CN109922603A - A kind of boring method of PCB - Google Patents
A kind of boring method of PCB Download PDFInfo
- Publication number
- CN109922603A CN109922603A CN201910312292.5A CN201910312292A CN109922603A CN 109922603 A CN109922603 A CN 109922603A CN 201910312292 A CN201910312292 A CN 201910312292A CN 109922603 A CN109922603 A CN 109922603A
- Authority
- CN
- China
- Prior art keywords
- ptfe
- daughter board
- internal layer
- pcb
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses the boring methods of PCB a kind of, are related to the manufacture craft of printed wiring board.The boring method includes: overlapping upper cover plate, PCB and backing plate and fixation；Preboring selects the diameter of drill to be less than aperture hole to be drilled；Substep drilling is carried out according to the core plate material of the PCB, the diameter of drill is selected to be equal to aperture hole to be drilled.The present invention by adjusting PTFE mixed-compression board stepped construction, upper and lower level using supplies in mixed-compression board is protected, pass through preboring and substep drilling chip removal stage by stage, by the fibre cutting in PTFE material at short bits, winding drill is prevented, and helps to clean drill in the drilling cuttings of non-the PTFE core plate and backing plate of internal layer using mixed pressure, reach better drilling effect, reduces hole wall burr.
Description
Technical field
The present embodiments relate to the manufacturing technology of printed wiring board more particularly to a kind of boring methods of PCB.
Background technique
Polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene, be abbreviated as PTFE) material two-side covers made of copper foil
Copper-clad plate, referred to as PTFE core plate.The multilayer mixed pressure PCB made of PTFE core plate, the outer surface of at least side is in lamination
PTFE core plate.PTFE material is relatively soft, and burr mainly includes edges of boards after aperture burr, hole wall burr and milling plate after drilling
Burr.In the method for drilling burr for improving this kind of PCB, for aperture burr, existing general processing method defines auxiliary
The use of material, for example, lamination mode be aluminium flake+FR4 core plate+barrier paper+PTFE multilayer mixed pressure PCB+ barrier paper+FR4 core plate+
Aluminium flake etc., aluminium flake plays positioning and guiding function, and hole can be prevented inclined, and radiate, remove dust in bit ditch etc.；FR4 plate
The hardness of itself plays the role of support；The mode of superposition material advantageously reduces the generation of drilling burr.Another changes
The method of kind aperture burr is then after burr generates, to be removed using additional process or process, for example laser is burnt
Erosion, mechanical nog plate, high pressure washing, chemical microetch etc..
But there are no effective counter-measures to the burr that hole wall internal in boring procedure generates for the method limited at present.
Summary of the invention
The present invention provides the boring method of PCB a kind of, can reduce what PTFE mixed-compression board was generated in boring procedure middle hole wall
Burr.
A kind of boring method of PCB, comprising:
Overlap upper cover plate, PCB and backing plate and fixation；
Preboring selects the diameter of drill to be less than aperture hole to be drilled；
Substep drilling is carried out according to the core plate material of the PCB, the diameter of drill is selected to be equal to aperture hole to be drilled.
The preboring includes:
The depth for drilling the upper cover plate and the upper layer PTFE daughter board, and piercing the non-PTFE daughter board of internal layer is first default
Depth obtains prebored hole.
Wherein, substep drilling is carried out according to the core plate material of the PCB, comprising:
The PCB includes upper layer PTFE daughter board, the non-PTFE daughter board of internal layer and lower layer's PTFE daughter board；
It is pierced along the prebored hole, the center of circle of drill is overlapped with the center of circle of the prebored hole；
First stage drills the upper cover plate and the upper layer PTFE daughter board, and the depth for piercing the non-PTFE daughter board of internal layer is
Second predetermined depth；
Second stage drills the non-PTFE daughter board of the internal layer；
Phase III drills the lower layer PTFE daughter board, and the depth for piercing backing plate is the second predetermined depth.
Alternatively, the core plate material according to the PCB carries out substep drilling, comprising:
The PCB includes upper layer PTFE daughter board, lower layer's PTFE daughter board and the upper layer PTFE daughter board and the lower layer
Between PTFE daughter board, at least one set of non-PTFE daughter board of the first internal layer, internal layer PTFE daughter board and the second internal layer successively overlapped it is non-
PTFE daughter board；
It is pierced along the prebored hole, the center of circle of drill is overlapped with the center of circle of the prebored hole；
First stage drills the upper cover plate and the upper layer PTFE daughter board, pierces the depth of the non-PTFE daughter board of the first internal layer
Degree is the second predetermined depth；
Second stage drills the non-PTFE daughter board of first internal layer；
Phase III drills the internal layer PTFE daughter board, and the depth for piercing the non-PTFE daughter board of the second internal layer is second pre-
If depth；
Fourth stage drills the non-PTFE daughter board of second internal layer；
5th stage drilled the lower layer PTFE daughter board, and the depth for piercing backing plate is the second predetermined depth.
The lower drilling depth of first stage is greater than the depth of the prebored hole.
Preboring selects the diameter of drill 0.05~0.2mm smaller than aperture hole to be drilled.
First predetermined depth is 0.2~0.4mm；Second predetermined depth is 0.3~0.8mm；And described first
Predetermined depth is less than second predetermined depth.
Wherein, the upper cover plate includes aluminium flake and cover board.
Wherein, the non-PTFE daughter board of the internal layer is FR4 core plate.
The present invention by adjusting the stepped construction of PTFE mixed-compression board, prevented by the upper and lower level using supplies in mixed-compression board
Shield prevents winding drill by the fibre cutting in PTFE material at short bits by preboring and substep drilling chip removal stage by stage, and
Using mixed pressure in the drilling cuttings of non-the PTFE core plate and backing plate of internal layer, helps to clean drill, reach better drilling effect, reduce hole
Wall burr.
Detailed description of the invention
Fig. 1 is the flow chart of boring method in the embodiment of the present invention one；
Fig. 2 is the iterative structure schematic diagram of PCB in the embodiment of the present invention one；
Fig. 3 is preboring schematic diagram in the embodiment of the present invention one；
Fig. 4 is the schematic diagram that drills step by step in the embodiment of the present invention one；
Fig. 5 is the iterative structure schematic diagram of PCB in the embodiment of the present invention two；
Fig. 6 is the schematic diagram that drills step by step in the embodiment of the present invention two.
In figure: 1, aluminium flake；2, cover board；3, upper layer PTFE daughter board；4, the non-PTFE daughter board of internal layer；5, prepreg；6, backing plate；
7, lower layer PTFE daughter board；8, the non-PTFE daughter board of the first internal layer；9, the non-PTFE daughter board of the second internal layer；10, internal layer PTFE daughter board.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
The present embodiment provides the boring method of PCB a kind of, suitable for the PCB of PTFE core plate and other core plate mixed pressures, for
The PCB of the type drills, and can reduce hole wall burr.
Wherein, two side external surfaces of the PCB all have PTFE core plate, including non-PTFE of upper layer PTFE daughter board, internal layer
Plate and lower layer's PTFE daughter board, become PTFE mixed-compression board.
Upper layer PTFE daughter board and lower layer's PTFE daughter board can be to be overlapped between individual PTFE core plate or multiple PTFE core plates
The daughter board that prepreg presses.
Because the material is soft by PTFE, need the core material of the harder material of mixed pressure to provide certain support force.Institute
The non-PTFE daughter board of internal layer is stated to overlap between individual FR4 core plate (glass-epoxy copper-clad plate) or multiple FR4 core plates
The daughter board that prepreg presses.
It is limited by PCB layers of copper quantity, the non-PTFE daughter board of internal layer also could alternatively be FR4 prepreg.
Fig. 1 is the flow chart of boring method in the present embodiment, is specifically comprised the following steps:
S1, overlapping upper cover plate, PCB and backing plate and fixation.
Wherein, the upper cover plate includes aluminium flake and cover board.Cover board selects organic hard sheet, and thickness is in 1mm.Backing plate choosing
With melamine, phenolic material.
The tooling hole that PCB surrounding workspace is corresponded on supplies such as cover board and backing plate offers corresponding hole, will be auxiliary
After helping material and PCB to overlap in order, by fixed forms such as pins, supplies and PCB are fixed, cover aluminium flake above
Blend compounds band is fixed.
Fig. 2 illustrate one of PCB laminated construction and with supplies overlapping after structure.From top to bottom successively
Overlap aluminium flake 1, cover board 2, upper layer PTFE daughter board 3, the non-PTFE daughter board 4 of internal layer, lower layer's PTFE daughter board 7 and backing plate 6, upper layer PTFE
Between the non-PTFE daughter board 4 of plate 3, internal layer and lower layer's PTFE daughter board 7, need to fold into prepreg 5 according to pressing.
S2, preboring.
Preboring needs to drill the upper cover plate and the upper layer PTFE daughter board, and it is default to pierce the non-PTFE daughter board first of internal layer
Depth obtains prebored hole.
Fig. 3 is preboring schematic diagram in the embodiment of the present invention.Preboring selects the diameter d of drill to be less than aperture D hole to be drilled, excellent
Choosing, preboring selects the diameter of drill 0.05~0.2mm smaller than aperture hole to be drilled.First predetermined depth be 0.2~
0.4mm.The lower drilling depth of preboring=upper cover plate thickness+upper layer PTFE daughter board the+the first predetermined depth of thickness.
In the step, the drill cutter diameter of preboring is smaller, as preliminary cutting, PTFE layers when can effectively reduce formal drilling
Drilling cuttings, to be conducive to the discharge and cutting of drilling cuttings when formal drilling.
S3 carries out substep drilling according to the core plate material of the PCB.
The step selects the diameter of drill to be equal to aperture D hole to be drilled.If needing to carry out the operation such as hole metallization after drilling,
It is then the thickness surplus of reserved coating, the diameter of drill is selected to should be slightly bigger than aperture D hole to be drilled.
Drill is pierced along the prebored hole, and the center of circle of drill is overlapped with the center of circle of the prebored hole.
Fig. 4 is the schematic diagram that drills step by step in the embodiment of the present invention.Substep drills
S31, first stage drill the upper cover plate and the upper layer PTFE daughter board, pierce the depth of the non-PTFE daughter board of internal layer
Degree is the second predetermined depth, and the lower drilling depth of first stage is greater than the depth of the prebored hole.
The lower drilling depth > upper cover plate thickness of first stage+upper layer PTFE daughter board the+the second predetermined depth of thickness.Wherein, institute
Stating the second predetermined depth is 0.3~0.8mm, and first predetermined depth is less than second predetermined depth.
In the step, drill can effectively cut PTFE layers, and after preboring, and PTFE layers of coal powder quantity of bore will effectively subtract
It is few, meanwhile, internal layer FR4 daughter board is pierced, PTFE layers of drilling cuttings can be discharged by FR4 layers of drilling cuttings, clean drill.
S32, second stage drill the non-PTFE daughter board of the internal layer.
Lower drilling depth > upper cover plate thickness+upper layer PTFE daughter board thickness+non-PTFE daughter board thickness of internal layer of second stage.
S33, phase III drill the lower layer PTFE daughter board, and the depth for piercing backing plate is the second predetermined depth.
Thick+the second predetermined depth of the lower drilling depth of phase III=upper cover plate thickness+pcb board.
In the step, drill enters in backing plate, and effectively PTFE layers of drilling cuttings can be discharged by backing plate drilling cuttings, guarantee drill
Cleaning.
The present embodiment by adjusting PTFE mixed-compression board stepped construction, using supplies mixed-compression board upper and lower level carry out
Protection prevents winding drill by the fibre cutting in PTFE material at short bits by preboring and substep drilling chip removal stage by stage,
And it helps to clean drill, reaches better drilling effect, reduce in the drilling cuttings of non-the PTFE core plate and backing plate of internal layer using mixed pressure
Hole wall burr.
Embodiment two
As shown in figure 5, the embodiment of the present invention PCB include upper layer PTFE daughter board 3, lower layer's PTFE daughter board 7 and it is described on
Between layer PTFE daughter board 3 and the lower layer PTFE daughter board 7, at least one set of non-PTFE daughter board 8 of the first internal layer, internal layer successively overlapped
PTFE daughter board 10 and the non-PTFE daughter board 9 of the second internal layer.Top is superimposed with aluminium flake 1 and cover board 2, and lower section has overlapped backing plate 6, each straton
It needs to fold into prepreg 5 according to pressing between plate.
Fig. 6 is the schematic diagram that drills step by step in the present embodiment.As shown in fig. 6, substep drilling is pierced along the prebored hole, drill
The center of circle be overlapped with the center of circle of the prebored hole, comprising:
First stage drills the upper cover plate and the upper layer PTFE daughter board, pierces the depth of the non-PTFE daughter board of the first internal layer
Degree is the second predetermined depth.
Second stage drills the non-PTFE daughter board of first internal layer.
Phase III drills the internal layer PTFE daughter board, and the depth for piercing the non-PTFE daughter board of the second internal layer is second pre-
If depth.
Fourth stage drills the non-PTFE daughter board of second internal layer.
5th stage drilled the lower layer PTFE daughter board, and the depth for piercing backing plate is the second predetermined depth.
The present embodiment is suitable for the mixed-compression board that internal layer has pressed PTFE plate, while drilling PTFE layers, pierces non-PTFE
Layer certain depth helps PTFE layers of drilling cuttings to be discharged and clean drill, it is mixed can to effectively reduce PTFE using non-PTFE layers of drilling cuttings
The drilling burr of pressing plate improves hole wall quality.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (9)
1. a kind of boring method of PCB characterized by comprising
Overlap upper cover plate, PCB and backing plate and fixation；
Preboring selects the diameter of drill to be less than aperture hole to be drilled；
Substep drilling is carried out according to the core plate material of the PCB, the diameter of drill is selected to be equal to aperture hole to be drilled.
2. boring method according to claim 1, which is characterized in that the preboring includes:
The depth for drilling the upper cover plate and the upper layer PTFE daughter board, and piercing the non-PTFE daughter board of internal layer is first default deep
Degree obtains prebored hole.
3. boring method according to claim 2, which is characterized in that carry out substep brill according to the core plate material of the PCB
Hole, comprising:
The PCB includes upper layer PTFE daughter board, the non-PTFE daughter board of internal layer and lower layer's PTFE daughter board；
It is pierced along the prebored hole, the center of circle of drill is overlapped with the center of circle of the prebored hole；
First stage drills the upper cover plate and the upper layer PTFE daughter board, and the depth for piercing the non-PTFE daughter board of internal layer is second
Predetermined depth；
Second stage drills the non-PTFE daughter board of the internal layer；
Phase III drills the lower layer PTFE daughter board, and the depth for piercing backing plate is the second predetermined depth.
4. boring method according to claim 2, which is characterized in that carry out substep brill according to the core plate material of the PCB
Hole, comprising:
The PCB includes upper layer PTFE daughter board, lower layer's PTFE daughter board and the upper layer PTFE daughter board and lower layer PTFE
Between plate, at least one set of non-PTFE daughter board of the first internal layer, internal layer PTFE daughter board and non-PTFE daughter board of the second internal layer successively overlapped；
It is pierced along the prebored hole, the center of circle of drill is overlapped with the center of circle of the prebored hole；
First stage drills the upper cover plate and the upper layer PTFE daughter board, and the depth for piercing the non-PTFE daughter board of the first internal layer is
Second predetermined depth；
Second stage drills the non-PTFE daughter board of first internal layer；
Phase III drills the internal layer PTFE daughter board, and the depth for piercing the non-PTFE daughter board of the second internal layer is second default deep
Degree；
Fourth stage drills the non-PTFE daughter board of second internal layer；
5th stage drilled the lower layer PTFE daughter board, and the depth for piercing backing plate is the second predetermined depth.
5. boring method according to claim 2 or 3, it is characterised in that:
The lower drilling depth of first stage is greater than the depth of the prebored hole.
6. boring method according to claim 1, it is characterised in that:
Preboring selects the diameter of drill 0.05~0.2mm smaller than aperture hole to be drilled.
7. boring method according to claim 5, it is characterised in that:
First predetermined depth is 0.2~0.4mm；
Second predetermined depth is 0.3~0.8mm；
And first predetermined depth is less than second predetermined depth.
8. boring method according to claim 1, it is characterised in that:
The upper cover plate includes aluminium flake and cover board.
9. boring method according to claim 1, it is characterised in that:
The non-PTFE daughter board of internal layer is FR4 core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910312292.5A CN109922603B (en) | 2019-04-18 | 2019-04-18 | PCB drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910312292.5A CN109922603B (en) | 2019-04-18 | 2019-04-18 | PCB drilling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109922603A true CN109922603A (en) | 2019-06-21 |
| CN109922603B CN109922603B (en) | 2020-11-06 |
Family
ID=66977699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910312292.5A Active CN109922603B (en) | 2019-04-18 | 2019-04-18 | PCB drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109922603B (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031666A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Large typesetting and processing method for optical module PCB product |
| CN111885845A (en) * | 2020-07-24 | 2020-11-03 | 昆山广谦电子有限公司 | U-shaped groove bonding pad deburring forming method and processing burr improving process thereof |
| CN112170879A (en) * | 2019-07-01 | 2021-01-05 | 维嘉数控科技（苏州）有限公司 | Thick plate segmented drilling method and drilling machine |
| CN112672502A (en) * | 2019-10-15 | 2021-04-16 | 苏州维嘉科技股份有限公司 | PCB (printed circuit board), deep forming processing method thereof and numerical control device |
| CN112672520A (en) * | 2021-01-14 | 2021-04-16 | 珠海杰赛科技有限公司 | Processing method of crimping hole of circuit board |
| CN112739004A (en) * | 2020-11-13 | 2021-04-30 | 珠海杰赛科技有限公司 | Machining method for improving drilling burrs |
| CN112792908A (en) * | 2020-12-29 | 2021-05-14 | 宜兴硅谷电子科技有限公司 | Method for improving winding of large drill points of various drill holes |
| CN113119221A (en) * | 2021-03-30 | 2021-07-16 | 江门市奔力达电路有限公司 | Anti-wire-winding drilling device and drilling method for PCB |
| CN113873758A (en) * | 2021-08-27 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method for improving interconnection and separation of through holes of PTFE circuit board |
| CN114126227A (en) * | 2021-10-28 | 2022-03-01 | 苏州烁点电子科技有限公司 | PCB (printed circuit board) drilling process |
| CN114745857A (en) * | 2022-04-11 | 2022-07-12 | 深圳市大族数控科技股份有限公司 | Circuit board slotting method |
| CN114745854A (en) * | 2022-04-07 | 2022-07-12 | 科惠白井(佛冈)电路有限公司 | Drilling method of PCB (printed circuit board) |
| CN117119694A (en) * | 2023-10-23 | 2023-11-24 | 四川英创力电子科技股份有限公司 | Processing technology for printed circuit board superposition drilling and milling |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103240452A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Polytetrafluoroethylene (PTFE) plate milling and cutting method |
| CN104149125A (en) * | 2013-05-14 | 2014-11-19 | 深圳市大族激光科技股份有限公司 | Method for detecting drilling precision of PCB mechanical drilling machine |
| CN104385363A (en) * | 2014-09-16 | 2015-03-04 | 深圳市景旺电子股份有限公司 | Drilling method of PCB with high-thermal conductivity PTFE material and PCB |
| CN206402516U (en) * | 2016-12-30 | 2017-08-11 | 上海嘉捷通信息科技有限公司 | A kind of multi-disc printed circuit board structure for reducing burr burr |
| CN109379845A (en) * | 2018-11-02 | 2019-02-22 | 珠海杰赛科技有限公司 | A kind of multilayer circuit board processing technology containing PTFE |
-
2019
- 2019-04-18 CN CN201910312292.5A patent/CN109922603B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104149125A (en) * | 2013-05-14 | 2014-11-19 | 深圳市大族激光科技股份有限公司 | Method for detecting drilling precision of PCB mechanical drilling machine |
| CN103240452A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Polytetrafluoroethylene (PTFE) plate milling and cutting method |
| CN104385363A (en) * | 2014-09-16 | 2015-03-04 | 深圳市景旺电子股份有限公司 | Drilling method of PCB with high-thermal conductivity PTFE material and PCB |
| CN206402516U (en) * | 2016-12-30 | 2017-08-11 | 上海嘉捷通信息科技有限公司 | A kind of multi-disc printed circuit board structure for reducing burr burr |
| CN109379845A (en) * | 2018-11-02 | 2019-02-22 | 珠海杰赛科技有限公司 | A kind of multilayer circuit board processing technology containing PTFE |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112170879B (en) * | 2019-07-01 | 2021-10-26 | 苏州维嘉科技股份有限公司 | Thick plate segmented drilling method and drilling machine |
| CN112170879A (en) * | 2019-07-01 | 2021-01-05 | 维嘉数控科技（苏州）有限公司 | Thick plate segmented drilling method and drilling machine |
| CN112672502A (en) * | 2019-10-15 | 2021-04-16 | 苏州维嘉科技股份有限公司 | PCB (printed circuit board), deep forming processing method thereof and numerical control device |
| CN111031666A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Large typesetting and processing method for optical module PCB product |
| CN111885845A (en) * | 2020-07-24 | 2020-11-03 | 昆山广谦电子有限公司 | U-shaped groove bonding pad deburring forming method and processing burr improving process thereof |
| CN111885845B (en) * | 2020-07-24 | 2024-04-26 | 昆山广谦电子有限公司 | U-shaped groove bonding pad deburring forming method and burr processing improvement process thereof |
| CN112739004A (en) * | 2020-11-13 | 2021-04-30 | 珠海杰赛科技有限公司 | Machining method for improving drilling burrs |
| CN112792908A (en) * | 2020-12-29 | 2021-05-14 | 宜兴硅谷电子科技有限公司 | Method for improving winding of large drill points of various drill holes |
| CN112672520A (en) * | 2021-01-14 | 2021-04-16 | 珠海杰赛科技有限公司 | Processing method of crimping hole of circuit board |
| CN113119221A (en) * | 2021-03-30 | 2021-07-16 | 江门市奔力达电路有限公司 | Anti-wire-winding drilling device and drilling method for PCB |
| CN113873758A (en) * | 2021-08-27 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method for improving interconnection and separation of through holes of PTFE circuit board |
| CN114126227A (en) * | 2021-10-28 | 2022-03-01 | 苏州烁点电子科技有限公司 | PCB (printed circuit board) drilling process |
| CN114745854A (en) * | 2022-04-07 | 2022-07-12 | 科惠白井(佛冈)电路有限公司 | Drilling method of PCB (printed circuit board) |
| CN114745857A (en) * | 2022-04-11 | 2022-07-12 | 深圳市大族数控科技股份有限公司 | Circuit board slotting method |
| CN117119694A (en) * | 2023-10-23 | 2023-11-24 | 四川英创力电子科技股份有限公司 | Processing technology for printed circuit board superposition drilling and milling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109922603B (en) | 2020-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109922603A (en) | A kind of boring method of PCB | |
| CN101505576B (en) | Manufacturing method for multilayered rigidity and flexibility combined printed circuit board | |
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| CN106535510A (en) | Method for producing rigid-flex PCB lid | |
| CN103079748B (en) | Laser processing method, and method for manufacturing multilayer flexible printed wiring board using same | |
| CN103079350A (en) | Method for processing patterns in blind slot of printed circuit board | |
| CN103096645A (en) | Lamination positioning method of multilayer circuit board | |
| CN102291947A (en) | Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB | |
| CN207099441U (en) | A kind of printed circuit board laser drill special backing plate | |
| CN107251661A (en) | Printing distributing board and its manufacture method | |
| CN104684276A (en) | Printed wiring board and processing method thereof | |
| CN103874326A (en) | Printed circuit board and method of manufacturing printed circuit board | |
| CN103596368A (en) | Improved direct laser drilling processing method | |
| EP1174006A1 (en) | Method for drilling circuit boards | |
| CN103857208A (en) | Machining method for circuit board drilling | |
| JP2009026912A (en) | Method for manufacturing multilayer printed-wiring board | |
| CN113543526A (en) | Blind hole machining method and FPC multilayer board | |
| JP2009200344A (en) | Manufacturing method of printed wiring board | |
| CN104936387A (en) | Printed circuit board metalized half via hole machining method | |
| CN104551088A (en) | Printed circuit board backdrill device and backdrill method | |
| JP7333210B2 (en) | Method for manufacturing printed wiring board | |
| WO2023123909A1 (en) | Pcb processing method and pcb | |
| US20090178840A1 (en) | Pcb and manufacturing method thereof | |
| CN213462429U (en) | Plate to be drilled and printed circuit board | |
| CN112739016B (en) | Stacked hole circuit board and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |