CN104282817B - Light-emitting diode component and production method - Google Patents
Light-emitting diode component and production method Download PDFInfo
- Publication number
- CN104282817B CN104282817B CN201310272229.6A CN201310272229A CN104282817B CN 104282817 B CN104282817 B CN 104282817B CN 201310272229 A CN201310272229 A CN 201310272229A CN 104282817 B CN104282817 B CN 104282817B
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- Prior art keywords
- light
- emitting diode
- transparent
- led
- led component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910613609.9A CN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
CN201310272229.6A CN104282817B (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
CN201910613684.5A CN110335932A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310272229.6A CN104282817B (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910613609.9A Division CN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
CN201910613684.5A Division CN110335932A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104282817A CN104282817A (en) | 2015-01-14 |
CN104282817B true CN104282817B (en) | 2019-08-06 |
Family
ID=52257508
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310272229.6A Active CN104282817B (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
CN201910613684.5A Pending CN110335932A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
CN201910613609.9A Pending CN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910613684.5A Pending CN110335932A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
CN201910613609.9A Pending CN110350064A (en) | 2013-07-01 | 2013-07-01 | Light-emitting diode component and production method |
Country Status (1)
Country | Link |
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CN (3) | CN104282817B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6614587B2 (en) * | 2015-06-17 | 2019-12-04 | インテル・コーポレーション | Two-material high-K heat sealant system |
CN110416391A (en) * | 2019-08-28 | 2019-11-05 | 开发晶照明(厦门)有限公司 | LED packaging element |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202281057U (en) * | 2011-05-11 | 2012-06-20 | 浙江锐迪生光电有限公司 | High-efficiency LED light emitting tube with LED chip 4pi light outlet |
CN102969432A (en) * | 2012-10-25 | 2013-03-13 | 日月光半导体制造股份有限公司 | Light-emitting diode packaging structure and manufacture method thereof |
CN103069593A (en) * | 2010-10-22 | 2013-04-24 | 松下电器产业株式会社 | Mounting board, light emitting device and lamp |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6147411A (en) * | 1998-03-31 | 2000-11-14 | Micron Technology, Inc. | Vertical surface mount package utilizing a back-to-back semiconductor device module |
JP3400958B2 (en) * | 1999-07-07 | 2003-04-28 | 株式会社シチズン電子 | Multicolor light emitting diode |
JP3492945B2 (en) * | 1999-07-19 | 2004-02-03 | 株式会社シチズン電子 | Light emitting diode |
CN1492506A (en) * | 2002-10-22 | 2004-04-28 | 洲磊科技股份有限公司 | Polycrystalline light-emitting diode module package |
TW564535B (en) * | 2002-11-06 | 2003-12-01 | Acme Technologies Ltd | White LED package |
US7824937B2 (en) * | 2003-03-10 | 2010-11-02 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacturing the same |
CN2738402Y (en) * | 2004-10-19 | 2005-11-02 | 新灯源科技有限公司 | Improvement of light-emitting diode packaging structure |
TW200717859A (en) * | 2005-10-31 | 2007-05-01 | Ultra Bright Leds Co Ltd | Method and apparatus for producing light emitting diode |
JP2007165811A (en) * | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | Light emitting device |
CN101034728A (en) * | 2006-03-10 | 2007-09-12 | 东芝照明技术株式会社 | Illumination device |
JP4905009B2 (en) * | 2006-09-12 | 2012-03-28 | 豊田合成株式会社 | Method for manufacturing light emitting device |
CN101192638A (en) * | 2006-11-27 | 2008-06-04 | 山西乐百利特科技有限责任公司 | Luminous diode element |
JP2008251664A (en) * | 2007-03-29 | 2008-10-16 | Toshiba Lighting & Technology Corp | Illumination apparatus |
TWI336966B (en) * | 2007-04-27 | 2011-02-01 | Chao Yuan Cheng | Led package with uniform color phase |
JP2009071005A (en) * | 2007-09-13 | 2009-04-02 | Sony Corp | Wavelength-converting member and production method thereof, and light-emitting device using wavelength converting member |
CN201153127Y (en) * | 2007-12-13 | 2008-11-19 | 佛山市国星光电股份有限公司 | Sheet type LED with double side encapsulated |
CN101493216B (en) * | 2008-01-24 | 2011-11-09 | 富士迈半导体精密工业(上海)有限公司 | LED light source module |
CN201226357Y (en) * | 2008-07-08 | 2009-04-22 | 宏齐科技股份有限公司 | LED chip packaging structure for backlight module |
CN101771024B (en) * | 2008-12-30 | 2012-10-10 | 京东方科技集团股份有限公司 | Light-emitting diode (LED) and packaging method thereof |
CN101800219B (en) * | 2009-02-09 | 2019-09-17 | 晶元光电股份有限公司 | Light-emitting component |
CN101800270A (en) * | 2009-02-11 | 2010-08-11 | 亿光电子工业股份有限公司 | Light emitting diode device and packaging method therefore |
CN101807632B (en) * | 2009-02-17 | 2012-07-11 | 亿光电子工业股份有限公司 | Light emitting diode package |
JP5340879B2 (en) * | 2009-10-13 | 2013-11-13 | スタンレー電気株式会社 | Light emitting device |
CN101699638A (en) * | 2009-10-30 | 2010-04-28 | 中山大学 | Phosphor powder film making method and obtained phosphor powder film encapsulating method |
JP5047264B2 (en) * | 2009-12-22 | 2012-10-10 | 株式会社東芝 | Light emitting device |
CN102201399B (en) * | 2010-03-22 | 2016-04-13 | 晶元光电股份有限公司 | Light-emitting component |
JP2011204376A (en) * | 2010-03-24 | 2011-10-13 | Stanley Electric Co Ltd | Semiconductor light-emitting device |
CN201706309U (en) * | 2010-04-16 | 2011-01-12 | 华兴电子工业股份有限公司 | Assembled light-emitting diode lamp strip structure capable of generating continuous light and lighting fixture |
CN101846256A (en) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led light source |
JP2011249476A (en) * | 2010-05-25 | 2011-12-08 | Kyocera Corp | Semiconductor light-emitting device |
CN201804907U (en) * | 2010-06-02 | 2011-04-20 | 深圳市聚飞光电股份有限公司 | High-power LED |
CN102339927A (en) * | 2010-07-27 | 2012-02-01 | 展晶科技(深圳)有限公司 | Light emitting diode |
US8371715B2 (en) * | 2010-09-21 | 2013-02-12 | Catcher Technology Co., Ltd. | LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor |
CN102479786A (en) * | 2010-11-23 | 2012-05-30 | 光芯科技股份有限公司 | Light emitting module and alternating current light emitting device |
KR20120067153A (en) * | 2010-12-15 | 2012-06-25 | 삼성엘이디 주식회사 | Light emitting device, light emitting device package, manufacturing method of light emitting device, and packaging method of light emitting device |
JP5680472B2 (en) * | 2011-04-22 | 2015-03-04 | シチズンホールディングス株式会社 | Manufacturing method of semiconductor light emitting device |
CN102244189A (en) * | 2011-07-19 | 2011-11-16 | 彩虹集团公司 | LED encapsulated by ceramic substrate in integrated mode |
KR101900352B1 (en) * | 2011-08-01 | 2018-09-19 | 시코쿠 케이소쿠 코교 가부시키가이샤 | Semiconductor device and fabrication method for same |
CN202259395U (en) * | 2011-09-07 | 2012-05-30 | 王元成 | LED (light-emitting diode) light source |
CN103094263A (en) * | 2011-10-28 | 2013-05-08 | 鸿富锦精密工业(深圳)有限公司 | Light-emitting diode device |
TW201320412A (en) * | 2011-11-14 | 2013-05-16 | Evergreen Optronics Inc | Light emitting diode package |
US8928012B2 (en) * | 2012-02-22 | 2015-01-06 | Jianhua Hu | AC LED device and its manufacturing process for general lighting applications |
CN202712176U (en) * | 2012-05-21 | 2013-01-30 | 苏州晶品光电科技有限公司 | LED sealing structure using transparent oxide substrate |
CN102709458A (en) * | 2012-05-21 | 2012-10-03 | 苏州晶品光电科技有限公司 | LED (light-emitting diode) packaging structure using transparent oxide substrate and packaging method thereof |
CN102709452A (en) * | 2012-05-21 | 2012-10-03 | 苏州晶品光电科技有限公司 | Fluorescent transparent ceramic LED (light-emitting diode) sealing structure and sealing method thereof |
CN202712175U (en) * | 2012-05-21 | 2013-01-30 | 苏州晶品光电科技有限公司 | Fluorescent film planar sheet type LED array light source |
CN102709281A (en) * | 2012-05-21 | 2012-10-03 | 苏州晶品光电科技有限公司 | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source |
CN202601729U (en) * | 2012-05-31 | 2012-12-12 | 深圳市华高光电科技有限公司 | LED (Light-Emitting Diode) encapsulating structure |
CN102856475A (en) * | 2012-09-05 | 2013-01-02 | 苏州金科信汇光电科技有限公司 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
TWM445267U (en) * | 2012-09-10 | 2013-01-11 | Sintronic Technology Inc | Light emitting diode package structure |
CN202868390U (en) * | 2012-09-26 | 2013-04-10 | 厦门华联电子有限公司 | Novel light-emitting diode (LED) power source and bulb produced with the same |
CN103000788A (en) * | 2012-11-30 | 2013-03-27 | 深圳市璨阳光电有限公司 | LED packaging structure and method |
CN103075667A (en) * | 2013-01-11 | 2013-05-01 | 郑香奕 | Full-angle light emitting diode (LED) light source body and production process for same |
TWM455263U (en) * | 2013-01-28 | 2013-06-11 | Harvatek Corp | Several white light packaging with blue light LED |
-
2013
- 2013-07-01 CN CN201310272229.6A patent/CN104282817B/en active Active
- 2013-07-01 CN CN201910613684.5A patent/CN110335932A/en active Pending
- 2013-07-01 CN CN201910613609.9A patent/CN110350064A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103069593A (en) * | 2010-10-22 | 2013-04-24 | 松下电器产业株式会社 | Mounting board, light emitting device and lamp |
CN202281057U (en) * | 2011-05-11 | 2012-06-20 | 浙江锐迪生光电有限公司 | High-efficiency LED light emitting tube with LED chip 4pi light outlet |
CN102969432A (en) * | 2012-10-25 | 2013-03-13 | 日月光半导体制造股份有限公司 | Light-emitting diode packaging structure and manufacture method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN110335932A (en) | 2019-10-15 |
CN104282817A (en) | 2015-01-14 |
CN110350064A (en) | 2019-10-18 |
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Effective date of registration: 20170515 Address after: Hsinchu City, Taiwan, China Applicant after: EPISTAR Corp. Address before: Hsinchu City, Taiwan, China Applicant before: EPISTAR Corp. Applicant before: INTERLIGHT OPTOTECH Corp. Effective date of registration: 20170515 Address after: Hsinchu City, Taiwan, China Applicant after: EPISTAR Corp. Applicant after: INTERLIGHT OPTOTECH Corp. Address before: Taichung City, Taiwan, China Applicant before: HUGA OPTOTECH INC. Applicant before: INTERLIGHT OPTOTECH Corp. |
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Effective date of registration: 20180606 Address after: Hsinchu City, Taiwan, China Applicant after: EPISTAR Corp. Applicant after: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. Address before: Hsinchu City, Taiwan, China Applicant before: EPISTAR Corp. |
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