TW201933603A - Display panel and manufacturing method thereof - Google Patents

Abstract

A display panel and a manufacturing method thereof are provided. The display panel includes a first substrate, a plurality of light-emitting diodes, a second substrate and a circuit wiring. The first substrate includes a plurality of sub-substrates joined to one another. The first substrate is disposed on the second substrate. The light-emitting diodes are disposed on each sub-substrate. The circuit wiring is located on the second substrate rather than the first substrate. Each light-emitting diode is electrically connected to the circuit wiring.

Description

Display panel and method of manufacturing same

The present invention relates to a display panel and a method of fabricating the same, and more particularly to a display panel having a light emitting diode and a method of fabricating the same.

With the maturity of optoelectronic technology, the technology of display has been continuously developed towards miniaturization. A display is a micro-light diode (micro-LED) display or an organic light-emitting diode (OLED) display. This type of display adopts an active light-emitting display technology, and does not require an additional backlight source, so that the display can be further thinned and thinned. .

Taking a miniature light-emitting diode display as an example, the transfer technology of the miniature light-emitting diode is challenged due to the extremely small size of the miniature light-emitting diode. For example, when the micro LED is transferred from the carrier to the array substrate, it is easy to cause misalignment. If it is applied to a large-sized display panel, it is impossible to ensure that all of the micro-light-emitting diodes can be successfully transferred, and even damage or poor bonding may occur, thereby affecting the quality of the produced display panel.

The present invention relates to a display panel and a method of fabricating the same, in which a plurality of light emitting diodes are fabricated on a plurality of sub-substrates and combined with the sub-substrates on the second substrate to avoid the above problems.

According to an aspect of the invention, a display panel is proposed. The display panel includes a first substrate, a plurality of light emitting diodes, a second substrate, and a circuit wiring. The first substrate includes a plurality of sub-substrates disposed in a spliced manner, and the first substrate is disposed on the second substrate. A plurality of light emitting diodes are disposed on each of the sub-substrates. The circuit wiring is located on the second substrate but not on the first substrate, and each of the light emitting diode systems is electrically connected to the circuit wiring.

According to another aspect of the present invention, a method of manufacturing a display panel is provided. The manufacturing method includes the following steps. A plurality of light emitting diodes are disposed on the plurality of sub-substrates. A circuit is disposed on a second substrate but is not disposed on the sub-substrates. The sub-substrates are combined on the second substrate such that the respective light-emitting diodes are electrically connected to the circuit wiring.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

In the following, various embodiments are described in detail, and the present invention is not intended to show all possible embodiments, and other embodiments not disclosed in the present invention may be applied. Furthermore, the dimensional ratios on the drawings are not drawn in proportion to the actual product. Therefore, the description and illustration are for illustrative purposes only and are not intended to limit the scope of the invention. Further, the drawings in the embodiments are omitted to partially illustrate the technical features of the present invention. Hereinafter, the same/similar symbols are used to denote the same/similar elements or steps.

Please refer to FIG. 1 , which is a schematic diagram of a sub-substrate 100 according to an embodiment of the invention. A plurality of light emitting diodes 30 are disposed on the sub-substrate 100, for example, in an array on the sub-substrate 100. In one embodiment, the light-emitting diodes 30 are micro-light-emitting diodes that can be transferred from a carrier to the sub-substrate 100, for example, by adhesion, electrostatic adsorption, vacuum suction, or the like, onto the sub-substrate 100. In this case, the 9×9 LEDs 30 are disposed on one sub-substrate 100 as an example. However, it should be understood that the number of the LEDs 30 of the present invention is not limited thereto. The device capability of the transfer machine selects the number of sub-substrates 100 of a suitable size and the number of light-emitting diodes 30 disposed thereon.

Next, please refer to FIG. 2, which is a schematic diagram of a first substrate 10 according to an embodiment of the present invention. After the plurality of light emitting diodes 30 are transferred onto the plurality of sub-substrates 100 in accordance with the example of FIG. 1, the sub-substrates 100 are spliced to each other to form a first substrate 10 having a large area. The size of the first substrate 10 may vary depending on the size and number of the spliced sub-substrate 100. For example, the sub-substrate 100 of a suitable size and number may be selected according to the ratio of the display screen of the produced display panel, and then the sub-substrates 100 are mutually Stitched together. The distance D1 between two adjacent light-emitting diodes 30 at the junction of two adjacent sub-substrate 100 is substantially equal to the distance D2 between two adjacent light-emitting diodes 30 in a sub-substrate 100.

It should be particularly noted that the first substrate 10 completed under this step does not include any circuit wiring, that is, there is no circuit trace connected to each other between the LEDs 30.

Next, please refer to FIG. 3 , which illustrates a schematic view of the first substrate 10 disposed on the second substrate 20 in an embodiment of the invention. A circuit wiring 22 is provided on the second substrate 20, but is not provided on the first substrate 10, and each of the light-emitting diodes 30 is electrically connected to the circuit wiring 22.

In detail, referring to the enlarged view of a sub-pixel structure P1 in FIG. 3, each sub-pixel structure P1 corresponds to one light-emitting diode 30. The circuit wiring 22 includes a plurality of gate lines 221, a plurality of data lines 222, a plurality of first signal lines 223, and a plurality of second signal lines 224. The first signal line 223 is electrically connected to the first electrode contact 225, and the second signal line 224 is electrically connected to the second electrode contact 226. When the first substrate 10 is disposed on the second substrate 20, the first electrode (for example, an N-type electrode) of each of the LEDs 30 is bonded to a corresponding first electrode contact 225, and each of the light-emitting diodes The second electrode of 30 (for example, a P-type electrode) is bonded to a corresponding second electrode contact 226 to electrically connect each of the light-emitting diodes 30 to the circuit wiring 22. That is, each of the light emitting diodes 30 can be individually controlled via the circuit wiring 22.

In one embodiment, the first substrate 10 is, for example, in an inverted manner, such that the first electrode 301 and the second electrode 302 (shown in FIG. 4) of each of the light-emitting diodes 30 face the corresponding first electrode contacts. 225 and second electrode contact 226. The first electrode 301 and the second electrode 302 of the light-emitting diode 30 can be electrically connected to the corresponding first electrode contact 225 and the second electrode contact 226 through an anisotropic conductive film or a solder joint. , electrically connected to the circuit wiring 22 .

Referring to FIG. 4, a partial cross-sectional view of a display panel 1 according to an embodiment of the present invention is shown. The first signal line 223 and the second signal line 224 are formed on the second substrate 20. The display panel 1 further includes an insulating layer 40 disposed on the second substrate 20, the first signal line 223 and the second signal line 224, and the first electrode contact 225 and the second electrode contact 226 are disposed on the insulating layer 40. . The insulating layer 40 has a plurality of first through holes 401 and a plurality of second through holes 402. The first electrode contacts 225 are electrically connected to the corresponding first signal lines 223 via the corresponding first through holes 401, and the second electrode contacts are connected. The 226 is electrically connected to the corresponding second signal line 224 via the corresponding second via 402.

In this embodiment, the first substrate 10 (or each sub-substrate 100) may be a monolithic glass substrate or a flexible substrate. In some embodiments, the light emitting diode 30 can be a blue light emitting diode, a red light emitting diode, a green light emitting diode, a white light emitting diode, or the like, or a combination thereof. Each of the light-emitting diodes 30 displaying different colors is disposed corresponding to a set of first electrode contacts 225 and second electrode contacts 226, so that the display panel 1 can display various colors.

After the pairing of the first substrate 10 and the second substrate 20 is completed, the display panel 1 or the second substrate 20 may be electrically detected, or before the pair of the first substrate 10 and the second substrate 20 The first substrate 10 or the sub-substrate 100 is electrically tested, and it is detected whether any of the light-emitting diodes 30 is damaged and cannot emit light normally. Here, if the defective LED 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

Referring to FIG. 5, a partial cross-sectional view of a display panel 2 according to another embodiment of the present invention is shown. Different from the embodiment of FIG. 4, the display panel 2 further includes a color filter layer 50 disposed on each of the sub-substrates 100. At the time of fabrication, a color filter layer 50 is disposed on each of the sub-substrates 100. Next, a plurality of light emitting diodes 30 are placed on the color filter layer 50 of each sub-substrate 100. Then, a pair of the first substrate 10 and the second substrate 20 is performed.

The color filter layer 50 may include a plurality of color conversion regions 501, 502, and 503, and the color conversion regions 501, 502, and 503 are respectively disposed between the respective LEDs 30 and the sub-substrates 100. In an embodiment, the color conversion regions 501, 502, 503 can be, for example, a quantum dot layer, a color resist layer, or other suitable material or a combination thereof, and the color conversion regions 501, 502, 503 can adopt different color conversions. The materials are, for example, red, green, and blue color conversion materials, and the light emitting diodes 30 may be white light emitting diodes. Thereby, the display panel 2 can display various colors.

After the pairing of the first substrate 10 and the second substrate 20 is completed, the display panel 2 or the second substrate 20 may be electrically detected, or before the pair of the first substrate 10 and the second substrate 20 The first substrate 10 or the sub-substrate 100 is electrically tested, and it is detected whether any of the light-emitting diodes 30 is damaged and cannot emit light normally. Here, if the defective LED 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

Referring to Figures 6A and 6B, there are shown partial cross-sectional views of display panels 3, 3' in accordance with some embodiments of the present invention. Referring to FIG. 6A , the display panel 3 further includes a first insulating layer 60 disposed on each of the sub-substrates 100 . At the time of fabrication, a first insulating layer 60 is disposed on each of the sub-substrates 100. Then, a plurality of first recesses 601 are formed in the first insulating layer 60, and a plurality of LEDs 30 are disposed in the corresponding first recesses 601 to improve the transfer accuracy of the LEDs 30. Then, a pair of the first substrate 10 and the second substrate 20 is performed.

The first insulating layer 60 may include a color conversion material or a photoresist material, and the first groove 601 may be formed by exposure development of a color conversion material or a photoresist material. Furthermore, the first insulating layer 60 may further include a black matrix to reduce the occurrence of light mixing.

In another embodiment, referring to Fig. 6B, unlike the embodiment of Fig. 6A, the display panel 3' does not have the first insulating layer 60. Instead, a plurality of second recesses 101 are formed in each of the sub-substrates 100, for example, a plurality of second recesses 101 are formed by etching the sub-substrate 100, and a plurality of the LEDs 30 are disposed. In the corresponding second groove 101, the transfer precision of the light-emitting diode 30 is improved. Then, a pair of the first substrate 10 and the second substrate 20 is performed.

After the pairing of the first substrate 10 and the second substrate 20 is completed, the display panel 3, 3' or the second substrate 20 may be electrically detected, or the first substrate 10 and the second substrate 20 may be Before the pair, the first substrate 10 or the sub-substrate 100 is electrically tested, and it is detected whether any of the light-emitting diodes 30 is damaged and cannot emit light normally. Here, if the defective LED 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

Referring to Figures 7A and 7B, there are shown partial cross-sectional views of display panels 4, 4' of other embodiments of the present invention. Referring to FIG. 7A, the display panel 4 further includes a second insulating layer 70 disposed on the second substrate 20, in contrast to the embodiment of FIG. In detail, the second insulating layer 70 is disposed on the insulating layer 40, and the second insulating layer 70 may include a color conversion material or a photoresist material, and may be formed in the color conversion material or the photoresist material by exposure and development. The third recess 701, and the first electrode contact 225 and the second electrode contact 226 of the circuit wiring 22 are each exposed from each of the third recesses 701. When the first substrate 10 and the second substrate 20 are paired, each of the LEDs 30 is substantially aligned with the first electrode contact 225 and the second electrode contact 226 in the corresponding third recess 701 to enhance The precision of the group. That is to say, in the present embodiment, the display panel 4 can be fabricated by using a color filter on Array (COA) formed on the array substrate (ie, the second substrate 20). Although the structure in which the insulating layer 40 and the second insulating layer 70 are two layers is shown in FIG. 7A, it will be understood by those skilled in the art that the insulating layer 40 and the second insulating layer 70 may be a single layer or a structure of two or more layers.

In another embodiment, referring to Fig. 7B, unlike the embodiment of Fig. 7A, the display panel 4' does not have the second insulating layer 70. Instead, at the time of fabrication, a plurality of fourth recesses 201 are formed in the second substrate 20, for example, a plurality of fourth recesses 201 are formed by etching the second substrate 20, and the circuit wirings 22 are formed in the fourth. Inside the groove 201.

In detail, the first signal line 223 and the second signal line 224 are formed in the fourth groove 201. The display panel 4' further includes an insulating layer 80 disposed in the fourth recess 201 and covering the first signal line 223 and the second signal line 224. The first electrode contact 225 and the second electrode contact 226 are disposed on On the insulating layer 80. The insulating layer 80 has a plurality of first through holes 801 and a plurality of second through holes 802. The first electrode contacts 225 are electrically connected to the corresponding first signal lines 223 via the corresponding first through holes 801, and the second electrode contacts are connected. The 226 is electrically connected to the corresponding second signal line 224 via the corresponding second through hole 802. Thereby, the first electrode contact 225 and the second electrode contact 226 of the circuit wiring 22 are each exposed from each of the fourth recesses 201. When the first substrate 10 and the second substrate 20 are paired, each of the LEDs 30 is substantially aligned with the first electrode contact 225 and the second electrode contact 226 of the corresponding fourth recess 201 to enhance The precision of the group.

After the pairing of the first substrate 10 and the second substrate 20 is completed, the display panel 4, 4' or the second substrate 20 may be electrically detected, or the first substrate 10 and the second substrate 20 may be Before the pair, the first substrate 10 or the sub-substrate 100 is electrically tested, and it is detected whether any of the light-emitting diodes 30 is damaged and cannot emit light normally. Here, if the defective LED 30 is detected, it can be replaced or repaired without affecting the circuit wiring 22.

In summary, according to the above embodiment, a plurality of light emitting diodes (for example, miniature light emitting diodes) are first disposed on a plurality of sub-substrates. On the other hand, a circuit wiring is disposed on a second substrate but not on the sub-substrates. Then, the sub-substrates are disposed on the second substrate, for example, the sub-substrates are spliced to each other to form a first substrate, and the first substrate is disposed on the second substrate, so that the LEDs are electrically connected. For circuit wiring. Thereby, each of the light emitting diodes on the first substrate can be individually controlled by the circuit wiring on the second substrate. At the same time, the first substrate produced in this way can be free from the device capability of the transfer machine, so that it can meet the needs of today's large-sized display screens. After the pair of the first substrate and the second substrate are completed, the display panel or the second substrate may be electrically detected, or before the pair of the first substrate and the second substrate, the first substrate Or the sub-substrate performs an electrical detection procedure, thereby detecting whether any of the light-emitting diodes is damaged, and the damaged light-emitting diode can be replaced or repaired immediately without affecting the circuit wiring.

In addition, the above steps of disposing a plurality of light emitting diodes on a plurality of sub-substrates may further include the following various embodiments and variations thereof. In one embodiment, a color filter layer may be first disposed on each of the sub-substrates, and then a plurality of light-emitting diodes are disposed on the color filter layers of the sub-substrates, so that the display panel can display various colors. In some embodiments, a first insulating layer may be disposed on each of the sub-substrates, and a plurality of first recesses are formed in the first insulating layer. Alternatively, a plurality of second grooves may be formed directly in each of the sub-substrates. Then, a plurality of light emitting diodes are disposed in the corresponding first or second grooves to improve the transfer precision of the light emitting diodes.

Furthermore, the above steps of disposing the circuit wiring on the second substrate but not on the sub-substrates may further include the following various embodiments and variations thereof. In one embodiment, a second insulating layer may be disposed on the second substrate, the second insulating layer has a plurality of third recesses, and the plurality of electrode contacts of the circuit wiring are exposed to the respective third recesses. Then, each of the light emitting diodes can be substantially aligned with each of the electrode contacts in the corresponding third groove to improve the accuracy of the pair. In another embodiment, a plurality of fourth recesses may be formed directly in the second substrate, and the circuit wiring is formed in the fourth recess, and the plurality of electrode contacts are exposed. Then, each of the light emitting diodes can be substantially aligned with each of the electrode contacts in the corresponding fourth groove to improve the accuracy of the pair.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1, 2, 3, 3', 4, 4'‧‧‧ display panels

10‧‧‧First substrate

100‧‧‧subsubstrate

101‧‧‧second groove

20‧‧‧second substrate

201‧‧‧fourth groove

22‧‧‧Circuit wiring

221‧‧ ‧ gate line

222‧‧‧Information line

223‧‧‧First signal line

224‧‧‧second signal line

225‧‧‧First electrode contact

226‧‧‧second electrode contact

30‧‧‧Lighting diode

301‧‧‧First electrode

302‧‧‧second electrode

40‧‧‧Insulation

401‧‧‧First perforation

402‧‧‧Second perforation

50‧‧‧Color filter layer

501, 502, 503‧‧‧ color conversion area

60‧‧‧First insulation

601‧‧‧first groove

70‧‧‧Second insulation

701‧‧‧ third groove

80‧‧‧Insulation

801‧‧‧First perforation

802‧‧‧second perforation

D1, D2‧‧‧ distance

P1‧‧‧ sub-pixel structure

FIG. 1 is a schematic view showing a sub-substrate according to an embodiment of the present invention, wherein a plurality of light-emitting diodes are disposed on the sub-substrate. FIG. 2 is a schematic view showing a first substrate according to an embodiment of the present invention, wherein the first substrate is formed by splicing a plurality of sub-substrates. FIG. 3 is a schematic view showing the first substrate disposed on the second substrate in an embodiment of the invention. 4 is a partial cross-sectional view of a display panel in accordance with an embodiment of the present invention. Fig. 5 is a partial cross-sectional view showing a display panel according to another embodiment of the present invention. 6A and 6B are partial cross-sectional views of a display panel in accordance with some embodiments of the present invention. 7A and 7B are partial cross-sectional views showing a display panel according to another embodiment of the present invention.

Claims (10)

A display panel comprising: a first substrate comprising a plurality of sub-substrates arranged in a spliced manner; a plurality of LEDs disposed on each of the sub-substrates; a second substrate, the first substrate being disposed in the second And the circuit wiring is located on the second substrate but not on the first substrate, and each of the light emitting diode systems is electrically connected to the circuit wiring. The display panel of claim 1, wherein each of the light emitting diodes comprises a first electrode and a second electrode, the circuit wiring comprising a plurality of first electrode contacts and a plurality of second electrode contacts The first electrode of each of the light emitting diodes is bonded to the corresponding first electrode contacts, and the second electrode of each of the light emitting diodes is coupled to the corresponding second electrode contacts. The display panel of claim 2, wherein the first electrode substantially faces the corresponding first electrode contacts, and the second electrode substantially faces the corresponding second electrode contacts . The display panel of claim 1, further comprising: a color filter layer disposed on each of the sub-substrates, the color filter layer includes a plurality of color conversion regions, and the color conversion regions are respectively correspondingly disposed Between each of the light-emitting diodes and each of the sub-substrates. The display panel of claim 1, further comprising: a first insulating layer disposed on each of the sub-substrates, the first insulating layer having a plurality of first recesses, each of the light emitting diode systems In the corresponding first grooves. The display panel of claim 1, wherein each of the sub-substrates has a plurality of second recesses, and each of the light-emitting diode systems is disposed in the corresponding second recesses. The display panel of claim 1, further comprising: a second insulating layer disposed on the second substrate, the second insulating layer having a plurality of third grooves, the plurality of electrodes of the circuit wiring The contacts are each exposed to each of the third recesses, and each of the light emitting diodes is substantially aligned with each of the corresponding ones of the third recesses. The display panel of claim 1, wherein the second substrate has a fourth recess, the circuit wiring is disposed in the fourth recess, and exposing a plurality of electrode contacts, each of the light emitting diodes The pole bodies are substantially aligned with the respective electrode contacts. A manufacturing method of a display panel, comprising: setting a plurality of light emitting diodes on a plurality of sub-substrates; disposing a circuit wiring on a second substrate but not on the sub-substrates; and combining the sub-substrates The second substrate is electrically connected to the circuit wiring. The manufacturing method of claim 9, wherein the step of combining the sub-substrates on the second substrate comprises: splicing the sub-substrates with each other to form a first substrate; and combining the first substrate with On the second substrate.