CN116801515A - Flexible circuit board etching processing method capable of preventing copper layer from cracking - Google Patents
Flexible circuit board etching processing method capable of preventing copper layer from cracking Download PDFInfo
- Publication number
- CN116801515A CN116801515A CN202310582172.3A CN202310582172A CN116801515A CN 116801515 A CN116801515 A CN 116801515A CN 202310582172 A CN202310582172 A CN 202310582172A CN 116801515 A CN116801515 A CN 116801515A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper
- substrates
- etching
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 92
- 239000010949 copper Substances 0.000 title claims abstract description 92
- 238000005530 etching Methods 0.000 title claims abstract description 53
- 238000005336 cracking Methods 0.000 title claims abstract description 21
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 239000010410 layer Substances 0.000 claims abstract description 65
- 238000001035 drying Methods 0.000 claims abstract description 38
- 238000007747 plating Methods 0.000 claims abstract description 29
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000009713 electroplating Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 239000011247 coating layer Substances 0.000 claims abstract description 10
- 238000005507 spraying Methods 0.000 claims abstract description 10
- 238000005553 drilling Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 53
- 239000011889 copper foil Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of flexible circuit board processing, in particular to a flexible circuit board etching processing method capable of preventing a copper layer from cracking; the method comprises the steps of stacking and baking a plurality of layers of substrates, drilling holes at corresponding positions on the surfaces of the substrates, electroplating the substrates, adopting 1-3% dilute sulfuric acid to treat the substrates after electroplating, drying the substrates at high temperature, adopting a pattern transfer film on the dried substrates, precisely laminating the substrates and a copper plating dry film, carrying out exposure treatment after lamination, carrying out development on the exposed substrates for one time to expose the areas to be etched on the substrates, carrying out etching treatment on the etched areas on the substrates to form circuits on the surfaces of the substrates, then removing the copper plating dry film from the surfaces of a circuit board, carrying out chemical cleaning and drying on the substrates, electroplating copper on the copper layers of the etched areas, and spraying high-temperature insulating coating layers around the circuits.
Description
Technical Field
The invention relates to the technical field of flexible circuit board processing, in particular to a flexible circuit board etching processing method capable of preventing a copper layer from cracking.
Background
The flexible printed circuit board is made of polyimide or polyester film as a base material, has the characteristics of high wiring density, light weight, thin thickness and good bending property, comprises a base material and copper foil on the base material, and is exposed to light to expose a circuit, and then is etched to remove unnecessary parts, and the circuit is formed on the surface of the copper foil.
However, in the existing circuit board etching process, the copper layer in the etching area is thinned, and the copper layer is easy to crack due to the fact that the copper layer is bent when the subsequent circuit board is used, so that the durability of the circuit board is poor.
Disclosure of Invention
The invention aims to provide a flexible circuit board etching processing method capable of preventing a copper layer from cracking, and aims to solve the technical problems that in the prior art, in the etching process of a circuit board, the copper layer in an etching area is thinned, and the copper layer is easy to crack due to crack formation caused by bending when a subsequent circuit board is used, so that the durability of the circuit board is poor.
In order to achieve the above object, the method for etching a flexible circuit board capable of preventing cracking of a copper layer, adopted by the invention, comprises the following steps:
preparing a substrate for manufacturing a flexible circuit board, and selecting a plurality of layers of substrates attached with copper foil;
stacking and baking the multi-layer base material;
drilling holes at corresponding positions on the surface of the base material, and carrying out metallization treatment on the drilled holes;
electroplating the whole plate of the base material;
electroplating the base material, treating with 1-3% dilute sulfuric acid, drying at high temperature, placing in a rack, and waiting for pattern transfer by pasting a dry film;
the dried base material adopts a primary pattern transfer film;
precisely pressing the base material and the copper plating dry film, and performing exposure treatment after pressing;
developing the base material after exposure treatment for one time to expose the area to be etched;
etching the etching area on the substrate to form a circuit on the surface of the substrate to obtain a circuit board;
removing the copper plating dry film from the surface of the circuit board, and chemically cleaning and drying the substrate;
removing the copper plating dry film, and electroplating copper on the copper layer of the etched area;
spraying a high-temperature insulating coating layer around the circuit and the circuit, and naturally drying in a normal-temperature ventilation environment;
and detecting the circuit of the circuit board, and packaging and warehousing after detection.
Wherein, in the step of selecting a plurality of layers of the base material attached with copper foil in the base material for preparing the flexible circuit board:
the thickness of the copper layer is 10-12 um, and the thickness of the base material is 45-55 um.
Wherein, in the step of baking the multilayer substrate stack:
the baking temperature is 100-140 ℃ and the baking time is 50-60 min.
Wherein, after the base material is electroplated, dilute sulfuric acid with concentration of 1-3% is adopted for treatment, and the base material is dried at high temperature, then is placed in a rack, and is waited to paste a dry film for pattern transfer:
the drying temperature is 75-85 ℃.
Wherein, in the step of etching the etching area on the substrate to form a circuit on the surface of the substrate to obtain the circuit board, the step of:
the etch standard line is 2mm &0.25mm, which must be within +/-0.02mm after etching.
Wherein, in the step of removing the copper plating dry film from the surface of the circuit board, the substrate is chemically cleaned and dried:
the drying temperature is 70-80 ℃.
Wherein, after removing the copper plating dry film, by electroplating copper on the copper layer of the etched region:
the thickness of the electroplated copper is 5-15 um.
The invention relates to a flexible circuit board etching processing method capable of preventing copper layer cracking, which comprises the steps of preparing a substrate for manufacturing a flexible circuit board, selecting a plurality of layers of substrates attached with copper foil, stacking and baking the substrates, drilling holes at corresponding positions on the surfaces of the substrates, carrying out metallization processing on the drilled holes, carrying out whole-board electroplating on the substrates, carrying out dilute sulfuric acid treatment of 1-3% after the electroplating of the substrates, drying at high temperature, then placing an inserting frame, waiting for pattern transfer of a dry film, carrying out pattern transfer film on the dried substrates, precisely laminating the substrates and the copper plating dry film, carrying out exposure treatment after lamination, carrying out primary development on the substrates after the exposure treatment, enabling the substrates to expose areas to be etched, carrying out etching treatment on etched areas on the substrates, enabling the surfaces of the substrates to form circuits, obtaining a circuit board, then removing the copper plating dry film from the surfaces of the circuit board, carrying out chemical cleaning and drying on the substrates, carrying out copper plating on the copper layer on the etched areas, carrying out spraying on the high-temperature insulating coating layer around the circuits and the circuits, carrying out natural drying under the environment, finally carrying out detection on the circuits of the circuit board, and carrying out warehouse entry detection on the circuits after detection, so that the durability of the circuit board can be prevented from cracking.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of the steps of a first embodiment of the present invention.
Fig. 2 is a flow chart of the steps of a second embodiment of the present invention.
Fig. 3 is a flow chart of steps of a third embodiment of the present invention.
Detailed Description
In an embodiment, please refer to fig. 1.
Referring to fig. 1, the invention provides a flexible circuit board etching processing method capable of preventing a copper layer from cracking, comprising the following steps:
s1: preparing a substrate for manufacturing a flexible circuit board, selecting a plurality of layers of substrates attached with copper foil, wherein the thickness of the copper layer is 10um, and the thickness of the substrate is 45um;
s2: stacking and baking the multi-layer base material, wherein the baking temperature is 100 ℃, and the baking time is 50min;
s3: drilling holes at corresponding positions on the surface of the base material, and carrying out metallization treatment on the drilled holes;
s4: electroplating the whole plate of the base material;
s5: electroplating a base material, treating the base material with 1% dilute sulfuric acid, drying at a high temperature, placing the base material in an inserting frame, and waiting for a dry film to be pasted for pattern transfer, wherein the drying temperature is 75 ℃;
s6: the dried base material adopts a primary pattern transfer film;
s7: precisely pressing the base material and the copper plating dry film, and performing exposure treatment after pressing;
s8: developing the base material after exposure treatment for one time to expose the area to be etched;
s9: etching the etching area on the substrate to form a circuit on the surface of the substrate, wherein the etching standard line is 2mm & lt 0.25mm, and the etching standard line is within +/-0.02mm to obtain a circuit board;
s10: removing the copper plating dry film from the surface of the circuit board, and chemically cleaning and drying the base material at the drying temperature of 70 ℃;
s11: after the copper plating dry film is removed, copper is electroplated on the copper layer of the etched area, wherein the thickness of the electroplated copper is 5um;
s12: spraying a high-temperature insulating coating layer around the circuit and the circuit, and naturally drying in a normal-temperature ventilation environment;
s13: and detecting the circuit of the circuit board, and packaging and warehousing after detection.
In the embodiment, a substrate for manufacturing a flexible circuit board is prepared, a plurality of layers of substrates attached with copper foil are selected, the thickness of the copper layer is 10um, the thickness of the substrate is 45um, then the plurality of layers of substrates are stacked and baked, the baking temperature is 100 ℃, the baking time is 50min, holes are drilled at corresponding positions on the surfaces of the substrates, the drilled holes are metallized, the substrates are plated on the whole board, 1% dilute sulfuric acid is adopted after the substrates are plated, the substrates are dried at a high temperature of 75 ℃, then a frame is inserted and placed, a dry film is waited for pattern transfer, the dried substrates adopt a pattern transfer film once, the substrates and the copper plating dry film are precisely pressed, exposure treatment is carried out after the pressing, the substrates after the exposure treatment are developed once, the method comprises the steps of exposing a region to be etched on a substrate, carrying out etching treatment on the etched region on the substrate, forming a circuit on the surface of the substrate, carrying out etching standard lines within +/-0.02mm after etching to obtain a circuit board, removing a copper plating dry film from the surface of the circuit board, carrying out chemical cleaning and drying on the substrate, carrying out electroplating copper on a copper layer of the etched region at the drying temperature of 70 ℃, carrying out electroplating copper with the thickness of 5um, spraying a high-temperature insulating coating layer around the circuit and the circuit, naturally drying in a normal-temperature ventilation environment, finally detecting the circuit of the circuit board, and carrying out packaging and warehousing after detection, thereby realizing the purposes of preventing the copper layer on the circuit board from cracking and improving the durability of the circuit board.
In a second embodiment, please refer to fig. 2.
Referring to fig. 2, the invention provides a method for etching a flexible circuit board capable of preventing a copper layer from cracking, comprising the following steps:
s1: preparing a substrate for manufacturing a flexible circuit board, selecting a plurality of layers of substrates attached with copper foil, wherein the thickness of the copper layer is 11um, and the thickness of the substrate is 50um;
s2: stacking and baking the multi-layer base material, wherein the baking temperature is 120 ℃, and the baking time is 55min;
s3: drilling holes at corresponding positions on the surface of the base material, and carrying out metallization treatment on the drilled holes;
s4: electroplating the whole plate of the base material;
s5: electroplating a base material, adopting 2% dilute sulfuric acid for treatment, drying at high temperature, then placing in a rack, waiting for pattern transfer of a dry film, and drying at 80 ℃;
s6: the dried base material adopts a primary pattern transfer film;
s7: precisely pressing the base material and the copper plating dry film, and performing exposure treatment after pressing;
s8: developing the base material after exposure treatment for one time to expose the area to be etched;
s9: etching the etching area on the substrate to form a circuit on the surface of the substrate, wherein the etching standard line is 2mm & lt 0.25mm, and the etching standard line is within +/-0.02mm to obtain a circuit board;
s10: removing the copper plating dry film from the surface of the circuit board, and chemically cleaning and drying the base material at the drying temperature of 75 ℃;
s11: after the copper plating dry film is removed, copper is electroplated on the copper layer of the etched area, wherein the thickness of the electroplated copper is 10um;
s12: spraying a high-temperature insulating coating layer around the circuit and the circuit, and naturally drying in a normal-temperature ventilation environment;
s13: and detecting the circuit of the circuit board, and packaging and warehousing after detection.
In the embodiment, a substrate for manufacturing a flexible circuit board is prepared, a plurality of layers of substrates attached with copper foil are selected, the thickness of the copper layer is 11um, the thickness of the substrate is 50um, then the layers of substrates are stacked and baked, the baking temperature is 120 ℃, the baking time is 55min, holes are drilled at corresponding positions on the surfaces of the substrates, the drilled holes are metallized, the substrates are plated on the whole board, 1% dilute sulfuric acid is adopted after the substrates are plated, the substrates are dried at a high temperature of 80 ℃, then a frame is inserted and placed, a dry film is waited for pattern transfer, the dried substrates adopt a pattern transfer film once, the substrates and the copper plating dry film are precisely pressed, exposure treatment is carried out after the pressing, the substrates after the exposure treatment are developed once, the method comprises the steps of exposing a region to be etched on a substrate, carrying out etching treatment on the etched region on the substrate, forming a circuit on the surface of the substrate, carrying out etching standard lines within +/-0.02mm after etching to obtain a circuit board, removing a copper plating dry film from the surface of the circuit board, carrying out chemical cleaning and drying on the substrate, carrying out copper electroplating on a copper layer of the etched region at the drying temperature of 75 ℃, carrying out high-temperature insulating coating layer spraying on the periphery of the circuit and the circuit, naturally drying under a normal-temperature ventilation environment, finally detecting the circuit of the circuit board, and packaging and warehousing after detection, so that the copper layer on the circuit board can be prevented from cracking, and the durability of the circuit board is improved.
In a third embodiment, please refer to fig. 3.
Referring to fig. 3, the invention provides a method for etching a flexible circuit board capable of preventing a copper layer from cracking, comprising the following steps:
s1: preparing a substrate for manufacturing a flexible circuit board, selecting a plurality of layers of substrates attached with copper foil, wherein the thickness of the copper layer is 12um, and the thickness of the substrate is 55um;
s2: stacking and baking the multi-layer base material, wherein the baking temperature is 140 ℃, and the baking time is 60 minutes;
s3: drilling holes at corresponding positions on the surface of the base material, and carrying out metallization treatment on the drilled holes;
s4: electroplating the whole plate of the base material;
s5: electroplating a base material, treating the base material with 3% dilute sulfuric acid, drying at high temperature, placing the base material in a rack, and waiting for a dry film to be pasted for pattern transfer, wherein the drying temperature is 85 ℃;
s6: the dried base material adopts a primary pattern transfer film;
s7: precisely pressing the base material and the copper plating dry film, and performing exposure treatment after pressing;
s8: developing the base material after exposure treatment for one time to expose the area to be etched;
s9: etching the etching area on the substrate to form a circuit on the surface of the substrate, wherein the etching standard line is 2mm & lt 0.25mm, and the etching standard line is within +/-0.02mm to obtain a circuit board;
s10: removing the copper plating dry film from the surface of the circuit board, and chemically cleaning and drying the base material at 80 ℃;
s11: after the copper plating dry film is removed, copper is electroplated on the copper layer of the etched area, wherein the thickness of the electroplated copper is 15um;
s12: spraying a high-temperature insulating coating layer around the circuit and the circuit, and naturally drying in a normal-temperature ventilation environment;
s13: and detecting the circuit of the circuit board, and packaging and warehousing after detection.
In the embodiment, a substrate for manufacturing a flexible circuit board is prepared, a plurality of layers of substrates attached with copper foil are selected, the thickness of the copper layer is 12um, the thickness of the substrate is 55um, then the plurality of layers of substrates are stacked and baked, the baking temperature is 140 ℃, the baking time is 60min, holes are drilled at corresponding positions on the surfaces of the substrates, the drilled holes are metallized, the substrates are plated on the whole board, 1% dilute sulfuric acid is adopted after the substrates are plated, the substrates are dried at a high temperature of 85 ℃, then a frame is inserted and placed, a dry film is waited for pattern transfer, the dried substrates adopt a pattern transfer film once, the substrates and the copper plating dry film are precisely pressed, exposure treatment is carried out after the pressing, the substrates after the exposure treatment are developed once, the method comprises the steps of exposing a region to be etched on a substrate, carrying out etching treatment on the etched region on the substrate, forming a circuit on the surface of the substrate, carrying out etching standard lines within +/-0.02mm after etching to obtain a circuit board, removing a copper plating dry film from the surface of the circuit board, carrying out chemical cleaning and drying on the substrate, carrying out electroplating copper on a copper layer of the etched region at the drying temperature of 80 ℃, carrying out electroplating copper with the thickness of 15um, spraying a high-temperature insulating coating layer around the circuit and the circuit, naturally drying in a normal-temperature ventilation environment, finally detecting the circuit of the circuit board, and carrying out packaging and warehousing after detection, thereby realizing the purposes of preventing the copper layer on the circuit board from cracking and improving the durability of the circuit board.
The above disclosure is only a preferred embodiment of the present invention, and it should be understood that the scope of the invention is not limited thereto, and those skilled in the art will appreciate that all or part of the procedures described above can be performed according to the equivalent changes of the claims, and still fall within the scope of the present invention.
Claims (7)
1. The flexible circuit board etching processing method capable of preventing the copper layer from cracking is characterized by comprising the following steps of:
preparing a substrate for manufacturing a flexible circuit board, and selecting a plurality of layers of substrates attached with copper foil;
stacking and baking the multi-layer base material;
drilling holes at corresponding positions on the surface of the base material, and carrying out metallization treatment on the drilled holes;
electroplating the whole plate of the base material;
electroplating the base material, treating with 1-3% dilute sulfuric acid, drying at high temperature, placing in a rack, and waiting for pattern transfer by pasting a dry film;
the dried base material adopts a primary pattern transfer film;
precisely pressing the base material and the copper plating dry film, and performing exposure treatment after pressing;
developing the base material after exposure treatment for one time to expose the area to be etched;
etching the etching area on the substrate to form a circuit on the surface of the substrate to obtain a circuit board;
removing the copper plating dry film from the surface of the circuit board, and chemically cleaning and drying the substrate;
removing the copper plating dry film, and electroplating copper on the copper layer of the etched area;
spraying a high-temperature insulating coating layer around the circuit and the circuit, and naturally drying in a normal-temperature ventilation environment;
and detecting the circuit of the circuit board, and packaging and warehousing after detection.
2. The method for etching a flexible circuit board capable of preventing cracking of a copper layer according to claim 1, wherein in the step of selecting a plurality of layers of the substrate to which copper foil is attached in the substrate to be manufactured for the flexible circuit board:
the thickness of the copper layer is 10-12 um, and the thickness of the base material is 45-55 um.
3. The method for etching a flexible circuit board capable of preventing cracking of a copper layer according to claim 1, wherein in the step of subjecting the plurality of layers to a substrate stacking bake:
the baking temperature is 100-140 ℃ and the baking time is 50-60 min.
4. The method for etching a flexible printed circuit board capable of preventing cracking of a copper layer according to claim 1, wherein after the base material is electroplated, the base material is treated with 1-3% dilute sulfuric acid and dried at a high temperature, and then placed in an insertion frame, and the dry film is waited for pattern transfer:
the drying temperature is 75-85 ℃.
5. The method for etching a flexible printed circuit board capable of preventing cracking of a copper layer according to claim 1, wherein in the step of etching the etched area on the substrate to form a circuit on the surface of the substrate, a circuit board is obtained:
the etch standard line is 2mm &0.25mm, which must be within +/-0.02mm after etching.
6. The method for etching a flexible circuit board capable of preventing cracking of a copper layer according to claim 1, wherein in the step of removing the copper-plated dry film from the surface of the circuit board, the substrate is chemically cleaned and dried:
the drying temperature is 70-80 ℃.
7. The method for etching a flexible circuit board capable of preventing cracking of a copper layer according to claim 1, wherein after removing the copper plating dry film, by electroplating copper on the copper layer in the etched area:
the thickness of the electroplated copper is 5-15 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310582172.3A CN116801515A (en) | 2023-05-23 | 2023-05-23 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310582172.3A CN116801515A (en) | 2023-05-23 | 2023-05-23 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116801515A true CN116801515A (en) | 2023-09-22 |
Family
ID=88033843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310582172.3A Pending CN116801515A (en) | 2023-05-23 | 2023-05-23 | Flexible circuit board etching processing method capable of preventing copper layer from cracking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116801515A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100571726B1 (en) * | 2005-11-02 | 2006-04-17 | (주)플렉스컴 | Rigid flexible printed circuit board and manufacturing method thereof |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
| CN112969300A (en) * | 2021-01-28 | 2021-06-15 | 盐城维信电子有限公司 | Etching processing method for flexible circuit board |
| CN113891569A (en) * | 2021-10-26 | 2022-01-04 | 广东工业大学 | Circuit shape-preserving etching manufacturing method based on semi-additive method |
| CN113993303A (en) * | 2021-10-27 | 2022-01-28 | 上海天承化学有限公司 | Method for metallizing holes of mixed-pressure circuit board |
| CN114928945A (en) * | 2022-05-27 | 2022-08-19 | 珠海达汉电子科技有限公司 | Manufacturing process of superfine circuit printed circuit board |
| CN114980518A (en) * | 2022-05-23 | 2022-08-30 | 海顺电子科技(珠海)有限公司 | Production process of flexible circuit board |
-
2023
- 2023-05-23 CN CN202310582172.3A patent/CN116801515A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100571726B1 (en) * | 2005-11-02 | 2006-04-17 | (주)플렉스컴 | Rigid flexible printed circuit board and manufacturing method thereof |
| CN112654169A (en) * | 2020-11-09 | 2021-04-13 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with bending requirement |
| CN112969300A (en) * | 2021-01-28 | 2021-06-15 | 盐城维信电子有限公司 | Etching processing method for flexible circuit board |
| CN113891569A (en) * | 2021-10-26 | 2022-01-04 | 广东工业大学 | Circuit shape-preserving etching manufacturing method based on semi-additive method |
| CN113993303A (en) * | 2021-10-27 | 2022-01-28 | 上海天承化学有限公司 | Method for metallizing holes of mixed-pressure circuit board |
| CN114980518A (en) * | 2022-05-23 | 2022-08-30 | 海顺电子科技(珠海)有限公司 | Production process of flexible circuit board |
| CN114928945A (en) * | 2022-05-27 | 2022-08-19 | 珠海达汉电子科技有限公司 | Manufacturing process of superfine circuit printed circuit board |
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