WO2016027789A1 - Wavelength conversion member, and light-emitting apparatus, light-emitting element, light source apparatus, and display apparatus using same - Google Patents
Wavelength conversion member, and light-emitting apparatus, light-emitting element, light source apparatus, and display apparatus using same Download PDFInfo
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- WO2016027789A1 WO2016027789A1 PCT/JP2015/073061 JP2015073061W WO2016027789A1 WO 2016027789 A1 WO2016027789 A1 WO 2016027789A1 JP 2015073061 W JP2015073061 W JP 2015073061W WO 2016027789 A1 WO2016027789 A1 WO 2016027789A1
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- light
- wavelength conversion
- conversion member
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- storage space
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0026—Wavelength selective element, sheet or layer, e.g. filter or grating
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133621—Illuminating devices providing coloured light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Definitions
- the present invention relates to a wavelength conversion member in which a wavelength conversion member is filled in a container, and a light emitting device, a light emitting element, a light source device, and a display device using the wavelength conversion member.
- Patent Document 1 discloses an invention related to a light emitting device including a light source, a wavelength conversion member, a light guide plate, and the like.
- the wavelength conversion member is provided between the light source and the light guide plate, and absorbs light having a wavelength emitted from the light source, and then generates light having a different wavelength.
- the wavelength conversion part substance is enclosed with cylindrical containers, such as glass, for example.
- the wavelength changing substance includes a fluorescent pigment, a fluorescent dye, a quantum dot, or the like.
- the wavelength changing substance absorbs blue light from a light source and converts a part thereof into red light or green light.
- Patent Document 1 [0015] to [0017] describe that light from a light source passes through a wavelength conversion substance, and thereby red, green, and blue light are combined to generate white light. ing.
- the present invention has been made in view of such points, and in particular, a wavelength conversion member capable of performing color conversion appropriately and with high efficiency, and a light emitting device, a light emitting element, and a light source device using the same
- An object is to provide a display device.
- the wavelength conversion member of the present invention includes a first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface, and the side surface.
- a container provided with a storage space on the inner side, a wavelength converting substance disposed in the storage space, and the second side from the side surface, the end of the second surface, or the side surface. And a colored layer formed over the end of the surface.
- the wavelength conversion member of the present invention includes a first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface, and the side surface.
- the container further includes a container having a storage space inside, a wavelength converting substance disposed in the storage space, and a colored layer formed on a wall surface of the storage space.
- the wavelength conversion member of the present invention includes a first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface, and the side surface.
- a container provided with a storage space on the inner side, a wavelength converting substance disposed in the storage space, and a colored layer provided between the side surface of the container and the storage space.
- the wavelength converting material includes quantum dots.
- the said wavelength conversion substance is formed with the resin composition which disperse
- the wavelength conversion substance is formed of a resin composition in which the quantum dots are dispersed in a silicone resin.
- vertical to at least any one of the said 1st surface and the said 2nd surface is a rectangular shape.
- the colored layer is preferably colored white.
- the colored layer is preferably composed of paint, ink, or tape.
- the refractive index of resin which comprises the said wavelength conversion substance is smaller than the refractive index of the said container.
- the light-emitting device in this invention has the light emitting element provided facing the said 1st surface, and the wavelength conversion member in any one of said arrange
- the light-emitting element according to the present invention includes a light-emitting chip that emits blue light, and the wavelength conversion member according to any one of the above that is disposed on a light-emitting side of the light-emitting chip. To do.
- the light source device includes the light emitting device described above or the light emitting element described above and a light guide plate.
- the display device includes a display portion and the light-emitting device described above or the light-emitting element described above disposed on the back side of the display portion.
- the wavelength conversion member of the present invention color conversion can be performed appropriately and efficiently compared to the conventional case.
- the light emitting device, light emitting element, light source device, and display device of the present invention each include the wavelength conversion member of the present invention. Therefore, it can be appropriately and efficiently converted to a desired color through the wavelength conversion member or a color closer to the desired color, and the reliability of the apparatus can be increased. Thereby, power consumption can be reduced.
- FIG. 2 is a cross-sectional view of the wavelength conversion member shown in FIG. 1 cut in a plane direction along the line AA and viewed from the direction of the arrows. It is sectional drawing of the wavelength conversion member which shows a different cross-sectional shape from FIG. It is sectional drawing of the wavelength conversion member which shows the cross-sectional shape different from FIG. 2, FIG. It is sectional drawing of the wavelength conversion member which shows a different cross-sectional shape from FIG. It is sectional drawing of the wavelength conversion member which shows a different cross-sectional shape from FIG. It is sectional drawing of the wavelength conversion member which shows a different cross-sectional shape from FIG. It is a top view of the light-emitting device and light source device using the wavelength conversion member shown in FIG.
- FIG. 9 is an enlarged longitudinal sectional view taken in the height direction along the line BB and viewed from the arrow direction in a state where the wavelength conversion members shown in FIG. 8 are combined.
- FIG. 9 is a longitudinal cross-sectional view of the light emitting device as viewed from the direction of the arrow, cut in the height direction along the line BB shown in FIG. 8 in a state where the members of the light emitting device shown in FIG.
- FIG. 10 is an enlarged longitudinal sectional view of a wavelength conversion member showing a sectional shape different from FIG. 9. It is a longitudinal cross-sectional view of the display apparatus using the light emitting element shown in FIG.
- Example 2 is an emission spectrum in Example 1.
- 2 is a chromaticity diagram in Example 1.
- FIG. 2 is an emission spectrum in Example 2.
- 6 is a chromaticity diagram in Example 2.
- FIG. 7 is an emission spectrum in Example 3.
- 6 is a chromaticity diagram in Example 3.
- FIG. 1 is a perspective view of a wavelength conversion member showing a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view of the wavelength conversion member shown in FIG. 1 cut along a line AA in the plane direction and viewed from the direction of the arrow.
- the wavelength conversion member 1 in the first embodiment includes a container 2, a wavelength conversion material 3, and a colored layer 4.
- the container 2 can store and hold the wavelength converting substance 3.
- the container 2 is preferably a transparent member. “Transparent” refers to what is generally recognized as being transparent, or having a visible light transmittance of about 50% or more.
- the container 2 includes a light incident surface 2a, a light emitting surface 2b, and a side surface 2c that connects the light incident surface 2a and the light emitting surface 2b. As shown in FIGS. 1 and 2, the light incident surface 2a and the light emitting surface 2b are in a positional relationship facing each other.
- the container 2 has a storage space 5 formed inside the light incident surface 2a, the light emitting surface 2b, and the side surface 2c.
- the storage space 5 should just be located inside at least the side surface 2c. That is, for example, a part of the storage space 5 may reach the light incident surface 2a and the light emitting surface 2b.
- the wavelength conversion substance 3 is disposed in the storage space 5. As shown in FIG. 1, the storage space 5 is open, from which the wavelength converting substance 3 can be sealed and filled in the storage space 5.
- the vertical and horizontal dimensions of the container 2 are about several mm to several tens of mm, and the vertical and horizontal dimensions of the storage space 5 are about several hundred ⁇ m to several mm.
- the outer cross section of the storage space 5 and the outer cross section of the container 2 are both rectangular. It is formed with.
- Such a cut surface is a surface cut in the direction in which the light incident surface 2a, the light emitting surface 2b, and the side surface 2c appear.
- the “rectangular shape” has four vertices having a substantially right angle and includes a square and a rectangle.
- the outer cross section of the storage space 5 and the outer cross section of the container 2 are preferably similar.
- the container 2 shown in FIGS. 1 and 2 is, for example, a glass tube container, and can be exemplified by a glass capillary.
- a resin or the like may be used as long as the container having excellent transparency can be configured as described above.
- the wavelength conversion material 3 includes quantum dots. Fluorescent pigments other than quantum dots, fluorescent dyes, and the like may be used as the wavelength conversion substance 3, but the inclusion of quantum dots is excellent in wavelength conversion characteristics.
- the wavelength converting substance 3 is preferably formed of a resin composition in which quantum dots are dispersed.
- resins include polypropylene, polyethylene, polystyrene, AS resin, ABS resin, methacrylic resin, polyvinyl chloride, polyacetal, polyamide, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyethersulfone, and polyphenylene sulfide.
- Polyamideimide, polymethylpentene, liquid crystal polymer, epoxy resin, phenol resin, urea resin, melamine resin, epoxy resin, diallyl phthalate resin, unsaturated polyester resin, polyimide, polyurethane, silicone resin, or some mixture thereof Etc. can be used.
- the refractive index of the resin constituting the wavelength converting substance 3 is preferably smaller than the refractive index of the container 2.
- the refractive index of the silicone resin is 1.52 for SCR1016 manufactured by Shin-Etsu Chemical Co., Ltd., 1.55 for A2045 manufactured by Daicel Corporation, at 23 ° C., sodium D line, manufactured by Shin-Etsu Chemical Co., Ltd. KER-2500 of 1.41 and A1080 manufactured by Daicel Corporation of 1.41.
- the refractive index of an epoxy resin is 1.51 in Cell Venus WO917 made from Daicel Corporation, and 1.50 in Cell Venus WO925 in sodium D line
- the refractive index of the container 2 made of glass is about 1.45 in the case of general glass, and about 1.50 to 1.90 in the case of optical glass with a high refractive index. Therefore, by appropriately selecting the resin constituting the wavelength converting substance 3 and the material of the container 2, the refractive index of the resin constituting the wavelength converting substance 3 can be made smaller than the refractive index of the container 2.
- A1080 or KER-2500 which is a silicone resin having a refractive index of 1.41, is used as the resin constituting the wavelength converting substance 3, and the container 2 can be made of glass having a refractive index of 1.45.
- a silicone resin or an epoxy resin having a refractive index of 1.41 to 1.55 is used as a resin constituting the wavelength converting substance 3, and the container 2 is made of a high refractive index glass having a refractive index of 1.56 or more. Can be configured.
- a part of the light that has entered the wavelength converting substance 3 is totally reflected by the side wall portion of the container 2 facing the storage space 5. This is because the incident angle on the medium side with a small refractive index is larger than the incident angle on the medium side with a large refractive index.
- the resin constituting the wavelength converting substance 3 here is not limited to the resin for dispersing the quantum dots.
- the quantum dot in this Embodiment has the core of a semiconductor particle, and the shell part which coat
- CdSe is used for the core, but the material is not particularly limited.
- a core material containing at least Zn and Cd, a core material containing Zn, Cd, Se and S, ZnCuInS, CdS, CdSe, ZnS, ZnSe, InP, CdTe, and some composites thereof are used. it can.
- the quantum dot in this Embodiment may be comprised only by the core part of a semiconductor particle, without forming a shell part. That is, the quantum dot does not need to have a covering structure with a shell part as long as it has at least a core part. For example, when the shell portion is coated on the core portion, the region that becomes the covering structure may be small or the covering portion may be too thin to analyze and confirm the covering structure. Therefore, it can be determined as a quantum dot regardless of the presence or absence of the shell portion by analysis.
- Quantum dots include, for example, two types of quantum dots having an absorption wavelength of 460 nm (blue) and a fluorescence wavelength of about 520 nm (green) and a quantum dot of about 660 nm (red). For this reason, when blue light is incident from the light incident surface 2a, a part of blue is converted into green or red by each quantum dot. Thereby, white light can be obtained from the light emitting surface 2b. However, conventionally, blue light cannot be appropriately converted into white light. This is because the blue light passes through the side region 7 (see FIG. 2) between the storage space 5 filled with the wavelength converting substance 3 and the side surface 2c (see FIG. 2) from the light incident surface 2a to the light emitting surface 2b. This is because the blue wavelength intensity is strong at 2b.
- the colored layers 4 and 4 are provided on the side surfaces 2c and 2c as shown in FIGS.
- the “colored layer” is a layer that is not transparent, and refers to a layer colored in colors including white.
- the colored layer 4 is preferably composed of paint, ink, or tape.
- the color of the colored layer 4 is not limited, it is suitable that it is white. Therefore, the colored layer 4 can be easily formed by simply applying white paint or white ink to the side surface 2c or simply applying a white tape to the side surface 2c.
- the metal layer 4 can be formed by vapor-depositing a metal such as Ni, Ag, Al, or Cr.
- the emission intensity of white light can be made equal to or higher than that of the prior art.
- the colored layer 4 is formed on the side surface 2c of the container 2, but as shown in FIG. 3A, the colored layer 4 extends from the side surface 2c of the container 2 to the end 2e of the light emitting surface 2b. Can be formed. Or as shown to FIG. 3B, the colored layer 4 can also be formed only in the edge part 2e of the light-projection surface 2b.
- the colored layer 4 is preferably formed from the side surface 2c of the container 2 as shown in FIG. 2 or from the side surface 2c of the container 2 to the end 2e of the light emitting surface 2b as shown in FIG. 3A.
- the end 2e of the light exit surface 2b faces the side region 7 between the storage space 5 and the side surface 2c. Therefore, the end 2e does not face the storage space 5 filled with the wavelength converting substance 3. Therefore, the colored layer 4 provided at the end 2e of the light exit surface 2b is preferably located on both sides of the storage space 5 filled with the wavelength converting substance 3 and does not face the storage space 5, but the light exit surface 2b.
- the colored layer 4 may be formed to be slightly longer and may partially face the storage space 5.
- the colored layer 4 is included in the allowable range as long as it faces about 1/3 or less of the width of the storage space 5.
- the colored layer 4 is preferably formed on the entire surface of the side surface 2c or the end portion 2e, but may not necessarily be the entire surface, and may be a part of the side surface 2c or the end portion 2e. However, the colored layer 4 preferably covers an area of 50% or more of the side surface 2c or the end 2e. Further, the colored layer 4 may be formed by using all or part of the side region 7 as a colored material instead of being formed on the side region 7. For example, all or part of the side region 7 can be formed by using white glass or white resin.
- the cross-sectional shape is preferably such that the outer shape of the container 2 and the storage space 5 is rectangular.
- the side surface 2c of the container 2 and the side wall surface of the storage space 5 may be curved or may have an elliptical configuration.
- the outer shape of the container 2 and the storage space 5 is square, but as shown in FIG. 4B, the outer shape of the container 2 and the storage space 5 can be rectangular.
- the outer shapes of the cross section of the container 2 and the storage space 5 are similar to each other, but as shown in FIG. 4C, the outer shape of the cross section of the container 2 and the storage space It is also possible to make the outer shape of the cross section of 5 different.
- the outer shape of the cross section of the container 2 is a rectangular shape
- the outer shape of the cross section of the storage space 5 is a hexagon.
- making the outer shape of the cross section of the container 2 and the storage space 5 similar to each other has the effect of providing the colored layer 4 of the present embodiment (color conversion can be performed appropriately and efficiently, and desired as compared with the prior art.
- the external shape of the cross section of the container 2 and the storage space 5 can be made into a trapezoid shape similar to each other.
- the shorter side of the trapezoid is the light incident surface 2a
- the longer side is the light emitting surface 2b.
- the light emitted from the light source can be enlarged to a predetermined size.
- the long side of the trapezoid may be the light incident surface 2a and the short side may be the light emitting surface 2b. Thereby, the light emitted from the light source can be condensed to a predetermined size.
- the outer shapes of the cross sections of the container 2 and the storage space 5 are different from those in FIG. 4D, and the side surfaces are formed symmetrically with respect to the center line passing through the centers of the upper base and the lower base of the trapezoid. May be.
- the light incident surface and the light exit surface are formed as flat surfaces, but either one of the light incident surface and the light exit surface or both are formed as curved surfaces. May be.
- the side surface of the container 2 is formed as a flat surface, but the side surface may be formed as a curved surface.
- the corners between the sides may be R-shaped.
- expressions such as a rectangular shape, a hexagonal shape, and a trapezoidal shape are not limited to geometrically accurate quadrangular shapes, hexagonal shapes, trapezoidal shapes, etc., and lines and angles constituting these have distortions, or Including errors are also included. By these, the direction of the emitted light can be adjusted.
- the colored layer 4 is formed on the side surface 2c of the container 2, but the colored layer 4 is formed on the side surface 2c of the container 2 from the side 2c of the container 2 as shown in FIG. 3A. It can also be provided on the end 2e of the light exit surface 2b as shown in FIG. 3B.
- the colored layer 4 is formed on the outer surface of the container 2, but the colored layer 4 can also be formed on the wall surface 5a of the internal space 5, as shown in FIG.
- the wall surface 5 a that forms the colored layer 4 is located at a position facing the side surface 2 c of the container 2.
- the side portion 2 d of the container 2 between the side surface 2 c of the container 2 and the internal space 5 can be a colored layer 4.
- the container 2 is molded in two colors, and at this time, a colored resin is used for a portion to be the side portion 2d of the container 2.
- the container 2 shown in FIG. 6 can be formed by bonding the side part 2d of the container 2 and other parts by bonding or the like. 5 and 6, the same reference numerals as those in FIGS. 2 and 3 indicate the same parts as those in FIGS.
- the wavelength conversion member 1 shown in FIG. 1 can be interposed between a light emitting element 10 such as an LED and a light guide plate 12 as shown in FIG.
- a combination of the wavelength conversion member 1 and the light emitting element 10 is a light emitting device, and a light source plate 12 is added to the light emitting device to constitute a light source device.
- the light guide member can be configured by combining the wavelength conversion member 1 and the light guide plate 12.
- the light emitting device shown in FIG. 7 can be used as a white surface light source of a liquid crystal display, for example.
- the light emitted from the light emitting element 10 is incident from the light incident surface 2 a of the wavelength conversion member 1, wavelength-converted by the wavelength conversion material 3 (see FIG. 1), and wavelength-converted light. Is emitted from the light exit surface 2b to the light guide plate 12.
- the colored layer 4 formed on the side surface 2c of the container 2 constituting the wavelength conversion member 1 appears on the upper and lower surfaces.
- Light of a desired color can be obtained from the light emitting surface 2b.
- the desired color of emitted light is white light
- the light-emitting device and the light source device shown in FIG. 7 can emit white light more effectively than conventional ones, and can improve the reliability of the device.
- FIG. 8 is an exploded perspective view of a light-emitting element provided with a wavelength conversion member according to the second embodiment of the present invention.
- FIG. 9 is an enlarged longitudinal sectional view taken along the line BB in the height direction and viewed from the arrow direction in a state where the wavelength conversion members shown in FIG. 8 are combined.
- FIG. 10 is a longitudinal cross-sectional view of the light-emitting element as viewed from the direction of the arrow, cut in the height direction along the line BB shown in FIG. 8 in a state where the members of the light-emitting element shown in FIG. 8 are combined.
- the wavelength conversion member 21 includes a container 25 formed of a plurality of pieces of a container main body 23 and a lid body 24. As shown in FIGS. 8, 9, and 10, a bottomed storage space 26 is formed at the center of the container body 23. The wavelength conversion substance 27 is filled in the storage space 26.
- the lid body 24 is joined to the container body 23 via an adhesive layer (not shown). Further, the colored layer 28 is formed on the side surface 25 c of the container 25.
- the lower surface of the container 25 of the wavelength conversion member 21 is a light incident surface 25 a.
- the upper surface facing the light incident surface 25a is the light emitting surface 25b.
- a storage space 26 is formed at a position inside the side surface 25c provided in the container 25 of the wavelength conversion member 21 shown in FIGS. 9 shows the side surface 25c that appears on the cut surface along the line BB in FIG. 8, but the other two side surfaces 25c that do not appear on the cut surface along the line BB (the front side and the back surface shown in FIG. 8).
- the colored layer 28 it is preferable to form the colored layer 28 on the side). If it is effective to provide the colored layer 28 on a certain side surface 25c due to the directivity of light, the colored layer 28 may be provided only on the certain side surface 25c and the colored layer 28 may not be provided on the other side surface 25c. Good. However, it is preferable to provide the colored layer 28 on all the side surfaces 25c.
- the LED chip 22 is connected to a printed wiring board 29, and the periphery of the LED chip 22 is surrounded by a frame 30 as shown in FIGS.
- the inside of the frame 30 is sealed with a resin layer 31.
- the wavelength conversion member 21 is joined to the upper surface of the frame body 30 via an adhesive layer (not shown) to form a light emitting element 20 such as an LED.
- the colored layer 28 may be formed from the side surface 25c of the container 25 of the wavelength conversion member 21 to the end portion 25e of the light emitting surface 25b. Further, as shown in FIG. 11B, the colored layer 28 may be formed only on the end portion 25e of the light emitting surface 25b.
- FIG. 12 is a longitudinal sectional view of a display device using the light emitting element shown in FIG.
- the display device 50 includes a plurality of light emitting elements 20 (LEDs) and a display unit 54 such as a liquid crystal display facing the light emitting elements 20.
- Each light emitting element 20 is disposed on the back side of the display unit 54.
- the plurality of light emitting elements 20 are supported by the support body 52.
- the light emitting elements 20 are arranged at a predetermined interval.
- Each light emitting element 20 and the support 52 constitute a backlight 55 for the display unit 54.
- the support 52 is not particularly limited in shape or material such as a sheet shape, a plate shape, or a case shape.
- a light diffusion plate 53 or the like is interposed between the backlight 55 and the display unit 54.
- the light-emitting device (including the light-emitting element, the capillary-shaped wavelength conversion member 1, the light guide plate 12, and the like) shown in FIG. 7 is disposed on the back side of the display unit 54 shown in FIG.
- the display device 50 may be configured.
- the wavelength conversion member and the light emitting element of the present embodiment can be applied to other types of light source devices, illumination devices, light diffusion devices, light reflection devices, and the like. it can.
- Example 1 A silicone resin was used as a dispersion resin for the quantum dots, and the silicone resin in which the quantum dots were dispersed was sealed in a capillary. The quantum dot concentration was set to a concentration at which the absorbance was 15%.
- Example 2 An epoxy resin was used as a dispersion resin for the quantum dots, and the epoxy resin in which the quantum dots were dispersed was sealed in a capillary. The quantum dot concentration was set to a concentration at which the absorbance was 15%.
- Example 1 In Example 1, the sample 1 was used, a wavelength conversion member (hereinafter referred to as “none_1”) in which no paint was applied to the capillary, and a wavelength conversion member (hereinafter, referred to as “none_1”) in which white paint was applied to the end of the light emission surface of the capillary. "Top_1”), a wavelength conversion member (hereinafter referred to as "side_1”) coated with white paint on the side of the light exit surface of the capillary, white paint from the side of the light exit surface of the capillary to the end of the light exit surface The wavelength conversion member (henceforth "side + top_1”) which apply
- the white paint suppresses blue light leakage from the side region from the light incident surface to the light emitting surface, so that the synthetic hole on the light emitting surface is conventional (none_1).
- side_1 and side + top_1 were able to obtain white light or near-white light.
- all of top_1, side_1, and side + top_1 were able to obtain white light emission intensity equal to or higher than that of none_1.
- the increase in the light emission intensity of white light was more noticeable than that of none_1.
- Example 2 In Example 2, a wavelength conversion member (hereinafter referred to as “none_2”) in which the sample 1 is used and no paint is applied to the capillary, and a wavelength conversion member (top_2) in which silver paint is applied to the end of the light emission surface of the capillary A wavelength converting member (side_2) coated with silver paint on the side of the light emitting surface of the capillary, and a wavelength converting member (side + top_2) coated with silver paint from the side of the light emitting surface of the capillary to the end of the light emitting surface. Prepared.
- Example 1 by applying silver paint, blue is weaker than none_2 and close to white.
- the effect of Example 1 with white paint was greater than that of Example 2.
- Example 3 In Example 3, the sample 2 was used, a wavelength conversion member (none_3) in which no paint was applied to the capillary, a wavelength conversion member (top_3) in which white paint was applied to the end of the light output surface of the capillary, and light output from the capillary A wavelength converting member (side_3) coated with white paint on the side surface of the surface and a wavelength converting member (side + top_3) coated with white paint from the side surface of the light emitting surface of the capillary to the end of the light emitting surface were prepared.
- blue is weaker than none_3 and close to white, but it is better to use a silicone resin as the dispersion resin (see FIG. 14). It has been found that blue can be suppressed and white can be made closer than when an epoxy resin is used.
- Example 3 An epoxy resin was used as a dispersion resin for the quantum dots, and the epoxy resin in which the quantum dots were dispersed was sealed in a capillary. The density
- Sample 4 An epoxy resin was used as a dispersion resin for the quantum dots, and the epoxy resin in which the quantum dots were dispersed was sealed in a capillary. The density
- Example 5 A silicone resin was used as a dispersion resin for the quantum dots, and the silicone resin in which the quantum dots were dispersed was sealed in a capillary.
- concentration of the quantum dot in dispersion resin was made into the density
- Comparative Example 1 In Comparative Example 1, a sample 3 was used and a wavelength conversion member in which paint was not applied to the capillary was prepared. The measurement results obtained by measuring the luminous flux are shown in Table 1 below.
- Comparative Example 2 In Comparative Example 2, a sample 4 was used and a wavelength conversion member in which no paint was applied to the capillary was prepared. The measurement results obtained by measuring the luminous flux are shown in Table 2 below.
- Example 3 to 5 wavelength conversion members were prepared by using Sample 1 and applying white paint to the side surfaces of the capillaries. The measurement position at which the light flux measurement was performed was changed in Examples 3-5.
- Example 4 was set as the measurement position in the vicinity of the center of the light guide plate, and Examples 3 and 5 were positioned on both sides thereof.
- Example 3 The measurement results of Example 3 are shown in Table 3 below, the measurement results of Example 4 are shown in Table 4, and the measurement results of Example 5 are shown in Table 5 below.
- Example 6 In Examples 6 to 8, wavelength conversion members were prepared using Sample 5 and applying white paint to the side surfaces of the capillaries. The measurement position at which the light flux measurement was performed was changed in Examples 6-8. In Example 7, the vicinity of the center of the light guide plate was used, and in Examples 6 and 8, both side positions thereof were set as measurement positions.
- Example 6 The measurement results of Example 6 are shown in Table 6 below, the measurement results of Example 7 are shown in Table 7, and the measurement results of Example 8 are shown in Table 8 below.
- the x coordinate of the chromaticity diagram can be 0.30 to 0.40
- the y coordinate can be 0.35 to 045
- the color temperature can be about 4000 K to 6500 K in the example.
- an LED, a backlight device, a display device, or the like can be realized using a wavelength conversion member in which a wavelength conversion substance is sealed in a container.
- a wavelength conversion member of the present invention since color conversion can be performed appropriately and with high efficiency, it is possible to reduce power consumption of an LED, a backlight device, a display device, and the like using the wavelength conversion member of the present invention. it can.
Abstract
Description
内寸0.5mm×0.5mm角型ガラスキャピラリ(図1、図2参照)
[量子ドット]
コア/シェル構造の赤色発光量子ドット(QY値;83%)と緑色発光量子ドット(QY値80%、81%)
[量子ドットに対する分散樹脂]
シリコーン樹脂
エポキシ樹脂
[キャピラリへの樹脂封入]
真空引きで封入
[全光束測定]
キャピラリを導光板の底に貼り付けて測定した。その際、光源として450nm波長LED(駆動20mA)を3個点灯させた。そして、分光器としてASENSETEK lighting Passportを用いた。 [Capillary]
Inner size 0.5 mm x 0.5 mm square glass capillary (see Figs. 1 and 2)
[Quantum dots]
Core / shell structure red light emitting quantum dots (QY value; 83%) and green light emitting quantum dots (QY value 80%, 81%)
[Dispersion resin for quantum dots]
Silicone resin Epoxy resin [Resin encapsulated in capillary]
Enclosed by vacuum [total luminous flux measurement]
Measurement was performed by attaching a capillary to the bottom of the light guide plate. At that time, three 450 nm wavelength LEDs (drive 20 mA) were turned on as light sources. As a spectroscope, ASENSETEK lighting Passport was used.
量子ドットに対する分散樹脂としてシリコーン樹脂を用い、量子ドットが分散されたシリコーン樹脂をキャピラリへ封入した。なお、量子ドット濃度は、吸光度が15%となる濃度とした。
[試料2]
量子ドットに対する分散樹脂としてエポキシ樹脂を用い、量子ドットが分散されたエポキシ樹脂をキャピラリへ封入した。なお、量子ドット濃度は、吸光度が15%となる濃度とした。 [Sample 1]
A silicone resin was used as a dispersion resin for the quantum dots, and the silicone resin in which the quantum dots were dispersed was sealed in a capillary. The quantum dot concentration was set to a concentration at which the absorbance was 15%.
[Sample 2]
An epoxy resin was used as a dispersion resin for the quantum dots, and the epoxy resin in which the quantum dots were dispersed was sealed in a capillary. The quantum dot concentration was set to a concentration at which the absorbance was 15%.
実施例1では、試料1を用い、キャピラリにペイントを塗布していない波長変換部材(以下、「none_1」という)、キャピラリの光出射面の端部に白色ペイントを塗布した波長変換部材(以下、「top_1」という)、キャピラリの光出射面の側面に白色ペイントを塗布した波長変換部材(以下、「side_1」という)、キャピラリの光出射面の側面上から光出射面の端部上にかけて白色ペイントを塗布した波長変換部材(以下、「side+top_1」という)を用意した。 [Example 1]
In Example 1, the
実施例2では、試料1を用い、キャピラリにペイントを塗布していない波長変換部材(以下、「none_2」という)、キャピラリの光出射面の端部に銀色ペイントを塗布した波長変換部材(top_2)、キャピラリの光出射面の側面に銀色ペイントを塗布した波長変換部材(side_2)、キャピラリの光出射面の側面上から光出射面の端部上にかけて銀色ペイントを塗布した波長変換部材(side+top_2)を用意した。 [Example 2]
In Example 2, a wavelength conversion member (hereinafter referred to as “none_2”) in which the
実施例3では、試料2を用い、キャピラリにペイントを塗布していない波長変換部材(none_3)、キャピラリの光出射面の端部に白色ペイントを塗布した波長変換部材(top_3)、キャピラリの光出射面の側面に白色ペイントを塗布した波長変換部材(side_3)、キャピラリの光出射面の側面上から光出射面の端部上にかけて白色ペイントを塗布した波長変換部材(side+top_3)を用意した。 [Example 3]
In Example 3, the
量子ドットに対する分散樹脂としてエポキシ樹脂を用い、量子ドットが分散されたエポキシ樹脂をキャピラリへ封入した。分散樹脂中の量子ドットの濃度を吸光度が20%となる濃度とした。
[試料4]
量子ドットに対する分散樹脂としてエポキシ樹脂を用い、量子ドットが分散されたエポキシ樹脂をキャピラリへ封入した。分散樹脂中の量子ドットの濃度を吸光度が30%となる濃度とした。
[試料5]
量子ドットに対する分散樹脂としてシリコーン樹脂を用い、量子ドットが分散されたシリコーン樹脂をキャピラリへ封入した。分散樹脂中の量子ドットの濃度を吸光度が20%となる濃度とした。 [Sample 3]
An epoxy resin was used as a dispersion resin for the quantum dots, and the epoxy resin in which the quantum dots were dispersed was sealed in a capillary. The density | concentration of the quantum dot in dispersion resin was made into the density | concentration which becomes 20% of light absorbency.
[Sample 4]
An epoxy resin was used as a dispersion resin for the quantum dots, and the epoxy resin in which the quantum dots were dispersed was sealed in a capillary. The density | concentration of the quantum dot in dispersion resin was made into the density | concentration used as a
[Sample 5]
A silicone resin was used as a dispersion resin for the quantum dots, and the silicone resin in which the quantum dots were dispersed was sealed in a capillary. The density | concentration of the quantum dot in dispersion resin was made into the density | concentration which becomes 20% of light absorbency.
比較例1では、試料3を用い、キャピラリにペイントを塗布していない波長変換部材を用意した。そして光束測定を行った測定結果が以下の表1に示されている。 [Comparative Example 1]
In Comparative Example 1, a
比較例2では、試料4を用い、キャピラリにペイントを塗布していない波長変換部材を用意した。そして光束測定を行った測定結果が以下の表2に示されている。 [Comparative Example 2]
In Comparative Example 2, a
実施例3~5では、夫々試料1を用い、キャピラリの側面に白色ペイントを塗布した波長変換部材を用意した。そして光束測定を行う測定位置を実施例3~5で変えた。実施例4は導光板の中央付近、実施例3、及び実施例5はその両側位置を測定位置とした。 [Examples 3 to 5]
In Examples 3 to 5, wavelength conversion members were prepared by using
実施例6~8では、夫々試料5を用い、キャピラリの側面に白色ペイントを塗布した波長変換部材を用意した。そして光束測定を行う測定位置を実施例6~8で変えた。実施例7は導光板の中央付近、実施例6、及び実施例8はその両側位置を測定位置とした。 [Examples 6 to 8]
In Examples 6 to 8, wavelength conversion members were prepared using
Claims (14)
- 第1の面、前記第1の面に対向する第2の面、及び、前記第1の面と前記第2の面との間を繋ぐ側面を備え、前記側面よりも内側に収納空間が設けられた容器と、
前記収納空間内に配置された波長変換物質と、
前記側面上、前記第2の面の端部上、又は、前記側面上から前記第2の端部上にかけて形成された着色層と、
を有することを特徴とする波長変換部材。 A first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface, and a storage space is provided inside the side surface A container,
A wavelength converting substance disposed in the storage space;
A colored layer formed on the side surface, on an end portion of the second surface, or on the side surface to the second end portion;
A wavelength conversion member comprising: - 第1の面、前記第1の面に対向する第2の面、及び、前記第1の面と前記第2の面との間を繋ぐ側面を備え、前記側面よりも内側に収納空間が設けられた容器と、
前記収納空間内に配置された波長変換物質と、
前記収納空間の壁面に形成された着色層と、
を有することを特徴とする波長変換部材。 A first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface, and a storage space is provided inside the side surface A container,
A wavelength converting substance disposed in the storage space;
A colored layer formed on the wall surface of the storage space;
A wavelength conversion member comprising: - 第1の面、前記第1の面に対向する第2の面、及び、前記第1の面と前記第2の面との間を繋ぐ側面を備え、前記側面よりも内側に収納空間が設けられた容器と、
前記収納空間内に配置された波長変換物質と、
前記容器の前記側面と前記収納空間までの間に設けられた着色層と、
を有することを特徴とする波長変換部材。 A first surface, a second surface facing the first surface, and a side surface connecting the first surface and the second surface, and a storage space is provided inside the side surface A container,
A wavelength converting substance disposed in the storage space;
A colored layer provided between the side surface of the container and the storage space;
A wavelength conversion member comprising: - 前記波長変換物質は、量子ドットを含むことを特徴とする請求項1ないし3のいずれかに記載の波長変換部材。 The wavelength conversion member according to any one of claims 1 to 3, wherein the wavelength conversion substance includes quantum dots.
- 前記波長変換物質は、前記量子ドットを分散した樹脂組成物により形成されることを特徴とする請求項4に記載の波長変換部材。 The wavelength conversion member according to claim 4, wherein the wavelength conversion substance is formed of a resin composition in which the quantum dots are dispersed.
- 前記波長変換物質は、前記量子ドットをシリコーン樹脂に分散した樹脂組成物により形成されることを特徴とする請求項5に記載の波長変換部材。 The wavelength converting member according to claim 5, wherein the wavelength converting substance is formed of a resin composition in which the quantum dots are dispersed in a silicone resin.
- 前記第1の面及び前記第2の面の、少なくともいずれか一方に垂直な平面で切断した、前記収納空間及び前記容器の外形断面は、いずれも矩形状であることを特徴とする請求項1ないし6のいずれかに記載の波長変換部材。 The outer cross section of the storage space and the container cut by a plane perpendicular to at least one of the first surface and the second surface are both rectangular. The wavelength conversion member in any one of 6 thru | or 6.
- 前記着色層は、白色に着色されていることを特徴とする請求項1ないし7のいずれかに記載の波長変換部材。 The wavelength conversion member according to any one of claims 1 to 7, wherein the colored layer is colored white.
- 前記着色層は塗料、インク、あるいはテープにより構成されることを特徴とする請求項1ないし8のいずれかに記載の波長変換部材。 The wavelength conversion member according to any one of claims 1 to 8, wherein the colored layer is made of paint, ink, or tape.
- 前記波長変換物質を構成する樹脂の屈折率は、前記容器の屈折率よりも小さいことを特徴とする請求項1ないし9のいずれかに記載の波長変換部材。 The wavelength conversion member according to any one of claims 1 to 9, wherein a refractive index of a resin constituting the wavelength conversion substance is smaller than a refractive index of the container.
- 前記第1の面に対向して設けられた発光素子と、前記発光素子の発光側に配置される請求項1ないし10のいずれかに記載の波長変換部材と、を有して構成されることを特徴とする発光装置。 The light-emitting element provided to face the first surface, and the wavelength conversion member according to claim 1 disposed on a light-emitting side of the light-emitting element. A light emitting device characterized by the above.
- 青色光を発する発光チップと、前記発光チップの光出射側に配置された請求項1ないし10のいずれかに記載の波長変換部材と、を有して構成されることを特徴とする発光素子。 A light emitting device comprising: a light emitting chip that emits blue light; and the wavelength conversion member according to claim 1 disposed on a light emitting side of the light emitting chip.
- 請求項11に記載の発光装置、あるいは、請求項12に記載の発光素子と、導光板と、を有することを特徴とする光源装置。 A light source device comprising the light emitting device according to claim 11 or the light emitting element according to claim 12 and a light guide plate.
- 表示部と、前記表示部の裏面側に配置された請求項11に記載の発光装置、あるいは、請求項12に記載の発光素子と、を有することを特徴とする表示装置。
A display device comprising: a display unit; and the light-emitting device according to claim 11 or the light-emitting element according to claim 12 arranged on a back side of the display unit.
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KR1020177003704A KR20170045206A (en) | 2014-08-22 | 2015-08-18 | Wavelength conversion member, and light-emitting apparatus, light-emitting element, light source apparatus, and display apparatus using same |
US15/504,200 US10598844B2 (en) | 2014-08-22 | 2015-08-18 | Wavelength conversion member, and light-emitting apparatus, light-emitting element, light source apparatus, and display apparatus using same |
EP15833902.8A EP3185316A4 (en) | 2014-08-22 | 2015-08-18 | Wavelength conversion member, and light-emitting apparatus, light-emitting element, light source apparatus, and display apparatus using same |
JP2016544205A JP6746498B2 (en) | 2014-08-22 | 2015-08-18 | Wavelength conversion member, light emitting device using the same, light emitting element, light source device, and display device |
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CN110389470A (en) * | 2018-04-19 | 2019-10-29 | 鸿富锦精密工业(深圳)有限公司 | Backing structure and display device |
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Also Published As
Publication number | Publication date |
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TWI681574B (en) | 2020-01-01 |
TW201921733A (en) | 2019-06-01 |
US10598844B2 (en) | 2020-03-24 |
JP6746498B2 (en) | 2020-08-26 |
KR20170045206A (en) | 2017-04-26 |
CN106663727A (en) | 2017-05-10 |
EP3185316A1 (en) | 2017-06-28 |
US20170269280A1 (en) | 2017-09-21 |
EP3185316A4 (en) | 2018-03-07 |
TWI696301B (en) | 2020-06-11 |
CN106663727B (en) | 2020-10-16 |
JPWO2016027789A1 (en) | 2017-07-20 |
TW201616693A (en) | 2016-05-01 |
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