JP2009071005A - Wavelength-converting member and production method thereof, and light-emitting device using wavelength converting member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wavelength-converting member for enhancing moisture resistance and a production method thereof, and to provide a light-emitting device that uses the wavelength-converting member. <P>SOLUTION: In a wavelength-converting member 6 of this light-emitting device, a phosphor layer 1 with phosphor dispersed in a transparent resin is joined to a first transparent substrate 2 and is interposed in between the first transparent substrate and a second transparent substrate 3; the circumference part of the phosphor layer is surrounded by a transparent adhesive 4; and the joint between the first and second transparent substrates and the joint between the second transparent and the phosphor layer are, respectively joined with a transparent adhesive. The wavelength converting member is produced by a method that includes forming the phosphor layer 1 to be joined to the first transparent substrate, by applying a transparent resin with a phosphor dispersed to the first transparent substrate and by making the resin cure; dropping the transparent adhesive to a face of the phosphor layer; and heating and curing the transparent adhesive at 200°C or lower with the phosphor layer interposed between the first and second transparent substrates so that the circumference part of the phosphor layer is surrounded by the transparent adhesive, by joining the first and second transparent substrates. As the first and second transparent substrates, a cyclic polyolefin-based resin having high moisture resistance is used. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to improvement of moisture resistance of a phosphor, and more particularly, to a wavelength conversion member in which phosphor particles are sealed, a method for manufacturing the same, and a light emitting device in which the wavelength changing member is combined with a light emitting element.

  A light-emitting device that emits a phosphor by light from a semiconductor light-emitting element by combining a wavelength conversion member encapsulated with phosphor particles with a semiconductor light-emitting element such as a light-emitting diode (LED) can be made compact. Development has been made as a light source for display devices and lighting devices used in various applications with low power consumption.

  Various resins are known as materials for sealing phosphors. For example, phosphors made of sulfide may be hydrolyzed by reacting with moisture, and wavelength conversion members are used under high humidity. In such a case, moisture permeates the sealing resin, and the phosphor is denatured or decomposed by the permeated moisture, resulting in a decrease in luminous efficiency. Moreover, the optical characteristic and chemical characteristic of sealing resin deteriorate by the light radiate | emitted from a light emitting element, and the light transmittance of sealing resin deteriorates.

  When glass is used as a material for sealing the phosphor, in order to disperse the phosphor particles in the glass, it is necessary to increase the temperature to bring the glass into a molten state. It cannot be applied to a deteriorating phosphor.

  Hereinafter, specific examples of the related art relating to phosphor sealing will be described.

  Patent Document 1 entitled “Manufacturing Method of Radiation Image Conversion Panel” includes the following description.

  In the method for producing a radiation image conversion panel of the invention of Patent Document 1, a photostimulable phosphor layer is provided between a support and a protective layer, and the photostimulable phosphor layer is protected from the support by a sealing member. In the method of manufacturing a radiation image conversion panel having a structure sealed between layers, when sealing with the sealing member, the support, the protective layer, and the sealing member are used when the radiation image conversion panel is used. The sealing member is cured in a state of being maintained at a temperature in the vicinity of the upper limit temperature.

  When sealing with the sealing member, the sealing member is cured in a state where the support, the protective layer, and the sealing member are held at a temperature close to the upper limit temperature when the radiation image conversion panel is used. Thus, a radiation image conversion panel that can be used stably for a long period of time without peeling or cracking can be produced. Hereinafter, the invention of Patent Document 1 will be specifically described.

  FIG. 9 is FIG. 1 described in Patent Document 1, and is a cross-sectional view showing an example of a radiation image conversion panel obtained by the manufacturing method of the invention of Patent Document 1. A photostimulable phosphor layer 101 is disposed between the support 102 and the protective layer 203. In order to protect the photostimulable phosphor layer 101 from physical or chemical stimulation from the outside, the support 102 and The peripheral edge of the protective layer 103 is sealed with a sealing member, and the photostimulable phosphor layer 101 is sealed.

  Patent Document 2 entitled “Light Emitting Device” includes the following description.

  An object of the invention of Patent Document 2 is to provide a light emitting device that is excellent in moisture resistance and light resistance, and that can easily obtain uniform wavelength conversion without reducing external radiation efficiency based on light emission of an LED element. is there. In order to achieve this purpose, the invention of Patent Document 2 forms a light emitting element portion that emits light of a predetermined wavelength and a phosphor excited by the light of the predetermined wavelength in a layered manner with a transparent moisture-impermeable material. And a wavelength converter formed so as to be surrounded by the light emitting device.

  Glass is preferably used as the moisture-impermeable material that surrounds the phosphor in layers. As this glass, a low-melting glass that is easy to mold at low temperatures can be used.

  It is preferable that the wavelength conversion unit surrounds and seals the light emitting element unit, and the phosphor is disposed in a thin film around the light emitting element unit. In addition, the wavelength conversion unit can be formed to have an optical shape that emits light according to desired light distribution characteristics from the light emitting element unit. In addition, the wavelength conversion unit can be integrated by sandwiching a phosphor formed in a thin film on the surface of the first glass with the second glass and thermally fusing it.

  According to such a configuration, degradation of the sealing material due to light radiated from the light emitting element portion and decomposition or alteration of the phosphor due to moisture absorption are prevented, thereby preventing wavelength conversion from being degraded.

  The wavelength converter uses a transparent low-melting glass having a refractive index n = 1.5, a thin phosphor layer is disposed between two low-melting glasses, and the two glass materials are heat-sealed. Then, it is formed by integrating with the phosphor layer.

  FIGS. 10A to 10E are FIGS. 2A to 2E described in Patent Document 2, and are process diagrams showing a manufacturing process of the wavelength conversion unit. FIG. ) Is a side view of the glass sheet in the preparation step, FIG. 10B is a side view of the glass sheet in the printing step, FIG. 10C is a side view of the glass sheet in the bonding preparation step, and FIG. The side view of the glass sheet in a process and FIG.10 (e) are top views of a wavelength conversion part.

(1) Preparatory process Fig.10 (a) is a side view of the glass sheet in a preparatory process. First, a glass sheet 201 made of sheet-like low-melting glass is prepared. The glass sheet 201 is formed to have a length capable of arranging a plurality of LED elements 3 in the longitudinal direction.

(2) Printing process FIG.10 (b) is a side view of the glass sheet in a printing process. A phosphor solution is prepared by dissolving phosphor 200 in n-butyl acetate containing about 1% nitrocellulose as a thickener, and this solution is screened on the surface of glass sheet 201 at a pitch according to the arrangement interval of LED elements. Print and deposit in a thin film. Next, the phosphor layer 202A is formed by heat-treating the glass sheet 201 printed with the phosphor solution to remove the solvent component. Note that the heat treatment may be performed in a reduced-pressure atmosphere.

(3) Joining preparation process FIG.10 (c) is a side view of the glass sheet in a joining preparation process. A glass sheet 203 made of the same low-melting glass as the glass sheet 201 is prepared, and arranged so as to sandwich the phosphor layer 202A of the glass sheet 203 formed in the printing process. The glass sheets 201 and 203 preferably have the same shape, but may have different shapes.

(4) Joining Step FIG. 10 (d) is a side view of the glass sheet in the joining step. The glass sheets 201 and 203 sandwiching the phosphor layer 202A are heat-fused by heat-pressing in a reduced pressure atmosphere. The phosphor layer 202A is provided in layers so as to be located at the boundary between the heat-fused glass sheets 201 and 203.

  FIG. 10E is a plan view of the wavelength conversion unit. The wavelength conversion unit 204 is formed by sandwiching a phosphor layer 202A having a shape formed by screen printing between glass sheets 201 and 203. In the figure, the phosphor layer 202A is square, but this shape can be changed to various shapes that can be screen-printed. For example, it can be formed in a circular shape.

JP-A-4-359199 (paragraphs 0006 to 0008, FIG. 1) Japanese Patent Laying-Open No. 2005-11953 (paragraphs 0011 to 0027, FIG. 2)

  In order to improve the moisture resistance of the phosphor, in the method described in Patent Document 2, the glass is raised to the softening point and fused, and the phosphor is sandwiched between the glass layers. The temperature is not described. When a low melting glass is used as the glass, the low melting glass often contains a metal such as Pb or Bi in order to lower the melting point, and is often colored, and any low melting glass is used to prevent light transmission. I can't.

Further, depending on the type of phosphor, the glass deteriorates at the softening point temperature. For example, the softening point of a commercially available glass having a low melting point is a temperature of 624 degrees (hereinafter, the temperature shown in the specification is a Celsius temperature). As will be described later, when SrGa ₂ S ₄ : Eu is fired at 600 ° C., it decreases by 18%. Further, as will be described later, CaAlSiN ₃ : Eu and Ca ₂ Si ₅ N ₈ : Eu which are chemically stable are reduced by 75% and 97%, respectively, when fired at 600 degrees. That is, in the method described in Patent Document 2, depending on the selection of the glass, the phosphor is thermally deteriorated only by the temperature rise for fusing the glass, so it is impossible to adapt to any phosphor. is there.

  The present invention has been made to solve the above-described problems, and the object thereof can be applied to a phosphor that is easily deteriorated by heating, and improves the moisture resistance of the phosphor. An object of the present invention is to provide a highly reliable wavelength conversion member, a manufacturing method thereof, and a light emitting device using the wavelength conversion member.

  That is, the present invention includes a first transparent substrate, a second transparent substrate, a phosphor layer sandwiched between the first and second transparent substrates, and a phosphor dispersed in a transparent resin. A transparent adhesive that surrounds the outer periphery of the phosphor layer, the first transparent substrate and the phosphor layer being joined together by the transparent resin, and the second transparent substrate and the phosphor layer. Are bonded by the transparent adhesive, and the first transparent substrate and the second transparent substrate are bonded by the transparent adhesive according to a wavelength conversion member (wavelength conversion member according to the first configuration) It is.

  The present invention also provides a fluorescent material sandwiched between a first transparent substrate made of a cyclic polyolefin resin, a second transparent substrate made of the cyclic polyolefin resin, and the first and second transparent substrates. A phosphor layer in which a body is dispersed in a transparent resin, and a transparent adhesive that surrounds an outer periphery of the phosphor layer, and the first transparent substrate and the second transparent substrate are bonded to each other by the transparent adhesive. The present invention relates to a wavelength conversion member (wavelength conversion member according to the second configuration) joined by an agent.

  The present invention also includes a first step of forming a phosphor layer bonded to the first transparent substrate by applying and curing a transparent resin in which the phosphor is dispersed on the first transparent substrate; A second step of dropping a transparent adhesive on the upper surface of the body layer; bringing the second transparent substrate into contact with the dropped transparent adhesive; and pressing the second transparent substrate against the phosphor layer. The transparent adhesive is spread, the transparent adhesive is heat-cured so that an outer peripheral portion of the phosphor layer is surrounded by the transparent adhesive, and the second transparent substrate and the A method for manufacturing a wavelength conversion member (manufacturing a wavelength conversion member according to a first configuration), comprising: a phosphor layer, and a third step of bonding each of the first transparent substrate and the second transparent substrate. Method).

  According to the present invention, a transparent resin in which a phosphor is dispersed is applied to a first transparent substrate made of a cyclic polyolefin resin and cured to form a first phosphor layer that is bonded to the first transparent substrate. Step, a second step of dropping a transparent adhesive onto the upper surface of the phosphor layer, and the phosphor layer between the second transparent substrate made of the cyclic polyolefin resin and the first transparent substrate. And the transparent adhesive is heat-cured so that the outer peripheral portion of the phosphor layer is surrounded by the transparent adhesive, and the first transparent substrate and the second transparent substrate are joined together. The manufacturing method of the wavelength conversion member which has these processes (The manufacturing method of the wavelength conversion member by a 2nd structure).

  The present invention also relates to a light emitting device having the wavelength conversion member.

  According to the wavelength conversion member of the first configuration of the present invention, the phosphor layer bonded to the first transparent substrate by the transparent resin in which the phosphor is dispersed is the first and second transparent substrates. Between the second transparent substrate and the phosphor layer, between the first transparent substrate and the second transparent substrate, and the outer peripheral portion of the phosphor layer is surrounded by the transparent adhesive. And the phosphor is sealed by the transparent resin, the transparent adhesive, and the first and second transparent substrates, so that the first and first moisture resistance is high. A wavelength conversion member that can improve the moisture resistance of the phosphor by using the transparent substrate 2 and the transparent adhesive, and can be applied to the phosphor that is easily deteriorated by heating. Can . Moisture permeating the bonding interface between the transparent adhesive layer and the second transparent substrate passes through the transparent adhesive layer present between the second transparent substrate and the phosphor layer, and The wavelength of the configuration in which the transparent adhesive layer is not formed between the second transparent substrate and the phosphor layer because the phosphor layer passes through the transparent resin and reaches the phosphor. Compared with the conversion member, the moisture resistance of the phosphor can be remarkably improved, and a highly reliable wavelength conversion member can be realized.

  According to the wavelength conversion member of the second configuration of the present invention, the first and second transparent substrates are made of the cyclic polyolefin-based resin, and the phosphor is dispersed in the transparent resin. A layer is sandwiched between the first and second transparent substrates, an outer peripheral portion of the phosphor layer is surrounded by the transparent adhesive, and the first transparent substrate and the second transparent substrate are transparent. Since the phosphor is sealed by the transparent resin, the transparent adhesive, and the first and second transparent substrates, the cyclic polyolefin resin and the transparent adhesive have moisture resistance. Since it is large, the moisture resistance of the phosphor can be improved, it can be applied to the phosphor that is easily deteriorated by heating, and a highly reliable wavelength conversion member can be realized.

  In addition, according to the method for manufacturing a wavelength conversion member according to the first configuration of the present invention, the transparent resin in which the phosphor is dispersed is applied to the first transparent substrate and cured, and then bonded to the first transparent substrate. A first step of forming a phosphor layer, a second step of dropping a transparent adhesive on the upper surface of the phosphor layer, a second transparent substrate in contact with the dropped transparent adhesive, The second transparent substrate is pressed against the phosphor layer to spread the transparent adhesive, and the transparent adhesive is heated and cured so that the outer peripheral portion of the phosphor layer is surrounded by the transparent adhesive. And a third step of joining the second transparent substrate and the phosphor layer, and the first transparent substrate and the second transparent substrate, respectively, with the transparent adhesive. The phosphor is the transparent resin, the transparent adhesive, the first and second transparent By using the first and second transparent substrates and the transparent adhesive, which are sealed by a plate and have high moisture resistance, the moisture resistance of the phosphor can be improved and easily deteriorated by heating. The manufacturing method of the wavelength conversion member which can be applied also to the said fluorescent substance can be provided. In the wavelength conversion member according to this manufacturing method, the second transparent substrate and the phosphor layer are bonded by the transparent adhesive, and a bonding interface between the transparent adhesive layer and the second transparent substrate is formed. The moisture that permeates passes through the transparent adhesive layer that exists between the second transparent substrate and the phosphor layer, and then passes through the transparent resin of the phosphor layer to the phosphor. Therefore, the moisture resistance of the phosphor is remarkably improved compared to a wavelength conversion member having a configuration in which the transparent adhesive layer is not formed between the second transparent substrate and the phosphor layer. A highly reliable wavelength conversion member can be manufactured.

  Further, according to the method for manufacturing a wavelength conversion member according to the second configuration of the present invention, the transparent resin in which the phosphor is dispersed is applied to a first transparent substrate made of a cyclic polyolefin-based resin and cured, and the first A first step of forming a phosphor layer to be bonded to one transparent substrate, a second step of dropping a transparent adhesive on the upper surface of the phosphor layer, and a second transparent substrate made of the cyclic polyolefin resin. And the first transparent substrate, the phosphor layer is sandwiched between the first and second transparent substrates, and the transparent adhesive is heat-cured so that the outer periphery of the phosphor layer is surrounded by the transparent adhesive. And having a third step of bonding the transparent substrate and the second transparent substrate, the phosphor is sealed with the transparent resin, the transparent adhesive, and the first and second transparent substrates. The cyclic polyolefin-based resin and Since the moisture resistance of the transparent adhesive is large, the moisture resistance of the phosphor can be improved, and it can be applied to the phosphor that is easily deteriorated by heating. Can be manufactured.

  Further, according to the light emitting device of the present invention, since the wavelength converting member is included, the wavelength converting member is combined with excitation light from a semiconductor light emitting element or the like, so that the illumination device used for general purposes and the back for LCD Light emitting devices used as light sources such as lighting devices used for lights, etc., lighting devices used for display devices used in various applications, etc. can be constructed, moisture resistance can be improved, and reliability is high A light emitting device can be realized.

  In the wavelength conversion member according to the first and second configurations of the present invention, it is preferable that the moisture resistance of the first and second transparent substrates is greater than that of the transparent adhesive. According to this configuration, since the moisture resistance of the first and second transparent substrates sandwiching the phosphor layer is larger than the moisture resistance of the transparent adhesive, the areas of the first and second transparent substrates are large. Moisture permeation from the largest plane portion can be suppressed, the phosphor in the phosphor layer can be made less susceptible to moisture, and the moisture resistance of the phosphor can be improved, A highly reliable wavelength conversion member can be realized.

  The transparent resin and the transparent adhesive are made of different materials, and the moisture resistance of the transparent adhesive is preferably larger than that of the transparent resin. According to this configuration, moisture passes through the transparent adhesive in the portion facing the outer peripheral portion of the phosphor layer, and then passes through the transparent resin in the phosphor layer. The phosphor in the layer can be made less susceptible to moisture, the moisture resistance of the phosphor can be improved, and a highly reliable wavelength conversion member can be realized.

  In the wavelength conversion member manufacturing method according to the first and second configurations of the present invention, the first and second transparent substrates having higher moisture resistance than the transparent adhesive may be used. According to the wavelength conversion member having this configuration, since the moisture resistance of the first and second transparent substrates sandwiching the phosphor layer is greater than the moisture resistance of the transparent adhesive, the first and second transparent substrates It is possible to suppress moisture permeation from the plane portion having the largest substrate area, and to make the phosphor in the phosphor layer less susceptible to moisture, thereby improving the moisture resistance of the phosphor. Therefore, a highly reliable wavelength conversion member can be realized.

  Moreover, it is good to set it as the structure where the moisture resistance is larger than the said transparent resin, and the said transparent adhesive agent which consists of a material different from the said transparent resin is used. According to the wavelength conversion member having this configuration, moisture passes through the transparent adhesive in the portion facing the outer peripheral portion of the phosphor layer, and then passes through the transparent resin in the phosphor layer. The phosphor in the phosphor layer can be made less susceptible to moisture, the moisture resistance of the phosphor can be improved, and a highly reliable wavelength conversion member can be manufactured.

  In the third step, the transparent adhesive is preferably heat-cured at 200 degrees or less. According to this configuration, it is possible to suppress thermal deterioration of the phosphor in the heat curing treatment of the transparent adhesive, and when heating at 200 degrees or less, many types of phosphors do not cause luminance deterioration due to heating. Therefore, it is possible to manufacture a highly reliable wavelength conversion member that does not cause deterioration of luminance characteristics.

Embodiments The wavelength conversion member according to the present invention forms a phosphor layer by applying a phosphor dispersed in a highly moisture-resistant transparent resin to the surface of the lower transparent sheet (substrate) having a high moisture resistance and curing the phosphor. When covering the body layer with the upper transparent sheet (substrate), the upper transparent sheet and the phosphor layer are bonded using a transparent adhesive different from the material of the lower and upper transparent sheets without using a high temperature process. Furthermore, a transparent adhesive is adhered to the outer peripheral portion of the phosphor layer so that the phosphor layer is three-dimensionally surrounded and sealed with at least two kinds of transparent materials. As the transparent adhesive, one having high moisture resistance such as an epoxy resin or an acrylic resin is used. As the lower and upper transparent sheets, at 200 degrees or less, for example, a transparent glass substrate or a transparent resin substrate that does not deteriorate optical characteristics or chemical characteristics is used.

  The wavelength conversion member according to the present invention can greatly improve the moisture resistance of the phosphor by sandwiching the phosphor with a plurality of types of transparent materials even if the phosphor is greatly deteriorated with respect to humidity. The present invention can be suitably applied to a wavelength conversion member using a sulfide-based phosphor that is expected to improve the color gamut luminance.

  In the wavelength conversion member according to the present invention, the moisture resistance can be improved by three-dimensionally enclosing the phosphor layer in which the phosphor is dispersed and cured with a transparent transparent sheet and adhesive having high moisture resistance from three directions. It can be applied to phosphors that are easily deteriorated by heating, and can be applied to any phosphor.

  In the wavelength conversion member according to the present invention, in particular, the lower and upper transparent sheets use a cyclic polyolefin-based resin, which will be described later, which is a transparent amorphous thermoplastic resin, and the lower transparent sheet is made of a transparent resin in which a phosphor is dispersed. The phosphor layer bonded to the lower transparent sheet and the upper transparent sheet are sandwiched between the lower transparent sheet and the upper transparent sheet, and the outer peripheral part of the fluorescent substance layer is surrounded by the transparent adhesive. It is desirable that the gaps are joined by a transparent adhesive, and the phosphor is sealed with a transparent resin, a transparent adhesive, a lower part and an upper transparent sheet.

  By using a cyclic polyolefin resin with high moisture resistance as the lower and upper transparent sheets, and a transparent adhesive with high moisture resistance, the moisture resistance of the phosphor can be improved. The wavelength conversion member which can also be applied can be made possible. Moisture that permeates the bonding interface between the transparent adhesive layer and the upper transparent sheet permeates the transparent adhesive layer that exists between the upper transparent sheet and the phosphor layer, and then permeates the transparent resin of the phosphor layer. Therefore, the moisture resistance of the phosphor is greatly improved compared to the wavelength conversion member having a configuration in which the transparent adhesive layer is not formed between the upper transparent sheet and the phosphor layer. Therefore, a highly reliable wavelength conversion member can be realized.

  The wavelength conversion member according to the present invention is combined with a semiconductor light-emitting element to emit light used as a light source for a general-purpose lighting device, a lighting device used for an LCD backlight, a lighting device used for various display devices, etc. Can be applied to devices.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

  1A and 1B are diagrams for explaining the configuration of a wavelength conversion member 6 according to an embodiment of the present invention. FIG. 1A is a plan view, and FIG. 1B is an AA portion of FIG. It is sectional drawing.

  As shown in FIG. 1, the wavelength conversion member 6 in which phosphor particles are sealed includes a lower transparent sheet (first transparent substrate) 2 (hereinafter abbreviated as a lower sheet 2) and an upper transparent sheet (second sheet). Transparent substrate) 3 (hereinafter abbreviated as upper sheet 3), phosphor layer 1, and transparent adhesive 4, and phosphor layer 1 is made of a transparent resin (for example, a transparent silicone resin). It is formed by being dispersed and cured. The periphery of the phosphor layer 1 disposed between the lower sheet 2 and the upper sheet 3 is closely surrounded by a transparent adhesive (for example, epoxy resin) 4, and the lower sheet 2 and the upper sheet 3 are adhesive 4. Are joined by. In the example shown in FIG. 1, the shape of the phosphor layer 1 formed on the surface of the lower sheet 2 is circular, but it is needless to say that this shape may be any shape.

  Regarding the wavelength conversion member 6 exposed to moisture from the outside, in general, (areas of the surfaces of the lower sheet 2 and the upper sheet 3 facing in a direction perpendicular to the phosphor layer 1)> (transparent adhesive 4 Since the area of the surfaces of the lower sheet 2 and the upper sheet 3 facing each other >> (area of the transparent adhesive 4 facing in the direction parallel to the phosphor layer 1), the phosphor of the wavelength conversion member 6 In order to improve the moisture resistance, the lower sheet 2 and the upper sheet so as to satisfy (the moisture resistance of the lower sheet 2 and the upper sheet 3)> (the moisture resistance of the transparent adhesive 4)> (the moisture resistance of the transparent resin). 3. It is desirable to select the material of the transparent adhesive 4 and the transparent resin. The length of the transparent adhesive 4 in the direction parallel to the phosphor layer 1 is preferably as large as possible.

  FIG. 2 is a view for explaining a method of manufacturing the wavelength conversion member 6 according to the embodiment of the present invention, and FIG. 3 is a plan view and a cross-sectional view for explaining the formation process of the phosphor layer 1 on the lower sheet surface 2. FIG. 4 is a cross-sectional view illustrating a process of sealing the phosphor layer 1 with the upper sheet 3, the lower sheet 2, and the adhesive 4.

  As shown in FIG. 2, the wavelength converting member 6 is manufactured by applying a transparent silicone resin in which phosphor particles are dispersed to the surface of the lower sheet 2 and curing it to form the phosphor layer 1 (FIG. 3). And the step of dropping the adhesive 4 on the upper surface of the phosphor layer 1, bringing the upper sheet 3 into contact with the dropped adhesive 4, and pressing the upper sheet 3 against the surface of the phosphor layer 1. The adhesive 4 is spread, and the upper sheet 3 and the lower sheet 2 are held at a predetermined distance so that the outer peripheral portion of the phosphor layer 1 is closely surrounded by the adhesive 4. The adhesive 4 is heated and cured at 200 ° C. or less, and the phosphor layer 1 is sealed between the upper sheet 3 and the lower sheet 2 (see FIG. 4).

  As shown in FIG. 3, in the step of forming the phosphor layer 1 on the surface of the lower sheet 2, a dispersion in which a phosphor is dispersed at a predetermined weight ratio using a transparent silicone resin as a transparent resin, The phosphor layer 1 is formed by coating the surface of the lower sheet 2 with a predetermined thickness t by a printing method and heating and curing the silicone resin under curing conditions of a predetermined temperature and time.

  As shown in FIG. 4, in the step of sealing the phosphor layer 1 between the upper sheet 3 and the lower sheet 2, a transparent epoxy resin having high moisture resistance is used as the transparent adhesive 4, and the thickness t It is dropped on the upper surface of the phosphor layer 1. Next, the upper sheet 3 is brought into contact with the dropped adhesive 4, the upper sheet 3 is pressed against the phosphor layer 1, and the adhesive 4 is spread, so that the adhesive 4 becomes the outer peripheral portion of the phosphor layer 1. The adhesive 4 is heated and cured at a predetermined temperature and time for the upper sheet 3 and the lower sheet 2 in a state where the upper sheet 3 and the lower sheet 2 are held at a predetermined distance so as to surround the outer periphery. The sheet 3 and the lower sheet 2 are joined, and the phosphor layer 1 is sealed between the upper sheet 3 and the lower sheet 2.

  The predetermined distance is, for example, (t + (2-3)) (μm) when the thickness of the phosphor layer 1 is t (μm), and the upper sheet 3 and the phosphor layer 1 are There should be a layer of adhesive 4 in between. Since the surface of the phosphor layer 1 is generally uneven, even if the upper sheet 3 and the phosphor layer 1 are simply brought into close contact with each other, they are bonded between the upper sheet 3 and the phosphor layer 1. There is a layer of agent 4.

  As described above, the phosphor layer 1 is tightly bonded to the lower sheet 2 with the transparent resin, the lower sheet 2 and the upper sheet 3 are bonded with the adhesive 4, and the outer peripheral portion of the phosphor layer 1 is bonded. A wavelength conversion member 6 in which the phosphor layer 1 is bonded and surrounded by the agent 4, the phosphor layer 1 is bonded to the upper sheet 3 by the adhesive 4, and the phosphor layer 1 is sealed inside can be formed. In the wavelength conversion member 6, the phosphor particles are dispersed and sealed in the transparent resin of the phosphor layer 1, and the phosphor layer 1 is further sealed by the adhesive 4, the lower sheet 2, and the upper sheet 3. Has been.

  In the present embodiment, since there is an adhesive 4 layer between the upper sheet 3 and the phosphor layer 1, moisture penetrates the bonding interface between the transparent adhesive 4 layer of the wavelength conversion member 6 and the upper sheet 3. Passes through the layer of the transparent adhesive 4 existing between the upper transparent sheet 3 and the phosphor layer 1 and then passes through the transparent resin of the phosphor layer 1 to reach the phosphor. Compared with a wavelength conversion member having a configuration in which the layer 4 is not formed between the upper sheet 3 and the phosphor layer 1, the moisture resistance of the phosphor in the phosphor layer 1 can be significantly improved.

  1 to 3, the width of the layer of the adhesive 4 formed on the outer peripheral portion of the phosphor layer 1 (the width between the lower and upper sheets 2 and 3) is made as long as possible, and the adhesive It is possible to increase the moisture permeation length through the layer 4 and make it difficult for moisture to reach the phosphor layer 1, so that the moisture resistance of the phosphor in the phosphor layer 1 can be further improved. And a highly reliable wavelength conversion member can be realized.

  Moreover, in FIGS. 1-3, the area | region of the outer peripheral part in which the fluorescent substance layer 1 is not formed in the surface side of the lower sheet 2 to which the dispersion | distribution in which the fluorescent substance was disperse | distributed is applied, and the upper sheet 3 facing this By roughening the outer peripheral region, the contact area of the adhesive 4 with respect to the lower and upper sheets 2 and 3 is increased, and the bonding strength between the lower and upper sheets 2 and 3 is increased. The area of the bonding interface between the lower and upper sheets 2 and 3 in the layer is increased, the penetration length of moisture until reaching the phosphor layer 1 is increased, and the moisture does not easily penetrate into the phosphor layer 1. Therefore, the moisture resistance of the phosphor in the phosphor layer 1 can be further improved, and a highly reliable wavelength conversion member can be realized.

  In the created wavelength conversion member 6, the phosphor layer 1 is bonded to the lower sheet 2 with a silicone resin, the outer peripheral portion of the phosphor layer 1 is in close contact with the adhesive 4, and the phosphor layer 1 is the adhesive. The phosphor layer 1 is sealed inside so that there is no space in which moisture is retained by bonding to the upper sheet 3 via 4. That is, the phosphor particles are sealed with a transparent silicone resin, and the phosphor layer 1 is sealed with the adhesive 4, the lower sheet 2, and the upper sheet 3.

  The resin in which the phosphor is dispersed to form the phosphor layer 1 may be any resin that is transparent and has high moisture resistance. Epoxy resins, fluororesins, and the like can be used in addition to the silicone resin.

  The lower sheet 2 and the upper sheet 3 only need to be transparent and have high moisture resistance. Various transparent resins can be used in addition to transparent glass, and the lower sheet 2 and the partial sheet 3 are made of different materials. It can also be configured. As resins, polyolefin resins such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), polyester resins such as polyethylene terephthalate (PET), acrylic (PMMA) resin, fluororesin, polyarylate (PAR) Resin or the like can be used. When the phosphor is excited by ultraviolet rays, it is desirable that the lower sheet 2 and the upper sheet 3 are made of a material that does not deteriorate due to the ultraviolet rays and cause a decrease in light transmittance.

  In addition to the polyolefin resins such as PE, PP and PMP, cyclic polyolefin resins having an alicyclic structure in the main chain can be used. For example, ethylene tetracyclododecene copolymer (E / TD) (polymer obtained by copolymerizing ethylene and tetracyclododecene, a kind of cyclic olefin (cycloolefin copolymer)) ("Apel (registered trademark)" (Mitsui Chemicals) )), Cycloolefin copolymer copolymerized with norbornene and ethylene ("TOPAS (registered trademark)" (Ticona)), metathesis ring-opening polymerization of ester-substituted tetracyclododecene monomer, followed by main chain double bond Cycloolefin polymer (norbornene-based resin) ("ARTON (registered trademark)" (JSR)) synthesized by complete hydrogenation of benzene, ring-opening metathesis ring-opening polymerization of norbornene-based monomer, and then double bond in polymer Ring-opening metathesis ring-opening polymer obtained by hydrogenation of Fin polymer (norbornene resin)) ( "ZEONEX (registered trademark)" (Nippon Zeon), can be used "ZEONOR (registered trademark)" (Nippon Zeon)) amorphous resin such.

  Further, an amorphous polyester resin can be used as polyethylene terephthalate, and 4-vinyloxy-1-butene (“Cytop®”), which is an amorphous transparent perfluoroether resin, can be used as the fluorine resin. (Asahi Glass)), tetrafluoroethylene-perfluorodioxole copolymer (TFE / PDD) (Mitsui / DuPont Fluorochemical), polyvinylidene fluoride (PVDF), and the like can be used.

The moisture resistance of the resin used for the lower and upper transparent sheets, the resin used for forming the phosphor layer in which the phosphor is dispersed, and the resin used for joining the lower and upper transparent sheets is the water absorption rate. (E.g., measured according to JIS K7209), moisture permeability (e.g., measured according to JIS Z2080), and in order to ensure the moisture resistance of the phosphor, The upper transparent sheet preferably has, for example, a water absorption rate of 0.1% (23 ° water × 24 h) or less and a water vapor transmission rate of 5 g / m ² · 24 h (film thickness of 100 μm, 40 ° / 90% RH) or less. In particular, the moisture resistance of the cyclic polyolefin resins of “ZEONEX”, “ZEONOR”, “APEL”, and “TOPAS” (moisture permeability is about 1 g / m ² · 24 h, water absorption is about 0.01%). Next, the moisture resistance of PE and PP (moisture permeability is about 3 to 5 g / m ² · 24 h, water absorption is about 0.01%) is good. More preferably it is used.

  The transparent adhesive 4 that joins the lower sheet 2 and the part sheet 3 may be transparent and has high moisture resistance, and an acrylic resin or the like can be used in addition to the epoxy resin. Since the water absorption of the epoxy resin is smaller than that of the silicone resin and excellent in moisture resistance, it is suitable as the transparent adhesive 4.

In order to improve the moisture resistance of the phosphor used for the wavelength conversion member 6 and the light resistance against ultraviolet rays or the like, an inorganic layer may be formed on one side or both sides of the lower sheet 2 and the upper sheet 3 by sputtering or the like. For example, SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ may be formed on one or both sides of the above-described resin sheet (for example, a polyolefin resin sheet such as PP, PE, or PMP, a PET sheet, or a cyclic polyolefin resin sheet). , SIO _x N _y , ITO (indium tin oxide), IZO (indium zinc oxide), AZO (antimony doped zinc oxide), and GZO (gallium doped zinc oxide) to form fluorescence The moisture resistance and light resistance of the body can be improved.

  Note that the adhesive layer 4 is not used after the inorganic material layer is formed on one surface of the lower sheet 2 and the upper sheet 3 and / or the thermoplastic sheet by sputtering or the like, and the phosphor layer 1 is formed on the surface of the lower sheet 2. In addition, the portion of the lower sheet 2 and the upper sheet 3 where the inorganic material layer is not formed is joined by heat sealing to improve the moisture resistance and light resistance of the phosphor, thereby converting the wavelength. The reliability of the member can also be improved.

  Further, after forming the phosphor layer 1 on the surface of the lower sheet 2 using the thermoplastic lower sheet 2 and the upper sheet 3, the lower sheet 2 is formed by heat fusion without using the adhesive 4. After the upper sheet 3 is joined, an inorganic layer is formed on the outer surface of the lower sheet 2 and / or the upper sheet 3 by sputtering or the like, thereby improving the moisture resistance and light resistance of the phosphor. The reliability of the conversion member can also be improved.

  FIG. 5 is a cross-sectional view illustrating a configuration of a light emitting device 8 using the wavelength conversion member 6 according to the embodiment of the present invention. FIG. 5A is a combination of the semiconductor light emitting element 12 and the wavelength conversion member 6. The light emitting device 8a configured, FIG. 5B shows a light emitting device 8b configured by combining a plurality of semiconductor light emitting elements 12 and the wavelength conversion member 6, and FIG. 5C shows the light emitting device shown in FIG. It is sectional drawing explaining the structure of the light emitting device 8c which deform | transformed the structure of 8a.

  As shown in FIG. 5A, the light emitting device 8 a includes a substrate 10, a semiconductor light emitting element 12, a sealing resin 13, and a wavelength conversion member 6, and the substrate 10 includes a mortar configured by a frame body 14. A concave portion 11 and a wiring portion (not shown) electrically connected to an electrode portion (not shown) of the semiconductor light emitting element 12 are formed.

  The semiconductor light emitting element 12 is an element made of, for example, a GaN compound semiconductor, and is mounted on the central portion of the bottom surface of the recess 11 of the substrate 10. An electrode portion (not shown) of the semiconductor light emitting element 12 is connected to a wiring portion (not shown) of the substrate 10 by wire bonding or the like, for example. The semiconductor light emitting element 12 is an LED (Light Emitting Diode) chip or LD (Laser diode) composed of a GaN-based semiconductor layer formed on a sapphire substrate, and is a light emitting element that emits blue light.

  The sealing resin 13 is, for example, an epoxy resin, a silicone resin, or the like, which is a low moisture-permeable resin having a high light-transmitting property and having a high moisture resistance. is doing. The wavelength conversion member 6 is disposed in the light emitting direction from the semiconductor light emitting element 12. The area of the wavelength conversion member 6 is larger than the area of the opening of the recess 11, and the outer edge of the wavelength conversion member 6 is bonded and fixed to the frame body 14 with an adhesive or the like at the edge of the opening of the recess 11. ing.

  As described above, the long conversion member 6 has the phosphor layer 1 sealed with the transparent adhesive (epoxy resin) 4 between the phosphor layer 1 and the transparent lower and upper sheets 2 and 3. The phosphor layer 1 is composed of a silicone resin and a phosphor dispersed in the silicone resin.

  For example, if a phosphor that emits yellow fluorescent light of YAG type is used as the phosphor constituting the phosphor layer 1, the blue light emitted from the semiconductor light emitting element 12 is transmitted through the sealing resin 13 and converted in wavelength. The YAG phosphor is excited by the blue light that reaches the member 6 and reaches the wavelength conversion member 6 and emits yellow light. Therefore, the blue light emitted from the semiconductor light emitting element 12 and the YAG phosphor are emitted from the YAG phosphor. White light is emitted from the wavelength conversion member 6 to the outside by the combination with the yellow light.

  As a configuration of the light emitting device, a white illumination device that emits white light by a combination of a semiconductor light emitting device 12 that emits blue light and a phosphor that emits fluorescence other than yellow, or a semiconductor light emitting device 12 that emits ultraviolet light. Needless to say, a white illumination device that emits white light by combining with a phosphor that is excited by the ultraviolet light and emits fluorescence of a desired color is possible. Such a white illuminating device has a stable luminance without being greatly influenced by the environmental conditions to be used, and can be used as illumination for various applications.

  5A, a plurality of semiconductor light emitting elements 12 arranged one-dimensionally or two-dimensionally are mounted on the bottom surface of the recess 11 of the substrate 10, as shown in FIG. 5B. It can also be configured. According to such a configuration, by synchronizing the driving of the plurality of semiconductor light emitting elements 12, a light emitting device as an irradiation device having a large light irradiation area by excitation light emission of the phosphor constituting the wavelength conversion member 6 is realized. be able to.

  In the configuration shown in FIG. 5B, each of the plurality of semiconductor light emitting elements 12 arranged one-dimensionally or two-dimensionally corresponds to the pixel arrangement, and the driving of each semiconductor light-emitting element 12 is controlled to emit light. By displaying this light emission on the wavelength conversion member 6 from a substantially vertical direction, desired character information and desired image information can be displayed by excitation light emission of the phosphor constituting the wavelength conversion member 6. A light-emitting device as a display device having a large area can be realized.

  As shown in FIG. 5C, the structure of the light emitting device 8a in FIG. 5A can be modified. In the light emitting device 8c shown in FIG. A configuration is shown in which the inside of the configured mortar-shaped recess 11 is sealed with a sealing resin 13 together with the semiconductor light emitting element 12, and the wavelength conversion member 6 is further sealed with a sealing resin 13a. According to the structure shown in FIG. 5C, a light-emitting device that is thinner and has excellent moisture resistance can be realized.

  The configuration shown in FIG. 5C is modified so that a plurality of semiconductor light emitting elements 12 are mounted on the bottom surface of the recess 11 of the substrate 10 in the same manner as the configuration shown in FIG. You can also.

  As the lower sheet 2 and the upper sheet 3 constituting the wavelength conversion member 6 used in the light emitting device in the modification of FIGS. 5B and 5C, a thin deformable resin plate is used, and the diameter is several. By mounting the semiconductor light emitting element 12 of 10 μm or less on the thin deformable substrate 10, the moisture resistance is improved, the reliability is high, and the light emitting device as a flexible lighting device that can be deformed or the light emission as a display device. A device can be realized.

  Hereinafter, the heat deterioration of various phosphors and the moisture resistance of the phosphors in the wavelength conversion member according to the present invention will be described.

Example <Heat degradation of various phosphors>
(1) Deterioration due to heating of the phosphor was examined on the assumption that the phosphor was sealed between glass sheets by a heating process of about 600 degrees. The emission intensity by light excitation at a wavelength of 450 nm after firing each phosphor of SrGa ₂ S ₄ : Eu, CaAlSiN ₃ : Eu, Ca ₂ Si ₅ N ₈ : Eu is 600 ° C. for 1 hour. It is 18%, 75%, and 97% of the emission intensity, and CaAlSiN ₃ : Eu, Ca ₂ Si ₅ N ₈ : Eu has a very large heat deterioration, and considering the heat deterioration of the phosphor, a heating process of about 600 degrees Encapsulation of a phosphor that requires the above is not practical.

(2) Deterioration of phosphor at curing temperature of adhesive 4 Curing conditions for commercially available epoxy resin adhesive and silicone resin adhesive differ depending on the type of curing agent used and the intended use. In order to form the wavelength conversion member according to the present invention, it is preferable to set the curing temperature of the adhesive to about 150 to 200 degrees so that the cured resin can have sufficient moisture resistance and heat resistance.

  Therefore, the emission intensity by light excitation at a wavelength of 450 nm after heat treatment (fired at 200 ° C. for 2 hours) of commonly used phosphors (sulfide phosphors, CRT phosphors, lamp phosphors). Degradation was evaluated. As a result of evaluation, regarding the following phosphors, no deterioration of the emission intensity was observed, and the deterioration rate of the emission intensity was 0%.

CaAlSiN ₃ : Eu, Ca ₂ Si ₅ N ₈ : Eu, SrGa ₂ S ₄ : Eu, CaS: Eu, SrS: Eu, Y ₃ Al _l5 O ₁₂ : Ce, ZnS: Ag, Cl, ZnS: Ag, Al, Y ₂ O ₂ S: Eu, Y ₂ O ₃ : Eu, YVO ₄ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn, LaPO ₄ : Ce, Tb.

  The wavelength conversion member according to the present invention seals the phosphor by bonding the transparent glass sheet by curing the transparent adhesive at a temperature of 200 degrees or less, which is much lower than the softening point of the glass. There is no degradation caused by. In addition, resin sheets such as polyolefin resin sheets such as PP, PE, and PMP, cyclic polyolefin resin sheets, and the like that have high moisture resistance, low moisture absorption, and low water absorption instead of glass, are cured at a temperature of 200 ° C. or less with a transparent adhesive. Since the phosphor is sealed by bonding with, the phosphor is not deteriorated.

<Moisture resistance of wavelength conversion member (moisture resistance of phosphor)>
FIG. 6 is a diagram for explaining an example of a result of evaluating the moisture resistance of the wavelength conversion member according to the embodiment of the present invention.

  7A and 7B are diagrams for explaining the configuration of Sample-2 in the evaluation of the moisture resistance of the wavelength conversion member according to the embodiment of the present invention. FIG. 7A is a plan view, and FIG. It is sectional drawing in the AA part of FIG.

  8A and 8B are diagrams for explaining the configuration of a comparative example (phosphor alone) in the evaluation of the moisture resistance of the wavelength conversion member according to the embodiment of the present invention. FIG. 8A is a plan view, and FIG. It is sectional drawing in the AA part of FIG. 8 (A). First, preparation of Sample-1 of the wavelength conversion member 6 will be described.

  In Sample-1 of the wavelength conversion member 6, commercially available Pyrex (registered trademark) glass widely used was used as the lower and upper sheets 2 and 3. The glass used has a circular shape with a diameter of 8 mm and a thickness of 0.1 mm as shown in FIG.

  A dispersion obtained by dispersing CaS: Eu phosphor at 10 wt% in a transparent silicone resin (Shin-Etsu silicone, product number KJR-632) is applied to the surface of the lower sheet 2 by a printing method as shown in FIG. The phosphor layer 1 was formed by heating and curing the silicone resin under the conditions of 2 hours. Glass was used as the lower sheet 2. As shown in FIG. 3, the phosphor layer 1 has a diameter of 6 mm and a thickness of t = about 50 μm. The reason why the resin in which the phosphor is dispersed is the silicone resin is that the silicone resin has a feature that it is hardly deteriorated against heat and light. The CaS: Eu phosphor is a sulfide and has very poor moisture resistance.

  Next, as shown in FIG. 4, a highly moisture-resistant transparent epoxy resin (Nitto Denko, product number NT8080) is dropped as an adhesive 4 on the upper surface of the phosphor layer 1 having a thickness t, and the dropped adhesive is adhered. The upper sheet 3 is brought into contact with the agent 4, and the upper sheet 3 is pressed against the surface of the phosphor layer 1 so that the outer periphery of the phosphor layer 1 is closely adhered and surrounded by the adhesive 4. The adhesive 4 is heated and cured in a state where the distance between the upper sheet 3 and the lower sheet 2 is maintained at a predetermined distance, and the phosphor layer 1 is sealed between the upper sheet 3 and the lower sheet 2. With the upper sheet 3 pressed against the surface of the phosphor layer 1, the transparent epoxy resin was cured by heating under conditions of 135 degrees and 2 hours.

  As described above, the phosphor layer 1 and the lower sheet 2 are in close contact with each other and bonded by the transparent resin, the adhesive 4 is in close contact with the outer peripheral portion of the phosphor layer 1, and the phosphor layer 1 and the upper sheet 3 are in close contact with each other. Then, the sample for evaluation of the wavelength conversion member 6 in which the upper sheet 3 and the lower sheet 2 were bonded together by the adhesive 4 and the phosphor layer 1 was sealed inside was prepared. In the wavelength conversion member 6, phosphor particles are dispersed and sealed in a transparent silicone resin, and the phosphor layer 1 is further sealed with an adhesive 4, a lower sheet 2, and an upper sheet 3.

  Sample-2 (wavelength conversion member 6a) shown in FIG. 7 was prepared as follows. The difference between the creation of Sample-2 and the creation of Sample-1 described above is as follows.

  In the preparation of Sample-1 described above, a transparent epoxy resin was used as the adhesive 4. However, in the preparation of the wavelength conversion member 6a, the above-described use was made to disperse phosphor particles instead of the transparent epoxy resin. A transparent silicone resin was used as the adhesive 4a. In addition, the dimension of each part of the wavelength conversion member 6a was made the same as the above-mentioned sample-1.

  The comparative example (phosphor simple substance) shown in FIG. 8 was prepared as follows.

  In the comparative example, in the preparation process of Sample-1 described above, a dispersion in which a phosphor was dispersed in a transparent silicone resin was applied to the surface of the lower sheet 2 by a printing method, and the silicone was formed under conditions of 150 degrees and 2 hours. The phosphor layer 1 was obtained by heating and curing the system resin to form the phosphor layer 1, and the phosphor layer 1 thus formed was designated as a phosphor simple substance 5. The thickness t and the diameter φ of the phosphor single body 5 were the same as the values of the phosphor layer 1 in the above sample-1.

  Next, the moisture resistance test of Sample-1, Sample-2, and Comparative Example and the evaluation results thereof will be described.

  Each sample described above was placed in a high-temperature and high-humidity tank set at 60 degrees and 90% RH, exposed to high temperature and high humidity, and the time-dependent change in emission intensity of each sample was measured when excited with light having a wavelength of 450 nm. Thus, an example of evaluation results of moisture resistance shown in FIG. 6 was obtained. The vertical axis of FIG. 6 shows the relative light emission intensity (%) with the light emission intensity of the phosphor before being exposed to high temperature and high humidity as 100, and the horizontal axis is the time of exposure to high temperature and high humidity (high temperature and high humidity exposure time). is there.

  As shown in FIG. 6, the relative light emission intensity of the comparative example rapidly decreases with the high temperature and high humidity exposure time, and shows a tendency to saturate to about 55% after about 400 hours. The relative luminescence intensity of the comparative example decreases with the high temperature and high humidity exposure time, and does not show a saturation tendency after about 400 hours, but decreases to about 60% after the high temperature and high humidity exposure of 600 hours. . On the other hand, the relative light emission intensity of Sample-1 is almost 100% even after exposure to high temperature and high humidity for 600 hours, and there is almost no decrease, and the moisture resistance is much higher than that of Sample-2 and Comparative Example. It was found that it was excellent and completely satisfied the goal of maintaining a relative light emission intensity of 80% or more after 500 hours, and the moisture resistance of the phosphor was ensured.

  As described above, according to the present invention, it is possible to provide a wavelength conversion member capable of improving the moisture resistance of a phosphor, a method for manufacturing the same, and a light emitting device using the wavelength conversion member, and heat deterioration. It is suitable for a light-emission conversion member using a phosphor that is easy to be used, and can be applied to various phosphors, to ensure the moisture resistance of a wavelength conversion member and a light-emitting device using the same, and to improve reliability. it can. The present invention can also be applied to sealing of inorganic electroluminescence (EL) materials.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the above-mentioned embodiment, Various deformation | transformation based on the technical idea of this invention is possible.

  For example, the type of phosphor used, the thickness and area of the phosphor layer to be formed can be arbitrarily changed as necessary. It goes without saying that a wavelength conversion member can be formed by mixing a plurality of types of phosphors and dispersing them in a transparent resin to form a phosphor layer.

  INDUSTRIAL APPLICABILITY According to the present invention, a wavelength conversion member that is suitable for a phosphor that is easily deteriorated by heating and that can improve the moisture resistance of the phosphor and has high reliability, a method for manufacturing the same, and a light-emitting device using the leaf conversion member Can be provided.

It is a figure explaining the structure of the wavelength conversion member by embodiment of this invention. It is a figure explaining the manufacturing method of a wavelength conversion member same as the above. It is a figure explaining the manufacturing method of a wavelength conversion member same as the above. It is a figure explaining the manufacturing method of a wavelength conversion member same as the above. It is a figure explaining the structure of the light-emitting device using a wavelength conversion member same as the above. It is a figure explaining the example of an evaluation result of the moisture resistance of the wavelength conversion member by the example of the present invention. It is a figure explaining the structure of sample-2 in evaluation of the moisture resistance of a wavelength conversion member same as the above. It is a figure explaining the structure of the comparative example (phosphor single-piece | unit) in evaluation of the moisture resistance of a wavelength conversion member same as the above. It is sectional drawing which shows an example of the radiographic image conversion panel in a prior art. It is process drawing which shows the manufacturing process of a wavelength conversion part same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Phosphor layer, 2 ... Lower sheet, 3 ... Upper sheet, 4, 4a ... Adhesive, 5 ... Phosphor simple substance,
6, 6a ... wavelength conversion member, 8a, 8b, 8c ... light emitting device, 10 ... substrate, 11 ... recess,
DESCRIPTION OF SYMBOLS 12 ... Semiconductor light-emitting device, 13, 13a ... Sealing resin, 14 ... Frame

Claims (15)

A first transparent substrate;
A second transparent substrate;
A phosphor layer sandwiched between the first and second transparent substrates and in which a phosphor is dispersed in a transparent resin;
A transparent adhesive that surrounds an outer periphery of the phosphor layer, the first transparent substrate and the phosphor layer are bonded together by the transparent resin, and the second transparent substrate and the phosphor layer Is a wavelength conversion member in which the first transparent substrate and the second transparent substrate are bonded together by the transparent adhesive.   The wavelength conversion member according to claim 1, wherein moisture resistance of the first and second transparent substrates is greater than that of the transparent adhesive.   The wavelength conversion member according to claim 1, wherein the transparent resin and the transparent adhesive are made of different materials, and the moisture resistance of the transparent adhesive is greater than that of the transparent resin. A first transparent substrate made of a cyclic polyolefin resin;
A second transparent substrate made of the cyclic polyolefin-based resin;
A phosphor layer sandwiched between the first and second transparent substrates and in which a phosphor is dispersed in a transparent resin;
A wavelength conversion member having a transparent adhesive surrounding an outer peripheral portion of the phosphor layer, wherein the first transparent substrate and the second transparent substrate are joined by the transparent adhesive.   The wavelength conversion member according to claim 4, wherein moisture resistance of the first and second transparent substrates is greater than that of the transparent adhesive.   The wavelength conversion member according to claim 4, wherein the transparent resin and the transparent adhesive are made of different materials, and the moisture resistance of the transparent adhesive is larger than that of the transparent resin. A first step in which a transparent resin in which a phosphor is dispersed is applied to a first transparent substrate and cured to form a phosphor layer bonded to the first transparent substrate;
A second step of dropping a transparent adhesive on the upper surface of the phosphor layer;
A second transparent substrate is brought into contact with the dropped transparent adhesive, and the second transparent substrate is pressed against the phosphor layer to spread the transparent adhesive, and an outer peripheral portion of the phosphor layer. The transparent adhesive is heat-cured so that is surrounded by the transparent adhesive, and the first transparent substrate and the first transparent substrate are interposed between the second transparent substrate and the phosphor layer by the transparent adhesive. And a third step of joining the second transparent substrates to each other.   The method for producing a wavelength conversion member according to claim 7, wherein the first and second transparent substrates having higher moisture resistance than the transparent adhesive are used.   The method for manufacturing a wavelength conversion member according to claim 7, wherein the transparent adhesive made of a material different in moisture resistance from the transparent resin is used.   The method for producing a wavelength conversion member according to claim 7, wherein in the third step, the transparent adhesive is heat-cured at 200 ° C or lower. A first step of applying a transparent resin in which a phosphor is dispersed to a first transparent substrate made of a cyclic polyolefin-based resin and curing the resin to form a phosphor layer bonded to the first transparent substrate;
A second step of dropping a transparent adhesive on the upper surface of the phosphor layer;
The phosphor layer is sandwiched between a second transparent substrate made of the cyclic polyolefin resin and the first transparent substrate, and the outer peripheral portion of the phosphor layer is surrounded by the transparent adhesive. The manufacturing method of the wavelength conversion member which heat-hardens a transparent adhesive and has a 3rd process of joining a said 1st transparent substrate and a said 2nd transparent substrate.   The method for producing a wavelength conversion member according to claim 11, wherein the first and second transparent substrates having higher moisture resistance than the transparent adhesive are used.   The method for producing a wavelength conversion member according to claim 11, wherein the transparent adhesive made of a material different in moisture resistance from the transparent resin is used.   The method for producing a wavelength conversion member according to claim 11, wherein in the third step, the transparent adhesive is heat-cured at 200 ° C. or less.   A light-emitting device having the wavelength conversion member according to any one of claims 1 to 6.

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