TWI688809B - Light emitting module and display module - Google Patents
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- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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Abstract
Description
本發明是有關於一種發光模組與顯示模組。The invention relates to a light emitting module and a display module.
大屏幕顯示系統能夠集中顯示多種不同信號源的信號,以滿足用戶大面積顯示各種共享信息和綜合信息的需求。在一般的做法中,其通常藉由多個較小的顯示面板進行拼接而形成大尺寸的顯示面板。在每一個較小的顯示面板的顯示區中,通常顯示區內的紅光、藍光、綠光發光元件都會以一順序並沿著一方向進行排列。在理想的狀況下,這些發光元件是要以特定的排列順序進行排列。但是,由於一般的發光元件上並沒有明顯的標記來標示其發光顏色,因此在拼接的過程中有可能會把同樣發光顏色的發光元件排列在一起,而這會造成在部分區域中同樣發光顏色的發光元件的間距較小(例如藍光發光元件與藍光發光元件排列在一起),而位在部分區域具有同樣顏色的發光元件的間距較大。舉例來說,若預設的發光元件的發光顏色是以紅、綠、藍、紅、綠、藍…的排列順序進行排列,若發生排列順序錯設的情況,則有可能變成紅、綠、藍、藍、綠、紅…此情形。因此,當使用者使用上述的大尺寸顯示面板時,會導致色光出光不一致,進而影響顯示品質。The large-screen display system can centrally display signals from a variety of different signal sources to meet the needs of users to display various shared information and comprehensive information in a large area. In a common method, a large-sized display panel is usually formed by splicing multiple smaller display panels. In the display area of each smaller display panel, the red, blue, and green light-emitting elements in the display area are usually arranged in an order and along a direction. In an ideal situation, these light emitting elements are arranged in a specific arrangement order. However, because there is no obvious mark on the general light-emitting element to indicate its light-emitting color, it is possible to arrange the light-emitting elements of the same light-emitting color together during the splicing process, and this will cause the same light-emitting color in some areas. The pitch of the light-emitting elements is small (for example, the blue light-emitting elements and the blue light-emitting elements are arranged together), and the pitch of the light-emitting elements with the same color in some areas is large. For example, if the preset color of the light emitting element is arranged in the order of red, green, blue, red, green, blue, etc., if the arrangement order is wrong, it may become red, green, Blue, blue, green, red... this situation. Therefore, when the user uses the above-mentioned large-size display panel, it will cause inconsistent color light emission, which further affects the display quality.
另一方面,在每一個較小的顯示面板中,通常都會設有顯示區以及邊框區,而顯示區內係設有顯示畫素以及部分的走線,而邊框區則是用來設置驅動電路、一部分的走線或其他電子元件的區域,因此邊框區(或稱無效顯示區/非顯示區)通常無法顯示畫面。在拼接完成後,這些較小的顯示面板之間會有無效顯示區的存在,而造成整體顯示畫面的不連續,進而影響觀賞品質。On the other hand, in each smaller display panel, there is usually a display area and a border area, and the display area is provided with display pixels and some traces, and the border area is used to set the driving circuit , Part of the wiring or the area of other electronic components, so the border area (or invalid display area/non-display area) usually cannot display the screen. After the splicing is completed, there will be invalid display areas between these smaller display panels, resulting in a discontinuity in the overall display image, which in turn affects the viewing quality.
本發明提供一種發光模組,其使具有此發光模組的顯示模組具有良好的顯示品質,且具有此發光模組的顯示模組提供無縫隙的顯示畫面。The invention provides a light-emitting module, which makes the display module with the light-emitting module have good display quality, and the display module with the light-emitting module provides a seamless display screen.
本發明提供一種顯示模組,其具有良好的顯示品質,且能提供無縫隙的顯示畫面。The invention provides a display module which has good display quality and can provide a seamless display screen.
本發明的一實施例中提供一種發光模組,包括承載基板、多個發光元件、模組控制器以及對位部。承載基板具有第一表面、第二表面與側面。第一表面相對於第二表面,且側面連接於第一表面與第二表面。這些發光元件設置於第一表面上。模組控制器設置於第二表面上,且模組控制器與這些發光元件電性連接。對位部位於承載基板的側面。對位部與承載基板所形成的一外輪廓為不對稱。An embodiment of the present invention provides a light-emitting module, which includes a carrier substrate, a plurality of light-emitting elements, a module controller, and an alignment portion. The carrier substrate has a first surface, a second surface and side surfaces. The first surface is opposite to the second surface, and the side surface is connected to the first surface and the second surface. These light emitting elements are provided on the first surface. The module controller is disposed on the second surface, and the module controller is electrically connected to the light-emitting elements. The alignment part is located on the side of the carrier substrate. An outer contour formed by the alignment portion and the carrier substrate is asymmetric.
本發明的一實施例中提供一種發光模組,包括驅動基板、承載基板、多個發光元件以及模組控制器。驅動基板包括基底以及多條訊號線。基底具有多個定位部,且這些訊號線設置於基底上。承載基板具有第一表面、第二表面與側面。第一表面相對於第二表面,且側面連接於第一表面與第二表面。這些發光元件設置於第一表面上。模組控制器設置於第二表面上,且模組控制器與這些發光元件電性連接。承載基板以及模組控制器與對應的定位部接合。An embodiment of the present invention provides a light emitting module, including a driving substrate, a carrier substrate, a plurality of light emitting elements, and a module controller. The driving substrate includes a substrate and multiple signal lines. The substrate has a plurality of positioning portions, and these signal lines are disposed on the substrate. The carrier substrate has a first surface, a second surface and side surfaces. The first surface is opposite to the second surface, and the side surface is connected to the first surface and the second surface. These light emitting elements are provided on the first surface. The module controller is disposed on the second surface, and the module controller is electrically connected to the light-emitting elements. The carrier substrate and the module controller are engaged with the corresponding positioning part.
本發明的一實施例中提供一種顯示模組,包括驅動基板以及多個上述的發光模組。各發光模組包括承載基板、多個發光元件、模組控制器以及定位部。驅動基板包括基底以及多條訊號線。基底具有多個定位部。這些訊號線設置於基底上。這些發光模組電性連接於驅動基板。承載基板具有第一表面、第二表面與側面。第一表面相對於第二表面,且側面連接於第一表面與第二表面。這些發光元件設置於第一表面上。模組控制器設置於第二表面上,且模組控制器與這些發光元件電性連接。對位部位於承載基板的一側。對位部與承載基板所形成的一外輪廓為不對稱,且承載基板以及模組控制器與對應的定位部接合。An embodiment of the present invention provides a display module including a driving substrate and a plurality of the above-mentioned light-emitting modules. Each light-emitting module includes a carrier substrate, a plurality of light-emitting elements, a module controller, and a positioning portion. The driving substrate includes a substrate and multiple signal lines. The base has a plurality of positioning portions. These signal lines are arranged on the substrate. These light emitting modules are electrically connected to the driving substrate. The carrier substrate has a first surface, a second surface and side surfaces. The first surface is opposite to the second surface, and the side surface is connected to the first surface and the second surface. These light emitting elements are provided on the first surface. The module controller is disposed on the second surface, and the module controller is electrically connected to the light-emitting elements. The alignment portion is located on the side of the carrier substrate. An outer contour formed by the alignment portion and the carrier substrate is asymmetric, and the carrier substrate and the module controller are joined to the corresponding positioning portion.
基於上述,在本發明實施例的發光模組與顯示模組中,對位部設置於承載基板的一側,因此對位部可作為這些發光元件的發光顏色排列順序的標記,使用者可依據對位部來判斷發光顏色的排列順序,在組裝於驅動基板的過程中可以避免發光顏色排列順序錯置的情況。此外,發光元件與模組控制器分別設置於承載基板的第一、第二表面,因此相較於習知技術來說,在第一表面中可以大幅地減少不具有顯示功能的走線與控制元件所佔有的面積,且避免了無效顯示區的情形,因此顯示模組可以提供的無縫隙的顯示畫面,而具有良好的顯示品質。Based on the above, in the light-emitting module and the display module of the embodiment of the present invention, the alignment portion is provided on the side of the carrier substrate, so the alignment portion can be used as a mark for the order of the light-emitting color arrangement of these light-emitting elements. The alignment part determines the arrangement order of the emission colors, and avoids the misalignment of the arrangement order of the emission colors during the assembly on the driving substrate. In addition, the light emitting element and the module controller are respectively disposed on the first and second surfaces of the carrier substrate, so compared with the conventional technology, the first surface can greatly reduce the wiring and control without the display function The area occupied by the device avoids the situation of the invalid display area. Therefore, the display module can provide a seamless display screen with good display quality.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.
為了方便說明本發明實施例的顯示模組與發光模組之間的配置關係,本發明實施例的顯示模組與發光模組可被視為處於由方向D1、D2、D3構成的三維空間中,其中方向D1、D2、D3兩兩互為垂直。In order to facilitate the description of the configuration relationship between the display module and the light emitting module of the embodiment of the present invention, the display module and the light emitting module of the embodiment of the present invention can be regarded as being in a three-dimensional space composed of directions D1, D2, D3 , Where the directions D1, D2, D3 are perpendicular to each other.
圖1是依照本發明的一實施例的一種顯示模組的上視示意圖。圖2是圖1中發光模組的剖面示意圖。圖3是圖1中發光模組的正面示意圖。圖4是圖1中發光模組的背面示意圖。圖5是圖1中發光模組與驅動基板的組裝示意圖。圖6是圖1中剖面A-A’的剖面示意圖,即圖5組裝完成的示意圖。FIG. 1 is a schematic top view of a display module according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view of the light emitting module in FIG. 1. 3 is a schematic front view of the light emitting module in FIG. 1. FIG. 4 is a schematic back view of the light emitting module in FIG. 1. FIG. 5 is an assembly diagram of the light emitting module and the driving substrate in FIG. Fig. 6 is a schematic cross-sectional view of section A-A' in Fig. 1, that is, the assembled view of Fig. 5.
請參照圖1,於本實施例中,顯示模組200具有顯示區DR與非顯示區NDR。非顯示區NDR為顯示區DR以外的區域,亦可被稱為邊框區BR(Border Region)。於本實施例中,顯示區DR為顯示模組100中用以顯示影像畫面的區域,非顯示區NDR則例如是用以設置顯示模組100中的電路元件或走線的區域,但不以此為限。Please refer to FIG. 1. In this embodiment, the
請再參照圖1,於本實施例中,顯示模組200包括多個發光模組100以及驅動基板DP。驅動基板DP更包括電源供應器PS、掃描驅動器SD以及資料驅動器DD。於以下的段落中會詳細地說明上述各元件與相對應的配置關係。Please refer to FIG. 1 again. In this embodiment, the
發光模組100可用受控發光並可進一步依據影像資料來顯示影像,因此亦可被視為顯示模組200中的子顯示模組。請參照圖1至圖6,這些發光模組100位於顯示區DR中。發光模組100包括承載基板110、多個發光元件120、模組控制器130以及對位部140。於以下的段落中會詳細地說明發光模組100內的各元件。The light-
承載基板110係用來承載發光模組100內各元件的基板。請參照圖1至圖4,承載基板110具有第一表面S1、第二表面S2以及連接第一、第二表面S1、S2的側面SS1、SS2。第一表面S1相對於第二表面S2。第一表面S1朝向顯示側DS。第二表面S2則朝向背側BS。承載基板110包括線路層CL以及多個導通孔H。線路層CL設置於第二表面S2。這些導通孔H則是貫穿承載基板110。The
這些發光元件120係指本身具有發光功能的光學元件。請參照圖1至圖3,這些發光元件120設置於第一表面S1上,且分別對應設置於這些導通孔H(如圖2所示)。這些發光元件120包括多種不同發光顏色的發光元件,且例如是包括多個紅光、綠光以及藍光發光元件R、G、B。這些紅光、綠光以及藍光發光元件R、G、B例如是以發光顏色藍、綠、紅的發光顏色排列順序排列於第一表面S1上,但不以此為限。These light-emitting
於其他的實施例中,發光元件120的發光顏色亦可以是黃色、紫色、白色等其他不同發光顏色,本發明並不以此為限。並且,發光元件120的排列順序亦不以藍、綠、紅的顏色排列為限制,亦可以為紅、藍、綠;綠、紅、藍;…等不同的顏色排列順序,本發明亦不以此為限。此外,於本實施例中,每一個發光模組100所具有的發光元件120的數量例如是以六個作為示例,於其他的實施例中,發光元件120的數量亦可以是小於六個或大於六個,本發明並不以此為限。本領域的通常知識者可以依據需求來對應設計發光顏色、發光顏色排列順序以及發光元件120的數量,本發明並不以此為限。In other embodiments, the light emitting color of the
於本實施例中,發光元件120的種類可為發光二極體、次毫米發光二極體(Mini LED)或微型發光二極體(Micro LED)、有機發光二極體(Organic Light Emitting Diode, OLED),其中次毫米發光二極體的尺寸大小例如是落在100微米至200微米的範圍內,而微型發光二極體的尺寸大小例如是微米等級的大小,其尺寸例如是小於100微米且大於0微米的範圍內,本發明並不以此為限。In this embodiment, the type of the light-emitting
模組控制器130依據來自掃描驅動器SD與資料驅動器DD的影像資料來驅動這些發光元件110發光,並進一步使發光模組100顯示影像畫面。於本實施例中,模組控制器130包括體積較小的積體電路(Integrated Circuit),亦可被稱做小晶片(Chiplet)。請參照圖2與圖4,模組控制器130設置於第二表面S2上。模組控制器130與這些發光元件110電性連接,且例如是藉由這些導通孔H與線路層CL與這些發光元件110電性連接。此外,模組控制器130上更設有接合墊BP,以與電路接合。The
對位部140僅位於承載基板110的側面SS1。於圖1至圖6中所示,發光模組100所具有的對位部140的態樣例如是凸塊的態樣。因此,在整個發光模組100中,對位部140與承載基板110所形成的外輪廓不對稱。詳細來說,於本段落中所謂的「外輪廓不對稱」可由以下的方式看出:假設一軸向垂直於第一表面S1的法向量的參考軸RA1通過第一表面S1的中央,並且,若以俯視的方式(即沿方向D3的反方向)觀看第一表面S1,則可看出參考軸RA1的左側的承載基板110的局部的外輪廓不對稱於在參考軸RA1的右側的承載基板110與對位部140的局部的外輪廓。簡言之,藉由對位部140的設置,發光模組100可以提供使用者在方向D1、D2所構成的參考平面上的視覺不對稱性。部分的發光元件120(例如是紅光發光元件R)與對位部140的距離較近,而部分的發光元件120(例如是藍光發光元件B)與對位部140的距離較遠。因此,使用者可以依據對位部140所在的位置來判斷發光元件120的發光顏色,也就是說,使用者可藉由對位部140與承載基板110的外輪廓的不對稱性來達到判斷發光元件120的發光顏色。對位部140亦可被視為是判斷發光元件120發光顏色的一種標記。The
請參照圖5,驅動基板DP包括基底BE以及多條訊號線SL。基底112具有多個定位部FP。基底BE具有底面S3與內表面S4,底面S3連接於內表面S4,且內表面S4例如為階梯狀,但不以此為限。底面S3與內表面S4定義出對應的一定位部FP。於本實施例中,各定位部FP包括凹槽GV。凹槽GV包括第一凹槽GV1、第二凹槽GV2以及第三凹槽GV3。第一凹槽G1鄰近底面S3。第二凹槽G2相較於第一凹槽G1鄰近於顯示模組200外部。第三凹槽G3位於第二凹槽G2的一側。Please refer to FIG. 5, the driving substrate DP includes a base BE and a plurality of signal lines SL. The base 112 has a plurality of positioning portions FP. The base BE has a bottom surface S3 and an inner surface S4, the bottom surface S3 is connected to the inner surface S4, and the inner surface S4 is, for example, stepped, but not limited thereto. The bottom surface S3 and the inner surface S4 define a corresponding positioning portion FP. In this embodiment, each positioning portion FP includes a groove GV. The groove GV includes a first groove GV1, a second groove GV2, and a third groove GV3. The first groove G1 is adjacent to the bottom surface S3. The second groove G2 is adjacent to the outside of the
請再參照圖5,承上述,發光模組100可藉由定位部FP而嵌合於驅動基板DP的基底BE內。當發光模組100嵌合於驅動基板DP時,模組控制器130嵌設於第一凹槽GV1中,承載基板110則嵌設於第二凹槽GV2中,對位部140(凸塊態樣)則嵌設於第三凹槽GV3中,組裝完成後如圖6所示。換言之,承載基板110、對位部140以及模組控制器120可以與對應的定位部FP接合。請參照圖6,組裝完成後,承載基板110覆蓋模組控制器130以及訊號線SL,而這些發光元件120則暴露於顯示模組200的外部。Referring again to FIG. 5, according to the above, the
請再參照圖6,在方向D1、D3所構成的另一參考平面上,本實施例的發光模組100亦可提供使用者視覺的不對稱性。詳細來說,假設另一軸向平行於第一表面S1的法向量的參考軸RA2通過第一表面S1的中央,並且,從圖6中可看出:位於參考軸RA2的左側的承載基板110與對位部140的局部的外輪廓不對稱於在參考軸RA2的右側的承載基板110的局部的外輪廓。簡言之,藉由對位部140的設置,發光模組100可以提供使用者在方向D1、D3所構成的參考平面上的不對稱性。Please refer to FIG. 6 again. On another reference plane formed by the directions D1 and D3, the light-emitting
電源供應器PS係為用以提供顯示模組200中各元件電力的電子元件。掃描驅動器SD與資料驅動器DD可依據影像資料並藉由訊號線SL傳遞控制訊號至這些模組控制器130。這些模組控制器130再依據影像資料來使這些發光模組100顯示影像畫面。電源供應器SP、掃描驅動器SD與資料驅動器DD設置於非顯示區NDR中,且皆與驅動基板DP的訊號線SL電性連接。具體而言,電源供應器SP與掃描驅動器SD設置於非顯示區NDR的一側(例如是如圖1中的左側),而資料驅動器DD則設置於非顯示區NDR的另一側(例如是如圖1中的下側)。請參照圖5,電源供應器SP、掃描驅動器SD電源供應器120藉由這些訊號線SL的一部分(即此部分的訊號線SL作為電源線PL)與這些模組控制器130電性連接,且用以提供電力。掃描驅動器130藉由這些訊號線的一部分(即此部分的訊號線SL作為掃描線SCL)電性連接於這些模組控制器130。資料驅動器140藉由這些訊號線的一部分(即此部分的訊號線SL作為資料線DL)電性連接於這些模組控制器130。The power supply PS is an electronic component used to provide power to each component in the
於以下的段落中會詳細地說明發光模組100於顯示區DR的排列方式。The arrangement of the
於本實施例中,這些定位部FP以陣列的方式排列成一矩陣MX,由於這些發光模組100嵌合於這些定位部FP,因此這些發光模組100亦以陣列的方式排列一矩陣MX。每一個發光模組100中的對位部140皆往方向D1凸出。In this embodiment, the positioning portions FP are arranged in a matrix MX. Since the
承上述,在本實施例的發光模組100與顯示模組200中,對位部140位於承載基板110的側面SS1而使對位部140與承載基板110所形成的外輪廓不對稱,而這些發光元件120與對位部140之間具有不同的距離。因此,使用者可以依據發光元件120與對位部140之間的距離,來判斷發光顏色的排列方式。As described above, in the
舉例來說,在發光模組100中,紅光發光元件R較靠近對位部140,藍光發光元件B則較遠離對位部140a,而綠光發光元件G則是位於紅光、藍光發光元件R、G之間,因此使用者可根據發光元件120與對位部140之間的距離的遠近,判斷的發光顏色的排列方式為藍、綠、紅。For example, in the
根據上述的設置,當使用者將發光模組100嵌設於驅動基板DP中時,儘管發光元件120上並沒有明顯的標記標示其發光顏色,但使用者仍可以依據對位部140與發光元件120之間的距離來判斷對應的發光元件120的發光顏色,藉此可以得知在對應的發光模組100中的發光顏色的排列順序。如此一來,在嵌設的過程中可以確保這些發光元件120以既定的發光顏色排列順序(例如是藍、綠、紅、藍、綠、紅...)進行排列,而大幅避免排列順序錯設的狀況。因此,本實施例的顯示模組200可以避免色光的出光位置不一致,而具有良好的顯示品質。According to the above configuration, when the user embeds the light-emitting
接著,在本實施例的發光模組100與顯示模組200中,這些發光元件120設置於第一表面S1上,而模組控制器130設置於朝向背側BS的第二表面S2上,導通孔H則是貫穿承載基板110。模組控制器130與相關的走線層(線路層CL)則是被埋設於承載基板110與驅動基板DP之間。換言之,本實施例的發光模組100將顯示功能整合於承載基板110的第一表面S1上,而將控制功能與訊號傳輸功能整合於承載基板110的第二表面S2上。Next, in the light-emitting
因此,當使用者觀賞顯示模組200的顯示畫面時,由於不具有顯示功能的走線與控制元件不位於第一表面S1上,這些發光元件120可以以更緊密地排列方式排列於第一表面S1上,可增加顯示解析度。Therefore, when the user views the display screen of the
同時,第一表面S1就不需要再設置走線或控制元件,而省去了無效顯示區。當這些發光模組100嵌合於驅動基板DP後,整個顯示區DR能夠有效地顯示畫面,避免了習知技術中所提到的無效顯示區的情形,因此本實施例的顯示模組200可以提供的無縫隙的顯示畫面(即連續的顯示畫面),而具有良好的顯示品質。At the same time, the first surface S1 does not need to be provided with wiring or control elements, and the invalid display area is omitted. After these light-emitting
請再參照圖6,在本實施例中,由於這些第一表面S1與基材BE暴露於顯示模組200外部的表面SE實質上切齊,而此設計有利於接續的模組封裝製程。Please refer to FIG. 6 again. In this embodiment, since the first surface S1 and the surface SE of the substrate BE exposed to the outside of the
圖7是本發明另一實施例的發光模組的剖面示意圖。7 is a schematic cross-sectional view of a light emitting module according to another embodiment of the invention.
請參照圖7,本發明實施例的發光模組的畫分方式並不限於上述的觀點。圖7大體上類似於圖6,發光模組100’亦可以包括驅動基板DP、承載基板110、多個發光元件120以及模組控制器130。各元件的功能以及連接關係已與上述段落中說明,於此不再贅述。由於這些發光元件120的發光顏色的排列順序(例如是藍、綠、紅)已經預設好了,因此使用者可以直觀地將設有多個發光元件120的承載基板110嵌設於對應的定位部FP,而大幅地避免了發光顏色排列順序錯置的情況。因此本發明實施例的發光模組100’可以提供使用者上述的便利性。Referring to FIG. 7, the division method of the light emitting module according to the embodiment of the present invention is not limited to the above viewpoint. 7 is substantially similar to FIG. 6, the light emitting module 100' may also include a driving substrate DP, a
圖8A至圖8F為圖1中發光模組的製作流程圖。8A to 8F are flowcharts of manufacturing the light emitting module in FIG. 1.
於以下的段落中會詳細地說明圖1中發光模組的製作方式。The manufacturing method of the light emitting module in FIG. 1 will be described in detail in the following paragraphs.
請參照圖8A,提供承載基板110以及對位部140。將對位部140設置於承載基板110的側面SS1。並且對承載基板110進行一挖孔製程,以形成貫穿承載基板110的多個孔洞H’。Referring to FIG. 8A, a
請參照圖8B,於這些孔洞H’中灌入導電材料,以形成貫穿承載基板110的多個導通孔H。Referring to FIG. 8B, conductive materials are poured into these holes H'to form a plurality of via holes H penetrating the
請參照圖8C,在承載基板110的一表面S1上設置多個發光元件120,且這些發光元件120的位置分別對應於這些導通孔H。Referring to FIG. 8C, a plurality of
請參照圖8D,在承載基板110的另一表面S2上形成線路層CL,且使線路層CL電性連接於這些導通孔H。並將一模組控制器130設置於線路層CL上,以使模組控制器130與線路層CL兩者電性連接,且模組控制器130可藉由線路層CL與這些導通孔H與這些發光元件120電性連接。Referring to FIG. 8D, a circuit layer CL is formed on the other surface S2 of the
至此,發光模組100的製作大體上已經完成。So far, the production of the
圖9A至圖9F為圖1中驅動基板的定位部的製作流程圖。圖10A與圖10B示出圖1中驅動基板的定位部的另一種製作流程圖。9A to 9F are manufacturing flowcharts of the positioning portion of the driving substrate in FIG. 1. 10A and 10B show another manufacturing flowchart of the positioning portion of the driving substrate in FIG. 1.
請參照圖9A,提供基底BE的第一部分BE1,並於第一部分BE1的表面上形成多條訊號線SL。Referring to FIG. 9A, a first part BE1 of the substrate BE is provided, and a plurality of signal lines SL are formed on the surface of the first part BE1.
請參照圖9B,形成基底BE的第二部分BE2於第一部分BE1上,並使第二部分BE2覆蓋這些訊號線SL。第二部分BE2例如是光阻材料、壓克力或其他種類的高分子材料。9B, the second portion BE2 of the substrate BE is formed on the first portion BE1, and the second portion BE2 covers the signal lines SL. The second part BE2 is, for example, a photoresist material, acrylic or other kinds of polymer materials.
請參照圖9C,提供第一光罩M1,其具有第一開口O1。將此第一光罩M1設置於第二部分BE2上,並進行一第一曝光顯影製程,以蝕刻出承載基板110與模組控制器130所需的深度,並定義出定位部FP中的第一凹槽GV1與部分的第二凹槽GV2(即圖9C中的點狀空間)。9C, a first mask M1 is provided, which has a first opening O1. The first mask M1 is disposed on the second part BE2, and a first exposure and development process is performed to etch the required depth of the
請參照圖9D,移除第一光罩M1,並提供第二光罩M2,其中第二光罩M2具有第二開口O2。將此第二光罩M2設置於第二部分BE2上,並進行一第二曝光顯影製程,以蝕刻出承載基板110所需的深度,而定義出其他部分的第二凹槽GV2(即圖9D中的點狀空間)。據此,藉由第一、第二曝光顯影製程可以定義出定位部FP中的第一、第二凹槽GV1、GV2。9D, the first mask M1 is removed, and a second mask M2 is provided, wherein the second mask M2 has a second opening O2. The second photomask M2 is disposed on the second portion BE2, and a second exposure and development process is performed to etch the required depth of the
請參照圖9E,移除第二光罩M1,並提供第三光罩M3,其中第三光罩M3具有第三開口O3。將此第三光罩M3設置於第二部分BE2上,並進行一第三曝光顯影製程,以蝕刻出對位部140所需的深度,而定義出定位部FP中的第三凹槽GV3(即圖9E中的點狀空間)。9E, the second mask M1 is removed, and a third mask M3 is provided, wherein the third mask M3 has a third opening O3. The third photomask M3 is disposed on the second portion BE2, and a third exposure and development process is performed to etch the depth required by the
請參照圖9F,移除第三光罩M3。至此,驅動基板DP的定位部FP大體上已經製作完成。Referring to FIG. 9F, the third photomask M3 is removed. So far, the positioning portion FP of the drive substrate DP has been substantially completed.
於圖9A至圖9F的製作方法中,定位部FP可以藉由多種具有不同開口O1~O3的第一、第二、第三光罩M1~M3,並進行多次不同曝光時間的曝光,而可製作不同深度的第一、第二、第三凹槽GV1~GV3。In the manufacturing method of FIG. 9A to FIG. 9F, the positioning portion FP can perform multiple exposures with different exposure times through a plurality of first, second, and third photomasks M1 to M3 having different openings O1 to O3, and The first, second and third grooves GV1~GV3 of different depths can be made.
請參照圖10A,提供一灰階光罩M’,並將此灰階光罩M’設置於第二部分BE2上。灰階光罩M’具有第一、第二以及第三區域R1~R3,其中各區域的吸光能力不同。具體來說,第三區域R3的吸光能力最強,第二區域R2的吸光能力次之,第一區域R1的吸光能力最弱。第一、第二區域R1、R2用以定義定位部FP中的第一、第二凹槽GV1、GV2,第三區域R3用以定義定位部FP中的第三凹槽GV3。接著,進行一曝光顯影製程,而可定義出定位部FP中的第一、第二與第三凹槽GV1、GV2、GV3。Referring to FIG. 10A, a gray scale mask M'is provided, and the gray scale mask M'is disposed on the second portion BE2. The gray scale mask M'has first, second and third regions R1 to R3, wherein the light absorption capabilities of the regions are different. Specifically, the third region R3 has the strongest light absorption capability, the second region R2 has the second light absorption capability, and the first region R1 has the weakest light absorption capability. The first and second regions R1 and R2 are used to define the first and second grooves GV1 and GV2 in the positioning part FP, and the third region R3 is used to define the third groove GV3 in the positioning part FP. Next, an exposure and development process is performed to define the first, second, and third grooves GV1, GV2, and GV3 in the positioning portion FP.
請參照圖10B,移除灰階光罩M’。至此,驅動基板DP的定位部FP大體上已經製作完成。Referring to FIG. 10B, the gray scale mask M'is removed. So far, the positioning portion FP of the drive substrate DP has been substantially completed.
於圖10A與圖10B的製作方法中,定位部FP可以藉由具有不同吸光能力的區域R1~R3,並進行一次性曝光顯影製程,而可製作不同深度的第一、第二、第三凹槽GV1~GV3。In the manufacturing method of FIG. 10A and FIG. 10B, the positioning portion FP can produce the first, second, and third recesses of different depths through the regions R1~R3 with different light absorption capabilities and performing a one-time exposure and development process Slots GV1~GV3.
於其他未示出的實施例中,基材BE的第二部分BE2亦可選用熱塑性材料,其例如是聚甲基丙烯酸甲酯(Polymethylmethacrylate, PMMA)。並且,在滾筒上可設置具有如同第一、第二、第三凹槽GV1~GV3的凸塊。因此,當滾筒對基材BE的第二部分BE2進行熱壓印製程後,而可在第二部分BE2上製作出不同深度的第一、第二、第三凹槽GV1~GV3。In other embodiments not shown, the second part BE2 of the substrate BE may also be a thermoplastic material, such as polymethylmethacrylate (PMMA). In addition, bumps having the first, second, and third grooves GV1~GV3 may be provided on the drum. Therefore, after the roller performs the hot stamping process on the second part BE2 of the substrate BE, the first, second, and third grooves GV1~GV3 with different depths can be formed on the second part BE2.
在此必須說明的是,以下的實施例沿用上述實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,在此不贅述。It must be noted here that the following embodiments follow the element numbers and partial contents of the above embodiments, wherein the same or similar reference numbers are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which will not be repeated here.
圖11為本發明另一實施例的顯示模組200a的上視示意圖。FIG. 11 is a schematic top view of a
圖11的顯示模組200a大致上類似於圖1的顯示模組200,其主要差異在於:顯示模組200a具有兩種不同態樣的第一、第二發光模組100a、100b。第一發光模組100a類似於圖1的發光模組100,其所對應具有的第一對位部140a的態樣為凸塊,因此對應的第一定位部FPa則是定位凹槽。第一對位部140a則是設置於承載基板110a的側面SS1,且其往方向D1凸出。承載基板110a的側面SS2則不設有第一對位部140a。第二發光模組100b具有的第二對位部140b的態樣為凹槽,因此其所對應的第二定位部FPa則是設有定位凸塊來與之配合。第二對位部140b則是設置於承載基板110b的側面SS2,且其往方向D1凹陷。承載基板110b的側面SS1則不設有第二對位部140b。The
於第一發光模組100a中,紅光發光元件R較靠近第一對位部140a,藍光發光元件B則較遠離第一對位部140a,綠光發光元件G則是位於紅光、藍光發光元件R、B之間。因此使用者可根據發光元件120與第一對位部140之間的距離的遠近,判斷的發光顏色的排列方式為紅、綠、藍。在第二發光模組100b中,藍光發光元件B較靠近第二對位部140b,紅光發光元件R則較遠離第二對位部140b,綠光發光元件G則是位於紅光、藍光發光元件R、B之間,因此根據發光元件120與第二對位部140b之間的距離的遠近,決定的發光顏色的排列方式為藍、綠、紅。因此,由於第一發光模組100a的第一對位部140a與第二發光模組100b的第二對位部140b形狀互補的關係,使用者可以更為直觀地進行嵌設,而更不容易出現錯設的情況。In the first light-emitting
在本實施例中,這些發光模組100a、100b亦排列成一矩陣MXa。矩陣MXa中二相鄰列(Column)中的一列的一部分的發光模組100稱為多個第一發光模組100a,二相鄰列中的另一列的一部分的發光模組100為稱為多個第二發光模組100b。這些第一發光模組100a所對應具有的對位部140為多個第一對位部140a。這些第一發光模組100a所對應具有的對位部140為多個第二對位部140b。這些第一對位部140a分別對位於這些第二對位部140b,且例如是一對一地對位。於本實施例中,第一對位部140a為矩形凸塊,第二對位部140b為矩形凹槽,這些第一對位部140a與這些第二對位部140b的形狀互補。由於第一、第二對位部140a、140b形狀互補的關係,因此第一發光模組100a的發光元件110與第二發光模組100b的發光元件110可以排列地更為緊密,而本實施例的顯示模組200可以提供解析度高的顯示畫面。In this embodiment, the
應注意的是,於本實施例中,第一、第二對位部140a、140b形狀不同且互補。於其他未示出的實施例中,第一、第二對位部140a、140b形狀不同但可以不互補。此外,於本實施例中,第一、第二對位部140a、140b的形狀是矩形。於其他未示出的實施例中,第一、第二對位部140a、140b的形狀亦可以是V形、半圓形、星形、梯形、橢圓形、扇形、多邊形或其他種不同種類的形狀,本發明並不以此為限。It should be noted that in this embodiment, the first and
此外,請再參照圖11,由另外一種觀點觀之,這些發光模組100由多組並排的第一、第二發光模組100a、100b所構成。第一發光模組100a所具有的多個發光元件120分別為第一、第二以及第三發光元件E1、E2、E3。第二發光模組100b所具有的多個發光元件120分別為第四、第五以及第六發光元件E4、E5、E6。
第一、第二、第三、第四、第五以及第六發光元件E1~E6沿著方向D1進行排列。第一、第四發光元件E1、E4能發出相同的第一色光(或稱發光顏色),第二、第五發光元件E2、E5能發出相同的第二色光,第三、第六發光元件E3、E6能發出相同的第三色光。第一、第二、第三色光彼此互為不同的色光。
In addition, please refer to FIG. 11 again. From another viewpoint, these light-emitting
綜上所述,在本發明的實施例的發光模組與顯示模組中,承載基板的一側設有對位部,這些發光元件的發光顏色的排列順序可以藉由對位部與發光元件之間的距離來判斷,因此使用者可以直觀地判斷出發光顏色排列順序,當將發光模組嵌設於驅動基板中時,比較不容易出現發光顏色排列順序錯置的情況,因此本發明實施例的顯示模組可以避免色光的出光位置不一致的狀況,而具有良好的顯示品質。In summary, in the light-emitting module and the display module of the embodiment of the present invention, a positioning portion is provided on one side of the carrier substrate, and the arrangement order of the emission colors of these light-emitting elements can be determined by the positioning portion and the light-emitting element The distance between them can be judged, so the user can intuitively determine the order of the luminous color arrangement. When the light emitting module is embedded in the driving substrate, it is less likely that the arranging order of the luminous color is misplaced, so the present invention is implemented The display module of the example can avoid the situation where the light emitting positions of colored lights are inconsistent, and has good display quality.
接著,這些發光元件與模組控制器分別設置於承載基板的相對兩表面上,其中這些發光元件設置於承載基板的第一表面,而模組控制器或其他線路層則是設置於承載基板的第二表面。第一表面作為顯示面,而第二表面則是準備要被埋設於驅動基板內,即第二表面作為電子功能面。因此,整個第一表面不需要設置不具有顯示功能的走線或者是控制元件等電子元件,而省去了習知技術中的無效顯示區。當這些發光模組嵌合於驅動基板後,整個顯示區能夠有效地顯示畫面,顯示畫面較不容易出現黑線的情況,因此,本發明實施例的顯示模組能夠提供無縫隙的顯示畫面,而具有良好的顯示品質。Then, the light-emitting elements and the module controller are respectively disposed on two opposite surfaces of the carrier substrate, wherein the light-emitting elements are arranged on the first surface of the carrier substrate, and the module controller or other circuit layers are arranged on the carrier substrate Second surface. The first surface serves as a display surface, and the second surface is intended to be buried in the driving substrate, that is, the second surface serves as an electronic functional surface. Therefore, the entire first surface does not need to be provided with traces that do not have a display function or electronic components such as control elements, and the invalid display area in the conventional technology is omitted. When these light emitting modules are fitted into the driving substrate, the entire display area can effectively display the screen, and the display screen is less prone to black lines. Therefore, the display module of the embodiment of the present invention can provide a seamless display screen. And has good display quality.
此外,由另一觀點觀之,在本發明實施例的發光模組中,由於這些發光元件在承載基板上的發光顏色的排列順序已經預設好了,使用者快速地將設有多個發光元件的承載基板以及模組控制器嵌設於驅動基板中對應的定位部中,因此本發明實施例的發光模組可以快速組裝,且可大幅地避免了發光顏色排列順序錯置的情況。In addition, from another point of view, in the light-emitting module of the embodiment of the present invention, since the arrangement order of the light-emitting colors of the light-emitting elements on the carrier substrate has been preset, the user will quickly provide multiple light-emitting The carrier substrate of the component and the module controller are embedded in the corresponding positioning portions in the driving substrate, so the light emitting module of the embodiment of the present invention can be quickly assembled, and the situation in which the arrangement order of the light emitting colors is misaligned can be largely avoided.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.
200、200a:顯示模組200, 200a: display module
100、100’:發光模組100, 100’: light emitting module
100a:第一發光模組100a: the first light emitting module
100b:第二發光模組100b: second light emitting module
110、110a、110b:承載基板110, 110a, 110b: carrier substrate
120:發光元件120: light emitting element
130:模組控制器130: module controller
140:對位部140: Counterpart
140a:第一對位部140a: the first counterpoint
140b:第二對位部140b: second counterpoint
B:藍光發光元件B: Blue light emitting element
BR:邊框區BR: border area
BS:背側BS: back side
BE:基底BE: base
BE1:基底的第一部分BE1: The first part of the base
BE2:基底的第二部分BE2: The second part of the base
BP:接合墊BP: Bonding pad
CL:線路層CL: line layer
D1~D3:方向D1~D3: direction
DD:資料驅動器DD: data driver
DL:資料線DL: data cable
DP:驅動基板DP: drive substrate
DS:顯示側DS: display side
DR:顯示區DR: display area
E1:第一發光元件E1: The first light-emitting element
E2:第二發光元件E2: second light emitting element
E3:第三發光元件E3: third light-emitting element
E4:第四發光元件E4: fourth light-emitting element
E5:第五發光元件E5: Fifth light-emitting element
E6:第六發光元件E6: sixth light-emitting element
FP:定位部FP: Positioning Department
FPa:第一定位部FPa: First positioning department
FPb:第二定位部FPb: second positioning part
G:綠光發光元件G: Green light emitting element
GV:凹槽GV: groove
GV1:第一凹槽GV1: first groove
GV2:第二凹槽GV2: second groove
GV3:第三凹槽GV3: third groove
M1:第一光罩M1: the first mask
M2:第二光罩M2: second mask
M3:第三光罩M3: third mask
M’:灰階光罩M’: Gray scale mask
MX、MXa:矩陣MX, MXa: matrix
H:導通孔H: Via
H’:孔洞H’: holes
NDR:非顯示區NDR: non-display area
O1:第一開口O1: the first opening
O2:第二開口O2: second opening
O3:第三開口O3: third opening
PS:電源供應器PS: Power supply
PL:電源線PL: power cord
R:紅光發光元件R: red light emitting element
R1:灰階光罩的第一區域R1: the first area of the gray scale mask
R2:灰階光罩的第二區域R2: the second area of the gray scale mask
R3:灰階光罩的第三區域R3: the third area of the gray scale mask
S1:第一表面S1: first surface
S2:第二表面S2: Second surface
S3:底面S3: Underside
S4:內表面S4: inner surface
SS1、SS2:側面SS1, SS2: side
SCL:掃描線SCL: Scan line
SD:掃描驅動器SD: Scan drive
SL:訊號線SL: Signal line
圖1是依照本發明的一實施例的一種顯示模組的上視示意圖。 圖2是圖1中發光模組的剖面示意圖。 圖3是圖1中發光模組的正面示意圖。 圖4是圖1中發光模組的背面示意圖。 圖5是圖1中發光模組與驅動基板的組裝示意圖。 圖6是圖1中剖面A-A’的剖面示意圖。 圖7是本發明另一實施例的發光模組的剖面示意圖。 圖8A至圖8D為圖1中發光模組的製作流程圖。 圖9A至圖9F為圖1中驅動基板的定位部的製作流程圖。 圖10A與圖10B示出圖1中驅動基板的定位部的另一種製作流程圖。 圖11為本發明另一實施例的顯示模組的上視示意圖。 FIG. 1 is a schematic top view of a display module according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view of the light emitting module in FIG. 1. 3 is a schematic front view of the light emitting module in FIG. 1. FIG. 4 is a schematic back view of the light emitting module in FIG. 1. FIG. 5 is an assembly diagram of the light emitting module and the driving substrate in FIG. Fig. 6 is a schematic sectional view of section A-A' in Fig. 1. 7 is a schematic cross-sectional view of a light emitting module according to another embodiment of the invention. 8A to 8D are flowcharts of manufacturing the light emitting module in FIG. 1. 9A to 9F are manufacturing flowcharts of the positioning portion of the driving substrate in FIG. 1. 10A and 10B show another manufacturing flowchart of the positioning portion of the driving substrate in FIG. 1. 11 is a schematic top view of a display module according to another embodiment of the invention.
200:顯示模組 200: display module
100:發光模組 100: light emitting module
110:承載基板 110: carrier substrate
120:發光元件 120: light emitting element
140:對位部 140: Counterpart
B:藍光發光元件 B: Blue light emitting element
BR:邊框區 BR: border area
BE:基底 BE: base
D1~D3:方向 D1~D3: direction
DD:資料驅動器 DD: data driver
DP:驅動基板 DP: drive substrate
DR:顯示區 DR: display area
FP:定位部 FP: Positioning Department
G:綠光發光元件 G: Green light emitting element
MX:矩陣 MX: matrix
NDR:非顯示區 NDR: non-display area
PS:電源供應器 PS: Power supply
R:紅光發光元件 R: red light emitting element
S1:第一表面 S1: first surface
SD:掃描驅動器 SD: Scan drive
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