JP2006159579A - Method for manufacturing metal mask plate for printing and metal mask plate for printing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture, with high precision, a metal mask plate for printing with holes opened in a desired printing pattern by a patterning process and a recessed part for the relief of a mounted component, formed on a substrate and besides, and to arrange that the change of a design for the position/size of the recessed part can be dealt with easily and at a low cost. <P>SOLUTION: In this method for manufacturing the metal mask plate for printing, high precision printing can be achieved since the metal mask plate for printing can be electroformed with high precision. It is possible to form the recessed parts 5 of various depth dimensions simply and certainly in compliance with the height dimension of a primary mounted component 9 only by adjusting the thickness dimension of a primary and a secondary electro-deposit layer 20 and 26. Thus the change of the position/depth dimension of the recessed part 5 in a substrate 2 following the change in design of a printed wiring board 7 as printed matter, can be dealt with easily and at a low cost. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is used, for example, when performing solder paste printing for mounting secondary mounting components after mounting various primary mounting components on the printed wiring board in a mounting process on the printed wiring board. The present invention relates to a printed metal mask plate and a method for manufacturing the same.

  In the field of this type of printing metal mask plate, it is known to provide a concave portion having a shape corresponding to the thickness and height of the component in order to escape the primary mounting component on the printed wiring board. Then, the recess is formed by etching within the plate thickness of the printing metal mask plate.

  However, the method of forming a recess by etching as in Patent Document 1 cannot form the recess with high accuracy. In the case of using a laser, if the number of concave portions to be formed is large, the manufacturing cost is high, and warping due to a thermal reaction around the concave portions, that is, undulation is likely to occur due to the influence of heat during formation. There is also a disadvantage in that the vertical cross-section of each opening tends to deteriorate.

  As a solution to the above problems, there are Patent Documents 2 and 3 by the present inventors. In those, after forming a recess corresponding to the recess for escaping the primary mounting component on the surface of the electroformed mother mold, an electrodeposition layer is formed on the electroformed mother mold by electroforming. A metal mask plate for printing provided with a recess is prepared.

Japanese Utility Model Publication No. 61-98070 Japanese Patent Laid-Open No. 5-220920 Japanese Patent Application Laid-Open No. 5-220921

  According to the above Patent Documents 2 and 3, since the substrate is formed by the electroforming method, it is possible to produce a printing metal mask plate with higher accuracy than the etching and laser methods. It is useful in terms. The problem is that the setting of the external shape and the size of the recess is defined by the recess formed in advance on the surface of the electroforming mother mold. It is not easy to change. Moreover, there is a disadvantage in that the manufacturing cost of the metal mask plate for printing is very high.

  An object of the present invention is to obtain a highly accurate printing metal mask plate by electroforming. In addition, an object of the present invention is to provide a method for producing a printing metal mask plate that can easily and inexpensively cope with a design change such as a position of a recess and a depth dimension.

  As shown in FIG. 1, the present invention relates to a method for manufacturing a printing metal mask plate having openings 3 patterned in a desired printing pattern on a substrate 2 and recesses 5 for escaping mounting parts, as shown in FIG. As shown in FIG. 3B, a step of forming a resist body 19a corresponding to the position where the concave portion 5 is formed at a predetermined position of the flat plate-shaped electroformed mother die 13, and as shown in FIG. FIG. 4B shows a step of forming, by electroforming, a primary electrodeposition layer 20 to be a top plate 6 that closes the upper portion of the recess 5 by electroforming on the surface not covered with the resist body 19a on FIG. Thus, a step of forming a resist body 25a corresponding to the recess pattern of the recess 5 on the primary electrodeposition layer 20 and forming a resist body 25b corresponding to the opening pattern of the opening 3 on the electroforming mother die 13; As shown in FIG. 4 (c), the electroformed mother mold 3 and a step of forming a secondary electrodeposition layer 26 to be the substrate 2 by electroforming on the surface not covered with the resist bodies 25a and 25b on the primary electrodeposition layer 20, as shown in FIG. And a step of peeling the primary and secondary electrodeposition layers 20 and 26 from the electroforming mother die 13. Thus, as shown in FIG. 1, the squeegee surface side (electrocasting mother die 13 side, ie, the upper side in FIG. 1) is flat, and the substrate surface side (electroformed surface side, ie, the lower side in FIG. 1). A metal mask plate for printing with a step can be obtained. Moreover, as shown in FIG. 1, the metal mask plate for printing by which the depth dimension of the opening (3) and the depth dimension of the recessed part (5) were set to the same dimension can be obtained.

  Further, as shown in FIG. 5, the present invention relates to a method for producing a printing metal mask plate having openings 3 patterned in a desired printing pattern on a substrate 2 and recesses 5 for escaping mounting parts. 6 (b), a step of forming a resist body 19a corresponding to the position where the recess 5 is formed at a predetermined position of the flat electroforming mother die 13, and an electroforming as shown in FIG. 6 (c). A step of forming, by electroforming, a primary electrodeposition layer 20 to be a top plate 6 that covers the upper portion of the recess 5 by electroforming on the surface of the matrix 13 that is not covered with the resist body 19a; and FIG. As shown in FIG. 4, a step of forming a resist body 35a corresponding to the recess pattern of the recess 5 on the primary electrodeposition layer 20 and forming a resist body 35b covering the entire surface of the electroformed mother die 13 without the primary electrodeposition layer 20 is formed. As shown in FIG. A step of forming a secondary electrodeposition layer 36 having a predetermined height dimension by electroforming on the surface of the primary electrodeposition layer 20 without the cores 35a and 35b, and a resist body 35a as shown in FIG. After removing 35b, a resist body 40a corresponding to the recess pattern of the recess 5 is formed on the primary electrodeposition layer 20, and a resist body 40b corresponding to the opening pattern of the opening 3 is formed on the electroforming mother die 13. 8B, as shown in FIG. 8B, the surface of the electroforming mother die 13 that is not covered with the resist bodies 40a and 40b and the surface of the secondary electrodeposition layer 36 are electroformed by electroforming. And a step of peeling the primary, secondary and tertiary electrodeposition layers 20, 36 and 41 from the electroforming mother mold 13 as shown in FIG. 8D. It is characterized by.

  Further, as shown in FIG. 9, the present invention patterns a desired printing pattern on a substrate 2 having a two-layer structure including a first layer 45 serving as a squeegee surface and a second layer 46 serving as a contact surface with a printing object. In the manufacturing method of the printing metal mask plate having the opened hole 3 and the recessed part 5 for escaping the mounted component, as shown in FIG. 10B, the plate-shaped electroforming mother die 13 is opened at a predetermined position. A step of forming a resist body 50a corresponding to the opening pattern of the holes 3 and a surface not covered with the resist body 50a on the electroforming mother die 13 by electroforming as shown in FIG. A step of forming a primary electrodeposition layer 51 to be the layer 45, a step of forming a resist body 55a corresponding to the recess pattern of the recess 5 on the primary electrodeposition layer 51, as shown in FIG. 11 (b), the label on the primary electrodeposition layer 51 A step of forming a secondary electrodeposition layer 56 to be the second layer 46 by electroforming on the surface not covered with the strike body 55a, as shown in FIG. And a step of peeling off the next electrodeposition layers 51 and 56.

  In the above manufacturing method, the primary electrodeposition layer 51 as the first layer 45 is formed by electroforming nickel-cobalt, and the secondary electrodeposition layer 56 as the second layer 46 is electroformed with nickel. Can be.

  In addition, as shown in FIG. 1, the present invention is a printing metal mask plate having a hole 2 patterned in a desired printing pattern on a substrate 2 and a recess 5 for escaping a mounted component, and a squeegee surface. The side is a flat surface, and there is a step on the substrate surface side.

  According to the method for producing a printing metal mask plate according to the present invention, a printing metal mask plate can be produced with high accuracy by electroforming, so that precise printing is possible. Above all, it is possible to easily and reliably form the recesses 5 having various depth dimensions according to the height dimension of the mounting component 9 (see FIG. 1) simply by adjusting the thickness dimension of the electrodeposition layer. As in Patent Documents 2 and 3, the depth dimension of the recess formed in the electroformed mother die is compared with the form in which the size and depth dimension of the recess for escaping the mounted component are determined. This is excellent in that it can easily and cost-effectively change the position, depth, etc. of the recess 5 on the substrate 2 due to the design change of a certain printed wiring board 7 (see FIG. 1).

  That is, according to the manufacturing method according to the first aspect of the present invention, the depth dimension of the opening 3 and the recess 5, the substrate, and the substrate can be adjusted only by adjusting the thickness dimension of the primary electrodeposition layer 20 and the secondary electrodeposition layer 26. 2 can be easily and easily changed.

  In the manufacturing method according to the second aspect of the present invention, in the electroforming step of FIG. 8B, the electrodeposited metal constituting the tertiary electrodeposition layer 41 is the secondary electrodeposition layer 36 and the electroforming mother mold 13. Growing simultaneously from the surface of the. For this reason, the height position of the tertiary electrodeposition layer 41 formed on the secondary electrodeposition layer 36 is the same as that on the electroforming mother mold 13 by the sum of the thickness dimensions of the primary and secondary electrodeposition layers 20 and 36. It becomes a position higher than that of the tertiary electrodeposition layer 41 formed in this. Therefore, it is easy to increase the depth of the recess 5. However, the printing metal mask plate 1 produced by the manufacturing method can be suitably applied when it is desired to set the depth dimension of the recess 5 to be larger than that of the opening 3. In other words, the primary mounting component 9 ( It can be suitably applied when the height dimension of FIG. 1) is large. Moreover, the depth dimension of the opening 3 and the recessed part 5 and the opposing distance dimension between the substrate 2 and the printed wiring board 7 can be simply adjusted only by adjusting the thickness dimension of the primary electrodeposition layer 20 and the secondary electrodeposition layer 36. It is also excellent in that it can be easily changed.

  In the manufacturing method according to the third aspect of the present invention, the primary electrodeposition layer 51 is formed using the resist body 50a formed on the electroforming mother die 13, and then the resist body 50a and the primary electrodeposition are formed. A secondary electrodeposition layer 56 is formed using a resist body 55 a formed on the layer 51. However, the depth dimension of the opening 3 formed by removing the resist body 50a is larger by the thickness dimension of the primary electrodeposition layer 51 than the depth dimension of the recess 5 formed by removing the resist body 55a. It becomes. However, the printing metal mask plate 1 produced by the manufacturing method can be applied to the process when the depth dimension of the opening 3 is desired to be set larger than that of the recess 5, in other words, the mounting component 9 (FIG. 1) is suitably applicable when the height dimension is small. It is also excellent in that the depth dimensions of the opening 3 and the recess 5 can be easily changed simply by adjusting the thickness dimensions of the primary electrodeposition layer 51 and the secondary electrodeposition layer 56.

  As shown in FIG. 9, the printing metal mask plate obtained by the production according to the third aspect of the present invention includes a first layer 45 serving as a squeegee surface and a second layer 46 serving as a contact surface with a printing object. The substrate 2 having the two-layer structure is provided. In this case, as in claim 4, the primary electrodeposition layer 51, which is the first layer 45, is electroformed by nickel-cobalt, and the secondary electrodeposition layer 56, which is the second layer 46, is electroformed by nickel. Then, by forming the secondary electrodeposition layer 56 with soft nickel, it is possible to ensure good adhesion to the printed wiring board 7 (see FIG. 1), which is the substrate, and the primary electrodeposition layer 51 is By forming it with nickel-cobalt having a hardness higher than that of nickel, the strength of the squeegee surface to which the printing pressure is applied, that is, the squeegee surface with which the squeegee 10 (see FIG. 1) comes into contact can be favorably secured.

  According to the metal mask plate for printing according to the present invention described in claim 5, since the squeegee (mother mold) surface side is flat, the squeegee is easy to squeegee, and there is a step on the printed material (electroformed) surface side, so the metal mask plate after the squeegee finishes Is easily separated from the substrate. Further, if the depth dimension of the opening 3 and the depth dimension of the recessed part 5 for escaping the mounted part are set to the same dimension, printing with substantially the same thickness as the mounted part can be performed.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an example of how the printing metal mask plate of the present invention is used, and FIG. 2 shows an external perspective view of the metal mask plate. As shown in FIG. 1 and FIG. 2, a printing metal mask plate 1 includes a flat substrate 2 having an opening 3 for discharging ink and paste, and a recess 5 for escaping a primary mounting component (mounting component). It has. In FIG. 1 and FIG. 2, reference numeral 6 indicates a top plate that is integrally and integrally joined to the substrate 2 so as to close the upper part of the escape recess 5. The thickness dimension of the portion having the recess 5 is slightly larger than the thickness dimension of the substrate 2. The “ink / paste” mentioned here is a concept including solder paste, cream solder, liquid solder, conductive ink, and the like.

  Reference numeral 7 denotes a printed wiring board on which the primary mounting component 9 has already been mounted, and 10 denotes a squeegee. The squeegee 10 is for scraping the ink paste 11 placed on the printing metal mask plate 1 in the secondary mounting process. In FIG. 1, squeezing is performed using the upper surface of the printing metal mask plate 1 as the squeegee surface and the lower surface as the contact surface with the printed wiring board 7. In the illustrated example, the opening 3 and the recess 5 are formed in a square shape. However, the outer shape of the opening 3 and the recess 5 is not limited to a square shape.

  3 and 4 show a method for manufacturing the printing metal mask plate 1 described above. First, as shown in FIG. 3A, a photoresist layer 15 is formed on the surface of a stainless steel electroforming mother die 13 having conductivity, and then the top plate 6 is formed on the photoresist layer 15. After the pattern film 16 (glass mask) having the translucent hole 16a to be in close contact, exposure is performed by irradiating with ultraviolet light with an ultraviolet lamp 17, and development and drying are performed to dissolve unexposed portions. By removing, a primary pattern resist 19 having a resist body 19a corresponding to the top plate 6 was formed on the electroformed mother die 13 as shown in FIG. More specifically, a primary pattern resist 19 is formed so as to surround the place where the top plate 6 is formed. The photoresist layer 15 was formed by laminating one or several negative photosensitive dry film resists at a predetermined height and then thermocompression bonding.

  Next, as shown in FIG. 3C, the primary electrodeposition layer 20 to be the top plate 6 is formed by electrodepositing nickel-cobalt as an electrodeposition metal on the electroforming mother mold 13 without the resist body 19a. Was formed by electroforming. In FIG. 3 (c), reference numeral 21 denotes a primary electrodeposition layer formed so as to surround the primary electrodeposition layer 20 with the resist body 19a interposed therebetween. In the step 3 (d), the resist body 19a was removed and removed.

  After removing the resist body 19a and the primary electrodeposition layer 21 as shown in FIG. 3D, a photoresist layer is formed on the entire surface of the primary electrodeposition layer 20 and the electroforming mother mold 13 as shown in FIG. After forming 22, a pattern film 23 (glass mask) having a light transmitting hole 23 a corresponding to the recess 5 and the opening 3 is brought into intimate contact with the photoresist layer 22, and then ultraviolet light is applied by the ultraviolet light lamp 17. By exposing to light, performing development, drying, and dissolving and removing unexposed portions, as shown in FIG. 4B, the concave pattern of the concave portions 5 on the primary electrodeposition layer 20 is obtained. And a secondary pattern resist 25 having a resist body 25b corresponding to the opening pattern of the predetermined opening 3 is formed on the electroforming mother die 13.

  Next, as shown in FIG. 4C, an electrodeposited metal is electrodeposited by electroforming on the surface of the primary electrodeposition layer 20 and the electroforming mother mold 13 without the resist bodies 25a and 25b to form the substrate 2. A secondary electrodeposition layer 26 was formed. Here, the secondary electrodeposition layer 26 was formed using nickel-cobalt as an electrodeposition metal.

  The secondary electrodeposition layer 26 grows simultaneously from the surfaces of the primary electrodeposition layer 20 and the electroforming mother mold 13. Therefore, the height of the secondary electrodeposition layer 26 formed on the primary electrodeposition layer 20 is set to the height of the primary electrodeposition layer 20 by the thickness of the secondary electrodeposition layer 20. The position could be higher than that of the layer 26.

  The surface of the secondary electrodeposition layer 26 relating to each of the portion to be the opening 3 and the portion to be the recess 5 is subjected to a polishing treatment so that each portion has a predetermined thickness dimension, and then the resist body 25a. -25b was removed. The recess 5 was formed by removing the resist body 25a, and the opening 3 was formed by removing the resist body 25b. Finally, the primary and secondary electrodeposition layers 20 and 26 were peeled from the electroformed mother die 13. As a result, as shown in FIG. 4D, a printing metal mask plate 1 having openings 3 and recesses 5 in the substrate 2 as the secondary electrodeposition layer 26 was obtained.

(Second Embodiment)
FIG. 5 shows a printing metal mask plate according to the second embodiment of the present invention. The printing metal mask plate 1 includes an opening 3 for discharging ink and paste on a flat substrate 2 and a recess 5 for escaping the primary mounting component. As shown in FIG. 5, each concave portion 5 has an inner peripheral surface partitioned by a substrate 2 and a base layer 30 formed in an embedded state on the substrate 2, and an upper portion thereof is an upper surface of the substrate 2. And a top plate 6 formed in a flush manner. That is, the top of the recess 5 is blocked by the top plate 6. The inner peripheral surfaces of the opening 3 and the recess 5 are formed in a straight shape. Here, it is noted that the depth dimension of the recess 5 is set larger than that of the opening 3. The “ink / paste” mentioned here is a concept including solder paste, cream solder, liquid solder, conductive ink, and the like.

  6 to 8 show a method for manufacturing the printing metal mask plate 1 described above. First, as shown in FIG. 6A, a photoresist layer 15 is formed on the surface of a stainless steel electroforming mother die 13 having conductivity, and then the top plate 6 is formed on the photoresist layer 15. After the pattern film 16 (glass mask) having the translucent hole 16a to be in close contact, exposure is performed by irradiating with ultraviolet light with an ultraviolet lamp 17, and development and drying are performed to dissolve unexposed portions. By removing, a primary pattern resist 19 having a resist body 19a corresponding to the top plate 6 was formed on the electroformed mother die 13 as shown in FIG. That is, the primary pattern resist 19 surrounding the place where the top plate 6 was formed was formed. The photoresist layer 15 was formed by laminating one or several negative photosensitive dry film resists at a predetermined height and then thermocompression bonding.

  Next, as shown in FIG. 6C, the primary electrodeposition layer 20 to be the top plate 6 is formed by electrodepositing nickel-cobalt as an electrodeposition metal on the electroforming mother mold 13 without the resist body 19a. Was formed by electroforming. In FIG. 6 (c), reference numeral 21 indicates a primary electrodeposition layer formed so as to surround the primary electrodeposition layer 20 with the resist body 19a interposed therebetween. In step 6 (d), the resist body 19a was removed and removed.

  After removing the resist body 19a and the primary electrodeposition layer 21 as shown in FIG. 6 (d), a photoresist layer is formed on the entire surface of the primary electrodeposition layer 20 and the electroforming mother mold 13 as shown in FIG. 7 (a). 32 is formed, and a pattern film 33 (glass mask) having a light transmitting hole 33a corresponding to the concave portion 5 and the substrate 2 is brought into close contact with the photoresist layer 32, and then ultraviolet light is irradiated by the ultraviolet light lamp 17. Is exposed to light, developed and dried to dissolve and remove the unexposed portions, thereby forming a concave pattern of the concave portions 5 on the primary electrodeposition layer 20 as shown in FIG. A secondary pattern resist 35 having a corresponding resist body 35a and having a resist body 35b covering the entire surface of the electroformed mother die 13 without the primary electrodeposition layer 20 was formed.

  Next, as shown in FIG. 7C, a secondary electrodeposition layer that becomes an underlayer 30 by electrodepositing an electrodeposited metal on the surface of the primary electrodeposition layer 20 without the resist bodies 35 a and 35 b by electroforming. 36 was formed. Here, the secondary electrodeposition layer 36 was formed using nickel-cobalt as an electrodeposition metal. The height of the secondary electrodeposition layer 36 was set so as not to exceed the height of the resist bodies 35a and 35b.

  Next, as shown in FIG. 7 (d), after removing the resist bodies 35a and 35b, as shown in FIG. 7 (e), the entire surfaces of the primary and secondary electrodeposition layers 20 and 36 and the electroforming mother mold 13 are formed. A photoresist layer 37 was formed so as to cover. Then, after a pattern film 39 (glass mask) having a light transmitting hole 39 a corresponding to the recess 5 and the opening 3 is brought into close contact with the photoresist layer 37, ultraviolet light is irradiated by the ultraviolet lamp 17. Resist body corresponding to the concave pattern of the concave portion 5 on the primary electrodeposition layer 20 as shown in FIG. 8A by exposing, developing and drying, and dissolving and removing the unexposed portion. A tertiary pattern resist 40 having a resist body 40b corresponding to the opening pattern of the predetermined opening 3 was formed on the electroforming mother die 13 while having 40a.

  Next, as shown in FIG. 8B, an electrodeposited metal is electrodeposited by electroforming on the surface of the secondary electrodeposition layer 36 and the electroforming mother mold 13 without the resist bodies 40a and 40b, and the substrate 2 and A tertiary electrodeposition layer 41 was formed. Here, the tertiary electrodeposition layer 41 was formed using nickel-cobalt as an electrodeposition metal.

  The tertiary electrodeposition layer 41 grows simultaneously from the upper end surface of the secondary electrodeposition layer 36 and the surface of the electroforming mother mold 13. For this reason, the height position of the tertiary electrodeposition layer 41 formed on the secondary electrodeposition layer 36 is set so as to be equal to the sum of the thickness dimensions of the primary electrodeposition layer 20 and the secondary electrodeposition layer 36. 13 and higher than that of the tertiary electrodeposition layer 41 formed on the substrate 13.

  Next, as shown in FIG. 8 (c), with respect to the portion to be the opening 3 and the portion to be the recess 5, that is, the surface of the tertiary electrodeposition layer 41 grown from the primary and secondary electrodeposition layers 20 and 36. After performing a polishing process so as to obtain a predetermined height, the resist bodies 40a and 40b were removed as shown in FIG. 8 (d). The recess 5 was formed by removing the resist body 40a, and the opening 3 was formed by removing the resist body 40b. Finally, the primary, secondary, and tertiary electrodeposition layers 20, 36, and 41 were peeled from the electroformed mother mold 13. Thus, as shown in FIGS. 8D and 5, the printing metal mask plate 1 having the openings 3 and the recesses 5 in the substrate 2 as the tertiary electrodeposition layer 41 was obtained.

(Third embodiment)
FIG. 9 shows a printing metal mask plate according to the third embodiment of the present invention. The printing metal mask plate 1 includes an opening 3 for discharging ink and paste on a flat substrate 2 and a recess 5 for escaping the primary mounting component. As shown in FIG. 9, the substrate 2 includes an upper first layer 45 serving as a squeegee surface, and a lower second layer 46 serving as a contact surface with a printing object (printed wiring board 7: see FIG. 1). It has a two-layer structure consisting of Each concave portion 5 has an inner peripheral surface partitioned by a second layer 46, and an upper portion thereof is partitioned by a first layer 45. The inner peripheral surfaces of the opening 3 and the recess 5 are formed in a straight shape. Here, it is noted that the depth dimension of the recess 5 is smaller than that of the opening 3 by the thickness dimension of the first layer 45. The “ink / paste” mentioned here is a concept including solder paste, cream solder, liquid solder, conductive ink, and the like.

  10 and 11 show a method for manufacturing the printing metal mask plate 1 described above. First, as shown in FIG. 10A, a photoresist layer 47 is formed on the surface of a stainless steel electroforming mother die 13 having conductivity, and then the hole 3 is formed on the photoresist layer 47. After the pattern film 49 (glass mask) having the translucent hole 49a is adhered, exposure is performed by irradiating with ultraviolet light with the ultraviolet lamp 17, and development and drying are performed to dissolve unexposed portions. By removing, a primary pattern resist 50 having a resist body 50a corresponding to the opening 3 was formed on the electroformed mother die 13 as shown in FIG. The photoresist layer 47 was formed by laminating one or several negative photosensitive dry film resists according to a predetermined height and then thermocompression bonding.

  Next, as shown in FIG. 10C, a primary electrodeposition layer to be the first layer 45 is formed by electrodepositing nickel-cobalt as an electrodeposition metal on the electroforming mother die 13 without the resist body 50a. 51 was electroformed.

  As shown in FIG. 11A, a photoresist layer 52 is formed on the entire surface of the primary electrodeposition layer 51 without the resist body 50a, and then a light transmitting hole corresponding to the recess 5 is formed on the photoresist layer 52. After closely adhering the pattern film 53 (glass mask) having 53a, exposure is performed by irradiating ultraviolet light with the ultraviolet light lamp 17, development and drying are performed, and unexposed portions are removed, As shown in FIG. 11B, a secondary pattern resist 55 having a resist body 55 a corresponding to the recess pattern of the recess 5 was formed at a predetermined position on the primary electrodeposition layer 51.

  Next, as shown in FIG. 11 (c), the electrodeposition metal is electrodeposited by electroforming on the surface of the primary electrodeposition layer 51 without the resist bodies 50a and 55a, so that the second electrode 46 is formed. Layer 56 was formed. Here, the secondary electrodeposition layer 56 was formed using nickel as an electrodeposition metal.

  The surface of the secondary electrodeposition layer 56 was subjected to a polishing process, and the heights were made uniform, and then the resist bodies 50a and 55a were removed as shown in FIG. 11 (d). The opening 3 was formed by removing the resist body 50a, and the recess 5 was formed by removing the resist body 55a. Finally, the primary and secondary electrodeposition layers 51 and 56 were peeled from the electroformed mother die 13. Thus, as shown in FIG. 11 (d) and FIG. 9, an opening is formed in the substrate 2 having a two-layer structure composed of the first and second layers 45 and 46 as the primary and secondary electrodeposition layers 51 and 56. The metal mask plate 1 for printing which has 3 and the recessed part 5 was obtained.

  In each of the above embodiments, each electrodeposition layer is formed using nickel-cobalt, nickel, or the like as an electrodeposition metal, but the electrodeposition metal that can be used in the present invention is not limited thereto.

1 is a longitudinal side view showing an example of how the printing metal mask plate according to the first embodiment of the present invention is used. Overall perspective view of metal mask plate for printing Process explanatory drawing of the manufacturing method of the metal mask plate for printing concerning a 1st embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal mask plate for printing concerning a 1st embodiment of the present invention. Vertical side view of a printing metal mask plate according to a second embodiment of the present invention Process explanatory drawing of the manufacturing method of the metal mask plate for printing which concerns on 2nd Embodiment of this invention. Process explanatory drawing of the manufacturing method of the metal mask plate for printing which concerns on 2nd Embodiment of this invention. Process explanatory drawing of the manufacturing method of the metal mask plate for printing which concerns on 2nd Embodiment of this invention. Vertical sectional side view of a printing metal mask plate according to a third embodiment of the present invention Process explanatory drawing of the manufacturing method of the metal mask plate for printing concerning a 3rd embodiment of the present invention. Process explanatory drawing of the manufacturing method of the metal mask plate for printing concerning a 3rd embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal mask plate 2 for printing 2 Board | substrate 3 Opening 5 Recess 6 for escape of mounting components Top plate 13 Electroforming mother die 19a Resist body 20 Primary electrodeposition layer 25a Resist body 25b Resist body 26 Secondary electrodeposition layer 35a Resist body 35b resist body 36 secondary electrodeposition layer 40a resist body 40b resist body 41 tertiary electrodeposition layer 45 first layer 46 second layer 50a resist body 51 primary electrodeposition layer 55a resist body 56 secondary electrodeposition layer

Claims (5)

In the manufacturing method of the metal mask plate for printing which has the opening (3) patterned by the desired printing pattern in the board | substrate (2), and the recessed part (5) for escape of mounting components,
Forming a resist body (19a) corresponding to a position where the concave portion (5) is formed at a predetermined position of the plate-shaped electroformed mother die (13);
A primary electrodeposition layer (20) serving as a top plate (6) that covers the upper part of the recess (5) by electroforming is applied to the surface of the electroforming mold (13) that is not covered with the resist body (19a). Forming by casting;
A resist body (25a) corresponding to the recess pattern of the recesses (5) is formed on the primary electrodeposition layer (20) and also corresponds to the opening pattern of the openings (3) on the electroforming mother die (13). Forming a resist body (25b);
A secondary electrodeposition layer (26) that becomes a substrate (2) by electroforming is formed on the surface of the electroforming mold (13) and the primary electrodeposition layer (20) not covered with the resist bodies (25a, 25b). Forming, and
And a step of peeling the primary and secondary electrodeposition layers (20, 26) from the electroforming mold (13). In the manufacturing method of the metal mask plate for printing which has the opening (3) patterned by the desired printing pattern in the board | substrate (2), and the recessed part (5) for escape of mounting components,
Forming a resist body (19a) corresponding to a position where the concave portion (5) is formed at a predetermined position of the plate-shaped electroformed mother die (13);
A primary electrodeposition layer (20) serving as a top plate (6) that covers the upper part of the recess (5) by electroforming is applied to the surface of the electroforming mold (13) that is not covered with the resist body (19a). Forming by casting;
A resist body (35a) corresponding to the recess pattern of the recesses (5) is formed on the primary electrodeposition layer (20), and the resist covers the entire surface of the electroformed mother die (13) without the primary electrodeposition layer (20). Forming a body (35b);
Forming a secondary electrodeposition layer (36) having a predetermined height dimension by electroforming on the surface of the primary electrodeposition layer (20) without the resist bodies (35a, 35b);
After removing the resist bodies (35a and 35b), a resist body (40a) corresponding to the recess pattern of the recesses (5) is formed on the primary electrodeposition layer (20), and on the electroforming mother mold (13). Forming a resist body (40b) corresponding to the opening pattern of the opening (3);
On the surface of the electroforming mold (13) that is not covered with the resist body (40a, 40b) and the surface of the secondary electrodeposition layer (36), a third electrodeposition layer ( 41),
And a step of peeling the primary, secondary and tertiary electrodeposition layers (20, 36, 41) from the electroforming mold (13). Openings (patterned in a desired printing pattern) on a substrate (2) having a two-layer structure comprising a first layer (45) serving as a squeegee surface and a second layer (46) serving as a contact surface between the printing object. 3) and a manufacturing method of a printing metal mask plate having a recess (5) for escaping the mounted component,
Forming a resist body (50a) corresponding to the opening pattern of the openings (3) at a predetermined position of the flat-plate electroformed mother mold (13);
Forming a primary electrodeposition layer (51) to be a first layer (45) by electroforming on the surface of the electroforming mold (13) not covered with the resist body (50a);
Forming a resist body (55a) corresponding to the recess pattern of the recess (5) on the primary electrodeposition layer (51);
Forming a secondary electrodeposition layer (56) to be a second layer (46) by electroforming on the surface of the primary electrodeposition layer (51) not covered with the resist body (55a);
And a step of peeling the primary and secondary electrodeposition layers (51, 56) from the electroforming mother mold (13).   The primary electrodeposition layer (51) as the first layer (45) is formed by electroforming nickel-cobalt, and the secondary electrodeposition layer (56) as the second layer (46) is electroformed with nickel. The method for producing a metal mask plate for printing according to claim 3. A printing metal mask plate having an opening (3) patterned in a desired printing pattern on a substrate (2) and a recess (5) for escape of a mounted component,
A metal mask plate for printing, characterized in that the squeegee surface side is flat and the substrate surface side has a step.

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