TWI732089B - Display panel and manufacturing method thereof - Google Patents

Display panel and manufacturing method thereof Download PDF

Info

Publication number
TWI732089B
TWI732089B TW107101376A TW107101376A TWI732089B TW I732089 B TWI732089 B TW I732089B TW 107101376 A TW107101376 A TW 107101376A TW 107101376 A TW107101376 A TW 107101376A TW I732089 B TWI732089 B TW I732089B
Authority
TW
Taiwan
Prior art keywords
substrate
light
sub
substrates
display panel
Prior art date
Application number
TW107101376A
Other languages
Chinese (zh)
Other versions
TW201933603A (en
Inventor
王賢軍
王雅榕
蘇松宇
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW107101376A priority Critical patent/TWI732089B/en
Priority to CN201810203225.5A priority patent/CN108470526A/en
Publication of TW201933603A publication Critical patent/TW201933603A/en
Application granted granted Critical
Publication of TWI732089B publication Critical patent/TWI732089B/en

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A display panel and a manufacturing method thereof are provided. The display panel includes a first substrate, a plurality of light-emitting diodes, a second substrate and a circuit wiring. The first substrate includes a plurality of sub-substrates joined to one another. The first substrate is disposed on the second substrate. The light-emitting diodes are disposed on each sub-substrate. The circuit wiring is located on the second substrate rather than the first substrate. Each light-emitting diode is electrically connected to the circuit wiring.

Description

顯示面板及其製造方法 Display panel and manufacturing method thereof

本發明是有關於一種顯示面板及其製造方法，且特別是有關於一種具有發光二極體的顯示面板及其製造方法。 The present invention relates to a display panel and a manufacturing method thereof, and more particularly to a display panel having a light-emitting diode and a manufacturing method thereof.

隨著光電技術的成熟，顯示器的技術不斷朝小型化發展。一種顯示器為微型發光二極體(micro-LED)顯示器或有機發光二極體(OLED)顯示器，此類型的顯示器採用主動式發光顯示技術，不需要配置額外的背光光源，故可進一步輕薄化顯示器。 With the maturity of optoelectronic technology, display technology continues to develop towards miniaturization. One type of display is a micro-LED display or an organic light-emitting diode (OLED) display. This type of display adopts active light-emitting display technology and does not need to be equipped with an additional backlight light source, so the display can be further thinned .

以微型發光二極體顯示器為例，由於微型發光二極體的尺寸極小，使微型發光二極體的轉移技術面臨挑戰。舉例而言，在將微型發光二極體從載板上轉移至陣列基板上容易會有對位不準的情況發生。若是應用在大尺寸的顯示面板，則無法確保所有的微型發光二極體都能成功轉移，甚至會有損傷或是接合不良的情況發生，進而影響到所產出的顯示面板品質。 Taking a micro light emitting diode display as an example, due to the extremely small size of the micro light emitting diode, the transfer technology of the micro light emitting diode is facing challenges. For example, when the micro light emitting diode is transferred from the carrier board to the array substrate, it is easy to cause misalignment. If it is applied to a large-size display panel, it is impossible to ensure that all the miniature light-emitting diodes can be successfully transferred, and there may even be damage or poor bonding, which affects the quality of the display panel produced.

本發明係有關於一種顯示面板及其製造方法，在設備能力範圍內，將數個發光二極體製作於數個子基板上，再將這些子基板組合於第二基板上，以避免上述問題。 The present invention relates to a display panel and a manufacturing method thereof. Within the capability of the device, a plurality of light-emitting diodes are fabricated on a plurality of sub-substrates, and these sub-substrates are combined on a second substrate to avoid the above-mentioned problems.

根據本發明之一方面，提出一種顯示面板。顯示面板包括一第一基板、複數個發光二極體、一第二基板以及一電路配線。第一基板包括互相拼接設置的複數個子基板，且第一基板係設置於第二基板上。數個發光二極體設置於各子基板上。電路配線位於第二基板上但不位於第一基板上，各發光二極體係電性連接於電路配線。 According to one aspect of the present invention, a display panel is provided. The display panel includes a first substrate, a plurality of light emitting diodes, a second substrate and a circuit wiring. The first substrate includes a plurality of sub-substrates spliced with each other, and the first substrate is disposed on the second substrate. Several light-emitting diodes are arranged on each sub-substrate. The circuit wiring is located on the second substrate but not on the first substrate, and each light emitting diode system is electrically connected to the circuit wiring.

根據本發明之另一方面，提出一種顯示面板之製造方法。製造方法包括以下步驟。設置複數個發光二極體於複數個子基板上。設置一電路配線於一第二基板上但不設置於此些子基板上。組合此些子基板於第二基板上，以使各發光二極體電性連接於電路配線。 According to another aspect of the present invention, a method for manufacturing a display panel is provided. The manufacturing method includes the following steps. A plurality of light-emitting diodes are arranged on the plurality of sub-substrates. A circuit wiring is arranged on a second substrate but not on these sub-substrates. The sub-substrates are combined on the second substrate so that the light-emitting diodes are electrically connected to the circuit wiring.

為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

1、2、3、3’、4、4’:顯示面板 1, 2, 3, 3’, 4, 4’: display panel

10:第一基板 10: The first substrate

100:子基板 100: Sub-substrate

101:第二凹槽 101: second groove

20:第二基板 20: second substrate

201:第四凹槽 201: Fourth Groove

22:電路配線 22: circuit wiring

221:閘極線 221: Gate Line

222:資料線 222: Data Line

223:第一訊號線 223: The first signal line

224:第二訊號線 224: second signal line

225:第一電極接點 225: first electrode contact

226:第二電極接點 226: second electrode contact

30:發光二極體 30: LED

301:第一電極 301: first electrode

302:第二電極 302: second electrode

40:絕緣層 40: Insulation layer

401:第一穿孔 401: first piercing

402:第二穿孔 402: second perforation

50:彩色濾光層 50: Color filter layer

501、502、503:色彩轉換區域 501, 502, 503: color conversion area

60:第一絕緣層 60: first insulating layer

601:第一凹槽 601: first groove

70:第二絕緣層 70: second insulating layer

701:第三凹槽 701: third groove

80:絕緣層 80: insulating layer

801:第一穿孔 801: first piercing

802:第二穿孔 802: second piercing

D1、D2:距離 D1, D2: distance

P1:子畫素結構 P1: Sub-pixel structure

第1圖繪示本發明一實施例之一子基板的示意圖，子基板上設置有數個發光二極體。 FIG. 1 is a schematic diagram of a sub-substrate according to an embodiment of the present invention, and several light-emitting diodes are arranged on the sub-substrate.

第2圖繪示本發明一實施例之一第一基板的示意圖，第一基板係由數個子基板互相拼接而成。 FIG. 2 is a schematic diagram of a first substrate according to an embodiment of the present invention. The first substrate is formed by splicing several sub-substrates with each other.

第3圖繪示本發明一實施例中，將第一基板設置於第二基板上的示意圖。 FIG. 3 is a schematic diagram of the first substrate being disposed on the second substrate in an embodiment of the present invention.

第4圖繪示本發明一實施例之顯示面板的部分剖視圖。 FIG. 4 is a partial cross-sectional view of a display panel according to an embodiment of the invention.

第5圖繪示本發明另一實施例之顯示面板的部分剖視圖。 FIG. 5 is a partial cross-sectional view of a display panel according to another embodiment of the invention.

第6A和6B圖繪示本發明一些實施例之顯示面板的部分剖視圖。 6A and 6B show partial cross-sectional views of display panels according to some embodiments of the present invention.

第7A和7B圖繪示本發明其它實施例之顯示面板的部分剖視圖。 7A and 7B are partial cross-sectional views of display panels according to other embodiments of the present invention.

以下係提出各種實施例進行詳細說明，本發明並非顯示出所有可能的實施例，未於本發明提出的其它實施態樣也可以應用。再者，圖式上的尺寸比例並非按照實際產品等比例繪製。因此，說明書和圖示內容僅作敘述實施例之用，而非作為限縮本發明保護範圍之用。此外，實施例中之圖式係省略部分元件，以清楚顯示本發明之技術特點。以下是以相同/類似的符號表示相同/類似的元件或步驟做說明。 Various embodiments are proposed below for detailed description. The present invention does not show all possible embodiments, and other embodiments not proposed by the present invention can also be applied. Furthermore, the size ratios in the drawings are not drawn in proportion to the actual products. Therefore, the contents of the description and illustrations are only used to describe the embodiments, rather than to limit the scope of protection of the present invention. In addition, some elements are omitted from the drawings in the embodiments to clearly show the technical features of the present invention. In the following, the same/similar symbols represent the same/similar elements or steps for description.

請參照第1圖，其繪示本發明一實施例之一子基板100的示意圖。數個發光二極體30係設置於子基板100上，例如是以陣列式排列於子基板100上。於一實施例中，發光二極體30係微型發光二極體，其可從一載體轉移至子基板100上，例如是以黏著、靜電吸附、真空吸引等方式轉移至子基板100上。於此，係以9×9個發光二極體30設置在一個子基板100上為例說明，然應理解的是本發明之發光二極 體30的數量並不以此為限，當可視實際轉移機台的設備能力選擇合適尺寸的子基板100以及設置於其上的發光二極體30之數量。 Please refer to FIG. 1, which shows a schematic diagram of a sub-substrate 100 according to an embodiment of the present invention. The plurality of light emitting diodes 30 are disposed on the sub-substrate 100, for example, arranged in an array on the sub-substrate 100. In one embodiment, the light-emitting diode 30 is a miniature light-emitting diode, which can be transferred from a carrier to the sub-substrate 100, such as by adhesion, electrostatic adsorption, vacuum attraction, etc., to the sub-substrate 100. Here, 9×9 light-emitting diodes 30 are arranged on a sub-substrate 100 as an example. However, it should be understood that the light-emitting diodes of the present invention The number of bodies 30 is not limited to this, and the number of sub-substrates 100 of suitable size and the number of light-emitting diodes 30 arranged on it can be selected according to the equipment capacity of the actual transfer machine.

接著，請參照第2圖，其繪示本發明一實施例之一第一基板10的示意圖。當依照第1圖之示例完成數個發光二極體30轉移於數個子基板100上之後，互相拼接這些子基板100，以形成一大面積之第一基板10。第一基板10的尺寸可隨所拼接之子基板100的尺寸及數量而定，例如可依據製作出之顯示面板的顯示畫面比例來選擇合適尺寸及數量的子基板100，再將這些子基板100互相拼接而成。於此，位於兩相鄰子基板100拼接處之兩相鄰發光二極體30之間的距離D1，實質上等於一子基板100中兩相鄰發光二極體30之間的距離D2。 Next, please refer to FIG. 2, which shows a schematic diagram of a first substrate 10 according to an embodiment of the present invention. After the light emitting diodes 30 are transferred to the sub-substrates 100 according to the example in FIG. 1, the sub-substrates 100 are joined to each other to form the first substrate 10 with a large area. The size of the first substrate 10 can be determined by the size and number of the sub-substrates 100 to be spliced. For example, the sub-substrates 100 of suitable size and number can be selected according to the display screen ratio of the manufactured display panel, and then the sub-substrates 100 can be connected to each other. Stitched together. Here, the distance D1 between two adjacent light-emitting diodes 30 at the junction of two adjacent sub-substrates 100 is substantially equal to the distance D2 between two adjacent light-emitting diodes 30 in one sub-substrate 100.

應特別說明的是，於此步驟下完成之第一基板10上並未包括任何電路配線，也就是說，於發光二極體30之間並未具有任何電路走線連接於彼此。 It should be particularly noted that the first substrate 10 completed in this step does not include any circuit wiring, that is, there is no circuit wiring between the light-emitting diodes 30 connected to each other.

接著，請參照第3圖，其繪示本發明一實施例中，將第一基板10設置於第二基板20上的示意圖。一電路配線22係設置於第二基板20上，但不設置於第一基板10上，而各發光二極體30係電性連接於電路配線22。 Next, please refer to FIG. 3, which illustrates a schematic diagram of the first substrate 10 being disposed on the second substrate 20 in an embodiment of the present invention. A circuit wiring 22 is provided on the second substrate 20, but not on the first substrate 10, and each light-emitting diode 30 is electrically connected to the circuit wiring 22.

詳細地說，請參照第3圖中一子畫素結構P1的放大圖，每個子畫素結構P1係對應於一個發光二極體30。電路配線22包括數條閘極線221、數條資料線222、數條第一訊號線223及數條第二訊號線224。第一訊號線223係電性連接於第一電極接點225，第二訊號線224係電性連接於第二電極接點226。當第一基板10設置於第二基板20上 時，各發光二極體30的第一電極(例如是N型電極)係接合至一相應的第一電極接點225，而各發光二極體30的第二電極(例如是P型電極)係接合至一相應的第二電極接點226，使各發光二極體30電性連接於電路配線22。也就是說，各個發光二極體30可經由電路配線22來單獨控制。 In detail, please refer to the enlarged view of a sub-pixel structure P1 in FIG. 3. Each sub-pixel structure P1 corresponds to a light emitting diode 30. The circuit wiring 22 includes a plurality of gate lines 221, a plurality of data lines 222, a plurality of first signal lines 223, and a plurality of second signal lines 224. The first signal line 223 is electrically connected to the first electrode contact 225, and the second signal line 224 is electrically connected to the second electrode contact 226. When the first substrate 10 is placed on the second substrate 20 At this time, the first electrode (for example, an N-type electrode) of each light-emitting diode 30 is connected to a corresponding first electrode contact 225, and the second electrode (for example, a P-type electrode) of each light-emitting diode 30 It is connected to a corresponding second electrode contact 226 so that each light-emitting diode 30 is electrically connected to the circuit wiring 22. In other words, each light emitting diode 30 can be individually controlled via the circuit wiring 22.

於一實施例中，第一基板10例如是以倒置的方式，使各發光二極體30的第一電極301和第二電極302(標示於第4圖)面向於相應的第一電極接點225和第二電極接點226。於此，發光二極體30的第一電極301和第二電極302可透過異方性導電膜或焊料接點等方式電性連接於相應的第一電極接點225和第二電極接點226，以電性連接於電路配線22。 In one embodiment, the first substrate 10 is, for example, in an inverted manner, so that the first electrode 301 and the second electrode 302 (marked in FIG. 4) of each light-emitting diode 30 face the corresponding first electrode contacts 225 and the second electrode contact 226. Here, the first electrode 301 and the second electrode 302 of the light-emitting diode 30 can be electrically connected to the corresponding first electrode contact 225 and the second electrode contact 226 through an anisotropic conductive film or solder contact. , It is electrically connected to the circuit wiring 22.

請參照第4圖，其繪示本發明一實施例之顯示面板1的部分剖視圖。第一訊號線223與第二訊號線224形成於第二基板20上。顯示面板1更包括一絕緣層40，設置於第二基板20、第一訊號線223與第二訊號線224上，第一電極接點225與第二電極接點226係設置於絕緣層40上。絕緣層40具有數個第一穿孔401及數個第二穿孔402，第一電極接點225係經由相應的第一穿孔401而電性連接於相應的第一訊號線223，第二電極接點226係經由相應的第二穿孔402而電性連接於相應的第二訊號線224。 Please refer to FIG. 4, which shows a partial cross-sectional view of the display panel 1 according to an embodiment of the present invention. The first signal line 223 and the second signal line 224 are formed on the second substrate 20. The display panel 1 further includes an insulating layer 40 disposed on the second substrate 20, the first signal line 223 and the second signal line 224, and the first electrode contact 225 and the second electrode contact 226 are disposed on the insulating layer 40 . The insulating layer 40 has a plurality of first through holes 401 and a plurality of second through holes 402. The first electrode contacts 225 are electrically connected to the corresponding first signal lines 223 through the corresponding first through holes 401, and the second electrode contacts 226 is electrically connected to the corresponding second signal line 224 through the corresponding second through hole 402.

於此實施例中，第一基板10(或各子基板100)可為一素玻璃基板或一可撓性基板。在一些實施例中，發光二極體30可為藍光發光二極體、紅光發光二極體、綠光發光二極體、白光發光二極體等 或其組合。各個顯示不同顏色的發光二極體30對應於一組第一電極接點225與第二電極接點226設置，使顯示面板1可顯示各種色彩。 In this embodiment, the first substrate 10 (or each sub-substrate 100) may be a plain glass substrate or a flexible substrate. In some embodiments, the light-emitting diode 30 may be a blue light-emitting diode, a red light-emitting diode, a green light-emitting diode, a white light-emitting diode, etc. Or a combination. Each light emitting diode 30 displaying different colors is arranged corresponding to a set of first electrode contacts 225 and second electrode contacts 226, so that the display panel 1 can display various colors.

在完成上述之第一基板10與第二基板20的對組之後，可對顯示面板1或第二基板20進行電性檢測程序，或是於第一基板10與第二基板20的對組之前，對第一基板10或子基板100進行電性檢測程序，進而檢測出是否有任何發光二極體30損壞而無法正常發光。於此，若檢測出具有缺陷的發光二極體30，即可進行汰換或修復，而不會對電路配線22造成影響。 After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, the electrical inspection procedure can be performed on the display panel 1 or the second substrate 20, or before the pairing of the first substrate 10 and the second substrate 20 , Perform an electrical inspection program on the first substrate 10 or the sub-substrate 100, and then detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

請參照第5圖，其繪示本發明另一實施例之顯示面板2的部分剖視圖。與第4圖之實施例不同的是，顯示面板2更包括一彩色濾光層50，設置於各子基板100上。於製作時，係先於各子基板100上設置一彩色濾光層50。接著，再將數個發光二極體30設置於各子基板100的彩色濾光層50上。而後，進行第一基板10與第二基板20的對組。 Please refer to FIG. 5, which shows a partial cross-sectional view of a display panel 2 according to another embodiment of the present invention. Different from the embodiment in FIG. 4, the display panel 2 further includes a color filter layer 50 disposed on each sub-substrate 100. During the production, a color filter layer 50 is provided on each sub-substrate 100 first. Then, several light-emitting diodes 30 are disposed on the color filter layer 50 of each sub-substrate 100. Then, the pairing of the first substrate 10 and the second substrate 20 is performed.

彩色濾光層50可包括數個色彩轉換區域501、502、503，色彩轉換區域501、502、503各自對應設置於各發光二極體30與各子基板100之間。在一實施例中，色彩轉換區域501、502、503例如可為量子點層、色阻層、或其它合適的材料或上述之組合，色彩轉換區域501、502、503可採用不同顏色的色彩轉換材料，例如是紅色、綠色及藍色的色彩轉換材料，而發光二極體30可為白光發光二極體。藉此，使顯示面板2可顯示各種色彩。 The color filter layer 50 may include a plurality of color conversion regions 501, 502, and 503, and the color conversion regions 501, 502, and 503 are respectively correspondingly disposed between each light-emitting diode 30 and each sub-substrate 100. In one embodiment, the color conversion areas 501, 502, 503 can be, for example, quantum dot layers, color resist layers, or other suitable materials or a combination of the above, and the color conversion areas 501, 502, 503 can adopt different colors for color conversion. The material is, for example, red, green, and blue color conversion materials, and the light-emitting diode 30 may be a white light-emitting diode. In this way, the display panel 2 can display various colors.

在完成上述之第一基板10與第二基板20的對組之後，可對顯示面板2或第二基板20進行電性檢測程序，或是於第一基板10與 第二基板20的對組之前，對第一基板10或子基板100進行電性檢測程序，進而檢測出是否有任何發光二極體30損壞而無法正常發光。於此，若檢測出具有缺陷的發光二極體30，即可進行汰換或修復，而不會對電路配線22造成影響。 After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, an electrical inspection procedure can be performed on the display panel 2 or the second substrate 20, or on the first substrate 10 and the second substrate 20. Before the pairing of the second substrate 20, an electrical inspection procedure is performed on the first substrate 10 or the sub-substrate 100 to detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

請參照第6A和6B圖，其繪示本發明一些實施例之顯示面板3、3’的部分剖視圖。請參照第6A圖，與第4圖之實施例不同的是，顯示面板3更包括一第一絕緣層60，設置於各子基板100上。於製作時，係先於各子基板100上設置一第一絕緣層60。接著，在第一絕緣層60中形成數個第一凹槽601，再將數個發光二極體30設置於相應的第一凹槽601內，以提升發光二極體30的轉移精度。而後，進行第一基板10與第二基板20的對組。 Please refer to FIGS. 6A and 6B, which illustrate partial cross-sectional views of the display panels 3, 3'according to some embodiments of the present invention. Please refer to FIG. 6A. The difference from the embodiment in FIG. 4 is that the display panel 3 further includes a first insulating layer 60 disposed on each of the sub-substrates 100. During production, a first insulating layer 60 is provided on each sub-substrate 100 first. Next, a plurality of first grooves 601 are formed in the first insulating layer 60, and then a plurality of light-emitting diodes 30 are disposed in the corresponding first grooves 601 to improve the transfer accuracy of the light-emitting diodes 30. Then, the pairing of the first substrate 10 and the second substrate 20 is performed.

第一絕緣層60可包括色彩轉換材料或光阻材料，第一凹槽601可以色彩轉換材料或光阻材料曝光顯影而形成。再者，第一絕緣層60可更包括黑色矩陣，以降低混光之情形發生。 The first insulating layer 60 may include a color conversion material or a photoresist material, and the first groove 601 may be formed by exposing and developing the color conversion material or the photoresist material. Furthermore, the first insulating layer 60 may further include a black matrix to reduce the occurrence of light mixing.

在另一實施例中，請參照第6B圖，與第6A圖之實施例不同的是，顯示面板3’不具有第一絕緣層60。反而，於製作時，係於各子基板100中形成數個第二凹槽101，例如是以蝕刻子基板100的方式形成數個第二凹槽101，再將數個發光二極體30設置於相應的第二凹槽101內，以提升發光二極體30的轉移精度。而後，進行第一基板10與第二基板20的對組。 In another embodiment, please refer to FIG. 6B. The difference from the embodiment in FIG. 6A is that the display panel 3'does not have the first insulating layer 60. On the contrary, during production, a plurality of second grooves 101 are formed in each sub-substrate 100, for example, a plurality of second grooves 101 are formed by etching the sub-substrate 100, and then a plurality of light-emitting diodes 30 are arranged In the corresponding second groove 101 to improve the transfer accuracy of the light-emitting diode 30. Then, the pairing of the first substrate 10 and the second substrate 20 is performed.

在完成上述之第一基板10與第二基板20的對組之後，可對顯示面板3、3’或第二基板20進行電性檢測程序，或是於第一基板 10與第二基板20的對組之前，對第一基板10或子基板100進行電性檢測程序，進而檢測出是否有任何發光二極體30損壞而無法正常發光。於此，若檢測出具有缺陷的發光二極體30，即可進行汰換或修復，而不會對電路配線22造成影響。 After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, the electrical inspection process can be performed on the display panel 3, 3'or the second substrate 20, or on the first substrate Before the pairing of 10 and the second substrate 20, an electrical inspection procedure is performed on the first substrate 10 or the sub-substrate 100 to detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

請參照第7A和7B圖，其繪示本發明其它實施例之顯示面板4、4’的部分剖視圖。請參照第7A圖，與第4圖之實施例不同的是，顯示面板4更包括一第二絕緣層70，設置於第二基板20上。詳細地說，第二絕緣層70係設置於絕緣層40上，第二絕緣層70可包括色彩轉換材料或光阻材料，並可藉由曝光顯影的方式在色彩轉換材料或光阻材料中形成第三凹槽701，而電路配線22的第一電極接點225與第二電極接點226係各自從各個第三凹槽701露出。當第一基板10與第二基板20對組時，各發光二極體30實質上對準於相應的第三凹槽701中的第一電極接點225與第二電極接點226，以提升對組的精度。也就是說，在本實施例中，可搭配在陣列基板(即第二基板20)上製作彩色濾光層之技術(Color filter On Array,COA)來製作顯示面板4。雖然第7A圖中顯示絕緣層40與第二絕緣層70為兩層之結構，但熟悉此技藝人士當可瞭解，絕緣層40與第二絕緣層70可為單一層或者兩層以上的結構。 Please refer to FIGS. 7A and 7B, which show partial cross-sectional views of display panels 4, 4'according to other embodiments of the present invention. Please refer to FIG. 7A. The difference from the embodiment in FIG. 4 is that the display panel 4 further includes a second insulating layer 70 disposed on the second substrate 20. In detail, the second insulating layer 70 is disposed on the insulating layer 40. The second insulating layer 70 can include a color conversion material or a photoresist material, and can be formed in the color conversion material or photoresist material by exposure and development. The third groove 701, and the first electrode contact 225 and the second electrode contact 226 of the circuit wiring 22 are respectively exposed from each third groove 701. When the first substrate 10 and the second substrate 20 are paired, each light-emitting diode 30 is substantially aligned with the first electrode contact 225 and the second electrode contact 226 in the corresponding third groove 701 to improve The accuracy of the group. That is to say, in this embodiment, the display panel 4 can be manufactured with the technology of manufacturing a color filter layer (Color filter On Array, COA) on the array substrate (ie, the second substrate 20). Although FIG. 7A shows the insulating layer 40 and the second insulating layer 70 as a two-layer structure, those skilled in the art will understand that the insulating layer 40 and the second insulating layer 70 can be a single layer or a two-layer structure.

在另一實施例中，請參照第7B圖，與第7A圖之實施例不同的是，顯示面板4’不具有第二絕緣層70。反而，於製作時，係於第二基板20中形成數個第四凹槽201，例如是以蝕刻第二基板20的方式形成數個第四凹槽201，再將電路配線22製作於第四凹槽201內。 In another embodiment, please refer to FIG. 7B. The difference from the embodiment in FIG. 7A is that the display panel 4'does not have the second insulating layer 70. On the contrary, during production, a plurality of fourth grooves 201 are formed in the second substrate 20, for example, a plurality of fourth grooves 201 are formed by etching the second substrate 20, and then the circuit wiring 22 is fabricated on the fourth groove 201. In the groove 201.

詳細地說，第一訊號線223與第二訊號線224形成於第四凹槽201內。顯示面板4’更包括一絕緣層80，設置於第四凹槽201內，並覆蓋第一訊號線223與第二訊號線224，第一電極接點225與第二電極接點226係設置於絕緣層80上。絕緣層80具有數個第一穿孔801及數個第二穿孔802，第一電極接點225係經由相應的第一穿孔801而電性連接於相應的第一訊號線223，第二電極接點226係經由相應的第二穿孔802而電性連接於相應的第二訊號線224。藉此，電路配線22的第一電極接點225與第二電極接點226係各自從各個第四凹槽201露出。當第一基板10與第二基板20對組時，各發光二極體30實質上對準於相應的第四凹槽201中的第一電極接點225與第二電極接點226，以提升對組的精度。 In detail, the first signal line 223 and the second signal line 224 are formed in the fourth groove 201. The display panel 4'further includes an insulating layer 80 disposed in the fourth groove 201 and covering the first signal line 223 and the second signal line 224. The first electrode contact 225 and the second electrode contact 226 are disposed in On the insulating layer 80. The insulating layer 80 has a plurality of first through holes 801 and a plurality of second through holes 802. The first electrode contacts 225 are electrically connected to the corresponding first signal lines 223 through the corresponding first through holes 801, and the second electrode contacts 226 is electrically connected to the corresponding second signal line 224 through the corresponding second through hole 802. Thereby, the first electrode contact 225 and the second electrode contact 226 of the circuit wiring 22 are exposed from the respective fourth grooves 201, respectively. When the first substrate 10 and the second substrate 20 are paired together, each light-emitting diode 30 is substantially aligned with the first electrode contact 225 and the second electrode contact 226 in the corresponding fourth groove 201 to enhance The accuracy of the group.

在完成上述之第一基板10與第二基板20的對組之後，可對顯示面板4、4’或第二基板20進行電性檢測程序，或是於第一基板10與第二基板20的對組之前，對第一基板10或子基板100進行電性檢測程序，進而檢測出是否有任何發光二極體30損壞而無法正常發光。 於此，若檢測出具有缺陷的發光二極體30，即可進行汰換或修復，而不會對電路配線22造成影響。 After the above-mentioned pairing of the first substrate 10 and the second substrate 20 is completed, electrical inspection procedures can be performed on the display panels 4, 4'or the second substrate 20, or on the first substrate 10 and the second substrate 20. Before grouping, an electrical inspection procedure is performed on the first substrate 10 or the sub-substrate 100 to detect whether any light-emitting diode 30 is damaged and cannot emit light normally. Here, if a defective light emitting diode 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

綜上，根據上述實施例，係先將數個發光二極體(例如是微型發光二極體)設置於數個子基板上。另一方面，係將一電路配線設置於一第二基板上但不設置於此些子基板上。接著，將這些子基板設置於第二基板上，例如是互相拼接這些子基板，以形成一第一基板，並將第一基板設置於第二基板上，以使各發光二極體電性連接於電路 配線。藉此，第一基板上的各個發光二極體可藉由第二基板上的電路配線來單獨控制。同時，依此方式製作出的第一基板可不受轉移機台的設備能力的限制，故可滿足現今大尺寸之顯示畫面的需求。再者，在完成第一基板與第二基板的對組之後，可對顯示面板或第二基板進行電性檢測程序，或是於第一基板與第二基板的對組之前，對第一基板或子基板進行電性檢測程序，進而能夠檢測出是否有任何發光二極體損壞，損壞的發光二極體可立即進行汰換或修復，而不會對電路配線造成影響。 In summary, according to the above-mentioned embodiment, a number of light-emitting diodes (for example, miniature light-emitting diodes) are first arranged on a number of sub-substrates. On the other hand, a circuit wiring is arranged on a second substrate but not on these sub-substrates. Then, the sub-substrates are disposed on the second substrate, for example, the sub-substrates are joined to each other to form a first substrate, and the first substrate is disposed on the second substrate to electrically connect the light-emitting diodes In the circuit Wiring. In this way, each light emitting diode on the first substrate can be individually controlled by the circuit wiring on the second substrate. At the same time, the first substrate produced in this way is not limited by the equipment capacity of the transfer machine, so it can meet the needs of today's large-size display screen. Furthermore, after the pairing of the first substrate and the second substrate is completed, the electrical inspection procedure can be performed on the display panel or the second substrate, or before the pairing of the first substrate and the second substrate, the first substrate Or the sub-substrate undergoes an electrical inspection program to detect whether any light-emitting diodes are damaged. The damaged light-emitting diodes can be replaced or repaired immediately without affecting the circuit wiring.

此外，上述將數個發光二極體設置於數個子基板上之步驟更可包括以下各種實施例及其變形。在一實施例中，可先設置一彩色濾光層於各子基板上，再將數個發光二極體設置於各子基板的彩色濾光層上，使顯示面板可顯示各種色彩。在一些實施例中，可先設置一第一絕緣層於各子基板上，並於第一絕緣層中形成數個第一凹槽。或者，亦可直接於各子基板中形成數個第二凹槽。接著，再將數個發光二極體設置於相應的第一凹槽或第二凹槽內，以提升發光二極體的轉移精度。 In addition, the above-mentioned step of disposing a plurality of light-emitting diodes on a plurality of sub-substrates may further include the following various embodiments and their modifications. In one embodiment, a color filter layer can be provided on each sub-substrate first, and then a plurality of light-emitting diodes can be provided on the color filter layer of each sub-substrate, so that the display panel can display various colors. In some embodiments, a first insulating layer may be provided on each sub-substrate first, and a plurality of first grooves may be formed in the first insulating layer. Alternatively, several second grooves can also be directly formed in each sub-substrate. Then, several light-emitting diodes are arranged in the corresponding first grooves or second grooves to improve the transfer accuracy of the light-emitting diodes.

再者，上述將電路配線設置於第二基板上但不設置於此些子基板上之步驟更可包括以下各種實施例及其變形。在一實施例中，可設置一第二絕緣層於第二基板上，第二絕緣層具有數個第三凹槽，電路配線的數個電極接點係各自露出於各第三凹槽。接著，各發光二極體可實質上對準於相應的第三凹槽中的各電極接點，以提升對組的精度。在另一實施例中，可直接於第二基板中形成數個第四凹槽， 再將電路配線製作於第四凹槽內，並露出數個電極接點。接著，各發光二極體可實質上對準於相應的第四凹槽中的各電極接點，以提升對組的精度。 Furthermore, the above steps of disposing the circuit wiring on the second substrate but not on the sub-substrates may further include the following various embodiments and their modifications. In one embodiment, a second insulating layer may be disposed on the second substrate. The second insulating layer has a plurality of third grooves, and the plurality of electrode contacts of the circuit wiring are respectively exposed in the third grooves. Then, each light-emitting diode can be substantially aligned with each electrode contact in the corresponding third groove to improve the accuracy of the pairing. In another embodiment, several fourth grooves can be directly formed in the second substrate, Then, the circuit wiring is fabricated in the fourth groove, and several electrode contacts are exposed. Then, each light-emitting diode can be substantially aligned with each electrode contact in the corresponding fourth groove to improve the accuracy of the pairing.

綜上所述，雖然本發明已以實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10:第一基板 10: The first substrate

20:第二基板 20: second substrate

22:電路配線 22: circuit wiring

221:閘極線 221: Gate Line

222:資料線 222: Data Line

223:第一訊號線 223: The first signal line

224:第二訊號線 224: second signal line

225:第一電極接點 225: first electrode contact

226:第二電極接點 226: second electrode contact

30:發光二極體 30: LED

P1:子畫素結構 P1: Sub-pixel structure

Claims (10)

一種顯示面板，包括：一第一基板，包括互相拼接設置的複數個子基板；複數個發光二極體，該些發光二極體中的複數者係設置於該些子基板中的每一者上；一第二基板，該第一基板係設置於該第二基板上，且該些子基板上的各該發光二極體實質上面向於該第二基板；以及一電路配線，位於該第二基板上但不位於該第一基板上，各該發光二極體係電性直接連接於該電路配線。 A display panel includes: a first substrate including a plurality of sub-substrates spliced with each other; a plurality of light-emitting diodes, a plurality of the light-emitting diodes are arranged on each of the sub-substrates A second substrate, the first substrate is set on the second substrate, and each of the light-emitting diodes on the sub-substrates substantially face the second substrate; and a circuit wiring located on the second substrate On the substrate but not on the first substrate, each of the light-emitting diode systems is directly electrically connected to the circuit wiring. 如申請專利範圍第1項所述之顯示面板，其中各該發光二極體包括一第一電極與一第二電極，該電路配線包括複數個第一電極接點與複數個第二電極接點，各該發光二極體的該第一電極接合至相應的該些第一電極接點，且各該發光二極體的該第二電極接合至相應的該些第二電極接點。 The display panel described in item 1 of the scope of patent application, wherein each of the light-emitting diodes includes a first electrode and a second electrode, and the circuit wiring includes a plurality of first electrode contacts and a plurality of second electrode contacts , The first electrode of each light emitting diode is connected to the corresponding first electrode contacts, and the second electrode of each light emitting diode is connected to the corresponding second electrode contacts. 如申請專利範圍第2項所述之顯示面板，其中該第一電極實質上面向於相應的該些第一電極接點，且該第二電極實質上面向於相應的該些第二電極接點。 According to the display panel described in claim 2, wherein the first electrode substantially faces the corresponding first electrode contacts, and the second electrode substantially faces the corresponding second electrode contacts . 如申請專利範圍第1項所述之顯示面板，更包括： 一彩色濾光層，設置於各該子基板上，該彩色濾光層包括複數個色彩轉換區域，該些色彩轉換區域各自對應設置於各該發光二極體與各該子基板之間。 The display panel described in item 1 of the scope of patent application includes: A color filter layer is disposed on each of the sub-substrates. The color filter layer includes a plurality of color conversion regions, and the color conversion regions are respectively correspondingly disposed between each of the light-emitting diodes and each of the sub-substrates. 如申請專利範圍第1項所述之顯示面板，更包括：一第一絕緣層，設置於各該子基板上，該第一絕緣層具有複數個第一凹槽，各該發光二極體係設置於相應的該些第一凹槽內。 The display panel described in item 1 of the scope of patent application further includes: a first insulating layer disposed on each of the sub-substrates, the first insulating layer has a plurality of first grooves, and each of the light-emitting diode systems is disposed In the corresponding first grooves. 如申請專利範圍第1項所述之顯示面板，其中各該子基板具有複數個第二凹槽，各該發光二極體係設置於相應的該些第二凹槽內。 According to the display panel described in item 1 of the scope of patent application, each of the sub-substrates has a plurality of second grooves, and each of the light-emitting diode systems is disposed in the corresponding second grooves. 如申請專利範圍第1項所述之顯示面板，更包括：一第二絕緣層，設置於該第二基板上，該第二絕緣層具有複數個第三凹槽，該電路配線的複數個電極接點係各自露出於各該第三凹槽，各該發光二極體實質上對準於相應的該些第三凹槽中的各該電極接點。 The display panel described in item 1 of the scope of patent application further includes: a second insulating layer disposed on the second substrate, the second insulating layer having a plurality of third grooves, and a plurality of electrodes of the circuit wiring The contacts are respectively exposed in the third grooves, and the light-emitting diodes are substantially aligned with the electrode contacts in the corresponding third grooves. 如申請專利範圍第1項所述之顯示面板，其中該第二基板具有一第四凹槽，該電路配線係設置於該第四凹槽內，並露出複數個電極接點，各該發光二極體實質上對準於相應的該些電極接點。 As for the display panel described in claim 1, wherein the second substrate has a fourth groove, the circuit wiring is arranged in the fourth groove, and a plurality of electrode contacts are exposed, each of the two light-emitting The pole bodies are substantially aligned with the corresponding electrode contacts. 一種顯示面板之製造方法，包括：設置複數個發光二極體的複數者於複數個子基板的每一者上；設置一電路配線於一第二基板上但不設置於該些子基板上；以及組合該些子基板於該第二基板上，以使各該發光二極體直接電性連接於該電路配線，且該些子基板上的各該發光二極體實質上面向於該第二基板。 A method for manufacturing a display panel includes: arranging a plurality of light-emitting diodes on each of the plurality of sub-substrates; arranging a circuit wiring on a second substrate but not on the sub-substrates; and Combine the sub-substrates on the second substrate so that each of the light-emitting diodes is directly electrically connected to the circuit wiring, and each of the light-emitting diodes on the sub-substrates substantially faces the second substrate . 如申請專利範圍第9項所述之製造方法，其中組合該些子基板於該第二基板上的步驟包括：互相拼接該些子基板，以形成一第一基板；以及組合該第一基板於該第二基板上。 According to the manufacturing method described in claim 9, wherein the step of combining the sub-substrates on the second substrate includes: joining the sub-substrates to each other to form a first substrate; and combining the first substrate with On the second substrate.
TW107101376A 2018-01-15 2018-01-15 Display panel and manufacturing method thereof TWI732089B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW107101376A TWI732089B (en) 2018-01-15 2018-01-15 Display panel and manufacturing method thereof
CN201810203225.5A CN108470526A (en) 2018-01-15 2018-03-13 Display panel and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107101376A TWI732089B (en) 2018-01-15 2018-01-15 Display panel and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201933603A TW201933603A (en) 2019-08-16
TWI732089B true TWI732089B (en) 2021-07-01

Family

ID=63265231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107101376A TWI732089B (en) 2018-01-15 2018-01-15 Display panel and manufacturing method thereof

Country Status (2)

Country Link
CN (1) CN108470526A (en)
TW (1) TWI732089B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200053841A (en) * 2018-11-09 2020-05-19 (주)포인트엔지니어링 Micro led carrier for correcting position error and micro led transfer system
CN110212079B (en) * 2019-05-17 2020-12-08 深圳市华星光电半导体显示技术有限公司 Transfer method of Micro-LED chip and Micro-LED display panel
CN110827709B (en) * 2019-11-26 2023-05-23 苏州佳世达电通有限公司 Display module
CN111063268A (en) * 2019-12-12 2020-04-24 深圳市华星光电半导体显示技术有限公司 Micro light-emitting diode display panel, preparation method thereof and display device
US11355473B2 (en) * 2020-06-16 2022-06-07 A.U. Vista, Inc. Tiled light emitting diode display panel having different resistance per unit length signal lines
CN113451365B (en) * 2020-06-23 2022-05-31 重庆康佳光电技术研究院有限公司 Spliced display device and manufacturing method thereof
CN111613175B (en) * 2020-06-29 2021-08-31 上海天马微电子有限公司 Display panel, preparation method thereof and display device
US11574953B2 (en) 2020-08-31 2023-02-07 A.U. Vista, Inc. Mosaic active matrix driven light emitting diode (LED) display panel
TWI784612B (en) 2021-07-05 2022-11-21 友達光電股份有限公司 Display device
CN113809116B (en) * 2021-09-16 2024-02-13 京东方科技集团股份有限公司 Display substrate, preparation method thereof and display device
CN114784047A (en) * 2022-05-24 2022-07-22 厦门大学 Active driving type Micro-LED substrate, display device and packaging method
CN116053367A (en) * 2023-03-06 2023-05-02 苏州晶台光电有限公司 MiniLED backlight lamp bead, backlight module manufacturing method, backlight lamp bead and backlight module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160072011A1 (en) * 2013-07-29 2016-03-10 Seoul Viosys Co., Ltd. Light emitting diode, method of fabricating the same and led module having the same
CN106297571A (en) * 2015-05-15 2017-01-04 弘凯光电(深圳)有限公司 Modularized limit emitting diode (LED) display panel and LED luminous plaque
US20170148771A1 (en) * 2015-11-19 2017-05-25 Samsung Electronics Co., Ltd. Light source module, display panel, and display apparatus including the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6370019B1 (en) * 1998-02-17 2002-04-09 Sarnoff Corporation Sealing of large area display structures
JP6842234B2 (en) * 2015-10-13 2021-03-17 ローム株式会社 Manufacturing method of optical semiconductor device and optical semiconductor device
CN106684108B (en) * 2015-11-05 2019-10-08 群创光电股份有限公司 Emitting diode display device
CN106782128A (en) * 2017-01-24 2017-05-31 深圳市华星光电技术有限公司 Micro- LED display panel and its manufacture method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160072011A1 (en) * 2013-07-29 2016-03-10 Seoul Viosys Co., Ltd. Light emitting diode, method of fabricating the same and led module having the same
CN106297571A (en) * 2015-05-15 2017-01-04 弘凯光电(深圳)有限公司 Modularized limit emitting diode (LED) display panel and LED luminous plaque
US20170148771A1 (en) * 2015-11-19 2017-05-25 Samsung Electronics Co., Ltd. Light source module, display panel, and display apparatus including the same

Also Published As

Publication number Publication date
TW201933603A (en) 2019-08-16
CN108470526A (en) 2018-08-31

Similar Documents

Publication Publication Date Title
TWI732089B (en) Display panel and manufacturing method thereof
KR20230017757A (en) Display panel and display device
US10033018B2 (en) Display device and method of manufacturing a display device
TWI679756B (en) Light emitting diode panel and manufacturing method thereof
KR20220025653A (en) Light-emitting display unit and display apparatus
TW202025240A (en) Massive transferring method of micro leds and light-emitting panel module using the method
CN113130463B (en) Light-emitting substrate, preparation method thereof and display device
US11942485B2 (en) Substrate having dual edge connection line and method for manufacturing the same, display panel, and display apparatus
CN111681610A (en) Display device and manufacturing method thereof
TWI738533B (en) Display panel and manufacturing method thereof
CN110491922B (en) Display substrate, manufacturing method thereof and display device
EP3316332A1 (en) Display device having a white emitting area
CN109148545B (en) Display panel and display device
WO2021227713A1 (en) Array substrate and detection method therefor, and tiled display panel
WO2021212560A1 (en) Detection device and detection method
US11631619B2 (en) Array substrate and fabricating method thereof, display panel and display device
WO2020222343A1 (en) Display device using semiconductor light emitting diode
TWI744035B (en) Display panel and method for manufacturing the same
CN112133245B (en) Drive chip full-embedded LED display screen based on thin film circuit
KR100759896B1 (en) Backlight module stacked at least one luminescence element and fabrication thereof
CN109935612B (en) Mini LED display screen and manufacturing method
CN113748514B (en) Display panel and display device
CN113748507B (en) Display panel and display device
JP2006190630A (en) Organic electroluminescent element and its manufacturing method
CN113594325A (en) Display panel, manufacturing method thereof and display device