WO2012053386A1

WO2012053386A1 - Method for producing light-emitting device, and light-emitting device

Info

Publication number: WO2012053386A1
Application number: PCT/JP2011/073297
Authority: WO
Inventors: 米田　賢治
Original assignee: シーシーエス株式会社
Priority date: 2010-10-21
Filing date: 2011-10-11
Publication date: 2012-04-26
Also published as: TW201230411A; JPWO2012053386A1

Abstract

The present invention pertains to a high-yield light-emitting device and a method for producing the light-emitting device, wherein a wavelength conversion member is easily analyzed, classified and managed, and the luminescent color and illumination of the light-emitting device are easy to control. The light-emitting device is provided with: a substrate having a recessed section that opens to the upper end surface; an LED element mounted inside the recessed section of the substrate, which emits ultraviolet light or short-wavelength visible light; a lower translucent plate-like body through which the ultraviolet light or short-wavelength visible light emitted by the LED element is transmitted; a wavelength conversion member containing phosphor that is excited by the ultraviolet light or short-wavelength visible light that has been transmitted through the lower translucent plate-like body; and an upper translucent plate-like body through which part or all of the light that has passed through the wavelength conversion member is transmitted. The method for producing the light-emitting device, the substrate of which comprises an upper substrate that holds the wavelength conversion member and a lower substrate on which the LED element is mounted, is characterized by providing: a mounting step in which the LED element is mounted on the lower substrate; a wavelength conversion member holding step in which the wavelength conversion member is held on the upper substrate; and an assembly step in which the lower substrate on which the LED element is mounted, and the upper substrate on which the wavelength conversion member is held, are integrated.

Description

LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE

The present invention efficiently converts ultraviolet light and short-wavelength visible light into long-wavelength visible light, and can efficiently extract the converted visible light, as well as being excellent in moisture resistance and heat dissipation. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device and a method for manufacturing the same, and more particularly, to a light emitting device that can easily analyze, classify, and manage wavelength conversion members, easily control the emission color and illuminance of the light emitting device, and has a high yield. .

Conventionally, a light-emitting device that emits light of a color different from the emission color of LED elements including white has been developed by combining LED elements that emit ultraviolet rays and short-wavelength visible light and various phosphors ( Patent Document 1). Such a light emitting device using an LED element has advantages such as small size, power saving and long life, and is widely used as a light source for display and a light source for illumination.

Examples of such a light emitting device include a device in which an LED element is mounted in the recess of the substrate on which the recess is formed, and a sealing layer that covers the LED element and a phosphor layer are laminated in this order. . In this light emitting device, most of the ultraviolet rays and short wavelength visible light emitted from the LED elements excite the phosphor and are converted into longer wavelength visible light, but some are not absorbed by the phosphor (visible). In some cases, the phosphor layer is transmitted as it is without being converted into light. In this case, since the conversion efficiency of ultraviolet rays or short-wavelength visible light emitted from the LED element into longer-wavelength visible light is lowered, the light-emitting efficiency of the light-emitting device is lowered as a result. In addition, if ultraviolet rays that are transmitted through the phosphor layer without being converted to visible light are emitted outside the light emitting device, the human body may be adversely affected.

On the other hand, among the longer wavelength visible rays emitted by the phosphors excited by ultraviolet rays or short wavelength visible rays emitted by the LED elements, those that have moved backward toward the substrate on which the LED elements are mounted are It is absorbed by the substrate and cannot be taken out of the light emitting device. For this reason, the light emission efficiency of the light emitting device also decreases due to this factor.

In addition, since the LED element has an extremely long life as compared with the conventional light source, the reflector formed on the base and its inner surface is exposed to visible light for a long time. As described above, the substrate exposed to visible light for a long time deteriorates and changes color. This also affects the emission color of the light emitting device.

JP 2005-191197 A

As a solution to such a problem, in the present applicant, the phosphor layer has a short-wavelength transmission filter (LED element side) that selectively transmits ultraviolet rays and short-wavelength visible light, and longer-wavelength visible light. Attempts have been made to sandwich the filter with a long wavelength transmission filter (on the side opposite to the LED element) that selectively transmits light.

When the phosphor layer is sandwiched between the short wavelength transmission filter (LED element side) and the long wavelength transmission filter (anti-LED element side), ultraviolet rays or short wavelength visible light that has passed through the phosphor layer as it is is a long wavelength transmission filter. Since the light can be reflected and travel in the phosphor layer again, the probability of hitting the phosphor is improved, and more ultraviolet rays and short-wavelength visible light can be converted into long-wavelength visible light. As a result, the amount of light emitted from the light emitting device can be increased. Further, among the long wavelength visible light emitted from the phosphor, the light traveling toward the LED element side is reflected by the short wavelength transmission filter, changed in the traveling direction toward the long wavelength transmission filter, and transmitted through the filter. And it is injected out of the device.

Therefore, by sandwiching the phosphor layer between the short wavelength transmission filter (LED element side) and the long wavelength transmission filter (anti-LED element side), ultraviolet rays and short wavelength visible rays can be efficiently converted into longer wavelength visible rays. In addition, the converted visible light can be efficiently taken out of the apparatus.

In order to manufacture such a light emitting device, for example, a sealing transparent resin is filled in a recess of a substrate on which an LED element is mounted, and then a short wavelength transmission filter is laminated thereon, and further, By injecting a resin composition having a phosphor dispersed thereon, a long wavelength transmission filter is laminated on the resin composition.

By the way, the resin composition in which the phosphor is dispersed is prepared by preparing a plurality of devices at a time and then injecting a predetermined amount into the recess of each substrate. The dispersion state of the phosphor in the resin composition Changes with time, so even with a light emitting device of the same specification, the color of the emitted color and the illuminance will vary slightly from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, and this also causes variations in the emission color and illuminance of the light emitting device as the final product. Furthermore, there are variations in the transmission wavelength of short wavelength transmission filters and long wavelength transmission filters. However, for example, when the obtained light-emitting device is used as a light source for an inspection device, the reliability of the inspection result is impaired if there is even such a small variation.

For this reason, the light emitting device, which is the final product in the past, is inspected for the color and illuminance of the emitted color, and those that deviate from the allowable range are excluded.

The present invention has been made in view of such problems, and can efficiently convert ultraviolet rays and short-wavelength visible light into long-wavelength visible light, and can efficiently extract the converted visible light. In addition, a light emitting device excellent in moisture resistance and heat dissipation and a manufacturing method thereof, in particular, easy to analyze, classify and manage the wavelength conversion member, easily control the emission color and illuminance of the light emitting device, and improve the yield. Providing a high light emitting device and a method for manufacturing the same is a main intended issue.

That is, the manufacturing method of the light-emitting device according to the present invention includes a substrate having a recess opening in an upper end surface, an LED element that emits ultraviolet light or short-wavelength visible light mounted in the recess of the substrate, and the LED element. A wavelength containing a lower light-transmitting plate-like body that transmits emitted ultraviolet light or short-wavelength visible light, and a phosphor that is excited by ultraviolet light or short-wavelength visible light transmitted through the lower light-transmitting plate-like body A conversion member, and an upper light-transmitting plate-like body that transmits part or all of the light that has passed through the wavelength conversion member, and the base includes an upper base that holds the wavelength conversion member, and A method of manufacturing a light emitting device comprising a lower base on which an LED element is mounted, a mounting step for mounting the LED element on the lower base, and a wavelength conversion member holding step for holding the wavelength conversion member on the upper base When Characterized in that it comprises a lower substrate in which the LED elements are mounted, and an assembly step of the wavelength converting member coalesces with the upper substrate held, the.

In addition, a light emitting device according to the present invention is emitted from a base having a recess opening in an upper end surface, an LED element emitting ultraviolet light or short wavelength visible light mounted in the recess of the base, and the LED element. A wavelength conversion member containing a lower light-transmitting plate-like body that transmits visible ultraviolet rays or short-wavelength visible light, and a phosphor that is excited by ultraviolet light or short-wavelength visible light that has passed through the lower light-transmitting plate-like body And an upper translucent plate-like body that transmits part or all of the light that has passed through the wavelength conversion member, wherein the base body holds the wavelength conversion member, and the LED element. And a lower substrate on which is mounted.

In such a case, the base body is divided into upper and lower parts, and the upper base body on which the wavelength conversion member is held and the lower base body on which the LED element is mounted are manufactured separately, and then the lower base body and the upper base body are separated. For example, after analyzing the emission color, illuminance, etc. of the wavelength conversion member using a reference light source, and classifying and managing the wavelength conversion member according to the result, it has the desired emission color, illuminance, etc. Since it is possible to select one and combine it with a suitable LED element, it becomes easy to manufacture a light-emitting device having a desired performance. For this reason, it becomes possible to suppress variations in the emission color, illuminance, and the like of the light emitting device that is the final product as much as possible.

At this time, if the wavelength conversion member is sandwiched between the lower light-transmitting plate and the upper light-transmitting plate, the wavelength conversion member including the phosphor is protected from moisture, and the wavelength conversion member is deteriorated. Since it can suppress, the long-term preservation | save of the wavelength conversion member is also attained.

In addition, since the base is divided into upper and lower parts, an insulating material is used for the lower base on which the LED element is mounted. On the other hand, since the upper base does not require insulation, a metal having high thermal conductivity can be used. . As a result, the heat generated from the wavelength conversion member can be efficiently conducted to the upper substrate to enhance the heat dissipation effect.

At this time, in order to efficiently dissipate the heat generated from the wavelength conversion member, the thermal conductivity of a sapphire plate, a crystal plate, a glass plate, etc., as a lower translucent plate or upper translucent plate It is preferable to use one having a power of 0.5 W / (m · K) or more. Alternatively, when using plastics or other materials with low thermal conductivity, deposit metal or metal compounds with excellent thermal conductivity, such as copper or aluminum, on the surface with gaps in the form of lines or grids. Thereby, thermal conductivity can be improved, ensuring translucency.

Further, in the present invention, since the lower light transmitting plate-like body and the upper light transmitting plate-like body seal the inside of the concave portion, it is possible to suppress the intrusion of gas and moisture into the concave portion, Even if a reflector made of a metal thin film is formed on the inner surface of the recess, the metal thin film can be prevented from being corroded by oxidation, sulfidation, chloride, or the like.

The upper base is a cylindrical body, and an annular protrusion is formed on the inner peripheral surface thereof, and the lower translucent plate-like body and the upper translucent plate-like body are formed, It is preferable that the protruding portion is provided, and the wavelength conversion member is provided between the lower light transmitting plate-like body and the upper light transmitting plate-like body. In this way, by controlling the thickness of the wavelength conversion member by forming the wavelength conversion member between the lower translucent plate-like body provided across the protrusion and the upper translucent plate-like body. As a result, it becomes possible to reduce variations in the emission color and illuminance of the wavelength conversion member.

In addition, by forming the wavelength conversion member between the lower light-transmitting plate-like body and the upper light-transmitting plate-like body provided with the protrusions interposed therebetween, the thickness of the wavelength conversion member can be controlled well. For this reason, it is possible to suppress uneven color of the emission color of the light emitting device.

Furthermore, by forming a wavelength conversion member between the lower translucent plate-like body and the upper translucent plate-like body that are provided with the protrusions interposed therebetween, the LED element and the phosphor (wavelength conversion member) Can be managed with good reproducibility. Then, the LED element and the phosphor (wavelength conversion member) are adjusted so that the light extraction efficiency from the LED element and the influence of the heat received by the phosphor are in an optimal balance by adjusting the formation position of the protrusion. It is also possible to control the distance to.

In the wavelength conversion member holding step, for example, the lower translucent plate-like body or the upper translucent plate-like body is placed in the upper base body so as to be in contact with the lower end surface or the upper end surface of the protruding portion. After the arrangement, the wavelength conversion member can be formed by depositing a resin composition containing a phosphor on the plate-like body. At this time, the amount of the resin composition can be easily managed by depositing the resin composition by potting.

Next, before the resin composition is cured, the lower light-transmitting plate-like body and the wavelength conversion member are stacked on the upper light-transmitting plate-like body or the lower light-transmitting plate-like body. And the upper substrate that holds the upper light-transmitting plate-like body can be produced.

Meanwhile, the LED element mounted on the lower base is preferably sealed with a transparent resin such as a silicone resin. By sealing in this way, the light extraction efficiency from the LED element to the sealing member can be improved.

Next, before the transparent resin is cured, the upper base that holds the lower translucent plate, the wavelength conversion member, and the upper translucent plate on the lower base, By installing the lower light-transmitting plate-like body so as to face the transparent resin side, the upper substrate and the lower substrate can be integrated to form a light emitting device.

At this time, it is preferable that the transparent resin is also attached to the surface of the lower light-transmitting plate-like body on the side facing the transparent resin. By doing in this way, it can prevent that a bubble remains in the sealing member formed by hardening transparent resin.

Further, depending on the structure of the substrate, before the transparent resin is cured, the lower light transmitting plate-like body is stacked thereon, and then the transparent resin is further attached on the lower light transmitting plate-like body. Before the transparent resin is cured, the upper base body holding the wavelength conversion member and the upper light-transmitting plate-like body thereon is faced, and the wavelength conversion member faces the lower light-transmitting plate-like body side. You may make it install so.

In addition, it may replace with the said protrusion and may provide the spacer between the said lower translucent plate-like body and the said upper translucent plate-like body.

In addition, a truncated conical space that expands toward the light emitting direction is formed in the upper base body, and the lower light-transmitting plate is disposed on the light emitting direction side of the truncated conical space. A cylindrical body, the wavelength conversion member, and the upper translucent plate-shaped body may be provided.

When using a base having such a structure, the upper base holding the lower translucent plate, the wavelength conversion member, and the upper translucent plate is used as the upper translucent plate. Is inverted so that it is located on the lower side, and the truncated conical space is filled with a transparent resin, and then the lower base is placed on the upper base before the transparent resin is cured. You may do it.

As the LED element, for example, those having a radiation peak at 490 nm or less are preferably used, and more preferably those having a radiation peak in the near ultraviolet region of 360 to 430 nm.

Further, as the upper light-transmitting plate-like body, it is preferable to use a long-wavelength transmission filter that transmits long-wavelength visible light and reflects ultraviolet light or short-wavelength visible light. In addition, the lower light-transmitting plate is used. As the plate-like body, it is preferable to use a short wavelength transmission filter which transmits ultraviolet rays or short wavelength visible rays and reflects longer wavelength visible rays. By using a long-wavelength transmission filter as the upper translucent plate-like body, ultraviolet rays and short-wavelength visible light are reflected to the wavelength conversion member side, improving the conversion efficiency into long-wavelength visible light, and harmful In addition, since the near-ultraviolet light is cut and the dielectric multilayer film of the long wavelength transmission filter also functions as an antireflection coating, visible light having a long wavelength can be efficiently led out of the apparatus. On the other hand, by using a short wavelength transmission filter as the lower light transmitting plate-like body, the visible light having a longer wavelength converted by the phosphor is reflected toward the wavelength conversion member, and the visible light is efficiently removed from the apparatus. Can be taken out.

As the short wavelength transmission filter or the long wavelength transmission filter, for example, the boundary where the level of the reflectance and transmittance of the electromagnetic wave is reversed is 10 nm or more larger than the emission peak wavelength of the LED element and 500 nm or less. Those having a dielectric multilayer film in a region are preferably used, and more preferably a dielectric multilayer film having a boundary in a wavelength region of 440 nm or less. Here, the dielectric multilayer film is formed by selecting and laminating two or more films having different refractive indexes from a thin film made of a highly transparent substance among dielectrics such as metal oxides, It also has excellent thermal conductivity. By using a short wavelength transmission filter or a long wavelength transmission filter with a dielectric multilayer film having excellent thermal conductivity, heat generated from the LED element or phosphor can be efficiently transmitted to the substrate. It can be emitted to the outside of the apparatus, and it is possible to more effectively prevent thermal deterioration of the phosphor and reduction in luminous efficiency and luminance.

According to the present invention having such a configuration, the wavelength conversion member and the like can be easily classified and managed, the light emission color and illuminance of the light emitting device can be easily controlled, and the light emitting device can be manufactured with a high yield. In addition, since the upper substrate does not require insulation, a metal having high thermal conductivity can be used as a material constituting the upper substrate, and as a result, heat generated from the wavelength conversion member is efficiently conducted to the upper substrate. Thus, the heat dissipation action can be enhanced. Furthermore, according to the present invention, it is possible to prevent corrosion and deterioration of the reflector made of a metal thin film formed on the inner surface of the recess of the substrate.

FIG. 1 is a longitudinal sectional view of a light emitting device according to a first embodiment of the present invention. FIG. 2 is a plan view of the light emitting device according to the embodiment. FIG. 3 is a graph showing an outline of transmittance and reflectance of the short wavelength transmission filter in the same embodiment. FIG. 4 is a graph showing an outline of transmittance and reflectance of the long wavelength transmission filter in the same embodiment. FIG. 5 is a diagram showing manufacturing steps (a) to (d) of the light emitting device according to the embodiment. FIG. 6 is a diagram showing manufacturing steps (e) to (f) of the light emitting device according to the embodiment. FIG. 7 is a diagram showing manufacturing steps (g) to (h) of the light emitting device according to the embodiment. FIG. 8 is a longitudinal sectional view of a light emitting device according to another embodiment. FIG. 9 is a longitudinal sectional view of a light emitting device according to another embodiment. FIG. 10 is a longitudinal sectional view of a light emitting device according to the second embodiment of the present invention. FIG. 11 is a diagram showing manufacturing steps (a) to (d) of the light emitting device according to the embodiment. FIG. 12 is a diagram showing manufacturing steps (e) to (f) of the light emitting device according to the embodiment. FIG. 13 is a diagram showing manufacturing steps (g) to (h) of the light emitting device according to the embodiment. FIG. 14 is a longitudinal sectional view of a light emitting device according to a third embodiment of the present invention. FIG. 15 is a diagram showing manufacturing steps (a) to (c) of the light emitting device according to the embodiment. FIG. 16 is a diagram showing manufacturing steps (d) to (e) of the light emitting device according to the embodiment. FIG. 17 is a diagram showing manufacturing steps (f) to (g) of the light emitting device according to the embodiment. FIG. 18 is a diagram showing manufacturing steps (h) to (i) of the light emitting device according to the embodiment. FIG. 19 is a diagram showing manufacturing steps (j) to (k) of the light emitting device according to the embodiment. FIG. 20 is a longitudinal sectional view of a light emitting device according to another embodiment. FIG. 21 is a diagram showing manufacturing steps (a) to (b) of the light emitting device according to the embodiment. FIG. 22 is a diagram showing manufacturing steps (c) to (d) of the light emitting device according to the embodiment. FIG. 23 is a longitudinal sectional view of a light emitting device according to another embodiment. FIG. 24 is a plan view of a light emitting device according to another embodiment. FIG. 25 is a side view of the light emitting device according to the embodiment. 26 is an AA ′ line longitudinal sectional view (a) and a BB ′ line longitudinal sectional view (b) of the light emitting device according to the embodiment. FIG. 27 is a plan view of a light emitting device according to another embodiment. FIG. 28 is a side view of the light emitting device according to the embodiment viewed from the A direction. FIG. 29 is a graph showing an outline of transmittance and reflectance of a long wavelength transmission filter according to another embodiment. FIG. 30 is a view showing a wavelength conversion member before cutting in another embodiment. FIG. 31 is a schematic longitudinal sectional view of a wavelength conversion member before cutting in another embodiment.

DESCRIPTION OF SYMBOLS 2 ... Base | substrate 2a ... Lower base | substrate 2b ... Upper base | substrate 3 ... LED element 5 ... Short wavelength transmission filter 6 ... Wavelength conversion member 7 ... Long wavelength transmission filter

<First Embodiment>
A light emitting device according to a first embodiment of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, the light emitting device 1 according to the present embodiment includes a base body 2 having a recess 22 that opens to an upper end surface 21, an LED element 3 mounted on a bottom surface 221 of the recess 22, and an LED A sealing member 4 that seals the element 3, and a short wavelength transmission filter 5, a wavelength conversion member 6, and a long wavelength transmission filter 7 that are sequentially provided on the sealing member 4 from the sealing member 4 side. It is a thing.

Each part is described in detail below.
The base body 2 is composed of a flat lower base body 2a and a cylindrical upper base body 2b. By placing the upper base body 2b on the lower base body 2a, a concave portion 22 opened on the upper end surface 21 is formed. Is. The lower base 2a is made of an insulating material having a high thermal conductivity such as ceramics such as alumina or aluminum nitride, and the upper base 2b is made of a metal having a high thermal conductivity such as copper or aluminum. Is.

The lower base 2a is for mounting an LED element 3 to be described later on its upper surface 221 (the bottom surface 221 of the recess 22). For example, silver for electrically connecting the LED element 3 to the upper surface 221 is used. A wiring conductor (not shown) made of a pattern or the like is formed. This wiring conductor is led to the outer surface of the light emitting device 1 through a wiring layer (not shown) formed inside the base 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit board are connected. Are electrically connected.

The upper base 2b is formed with an annular protrusion 23 on the inner peripheral surface 222, and the short wavelength transmission filter 5 and the long wavelength transmission filter 7 are provided with the protrusion 23 interposed therebetween. A wavelength conversion member 6 is formed between the transmission filter 5 and the long wavelength transmission filter 7.

Then, the short wavelength transmission filter 5 is disposed so as to be in close contact with the lower end surface of the protrusion 23 and the inner peripheral surface 222 of the upper base 2b, and the long wavelength transmission filter 7 is provided with the upper end surface of the protrusion 23 and the upper base. The short wavelength transmission filter 5 and the long wavelength transmission filter 7 are positioned in both the axial direction and the axis orthogonal direction with respect to the upper base 2b by being disposed so as to be in close contact with the inner peripheral surface 222 of 2b. It is configured.

The height of the upper base 2b and the formation position of the ridge 23 are determined when the short wavelength transmission filter 5 is disposed in close contact with the lower end surface of the ridge 23 and the inner peripheral surface 222 of the upper base 2b. The concave portion surrounded by the lower surface of the short wavelength transmission filter 5 and the inner peripheral surface 222 of the upper substrate 2b is set. Then, when the upper base 2b holding the wavelength conversion member 6 together with the short wavelength transmission filter 5 and the long wavelength transmission filter 7 is installed on the lower base 2a on which the LED element 3 is mounted, the concave portion becomes the upper surface of the lower base 2a. A closed space is formed, and the sealing member 4 is formed in the space. On the other hand, when the long wavelength transmission filter 7 is disposed so as to be in close contact with the upper end surface of the ridge 23 and the inner peripheral surface 222 of the upper base 2b, in this embodiment, the upper end surface and the upper portion of the long wavelength transmission filter 7 are arranged. A continuous plane constituting the upper surface of the light emitting device 1 is formed from the upper end surface 21 of the base 2b. Thus, the protrusion part 23 functions as a spacer.

The inner peripheral surface 222 of the upper base 2b (the side 222 of the recess 22 of the base 2) and the upper surface 221 of the lower base 2a (the bottom 221 of the recess 22 of the base 2) are subjected to metal plating such as silver, aluminum, and gold. As a result, a highly reflective metal thin film is formed and functions as a reflector (reflection film). Then, the ultraviolet light or the short wavelength visible light reflected downward by the long wavelength transmission filter 7 described later and transmitted through the wavelength conversion member 6 and the short wavelength transmission filter 5 is again transmitted to the wavelength conversion member 6 by the metal thin film. It can be reflected toward.

Note that, for example, silicone resin or the like constituting the sealing member 4 or the wavelength conversion member 6 has a high gas permeability. However, in this embodiment, the short wavelength transmission filter 5 and the long wavelength transmission filter 7 are formed by the gas into the recess 22. Since the intrusion of moisture can be suppressed, corrosion due to oxidation, sulfidation, chlorination, etc. of the metal thin film formed on the inner surface of the recess 22 can be prevented.

The LED element 3 emits ultraviolet rays or visible light having a short wavelength, and for example, those emitting near ultraviolet rays or violet light having a radiation peak at 360 to 430 nm are preferably used. For example, the LED element 3 is formed by laminating a gallium nitride-based compound semiconductor in the order of an n-type layer, a light-emitting layer, and a p-type layer on a sapphire substrate or a gallium nitride substrate.

The LED element 3 is flip-chip mounted on the bottom surface 221 of the concave portion 22 using solder bumps, gold bumps (not shown) with the gallium nitride compound semiconductor facing down (the bottom surface 221 side of the concave portion 22). The LED element 3 may be connected to a wiring conductor provided on the base 2 using wire bonding. In the present embodiment, a plurality (9) of LED elements 3 are mounted. However, the number of LED elements 3 is not limited to this, and can be appropriately changed according to the purpose and application.

The sealing member 4 seals the LED element 3 therein. In order to efficiently extract light from the LED element 3 to the sealing member 4, the sealing member 4 has excellent translucency and heat resistance. 3 is preferably made of a transparent resin such as a silicone resin having a small difference in refractive index with respect to 3.

The short wavelength transmission filter 5 is a low-pass filter that reflects long wavelength visible light and selectively transmits ultraviolet light or short wavelength visible light, and is provided on the sealing member 4. As such a short wavelength transmission filter 5, for example, as shown in FIG. 3, a filter having a dielectric multilayer film in which the light transmittance and the reflectance are reversed with the vicinity of 430 nm as a boundary can be used. . Such a dielectric multilayer film is formed by attaching a film material to a substrate made of glass, quartz, sapphire, or the like. The short wavelength transmission filter 5 may be arranged such that the surface on either side is in contact with the wavelength conversion member 6. For example, the surface on which the dielectric multilayer film is formed is in contact with the wavelength conversion member 6. In this case, the heat generated from the LED element 3 and the phosphor 61 can be efficiently transmitted to the substrate 2 to be emitted to the outside of the light emitting device 1, and long wavelength visible light is converted into the wavelength with the short wavelength transmission filter 5. The light can be efficiently reflected at the interface with the member 6 and led out of the light emitting device 1. On the other hand, from the viewpoint of heat dissipation, when the substrate of the dielectric multilayer film is made of a material having excellent thermal conductivity such as crystal or sapphire, the substrate side surface (the surface on which the dielectric multilayer film is not formed) Even if it is in contact with the wavelength conversion member 6, the heat generated from the LED element 3 and the phosphor 61 can be efficiently transmitted to the base 2 and released to the outside of the light emitting device 1. Moreover, even when the substrate of the dielectric multilayer film is made of glass, for example, by depositing a metal having excellent thermal conductivity such as copper or aluminum on the surface of the glass substrate in a line shape or a lattice shape, Thermal conductivity can be improved while ensuring translucency.

The wavelength conversion member 6 contains a phosphor 61 inside and is provided on the short wavelength transmission filter 5. As such a wavelength conversion member 6, for example, a phosphor 61 is provided in a matrix made of a silicone resin, a fluororesin, a low-melting glass, or the like that is excellent in translucency and heat resistance and has a small refractive index difference from the sealing member 4. Are dispersed.

The phosphor 61 contained in the wavelength conversion member 6 is not particularly limited, and examples thereof include a red phosphor, a green phosphor, a blue phosphor, and a yellow phosphor. Among these, when the red phosphor, the green phosphor, and the blue phosphor are used in combination, the light emitting device 1 that emits white light can be configured.

The long wavelength transmission filter 7 is a high-pass filter that reflects ultraviolet rays or short wavelength visible light and selectively transmits long wavelength visible light, and is provided on the wavelength conversion member 6. As such a long-wavelength transmission filter 7, for example, as shown in FIG. 4, a filter provided with a dielectric multilayer film in which the reflectance and transmittance of light are reversed at the vicinity of 430 nm can be used. . Such a dielectric multilayer film is formed by attaching a film material to a substrate made of glass, quartz, sapphire, or the like. The long wavelength transmission filter 7 may be disposed so that either side of the long-wavelength transmission filter 7 is in contact with the wavelength conversion member 6. For example, the substrate side surface (the surface on which the dielectric multilayer film is not formed) By disposing the long wavelength transmission filter 7 so as to be in contact with the wavelength conversion member 6, the dielectric multilayer film of the long wavelength transmission filter 7 also functions as an antireflection coating. Can be derived. In this case, if the substrate of the dielectric multilayer film is made of a material having excellent thermal conductivity such as crystal or sapphire, the heat generated from the LED element 3 and the phosphor 61 is efficiently transmitted to the base 2. Then, it can be emitted out of the light emitting device 1. Further, as described above, even when the substrate of the dielectric multilayer film is made of glass, for example, a metal having excellent thermal conductivity such as copper or aluminum is formed on the surface of the glass substrate in a line shape or a lattice shape. By evaporating, thermal conductivity can be improved while ensuring translucency. However, for example, when attention is paid to the heat dissipation of the dielectric multilayer film, the surface on the side where the dielectric multilayer film is formed may be in contact with the wavelength conversion member 6.

In such a light emitting device 1, ultraviolet rays or short-wavelength visible rays that have passed through the wavelength conversion member 6 are reflected by the long-wavelength transmission filter 7 and travel through the wavelength conversion member 6 again. For this reason, since the probability that ultraviolet rays or short-wavelength visible light hits the phosphor 61 is improved, more ultraviolet rays or short-wavelength visible light is converted into long-wavelength visible light. The amount increases. Further, among the long-wavelength visible light emitted from the phosphor 61, the light traveling in the direction toward the bottom surface 221 of the recess 22 of the substrate 2 is reflected by the short-wavelength transmission filter 5 and the traveling direction is changed to change the long-wavelength transmission filter 7. Since it passes through the filter 7 and exits from the apparatus 1, the extraction efficiency of visible light having a long wavelength is improved. Therefore, according to the light emitting device 1, ultraviolet rays and short-wavelength visible light can be efficiently converted into long-wavelength visible light, and the converted visible light can be efficiently taken out of the device 1.

Further, as described above, the long-wavelength visible light traveling backward toward the bottom surface 221 of the concave portion 22 of the base 2 is reflected by the short-wavelength transmission filter 5, so that the long-wavelength visible light reaching the inner surface of the concave portion 22 of the base 2 is visible. The number of light rays is reduced, the deterioration of the base 2 with time is suppressed, and the change in the emission color of the light emitting device 1 is also suppressed.

Next, a method for manufacturing the light emitting device 1 according to this embodiment will be described with reference to FIGS.

[Upper substrate]
In the upper base 2b, first, the long wavelength transmission filter 7 is disposed so as to be in close contact with the upper end surface (the lower end surface in FIG. 5) of the protrusion 23 and the inner peripheral surface 222 of the upper base 2b. Then, a predetermined amount of the phosphor-containing resin composition 6 is placed on the long wavelength transmission filter 7 by potting (FIGS. 5A to 5B). Next, before the resin composition 6 is cured, the short wavelength transmission filter 5 is provided thereon (FIG. 5C). The long wavelength transmission filter 7 and the short wavelength transmission filter 5 are bonded and fixed to the upper substrate 2b together with the wavelength conversion member 6 by curing the resin composition 6 by heating or the like as necessary. Thereby, the wavelength conversion member 6 can be held on the upper base 2b while being sandwiched between the long wavelength transmission filter 7 and the short wavelength transmission filter 5 (FIG. 5D). At this time, the short wavelength transmission filter 5 is in close contact with the lower end surface (upper end surface in FIG. 5) of the protrusion 23 and the inner peripheral surface 222 of the upper base 2b. Note that the amount of the resin composition 6 placed on the long wavelength transmission filter 7 by potting is larger than the amount necessary to form the wavelength conversion member 6, and the resin composition 6 is combined with the long wavelength transmission filter 7 and the short wavelength. When sandwiched between the transmission filter 5, the resin composition 6 oozes out between the long wavelength transmission filter 7 and the short wavelength transmission filter 5 and the upper base 2 b, and the resin composition 6 is used as these adhesives. It is also preferable to function.

[Lower substrate]
On the other hand, in the lower base 2a, a transparent resin 4 is placed on the LED element 3 mounted on the lower base 2a by a predetermined amount of potting (FIGS. 6E to 6F). Note that the amount of the transparent resin 4 placed on the lower base 2a by potting is set larger than the amount necessary for forming the sealing member 4, and the upper base 2b is placed on the lower base 2a as described below. In addition, it is preferable that the transparent resin 4 also functions as an adhesive so that the transparent resin 4 oozes out between the lower base 2a and the upper base 2b.

[assembly]
Before the transparent resin 4 placed on the lower substrate 2a is cured, the upper substrate 2b in which the wavelength conversion member 6 is formed on the lower substrate 2a on which the LED element 3 is mounted with the wavelength transmission filter 5 side down. Is installed (FIG. 7G). At this time, it is preferable that the resin composition 6 protrudes from the lower surface of the short-wavelength transmission filter 5 or the transparent resin 4 adheres. In particular, as shown in FIG. Sealing formed by curing the transparent resin 4 by attaching the resin composition 6 or the transparent resin 4 to the corners of the recesses surrounded by the lower surface of the transmission filter 5 and the inner peripheral surface 222 of the upper base 2b. It is possible to prevent bubbles from remaining in the member 4.

As described above, when the upper base 2b in which the wavelength conversion member 6 is held together with the short wavelength transmission filter 5 and the long wavelength transmission filter 7 is installed on the lower base 2a on which the LED element 3 is mounted, the short wavelength transmission filter 5 A space is formed in which a recess surrounded by the lower surface and the inner peripheral surface 222 of the upper substrate 2b is closed by the upper surface of the lower substrate 2a, and the space is filled with the transparent resin 4. Finally, the transparent resin 4 is cured by heating or the like as necessary, whereby the sealing member 4 is formed in the space and the sealing member 4 bonds the lower base 2a and the upper base 2b. Thus, the light emitting device 1 that functions as an adhesive layer to be integrated with the lower base 2a and the upper base 2b can be obtained.

In such a manufacturing method according to this embodiment, the base body 2 is divided into upper and lower parts, and the upper base body 2b in which the wavelength conversion member 6 is held together with the short wavelength transmission filter 5 and the long wavelength transmission filter 7, and the LED element 3 are mounted. Since the lower base body 2a is manufactured separately and then the upper base body 2b is installed on the lower base body 2a to be integrated, for example, the upper base body 2b holding the wavelength conversion member 6 and the like is integrated. Analyze the emission color, illuminance, etc. using a reference light source that emits light having a predetermined wavelength (for example, near-ultraviolet light of 405 nm) and intensity, classify and manage according to the result, and then A light emitting color, illuminance, or the like can be selected and combined with a suitable LED element 3, and as a result, it becomes easy to manufacture the light emitting device 1 having the desired performance. For this reason, it becomes possible to suppress variations in the emission color, illuminance, and the like of the light emitting device 1 that is the final product as much as possible.

In this embodiment, since the wavelength conversion member unit in which the wavelength conversion member 6 is sandwiched between the short wavelength transmission filter 5 and the long wavelength transmission filter 7 is configured by using the upper base 2b, the phosphor is used. The included wavelength conversion member 6 can be protected from moisture and its deterioration can be suppressed, and the wavelength conversion member 6 (wavelength conversion member unit) can be stored for a long period of time.

Further, in the present embodiment, the wavelength conversion member 6 is formed between the short wavelength transmission filter 5 and the long wavelength transmission filter 7 provided with the protrusion 23 interposed therebetween, so that the thickness of the wavelength conversion member 6 is increased. Control is facilitated, and as a result, variations in the emission color, illuminance, and the like of the wavelength conversion member 6 can be reduced. At this time, the amount of the resin composition 6 can be easily managed by placing the resin composition 6 on the long wavelength transmission filter 7 by potting.

Further, in the present embodiment, the wavelength conversion member 6 is formed between the short-wavelength transmission filter 5 and the long-wavelength transmission filter 7 provided with the protruding portion 23 interposed therebetween, whereby the LED element 3 and the phosphor 61 ( It becomes possible to manage the distance to the wavelength conversion member 6) with good reproducibility. Then, the LED element 3 and the phosphor 61 are adjusted so that the light extraction efficiency from the LED element 3 and the influence of the heat received by the phosphor 61 are optimally balanced by adjusting the formation position of the protrusion 23. It is also possible to control the distance to the (wavelength conversion member 6).

In this embodiment, since the base 2 is divided into upper and lower parts, an insulating material is used for the lower base 2a on which the LED element 3 is mounted. On the other hand, the upper base 2b is not required to have an insulating property. A metal with a high rate can be used. As a result, heat generated from the wavelength conversion member 6 and the LED element 3 can be efficiently conducted to the upper base 2b to enhance the heat radiation effect.

In particular, in the present embodiment, since the peripheral edges of the short wavelength transmission filter 5 and the long wavelength transmission filter 7 are in contact with the inner peripheral surface 222 and the protrusions 23 of the upper base 2b, the

filters

5 and 7 are wavelength conversion members. 6 or the LED element 3 conducts heat to the upper base 2b to exert a heat radiation effect. For this reason, the change of the luminescent color of the light-emitting device 1 resulting from the thermal deterioration of the fluorescent substance 61 in the wavelength conversion member 6 can be suppressed favorably.

In particular, by using a dielectric multilayer film having excellent thermal conductivity as the short wavelength transmission filter 5 and the long wavelength transmission filter 7, heat generated from the LED element 3 and the wavelength conversion member 6 can be efficiently transmitted to the upper base 2b. It can be transmitted and emitted to the outside of the apparatus 1, and thermal deterioration of the phosphor 61 and reduction in luminous efficiency and luminance can be more effectively prevented.

In the present embodiment, as shown in FIG. 8, a spacer S provided as a separate body from the upper base 2 b may be provided instead of the ridge 23. The spacer S is made of a metal having high thermal conductivity such as copper or aluminum, and has a flat plate shape provided with a through hole for forming the wavelength conversion member 6.

Furthermore, as shown in FIG. 9, the short wavelength transmission filter 5 or the long wavelength transmission filter 7 is formed with a recess so that the spacer S is integrated with the short wavelength transmission filter 5 or the long wavelength transmission filter 7. The side peripheral wall surrounding the recess may function as the spacer S. In the embodiment shown in FIG. 9, the spacer S is integrated with the short wavelength transmission filter 5, but may be integrated with the long wavelength transmission filter 7.

Note that these modifications can also be applied to other embodiments described later.

Second Embodiment
Below, 2nd Embodiment of this invention is described with reference to drawings. In the following description, differences from the first embodiment will be mainly described, and description of the same points as in the first embodiment will be omitted.

In the light emitting device 1 according to the present embodiment, as shown in FIG. 10, the lower end surface of the upper substrate 2 b also serves as the lower end surface of the protrusion 23, and the upper substrate 2 b is a long wavelength transmission filter among the

filters

5 and 7. Only 7 is held. On the other hand, the lower base 2a has a recess opening at the upper end surface, and a step portion 24 is formed on a side surface 222 of the recess, and a peripheral portion thereof is placed on the upper end surface of the step portion 24. In this manner, a short wavelength transmission filter 5 is provided. The short wavelength transmission filter 5 is configured to be positioned both in the axial direction and in the axis orthogonal direction with respect to the lower base 2a by being in close contact with the upper end surface of the step portion 24 and the side surface 222 of the recess. .

First, as shown in FIGS. 11A to 11B, the concave portion of the lower base 2a is filled with a transparent resin 4 that is large enough to bulge from the upper end surface of the stepped portion 24. Thereafter, as shown in FIGS. 11C to 11D, the short wavelength transmission filter 5 is disposed so that the peripheral edge portion is placed on the upper end surface of the step portion 24. Then, the overflowing transparent resin 4 oozes out between the upper end surface of the step portion 24 and the lower surface of the short wavelength transmission filter 5, and the leached transparent resin 4 passes between the lower base 2 a and the short wavelength transmission filter 5. It functions as an adhesive that adheres.

Next, as shown in FIGS. 12E to 12F, the transparent resin 4 is placed on the upper surface of the short wavelength transmission filter 5 held by the lower substrate 2a, and then shown in FIGS. 13G to 13H. As described above, the upper substrate 2b on which the wavelength conversion member 6 is held together with the long wavelength transmission filter 7 is placed thereon. The transparent resin 4 functions as an adhesive that bonds the lower substrate 2a (wavelength conversion member 6) and the upper substrate 2b (short wavelength transmission filter 5), and thus the light emitting device 1 is configured. Note that if the wavelength conversion member 6 is formed by potting the resin composition 6 containing the phosphor 61, the amount of the resin composition 6 can be strictly controlled. A continuous plane can be formed from the lower end surface of 2b.

<Third Embodiment>
Below, 3rd Embodiment of this invention is described with reference to drawings. In the following, differences from the first and second embodiments will be mainly described, and description of the same points as those of the embodiments will be omitted.

In the light-emitting device 1 according to the present embodiment, as shown in FIG. 14, a truncated cone-shaped space that expands toward the light emission direction is provided at the lower portion of the recess 22, and the inside of the truncated cone-shaped space is provided. Is provided with a sealing member 4. On the truncated conical space, a short wavelength transmission filter 5, a wavelength conversion member 6, and a long wavelength transmission filter 7 are arranged in order from the bottom, and the short wavelength transmission filter 5 and the long wavelength transmission filter 7 are A spacer S is provided so that a continuous surface that is substantially flush with the tapered surface of the recess 22 is formed therebetween. The spacer S is a flat plate provided with a truncated conical through-hole that expands toward the light emission direction.

The tapered surface of the truncated conical space is provided with a metal thin film, while the spacer S is made of aluminum, white resin, or the like, and both have a substantially continuous inclined surface extending from the bottom of the recess 22 to the vicinity of the opening. By forming, the inclined surface functions as a reflector.

First, the short wavelength transmission filter 5 is disposed on the upper end surface of the step formed on the inner surface above the tapered surface of the upper base 2b, and the spacer S is disposed thereon (FIG. 15 (a) to FIG. 15). (C)).

Next, a predetermined amount of the resin composition 6 containing a phosphor is filled in the through holes of the spacers S (FIGS. 16D to 16E). Further, by providing the long wavelength transmission filter 7 from above (FIG. 17 (f)), the light emitting side of the upper base 2b is disposed by the wavelength conversion member 6 sandwiched between the long wavelength transmission filter 7 and the short wavelength transmission filter 5. The opening is covered (FIG. 17 (g)).

Next, after the upper substrate 2b is inverted so that the long wavelength transmission filter 7 is on the lower side, the transparent resin 4 is filled in the truncated conical space (FIGS. 18 (h) to (i)). Thereafter, the lower base 2a on which the LED element 3 is mounted is placed on the upper base 2b so as to face the lower side of the LED element 3 (FIG. 19 (j)). In this way, the light emitting device 1 in which the lower base 2a and the upper base 2b are integrated can be obtained (FIG. 19 (k)).

In this way, the upper base 2b is inverted so that the long wavelength transmission filter 7 is on the lower side, and then the sealing resin 4 and the short wavelength transmission filter 5 are filled with the transparent resin 4 in the truncated conical space. It is possible to prevent bubbles from remaining between.

The present invention is not limited to the above embodiment.

For example, as shown in FIG. 20, the light emitting device 1 according to the present invention is different from the second embodiment in that a step for fitting the short wavelength transmission filter 5 in a recess opening in the upper end surface of the lower base 2a. The part 24 may not be formed.

In order to manufacture the light emitting device 1 of such an embodiment, first, as shown in FIGS. 21 (a) to 21 (b), it is transparent so as to bulge from the upper end surface of the concave portion of the lower base 2a. Resin 4 is filled. Thereafter, as shown in FIGS. 22C to 22D, the upper base 2b holding the wavelength conversion member 6 together with the short wavelength transmission filter 5 and the long wavelength transmission filter 7 is installed on the lower base 2a. In this case, the overflowing transparent resin 4 oozes out between the upper end surface of the lower base 2a and the lower end surface of the upper base 2b. The leached transparent resin 4 flows into the lower base 2a and the upper base 2b. Functions as an adhesive.

Further, as shown in FIG. 23, the upper base 2b may be composed only of an annular body constituting the protruding portion 23.

Furthermore, as shown in FIGS. 24 to 26, the upper base 2b may be provided with a groove 24 opened on its upper surface, and the lower base 2a is provided with a groove 25 opened on its side face. Also good. By providing

such grooves

24 and 25, the resin composition 6 that is filled in a large amount flows into the groove 24 while extruding the air inside, and the transparent resin 4 that is filled up in the groove 25 a lot. Since the air flows in while pushing out the air inside, the formation of bubbles in the wavelength conversion member 6 and the sealing member 4 can be prevented. In addition, in the embodiment shown in FIGS. 24 to 26, the space surrounded by the lower surface of the short wavelength transmission filter 5, the inner peripheral surface 222 of the upper base 2b, and the concave bottom surface 221 of the lower base 2a is directed downward. A reflecting member 8 made of an annular body in which a truncated conical through-hole having a reduced diameter is formed is disposed. On the surface of the through hole of the reflecting member 8, a metal thin film having a high reflectivity is formed by applying metal plating such as silver, aluminum, and gold, and functions as a reflector (reflection film). . A gap is formed between the upper surface of the reflecting member 8 and the lower surface of the short wavelength transmission filter 5, and excess transparent resin 4 is configured to flow into the groove 25 through the gap.

Specific examples in which the embodiment is applied to the light emitting device 1 for a light bulb type LED are shown in FIGS. The light-emitting device 1 shown in FIGS. 27 and 28 has a substantially circular shape in plan view, and 120 LED elements are mounted thereon.

The long wavelength transmission filter 7 is not limited to the one having the optical characteristics as shown in FIG. 4 as long as the reflectance and transmittance of the electromagnetic wave are reversed around 430 nm, as shown in FIG. It may have good optical characteristics and transmit some ultraviolet rays or visible light having a short wavelength. In such a case, when it is necessary to exhibit color rendering properties by violet light, or when it is necessary to improve the heat dissipation characteristics, ultraviolet rays or short rays reflected by the long wavelength transmission filter 7 and absorbed by the base 2 are used. This is effective when it is necessary to reduce visible light having a wavelength and suppress deterioration of the substrate 2.

In order to form the wavelength conversion member 6, as shown in FIG. 30, a plurality of wavelength conversions are performed on a large filter B having a size corresponding to a plurality of short wavelength transmission filters 5 or a long wavelength transmission filter 7. The resin composition 6 containing the phosphor 61 is printed using an ink jet printer or the like so that the member 6 is formed in a lump, and the resin composition 6 is cured, so that a plurality of wavelength conversion members 6 are formed. May be formed at a time and then the large filter B may be cut.

Further, when the resin composition 6 containing the phosphor 61 is printed on the large filter B, the resin composition 6B containing the blue phosphor, the resin composition 6G containing the green phosphor, and the red fluorescence. The resin composition 6R containing the body may be printed separately in this order. By printing in this way, the wavelength conversion member 6 having a three-layer structure can be formed as shown in FIG. The layers containing the red phosphor 61R, the green phosphor 61G, and the blue phosphor 61B are respectively the red phosphor-containing layer 6R, the green phosphor-containing layer 6G, and the blue phosphor-containing layer 6B from the LED element 3 side. When the layers are sequentially stacked, the blue light emitted from the blue phosphor 61B and the green light emitted from the green phosphor 61G are not absorbed by the other phosphors 61. Therefore, the energy conversion efficiency and the light extraction efficiency are reduced. Can be improved.

In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.

Claims

A base body having a recess opening in the upper end surface;
An LED element that emits ultraviolet or short-wavelength visible light mounted in the recess of the substrate;
A lower translucent plate-like body that transmits ultraviolet light or short-wavelength visible light emitted from the LED element;
A wavelength conversion member containing a phosphor that is excited by ultraviolet rays or short-wavelength visible light transmitted through the lower light-transmitting plate-like body;
An upper translucent plate that transmits part or all of the light that has passed through the wavelength conversion member, and
The base is a method of manufacturing a light emitting device comprising an upper base holding the wavelength conversion member and a lower base on which the LED element is mounted,
A mounting step of mounting the LED element on the lower substrate;
A wavelength conversion member holding step for holding the wavelength conversion member on the upper substrate;
A method of manufacturing a light-emitting device, comprising: an assembly step of combining the lower base on which the LED element is mounted and the upper base on which the wavelength conversion member is held.
The upper base is a cylindrical body, and an annular protrusion is formed on the inner peripheral surface thereof, and the lower translucent plate-shaped body and the upper translucent plate-shaped body are It is provided across the ridge,
The method for manufacturing a light-emitting device according to claim 1, wherein the wavelength conversion member is provided between the lower light-transmitting plate-like body and the upper light-transmitting plate-like body.
In the wavelength converting member holding step, the lower translucent plate-like body or the upper translucent plate-like body is disposed in the upper base so as to be in contact with the lower end surface or the upper end surface of the protruding portion. The method for producing a light-emitting device according to claim 1, wherein the step is a step of depositing a resin composition containing a phosphor on the plate-like body.
4. The method for manufacturing a light emitting device according to claim 3, wherein the step of depositing the resin composition is by potting.
4. The method for manufacturing a light emitting device according to claim 3, wherein the upper light transmitting plate-like body or the lower light transmitting plate-like body is stacked thereon before the resin composition is cured.
The manufacturing method of the light-emitting device according to claim 1, further comprising a sealing step of sealing the LED element mounted on the lower base with a transparent resin.
The upper substrate in which the assembling step holds the lower light transmitting plate, the wavelength conversion member, and the upper light transmitting plate on the lower substrate before the transparent resin is cured. The manufacturing method of the light-emitting device according to claim 6, wherein the lower translucent plate-like body is installed so that the transparent resin side faces the transparent resin side.
The light-emitting device according to claim 7, wherein the upper base is placed on the transparent resin after the transparent resin is attached to a surface of the lower light-transmitting plate-like body facing the transparent resin. Method.
The sealing step is a step of stacking the lower light transmitting plate-like body thereon before the transparent resin is cured,
In the assembly step, the transparent resin is further attached on the lower light-transmitting plate-like body stacked on the transparent resin, and before the transparent resin is cured, the wavelength conversion member and the The manufacturing method of the light-emitting device of Claim 6 which installs the said upper base | substrate holding an upper translucent plate-shaped body so that the said wavelength conversion member may face the said lower translucent plate-shaped body side.
The method for manufacturing a light-emitting device according to claim 1, wherein a spacer is provided between the lower light-transmitting plate-like body and the upper light-transmitting plate-like body.
A frustoconical space that expands toward the light emission direction is formed in the upper base body,
2. The light emitting device according to claim 1, wherein the lower light transmitting plate-like body, the wavelength conversion member, and the upper light transmitting plate-like body are provided on a light emission direction side of the truncated conical space. Manufacturing method.
The upper base holding the lower translucent plate, the wavelength conversion member, and the upper translucent plate is inverted so that the upper translucent plate is positioned on the lower side. The method for manufacturing a light emitting device according to claim 11, further comprising a step of filling the truncated conical space with a transparent resin.
13. The method for manufacturing a light emitting device according to claim 12, wherein the assembling step is a step of placing the lower substrate on the upper substrate before the transparent resin is cured.
The method for manufacturing a light-emitting device according to claim 1, wherein the LED element has a radiation peak at 490 nm or less.
The lower translucent plate-like body is a short wavelength transmission filter that transmits ultraviolet light or short wavelength visible light and reflects longer wavelength visible light,
2. The method for manufacturing a light emitting device according to claim 1, wherein the upper light transmitting plate-like body is a long wavelength transmission filter that transmits visible light having a longer wavelength and reflects ultraviolet light or visible light having a shorter wavelength.
The short-wavelength transmission filter or the long-wavelength transmission filter has a boundary where the level of the reflectance and transmittance of electromagnetic waves is reversed in a wavelength region of 10 nm or more larger than the emission peak wavelength of the LED element and 500 nm or less. The method of manufacturing a light emitting device according to claim 11, comprising a dielectric multilayer film.
A base body having a recess opening in the upper end surface;
An LED element that emits ultraviolet or short-wavelength visible light mounted in the recess of the substrate;
A lower translucent plate-like body that transmits ultraviolet light or short-wavelength visible light emitted from the LED element;
A wavelength conversion member containing a phosphor that is excited by ultraviolet rays or short-wavelength visible light transmitted through the lower light-transmitting plate-like body;
An upper translucent plate that transmits part or all of the light that has passed through the wavelength conversion member, and
The light-emitting device, wherein the base body includes an upper base body that holds the wavelength conversion member and a lower base body on which the LED element is mounted.
The upper base is a cylindrical body, and an annular protrusion is formed on the inner peripheral surface thereof, and the lower translucent plate-shaped body and the upper translucent plate-shaped body are It is provided across the ridge,
The light emitting device according to claim 17, wherein the wavelength conversion member is provided between the lower light transmissive plate and the upper light transmissive plate.
The light-emitting device according to claim 17, wherein a spacer is provided between the lower translucent plate and the upper translucent plate.
The light-emitting device according to claim 17, wherein a truncated conical space is formed in the upper substrate so as to expand toward the light emission direction.
The light-emitting device according to claim 17, wherein the lower light-transmitting plate or the upper light-transmitting plate has a thermal conductivity of 0.5 W / (m · K) or more.
The light-emitting device according to claim 17, wherein the lower light-transmitting plate or the upper light-transmitting plate is formed by depositing a metal or a metal compound with a gap on the surface thereof.
The light-emitting device according to claim 17, wherein the LED element has a radiation peak at 490 nm or less.
The lower translucent plate-like body is a short wavelength transmission filter that transmits ultraviolet light or short wavelength visible light and reflects longer wavelength visible light,
18. The light emitting device according to claim 17, wherein the upper light transmitting plate-like body is a long wavelength transmission filter that transmits visible light having a longer wavelength and reflects ultraviolet light or short wavelength visible light.
The short-wavelength transmission filter or the long-wavelength transmission filter has a boundary where the level of the reflectance and transmittance of electromagnetic waves is reversed in a wavelength region of 10 nm or more larger than the emission peak wavelength of the LED element and 500 nm or less. 25. The light emitting device according to claim 24, comprising a dielectric multilayer film.