KR20190114232A - The long hole processing method of PCB - Google Patents

The long hole processing method of PCB Download PDF

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Publication number
KR20190114232A
KR20190114232A KR1020180036626A KR20180036626A KR20190114232A KR 20190114232 A KR20190114232 A KR 20190114232A KR 1020180036626 A KR1020180036626 A KR 1020180036626A KR 20180036626 A KR20180036626 A KR 20180036626A KR 20190114232 A KR20190114232 A KR 20190114232A
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South Korea
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hole
long hole
printed circuit
routing
circuit board
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KR1020180036626A
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Korean (ko)
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오재환
신석철
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주식회사 디에이피
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Publication of KR20190114232A publication Critical patent/KR20190114232A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)

Abstract

Disclosed is a long hole processing method using slot bit and routing bit. The long hole processing method of a printed circuit board comprises: the inner drill processing step of processing a positive hole one by one on each of the left and right in the longitudinal direction of a long hole through the slot bit; and the routing processing step of reciprocating in an oval form along the inner region of the long hole from the left positive hole to the right positive hole through the routing bit with respect to the result of the inner drill processing step, routing the inner wall of the long hole and forming the long hole.

Description

인쇄회로기판의 장공 가공 방법{The long hole processing method of PCB}Long hole processing method of printed circuit boards

본 발명은 인쇄회로기판의 가공방법 및 그에 의해 제조된 인쇄회로기판에 관한 것으로서, 보다 상세하게는 라우터 장비의 수평가공방식을 드릴링 머신에 응용하여 용이하게 장공을 형성할 수 있음은 물론 가공시간을 단축하고 가공 품위도 향상시킨 인쇄회로기판의 장공 가공 방법에 관한 것이다.The present invention relates to a method for processing a printed circuit board and a printed circuit board manufactured by the same, and more particularly, it is possible to easily form a long hole by applying a horizontal processing method of a router equipment to a drilling machine, as well as processing time. The present invention relates to a method for processing a long hole in a printed circuit board which has been shortened and improved in quality.

일반적으로, 인쇄회로기판(Printed Circuit Board)은 강화 섬유유리나 플라스틱 등의 절연판 상에 배선회로를 인쇄한 후 전기적 소자를 고정시켜 소정의 단위기능을 수행할 수 있도록 만들어진 회로기판을 의미하며, 최근의 반도체 집적기술에 대한 비약적인 발전에 힘입어 LSI(Large Scale Integration), VLSI(Very Large Scale Integrated Circuit), ULSI(Ultra Large Scale Integration)급 반도체 칩의 조립 및 실장 기술로서 와이어리스 본딩(Wireless Bonding)의 TCP(Tape Carrier Package) 기술이 소개됨에 따라 그 활용범위를 더욱 넓히고 있다.In general, a printed circuit board (Printed Circuit Board) refers to a circuit board made to perform a predetermined unit function by fixing the electrical element after printing the wiring circuit on an insulating plate such as reinforced fiberglass or plastic, With the rapid development of semiconductor integrated technology, TCP of Wireless Bonding is an assembly and mounting technology of large scale integration (LSI), very large scale integrated circuit (VLSI), and ultra large scale integration (ULSI) semiconductor chips. Tape Carrier Package (Tape Carrier Package) technology has been introduced to expand the scope of application.

이러한 인쇄회로기판에는 정공형태의 홀 이외에도 장공형태의 홀이 요구된다.Such printed circuit boards require long holes in addition to hole holes.

도 1은 슬롯 비트를 이용한 종래의 정공 가공 방법을 보인다.1 shows a conventional hole machining method using a slot bit.

종래에는 인쇄회로기판에 필요한 장공을 형성하기 위해서 도 1에 예시된 바와 같이 슬롯비트(20)를 사용하여 형성할 크기의 장공(22)에 맞춰 여러 개의 정공형 홀(12)들을 가공하게 된다.In the related art, in order to form a long hole required for a printed circuit board, as shown in FIG. 1, a plurality of hole holes 12 are processed in accordance with a long hole 22 having a size to be formed using the slot bit 20.

따라서 인쇄회로기판상에 장공(22)을 형성하기 위해서는 매우 많은 시간과 경비가 소요되고, 그로 인해 생산성이 매우 낮다는 단점이 있다.Therefore, to form the long hole 22 on the printed circuit board takes a lot of time and expense, and there is a disadvantage that the productivity is very low.

뿐만 아니라, 단순히 다수의 정공형 홀(12)들을 겹쳐 드릴링하는 수직가공 방식으로 장공(22)을 형성하다 보니 가공된 장공(22)이 균일하지 못하고 틀어지거나 혹은 정공형 홀(12)들이 겹치는 부위가 깨끗하게 제거되지 못하고 버(Burr)를 남겨 품질불량을 초래하는 등 또 다른 문제점들도 있다.In addition, since the hole 22 is formed in a vertical processing method in which a plurality of hole holes 12 are overlapped and drilled, the processed hole 22 is not uniform and is twisted, or the hole holes 12 overlap. There are also other problems, such as a problem that can result in poor quality that can not be removed cleanly and leaves a burr.

대한민국특허청 공개특허 10-2010-0083476 (2010.07.22.)Korean Patent Office Publication 10-2010-0083476 (2010.07.22.) 대한민국특허청 등록특허 10-0687791 (2007.03.02.)Korea Patent Office Registered Patent 10-0687791 (2007.03.02.)

본 발명은 상술한 바와 같은 종래 기술상의 제반 문제점들을 감안하여 이를 해결하고자 창출된 것으로, 홀이 틀어지거나 버가 생기지 않아 품질향상을 달성할 수 있는 인쇄회로기판의 가공 방법을 제공하는 것을 그 목적으로 한다.The present invention has been made in view of the above-mentioned problems in the prior art, and has been created to solve the above problems. The object of the present invention is to provide a processing method of a printed circuit board capable of achieving quality improvement by not forming holes or burrs. do.

상기의 목적을 달성하기 위한 본 발명에 따른 인쇄회로기판의 정공 가공 방법은 Hole processing method of a printed circuit board according to the present invention for achieving the above object

슬롯비트와 라우터비트를 이용하여 인쇄회로기판상에 장공을 형성하는 인쇄회로기판 장공 가공 방법에 있어서; A printed circuit board hole processing method for forming a hole on a printed circuit board using slot bits and router bits;

슬롯비트를 통해 장공의 길이 방향으로 좌측 및 우측 각각에 하나씩 정공형 홀을 가공하는 내부 드릴 가공 단계; 및An internal drill processing step of machining hole holes one by one on each of the left and right sides in the longitudinal direction of the long hole through the slot bit; And

상기 내부 드릴 가공 단계의 결과물에 대하여 라우팅 비트를 통해 좌측의 정공형 홀부터 우측의 정공형 홀까지 장공의 내측 영역을 따라 타원형으로 왕복하며 장공의 내벽을 라우팅하여 장공을 형성하는 라우팅 가공 단계; 를 포함한다.A routing processing step of forming a hole by routing the inner wall of the hole and reciprocating oval along the inner region of the hole from the left hole to the right hole through a routing bit with respect to the result of the internal drill processing step; It includes.

여기서, 장공형 홀의 직경은 장공의 폭보다 작은 것이 바람직하다.Here, the diameter of the long hole is preferably smaller than the width of the long hole.

본 발명에 따르면, 드릴링 머신만을 가지고도 간편 용이하게 장공을 수평가공할 수 있고, 비트만 바꿔서 장공을 가공할 수 있어 제조비용을 절감시킬 수 있으며, 또한 가공된 장공이 틀어지거나 버를 발생시키지 않아 품질이 향상되며, 가공시간을 단축할 수 있고, 이를 통해 생산성을 향상시키는 효과를 얻을 수 있다.According to the present invention, it is possible to simply horizontally machine the long hole even by using only a drilling machine, and to reduce the manufacturing cost by machining the long hole by changing only the bit, and also the machined long hole is not twisted or generates burrs. The quality is improved, and the processing time can be shortened, thereby improving the productivity.

도 1은 슬롯 비트를 이용한 종래의 정공 가공 방법을 보인다.
도 2는 본 발명에 따른 인쇄회로기판의 장공 가공 방법을 보인 예시도이다.
도 3은 본 발명에 따른 인쇄회로기판의 장공 가공 방법에 의한 효과를 보이는 것이다.1 shows a conventional hole machining method using a slot bit.
Figure 2 is an exemplary view showing a long hole processing method of a printed circuit board according to the present invention.
Figure 3 shows the effect by the long hole processing method of the printed circuit board according to the present invention.

이하에서는, 첨부도면을 참고하여 본 발명에 따른 바람직한 실시예를 보다 상세하게 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment according to the present invention.

도 2는 본 발명에 따른 인쇄회로기판의 장공 가공 방법을 보인 예시도이다.Figure 2 is an exemplary view showing a long hole processing method of a printed circuit board according to the present invention.

도 2를 참조하면, 먼저 장공(42)의 길이 방향으로 좌측 및 우측 각각에 정공형 홀(32a, 32b)을 가공한다. 이때, 슬롯 비트(미도시)를 이용하여 정공형 홀(32a, 32b)을 가공하게 된다.(내부 Drill 가공 단계)Referring to FIG. 2, first, hole holes 32a and 32b are processed in the left and right sides of the long hole 42 in the longitudinal direction. At this time, the hole holes 32a and 32b are processed using slot bits (not shown).

여기서, 정공형 홀(32a, 32b)의 직경은 장공(42)의 폭보다 적은 것이 바람직하다.Here, the diameter of the hole 32a, 32b is preferably smaller than the width of the long hole 42.

다음으로, 좌측의 정공형 홀(32a)부터 우측의 정공형 홀(32b)까지 장공(42)의 내벽을 따라 타원형으로 왕복하면서 라우팅한다. 이때 라우팅 비트(44, routing bit)를 이용하여 라우팅하게 된다. (라우팅 가공 단계)Next, routing is performed while reciprocating elliptically along the inner wall of the long hole 42 from the hole hole 32a on the left side to the hole hole 32b on the right side. At this time, routing is performed using a routing bit 44. (Routing step)

이와 같은 형태의 장공(42)을 간편 용이하면서도 단시간에 형성할 수 있음은 물론 정확하고 월등히 향상된 품질의 버가 없는 장공(42)을 가공할 수 있게 된다.The long hole 42 of this type can be easily and easily formed in a short time, as well as to process the long hole 42 without the burr of accurate and significantly improved quality.

본 발명에 따른 인쇄회로기판의 가공은 CNC 기능을 갖춘 드릴링 머신(Drilling Machine)에 의해 이루어질 수 있다.Processing of the printed circuit board according to the present invention can be made by a drilling machine (Drilling Machine) having a CNC function.

이러한 드릴링머신은 주지된 바와 같이, 컴퓨터수치제어(CNC, Computerized Numerical Control)에 의해 드릴링하게 되므로 정밀도가 우수하고, 자동제어가 가능하며, 부가적인 조작이 요구되지 않아 신속하게 작업할 수 있으므로 생산수율도 향상시킬 수 있다.As this drilling machine is well-known, it is drilled by Computerized Numerical Control (CNC), so the precision is excellent, automatic control is possible, and additional operation is not required, so the production yield is high. Can also be improved.

그리고, 상기 드릴링 머신은 드릴용 슬롯 비트와 라우팅용 라우팅 비트를 교체사용할 수 있도록 구성되어 있을 수 있다.In addition, the drilling machine may be configured to replace the drill slot bit and the routing routing bit.

주지하는 바와 같이 라우팅 비트는 인쇄회로기판의 재단작업을 위해 사용되는 비트로서 수평절삭가공을 위한 구조로 이루어져 있다.As is well known, the routing bit is a bit used for cutting a printed circuit board, and has a structure for horizontal cutting.

도 3은 본 발명에 따른 인쇄회로기판의 장공 가공 방법에 의한 효과를 보이는 것이다.Figure 3 shows the effect by the long hole processing method of the printed circuit board according to the present invention.

도 3에 도시된 바와 같이, 본 발명에 따른 정공 가공 방법은 정공형 홀(32a, 32b)을 가공하는 내부 Drill 가공 단계와 장공(42)의 내벽을 가공하는 라우팅 가공 단계를 포함한다. As shown in FIG. 3, the hole machining method according to the present invention includes an internal drill machining step of machining the hole-type holes 32a and 32b and a routing machining step of machining the inner wall of the long hole 42.

도 3을 참조하면, 1Lot 90PNL(panel)을 가공하기 위해서 종래 기술에 의해서는 3,900분이 소요되지만 본 발명의 정공 가공 방법에 의하면 고작 1,800분만이 소요됨을 알 수 있다. 즉, 35시간이나 단축되는 것을 알 수 있다.Referring to FIG. 3, it takes 3,900 minutes by the prior art to process 1Lot 90PNL (panel), but it can be seen that only 1,800 minutes are required according to the hole processing method of the present invention. That is, it turns out that it shortens for 35 hours.

12, 32...정공형 홀 22, 42...장공
44...라우팅 비트12, 32 ... hole hole 22, 42 ... hole
44 ... routing bit

Claims (2)

슬롯비트와 라우터비트를 이용하여 인쇄회로기판상에 장공을 형성하는 인쇄회로기판 장공 가공 방법에 있어서;
슬롯비트를 통해 장공의 길이 방향으로 좌측 및 우측 각각에 하나씩 정공형 홀을 가공하는 내부 드릴 가공 단계; 및
상기 내부 드릴 가공 단계의 결과물에 대하여 라우팅 비트를 통해 일측의 정공형 홀부터 타측의 정공형 홀까지 장공의 내측 영역을 따라 타원형으로 왕복하며 장공의 내벽을 라우팅하여 장공을 형성하는 라우팅 가공 단계;
를 포함하는 인쇄회로기판의 장공 가공 방법.
A printed circuit board hole processing method for forming a hole on a printed circuit board using slot bits and router bits;
An internal drill processing step of machining a hole in each of the left and right sides in the longitudinal direction of the long hole through the slot bit; And
A routing processing step of forming a long hole by reciprocating an inner wall of the long hole through an inner region of the long hole from a hole hole on one side to a hole hole on the other side through a routing bit with respect to the result of the internal drill processing step;
Long hole processing method of a printed circuit board comprising a.
제1항에 있어서, 상기 장공형 홀의 직경은 상기 장공의 폭보다 작은 것을 특징으로 하는 인쇄회로기판의 장공 가공 방법.The method of claim 1, wherein the diameter of the long hole is smaller than the width of the long hole.
KR1020180036626A 2018-03-29 2018-03-29 The long hole processing method of PCB KR20190114232A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096058A (en) * 2021-11-05 2022-02-25 昆山沪利微电有限公司 Multi-order HDI-PCB and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100687791B1 (en) 2005-11-29 2007-03-02 주식회사 코리아써키트 Manufacturing method of printed circuit board
KR20100083476A (en) 2009-01-14 2010-07-22 김상록 Processing method of printed circuit board and manufactured printed circuit board thereby

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100687791B1 (en) 2005-11-29 2007-03-02 주식회사 코리아써키트 Manufacturing method of printed circuit board
KR20100083476A (en) 2009-01-14 2010-07-22 김상록 Processing method of printed circuit board and manufactured printed circuit board thereby

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096058A (en) * 2021-11-05 2022-02-25 昆山沪利微电有限公司 Multi-order HDI-PCB and manufacturing method thereof
CN114096058B (en) * 2021-11-05 2024-04-30 昆山沪利微电有限公司 Multi-order HDI-PCB and manufacturing method thereof

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