CN114126227A - PCB (printed circuit board) drilling process - Google Patents
PCB (printed circuit board) drilling process Download PDFInfo
- Publication number
- CN114126227A CN114126227A CN202111259478.2A CN202111259478A CN114126227A CN 114126227 A CN114126227 A CN 114126227A CN 202111259478 A CN202111259478 A CN 202111259478A CN 114126227 A CN114126227 A CN 114126227A
- Authority
- CN
- China
- Prior art keywords
- pcb
- hole
- circuit board
- drilling
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000008569 process Effects 0.000 title claims abstract description 32
- 238000003801 milling Methods 0.000 claims abstract description 26
- 238000005516 engineering process Methods 0.000 claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims description 19
- 238000003754 machining Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 241001074085 Scophthalmus aquosus Species 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
Abstract
The invention discloses a PCB (printed circuit board) drilling process, which adopts a plurality of cutters to sequentially carry out two different processing modes of multi-stage drilling, compensation milling and the like to process a through hole of a PCB, and ensures that the deformation of the through hole in the processing process is small, and the precision of a drilling hole position and the aperture of the through hole are within a preset tolerance. This PCB circuit board drilling technology, adopt multiple cutter to carry out multistage brill in proper order, the through-hole of two kinds of differences such as compensation mill is processed to the PCB circuit board, and then the deformation that makes the through-hole course of working is less, drilling hole site precision and through-hole aperture are all in predetermined tolerance, stop the through-hole big-end-up that conventional processing appears, the bad problem that the diameter differs, and multiple cutter shares milling pressure in turn in the course of working, be difficult to disconnected sword, the reliability of processing technology and the yields of PCB circuit board processing have been guaranteed.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) processing, in particular to a PCB drilling process.
Background
The PCB is also called a printed circuit board, is an important electronic component, is a support for electronic components, is a carrier for electrical connection of electronic components, and is called a "printed" circuit board because it is manufactured by electronic printing.
At present, in the process of manufacturing a PCB, a plurality of holes with different apertures are often required to be drilled on the PCB for component insertion holes or conduction, and the current drilling process of the PCB usually adopts a processing process that a first type of drill cutter completely drills through the PCB from one surface to the other surface, although the processing process can achieve the expected purpose, when the PCB reaches a certain thickness, the deformation of the drill cutter is increased under the action of mechanical impact force between the drill cutter and a semi-finished product of the processed PCB, which easily causes the precision of the hole to be drilled to be reduced, and the size of the processed through hole also does not meet the tolerance requirement, wherein the most common problem is that the diameter of the top of the processed through hole is large relative to the standard value, the diameter of the bottom of the processed through hole is smaller relative to the standard value, the use requirement cannot be met, and the probability of the drill cutter interruption in the drilling process is high, therefore, in view of the above problems, the present application will provide a PCB circuit board drilling process.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a PCB (printed Circuit Board) drilling process, which solves the problems in the background art.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the invention provides a PCB (printed circuit board) drilling process, which adopts a plurality of cutters to sequentially carry out two different processing modes of multi-stage drilling, compensation milling and the like to process a through hole of a PCB, ensures that the deformation of the through hole in the processing process is smaller, and ensures that the precision of a drilling hole position and the aperture of the through hole are within a preset tolerance, and specifically comprises the following operations:
the first step is as follows: preparing materials before processing a PCB (printed Circuit Board) and two upper and lower protection plates, and determining the specification and the type of a used cutter according to the diameter of a through hole processed by the PCB and the thickness of the PCB, wherein the cutter mainly comprises a drill bit and a milling cutter;
the second step is that: confirming the drilling depth, the milling depth and the length value of the cutting edge of each cutter according to the prepared PCB and the two upper and lower protective plates;
the third step: (ii) a Positioning and mounting the PCB circuit board and the two upper and lower protective plates by adopting numerical control processing equipment, setting a coordinate system in different centers, determining the position of the through hole and compiling numerical control programs for processing various cutters;
the fourth step: sequentially clamping a drill bit type cutter by using numerical control machining equipment to machine basic holes of the PCB and the two upper and lower protective plates;
the fifth step: the existing basic holes of the PCB circuit board and the two upper and lower protective plates are reprocessed by clamping a milling cutter type cutter by using numerical control processing equipment, and finally the through hole characteristic processing of the PCB circuit board is realized;
and a sixth step: and taking materials, separating the PCB circuit board and the two upper and lower protective plates to obtain the PCB circuit board with the through holes.
Preferably, the upper protection plate and the lower protection plate are both cold punching plates, and the length and width values of the upper protection plate and the PCB are the same.
Preferably, the length and width value of the lower protection plate is greater than that of the PCB, the inner side of the bottom of the lower protection plate is provided with an abdicating adsorption groove, and the top surface of the lower protection plate is provided with a positioning structure.
Preferably, the inside reference column that has three equal diameter value of location structure that lower protection plate top surface set up, and three equal diameter value of reference column are triangle-shaped and set up.
Preferably, the numerical control machining equipment comprises a numerical control machining center, and a vacuum adsorption workbench is installed inside the numerical control machining center.
Preferably, the drill bit cutters are two or more drill bits with different diameter values.
(III) advantageous effects
The invention provides a PCB drilling process, which has the following beneficial effects:
this PCB circuit board drilling technology adopts multiple cutter to carry out multistage brill in proper order, the through-hole of two kinds of differences such as compensation mill is processed the PCB circuit board, and then the deformation that makes the through-hole course of working is less, drilling hole site precision and through-hole aperture are all in predetermined tolerance, stop the through-hole big-end-up that conventional processing appears, the bad problem that the diameter differs, and multiple cutter shares milling pressure in turn in the course of working, be difficult to the disconnected sword, the reliability of processing technology and the yields of PCB circuit board processing have been guaranteed.
Detailed Description
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: the invention provides a PCB (printed circuit board) drilling process, which adopts a plurality of cutters to sequentially carry out two different processing modes of multi-stage drilling, compensation milling and the like to process a through hole of a PCB, ensures that the deformation of the through hole in the processing process is smaller, and ensures that the precision of a drilling hole position and the aperture of the through hole are within a preset tolerance, and specifically comprises the following operations:
as one of the embodiments, the first step of processing a 6mm through hole is described in detail: preparing materials before processing a PCB (printed circuit board) and two upper and lower protective plates, determining the specification and the type of a used cutter according to the diameter of a through hole processed by the PCB and the thickness of the PCB, wherein the cutter mainly comprises a drill bit and a milling cutter, the drill bit cutters comprise two or more drill bits with different diameter values, the upper protective plate and the lower protective plate are cold punching plates, the length and width values of the upper protective plate and the PCB are the same, the specific diameter of the processed through hole is selected, and three cutters, namely a 5.3mm drill bit, a 5.8mm drill bit and a 5mm milling cutter are selected under the limiting condition of the 6mm through hole;
the second step is that: confirming the drilling depth, the milling depth and the cutting edge length value of each cutter according to the prepared PCB and the two upper and lower protection plates, specifically, confirming the specific processing depth of the cutter selected in the first step according to the provided PCB and the two upper and lower protection plates, wherein the drilling depth value of a 5.8mm drill bit is equal to the sum of three quarters of the thickness value of the PCB and the thickness value of the protection plates, the drilling depth value of a 5.3mm drill bit is equal to the sum of the thickness value of the PCB, the thickness value of the upper protection plate and the thickness value of the lower protection plate, the milling depth value of the 5mm milling cutter is not less than the sum of the thickness value of the PCB and the thickness value of the upper protection plate, and the cutting edge length values of the 5.3mm drill bit, the 5.8mm drill bit and the 5mm milling cutter are all greater than the sum of the thickness value of the PCB, the thickness value of the upper protection plate and the thickness value of the lower protection plate;
the third step: (ii) a The numerical control processing equipment comprises a numerical control processing center, a vacuum adsorption worktable is arranged in the numerical control processing center, specifically, a numerical control processing center and a vacuum adsorption worktable equipment are adopted for processing, a through groove is arranged in the middle of the lower protection plate, and then the middle of the lower protection plate is arranged on the top surface of the vacuum adsorption worktable, after the lower protective plate is stabilized, a positioning device is arranged at the designated position of the top surface of the lower protective plate, then the PCB circuit board and the upper protective plate are fixedly arranged in a detachable way, specifically, a screw thread connection with a screw as a connecting piece or an adhesive connection with glue is adopted, after the completion, the assembly of the PCB circuit board and the upper protection plate is arranged on the top surface of the lower protection plate by a positioning device, the bottom surface of the PCB circuit board covers the upper part of the through groove in the middle of the lower protection plate, then the PCB circuit board is divided into centers by utilizing a transmission component in the X, Y direction in the numerical control machining center and a dial indicator, determining a zero coordinate, then, respectively compiling a punching program of a 5.3mm drill bit, a punching program of a 5.8mm drill bit and a circumference compensation milling program of a 5mm milling cutter according to the zero coordinate and the position of a through hole to be processed of the PCB as reference surfaces;
the fourth step: the method comprises the steps of sequentially clamping a drill bit cutter by using numerical control machining equipment to machine basic holes of a PCB (printed circuit board) and two upper and lower protective plates, specifically, clamping a 5.8mm drill bit into a Z-axis cutter clamping mechanism of a numerical control machining center, calling a drilling program of the 5.8mm drill bit and starting the drilling program to move the 5.8mm drill bit to a specified through hole position, rotating the drill bit under the use of the numerical control machining center, penetrating the upper protective plate into the PCB, setting specific depth values according to the conditions in the second step, namely, the 5.8mm drill bit does not penetrate through the PCB, resetting transmission parts of the numerical control machining center after completing, clamping the 5.3mm drill bit into the Z-axis cutter clamping mechanism of the numerical control machining center, calling the drilling program of the 5.3mm drill bit and starting the drilling program, then continuing to drill according to the through hole position, setting the machining depth of the 5.3mm drill bit according to the set conditions in the second step, specifically, a 5.3mm drill bit respectively drills through the upper protection plate and the PCB circuit board to enter the interior of the lower protection plate, so that the processing of basic holes of the upper protection plate, the lower protection plate and the PCB circuit board is completed;
the fifth step: the method comprises the following steps that a numerical control machining device is adopted to clamp a milling cutter type cutter to reprocess the existing basic holes of a PCB (printed circuit board) and two upper and lower protection plates, and finally the through hole characteristic machining of the PCB is realized, specifically, a 5mm milling cutter is clamped in a Z-axis cutter clamping mechanism of a numerical control machining center, then a circumference compensation milling program of the 5mm milling cutter is called and started, then the 5mm milling cutter moves to the inside of the PCB to perform multi-section and repeated circumference compensation milling under the action of the numerical control machining center, finally the basic hole is expanded and milled to 6mm, the tolerance requirement is met, and after the completion, each transmission part of the numerical control machining center is reset;
and a sixth step: taking materials, separating the PCB circuit board and the two upper and lower protection plates, obtaining the PCB circuit board with the completed through hole, closing the vacuum adsorption workbench, taking down the PCB circuit board with the completed through hole characteristic processing and the upper protection plate, and separating the PCB circuit board and the upper protection plate.
In conclusion, according to the PCB drilling process, the through hole of the PCB is processed by adopting two different processing modes, namely a 5.3mm drill bit, a 5.8mm drill bit, a 5mm milling cutter multi-stage drill, a compensation mill and the like, so that the deformation of the through hole processing process is small, the precision of the drilling hole position and the aperture of the through hole are within a preset tolerance, the bad problem that the through hole is big at the top and small at the bottom in conventional processing is avoided, and milling pressure is shared by three kinds of cutters in turn in the processing process, so that cutter breakage is not easy.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A PCB circuit board drilling technology is characterized in that: according to the PCB drilling process provided by the invention, the through hole of the PCB is processed by adopting two different processing modes of multi-stage drilling, compensation milling and the like sequentially by adopting a plurality of cutters, so that the deformation of the through hole in the processing process is ensured to be smaller, and the precision of the drilling hole position and the aperture of the through hole are both within the preset tolerance, and the specific operation is as follows:
the first step is as follows: preparing materials before processing a PCB (printed Circuit Board) and two upper and lower protection plates, and determining the specification and the type of a used cutter according to the diameter of a through hole processed by the PCB and the thickness of the PCB, wherein the cutter mainly comprises a drill bit and a milling cutter;
the second step is that: confirming the drilling depth, the milling depth and the length value of the cutting edge of each cutter according to the prepared PCB and the two upper and lower protective plates;
the third step: (ii) a Positioning and mounting the PCB circuit board and the two upper and lower protective plates by adopting numerical control processing equipment, setting a coordinate system in different centers, determining the position of the through hole and compiling numerical control programs for processing various cutters;
the fourth step: sequentially clamping a drill bit type cutter by using numerical control machining equipment to machine basic holes of the PCB and the two upper and lower protective plates;
the fifth step: the existing basic holes of the PCB circuit board and the two upper and lower protective plates are reprocessed by clamping a milling cutter type cutter by using numerical control processing equipment, and finally the through hole characteristic processing of the PCB circuit board is realized;
and a sixth step: and taking materials, separating the PCB circuit board and the two upper and lower protective plates to obtain the PCB circuit board with the through holes.
2. A PCB board drilling process according to claim 1, wherein: the upper protection plate and the lower protection plate are cold punching plates, and the length and width values of the upper protection plate and the PCB are the same.
3. A PCB board drilling process according to claim 1, wherein: the length and width value of lower protection shield then all is greater than the length and width value of PCB circuit board, and the inboard of lower protection shield bottom has seted up the adsorption tank of stepping down, the top surface of lower protection shield is provided with location structure.
4. A PCB board drilling process according to claim 3, wherein: the inside reference column including three equal diameter value of location structure that lower protection plate top surface set up, and three equal diameter value of reference column are triangle-shaped and set up.
5. A PCB board drilling process according to claim 1, wherein: the numerical control machining equipment comprises a numerical control machining center, and a vacuum adsorption workbench is arranged in the numerical control machining center.
6. A PCB board drilling process according to claim 1, wherein: the drill bit type cutter comprises two or more drill bits with different diameter values.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111259478.2A CN114126227A (en) | 2021-10-28 | 2021-10-28 | PCB (printed circuit board) drilling process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111259478.2A CN114126227A (en) | 2021-10-28 | 2021-10-28 | PCB (printed circuit board) drilling process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114126227A true CN114126227A (en) | 2022-03-01 |
Family
ID=80377241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111259478.2A Pending CN114126227A (en) | 2021-10-28 | 2021-10-28 | PCB (printed circuit board) drilling process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114126227A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114952366A (en) * | 2022-05-13 | 2022-08-30 | 智恩电子(大亚湾)有限公司 | Drilling method of circuit board motherboard |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4872787A (en) * | 1986-12-19 | 1989-10-10 | Hitachi Seiko Ltd. | Method of drilling printed circuit board |
| JPH04244306A (en) * | 1991-01-10 | 1992-09-01 | Fujitsu Ltd | Method for drilling hole in printed circuit board |
| JPH09314410A (en) * | 1996-05-30 | 1997-12-09 | Hitachi Seiko Ltd | Method for spot facing with numerical control system |
| US20030152432A1 (en) * | 2002-02-08 | 2003-08-14 | Meece Roy Dean | Method of cutting a hole in a composite material workpiece |
| JP2007245331A (en) * | 2006-02-15 | 2007-09-27 | Hitachi Via Mechanics Ltd | Printed board machining device and drilling method therefor |
| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| CN102689031A (en) * | 2012-06-08 | 2012-09-26 | 镇江华印电路板有限公司 | Drilling method for circuit board |
| CN102938978A (en) * | 2012-11-28 | 2013-02-20 | 成都航天通信设备有限责任公司 | Thick-ceramic-base printed circuit board processing method |
| CN104325174A (en) * | 2014-10-09 | 2015-02-04 | 梅州市志浩电子科技有限公司 | Printed circuit board hole drilling positioning device and method |
| CN105945319A (en) * | 2016-06-15 | 2016-09-21 | 沈阳飞机工业（集团）有限公司 | Method for accurate numerically-controlled drilling on large-curvature arc surface |
| CN106984999A (en) * | 2017-05-05 | 2017-07-28 | 昆山弗莱吉电子科技有限公司 | A kind of pcb board method for processing forming compensated based on milling cutter knife footpath |
| US20170231099A1 (en) * | 2016-02-05 | 2017-08-10 | Dell Products, Lp | Electrical Breaks in PCB Vias |
| CN108012420A (en) * | 2017-10-27 | 2018-05-08 | 深圳市金洲精工科技股份有限公司 | A kind of molding milling method of pcb board microflute |
| CN109922603A (en) * | 2019-04-18 | 2019-06-21 | 生益电子股份有限公司 | A kind of boring method of PCB |
| CN110213895A (en) * | 2019-06-10 | 2019-09-06 | 深圳市鼎盛电路技术有限公司 | A kind of PCB circuit manufacturing method and PCB |
-
2021
- 2021-10-28 CN CN202111259478.2A patent/CN114126227A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4872787A (en) * | 1986-12-19 | 1989-10-10 | Hitachi Seiko Ltd. | Method of drilling printed circuit board |
| JPH04244306A (en) * | 1991-01-10 | 1992-09-01 | Fujitsu Ltd | Method for drilling hole in printed circuit board |
| JPH09314410A (en) * | 1996-05-30 | 1997-12-09 | Hitachi Seiko Ltd | Method for spot facing with numerical control system |
| US20030152432A1 (en) * | 2002-02-08 | 2003-08-14 | Meece Roy Dean | Method of cutting a hole in a composite material workpiece |
| JP2007245331A (en) * | 2006-02-15 | 2007-09-27 | Hitachi Via Mechanics Ltd | Printed board machining device and drilling method therefor |
| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| CN102689031A (en) * | 2012-06-08 | 2012-09-26 | 镇江华印电路板有限公司 | Drilling method for circuit board |
| CN102938978A (en) * | 2012-11-28 | 2013-02-20 | 成都航天通信设备有限责任公司 | Thick-ceramic-base printed circuit board processing method |
| CN104325174A (en) * | 2014-10-09 | 2015-02-04 | 梅州市志浩电子科技有限公司 | Printed circuit board hole drilling positioning device and method |
| US20170231099A1 (en) * | 2016-02-05 | 2017-08-10 | Dell Products, Lp | Electrical Breaks in PCB Vias |
| CN105945319A (en) * | 2016-06-15 | 2016-09-21 | 沈阳飞机工业（集团）有限公司 | Method for accurate numerically-controlled drilling on large-curvature arc surface |
| CN106984999A (en) * | 2017-05-05 | 2017-07-28 | 昆山弗莱吉电子科技有限公司 | A kind of pcb board method for processing forming compensated based on milling cutter knife footpath |
| CN108012420A (en) * | 2017-10-27 | 2018-05-08 | 深圳市金洲精工科技股份有限公司 | A kind of molding milling method of pcb board microflute |
| CN109922603A (en) * | 2019-04-18 | 2019-06-21 | 生益电子股份有限公司 | A kind of boring method of PCB |
| CN110213895A (en) * | 2019-06-10 | 2019-09-06 | 深圳市鼎盛电路技术有限公司 | A kind of PCB circuit manufacturing method and PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114952366A (en) * | 2022-05-13 | 2022-08-30 | 智恩电子(大亚湾)有限公司 | Drilling method of circuit board motherboard |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20040118605A1 (en) | Circuit board having a multi-functional hole | |
| CN114126227A (en) | PCB (printed circuit board) drilling process | |
| CN105307396B (en) | The manufacturing method of PCB containing square hole | |
| CN109089381B (en) | Appearance processing method of micro-size PCB | |
| CN110418505B (en) | Precise PCB blank plate and processing and forming method thereof | |
| CN114147807A (en) | Method for processing ultrashort slotted hole of circuit board | |
| CN108770204B (en) | Drilling method and drilling system for printed circuit board | |
| CN109548292B (en) | Super-long high multilayer PCB drilling production process | |
| CN111182731A (en) | Tree core groove processing method and printed circuit board | |
| JPS61121849A (en) | Reference hole for work stand | |
| CN111093329B (en) | Small-size stepped PCB forming method | |
| CN207578533U (en) | The lower cutting type jig of substrate | |
| CN111405840B (en) | Method for manufacturing stepped groove for PCB (printed circuit board) embedding capacity by PCB (printed circuit board) appearance processing machine | |
| CN112399716A (en) | Back drilling method and preparation method of PCB and prepared PCB | |
| CN207678080U (en) | A kind of PCB circuit board pore-forming positioning plate | |
| CN112752409A (en) | Processing technology for preventing hole copper from being stripped and controlling depth gong | |
| CN111356305A (en) | Processing technology for forming V-CUT | |
| JP3105084B2 (en) | Drilling machine with processed PCB and display method of spindle | |
| CN110708878A (en) | Processing method of printed circuit board | |
| CN213226371U (en) | Drilling and milling machine for printed circuit board | |
| CN112672502A (en) | PCB (printed circuit board), deep forming processing method thereof and numerical control device | |
| CN110102968B (en) | Processing method of SMT red glue screen printing template | |
| KR20190114232A (en) | The long hole processing method of PCB | |
| CN218225576U (en) | Positioning fixture for cutting tool rest machining | |
| CN108012429A (en) | A kind of PCB circuit board pore-forming positioning plate and localization method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20240419 |