulating film 14 are formed from the same insulating material using the same coating apparatus, the openings 16 and 18 are formed. The positional accuracy can be improved, and the yield of the printed wiring board 1 can be improved. As a result, it is possible to reduce the environmental load by reducing the number of discarded products.

  In the embodiment described above, when forming the first insulating film 11, the second insulating film 12, the third insulating film 13, the fourth insulating film 14, the first symbol portion 17, and the second symbol portion 19, an inkjet is used. Although the insulating material is applied by a method, the insulating material may be applied by a screen printing method using a mask and a squeegee. Even in the case where the first symbol portion 17 and the second symbol portion 19 are formed by the screen printing method, the first symbol portion 17 and the second symbol portion 19 can be used as symbol marks as in the ink jet method described above. Desired information can be displayed. Even when such a screen printing method is used, it is possible to reduce the thickness and prevent the occurrence of peeling and chipping as in the above-described embodiment.

<Modification>
In the embodiment described above, the first coating layer 3 is composed of the first insulating film 11 and the second insulating film 12, and the second coating layer 4 is composed of the third insulating film 13 and the fourth insulating film 14, Although the coating layer has a two-layer structure, each coating layer may be composed of one type of insulating film (that is, a one-layer structure). Further, only one of the two coating layers may have a two-layer structure and the other may have a one-layer structure. Hereinafter, a case where the two coating layers have a single-layer structure will be described with reference to FIG. In addition, since parts other than the coating layer are the same as those in the above-described embodiment, the same reference numerals are given and description thereof is omitted.

  FIG. 9 is a partially enlarged cross-sectional view of a printed wiring board 1 ′ according to a modification. The printed wiring board 1 ′ has a first coating layer 3 ′ on the first surface 2 a side of the laminate 2 and further has a second coating layer 4 ′ on the second surface 2 b side. The first coating layer 3 ′ and the second coating layer 4 ′ are composed of one type of insulating film formed by one inkjet drawing process (for example, the resolution is 1200 dpi). The material of the first coating layer 3 ′ and the second coating layer 4 ′ is a solder resist as in the above embodiment.

  As shown in FIG. 9, the first coating layer 3 ′ is formed with an opening 16 ′ that is a recess, and the opening 16 ′ is filled with non-conductive ink that is an insulating material, and the first symbol portion 17. Is formed. Similarly, the second coating layer 4 ′ has an opening 18 ′ that is a recess, and the second symbol portion 19 is formed by filling the opening 18 ′ with non-conductive ink that is an insulating material. Yes.

  The manufacturing method according to the modification is almost the same as the manufacturing method of the above-described embodiment, and only the ink jet drawing related to the first symbol portion 17 and the second symbol portion 19 is different. Specifically, in order to form the first coating layer 3 ′ by one inkjet drawing, control is performed to reduce only the application amount of the portion that becomes the opening 16 ′. For example, the application amount may be controlled by a multi-drop method. Similarly, with respect to the second coating layer 4 ′, control is performed to reduce only the application amount of the portion that becomes the opening 18 ′.

  Even in the case of this modification, the first symbol portion 17 and the second symbol portion 19 are formed so as not to protrude, so that the first symbol portion 17 and the second symbol portion 19 are not chipped, damaged, or separated. Can be prevented. Further, the printed wiring board 1 ′ can be reduced in thickness by the thickness of the first symbol portion 17 and the second symbol portion 19 as compared with the case where the conventional symbol mark protrudes from the coating layer.

<Embodiment of the present invention>
A printed wiring board according to a first embodiment of the present invention is a printed wiring board on which components are mounted via solder, and is a laminate in which a substrate material layer and a patterned conductor layer are laminated on the surface of the substrate material layer. A laminated body having a structure, a coating layer that covers the surface of the laminated body other than the solder, and has an opening having an opening shape corresponding to predetermined information of the component; A symbol portion representing predetermined information of the component.

  In the first embodiment, since the symbol part which is the symbol mark is formed so as not to protrude from the coating layer, it is possible to prevent the symbol part from being chipped, broken and peeled off. Further, the printed wiring board can be reduced in thickness by the thickness of the symbol portion as compared with the conventional case where the symbol mark protrudes from the coating layer.

  The printed wiring board according to the second embodiment of the present invention is that, in the first embodiment described above, the symbol portion is made of an insulating material different from the insulating material forming the coating layer. Thereby, the contrast of a symbol part can be given more favorably and the predetermined information represented by a symbol part can be made easier to visually recognize.

  In the printed wiring board according to the third embodiment of the present invention, in the first or second embodiment described above, the first insulating film in which the coating layer is formed on the surface of the laminate, and the first insulating film A second insulating film is formed on the second insulating film, and the opening is formed in the second insulating film so as to expose the first insulating film. As a result, the openings can be formed more accurately, and the cost of the coating layer can be reduced.

  The printed wiring board according to the fourth embodiment of the present invention is that, in the third embodiment described above, the first insulating film and the second insulating film are made of the same insulating material. As a result, the manufacturing cost of the coating layer can be further reduced, a strong coating layer can be realized, and the reliability of the printed wiring board can be improved.

A method for manufacturing a printed wiring board according to a fifth embodiment of the present invention is a method for manufacturing a printed wiring board for mounting a component via solder, wherein a conductor layer patterned on the surface of the board material layer is provided. A preparatory step for preparing a laminated body having a laminated structure, and a coating for forming a coating layer including an opening having an opening shape corresponding to predetermined information of the component on the surface of the laminated body except for attaching the solder a layer forming step, filling the insulation material into the opening of the coating layer, and a, and a symbol portion forming step of forming a symbol section representing the predetermined information of the component.

  In the fifth embodiment, since the symbol part which is a symbol mark is formed so as not to protrude from the coating layer, the symbol part can be prevented from being chipped, broken and peeled off. Further, the printed wiring board can be reduced in thickness by the thickness of the symbol portion as compared with the conventional case where the symbol mark protrudes from the coating layer.

  The method for manufacturing a printed wiring board according to a sixth embodiment of the present invention is the above fifth embodiment, wherein the coating layer forming step and the symbol portion forming step are performed by applying different insulating materials by an inkjet method. is there. Thereby, a coating layer and a symbol part can be formed favorably and easily, and the heating process concerning temporary hardening can be reduced.

  In the printed wiring board manufacturing method according to the seventh embodiment of the present invention, in the fifth embodiment described above, the coating layer forming step and the symbol portion forming step apply different insulating materials depending on the screen printing method. It is. Thereby, a coating layer and a symbol part can be formed favorably and easily.

  In the printed wiring board manufacturing method according to the eighth embodiment of the present invention, in any one of the fifth to seventh embodiments described above, the symbol portion forming step is performed by applying the insulation with a coating size smaller than the width of the opening. Applying material. Thereby, the insulating material can be prevented from leaking from the opening due to the spread of the insulating material constituting the symbol portion.

  In the printed wiring board manufacturing method according to the ninth embodiment of the present invention, in any one of the fifth to eighth embodiments described above, the symbol portion forming step includes the step of forming the insulating material along the opening shape of the opening. It is to temporarily cure the insulating material after spreading. Accordingly, the opening can be reliably filled with the insulating material constituting the symbol portion, and the predetermined information of the mounted component can be more accurately indicated by the planar shape of the symbol portion.

  In the printed wiring board manufacturing method according to the tenth embodiment of the present invention, in any one of the fifth to ninth embodiments described above, the coating layer forming step is performed on the surface of the laminate other than the soldering. A first insulating film forming step of forming a first insulating film, and a second insulating film forming step of forming a second insulating film having the opening on the surface of the first insulating film. As a result, the openings can be formed more accurately, and the cost of the coating layer can be reduced.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Laminated body 2a 1st surface 2b 2nd surface 3 1st coating layer 4 2nd coating layer 5 board | substrate material layer 5a 1st surface 5b 2nd surface 6 1st conductive layer 7 2nd conductivity Layer 11 First insulating film 12 Second insulating film 13 Third insulating film 14 Fourth insulating film 15 Opening 16 Opening 17 First symbol part 18 Opening 19 Second symbol part 20 Solder resist 21 Inkjet head 22 UV light source 23 Printing head

Claims (8)

A printed wiring board on which components are mounted via solder,
A laminate comprising a substrate material layer and a laminate structure in which a patterned conductor layer is laminated on the surface of the substrate material layer;
A coating layer that covers the surface of the laminate other than the solder and that has an opening having an opening shape corresponding to the predetermined information of the component;
Have a, a symbol section representing the predetermined information of the component to fill the opening,
The coating layer includes a first insulating film formed on the surface of the stacked body, and a second insulating film formed on the first insulating film,
The printed wiring board , wherein the opening is formed in the second insulating film so as to expose the first insulating film .   The printed wiring board according to claim 1, wherein the symbol portion is made of an insulating material different from an insulating material forming the coating layer. The first insulating film and said second insulating film, a printed wiring board according to claim 1 or 2 is made of the same insulating material. A method of manufacturing a printed wiring board for mounting a component via solder,
Preparing a laminate including a structure in which a patterned conductor layer is laminated on the surface of the substrate material layer; and
A coating layer forming step of forming a coating layer including an opening having an opening shape corresponding to predetermined information of the component on the surface of the laminate other than the soldering;
The filled with insulation material in the opening of the coating layer, anda symbol portion forming step of forming a symbol section representing the predetermined information of the component,
The coating layer forming step includes a first insulating film forming step of forming a first insulating film on the surface of the stacked body except for attaching the solder, and a second step of providing the opening on the surface of the first insulating film. A method for manufacturing a printed wiring board, comprising a second insulating film forming step of forming an insulating film.
The printed wiring board manufacturing method according to claim 4 , wherein in the coating layer forming step and the symbol portion forming step, different insulating materials are applied by an inkjet method. The printed wiring board manufacturing method according to claim 4 , wherein in the coating layer forming step and the symbol portion forming step, different insulating materials are applied by a screen printing method. 7. The printed wiring board manufacturing method according to claim 4 , wherein in the symbol portion forming step, the insulating material is applied with an application size smaller than a width of the opening. 8. The method of manufacturing a printed wiring board according to claim 4, wherein the symbol portion forming step temporarily cures the insulating material after the insulating material spreads along an opening shape of the opening.

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