CN202931661U - Circuit substrate, substrate module and display device - Google Patents
Circuit substrate, substrate module and display device Download PDFInfo
- Publication number
- CN202931661U CN202931661U CN201090001489.XU CN201090001489U CN202931661U CN 202931661 U CN202931661 U CN 202931661U CN 201090001489 U CN201090001489 U CN 201090001489U CN 202931661 U CN202931661 U CN 202931661U
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- Prior art keywords
- mark
- touch
- alignment mark
- screen
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Position Input By Displaying (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- User Interface Of Digital Computer (AREA)
Abstract
The utility model provides a circuit substrate for raising visuality of analignment marks. During the process of manufacturing a substrate module for electric connection of a touch screen (20) and FPC (50), as an analignment mark of FPC (50) is prepared from a non-transparent metal film, visuality is high. Thus, if an analignment mark (25) of the touch screen (20) is also prepared from the non-transparent metal film, visuality of the analignment mark (25) is high as well. By the use of the analignment marks with high visuality for position alignment, it can be easy to carry out position alignment of the touch screen (20) and FPC (50) with high precision. It results in that the yield of the substrate module is increased and there is no need in improving an alignment apparatus used for position alignment. Therefore, manufacturing cost of the substrate module can be reduced.
Description
Technical field
The present invention relates to circuit substrate, substrate module and display unit, relate in particular to the circuit substrate, substrate module and the display unit that are formed with for the alignment mark that is connected with flexible printed circuit board.
Background technology
In the past, as the connector members that is used for the circuit substrates such as touch-screen are electrically connected with electronic devices and components, the use flexible printed circuit board (flexible print circuit: Flexible Printed Circuit, hereinafter referred to as " FPC ").Anisotropic conductive adhesive sheet (anisotropic conductive film: Anisotropic Conductive Film, hereinafter referred to as " ACF ") is clipped in the middle FPC and circuit substrate is received in hot pressing.At this moment, utilize near be arranged on circuit substrate and the FPC join domain separately alignment mark, circuit substrate and FPC are carried out position alignment, under the splicing ear of circuit substrate and the splicing ear of FPC state devious, not to be connected.
The alignment mark of FPC is formed by the Copper Foil identical with the wiring of FPC.Because copper is the lower metal of light transmission (below, be called " opaque metal "), therefore, the visuality of the alignment mark that is formed by Copper Foil is higher.
On the other hand, in the zone of the removal diaphragm on substrate, the alignment mark of circuit substrate mostly and splicing ear arrange in the lump.If form splicing ear with the opaque metal film, the then moisture in the easy absorbing air of splicing ear and corrosion.In addition, if form splicing ear with the stacked film of indium tin oxide (Indium Tin Oxide is hereinafter referred to as " ITO ") film and opaque metal film, easy the peeling off at the interface at ITO film and opaque metal film of ITO film then.Like this, comprise in the situation of opaque metal film at the splicing ear of circuit substrate, existence can't be guaranteed the problem of reliability of the coupling part of FPC and circuit substrate.And, if only form the splicing ear of circuit substrate with the ITO film, then can address the above problem.Further, if alignment mark is also formed by the ITO film, then alignment mark and splicing ear do not have position deviation, therefore, can carry out to degree of precision the position alignment of circuit substrate and FPC.
Record the manufacture method of liquid crystal indicator in the Japanese patent laid-open 7-128675 communique, in this liquid crystal indicator, be difficult for observing the transparency electrode of display part, and observe easily transparency electrode and the alignment mark of portion of terminal.These electrodes and mark are formed on the insulated substrate by the ITO film.On the transparency electrode of portion of terminal and after the organic film of alignment mark formation solubility, insulated substrate is heat-treated.The transparency electrode of display part is oxidized because of heat treatment, and therefore, its transmissivity is high before than heat treatment.But, owing to transparency electrode and the alignment mark of portion of terminal covered by organic film, therefore, can be not oxidized because of heat treatment.Thus, improve the display quality of display part, and so that observe easily transparency electrode and the alignment mark of portion of terminal.
The prior art document
Patent documentation
Patent documentation 1: Japanese patent laid-open 7-128675 communique
Summary of the invention
Invent technical problem to be solved
But in the situation of the alignment mark that only forms circuit substrate with the ITO film, the light transmission of ITO film is very high, is more than 80%, therefore, when FPC and circuit substrate are carried out position alignment, is difficult to observe the alignment mark of circuit substrate.Therefore, when making FPC with substrate module that circuit substrate is electrically connected, if with the position alignment of only being carried out circuit substrate and FPC by the film formed alignment mark of ITO, easy occurrence positions deviation between circuit substrate and the FPC then, the rate of finished products of substrate module reduces.In addition, if improve the rate of finished products of substrate module and transform alignment device so that observe only by the film formed alignment mark of ITO easily, then need improvement expenses.Like this, if use only by the film formed alignment mark of ITO, circuit substrate and use the manufacturing cost of the substrate module of this circuit substrate to increase then.
In addition, control in the method for utilizing Japanese patent laid-open 7-128675 communique to put down in writing in the situation of transmissivity of ITO film, except heat treatment step, also need only portion of terminal to be formed the operation of organic film and the operation of peeling off formed organic film behind the heat treatment step before the heat treatment step.Consequently, the manufacturing cost of liquid crystal indicator increases.In addition, in the method that patent documentation 1 is put down in writing, before and after heat treatment step, the transparency electrode of portion of terminal and the transmissivity of alignment mark do not change.Thereby the method for namely using patent documentation 1 to put down in writing is heat-treated insulated substrate, and the visuality of alignment mark also can not get improving.
Therefore, the circuit substrate that the object of the present invention is to provide a kind of visuality that makes alignment mark to be improved.
The technical scheme that the technical solution problem adopts
A first aspect of the present invention relates to the circuit substrate that possesses insulated substrate, it is characterized in that, comprising:
Splicing ear, this splicing ear are formed on the described insulated substrate and are used for being electrically connected with flexible printed circuit board; And
The first alignment mark, this first alignment mark are used for carrying out position alignment with described flexible printed circuit board,
Described splicing ear is formed by nesa coating,
Described the first alignment mark comprises the first mark that is formed by opaque conductive film.
A second aspect of the present invention is characterized in that based on a first aspect of the present invention,
Described the first alignment mark only comprises the first mark that is formed by opaque conductive film.
A third aspect of the present invention is characterized in that based on a first aspect of the present invention,
Described the first alignment mark also comprises by film formed the second mark of electrically conducting transparent,
Described the second mark is formed on the upper surface of described the first mark.
A fourth aspect of the present invention is characterized in that based on a first aspect of the present invention,
Described the first alignment mark also comprises by film formed the second mark of electrically conducting transparent,
Described the first mark is formed on the upper surface of described the second mark.
A fifth aspect of the present invention is characterized in that based on a first aspect of the present invention,
Also comprise the first wiring, this first wiring is electrically connected with described splicing ear and is formed by described opaque conductive film,
Described the first mark is formed by the material opaque conductive film identical with described the first wiring.
A sixth aspect of the present invention is characterized in that based on a first aspect of the present invention,
The protected film of described the first alignment mark covers.
A seventh aspect of the present invention is characterized in that based on a first aspect of the present invention,
The described splicing ear of described circuit substrate is only formed by nesa coating.
A eighth aspect of the present invention relates to a kind of substrate module, and this substrate module comprises the related circuit substrate of either side in the first to the 7th aspect of the present invention, and the flexible printed circuit board that is electrically connected with described circuit substrate, it is characterized in that,
Described flexible printed circuit board comprises:
Flexible substrate;
Be formed at the wiring of second on the described flexible substrate;
Be formed near the second alignment mark of described the second wiring,
The splicing ear of described circuit substrate is electrically connected with described the second wiring after described second alignment mark of the first alignment mark that utilizes described circuit substrate and described flexible printed circuit board carries out position alignment.
A ninth aspect of the present invention relates to a kind of display unit, and this display unit comprises the related circuit substrate of either side in the first to the 7th aspect of the present invention, and shows and it is characterized in that the display floater of image,
Described circuit substrate is the touch-screen that also comprises touch sensor, and this touch sensor is formed and detected touch location by nesa coating,
Described display floater is relative with described touch-screen to be disposed.
The invention effect
According to a first aspect of the invention, be formed with the first alignment mark on the circuit substrate, this first alignment mark is used for carrying out position alignment with flexible printed circuit board.Employed light when being contained in the first alignment mark and being reflected in position alignment preferably by the first mark that opaque conductive film forms.Therefore, the visuality of the first alignment mark is higher, can be easily and detect accurately the position of the first alignment mark.If use this first alignment mark, then can easily and accurately flexible printed circuit board and circuit substrate be carried out position alignment, therefore, circuit substrate can be electrically connected with flexible printed circuit board and not produce position deviation.
According to of the present invention second to fourth aspect, the first alignment mark includes the first mark that is formed by opaque conductive film, therefore, has the effect identical with the related circuit substrate of first aspect.
According to a fifth aspect of the invention, the first mark that comprises in the first alignment mark is formed by the opaque conductive film identical with the first wiring, therefore, can form simultaneously the first wiring and the first mark.Thus, manufacturing process can be shortened, therefore, the manufacturing cost of circuit substrate can be reduced.
According to a sixth aspect of the invention, the protected film of the first alignment mark covers, therefore, the first mark that comprises in the first alignment mark in can absorbing air moisture and corrosion.
According to a seventh aspect of the invention, the splicing ear of circuit substrate is only formed by nesa coating.Thus, even the not protected film of splicing ear covers, can be because of airborne moisture corrosion yet, therefore, can guarantee the reliability with the coupling part of flexible printed circuit board.
According to an eighth aspect of the invention, because it is higher to be formed at the visuality of the first alignment mark on the related circuit substrate in above-mentioned the first to the 7th aspect, therefore, carry out position alignment with the second alignment mark that is formed on the flexible printed circuit board easily.Thus, can be easily and accurately flexible printed circuit board is carried out position alignment with circuit substrate and connect.
According to a ninth aspect of the invention, by the circuit substrate that above-mentioned the first to the 7th aspect is related as touch-screen, thereby can obtain to comprise easily and carry out position alignment with flexible printed circuit board accurately and the display unit of the touch-screen that is connected.
Description of drawings
Fig. 1 is the cutaway view of the structure of the related liquid crystal indicator of expression embodiments of the present invention 1.
Fig. 2 is the vertical view of the structure of the substrate module after the touch-screen that comprises in the expression liquid crystal indicator that execution mode 1 is related and FPC are electrically connected.
Fig. 3 (a) is the vertical view of the part of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 1, and Fig. 3 (b) is the cutaway view along the touch-screen of the edge A-A shown in Fig. 3 (a).
Fig. 4 (a) is the vertical view of the part of the FPC that comprises in the related liquid crystal indicator of expression execution mode 1, and Fig. 4 (b) is the figure of the position relationship of the alignment mark after the expression position alignment.
Fig. 5 (a)～(e) is the operation cutaway view of each manufacturing process of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 1.
Fig. 6 (a)～(d) is that the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 1 is connected the operation cutaway view of connection operation with FPC.
Fig. 7 (a) is the vertical view of the part of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 2, and Fig. 7 (b) is the cutaway view along the touch-screen of the edge B-B shown in Fig. 7 (a).
Fig. 8 (a)～(e) is the operation cutaway view of each manufacturing process of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 2.
Fig. 9 is the cutaway view that the touch-screen that comprises in the expression liquid crystal indicator that execution mode 2 is related and FPC carry out the structure of the substrate module after the thermo-compressed.
Figure 10 (a) is the vertical view of the part of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 3, and Figure 10 (b) is the cutaway view along the touch-screen of the edge C-C shown in Figure 10 (a).
Figure 11 (a)～(e) is the operation cutaway view of each manufacturing process of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 3.
Figure 12 is the cutaway view that the touch-screen that comprises in the expression liquid crystal indicator that execution mode 3 is related and FPC carry out the structure of the substrate module after the thermo-compressed.
Figure 13 (a) is the vertical view of the part of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 4, and Figure 13 (b) is the cutaway view along the touch-screen of the edge D-D shown in Figure 13 (a).
Figure 14 (a)～(e) is the operation cutaway view of each manufacturing process of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 4.
Figure 15 is the cutaway view that the touch-screen that comprises in the expression liquid crystal indicator that execution mode 4 is related and FPC carry out the structure of the substrate module after the thermo-compressed.
Figure 16 (a) is the vertical view of the part of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 5, and Figure 16 (b) is the cutaway view along the touch-screen of the edge E-E shown in Figure 16 (a).
Figure 17 (a)～(e) is the operation cutaway view of each manufacturing process of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 5.
Figure 18 is the cutaway view that the touch-screen that comprises in the expression liquid crystal indicator that execution mode 5 is related and FPC carry out the structure of the substrate module after the thermo-compressed.
Figure 19 (a) is the vertical view of the part of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 6, and Figure 19 (b) is the cutaway view along the touch-screen of the edge F-F shown in Figure 19 (a).
Figure 20 (a)～(e) is the operation cutaway view of each manufacturing process of the touch-screen that comprises in the related liquid crystal indicator of expression execution mode 6.
Figure 21 is the cutaway view that the touch-screen that comprises in the expression liquid crystal indicator that execution mode 6 is related and FPC carry out the structure of the substrate module after the thermo-compressed.
Embodiment
＜1. execution mode 1 〉
The structure of＜1.1 liquid crystal indicators 〉
Fig. 1 is the cutaway view of the structure of the related liquid crystal indicator 10 of expression embodiments of the present invention 1.As shown in Figure 1, liquid crystal indicator 10 comprises liquid crystal panel 70, is fixed in the touch-screen 20 of upper surface of liquid crystal panel 70 and the backlight unit 80 of being located at the lower surface of liquid crystal panel 70 by adhesive member 60.
The user's visually affirmation on one side that possesses the electronic installation of liquid crystal indicator 10 is disposed at the displaying contents of the liquid crystal panel 70 of touch-screen 20 rear side, directly contact touch-screen 20 with finger, pen etc. on one side, thereby the various functions of electronic installation are controlled.As shown in Figure 1, liquid crystal panel 70 comprises active-matrix substrate opposite each other 71 and relative substrate 72, and is clipped in the liquid crystal layer 73 between these substrates 71,72.Backlight unit 80 is 70 irradiation light from rear side to liquid crystal panel.
Fig. 2 is the vertical view that expression is electrically connected to FPC 50 structure of the substrate module 40 behind the touch-screen shown in Figure 1 20.As shown in Figure 2, substrate module 40 comprises touch-screen 20 and FPC 50.Touch-screen 20 comprises the insulated substrates 21 such as glass substrate, be formed at a plurality of touch sensors 22 on the insulated substrate, many lead-out wirings 23, be located at the end of insulated substrate 21 and be formed with the join domain 24 of a plurality of splicing ears (not shown).
It is banded that the shape of touch sensor 22 is, and a plurality of touch sensors 22 dispose parallelly.Touch sensor 22 is connected with a plurality of splicing ears of formation in the join domain 24 respectively via lead-out wiring 23.This touch-screen 20 is touch-screens of static capacity coupled modes, therefore, and in order to improve the accuracy of identification of touch location, touch sensor 22 is preferably high resistance, and in order not reduce the display quality of liquid crystal panel 70, touch sensor 22 is preferably formed by the material of high-transmission rate.Therefore, touch sensor 22 is formed at the transparent metal oxide film more than 80% by transmissivities such as ITO film, indium-zinc oxide (Indium Zinc Oxide is hereinafter referred to as " IZO ") films.
Lead-out wiring 23 is preferably low resistance, therefore, by metal films such as aluminium (Al), molybdenum (Mo), titanium nitride (TiN) or with they stacked and the laminated metal film form.The transmissivity of these metal films is for below the number %, and transmissivity is lower, and therefore, the below is called the opaque metal film sometimes.
The splicing ear of join domain 24 is only formed by the ITO film, and an end of splicing ear is electrically connected with lead-out wiring 23.Touch sensor 22 and lead-out wiring 23 protected films (not shown) cover, and the join domain 24 that comprises splicing ear not protected film cover.
The outside at the join domain 24 of touch-screen 20 is formed with alignment mark 25, is formed with alignment mark 53 at the two ends of FPC 50.When being carried out position alignment, touch-screen 20 and FPC 50 use alignment mark 25,53.Fig. 3 (a) is the alignment mark 25 of expression touch-screen 20 and the vertical view of join domain 24, is the figure after the part (by the zone of oval dotted line) of Fig. 2 is amplified.Fig. 3 (b) is the cutaway view along the touch-screen 20 of the edge A-A shown in Fig. 3 (a).Fig. 4 (a) is wiring (splicing ear) 52 of a part of expression FPC 50 and the vertical view of alignment mark 53, and Fig. 4 (b) is the figure of the position relationship between the alignment mark 53 of the alignment mark 25 of the touch-screen 20 after the expression position alignment and FPC 50.
Shown in Fig. 3 (a) and Fig. 3 (b), in the join domain 24 of touch-screen 20, be formed with a plurality of splicing ears 28 parallel to each other.Splicing ear 28 be connected by the film formed lead-out wiring 23 of the opaque metals such as aluminium.Be formed with alignment mark 25 on the right side of join domain 24.Alignment mark 25 only comprises by the film formed rectangular-shaped mark of opaque metal.The lip-deep diaphragm 29 that is formed at touch-screen 20 covers alignment mark 25 and lead-out wiring 23, but does not cover splicing ear 28.In addition, because Fig. 3 (a) and Fig. 3 (b) only illustrate the part of touch-screen 20, although therefore not shown among Fig. 3 (a) and Fig. 3 (b), also be formed with alignment mark 25 in the left side of join domain 24.In addition, shown in Fig. 3 (b), FPC 50 is configured in the top of touch-screen 20.
Shown in Fig. 4 (a), in FPC 50, be formed with the alignment mark 53 of opaque metal film with the central authorities frame shape after by rectangular-shaped removal.Thereby, shown in Fig. 4 (b), FPC 50 moved so that the alignment mark 25 of touch-screen 20 is incorporated in the frame of alignment mark 53 of FPC 50, thereby, can carry out position alignment to touch-screen 20 and FPC 50.In addition, the alignment mark 25 shown in Fig. 4 (b), 53 shape are examples, also can be other shapes.
The manufacture method of＜1.2 touch-screens 〉
Fig. 5 (a)～Fig. 5 (e) is the operation cutaway view of each manufacturing process of expression touch-screen 20.Shown in Fig. 5 (a), by sputtering method, for example form aluminium film 31 as the opaque metal film at the insulated substrates such as glass substrate 21.Then, shown in Fig. 5 (b), utilize photoetching process, aluminium film 31 is carried out patterning, to form lead-out wiring (not shown) and alignment mark 25.Thus, form simultaneously lead-out wiring and alignment mark 25, thereby can simplify manufacturing process.
Shown in Fig. 5 (c), for example form ITO film 32 as the transparent metal oxide film, to cover whole insulated substrate 21.Then, shown in Fig. 5 (d), utilize photoetching process, ITO film 32 is carried out patterning, to form touch sensor (not shown) and splicing ear 28.Thus, an end of lead-out wiring is electrically connected with touch sensor, the other end of lead-out wiring is electrically connected with splicing ear 28.
Shown in Fig. 5 (e), cover the join domain that is formed with splicing ear 28 with metal mask, utilize sputtering method or CVD(chemical vapour deposition (CVD): Chemical Vapor Deposition) method forms diaphragm 29.Diaphragm 29 forms the whole insulated substrate 21 that covers except splicing ear 28.Diaphragm 29 is formed by the stacked film such as any or they of silicon oxide film, silicon nitride film or organic film etc.
Like this, the alignment mark 25 of touch-screen 20 is formed by the opaque metal film identical with lead-out wiring, and splicing ear 28 is formed by the transparent metal oxide film.And alignment mark 25 covers with lead-out wiring, touch sensor etc. in the lump protected film 29.In this case, only append the pattern of alignment mark 25 by the photomask that uses to aluminium film 31 patterning the time, just can be by forming touch-screen 20 with in the past identical manufacturing process.
The manufacture method of＜1.3 substrate modules 〉
Fig. 6 (a)～Fig. 6 (e) is the operation cutaway view of the expression touch-screen 20 connection operation of being connected with FPC.Shown in Fig. 6 (a), prepare the touch-screen 20 that produces by above-mentioned manufacture method.Then, shown in Fig. 6 (b), rectangle ACF 30 is pasted touch-screen 20, in order to not only cover splicing ear 28, also cover alignment mark 25 fully.
Shown in Fig. 6 (c), configuration FPC 50 above touch-screen 20 arranges mark identification camera 55 below touch-screen 20.Planar mobile or rotation FPC 50 adjusts the position of FPC 50 all around, so that the alignment mark 25 of touch-screen 20 is incorporated in the frame of alignment mark 53 of FPC 50 (with reference to Fig. 4 (b)).Employed 2 alignment marks 25 of this position alignment, 53 form by opaque metal.Thus, mark identification identifies alignment mark 25,53 easily with camera 55, therefore, and can be easily and carry out accurately position alignment.
Shown in Fig. 6 (d), for the touch-screen 20 after the position alignment and FPC 50 are carried out thermo-compressed, the heater head 56 of the top that is configured in FPC 50 is descended.Because heater head 56 is heated, therefore, FPC 50 is pressed down by the heater head and descends, and carries out thermo-compressed with touch-screen 20.Consequently, the wiring of FPC 50 (splicing ear) 52 is electrically connected without position deviation ground with the splicing ear 28 of touch-screen 20 via ACF 30.In addition, splicing ear 28 is only formed by the ITO film, therefore, can guarantee the reliability with the coupling part of the wiring (splicing ear) 52 of FPC 50.
＜1.4 effects 〉
As above illustrated, the alignment mark 25 of touch-screen 20 only comprises by the film formed mark of the high opaque metal of reflectivity, therefore, and employed light in the time of being reflected in position alignment preferably.Position alignment is carried out with this reverberation, and therefore, the visuality of alignment mark 25 is higher, can be easily and detect accurately the position of alignment mark 25.Like this, if use alignment mark 25, then can be easily and carry out accurately position alignment, therefore, touch-screen 20 and FPC 50 can be electrically connected and not produce position deviation.Accordingly, can improve the rate of finished products of substrate module 40.In addition, because the visuality of the alignment mark 25 of touch-screen 20 is higher, therefore, need not to transform alignment device.Thereby the manufacturing cost that can suppress substrate module 40 increases.
The splicing ear 28 of touch-screen 20 is only formed by the ITO film, therefore is difficult for being corroded.Therefore, can guarantee the reliability of the coupling part of touch-screen 20 and FPC 50.And only the part of the pattern by changing the photomask that uses when the patterning just can form alignment mark 25, therefore, need not to append the coming of new operation or changes and have manufacturing process now.
＜2. execution mode 2～6 〉
The structure of the liquid crystal indicator that the execution mode 2～6 that the following describes is related is identical with the structure of liquid crystal indicator 10 shown in Figure 1.In addition, it is identical with the structure of substrate module 40 shown in Figure 2 to comprise the structure of substrate module of touch-screen.Thereby, in each following execution mode, omit figure and the explanation thereof of liquid crystal indicator and substrate module.And vertical view and cutaway view thereof based on after the part corresponding with the part (by the zone that oval-shaped dotted line surrounded) of touch-screen 20 shown in Figure 2 amplified describe each execution mode.
＜2.1 execution modes 2 〉
The vertical view of Fig. 7 (a) after to be expression to the part of the touch-screen 120 that comprises in the related liquid crystal indicator of execution mode 2 amplify, Fig. 7 (b) is the cutaway view along the touch-screen 120 of the edge B-B shown in Fig. 7 (a).Describe centered by the structural elements in the structural element of touch-screen 120 shown in Fig. 7 (a) and Fig. 7 (b), different from the structural element of touch-screen 20 shown in Fig. 3 (a) and Fig. 3 (b), to identical structural element mark identical with reference to label, and the description thereof will be omitted.
Shown in Fig. 7 (a) and Fig. 7 (b), with the splicing ear 28 of touch-screen 20 similarly, the splicing ear 28 of touch-screen 120 is only formed by the ITO film, the not protected film 29 of join domain 24 that comprises splicing ear 28 covers.But; the alignment mark 125 of touch-screen 120 is with film formed rectangular-shaped mark 125b carries out the mark of the stepped construction after stacked by transparent metal oxide by the film formed rectangular-shaped mark 125a of the opaque metal identical with lead-out wiring 23 with at the upper surface of mark 125a, and alignment mark 125 protected films 29 cover.Like this, because alignment mark 125 comprises that therefore, the visuality of alignment mark 125 is higher during position alignment by the film formed rectangular-shaped mark 125a of opaque metal.
Fig. 8 (a)～Fig. 8 (e) is the operation cutaway view of each manufacturing process of expression touch-screen 120.Describe centered by the manufacturing processes in manufacturing process shown in Fig. 8 (a)～Fig. 8 (e), different from manufacturing process shown in Fig. 5 (a)～Fig. 5 (e), to identical manufacturing process mark identical with reference to label, and the description thereof will be omitted.
Identical with situation shown in Fig. 5 (a) and Fig. 5 (b), shown in Fig. 8 (a) and Fig. 8 (b), the aluminium film 31 that is formed on the insulated substrate 21 is carried out patterning, form lead-out wiring (not shown) and mark 125a.Then, shown in Fig. 8 (c), form ITO film 32 to cover whole insulated substrate 21.
Shown in Fig. 8 (d), utilize photoetching process, ITO film 32 is carried out patterning, form touch sensor (not shown) and splicing ear 28, and, on the upper surface of mark 125a, also utilize the ITO film to form the mark 125b identical shaped with mark 125a.Thus, be formed on the stacked alignment mark 125 that the stepped construction of mark 125b is arranged of upper surface of mark 125a.Manufacturing process shown in Fig. 8 (e) is identical with manufacturing process shown in Fig. 5 (e), and therefore, the description thereof will be omitted.In this case, only append respectively the pattern of alignment mark 125 by each photomask that uses to aluminium film 31 and ITO film 32 patterning the time, just can be by forming alignment mark 125 with in the past identical manufacturing process.
The manufacture method of substrate module 140 is identical with the manufacture method of substrate module 40 shown in Figure 6, and therefore, the description thereof will be omitted.To be expression carry out the cutaway view of the structure of the substrate module 140 after the thermo-compressed with touch-screen 120 and FPC 50 to Fig. 9.As shown in Figure 9, the splicing ear 52 of FPC 50 is connected with the splicing ear 28 of touch-screen 20 via ACF 30.In addition, carry out position alignment so that the alignment mark 53 of FPC 50 surrounds the alignment mark 125 of touch-screen 120.
Because touch-screen 120 and substrate module 140 have the effect identical with the touch-screen 20 of execution mode 1 and substrate module 40, therefore, the description thereof will be omitted.
＜2.3 execution modes 3 〉
The vertical view of Figure 10 (a) after to be expression to the part of the touch-screen 220 that comprises in the related liquid crystal indicator of execution mode 3 amplify, Figure 10 (b) is the cutaway view along the touch-screen 220 of the edge C-C shown in Figure 10 (a).Describe centered by the structural elements in the structural element of touch-screen 220 shown in Figure 10 (a) and Figure 10 (b), different from the structural element of touch-screen 120 shown in Fig. 7 (a) and Fig. 7 (b), to identical structural element mark identical with reference to label, and the description thereof will be omitted.
The splicing ear 28 of touch-screen 220 is similarly formed by the ITO film with the splicing ear 28 of touch-screen 120, and the not protected film 29 of join domain 24 that comprises splicing ear 28 covers.But; the alignment mark 225 of touch-screen 220 be with by the film formed rectangular-shaped mark 225b of transparent metal oxide with film formed rectangular-shaped mark 225a carries out the mark of the stepped construction after stacked by the opaque metal identical with lead-out wiring 23 at the upper surface of mark 225b, alignment mark 225 protected films 29 cover.The alignment mark 225 of present embodiment is that 2 mark 125a, the 125b that the alignment mark 125 with execution mode 2 comprises turn upside down stacked mark.Like this, because alignment mark 225 comprises that therefore, the visuality of alignment mark 225 is higher during position alignment by the film formed rectangular-shaped mark 225a of opaque metal.
Figure 11 (a)～Figure 11 (e) is the operation cutaway view of each manufacturing process of expression touch-screen 220.Describe centered by the operations in manufacturing process shown in Figure 11 (a)～Figure 11 (e), different from manufacturing process shown in Fig. 5 (a)～Fig. 5 (e), to identical manufacturing process mark identical with reference to label, and the description thereof will be omitted.
Shown in Figure 11 (a), at first form ITO film 32 at insulated substrate 21.Then, shown in Figure 11 (b), by the ITO film 32 after the film forming is carried out patterning, form splicing ear 28 and the mark 225b of touch sensor (not shown), join domain.
Shown in Figure 11 (c), form aluminium film 31 to cover whole insulated substrate 21.Then, shown in Figure 11 (d), by the aluminium film 31 after the film forming is carried out patterning, form the lead-out wiring (not shown) that touch sensor is connected with splicing ear 28, and form the mark 225a identical with mark 225b shape at the upper surface of mark 225b.Thus, be formed on the alignment mark 225 that is laminated with on the upper surface by the film formed mark 225b of transparent metal oxide by the stepped construction of the film formed mark 225a of opaque metal.Manufacturing process shown in Figure 11 (e) is identical with manufacturing process shown in Fig. 5 (e), and therefore, the description thereof will be omitted.In this case, only append respectively the pattern of alignment mark 225 by each photomask that uses to aluminium film 31 and ITO film 32 patterning the time, just can be by forming alignment mark 225 with in the past identical manufacturing process.
The manufacture method of substrate module 240 is identical with the manufacture method of substrate module 40 shown in Figure 6, and therefore, the description thereof will be omitted.To be expression carry out the cutaway view of the structure of the substrate module 240 after the thermo-compressed with touch-screen 220 and FPC 50 to Figure 12.As shown in figure 12, the splicing ear 52 of FPC 50 is connected with the splicing ear 28 of touch-screen 220 via ACF30.In addition, carry out position alignment so that the alignment mark 53 of FPC 50 surrounds the alignment mark 225 of touch-screen 220.
Because touch-screen 220 and substrate module 240 have the effect identical with the touch-screen 20 of execution mode 1 and substrate module 40, therefore, the description thereof will be omitted.
＜2.3 execution modes 4 〉
The vertical view of Figure 13 (a) after to be expression to the part of the touch-screen 320 that comprises in the related liquid crystal indicator of execution mode 4 amplify, Figure 13 (b) is the cutaway view along the touch-screen 320 of the edge D-D shown in Figure 13 (a).Describe centered by the structural elements in the structural element of touch-screen 320 shown in Figure 13 (a) and Figure 13 (b), different from the structural element of touch-screen 20 shown in Fig. 3 (a) and Fig. 3 (b), to identical structural element mark identical with reference to label, and the description thereof will be omitted.
The alignment mark 25 of touch-screen 20 similarly only comprises by the formed rectangular-shaped mark of opaque metal film shown in the alignment mark 325 of touch-screen 320 shown in Figure 13 (a) and Figure 13 (b) and Fig. 3 (a) and Fig. 3 (b).Thus, because alignment mark 325 only comprises that therefore, visuality is higher when carrying out position alignment by the formed rectangular-shaped mark of opaque metal film.But alignment mark 325 is different from alignment mark 25, and not protected film 29 covers.
Figure 14 (a)～Figure 14 (e) is the operation cutaway view of each manufacturing process of expression touch-screen 320.Manufacturing process shown in Figure 14 (a)～Figure 14 (d) is identical with manufacturing process shown in Fig. 5 (a)～Fig. 5 (d), and therefore, the description thereof will be omitted.Under the state that splicing ear 28 and alignment mark 325 usefulness metal masks are covered, utilize CVD method or sputtering method to form diaphragm 29.Thus, shown in Figure 14 (e), be not only splicing ear 28, alignment mark 325 also not protected film 29 covers.Like this, form alignment mark 325 identical with alignment mark 25 structures and that its surperficial not protected film 29 covers.In this case, only append the pattern of alignment mark 325 by the photomask that uses to aluminium film 31 patterning the time, just can be by forming alignment mark 325 with in the past identical manufacturing process.
The manufacture method of substrate module 340 is identical with the manufacture method of substrate module 40 shown in Figure 6, and therefore, the description thereof will be omitted.To be expression carry out touch-screen 320 and FPC 50 cutaway view of the structure of the substrate module 340 after the thermo-compressed by above-mentioned manufacture method to Figure 15.The splicing ear 52 of FPC 50 is connected with the splicing ear 28 of touch-screen 320 via ACF 30.In addition, carry out position alignment so that the alignment mark 53 of FPC50 surrounds the alignment mark 325 of touch-screen 320.
Because touch-screen 320 and substrate module 340 have the effect identical with the touch-screen 20 of execution mode 1 and substrate module 40, therefore, the description thereof will be omitted.In addition, because the not protected film 29 of opaque metal film that alignment mark 325 comprises covers, therefore, be corroded because of the moisture in the atmosphere easily.But because acting on when FPC 50 carried out position alignment and carry out thermo-compressed of the alignment mark 325 of touch-screen 320 finish, therefore, being corroded thereafter is not a problem yet.
＜2.4 execution modes 5 〉
The vertical view of Figure 16 (a) after to be expression to the part of the touch-screen 420 that comprises in the related liquid crystal indicator of execution mode 5 amplify, Figure 16 (b) is the cutaway view along the touch-screen 420 of the edge E-E shown in Figure 16 (a).Describe centered by the structural elements in the structural element of touch-screen 420 shown in Figure 16 (a) and Figure 16 (b), different from the structural element of touch-screen 120 shown in Fig. 7 (a) and Fig. 7 (b), to identical structural element mark identical with reference to label, and the description thereof will be omitted.
With alignment mark 125 shown in Fig. 7 (a) and Fig. 7 (b) similarly, the alignment mark 425 of touch-screen 420 is with by the film formed rectangular-shaped mark 425a of opaque metal with in that film formed rectangular-shaped mark 425b carries out the mark of the stepped construction after stacked by ITO on the upper surface of mark 425a.Like this, because alignment mark 425 comprises that therefore, the visuality of alignment mark 425 is higher during position alignment by the film formed rectangular-shaped mark 425a of opaque metal.But alignment mark 425 is different from alignment mark 125, and not protected film 29 covers.
Figure 17 (a)～Figure 17 (e) is the operation cutaway view of each manufacturing process of expression touch-screen 420.Manufacturing process shown in Figure 17 (a)～Figure 17 (d) is identical with manufacturing process shown in Fig. 8 (a)～Fig. 8 (d), and therefore, the description thereof will be omitted.Shown in Figure 17 (e), under the state that splicing ear 28 and alignment mark 425 usefulness metal masks are covered, utilize CVD method or sputtering method to form diaphragm 29.Thus, be not only splicing ear 28, alignment mark 425 also not protected film 29 covers.Like this, form and to have the alignment mark 425 that stepped construction and its surface not protected film 29 identical with alignment mark 125 covers.In this case, only append respectively the pattern of alignment mark 425 by each photomask that uses to aluminium film 31 and ITO film 32 patterning the time, just can be by forming alignment mark 425 with in the past identical manufacturing process.
The manufacture method of substrate module 440 is identical with the manufacture method of substrate module 40 shown in Figure 6, and therefore, the description thereof will be omitted.To be expression carry out touch-screen 420 and FPC 50 cutaway view of the structure of the substrate module 440 after the thermo-compressed by above-mentioned manufacture method to Figure 18.The splicing ear 52 of FPC 50 is connected with the splicing ear 28 of touch-screen 420 via ACF 30.In addition, carry out position alignment so that the alignment mark 53 of FPC50 surrounds the alignment mark 425 of touch-screen 420.
Because touch-screen 420 and substrate module 440 have the effect identical with the touch-screen 20 of execution mode 1 and substrate module 40, therefore, the description thereof will be omitted.In addition, because the etching problem of the not protected film 29 of the alignment mark 425 opaque metal film that causes that covers is identical with the situation of touch-screen 320 shown in Figure 13 (a) and Figure 13 (b), therefore, the description thereof will be omitted.
＜2.5 execution modes 6 〉
The vertical view of Figure 19 (a) after to be expression to the part of the touch-screen 520 that comprises in the related liquid crystal indicator of execution mode 6 amplify, Figure 19 (b) is the cutaway view along the touch-screen 520 of the edge F-F shown in Figure 19 (a).Describe centered by the structural elements in the structural element of touch-screen 520 shown in Figure 19 (a) and Figure 19 (b), different from the structural element of touch-screen 220 shown in Figure 10 (a) and Figure 10 (b), to identical structural element mark identical with reference to label, and the description thereof will be omitted.
With alignment mark 225 shown in Figure 10 (a) and Figure 10 (b) similarly, the alignment mark 525 of touch-screen 520 is with by the film formed rectangular-shaped mark 525b of transparent metal oxide with in that film formed rectangular-shaped mark 525a carries out the mark of the stepped construction after stacked by opaque metal on the upper surface of mark 525b.Like this, because alignment mark 525 comprises that therefore, the visuality of alignment mark 525 is higher during position alignment by the film formed rectangular-shaped mark 525a of opaque metal.But different from alignment mark 225, the not protected film 29 of alignment mark 525 covers.
Figure 20 (a)～Figure 20 (e) is the operation cutaway view of each manufacturing process of expression touch-screen 520.Manufacturing process shown in Figure 20 (a)～Figure 20 (d) is identical with manufacturing process shown in Figure 11 (a)～Figure 11 (d), and therefore, the description thereof will be omitted.Under the state that splicing ear 28 and alignment mark 525 usefulness metal masks are covered, utilize CVD method or sputtering method to form diaphragm 29.Thus, shown in Figure 20 (e), be not only splicing ear 28, alignment mark 525 also not protected film 29 covers.Like this, form and to have the alignment mark 525 that stepped construction and its surface not protected film 29 identical with alignment mark 225 covers.In this case, only append respectively the pattern of alignment mark 525 by each photomask that uses to aluminium film 31 and ITO film 32 patterning the time, just can be by forming alignment mark 525 with in the past identical manufacturing process.
The manufacture method of substrate module 540 is identical with the manufacture method of substrate module 40 shown in Figure 6, and therefore, the description thereof will be omitted.To be expression carry out touch-screen 520 and FPC 50 cutaway view of the structure of the substrate module 540 after the thermo-compressed by above-mentioned manufacture method to Figure 21.The splicing ear 52 of FPC 50 is connected with the splicing ear 28 of touch-screen 520 via ACF 30.In addition, carry out position alignment so that the alignment mark 53 of FPC50 surrounds the alignment mark 525 of touch-screen 520.
Because touch-screen 520 and substrate module 540 have the effect identical with the touch-screen 20 of execution mode 1 and substrate module 40, therefore, the description thereof will be omitted.In addition, because the etching problem of the not protected film 29 of the alignment mark 525 opaque metal film that causes that covers is identical with the situation of touch-screen 320 shown in Figure 13 (a) and Figure 13 (b), therefore, the description thereof will be omitted.
＜3. other
In the respective embodiments described above, the touch-screen of establishing touch-screen and be capacitance-type is illustrated, but also can be the resistive film mode, the touch-screen of infrared mode, ultrasonic wave mode and electromagnetic induction coupled modes.In addition, the insulated substrate 21 of touch-screen also can be also used as the relative substrate 72 of liquid crystal panel 70.In this case, touch sensor is formed on another surface relative with a surface of Fluid Contacting crystal layer 73 of comparative electrode 72.
In addition, in the respective embodiments described above, the situation that touch-screen and FPC 50 are electrically connected is illustrated.But, be not limited to touch-screen, get final product so long as possess the circuit substrate of the splicing ear that is electrically connected with FPC 50.Particularly, in liquid crystal indicator 10, with the situation that touch-screen and FPC 50 are electrically connected in the respective embodiments described above similarly, situation about also being electrically connected with FPC 50 applicable to the active-matrix substrate 71 that will consist of liquid crystal panel 70.
In addition, in the respective embodiments described above, there is ACF 30 to be electrically connected with FPC 50 with the join domain 24 as the touch-screen of anisotropic conductive adhesive member at sticking note.But, also can substitute ACF 30 to the join domain 24 coating bonding thickeners of anisotropic conductive (Anisotropic Conductive Paste) of touch-screen.
In the respective embodiments described above, establish touch-screen and be included in the liquid crystal indicator 10 and be illustrated, but also can be included in organic EL(electroluminescence: Electro Luminescence) in the display unit.
In above-mentioned execution mode 2,3,5 and 6, establish comprise in the alignment mark of touch-screen by the shape of the film formed mark of transparent metal oxide and identical being illustrated of shape by the film formed mark of opaque metal.But, comparable large by the film formed mark of transparent metal oxide by the film formed mark of opaque metal, perhaps also can be less than it conversely.No matter in which kind of situation, the visuality the during position alignment of alignment mark is all higher, therefore, can have the effect identical with the alignment mark of above-mentioned execution mode.
The second mark 125b in the splicing ear 28 of each touch-screen, touch sensor 22 and the alignment mark, 225b, 425b, 525b also can replace the transparent metal oxide film to form by nesa coating.In addition, the first mark 125a in the lead-out wiring 23 of each touch-screen and the alignment mark, 225a, 425a, 525a also can replace opaque metal to form by opaque conductive film.
Industrial practicality
The present invention is suitable for being formed with the circuit substrate for the alignment mark that is connected with flexible printed circuit board, especially in the display unit of liquid crystal indicator etc., be suitable for to consist of the situation that the active-matrix substrate of display floater is electrically connected with flexible printed circuit board.
Label declaration
10 ... liquid crystal indicator
20,120,220,320,420,520 ... touch-screen
21 ... glass substrate (insulated substrate)
23 ... the lead-out wiring of touch-screen
24 ... join domain
25,125,225,325,425,525 ... the alignment mark of touch-screen
125a, 225a, 425a, 525a ... by film formed the first mark of opaque metal
125b, 225b, 425b, 525b ... by film formed the second mark of transparent metal oxide
28 ... the splicing ear of touch-screen
29 ... diaphragm
30 ... ACF(anisotropic conductive adhesive sheet)
40,140,240,340,440,540 ... substrate module
50 ... the FPC(flexible printed circuit board)
52 ... the wiring of FPC and splicing ear
53 ... the alignment mark of FPC
Claims (9)
1. circuit substrate, this circuit substrate possesses insulated substrate, it is characterized in that, comprising:
Splicing ear, this splicing ear are formed on the described insulated substrate and are used for being electrically connected with flexible printed circuit board; And
The first alignment mark, this first alignment mark are used for carrying out position alignment with described flexible printed circuit board,
Described splicing ear is formed by nesa coating,
Described the first alignment mark comprises the first mark that is formed by opaque conductive film.
2. circuit substrate as claimed in claim 1 is characterized in that,
Described the first alignment mark only comprises the first mark that is formed by opaque conductive film.
3. circuit substrate as claimed in claim 1 is characterized in that,
Described the first alignment mark also comprises by film formed the second mark of electrically conducting transparent,
Described the second mark is formed on the upper surface of described the first mark.
4. circuit substrate as claimed in claim 1 is characterized in that,
Described the first alignment mark also comprises by film formed the second mark of electrically conducting transparent,
Described the first mark is formed on the upper surface of described the second mark.
5. circuit substrate as claimed in claim 1 is characterized in that,
Also comprise the first wiring, this first wiring is electrically connected with described splicing ear and is formed by described opaque conductive film,
Described the first mark is formed by the material opaque conductive film identical with described the first wiring.
6. circuit substrate as claimed in claim 1 is characterized in that,
The protected film of described the first alignment mark covers.
7. circuit substrate as claimed in claim 1 is characterized in that,
The described splicing ear of described circuit substrate is only formed by nesa coating.
8. substrate module, this substrate module comprise as each described circuit substrate in the claim 1 to 7, and with as described in the flexible printed circuit board that is electrically connected of circuit substrate, it is characterized in that,
Described flexible printed circuit board comprises:
Flexible substrate;
Be formed at the wiring of second on the described flexible substrate; And
Be formed near the second alignment mark of described the second wiring,
The splicing ear of described circuit substrate is electrically connected with described the second wiring after described second alignment mark of the first alignment mark that utilizes described circuit substrate and described flexible printed circuit board carries out position alignment.
9. display unit, this display unit comprise such as each described circuit substrate in the claim 1 to 7, and show and it is characterized in that the display floater of image,
Described circuit substrate is the touch-screen that also comprises touch sensor, and this touch sensor is formed and detected touch location by nesa coating,
Described display floater is relative with described touch-screen to be disposed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010055510 | 2010-03-12 | ||
| JP2010-055510 | 2010-03-12 | ||
| PCT/JP2010/069513 WO2011111264A1 (en) | 2010-03-12 | 2010-11-02 | Circuit board, board module and display apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202931661U true CN202931661U (en) | 2013-05-08 |
Family
ID=44563103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201090001489.XU Expired - Fee Related CN202931661U (en) | 2010-03-12 | 2010-11-02 | Circuit substrate, substrate module and display device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9060429B2 (en) |
| CN (1) | CN202931661U (en) |
| AU (1) | AU2010347928A1 (en) |
| SG (1) | SG183319A1 (en) |
| WO (1) | WO2011111264A1 (en) |
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| CN108932073A (en) * | 2017-05-22 | 2018-12-04 | 祥达光学（厦门）有限公司 | Touch panel and its pin configuration |
| CN110069153A (en) * | 2018-01-24 | 2019-07-30 | 祥达光学（厦门）有限公司 | Touch panel and touch sensing winding |
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| CN111526664A (en) * | 2020-04-28 | 2020-08-11 | 苏州狮威电子科技有限公司 | Circuit board BIN value marking method |
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| CN104536181B (en) * | 2014-12-25 | 2017-07-07 | 昆山国显光电有限公司 | The alignment method and system of FOG techniques |
| CN108932073A (en) * | 2017-05-22 | 2018-12-04 | 祥达光学（厦门）有限公司 | Touch panel and its pin configuration |
| CN110069153A (en) * | 2018-01-24 | 2019-07-30 | 祥达光学（厦门）有限公司 | Touch panel and touch sensing winding |
| CN110069152A (en) * | 2018-01-24 | 2019-07-30 | 祥达光学（厦门）有限公司 | Touch panel and touch sensing winding |
| CN111831156A (en) * | 2018-01-24 | 2020-10-27 | 祥达光学（厦门）有限公司 | Touch panel and touch sensor tape |
| CN111857410A (en) * | 2018-01-24 | 2020-10-30 | 祥达光学（厦门）有限公司 | Touch panel |
| US11526239B2 (en) | 2018-01-24 | 2022-12-13 | Tpk Glass Solutions (Xiamen) Inc. | Touch panel and sheet of touch sensors |
| CN111526664A (en) * | 2020-04-28 | 2020-08-11 | 苏州狮威电子科技有限公司 | Circuit board BIN value marking method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011111264A1 (en) | 2011-09-15 |
| SG183319A1 (en) | 2012-09-27 |
| US9060429B2 (en) | 2015-06-16 |
| AU2010347928A1 (en) | 2012-09-06 |
| US20120319980A1 (en) | 2012-12-20 |
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