CN102689031A - Drilling method for circuit board - Google Patents
Drilling method for circuit board Download PDFInfo
- Publication number
- CN102689031A CN102689031A CN2012101889856A CN201210188985A CN102689031A CN 102689031 A CN102689031 A CN 102689031A CN 2012101889856 A CN2012101889856 A CN 2012101889856A CN 201210188985 A CN201210188985 A CN 201210188985A CN 102689031 A CN102689031 A CN 102689031A
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- CN
- China
- Prior art keywords
- hole
- aperture
- bore
- wiring board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a drilling method for a circuit board. A small hole is primarily drilled for a hole with the aperture PhiX of more than or equal to 4.0mm, and then is secondarily drilled to form a large hole with the complete aperture, so that popping can be effectively reduced. Holes with the same aperture can be drilled at the same time, so that the drilling efficiency can be remarkably improved.
Description
Technical field
The present invention relates to wiring board and make the field, especially a kind of method of wiring board boring.
Background technology
When Digit Control Machine Tool processing Φ 4.0mm, adopt directly boring at present; Because resistance was big when big drill bit bored down, the substrate pressure causes the layering of bore edges substrate easily, and it is bad to produce blast hole; Even raising rotating speed, reduction running speed still can't reduce fraction defective; And that but the method that adopts milling can avoid the blast hole working (machining) efficiency to reduce is nearly 1/3, has a strong impact on production efficiency, has been absorbed in the predicament of wanting quality still to want efficient when making Digit Control Machine Tool processing Φ 4.0mm.
Therefore, need a kind of new technical scheme to address the above problem.
Summary of the invention
To above-mentioned existing in prior technology problem and shortage, the purpose of this invention is to provide the method that a kind of wiring board of avoiding blast hole and efficient to improve is holed.
For realizing above-mentioned purpose, the method for wiring board boring of the present invention can adopt following technical scheme:
A kind of method of wiring board boring may further comprise the steps:
(1), the hole that will bore Φ X >=4.0mm is by filtering out, wherein X is the diameter in hole;
(2), holed by Φ (X-2.0) mm for the first time in the hole that filters out, and then hole for the second time by Φ X;
Wherein, if identical hole, some apertures is arranged, then bore operation is carried out in identical hole, this aperture simultaneously.
The present invention is compared with prior art: through aperture of subdrilling is continued in the hole of Φ X >=4.0mm, bore the macropore in complete aperture again, can effectively reduce the generation of blast hole.And being carried out bore operation simultaneously, identical hole, this aperture can significantly improve drilling efficiency.
The specific embodiment
Below in conjunction with the specific embodiment; Further illustrate the present invention; Should understand the following specific embodiment only be used to the present invention is described and be not used in the restriction scope of the present invention; After having read the present invention, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the present invention.
The present invention discloses a kind of method of wiring board boring, adopts Digit Control Machine Tool to carry out bore operation, and this method may further comprise the steps:
(1), the hole that will bore Φ X >=4.0mm is by filtering out, wherein X is the diameter in hole;
(2), holed by Φ (X-2.0) mm for the first time in the hole that filters out, and then hole for the second time by Φ X;
Wherein, if identical hole, some apertures is arranged, then bore operation is carried out in identical hole, this aperture simultaneously.After the Digit Control Machine Tool operating personnel receives borehole data, data is carried out cutter sort principle of ordering: the ascending execution of size by the diameter of cutter is preferentially holed, and guarantees the aperture subdrilling, bores behind the macropore.
As, needing to bore A hole Φ 6.0mm, engineers and technicians are when writing Digit Control Machine Tool boring file; This Φ 6.0mm hole is all filtered out, write the program of boring B hole Φ 4.0mm earlier, write the program of boring A hole Φ 6.0mm once more; If need bore C hole Φ 8.0mm simultaneously, then can write the program of boring D hole Φ 6.0mm earlier, the program of writing C hole Φ 8.0mm again; And the diameter in A hole and D hole is 6.0mm, can A hole and D hole be merged this moment hole, avoid having bored the A hole after lathe stop operation; Change cutter and detect cutter again, practiced thrift drilling time, improved drilling efficiency.
Claims (2)
1. the method for wiring board boring is characterized in that: may further comprise the steps:
(1), the hole that will bore Φ X >=4.0mm is by filtering out, wherein X is the diameter in hole;
(2), holed by Φ (X-2.0) mm for the first time in the hole that filters out, and then hole for the second time by Φ X;
Wherein, if identical hole, some apertures is arranged, then bore operation is carried out in identical hole, this aperture simultaneously.
2. one kind is used the method for wiring board boring according to claim 1, it is characterized in that: adopt Digit Control Machine Tool to carry out bore operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101889856A CN102689031A (en) | 2012-06-08 | 2012-06-08 | Drilling method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101889856A CN102689031A (en) | 2012-06-08 | 2012-06-08 | Drilling method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102689031A true CN102689031A (en) | 2012-09-26 |
Family
ID=46854859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101889856A Pending CN102689031A (en) | 2012-06-08 | 2012-06-08 | Drilling method for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102689031A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103213168A (en) * | 2013-04-18 | 2013-07-24 | 梅州市志浩电子科技有限公司 | Manufacturing method of mechanical large hole of printed circuit board |
| CN103785876A (en) * | 2014-02-21 | 2014-05-14 | 昆山苏杭电路板有限公司 | Method for drilling high-precision large-aperture hole in printed board |
| CN104552439A (en) * | 2013-10-11 | 2015-04-29 | 北大方正集团有限公司 | PCB drilling method |
| CN103785876B (en) * | 2014-02-21 | 2016-11-30 | 昆山苏杭电路板有限公司 | Printed board high-precision large aperture hole forming method |
| CN107696152A (en) * | 2017-09-01 | 2018-02-16 | 佛山市科莱机器人有限公司 | A kind of composite material casing processing method |
| CN114126227A (en) * | 2021-10-28 | 2022-03-01 | 苏州烁点电子科技有限公司 | PCB (printed circuit board) drilling process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101925253A (en) * | 2009-06-17 | 2010-12-22 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board and drilling method thereof |
| CN102098879A (en) * | 2011-03-04 | 2011-06-15 | 奥士康精密电路（惠州）有限公司 | Method for drilling internal layer thick copper plate |
-
2012
- 2012-06-08 CN CN2012101889856A patent/CN102689031A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101925253A (en) * | 2009-06-17 | 2010-12-22 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board and drilling method thereof |
| CN102098879A (en) * | 2011-03-04 | 2011-06-15 | 奥士康精密电路（惠州）有限公司 | Method for drilling internal layer thick copper plate |
Non-Patent Citations (2)
| Title |
|---|
| 李海平: "数控钻孔常见问题的分析与解决方法", 《印制电路信息》, no. 08, 10 August 2005 (2005-08-10) * |
| 王星等: "PCB数控钻孔机开发与应用综述", 《电子工业专用设备》, no. 04, 20 April 2009 (2009-04-20) * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103213168A (en) * | 2013-04-18 | 2013-07-24 | 梅州市志浩电子科技有限公司 | Manufacturing method of mechanical large hole of printed circuit board |
| CN104552439A (en) * | 2013-10-11 | 2015-04-29 | 北大方正集团有限公司 | PCB drilling method |
| CN104552439B (en) * | 2013-10-11 | 2016-07-06 | 北大方正集团有限公司 | The processing method of printed circuit board drill hole |
| CN103785876A (en) * | 2014-02-21 | 2014-05-14 | 昆山苏杭电路板有限公司 | Method for drilling high-precision large-aperture hole in printed board |
| CN103785876B (en) * | 2014-02-21 | 2016-11-30 | 昆山苏杭电路板有限公司 | Printed board high-precision large aperture hole forming method |
| CN107696152A (en) * | 2017-09-01 | 2018-02-16 | 佛山市科莱机器人有限公司 | A kind of composite material casing processing method |
| CN114126227A (en) * | 2021-10-28 | 2022-03-01 | 苏州烁点电子科技有限公司 | PCB (printed circuit board) drilling process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120926 |