CN113141717A - Drilling method of circuit board motherboard - Google Patents
Drilling method of circuit board motherboard Download PDFInfo
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- CN113141717A CN113141717A CN202110429115.2A CN202110429115A CN113141717A CN 113141717 A CN113141717 A CN 113141717A CN 202110429115 A CN202110429115 A CN 202110429115A CN 113141717 A CN113141717 A CN 113141717A
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- drilling
- hole
- motherboard
- board
- dirt
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a drilling method of a motherboard of a circuit board. According to the invention, after drilling is finished each time, drilling dirt can be more effectively removed from the hole, the phenomenon of hole blocking caused by excessive accumulation of drilling dirt is avoided, the heat dissipation efficiency of the inner-layer thick copper drill hole can be improved, the problem of poor roughness in the hole caused by excessive heat is avoided, and the problem of drill point fracture is avoided; the tool withdrawal speed is correspondingly reduced to 320mm/s, so that the smoothness of the hole wall of the drilled hole is improved; the sectional drilling method which is the same as the back drilling method is adopted, so that the heat dissipation efficiency of the drilling is effectively improved; in the plasma chemical reaction, the particles playing a chemical role are mainly positive ions and free radical particles, the effect on different materials is uniform, and the drilling dirt removing effect is good. Through testing, the working environment in the drilling process is clean and tidy, the generation of stains is reduced, and the neatness in the drilling process of the mother board is improved.
Description
Technical Field
The invention belongs to the technical field of circuit board production, and particularly relates to a drilling method of a circuit board motherboard.
Background
A motherboard, also called a system board or a main board, is one of the most basic and important components of a computer. Plays a significant role in the overall computer system. The manufacturing quality of the motherboard determines the stability of a hardware system, the motherboard is generally a rectangular circuit board, and a main circuit system forming a computer is mounted on the motherboard, and generally comprises elements such as a BIOS chip, an I/O control chip, a keyboard and panel control switch interface, an indicator light plug-in connector, an expansion slot, a motherboard, and a direct current power supply plug-in connector of a plug-in card, and the motherboard needs to be perforated during production.
However, the common drilling method is easy to cause the problem of back drilling hole blocking due to the difficulty in removing chips of copper wires and rubber slag, the problems of broken drill points, poor heat dissipation of the drilled holes and the like are increased, and meanwhile, the effect of removing drill dirt is poor.
Disclosure of Invention
The invention aims to: in order to solve the above-mentioned problems, a method for drilling a motherboard of a circuit board is provided.
The technical scheme adopted by the invention is as follows: a drilling method of a circuit board motherboard comprises the following steps:
s1, cutting the mother board after selecting the mother board without copper, and reducing the burrs and copper scraps of the board edge by using a backing plate; confirming that the cutting thickness is 0.0987 mm-0.113 mm;
s2, performing LDI exposure on the mother board which is well fed in the step S1, wherein an exposure ruler has 7 grids, the exposure energy is 45mJ, and the two plates are produced in a differentiated mode; testing the line width of the first mother board, and confirming the qualified manufactured product;
s3, starting to drill the outer layer of the motherboard; checking the precision of a machine table before drilling by adopting a non-clamping PIN positioning method; before drilling, firstly drilling a trial drilling hole, and then drilling an inner hole of a unit for production;
s4, after the plate is milled, the edge needs to be planed, and the maximum value is reserved for the edge; measuring the thickness of the plate by adopting a nine-point method after pressing, and measuring the thickness of the medium by cutting the plate edge;
s5, performing back drilling after the electrotinning is finished, cleaning a main shaft chuck before manufacturing, and replacing a backing board; measuring the thickness range of all boards before manufacturing, marking the boards, stacking back drilling according to the thickness difference, and measuring the area with the back drilling range, wherein the position of each board needs to be the same;
s6, before back drilling by changing different boards, the table top needs to be cleaned, and the board needs to be sliced each time to confirm the depth; cleaning the copper wire on the drill bit when 50 holes are drilled, and fully checking whether the copper wire remains after back drilling is finished; preparing a back drilling point film, and fully checking deviation holes;
s7, removing drilling dirt of the drill hole; the plasma is adopted to remove the drilling dirt with good effect; the plasma is formed by exciting gas molecules by adopting electric energy under the high vacuum condition to form ions or free radicals with higher reactivity, and the ions or the free radicals collide with the surface of the material under the action of a further electric field to generate physical and chemical reactions so as to remove the drilling dirt and form a layer of surface structure with a fine concave-convex shape;
s8, after the step S7 is finished, controlling the forming dimensional tolerance of the cleaned motherboard within a specified range, and milling and completely reserving the impedance strips; when washing the plate, the back hole is drilled downwards and the plate is placed at the speed of 1.0m/min, and the drying in the hole is ensured;
and S9, collecting and storing the mother board for subsequent etching and other operations of the mother board, thereby finishing the drilling process.
In a preferred embodiment, after the material is cut in step S1, the mother board is baked, wherein the baking temperature is controlled at 170 ℃ and the baking time is controlled at 4 hours.
In a preferred embodiment, in step S3, the pad is a standard phenolic pad with a lifetime setting of 500 holes, 1 PNL/stack.
In a preferred embodiment, in step S4, the out-of-tolerance split-pile redrawing strips are managed within ± 50mm of expansion and contraction.
In a preferred embodiment, in the step S5, the electroplating tin is electroplated for 10min to 13min with a current density of 1.0A/dm 2-1.3A/dm 2, and the tin thickness is controlled to be 5mm to 8mm, since tin is lower than copper density, a protective layer is padded on the copper layer during backdrilling; the back drilling is finished and then the tin layer is etched, on the one hand, etching liquid medicine is used for etching the flash of the back drilling hole and the drilling dirt in the hole, and on the other hand, the drilling dirt in the hole is cleaned by utilizing washing sections such as high-pressure washing and the like, so that the problems of hole blocking and the like are prevented.
In a preferred embodiment, in step S6, the drill speed is adjusted to 50kr/min, the feed speed is 36mm/S, and the retract speed is 212mm/S during backdrilling, and a 1:2:3:4 drilling method is adopted, in which 10% of the first drilling, 20% of the second drilling, 30% of the third drilling, and 40% of the fourth drilling are required to be performed for deep plating.
In a preferred embodiment, in step S6, the rotation speed is appropriately reduced to 100kr/min, the feeding speed is reduced to 29mm/S, and the retracting speed is correspondingly reduced to 320mm/S for drilling through holes.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the invention, after drilling is finished each time, drilling dirt can be more effectively removed from the hole, the phenomenon of hole blocking caused by excessive accumulation of drilling dirt is avoided, the heat dissipation efficiency of the inner-layer thick copper drill hole can be improved, the problem of poor roughness in the hole caused by excessive heat is avoided, and the problem of drill point fracture is avoided; the tool withdrawal speed is correspondingly reduced to 320mm/s, so that the smoothness of the hole wall of the drilled hole is improved; the sectional drilling method which is the same as the back drilling method is adopted, so that the heat dissipation efficiency of drilling is effectively improved.
2. In the invention, in the plasma chemical reaction, the particles playing a chemical role are mainly positive ions and free radical particles, the effect on different materials is uniform, and the effect of removing the drilling dirt is good. Through testing, the working environment in the drilling process is clean and tidy, the generation of stains is reduced, and the neatness in the drilling process of the mother board is improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a drilling method of a circuit board motherboard comprises the following steps:
s1, cutting the mother board after selecting the mother board without copper, and reducing the burrs and copper scraps of the board edge by using a backing plate; confirming that the cutting thickness is 0.1 mm; step S1, baking the mother board after cutting, wherein the temperature of the baking board is controlled at 170 ℃, and the time of baking the board is controlled at 4 hours;
s2, performing LDI exposure on the mother board which is well fed in the step S1, wherein an exposure ruler has 7 grids, the exposure energy is 45mJ, and the two plates are produced in a differentiated mode; testing the line width of the first mother board, and confirming the qualified manufactured product;
s3, starting to drill the outer layer of the motherboard; checking the precision of a machine table before drilling by adopting a non-clamping PIN positioning method; before drilling, firstly drilling a trial drilling hole, and then drilling an inner hole of a unit for production; in step S3, the base plate is a standard phenolic base plate, the service life is set to 500 holes, 1 PNL/pile;
s4, after the plate is milled, the edge needs to be planed, and the maximum value is reserved for the edge; after pressing, measuring the thickness of the plate by adopting a nine-point method, and measuring the thickness of the medium by cutting the plate edge without beating the slices in the unit; in step S4, controlling according to expansion and contraction within +/-50 mm, and changing the drilling belt in an out-of-tolerance manner by stacking;
s5, performing back drilling after the electrotinning is finished, cleaning a main shaft chuck before manufacturing, and replacing a backing board; measuring the thickness range of all boards before manufacturing, marking the boards, stacking back drilling according to the thickness difference, and measuring the area with the back drilling range, wherein the position of each board needs to be the same; in the step S5, the electrotinning is performed for 10min to 13min by using a current density of 1.0A/dm 2-1.3A/dm 2, the tin thickness is controlled to be 5mm to 8mm, and a protective layer is padded on the copper layer during back drilling because the tin has lower density than the copper; etching after back drilling, on one hand, etching to remove the tin layer, on the other hand, etching to remove burrs of the back drilling hole and drilling dirt in the hole by using etching liquid, and washing the drilling dirt in the hole by using washing sections such as high-pressure washing and the like to prevent the problems of hole blocking and the like; the drill dirt can be more effectively removed from the hole after each drilling, the phenomenon of hole blocking caused by excessive accumulation of the drill dirt is avoided, the heat dissipation efficiency of the inner-layer thick copper drill hole can be improved, the bad problems of excessive roughness in the hole and the like caused by excessive heat are avoided, and the problem of drill point breakage is avoided; the tool withdrawal speed is correspondingly reduced to 320mm/s, so that the smoothness of the hole wall of the drilled hole is improved; the sectional drilling method which is the same as the back drilling method is adopted, so that the heat dissipation efficiency of the drilling is effectively improved; replacing the type of the gasket during drilling;
s6, before back drilling by changing different boards, the table top needs to be cleaned, and the board needs to be sliced each time to confirm the depth; cleaning the copper wire on the drill bit when 50 holes are drilled, and fully checking whether the copper wire remains after back drilling is finished; preparing a back drilling hole point film, fully checking deviation holes, and washing a plate after back drilling; in the step S6, adjusting the rotating speed of a drill point to be 50kr/min during back drilling, the feed speed to be 36mm/S and the withdrawal speed to be 212mm/S, and adopting a 1:2:3:4 drilling method of 10 percent of deep plating required by the first drilling, 20 percent of second drilling, 30 percent of third drilling and 40 percent of fourth drilling; in the step S6, aiming at the drilled through hole, the rotating speed is properly reduced to 100kr/min, the tool feeding speed is reduced to 29mm/S, and the tool retracting speed is correspondingly reduced to 320 mm/S;
s7, removing drilling dirt of the drill hole; the plasma is adopted to remove the drilling dirt with good effect; the plasma is formed by exciting gas molecules by adopting electric energy under the high vacuum condition to form ions or free radicals with higher reactivity, and the ions or the free radicals collide with the surface of the material under the action of a further electric field to generate physical and chemical reactions so as to remove the drilling dirt and form a layer of surface structure with a fine concave-convex shape; in the plasma chemical reaction, the particles playing a chemical role are mainly positive ions and free radical particles, the effect on different materials is uniform, and the drilling dirt removing effect is good. Through testing, the working environment in the drilling process is clean and tidy, the generation of stains is reduced, and the neatness in the drilling process of the motherboard is improved;
s8, after the step S7 is finished, controlling the forming dimensional tolerance of the cleaned motherboard within a specified range, and milling and completely reserving the impedance strips; when washing the plate, the back hole is drilled downwards and the plate is placed at the speed of 1.0m/min, and the drying in the hole is ensured;
and S9, collecting and storing the mother board for subsequent etching and other operations of the mother board, thereby finishing the drilling process.
Example two:
a drilling method of a circuit board motherboard comprises the following steps:
s1, cutting the mother board after selecting the mother board without copper, and reducing the burrs and copper scraps of the board edge by using a backing plate; confirming that the cutting thickness is 0.13 mm; step S1, baking the mother board after cutting, wherein the temperature of the baking board is controlled at 165 ℃ and the baking time is controlled at 3.5 hours;
s2, performing LDI exposure on the mother board which is well fed in the step S1, wherein an exposure ruler has 7 grids, the exposure energy is 45mJ, and the two plates are produced in a differentiated mode; testing the line width of the first mother board, and confirming the qualified manufactured product;
s3, starting to drill the outer layer of the motherboard; checking the precision of a machine table before drilling by adopting a non-clamping PIN positioning method; before drilling, firstly drilling a trial drilling hole, and then drilling an inner hole of a unit for production; in step S3, the base plate is a standard phenolic base plate, the service life is set to 500 holes, 1 PNL/pile;
s4, after the plate is milled, the edge needs to be planed, and the maximum value is reserved for the edge; after pressing, measuring the thickness of the plate by adopting a nine-point method, and measuring the thickness of the medium by cutting the plate edge without beating the slices in the unit; in step S4, controlling according to expansion and contraction within +/-50 mm, and changing the drilling belt in an out-of-tolerance manner by stacking;
s5, performing back drilling after the electrotinning is finished, cleaning a main shaft chuck before manufacturing, and replacing a backing board; measuring the thickness range of all boards before manufacturing, marking the boards, stacking back drilling according to the thickness difference, and measuring the area with the back drilling range, wherein the position of each board needs to be the same; in the step S5, the electrotinning is performed for 10min to 13min by using a current density of 1.0A/dm 2-1.3A/dm 2, the tin thickness is controlled to be 5mm to 8mm, and a protective layer is padded on the copper layer during back drilling because the tin has lower density than the copper; etching after back drilling, on one hand, etching to remove the tin layer, on the other hand, etching to remove burrs of the back drilling hole and drilling dirt in the hole by using etching liquid, and washing the drilling dirt in the hole by using washing sections such as high-pressure washing and the like to prevent the problems of hole blocking and the like; the drill dirt can be more effectively removed from the hole after each drilling, the phenomenon of hole blocking caused by excessive accumulation of the drill dirt is avoided, the heat dissipation efficiency of the inner-layer thick copper drill hole can be improved, the bad problems of excessive roughness in the hole and the like caused by excessive heat are avoided, and the problem of drill point breakage is avoided; the tool withdrawal speed is correspondingly reduced to 320mm/s, so that the smoothness of the hole wall of the drilled hole is improved; the sectional drilling method which is the same as the back drilling method is adopted, so that the heat dissipation efficiency of the drilling is effectively improved; replacing the type of the gasket during drilling;
s6, before back drilling by changing different boards, the table top needs to be cleaned, and the board needs to be sliced each time to confirm the depth; cleaning the copper wire on the drill bit when 50 holes are drilled, and fully checking whether the copper wire remains after back drilling is finished; preparing a back drilling hole point film, fully checking deviation holes, and washing a plate after back drilling; in the step S6, adjusting the rotating speed of a drill point to be 50kr/min during back drilling, the feed speed to be 36mm/S and the withdrawal speed to be 212mm/S, and adopting a 1:2:3:4 drilling method of 10 percent of deep plating required by the first drilling, 20 percent of second drilling, 30 percent of third drilling and 40 percent of fourth drilling; in the step S6, aiming at the drilled through hole, the rotating speed is properly reduced to 100kr/min, the tool feeding speed is reduced to 29mm/S, and the tool retracting speed is correspondingly reduced to 320 mm/S;
s7, removing drilling dirt of the drill hole; the plasma is adopted to remove the drilling dirt with good effect; the plasma is formed by exciting gas molecules by adopting electric energy under the high vacuum condition to form ions or free radicals with higher reactivity, and the ions or the free radicals collide with the surface of the material under the action of a further electric field to generate physical and chemical reactions so as to remove the drilling dirt and form a layer of surface structure with a fine concave-convex shape; in the plasma chemical reaction, the particles playing a chemical role are mainly positive ions and free radical particles, the effect on different materials is uniform, and the drilling dirt removing effect is good. Through testing, the working environment in the drilling process is clean and tidy, the generation of stains is reduced, and the neatness in the drilling process of the motherboard is improved;
s8, after the step S7 is finished, controlling the forming dimensional tolerance of the cleaned motherboard within a specified range, and milling and completely reserving the impedance strips; when washing the plate, the back hole is drilled downwards and the plate is placed at the speed of 1.0m/min, and the drying in the hole is ensured;
and S9, collecting and storing the mother board for subsequent etching and other operations of the mother board, thereby finishing the drilling process.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A drilling method of a circuit board motherboard comprises the following steps: the drilling method of the circuit board motherboard comprises the following steps:
s1, cutting the mother board after selecting the mother board without copper, and reducing the burrs and copper scraps of the board edge by using a backing plate; confirming that the cutting thickness is 0.0987 mm-0.113 mm;
s2, performing LDI exposure on the mother board which is well fed in the step S1, wherein an exposure ruler has 7 grids, the exposure energy is 45mJ, and the two plates are produced in a differentiated mode; testing the line width of the first mother board, and confirming the qualified manufactured product;
s3, starting to drill the outer layer of the motherboard; checking the precision of a machine table before drilling by adopting a non-clamping PIN positioning method; before drilling, firstly drilling a trial drilling hole, and then drilling an inner hole of a unit for production;
s4, after the plate is milled, the edge needs to be planed, and the maximum value is reserved for the edge; after pressing, measuring the thickness of the plate by adopting a nine-point method, and measuring the thickness of the medium by cutting the plate edge without beating the slices in the unit;
s5, performing back drilling after the electrotinning is finished, cleaning a main shaft chuck before manufacturing, and replacing a backing board; measuring the thickness range of all boards before manufacturing, marking the boards, stacking back drilling according to the thickness difference, and measuring the area with the back drilling range, wherein the position of each board needs to be the same;
s6, before back drilling by changing different boards, the table top needs to be cleaned, and the board needs to be sliced each time to confirm the depth; cleaning the copper wire on the drill bit when 50 holes are drilled, and fully checking whether the copper wire remains after back drilling is finished; preparing a back drilling hole point film, fully checking deviation holes, and washing a plate after back drilling;
s7, removing drilling dirt of the drill hole; the plasma is adopted to remove the drilling dirt with good effect; the plasma is formed by exciting gas molecules by adopting electric energy under the high vacuum condition to form ions or free radicals with higher reactivity, and the ions or the free radicals collide with the surface of the material under the action of a further electric field to generate physical and chemical reactions so as to remove the drilling dirt and form a layer of surface structure with a fine concave-convex shape;
s8, after the step S7 is finished, controlling the forming dimensional tolerance of the cleaned motherboard within a specified range, and milling and completely reserving the impedance strips; when washing the plate, the back hole is drilled downwards and the plate is placed at the speed of 1.0m/min, and the drying in the hole is ensured;
and S9, collecting and storing the mother board for subsequent etching and other operations of the mother board, thereby finishing the drilling process.
2. The method of drilling a motherboard of a circuit board as recited in claim 1, wherein: after the material is cut in the step S1, the motherboard needs to be baked, the temperature of the baked board is controlled at 170 ℃, and the baking time is controlled at 4 hours.
3. The method of drilling a motherboard of a circuit board as recited in claim 1, wherein: in the step S3, the pad is a standard phenolic pad with a lifetime of 500 holes, 1 PNL/stack.
4. The method of drilling a motherboard of a circuit board as recited in claim 1, wherein: and in the step S4, the drilling strip is changed according to the condition that the expansion and contraction are controlled within +/-50 mm and the out-of-tolerance stacking.
5. The method of drilling a motherboard of a circuit board as recited in claim 1, wherein: in the step S5, the electrolytic tinning is performed for 10min to 13min by using a current density of 1.0A/dm 2-1.3A/dm 2, the tin thickness is controlled to be 5mm to 8mm, and a protective layer is padded on the copper layer during back drilling because the tin has lower density than the copper; the back drilling is finished and then the tin layer is etched, on the one hand, etching liquid medicine is used for etching the flash of the back drilling hole and the drilling dirt in the hole, and on the other hand, the drilling dirt in the hole is cleaned by utilizing washing sections such as high-pressure washing and the like, so that the problems of hole blocking and the like are prevented.
6. The method of drilling a motherboard of a circuit board as recited in claim 1, wherein: in the step S6, the rotation speed of the drill point is adjusted to 50kr/min during back drilling, the feed speed is 36mm/S, the withdrawal speed is 212mm/S, and a 1:2:3:4 drilling method of 10% of deep plating required by the first drilling, 20% of second drilling, 30% of third drilling and 40% of fourth drilling is adopted.
7. The method of drilling a motherboard of a circuit board as recited in claim 1, wherein: in the step S6, the rotation speed is appropriately reduced to 100kr/min, the feeding speed is reduced to 29mm/S, and the retracting speed is correspondingly reduced to 320mm/S for drilling the through hole.
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| CN202110429115.2A CN113141717A (en) | 2021-04-21 | 2021-04-21 | Drilling method of circuit board motherboard |
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| CN202110429115.2A CN113141717A (en) | 2021-04-21 | 2021-04-21 | Drilling method of circuit board motherboard |
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Application publication date: 20210720 |