CN201226078Y - Combined printing formwork - Google Patents
Combined printing formwork Download PDFInfo
- Publication number
- CN201226078Y CN201226078Y CNU2008201122059U CN200820112205U CN201226078Y CN 201226078 Y CN201226078 Y CN 201226078Y CN U2008201122059 U CNU2008201122059 U CN U2008201122059U CN 200820112205 U CN200820112205 U CN 200820112205U CN 201226078 Y CN201226078 Y CN 201226078Y
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- China
- Prior art keywords
- printing stencil
- combined type
- openings
- type printing
- support plate
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- Expired - Lifetime
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Abstract
The utility model discloses a compound type printing module which comprises a support plate, a net body and a photosensitive material. The support plate is provided with a plurality of first openings; the reticulate body is arranged on one surface of the support plate. The photosensitive material is covered on the net body and is provided with a plurality of second openings which are respectively opposite to the first openings. In this way, the reticulate body is connected with the support plate and the photosensitive material; moreover, the support plate is used as a shielding hood for leading the second openings of the photosensitive material to be consistent with the first openings of the support plates by using a yellow light technology for patterning the photosensitive material, thus accurately confirming the sizes of the second openings.
Description
Technical field
The utility model is about a kind of structure of printing stencil, especially in regard to a kind of structure of combined type printing stencil.
Background technology
Because consumption electronic products develop towards light, thin, short, little direction, and be the high-quality of lifting consumption electronic products, (Surface Mounted Technology SMT) has become the technology main flow of Electronic Packaging industry to surface mount technology.Surface mount technology comprises three operation stages: solder printing, placement electronic component and reflow soldering (solder reflowing).
Please refer to shown in Figure 1A, illustrate that a kind of printing stencil of application of known technology carries out the technology of solder printing.One circuit board 10 is provided, and utilizes a printing stencil 20a, a scraper 30 and a scolder S to come circuit board 10 is carried out solder printing.Printing stencil 20a has a plurality of pattern holes 202, and these pattern holes 202 run through printing stencil 20a.At first printing stencil 20a is arranged on the circuit board 10 during solder printing, is sidelong in printing stencil 20a one again and puts scolder S.The surface in contact of printing stencil 20a and scraper 30 can be considered meets shaving 201.When printing is carried out, scraper 30 bears an external force F and meets shaving 201 to fit tightly in printing stencil 20a, make scraper 30 when the direction of arrow is advanced, and printing stencil 20a produced a downward pressure, scolder S can be inserted in the pattern hole 202 of printing stencil 20a smoothly, so the pairing pattern of printing stencil 20a can be printed on the circuit board 10.
Yet known printing stencil 20a causes printing stencil 20a to produce wavy distortion after more than 30 friction of scraper easily, or produces scratch 203 in the shaving 201 meeting of printing stencil 20a.So the printing stencil 20a of non-smooth surface will cause scolder can't accurately fill up pattern hole 202, therefore cause the uppity problem of printing solder S thickness, in case when printing stencil 20a damages because repeatedly use, then must change immediately.Because printing stencil 20a is material with the steel usually, and is processed to form pattern hole 202 thereon, can cause cost to improve if often change printing stencil 20a.In addition, for the scratch 203 of meeting shaving 201, also easily when printing, often cause scolder S to insert scratch 203 and residue in printing stencil 20a because of the structure of depression.
In addition, these pattern holes 202 run through printing stencil 20a many places, for avoiding influencing the effect of printing, pattern hole 202 peripheries must keep certain join domain A with adjacent pattern hole 202, cause between the pattern hole 202 and need be provided with the multistage junction, separate with printing stencil 20a so as to avoiding part pattern hole 202.Yet such design causes scolder S can't pass through printing stencil 20a on the contrary, causes these pattern holes 202 can't have the printing effect of sophistication or the not good problem of printing effect.
Please refer to shown in Figure 1B, illustrate that the another kind of printing stencil of application of known technology carries out the technology of solder printing.Because scraper 30, circuit board 10, external force F and scolder S are specified in, so do not repeat them here.Printing stencil 20b comprises a body 21 and a reticulate body 22, and body 21 has a plurality of pattern holes 211, and these pattern holes 211 run through the body 21 of printing stencil 20b.In addition, reticulate body 22 is formed on the surface 212 of body 21, and join domain A (shown in Figure 1A) that need not be above-mentioned so as to providing these pattern holes 211 1 to keep effect is so as to reaching exquisite printed design.
Yet, because reticulate body 22 is formed on the surface 212 of body 21, just, the printing stencil 20b surface structure and the out-of-flatness of this tool reticulate body 22, such design causes scolder S on the contrary in printing process, easily the viscosity because of scolder S self residues on the reticulate body 22 of printing stencil 20b, and the net material of reticulate body 22 can disturb in the scolder S turnover pattern hole 211, and causes the amount of inserting scolder S in the pattern hole 211 wayward.During follow-up reflow soldering,, can cause scolder to cause short circuit, if insufficient solder connection, then can cause the contact can't conducting and cause the electronic product qualification rate to descend with contiguous contact conducting if scolder is too much.
Therefore, how to provide a kind of combined type printing stencil, can accurately control the size of pattern hole, take into account the printing effect of surface mount technology simultaneously, real is one of important problem.
The utility model content
Because above-mentioned problem, the utility model provides a kind of combined type printing stencil, can accurately control the size of pattern hole, so as to promoting the printing effect of surface mount technology, helps reducing the required cost of replacing printing stencil.
For reaching above-mentioned purpose, comprise a support plate, a reticulate body and a photosensitive material according to a kind of combined type printing stencil of the present utility model.Support plate has a plurality of first openings, and reticulate body is arranged at a surface of support plate.Photosensitive material covers reticulate body, and have a plurality of second openings respectively with the corresponding setting of these first openings.
From the above, because of foundation a kind of combined type printing stencil of the present utility model, support plate by having a plurality of first openings is as shade (mask), with the photosensitive material of gold-tinted technology (photolithigraphyprocess) patterning on it, make second opening of photosensitive material consistent, and accurately define the size of second opening with first opening of support plate.In addition, do not have the damage of scraping,, help reducing the required cost of replacing printing stencil so can prolong the serviceable life of combined type printing stencil owing to support plate directly bears the external force wiper.
Description of drawings
Figure 1A carries out the synoptic diagram of solder printing technology for a kind of printing stencil of application of known technology;
Figure 1B carries out the synoptic diagram of solder printing technology for the another kind of printing stencil of application of known technology;
Fig. 2 is the synoptic diagram of a kind of combined type printing stencil of the utility model preferred embodiment;
Fig. 3 is for using the synoptic diagram that combined type printing stencil of the present utility model carries out solder printing technology; And
Fig. 4 is the synoptic diagram of the combined type printing stencil of another preferred embodiment of the utility model.
[main element symbol description]
10: circuit board
20a, 20b: printing stencil
201,501: meet shaving
202,211,502: the pattern hole
203: scratch
21: body
212,512: the surface
22,52: reticulate body
30: scraper
50a, 50b: combined type printing stencil
51: support plate
511: the first openings
53: photosensitive material
531: the second openings
54: protective seam
A: join domain
F: external force
L: light
S: scolder
Embodiment
Hereinafter with reference to correlative type, a kind of combined type printing stencil structure according to the utility model preferred embodiment is described, wherein components identical will be illustrated with identical symbol.
Please refer to shown in Figure 2ly, a kind of combined type printing stencil 50a of the utility model preferred embodiment comprises a support plate 51, a reticulate body 52 and a photosensitive material 53.Support plate 51 has a plurality of first openings 511.Reticulate body 52 is arranged at a surface 512 of support plate 51.Photosensitive material 53 covers reticulate bodies 52, and have a plurality of second openings 531 respectively with these first opening, 511 corresponding settings.
In present embodiment, support plate 51 preferable materials are a rigidity material, and it can be metal or alloy, such as but not limited to steel or stainless steel.And these first openings 511 can form by modes such as etching, mechanical punching, machine drilling or cuies.Wherein, these first openings 511 can be configuration of one-period property or aperiodicity configuration according to actual needs.
The material of reticulate body 52 is metal, alloy or macromolecular material, constitutes such as but not limited to materials such as stainless steel, nylon or resins.At this, reticulate body 52 becomes the example explanation with a plurality of braided steel wires, and is right non-in order to restriction the utility model.The count of reticulate body 52 can be designed suitable aperture according to actual needs.The surface 512 that is arranged at support plate 51 by reticulate body 52 makes support plate 51 obtain to support.In addition, because the elastic strength of combined type printing stencil 50a can be by changing integral thickness to reach, for instance, when combined type printing stencil 50a has thin thickness, because support plate 51 all has higher deformability with reticulate body 52, therefore when scraper (figure shows) when pressurization forces in combined type printing stencil 50a, can be by elasticity with as cushioning.In addition, the composite structure that is made of support plate 51 and reticulate body 52 more can avoid the surface 512 of support plate 51 directly to bear the external force effect and cause scratch or damage.
The formation of these second openings 531, be that support plate 51 by having a plurality of first openings 511 is as shade, with the photosensitive material 53 of gold-tinted art pattern CADization on it, make second opening 531 of photosensitive material 53 consistent, and accurately define the size of second opening 531 with first opening 511 of support plate 51; Below about the generation type of these second openings 531 for illustrating, non-in order to restriction the utility model.
At first, providing a light L (shown in the direction of arrow) to wear from support plate 51 sides penetrates these first openings 511 and photosensitive material 53 is exposed, again after development and etch processes, can form these second openings 531 in photosensitive material 53, can be eurymeric (positive) photoresist or emulsion at this photosensitive material 53.Because therefore the material of photosensitive material 53 for having stickiness can make reticulate body 52 be fixed on the support plate 51.Can replace the required shade of gold-tinted technology by 511 of these first openings on the support plate 51.
It should be noted that light L make these second openings 531 respectively with these first opening, 511 accurate corresponding settings, so promptly have a plurality of pattern holes 502 and run through combined type printing stencil 50a.When inserting scolder, can accurately fill up these pattern holes 502, with the size of accurate control projection that scolder is formed (bump) by scraper.
Certainly, also can use minus (negative) photoresist or emulsion, and provide light (figure does not show), and cooperate patterning light shield (figure does not show) to carry out patterning from photosensitive material 53 sides according to actual needs.Light is worn and is penetrated the default pattern of light shield and photosensitive material 53 is exposed, in addition through develop and etch processes after, can form these second openings 531 in photosensitive material 53 equally.
Below the technology that above-mentioned combined type printing stencil 50a prints is used in explanation.Present embodiment is the example explanation with solder printing in a circuit board, and is right non-in order to restriction the utility model.Combined type printing stencil 50a of the present utility model also can apply to for example technology of the pattern conductive film of electronic product such as solar panels.
Please refer to shown in Figure 3ly, a circuit board 10, one combined type printing stencil 50a and a scraper 30 are provided, combined type printing stencil 50a is arranged on the circuit board 10, and the surface in contact of combined type printing stencil 50a and scraper 30 can be considered and meets shaving 501.Combined type printing stencil 50a has a plurality of pattern holes 502 and runs through combined type printing stencil 50a.When printing is carried out, according to the allocation position of pattern hole 502, and by scraper 30 so that scolder S is inserted in the pattern hole 502, corresponding pattern is printed on the circuit board 10.
When scraper 30 by external force F when the direction of arrow is advanced, external force F can make scraper 30 fit tightly in combined type printing stencil 50a meet shaving 501, and then make scolder S accurately insert pattern hole 502.Because combined type printing stencil 50a itself has the elasticity of deformation, therefore be subjected to external force F and when being pressed on combined type printing stencil 50a down, in the strength range of certain external force F, be not easy all to make that combined type printing stencil 50a produces the problem of being out of shape at scraper 30.
Please refer to shown in Figure 4ly, the combined type printing stencil 50b of another preferred embodiment of the utility model comprises a support plate 51, a reticulate body 52, a photosensitive material 53 and a protective seam 54.Because support plate 51, reticulate body 52 and photosensitive material 53 describe in detail in the above-described embodiments, do not repeat them here.
Combined type printing stencil 50b and above-mentioned combined type printing stencil 50a difference are: combined type printing stencil 50b has more protective seam 54, and it is covered in the periphery of these second openings 531 of photosensitive material 53 and/or the periphery of these first openings 511.At this, comprising Teflon (Teflon) with protective seam 54 materials is the example explanation, right non-in order to restriction the utility model.Certainly, protective seam 54 materials also can replace with other macromolecular material and have other additional function or be arranged at combined type printing stencil 50b with the structure of multilayer according to actual needs.
In typography; protective seam 54 can provide an anti-scratch effect; so can avoid combined type printing stencil 50b repeatedly to press through scraper scrapes and produces surperficial scratch; so as to keeping the flatness on combined type printing stencil 50b surface; prolong the serviceable life of combined type printing stencil 50b, make scolder can accurately print out uniform solder thickness.In addition, protective seam 54 also can provide one to prevent being stained with glutinous effect, and is not residual so that make scolder can break away from combined type printing stencil 50b smoothly.
In addition, be not difficult for scraping damage, prolong the serviceable life of combined type printing stencil, reduce and change the required cost of printing stencil owing to support plate directly bears the external force wiper.
In sum, because of foundation a kind of combined type printing stencil of the present utility model, support plate by having a plurality of first openings is as shade, with the photosensitive material of gold-tinted art pattern CADization on it, make second opening of photosensitive material consistent, and accurately define the size of second opening with first opening of support plate.In addition, be not difficult for scraping damage,, help reducing the required cost of replacing printing stencil so can prolong the serviceable life of combined type printing stencil owing to support plate directly bears the external force wiper.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present utility model and category, and, all should be contained in the claims scope its equivalent modifications of carrying out or change.
Claims (10)
1, a kind of combined type printing stencil, it comprises:
One support plate has a plurality of first openings;
One reticulate body is arranged at a surface of this support plate; And
One photosensitive material covers this reticulate body, and have a plurality of second openings respectively with the corresponding setting of these first openings.
2, combined type printing stencil as claimed in claim 1, wherein the material of this support plate is a rigid material.
3, combined type printing stencil as claimed in claim 2, wherein this rigidity material is a metal or alloy.
4, combined type printing stencil as claimed in claim 1, wherein these first openings form by etching, mechanical punching, machine drilling or cut mode.
5, combined type printing stencil as claimed in claim 1, wherein these second openings form by gold-tinted technology.
6, combined type printing stencil as claimed in claim 1, wherein the material of this reticulate body is metal, alloy or macromolecular material.
7, combined type printing stencil as claimed in claim 1, wherein this photosensitive material is photoresist or emulsion.
8, combined type printing stencil as claimed in claim 1, wherein this photosensitive material forms by coating or rotary coating mode.
9, combined type printing stencil as claimed in claim 1 more comprises:
One protective seam covers the periphery of this photosensitive material, these second openings and/or the periphery of these first openings.
10, combined type printing stencil as claimed in claim 9, wherein this protective seam material comprises Teflon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201122059U CN201226078Y (en) | 2008-05-26 | 2008-05-26 | Combined printing formwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201122059U CN201226078Y (en) | 2008-05-26 | 2008-05-26 | Combined printing formwork |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201226078Y true CN201226078Y (en) | 2009-04-22 |
Family
ID=40598974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201122059U Expired - Lifetime CN201226078Y (en) | 2008-05-26 | 2008-05-26 | Combined printing formwork |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201226078Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102653159A (en) * | 2011-03-04 | 2012-09-05 | 仓和有限公司 | Method for manufacturing printing screen with protective layer |
| CN102956797A (en) * | 2012-11-23 | 2013-03-06 | 天津三安光电有限公司 | Manufacturing method for LED (Light Emitting Diode) |
| CN103203968A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for a step stencil |
| CN103203965A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a printing stencil used in surface-mounting technology (SMT) |
| CN104191855A (en) * | 2014-08-22 | 2014-12-10 | 桐城运城制版有限公司 | SMT printing template |
| CN108337818A (en) * | 2017-01-20 | 2018-07-27 | 塞舌尔商元鼎音讯股份有限公司 | The method and its printed circuit board of printed circuit board technology |
-
2008
- 2008-05-26 CN CNU2008201122059U patent/CN201226078Y/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102653159A (en) * | 2011-03-04 | 2012-09-05 | 仓和有限公司 | Method for manufacturing printing screen with protective layer |
| CN102653159B (en) * | 2011-03-04 | 2013-12-18 | 仓和有限公司 | Method for manufacturing printing screen with protective layer |
| CN103203968A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for a step stencil |
| CN103203965A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a printing stencil used in surface-mounting technology (SMT) |
| CN103203965B (en) * | 2012-01-16 | 2017-01-25 | 昆山允升吉光电科技有限公司 | A hybrid production process for a printing stencil used in surface-mounting technology (SMT) |
| CN103203968B (en) * | 2012-01-16 | 2017-01-25 | 昆山允升吉光电科技有限公司 | A production process for a step stencil |
| CN102956797A (en) * | 2012-11-23 | 2013-03-06 | 天津三安光电有限公司 | Manufacturing method for LED (Light Emitting Diode) |
| CN102956797B (en) * | 2012-11-23 | 2015-01-07 | 天津三安光电有限公司 | Manufacturing method for LED (Light Emitting Diode) |
| CN104191855A (en) * | 2014-08-22 | 2014-12-10 | 桐城运城制版有限公司 | SMT printing template |
| CN104191855B (en) * | 2014-08-22 | 2016-07-13 | 桐城运城制版有限公司 | A kind of SMT printing stencil |
| CN108337818A (en) * | 2017-01-20 | 2018-07-27 | 塞舌尔商元鼎音讯股份有限公司 | The method and its printed circuit board of printed circuit board technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090422 |
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| CX01 | Expiry of patent term |