JP2005353751A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
JP2005353751A
JP2005353751A JP2004171325A JP2004171325A JP2005353751A JP 2005353751 A JP2005353751 A JP 2005353751A JP 2004171325 A JP2004171325 A JP 2004171325A JP 2004171325 A JP2004171325 A JP 2004171325A JP 2005353751 A JP2005353751 A JP 2005353751A
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resin
wiring board
resin coating
printed wiring
opening
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JP2004171325A
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Japanese (ja)
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Kanako Nakajima
加奈子 中島
Munekimi Mizutani
宗幹 水谷
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Fujikura Ltd
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Fujikura Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board improved in aperture accuracy/location accuracy and excellent mechanical characteristic. <P>SOLUTION: In the printed circuit board, an insulating layer (20) is covered to protect a circuit pattern (1). The insulating layer (20) is formed of a plurality of resin materials, a first resin covering part (3) formed of a resin material having excellent mechanical characteristic, and a second resin covering part (4) formed by coating of a photosensitive resin material. An aperture (4A) which has been formed by exposure/development of the photosensitive resin material is provided to the second resin covering part (4). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、回路パターンを保護する絶縁層を被覆したプリント配線基板に関し、特に開口精度・位置精度に優れ、かつ屈曲性等の機械的特性に優れたプリント配線基板に関する。   The present invention relates to a printed wiring board coated with an insulating layer that protects a circuit pattern, and more particularly to a printed wiring board that has excellent opening accuracy and positional accuracy and excellent mechanical properties such as flexibility.

金属箔とベース基材とからなる積層板をエッチング処理することによって前記金属箔をパターニングし、ベース基材１０２の表面に回路パターン１０１を形成したプリント配線基板１００において、前記回路パターン１０１を保護するため、プリント配線基板１００の表面に樹脂材料からなるカバーレイフィルム１０５を貼り合せたものが知られている（例えば、特許文献１を参照）。なおカバーレイフィルム１０５は、通常、ポリイミド層１０３と接着剤１０４とからなる。
従来技術によれば、例えば図３に示すように、打ち抜き加工によって予め所定の位置に開口部１０５Ａを形成したカバーレイフィルム１０５をプリント配線基板１００に積層し（図３（ａ）を参照）、その後加熱プレスすることによって、開口部１０５Ａを有するカバーレイフィルム１０５をプリント配線基板１００の表面に貼り合せていた（図３（ｂ）を参照）。
また例えば、微細な開口部が必要とされるプリント配線基板を製造する場合、感光性カバーレイフィルム１０６を使用し、図４に示すように、プリント配線基板１００の表面に感光性カバーレイフィルム１０６をラミネートした後（図４（ａ）を参照）、前記感光性カバーレイフィルム１０６の表面に開口部形成部分を除いてマスク部材１０７を被覆し（図４（ｂ）を参照）、その後、露光・現像することによって感光性カバーレイフィルム１０６をパターニングして開口部１０６Ａを形成していた（図４（ｃ）を参照）。なお感光性カバーレイフィルム１０６は、通常、アクリル系樹脂およびエポキシ系樹脂の混合物からなる。
特開２００３−１９３０００号公報 In the printed wiring board 100 in which the circuit pattern 101 is formed on the surface of the base substrate 102 by patterning the metal foil by etching a laminated plate made of the metal foil and the base substrate, the circuit pattern 101 is protected. For this reason, there is known one in which a coverlay film 105 made of a resin material is bonded to the surface of the printed wiring board 100 (see, for example, Patent Document 1). The cover lay film 105 is usually composed of a polyimide layer 103 and an adhesive 104.
According to the prior art, for example, as shown in FIG. 3, the coverlay film 105 in which the opening 105A is formed in advance at a predetermined position by punching is laminated on the printed wiring board 100 (see FIG. 3A). Thereafter, the cover lay film 105 having the opening 105A was bonded to the surface of the printed wiring board 100 by heating and pressing (see FIG. 3B).
For example, when manufacturing a printed wiring board that requires a fine opening, a photosensitive coverlay film 106 is used, and the photosensitive coverlay film 106 is formed on the surface of the printed wiring board 100 as shown in FIG. (See FIG. 4A), the surface of the photosensitive cover lay film 106 is covered with the mask member 107 except for the opening forming portion (see FIG. 4B), and then exposed. The photosensitive coverlay film 106 was patterned by development to form an opening 106A (see FIG. 4C). The photosensitive cover lay film 106 is usually made of a mixture of an acrylic resin and an epoxy resin.
JP 2003-193000 A

ポリイミド層１０３と接着剤１０４とからなるカバーレイフィルム１０５と、プリント配線基板１００とを位置合わせして積層し、加熱プレスすることによってプリント配線基板１００の表面にカバーレイフィルム１０５を貼り合わせる場合、加熱プレスの工程で、前記カバーレイフィルムの接着剤１０４が溶融流動し、これによってプリント配線基板１００の回路パターン１０１にカバーレイフィルム１０５が追従し、プリント配線基板１００とカバーレイフィルム１０５との間に気泡を生じさせることなくプリント配線基板１００の表面にカバーレイフィルム１０５を貼り合わせることができる。
しかしながら、加熱プレスによってカバーレイフィルム１０５をプリント配線基板１００に貼り合せた場合、溶融流動した接着剤１０４がカバーレイフィルムの開口部１０５Ａや端部から染み出し、この接着剤１０４の染み出しによって開口部１０５Ａが小さくなり、この開口部に実装される部品とプリント配線基板との電気的接続信頼性が悪化していた。また接着剤１０４の染み出しはランダムであるため、開口形状の見栄えが悪くなっていた。つまり接着剤１０４の染み出しによって、開口精度が低下し、プリント配線基板の精度が低下するといった問題点があった。
またさらに、加熱プレスの工程で、接着剤１０４の流動性の増加によるカバーレイフィルム１０５の位置ずれや、カバーレイフィルム１０５の伸縮変形によって、開口部１０５Ａの位置精度が低下していた。
一方、感光性カバーレイフィルム１０６を使用した場合、感光性カバーレイフィルム１０６をプリント配線基板１００にラミネートした後、露光・現像によるパターニングによって開口部１０６Ａを形成するため、開口部の位置精度や開口精度は優れる。
しなしながら、アクリル系樹脂およびエポキシ系樹脂の混合物からなる感光性カバーレイフィルム１０６は、ポリイミド等の樹脂材料からなるカバーレイフィルムに比べ、屈曲性などの機械的特性が低い。特に感光性カバーレイフィルムは折り曲げに弱く、繰り返し屈曲して用いられるプリント配線基板に感光性カバーレイフィルム１０６を使用すると、プリント配線基板１００の表面に貼り合せた感光性カバーレイフィルム１０６に割れ・剥れが発生し、それによってプリント配線基板に断線が起こりやすくなっていた。 When the cover lay film 105 composed of the polyimide layer 103 and the adhesive 104 and the printed wiring board 100 are aligned and laminated, and the cover lay film 105 is bonded to the surface of the printed wiring board 100 by heating and pressing, In the heating press process, the cover-lay film adhesive 104 melts and flows, whereby the cover-lay film 105 follows the circuit pattern 101 of the printed-wiring board 100, and between the printed-wiring board 100 and the cover-lay film 105. The coverlay film 105 can be bonded to the surface of the printed wiring board 100 without generating bubbles.
However, when the cover lay film 105 is bonded to the printed wiring board 100 by a hot press, the melted and flowed adhesive 104 oozes out from the opening 105A and the end of the cover lay film, and the oozing out of the adhesive 104 opens the opening. The portion 105A is small, and the reliability of electrical connection between the component mounted in the opening and the printed wiring board is deteriorated. Further, since the bleeding of the adhesive 104 was random, the appearance of the opening shape was poor. That is, there is a problem that the opening accuracy is lowered due to the seepage of the adhesive 104 and the accuracy of the printed wiring board is lowered.
Furthermore, the positional accuracy of the opening 105 </ b> A has been reduced due to the positional displacement of the coverlay film 105 due to the increase in the fluidity of the adhesive 104 and the expansion / contraction deformation of the coverlay film 105 in the heating press process.
On the other hand, when the photosensitive cover lay film 106 is used, the opening 106A is formed by patterning by exposure / development after laminating the photosensitive cover lay film 106 on the printed circuit board 100. The accuracy is excellent.
However, the photosensitive coverlay film 106 made of a mixture of an acrylic resin and an epoxy resin has lower mechanical properties such as flexibility than a coverlay film made of a resin material such as polyimide. In particular, the photosensitive coverlay film is vulnerable to bending, and when the photosensitive coverlay film 106 is used on a printed wiring board that is repeatedly bent, the photosensitive coverlay film 106 is cracked and bonded to the surface of the printed wiring board 100. Peeling occurred and the printed wiring board was easily broken.

そこで本発明によるプリント配線基板は、回路パターンを保護する絶縁層を被覆したプリント配線基板において、前記絶縁層が複数の樹脂材料から形成され、機械的特性に優れた樹脂材料で形成される第１樹脂被覆部と、感光性の樹脂材料を塗布して形成される第２樹脂被覆部とを有し、さらに前記第２樹脂被覆部に、感光性の樹脂材料を露光・現像して形成した開口部を設けたものである。   Therefore, the printed wiring board according to the present invention is a printed wiring board coated with an insulating layer for protecting a circuit pattern. An opening having a resin coating portion and a second resin coating portion formed by applying a photosensitive resin material, and further exposing and developing the photosensitive resin material on the second resin coating portion A part is provided.

本発明のプリント配線基板によれば、回路パターンを保護する絶縁層を被覆するにあたって、屈曲部などの優れた機械的特性を必要とする部分を、機械的特性に優れた樹脂材料から形成した第１樹脂被覆部で被覆するとともに、優れた開口精度や位置精度を必要とする部分を、感光性の樹脂材料から形成した第２樹脂被覆部で被覆することによって、機械的特性に優れたプリント配線基板に開口精度・位置精度の優れた開口部を形成することができる。
そして、プリント配線基板の機械的特性を低下させることなく開口部の開口精度・位置精度を向上させることによって、電子部品等の高密度・精細実装が可能となり、小型電子機器向けのプリント配線基板として適用するこができる。 According to the printed wiring board of the present invention, in covering the insulating layer for protecting the circuit pattern, the portion requiring excellent mechanical properties such as a bent portion is formed from a resin material having excellent mechanical properties. Printed wiring with excellent mechanical characteristics by covering with 1 resin coating part and covering the part that requires excellent opening accuracy and position accuracy with 2nd resin coating part formed from photosensitive resin material An opening having excellent opening accuracy and position accuracy can be formed on the substrate.
And by improving the opening accuracy and position accuracy of the opening without degrading the mechanical properties of the printed wiring board, high-density and fine mounting of electronic components, etc. is possible, and as a printed wiring board for small electronic devices Can be applied.

本発明の実施例によるプリント配線基板を、図１及び図２を参照して説明する。   A printed wiring board according to an embodiment of the present invention will be described with reference to FIGS.

この発明では、プリント配線基板１０に絶縁層２０を被覆するにあたって、屈曲性等の機械的特性を必要とする部分に機械的特性に優れた樹脂材料を被覆して第１樹脂被覆部３を形成するとともに、微細な開口部を必要とする部分に感光性の樹脂材料を塗布して第２樹脂被覆部４を形成し、複数の樹脂材料からなる絶縁層２０を形成する。   In the present invention, when the insulating layer 20 is coated on the printed wiring board 10, the first resin coating portion 3 is formed by coating a resin material having excellent mechanical properties on a portion requiring mechanical properties such as flexibility. At the same time, a photosensitive resin material is applied to a portion requiring a fine opening to form the second resin coating portion 4, and the insulating layer 20 made of a plurality of resin materials is formed.

図１を参照して、この発明の第１実施例によるプリント配線基板について説明する。
この実施例は、金属箔と液晶ポリマーとの二層からなる積層板をエッチング処理し、液晶ポリマーからなるベース基材２の表面に回路パターン１（回路１ａ，１ｂ，１ｃ）を形成したプリント配線基板１０を使用するものである（図１（ａ）を参照）。
図１に示すプリント配線基板１０は、基板左右に微細回路１ａ，１ｂが形成されているとともに、前記左右の微細回路１ａ，１ｂの間に屈曲部が設けられ、該屈曲部の表面に、前記左右の微細回路１ａ，１ｂの間を電気的に接続する回路１ｃが形成されている。
そしてこの実施例では、微細開口部を必要とする微細回路１ａと微細回路１ｂの間の電気的接続を担う回路１ｃが屈曲部の表面に形成されたプリント配線基板１０において、前記屈曲部の回路１ｃの表面には、屈曲性などの機械的特性に優れた樹脂材料からなる第１樹脂被覆部３を形成することによって、樹脂被覆部の割れ・剥れによる断線を防止するとともに、前記微細回路１ａ，１ｂの表面には、感光性樹脂材料からなる第２樹脂被覆部を形成することによって、開口精度・位置精度に優れた微細開口を形成してプリント配線基板の精度を向上させるものである。 A printed wiring board according to a first embodiment of the present invention will be described with reference to FIG.
In this embodiment, a printed wiring having a circuit pattern 1 (circuits 1a, 1b, 1c) formed on the surface of a base substrate 2 made of a liquid crystal polymer by etching a laminated plate made of two layers of a metal foil and a liquid crystal polymer. A substrate 10 is used (see FIG. 1A).
The printed circuit board 10 shown in FIG. 1 has microcircuits 1a and 1b formed on the left and right sides of the board, and a bent portion is provided between the left and right microcircuits 1a and 1b. A circuit 1c that electrically connects the left and right microcircuits 1a and 1b is formed.
In this embodiment, in the printed circuit board 10 on the surface of the bent portion, the circuit 1c that is responsible for the electrical connection between the fine circuit 1a and the fine circuit 1b that require a fine opening is provided. On the surface of 1c, by forming the first resin coating portion 3 made of a resin material having excellent mechanical properties such as flexibility, disconnection due to cracking / peeling of the resin coating portion is prevented, and the fine circuit By forming a second resin coating portion made of a photosensitive resin material on the surfaces of 1a and 1b, a fine opening having excellent opening accuracy and position accuracy is formed, thereby improving the accuracy of the printed wiring board. .

図１に示す実施例では、優れた機械的特性を必要とする部分に、液晶ポリマー（機械的特性が優れた樹脂材料）からなるフィルムを積層し、３００℃程度でプレスすることによって、第１樹脂被覆部３を形成した（図１（ｂ）を参照）。
液晶ポリマーからなるフィルムを積層して加熱プレスすることによって、前記フィルムとベース基材２の液晶ポリマー同士が溶融・接着し、回路パターン１（回路１ｃ）を保護する第１樹脂被覆部３が形成される。
この実施例では、優れた機械的特性を必要とする部分（例えば屈曲部）のみに液晶ポリマーからなるフィルムを積層して加熱プレスし、微細な開口部を必要とする部分（微細回路１ａ，１ｂが配された微細開口部）には第１樹脂被覆部３を形成させることなく、優れた機械的特性を必要とする部分に第１樹脂被覆部３を形成した。 In the embodiment shown in FIG. 1, a film made of a liquid crystal polymer (resin material having excellent mechanical properties) is laminated on a portion requiring excellent mechanical properties, and pressed at about 300 ° C. A resin coating portion 3 was formed (see FIG. 1B).
By laminating a film made of a liquid crystal polymer and heat-pressing, the liquid crystal polymer of the base material 2 melts and adheres to form a first resin coating portion 3 that protects the circuit pattern 1 (circuit 1c). Is done.
In this embodiment, a film made of a liquid crystal polymer is laminated only on a portion requiring excellent mechanical properties (for example, a bent portion) and heated and pressed, and portions requiring fine openings (fine circuits 1a and 1b). The first resin coating portion 3 was formed in a portion requiring excellent mechanical characteristics without forming the first resin coating portion 3 in the fine opening portion in which is disposed.

なお、液晶ポリマーの溶液を塗布し、第１樹脂被覆部３を形成してもよい。
優れた機械的特性を必要とする部分（屈曲部）を被覆する第１樹脂被覆部３はベース基材２と同じ樹脂材料を用いて形成することが好ましいが、その他の機械的特性に優れた樹脂材料を使用してもよい。
例えば、ポリイミド、ポリアミド、ポリアミドイミド等の機械特性に優れた樹脂材料からなる樹脂溶液をスクリーン印刷、バーコート、ディップコート等の塗布方法によって塗布し乾燥させ、第１樹脂被覆部３を形成してもよい。 The first resin coating portion 3 may be formed by applying a liquid crystal polymer solution.
The first resin coating portion 3 that covers a portion (bent portion) that requires excellent mechanical properties is preferably formed using the same resin material as the base substrate 2, but has excellent other mechanical properties. A resin material may be used.
For example, a resin solution made of a resin material having excellent mechanical properties such as polyimide, polyamide, and polyamideimide is applied by a coating method such as screen printing, bar coating, or dip coating, and dried to form the first resin coating portion 3. Also good.

プリント配線基板１０に絶縁層２０を被覆する場合、ベース基材２と絶縁層２０との間に気泡を入らせないようにして、第１樹脂被覆部３を形成する必要がある。
しかし、フィルム状の樹脂材料を貼り合せて第１樹脂被覆部３を形成した場合、回路パターン１（回路１ｃ）の回路高が高く、回路間隙が狭いと、回路間隙に気泡が入り易いといった欠点がある。
一方、溶液状の樹脂材料を塗布して第１樹脂被覆部３を形成した場合、回路間隙に気泡が入りにくく、また層厚を制御することが容易で、特に薄膜化することが容易である。
従って、回路パターン１（回路１ｃ）の回路高が高く回路間隙が狭い部分に、機械的特性が優れた樹脂材料からなる第１樹脂被覆部３を形成する場合、ポリイミド、ポリアミド、ポリアミドイミド、液晶ポリマーから選択される１又は複数の樹脂材料からなる樹脂溶液を塗布して第１樹脂被覆部３を形成することが好ましい。 When covering the printed wiring board 10 with the insulating layer 20, it is necessary to form the first resin covering portion 3 so as not to allow air bubbles to enter between the base substrate 2 and the insulating layer 20.
However, when the first resin coating portion 3 is formed by laminating a film-like resin material, the circuit height of the circuit pattern 1 (circuit 1c) is high, and if the circuit gap is narrow, bubbles may easily enter the circuit gap. There is.
On the other hand, when the first resin coating portion 3 is formed by applying a solution-like resin material, it is difficult for bubbles to enter the circuit gap, and it is easy to control the layer thickness, and it is particularly easy to reduce the thickness. .
Therefore, when the first resin coating portion 3 made of a resin material having excellent mechanical properties is formed in a portion where the circuit height of the circuit pattern 1 (circuit 1c) is high and the circuit gap is narrow, polyimide, polyamide, polyamideimide, liquid crystal It is preferable to form the first resin coating portion 3 by applying a resin solution made of one or more resin materials selected from polymers.

続いて、図１に示す実施例では、部品実装等のために微細開口部を必要とする部分に、例えば、アクリル系樹脂とエポキシ系樹脂の混合物からなる感光性樹脂溶液、または感光性ポリイミドからなる感光性樹脂溶液をスクリーン印刷、バーコート、ディップコート等の塗布方法によって塗布し乾燥させ、第２樹脂被覆部４を形成した（図１（ｃ）を参照）。
この実施例では、屈曲部などの優れた機械的特性を必要とする部分に第２樹脂被覆部４を形成させることなく、微細な開口部を必要とする部分（微細回路１ａ，１ｂが配された微細開口部）に、感光性の樹脂材料からなる樹脂溶液を塗布して第２樹脂被覆部４を形成した。 Subsequently, in the embodiment shown in FIG. 1, for example, a photosensitive resin solution made of a mixture of an acrylic resin and an epoxy resin, or a photosensitive polyimide is used for a portion that requires a fine opening for component mounting or the like. The resulting photosensitive resin solution was applied by a coating method such as screen printing, bar coating, or dip coating, and dried to form the second resin coating portion 4 (see FIG. 1C).
In this embodiment, the second resin coating portion 4 is not formed in a portion that requires excellent mechanical properties such as a bent portion, and portions that require fine openings (the fine circuits 1a and 1b are arranged). The second resin coating 4 was formed by applying a resin solution made of a photosensitive resin material to the fine openings).

また、前記感光性の樹脂材料からなる第２樹脂被覆部４を露光・現像によってパターニングし、開口部４Ａを形成した。
この実施例では、図１（ｄ）に示すように、感光性の樹脂材料を塗布して形成した第２樹脂被覆部４の表面に、開口部形成部分を除いてマスク部材５を被覆した後、露光・現像してパターニングした。そしてこの露光・現像によるパターニングによって、第２樹脂被覆部４に開口部４Ａを形成した（図１（ｅ）を参照）。
なお、機械的特性に優れた樹脂材料からなる第１樹脂被覆部３に開口部を形成する場合は、例えばレーザ加工によって開口部を形成することができる。 Further, the second resin coating portion 4 made of the photosensitive resin material was patterned by exposure and development to form an opening 4A.
In this embodiment, as shown in FIG. 1 (d), after the surface of the second resin coating portion 4 formed by applying a photosensitive resin material is coated with the mask member 5 except for the opening formation portion. And patterning by exposure and development. Then, an opening 4A was formed in the second resin coating portion 4 by patterning by exposure and development (see FIG. 1 (e)).
In addition, when forming an opening part in the 1st resin coating | coated part 3 which consists of a resin material excellent in the mechanical characteristic, an opening part can be formed by laser processing, for example.

次に、図２を参照してこの発明の第２実施例によるプリント配線基板を説明する。
この実施例は、ポリイミドフィルムの両面に金属箔を積層した積層板をエッチング処理し、ポリイミドからなるベース基材２の両面に回路パターン１（回路１ａ，１ｂ，１ｃ，１ｄ）を形成したプリント配線基板１０´を使用するものである（図２（ａ）を参照）。
この実施例によるプリント配線基板１０´も、第１実施例のプリント配線基板１０と同様に、基板表面側の左右に微細回路１ａ，１ｂが形成されているとともに、前記左右の微細回路１ａ，１ｂの間に屈曲部が設けられ、該屈曲部の表面に、前記左右の微細回路１ａ，１ｂの間を電気的に接続する回路１ｃが形成されている。
そして、微細開口部を必要とする微細回路１ａと微細回路１ｂの間の電気的接続を担う回路１ｃが屈曲部の表面に形成されたプリント配線基板１０において、前記屈曲部の回路１ｃの表面には、屈曲性などの機械的特性に優れた樹脂材料からなる第１樹脂被覆部３を形成することによって、樹脂被覆部の割れ・剥れによる断線を防止するとともに、前記微細回路１ａ，１ｂの表面には、感光性樹脂材料からなる第２樹脂被覆部を形成することによって、開口精度・位置精度に優れた微細開口を形成してプリント配線基板の精度を向上させるものである。
なおこの実施例によるプリント配線基板１０´は、屈曲部において裏面側の金属箔が全て除去された構造になっており、屈曲部では表面のみに回路１ｃが形成されている。 Next, a printed wiring board according to a second embodiment of the present invention will be described with reference to FIG.
In this embodiment, a laminated board in which metal foils are laminated on both sides of a polyimide film is etched to form a circuit pattern 1 (circuits 1a, 1b, 1c, 1d) on both sides of a base substrate 2 made of polyimide. A substrate 10 'is used (see FIG. 2 (a)).
Similarly to the printed wiring board 10 of the first embodiment, the printed circuit board 10 'according to this embodiment also has fine circuits 1a and 1b formed on the left and right sides of the substrate surface, and the left and right fine circuits 1a and 1b. Between the left and right microcircuits 1a and 1b, a circuit 1c is formed on the surface of the bent portion.
And in the printed wiring board 10 in which the circuit 1c which bears the electrical connection between the fine circuit 1a and the fine circuit 1b which require a fine opening is formed on the surface of the bent part, on the surface of the circuit 1c of the bent part Forming the first resin coating portion 3 made of a resin material having excellent mechanical properties such as bendability, thereby preventing disconnection due to cracking and peeling of the resin coating portion, and the fine circuits 1a and 1b. By forming a second resin coating portion made of a photosensitive resin material on the surface, a fine opening having excellent opening accuracy and position accuracy is formed to improve the accuracy of the printed wiring board.
The printed wiring board 10 'according to this embodiment has a structure in which the metal foil on the back surface side is completely removed from the bent portion, and the circuit 1c is formed only on the surface of the bent portion.

この実施例では、屈曲性などの優れた機械的特性を必要とする部分に、溶液状のポリイミド（ポリイミドインク）を塗布して第１樹脂被覆部３を形成するとともに、微細な開口部を必要とする部分（微細開口部）に感光性樹脂溶液（感光性絶縁インク）を塗布して第２樹脂被覆部４を形成し、プリント配線基板１０の表面に複数の樹脂材料からなる絶縁層２０を形成した。この実施例によれば、溶液状のポリイミド（ポリイミドインク）を塗布して第１樹脂被覆部３を形成するとともに、感光性樹脂溶液（感光性絶縁インク）を塗布して第２樹脂被覆部４を形成したため、回路間隙に気泡が入りにくく、また層厚を制御することが容易で、特に薄膜化することが容易である。
なお、屈曲部を被覆する第１樹脂被覆部３はベース基材２と同じ樹脂材料を用いて形成することが好ましい。 In this embodiment, a solution-like polyimide (polyimide ink) is applied to a portion requiring excellent mechanical properties such as flexibility to form the first resin coating portion 3 and a fine opening is required. A photosensitive resin solution (photosensitive insulating ink) is applied to a portion (fine opening) to form a second resin coating portion 4, and an insulating layer 20 made of a plurality of resin materials is formed on the surface of the printed wiring board 10. Formed. According to this embodiment, a solution-like polyimide (polyimide ink) is applied to form the first resin coating portion 3, and a photosensitive resin solution (photosensitive insulating ink) is applied to the second resin coating portion 4. Therefore, it is difficult for bubbles to enter the circuit gap, the layer thickness can be easily controlled, and it is particularly easy to reduce the thickness.
In addition, it is preferable to form the 1st resin coating | coated part 3 which coat | covers a bending part using the same resin material as the base base material 2. FIG.

また機械的特性の優れた樹脂材料（ポリイミドインク）から形成した第１樹脂被覆部３と、感光性の樹脂材料（感光性絶縁インク）から形成した第２樹脂被覆部４とを有する絶縁層２０において、前記第１樹脂被覆部３と第２樹脂被覆部４との境界を、それぞれの樹脂材料がオーバーラップするように設計することが好ましい（図２（ｂ）を参照）。第１樹脂被覆部３と第２樹脂被覆部４とをオーバーラップさせた絶縁層２０によってプリント配線基板１０を被覆することによって、回路パターン１が露出することが無い。   The insulating layer 20 includes a first resin coating portion 3 formed from a resin material (polyimide ink) having excellent mechanical characteristics and a second resin coating portion 4 formed from a photosensitive resin material (photosensitive insulating ink). It is preferable that the boundary between the first resin coating portion 3 and the second resin coating portion 4 is designed so that the resin materials overlap each other (see FIG. 2B). By covering the printed wiring board 10 with the insulating layer 20 in which the first resin covering portion 3 and the second resin covering portion 4 are overlapped, the circuit pattern 1 is not exposed.

この実施例では第１実施例と同様に、感光性の樹脂材料からなる第２樹脂被覆部４を、露光・現像によってパターニングし、開口部４Ａを形成した。
また、機械的特性に優れた樹脂材料からなる第１樹脂被覆部３に開口部を形成する場合、例えばレーザ加工によって開口部を形成することができる。
さらにこの実施例によるプリント配線基板１０´では、微細な開口部を必要としないプリント配線基板１０の裏面に、予め開口部６Ａを形成してあるカバーレイフィルム６を貼り合せ、裏面の回路１ｄを保護する樹脂被覆部（開口部６Ａを備える）を形成した。 In this example, similarly to the first example, the second resin coating portion 4 made of a photosensitive resin material was patterned by exposure and development to form the opening 4A.
Moreover, when forming an opening part in the 1st resin coating | coated part 3 which consists of a resin material excellent in the mechanical characteristic, an opening part can be formed by laser processing, for example.
Furthermore, in the printed wiring board 10 'according to this embodiment, a coverlay film 6 having an opening 6A formed in advance is bonded to the back surface of the printed wiring board 10 that does not require a fine opening, and the circuit 1d on the back surface is provided. A resin coating portion (including an opening 6A) to be protected was formed.

このように、本発明によるプリント配線基板では、回路パターン１を保護する絶縁層２０を形成するにあたって、屈曲部などの優れた機械的特性が必要な部分に、液晶ポリマーやポリイミドなどの機械的特性の優れた樹脂材料からなる第１樹脂被覆部３を形成するとともに、優れた開口精度を必要とする部分に、感光性の樹脂材料を塗布して第２樹脂被覆部４を形成し、さらに該第２樹脂被覆部４を露光・現像して開口部４Ａを形成したため、優れた機械的特性をもつプリント配線基板において、優れた位置精度・開口精度をもつ開口部を形成することができる。   As described above, in the printed wiring board according to the present invention, in forming the insulating layer 20 that protects the circuit pattern 1, mechanical properties such as liquid crystal polymer and polyimide are provided in a portion that requires excellent mechanical properties such as a bent portion. And forming a second resin coating portion 4 by applying a photosensitive resin material to a portion that requires excellent opening accuracy, and forming the second resin coating portion 4. Since the opening 4A is formed by exposing and developing the second resin coating portion 4, it is possible to form an opening having excellent positional accuracy and opening accuracy in a printed wiring board having excellent mechanical characteristics.

この発明の第１実施例によるプリント配線基板の説明図である。It is explanatory drawing of the printed wiring board by 1st Example of this invention. この発明の第２実施例によるプリント配線基板の説明図である。It is explanatory drawing of the printed wiring board by 2nd Example of this invention. 従来技術によるプリント配線基板（開口部を有するカバーレイフィルムを貼付）の説明図である。It is explanatory drawing of the printed wiring board by the prior art (attaching the coverlay film which has an opening part). 従来技術によるプリント配線基板（感光性カバーレイフィルムを貼付）の説明図である。It is explanatory drawing of the printed wiring board (attaching a photosensitive coverlay film) by a prior art.

符号の説明Explanation of symbols

１ 回路パターン
２ ベース基材
３ 第１樹脂被覆部
４ 第２樹脂被覆部
４Ａ 開口部
５ マスク部材
６ カバーレイフィルム
１０ プリント配線基板
２０ 絶縁層 DESCRIPTION OF SYMBOLS 1 Circuit pattern 2 Base base material 3 1st resin coating part 4 2nd resin coating part 4A Opening part 5 Mask member 6 Coverlay film 10 Printed wiring board 20 Insulating layer

Claims (3)

回路パターン（１）を保護する絶縁層（２０）を被覆したプリント配線基板において、
前記絶縁層（２０）が複数の樹脂材料から形成され、
機械的特性に優れた樹脂材料で形成される第１樹脂被覆部（３）と、感光性の樹脂材料を塗布して形成される第２樹脂被覆部（４）とを有し、
さらに前記第２樹脂被覆部（４）に、感光性の樹脂材料を露光・現像して形成した開口部（４Ａ）を設けたことを特徴とするプリント配線基板。 In a printed wiring board coated with an insulating layer (20) that protects the circuit pattern (1),
The insulating layer (20) is formed of a plurality of resin materials;
A first resin coating portion (3) formed of a resin material having excellent mechanical properties, and a second resin coating portion (4) formed by applying a photosensitive resin material,
The printed circuit board further comprises an opening (4A) formed by exposing and developing a photosensitive resin material to the second resin coating (4). ポリイミド、ポリアミド、ポリアミドイミド、液晶ポリマーから選択される１又は複数の樹脂材料からなる樹脂溶液を塗布して第１樹脂被覆部（３）を形成したことを特徴とする請求項１に記載のプリント配線基板。   The print according to claim 1, wherein the first resin coating portion (3) is formed by applying a resin solution made of one or more resin materials selected from polyimide, polyamide, polyamideimide, and liquid crystal polymer. Wiring board. 屈曲部に形成した回路（１ｃ）の表面に第１樹脂被覆部（３）を形成するとともに、微細回路（１ａ，１ｂ）の表面に第２樹脂被覆部（４）を形成したことを特徴とする請求項１又は２に記載のプリント配線基板。 The first resin coating portion (3) is formed on the surface of the circuit (1c) formed in the bent portion, and the second resin coating portion (4) is formed on the surface of the fine circuit (1a, 1b). The printed wiring board according to claim 1 or 2.
JP2004171325A 2004-06-09 2004-06-09 Printed circuit board Pending JP2005353751A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135510A (en) * 2006-11-28 2008-06-12 Shindo Denshi Kogyo Kk Flexible printed wiring board, flexible printed circuit board, and method for manufacturing them
JP2012033869A (en) * 2010-06-28 2012-02-16 Sumitomo Chemical Co Ltd Method of manufacturing laminated substrate, laminated substrate and printed circuit board
JP2015214152A (en) * 2010-06-28 2015-12-03 住友化学株式会社 Method for manufacturing laminate substrate, laminate substrate, and printed wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135510A (en) * 2006-11-28 2008-06-12 Shindo Denshi Kogyo Kk Flexible printed wiring board, flexible printed circuit board, and method for manufacturing them
JP2012033869A (en) * 2010-06-28 2012-02-16 Sumitomo Chemical Co Ltd Method of manufacturing laminated substrate, laminated substrate and printed circuit board
JP2015214152A (en) * 2010-06-28 2015-12-03 住友化学株式会社 Method for manufacturing laminate substrate, laminate substrate, and printed wiring board
TWI513582B (en) * 2010-06-28 2015-12-21 Sumitomo Chemical Co Method for producing laminated base material, laminated base material and printed wiring board
KR101805193B1 (en) * 2010-06-28 2017-12-05 스미또모 가가꾸 가부시끼가이샤 Method for producing laminated base material, laminated base material and printed wiring board

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