TWI711188B - Light-emitting diode assembly - Google Patents

Abstract

An LED assembly includes a substrate, an LED chips, a first electrode and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The LED chip and the first electrode are formed on the first surface. The second electrode is formed on the second surface. In a cross-sectional view, the first electrode and the second electrode have different length.

Description

Light-emitting diode assembly

The embodiment of the invention relates to a light emitting diode (LED) assembly and manufacturing method, and more particularly to an LED assembly that can provide a full-circumferential light field and related manufacturing methods.

At present, you can see the application of various LED products in life, such as traffic signs, motorcycle taillights, car headlights, street lights, computer indicator lights, flashlights, LED backlights, etc. In addition to the front-end chip manufacturing process, almost all of these products must go through the back-end packaging process.

The main function of the LED package is to provide the necessary electrical, optical, and thermal support for the LED chip. Semiconductor products such as LED chips, if exposed to the atmosphere for a long time, will be affected by moisture or environmental chemicals and deteriorate, resulting in degradation of characteristics. In LED packaging, epoxy resin is often used to encapsulate LED chips to effectively isolate the atmosphere. In addition, in order to achieve the goal of being brighter and more power-saving, the LED package also needs to have good heat dissipation and light extraction efficiency. If the heat generated when the LED chip emits light is not dissipated in time, the heat accumulated in the LED chip will adversely affect the characteristics, lifetime and reliability of the device. Optical design is also an important part of the LED packaging process. How to more effectively extract light, the angle and direction of light emission are the key points in the design.

In addition to thermal issues, the packaging technology of white LEDs also needs to consider issues such as color temperature, color rendering index, and phosphors. Moreover, if the white LED uses blue LED chips with yellow-green phosphors, the shorter the wavelength of blue light, the greater the damage to human eyes. Therefore, it is necessary to effectively block blue light in the package structure to avoid blue light leakage.

In order for LED products to be competitive in the market, how to make the LED packaging process stable, low-cost, and high-yield is also the goal pursued by LED packaging.

A light-emitting diode assembly includes: a substrate, a light-emitting diode chip, a first electrode, and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The light emitting diode chip and the first electrode are located on the first surface. The second electrode is formed on the second surface and is electrically connected to the first electrode. In a cross section, the first electrode and the second electrode have different lengths.

FIG. 1 is a perspective view of a light-emitting diode (LED) assembly 100 according to an embodiment of the invention. The LED assembly 100 includes a transparent substrate 106, which in one embodiment is a non-conductive glass substrate. The transparent substrate 106 has an upper surface 102 and a lower surface 104 facing opposite directions. As shown in FIG. 1, the transparent substrate 106 is approximately a long strip with two terminals 114 and 116. In this specification, transparency is only used to mean that light can pass through, which may be completely transparent (translucent, or semitransparent). In another embodiment, the material of the transparent substrate 106 may be sapphire, silicon carbide, or diamond-like carbon.

Figure 2A shows a top view of the LED assembly 100a. Please also refer to Figure 1. On the upper surface 102, a number of blue LED chips 108 are fixed, and they are electrically connected to each other through a circuit formed by a bonding wire 110. Each blue LED chip 108 can be a single LED with a forward voltage of about 2~3V (hereinafter referred to as "low voltage chip"), or it can have several light-emitting diodes connected in series and the forward voltage is greater than low Voltage chips, such as 12V, 24V, 48V, etc. (hereinafter referred to as "high voltage chips"). Specifically, different from the wire bonding method, a high-voltage chip is formed by a semiconductor process on a common substrate to form several light-emitting diode units (ie, a light-emitting diode structure with at least a light-emitting layer) connected to each other. The common substrate may be a crystalline substrate or a non-crystalline substrate. In Figures 1 and 2A, the blue LED chips 108 are arranged in two rows along the two sides of the longitudinal axis connecting the two terminals 114 and 116 of the transparent substrate 106, and they are connected in series with each other by bonding wires 110. Above, it is equivalent to a light-emitting diode with high forward voltage. However, the present invention is not limited to this. In other embodiments, the blue LED chips 108 on the upper surface 102 can be arranged in any pattern, and the electrical connection with each other can be in series, in parallel, and mixed in series and parallel, Or the connection method of the bridge structure.

As shown in FIG. 2A, near the terminal 114, the transparent substrate 106 has a via 107. The via hole 107 has a via hole that penetrates the transparent substrate 106 and reaches the upper surface 102 and the lower surface 104 directly, and conductive material is formed therein to fill the via hole or only cover the inner wall of the via hole to form the via hole 107. The conductive material in the through hole can provide electrical connection between the two ends of the through hole 107. On the upper surface 102 near the terminal 114, a conductive electrode plate 118 is provided. The conductive electrode plate 118 does not directly contact the via 107, that is, it does not directly contact the conductive objects in the via. One of the blue LED chips 108 (denoted as 108a) near the terminal 114 is electrically connected to the conductive electrode plate 118 by a bonding wire 110. One of the blue LED chips 108 (denoted as 108b) near the terminal 114 is electrically connected to the via 107 by another bonding wire 110.

All the bonding wires 110 and the blue LED chip 108 on the upper surface 102 are covered by the transparent colloid 112 to prevent the possible aging and degradation of the bonding wires 110 and the blue LED chip 108 caused by moisture or chemicals in the atmosphere. damage. The main constituent of the transparent colloid 112 may be epoxy resin or silicone. The transparent colloid 112 contains at least one kind of phosphor, which can be excited by part of the blue light emitted by the blue LED chip 108 (for example, its peak value is 430nm-480nm) to generate yellow light (for example, its peak value is 570nm-590nm) ) Or yellow-green light (for example, its peak value is 540nm-570nm). When the yellow light or yellow-green light is properly mixed with the remaining blue light, the human eye will regard it as white light. Figure 1 is just a schematic diagram. In an example, the LED assembly 100 in Figure 1 may not be able to see the bonding wires 110 and the blue LED chip 108 under the transparent gel 112 because of the phosphor in the transparent gel 112 as shown in Figure 1.

Figure 2B shows a bottom view of the LED assembly 100a. As shown in FIG. 2B, no LED chip is provided on the lower surface 104. On the lower surface 104 close to the terminal 114, another conductive electrode plate 120 is provided, a part of which overlaps the through hole 107 and directly contacts the conductive object in the through hole to be electrically connected to each other. However, in another embodiment, the conductive electrode plate 120 may not be directly connected to the through hole 107, but to form an electrical connection with the through hole 107 through another conductor, such as a bonding wire 110. On the lower surface 104 close to the terminal 116, another conductive electrode plate 122 may be selectively provided. With such a design, the conductive electrode plate 122 and the conductive electrode plate 120 can be coplanar, so that the LED assembly 100a can be placed more firmly, and damage caused by falling over during transportation or processing can be avoided. In this embodiment, the conductive electrode plate 122 may be a floating connection on the circuit, and is not electrically connected to any electronic components, circuits, or other electrode plates in the LED assembly 100a, because its main purpose is to make the LED assembly 100a Place it smoothly.

As shown in the embodiment of FIGS. 2A and 2B, the boundary between the conductive electrode plates 120 and 118 is located within the lower surface 104 and the upper surface 102, that is, it does not substantially exceed the boundary between the lower surface 104 and the upper surface 102. The shape of the conductive electrode plates 120, 118, and 122 does not need to be approximately rectangular, and the size does not need to be approximately the same. In another embodiment, one of the conductive electrode plates 120 and 118 is approximately rectangular, and the other is approximately circular to facilitate identification of the positive and negative electrodes of the LED assembly 100a.

From an electrical point of view, the blue LED chip 108 and the via 107 are connected in series between the conductive electrode plates 120 and 118. The conductive electrode plates 120 and 118 can be used as two power input terminals of the LED assembly 100a. The positive power terminal and the negative power terminal of a driving power supply (not shown) may be electrically connected to the conductive electrode plates 120 and 118, respectively, to drive the blue LED chip 108 to emit light.

FIG. 3A shows a schematic cross-sectional view taken along AA of the LED assembly 100a in FIG. 2A; and FIG. 3B is a cross-sectional schematic view taken along BB of the LED assembly 100a in FIG. 2A.

Similar to the previous description, in Figure 3A, the blue LED chip 108b is electrically connected to the via hole 107 through a bonding wire 110, which is connected to the conductive electrode plate 120 on the lower surface 104; in Figure 3B, the blue LED The chip 108 a is electrically connected to the conductive electrode plate 118 on the upper surface 102 through another bonding wire 110. FIG. 4 shows that the LED assembly 100 is arranged in a bulb. The bulb includes a lampshade 180, the LED assembly 100, a circuit board 192, a heat dissipation mechanism 182, and an electrical connection mechanism 183 (for example, an Edison lamp holder). The terminal 114 of the LED assembly 100 is fixed on the circuit board 192; the circuit board 192 is connected to the heat dissipation mechanism 182 for separating the heat generated by the LED assembly 100 from the bulb; the electrical connection mechanism 183 is connected to the heat dissipation mechanism 182. Because the conductive electrode plates 120 and 118 used to drive the blue LED chip 108a are respectively located on the upper surface 102 and the lower surface 104 on the same terminal 114 side of the transparent substrate 106, a conductive body such as solder can be used to connect the conductive electrode plate 120 and 118 is soldered on a circuit board at the same time, as shown in Figure 5A. The solder 190 can not only provide the electrical connection of the driving power supply to make the LED assembly 100 emit light, but also provide mechanical support to the terminal 114, so that the LED assembly 100 can stand vertically on the circuit board 192 and emit light around the surrounding area. field. In FIG. 5A, the LED assembly 100 is only supported by the solder 190 and can stand on the circuit board 192 approximately vertically. The circuit board 192 also supplies power to the LED assembly 100 through the solder 190. FIG. 5B is a clip formed by a metal clip 194 that clamps the LED assembly 100 and fixes it to the circuit board 192 approximately vertically. The metal clip 194 provides two functions of power supply and mechanism fixing at the same time, which can also achieve the effect of reducing the complexity and cost of the production process. However, the LED assembly 100 can also be diagonally inserted on the circuit board 192 in a non-vertical manner.

In the embodiment shown in FIG. 3A, a vertical conductive element 130 may be provided at the position of the through hole 107 of the upper surface 102 as an electrical connection between the through hole 107 and a bonding wire 110. For example, the vertical conduction element 130 is a pn junction diode (for example, a vertical light-emitting diode, a Schottky diode or a susceptor diode), a resistor, or a metal block with conductive silver The glue is adhered to the via hole 107. In another embodiment, the vertical conduction element 130 and the conductive silver paste may be omitted, and a bonding wire 110 may directly contact the through hole 107 to create an electrical connection.

In FIGS. 3A and 3B, each blue LED chip 108 has a transparent adhesive layer 132 for fixing the blue LED chip 108 on the upper surface 102 of the transparent substrate 106. In FIGS. 3A and 3B, there is a corresponding transparent adhesive layer 132 under each blue LED chip 108 in a one-to-one relationship, but the invention is not limited to this. In one embodiment, there are a plurality of transparent adhesive layers 132 on the upper surface 102, and a plurality of blue LED chips 108 are adhered to each transparent adhesive layer 132; in another embodiment, there is only a single transparent adhesive layer on the upper surface 102 132, which carries all the blue LED chips 108 on it. The larger the area of the transparent adhesive layer 132, the better the heat dissipation effect of the blue LED chip 108 on it, but it may have the disadvantage that the greater the shear caused by the difference in thermal expansion coefficient. Therefore, the size of the area of the transparent adhesive layer 132 and the number of the blue LED chips 108 to bear may depend on the actual application. In one embodiment, the transparent adhesive layer 132 is mixed with some thermally conductive particles with high thermal conductivity, such as alumina powder, diamond-like carbon (diamond-like carbon), or silicon carbide (SiC), the thermal conductivity of which is greater than 20W/ In addition to improving the heat dissipation effect, mK can also have the effect of light scattering.

In Figures 3A and 3B, the material of the transparent adhesive layer 132, for example, can be epoxy resin or silicone, and mixed with the same, similar or different from the transparent colloid 112 Fluorescent powder. For example, the phosphor can be YAG or TAG phosphor. As mentioned earlier, the transparent glue 112 with phosphor covers the periphery and above the bonding wire 110 and the blue LED chip 108, and the transparent adhesive layer 132 is located under the blue LED chip 108. In other words, each blue LED chip 108 is not only sandwiched by the transparent glue 112 and the transparent adhesive layer 132, but also substantially completely wrapped by a transparent capsule formed by the transparent glue 112 and the transparent adhesive layer 132 . The blue light emitted by the blue LED chip 108 is either converted into yellow-green light by the phosphor, or mixed with yellow-green light. Therefore, the LED assembly 100a in FIGS. 3A and 3B can prevent blue light leakage.

Fig. 6 shows a manufacturing method for forming the LED assembly 100a in Figs. 3A and 3B. First, a transparent substrate 106 is provided. A via 107 is formed in advance on the transparent substrate 106 (step 148). For example, laser light can be used to melt a through hole from the transparent substrate 106 made of glass, and then a conductive material is filled in the through hole to form the through hole 107. Step 150 precut the transparent substrate 106. Some grooves are formed on the transparent substrate 106 first, and the position of each LED component 100 on the transparent substrate 106 is roughly defined in advance to facilitate subsequent cutting. In step 152, the conductive electrode plates 118 and 120 are attached to the transparent substrate 106, respectively, near the upper surface 102 and the lower surface 104 of the terminal 114. If there is a conductive electrode plate 112, it is also formed on the transparent substrate 106 in step 152. In another embodiment, the conductive electrode plate is formed on the upper surface 102 or the lower surface 104 by printing. In step 154, a transparent adhesive layer 132 with phosphor is formed on the upper surface 102, and its position is first designed to place the blue LED chip 108 on it. The method for forming the transparent adhesive layer 132, for example, can be glued, printed or sprayed to form the transparent adhesive layer 132 on the upper surface 102.

In step 155, the blue LED chip 108 is fixed on the transparent adhesive layer 132. For example, a vacuum suction nozzle can be used to suck up the blue LED chip 108 from a blue tape and place it on the transparent adhesive layer 132. The placement position of the blue LED chip 108 is preferably completely surrounded by the periphery of a transparent adhesive layer 132, that is, the area of the transparent adhesive layer 132 is larger than that of the blue LED chip 108 to avoid blue light leakage. The vertical conduction element 130 can be adhered to the through hole 107 of the upper surface 102 with conductive silver glue at this time. Step 156 forms a bonding wire 110 to electrically connect one blue LED chip 108 to another blue LED chip 108, the blue LED chip 108a to the conductive electrode plate 118, and the blue LED chip 108b to the vertical conduction element 130. Step 157 can use dispense or printing to form a transparent gel 112 with phosphor on the upper surface 102 to cover the bonding wires 110 and the blue LED chip 108. In step 158, the LED components 100 can be separated by manual cracking or machine cutting along the previously formed grooves.

It can be seen from the manufacturing method in FIG. 6 that, in the LED component formation process, except for forming the conductive electrode plate 120 or 122 on the lower surface 104, the other steps are generally performed on the upper surface 102. Because the bottom surface 104 has only a large area of the conductive electrode plate and is not easily scratched, the process carrier can be used to absorb or hold the bottom surface 104 to transport or fix the transparent substrate 106 to avoid The delicate structure on the upper surface 102 is damaged by mechanical stresses such as friction and scratches. The process yield can be improved considerably.

In the embodiments shown in FIGS. 3A, 3B, and 6, the light emitting direction of the blue LED chip 108 is not subject to any restriction. For the lower part, the blue LED chip 108 can pass through the transparent adhesive layer 132 and the transparent substrate 106 to provide mixed light; for the surrounding and above, the blue LED chip 108 can also provide mixed light through the transparent colloid 112. Therefore, the LED assembly 100a can be regarded as a light-emitting element that can provide six-sided lighting, and the bulb with the LED assembly 100 in Figure 4 can be regarded as an Omnidirectional lighting device.

In Figures 2A, 2B, 3A, and 3B, the blue LED chip 108 is directly adhered to the transparent substrate 106 with the transparent adhesive layer 132, but the present invention is not limited to this. Fig. 7A and Fig. 7B respectively show a top view and a bottom view of the LED assembly 100b in another embodiment. The second cross-sectional view of the LED assembly 100b is shown in FIG. 8A and FIG. 8B. Figure 9 shows the manufacturing method of the LED component 100b. Figures 7A, 7B, 8A, 8B, and 9 are similar to and correspond to Figures 2A, 2B, 3A, 3B, and 6, respectively. The components, devices, or steps corresponding to the same symbols or signs are similar or identical. Element, device or step. For the sake of brevity, its explanation may be omitted in this description.

Different from FIG. 2A, FIG. 7A has an additional submount 160, which is placed within the periphery of the transparent adhesive layer 132 and sandwiched between the blue LED chip 108 and the transparent adhesive layer 132. The material of the secondary substrate 160 may be transparent glass, sapphire, silicon carbide, or diamond-like carbon. Different from Figures 3A and 3B, part or all of the blue LED chip 108 in Figures 8A and 8B is fixed on the sub-substrate 160, and the sub-substrate 160 is fixed on the transparent substrate 106 with a transparent adhesive layer 132 .

In Figure 9, step 154a and step 155a replace step 154 and step 155 in Figure 6, respectively. In step 154a, the sub-substrate 160 is fixed to the transparent substrate 106 by the transparent adhesive layer 132 with phosphor. In one embodiment, the transparent adhesive layer 132 is first formed on the back of the sub-substrate 160, and then the sub-substrate 160 is attached to the transparent substrate 106; in another embodiment, the transparent adhesive layer 132 is first formed on the transparent substrate by coating On the upper surface 102 of 106, the sub-substrate 160 is then attached to the transparent adhesive layer 132. In step 155a, the blue LED chip 108 is then fixed on the sub-substrate 160.

In the embodiments shown in FIGS. 7A, 7B, 8A, 8B, and 9, the blue LED chip 108 can be fixed on the sub-substrate 160 by using the same or similar material as the transparent adhesive layer 132. However, the present invention is not limited to this. In one embodiment, the blue LED chip 108 can be fixed on the sub-substrate 160 by using transparent glue without phosphor or eutectic metal. In another embodiment, conductive strips are printed on the secondary substrate 160, and the blue LED chip 108 is fixed on it in a flip chip manner, so step 156 in Figure 9 may be omitted, however, The blue LED chip 108b still needs to be electrically connected to the via 107 through the bonding wire 100; and the blue LED chip 108a also needs to be electrically connected to the conductive electrode plate 118 through the bonding wire 100. In another embodiment, the blue LED chip 108 is fixed on the sub-substrate 160 by an anisotropic conductive film (ACF).

The LED assembly 100b in Figures 7A, 7B, 8A, 8B, and 9 enjoys the same benefits as the LED assembly 100a in Figures 2A, 2B, 3A, 3B, and 6. For example, the terminal 114 of the LED component 100b can be fixed on a circuit board with solder alone and provide electrical connection for driving power at the same time; the lower surface 104 of the LED component 100b is less afraid of scratches, and the process yield can be effectively improved The LED assembly 100b can be suitable for a full-peripheral lighting device; the LED assembly 100b can reduce or eliminate the problem of blue light leakage.

Fig. 8C and Fig. 8D show two cross-sectional views of the LED assembly 100c, which are respectively a modification of Fig. 8A and Fig. 8B. The LED assembly 100b (in FIGS. 8A and 8B) uses a single transparent adhesive layer 132 to fix the secondary substrate 160 on the transparent substrate 106. Different from the LED component 100b, the LED component 100c (in Figures 8C and 8D) uses two transparent adhesive layers 132 and 133 to fix the secondary substrate 160 on the transparent substrate 106. At least one of the transparent adhesive layers 132 and 133 contains phosphor. In the embodiment shown in FIGS. 8C and 8D, the transparent adhesive layer 132 has phosphor, but the transparent adhesive layer 133 does not. The material of the transparent adhesive layer 133, for example, can be epoxy resin or silicone. Because the transparent adhesive layer 133 has no phosphor, it can provide a better adhesive effect and adhere to the transparent substrate 106. The transparent adhesive layers 132 and 133 may be the same or different materials. In another embodiment, another transparent adhesive layer 133 can also be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase the mutual adhesion.

The blue LED chips 108 in the light emitting diode assembly 100 in FIG. 1 are electrically connected to each other through the bonding wires 110, but the invention is not limited to this. FIG. 10 is a three-dimensional schematic diagram of a light emitting diode assembly 400 according to an embodiment of the present invention, in which the blue LED chip 108 is fixed on the upper surface 102 by flip chip. Figures 11A and 11B show top and bottom views of the LED assembly 400a. Fig. 12A shows a schematic cross-sectional view taken along AA of the LED assembly 400a in Fig. 11A; and Fig. 12B is a schematic cross-sectional view taken along the line BB of the LED assembly 400a in Fig. 11A. Figures 10, 11A, 11B, 12A, and 12B are similar to and correspond to Figures 1, 2A, 2B, 3A, and 3B, respectively. The components, devices, or steps corresponding to the same symbols or signs are similar or identical Element, device or step. For the sake of brevity, its explanation may be omitted in this description.

Figures 12A and 12B are different from Figures 3A and 3B. In Figures 12A and 12B, conductive strips 402 are printed on the transparent substrate 106, and the blue LED chips 108 are electrically connected to each other through the conductive strips 402. connection. Therefore, the blue LED chip 108 in FIGS. 12A and 12B can emit light from the surrounding area and the upper and lower sides. Therefore, the LED assembly 400a can be regarded as a light emitting element that can provide six-sided light. Figure 12C shows another LED component 400b, in which a fluorescent layer 131 is coated on the lower surface 104, and the fluorescent layer 131 contains fluorescent powder, which can convert the light emitted by the blue LED chip 108 into another color Light. In this way, the chance of blue light leakage from the lower surface 104 can be reduced. In another embodiment, the blue LED chip 108 in the LED assembly 400a can be replaced with a white LED chip, and each white LED chip is basically a blue LED chip with a phosphor layer formed on the surface. In this way, the problem of blue light leakage can be avoided.

Although the LED components 100a and 100b in the previous embodiment both have the through holes 107 as part of a circuit, the conductive electrode plates 120 and 118 on the upper and lower surfaces 102 and 104 of the transparent substrate 106 can be used as the two LED components 100a and 100b. The driving power input terminal, but the present invention is not limited to a through hole.

FIG. 13 shows a three-dimensional schematic diagram of an LED assembly 200 according to an embodiment of the invention. Figures 14 and 15 are respectively a top view and a side view of the LED assembly 200a. Different from the LED assemblies 100a and 100b, the LED assembly 200a in Figures 14 and 15 has conductive electrode plates 118 and 119 formed on the two terminals 114 and 116 of the upper surface 102 of the transparent substrate 106, respectively. In the LED assembly 200a, the conductive electrode plates 118 and 119 partially span or extend beyond the two terminals 114 and 116 of the transparent substrate 106. Moreover, the LED assembly 200a does not have a via 107. The manufacturing method and steps of the LED assembly 200 or 200a in Figures 13, 14 and 15 can be inferred with reference to the foregoing description, and therefore will not be repeated.

In the LED assembly 200a, each blue LED chip 108 has a single corresponding transparent adhesive layer 132, but the present invention is not limited to this. As previously described, in other embodiments, many blue LED chips 108 may share a transparent adhesive layer 132, or all the blue LED chips 108 are adhered to the transparent substrate 106 only through a transparent adhesive layer 132.

Figures 16 and 17 show another LED assembly 200b, which is similar to the LED assembly 200a in Figures 14 and 15, but each blue LED chip 108 in Figures 16 and 17 is fixed to the primary substrate 160, and the secondary substrate 160 is fixed on the transparent substrate 106 through the transparent adhesive layer 132. The details of the LED assembly 200b can be inferred with reference to the LED assembly 100b in FIGS. 8A and 8B and related descriptions, and will not be repeated here.

Figure 18 shows a side view of another LED assembly 200c. Figure 19 shows a manufacturing method of the LED assembly 200c. Figure 18 is similar to Figure 17, the top view of Figure 18 can be similar to Figure 16, and Figure 19 is similar to Figure 9, and the similarities are not repeated here. Different from FIG. 17, in FIG. 18, the conductive electrode plates 118 and 119 are attached to the transparent adhesive layer 132. In the process method in FIG. 19, step 151 is inserted between steps 150 and 152, which coats a transparent adhesive layer 132 on the transparent substrate 106. In other words, the formation of the transparent adhesive layer 132 can be performed before the conductive electrode plates 118 and 119 are attached. The transparent adhesive layer 132 may be epoxy resin or silicone, and mixed with the same or similar phosphors as in the transparent colloid 112. For example, the phosphor can be YAG or TAG phosphor.

The LED components 200b and 200c in FIGS. 17 and 18 adopt a single transparent adhesive layer 132 to fix the sub-substrate 160 on the transparent substrate 106. However, the present invention is not limited to this. In other embodiments, the LED components 200b and 200c can be changed, and the two transparent adhesive layers 132 and 133 in FIGS. 8C and 8D are used to fix the secondary substrate 160 on the transparent substrate 106. In another embodiment, another transparent adhesive layer 133 can also be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase the mutual adhesion.

The lower surface 104 of the LED components 200a, 200b, and 200c has no patterns at all, and there is no problem of scratches on the lower surface 104 at all. The LED components 200a, 200b and 200c can be applied to the application of the full-circumference light field, and there is less blue light leakage problem. For example, a bulb can be fixed with solder or conductive clamps to the conductive electrode plates 118 and 119 of the two terminals 114 and 116 in the LED assembly 200a, 200b or 200c, and the driving power is provided through the two electrode plates at the same time. Electrical connection.

FIG. 20 shows a three-dimensional schematic diagram of an LED assembly 300 according to another embodiment of the present invention. Figures 21A and 21B show top and bottom views of an LED assembly 300a. Figure 22 shows a cross-sectional view of the LED assembly 300a. The two terminals 114 and 116 of the LED assembly 300a on the lower surface 104 of the transparent substrate 106 are respectively formed with conductive electrode plates 120 and 122. In Figures 21A, 21B, and 22, the LED assembly 300a has two through holes 107A, 107B formed near the terminals 114, 116, respectively. The conductive electrode plate 120 penetrates the through hole 107A, and the conductive electrode plate 122 penetrates the through hole 107B, and is electrically connected to the blue LED chip 108 on the upper surface 102. The blue LED chip 108 is arranged and electrically connected between the through holes 107A and 107B, and is also arranged and electrically connected between the conductive electrode plates 120 and 122. The details and possible changes in the LED assembly 300a can be inferred with reference to the description of other embodiments in this specification, and will not be repeated.

Figure 23 shows a side view of the LED assembly 300b. Wherein, the sub-substrate 160 is sandwiched between the blue LED chip 108 and the transparent adhesive layer 132. The details and possible changes in the LED assembly 300b can be inferred by referring to the description of other embodiments in this specification, and will not be repeated here.

Although in the LED assemblies 200 and 300, the conductive electrode plates located at the two terminals partially span or extend beyond the two terminals 114 and 116 of the transparent substrate 106, the present invention is not limited to this. FIG. 24 shows a perspective view of the LED assembly 600. FIG. 25A shows LED assembly 600a, which is a possible top view of LED assembly 600. In FIG. 25A, one side of the conductive electrode plates 118 and 119 is aligned with the edge of the transparent substrate 106. Figure 25B shows LED assembly 600b, which is another possible top view of LED assembly 600. In FIG. 25B, the conductive electrode plates 118 and 119 are completely located in the transparent substrate 106.

FIG. 26A shows an LED bulb 500a with the LED assembly 300 as a lamp core. The LED bulb 500a has two clamps 502. The clamp 502 may be V-shaped or Y-shaped. In one embodiment, the clamp 502 may be rectangular and have a groove for fixing the LED assembly 300. Each clamp 502 is made of a conductive object. The two tips of the clamp 502 clamp and fix the conductive electrode plates of the two terminals of the LED assembly 300, and make the upper surface 102 of the LED assembly 300 face upward (Z direction). The clamp 502 also electrically connects the conductive electrode plates at both ends of the LED assembly 300 to the Edison socket of the LED bulb 500a, so as to provide the power required for the LED assembly 300 to emit light. Figure 26B is similar to Figure 26A, but uses the LED assembly 600 as an LED bulb 500b. Unlike the LED bulb 500a, the upper surface 102 of the LED assembly 600 in the LED bulb 500b faces the Y direction, which is substantially perpendicular to the rotation axis (Z direction) of the LED bulb 500b. Of course, the LED assembly 300 or 600 in Figures 26A and 26B can be replaced with the LED assembly 200 described previously. The details and possible changes can be inferred by referring to the description of other embodiments in this specification, and will not be Tired out.

The lower surfaces 104 of the LED components 300a and 300b have only large-area conductive electrode plates 120 and 122 that are not afraid of scratches, and the process yield can be considerably improved. The lower surfaces 104 of the LED components 600a and 600b have no patterns at all, and they are not afraid of scratches. The LED components 300a, 300b, 600a and 600b can be applied to the application of the full-circumference light field, and there is no blue light leakage problem.

Although the above embodiments all use the blue LED chip 108 as the light source, the present invention is not limited to this. In other embodiments, some or all of the LED chips are not blue light, but red light or green light.

Some embodiments of the present invention, because of the existence of the transparent substrate 106 and the transparent adhesive layer 132, can emit light in all directions, so it is suitable for applications of full-peripheral light. In some embodiments, all the blue LED chips 108 are roughly wrapped by the transparent adhesive layer 132 and the transparent glue 112, so there is no blue light leakage problem. The LED assembly in some embodiments can receive power supply and mechanical support at the same time as long as one terminal is fixed; the LED assembly in some embodiments can receive power supply from both terminals at the same time when two terminals are mechanically fixed; in some embodiments The lower surface of the LED component has no detailed patterns or circuits, and it is less afraid of scratches. It can be conveniently taken or fixed during the manufacturing process, and the process yield is improved.

The above are only a few embodiments of the present invention, but each embodiment can refer to, merge or replace each other without conflict with each other. Any changes and modifications made in accordance with the scope of the patent application of the present invention shall all belong to The scope of the present invention.

100, 100a, 100b, 100c‧‧‧LED components 102‧‧‧Upper surface 104‧‧‧Lower surface 106‧‧‧Transparent substrate 107, 107A, 107B‧‧‧via 108, 108a, 108b‧‧‧Blue LED chip 110‧‧‧Wire 112‧‧‧Transparent colloid 114, 116‧‧‧Terminal 118‧‧‧Conductive electrode plate 119‧‧‧Conductive electrode plate 120‧‧‧Conductive electrode plate 122‧‧‧Conductive electrode plate 130‧‧‧Vertical pass element 131‧‧‧Fluorescent layer 132、133‧‧‧Transparent adhesive layer 148, 150, 151, 152, 154, 154a, 155, 155a, 156, 157, 158‧‧‧ steps 160‧‧‧Substrate 180‧‧‧Shade 182‧‧‧Radiator 183‧‧‧Electrical connection mechanism 190‧‧‧Solder 192‧‧‧Circuit board 194‧‧‧Metal Clip 200, 200a, 200b, 200c‧‧‧LED components 300, 300a, 300b‧‧‧LED components 400, 400a, 400b‧‧‧LED components 402‧‧‧conductive strip 500a, 500b‧‧‧LED bulb 502‧‧‧Fixture 600, 600a, 600b‧‧‧LED components

Figure 1 is a three-dimensional schematic diagram of an LED assembly according to an embodiment of the present invention. Figure 2A shows a top view of the LED assembly 100a. Figure 2B shows a bottom view of the LED assembly 100a. Figures 3A and 3B respectively show schematic cross-sectional views of AA and BB in Figure 2A. Figure 4 shows that the LED assembly 100 is installed in a bulb. FIG. 5A shows that the LED assembly 100 is fixed with solder. FIG. 5B shows that the LED assembly 100 is fixed with a metal clip. Figure 6 shows the manufacturing process for forming the LED components in Figures 3A and 3B. Fig. 7A and Fig. 7B respectively show a top view and a bottom view of the LED assembly 100b. Figures 8A and 8B show schematic diagrams of cross-sections AA and BB in Figure 7A. Fig. 8C and Fig. 8D show two cross-sectional views of the LED assembly 100c. Figure 9 shows the manufacturing method of the LED component 100b. FIG. 10 is a perspective view of a light emitting diode assembly 400 according to an embodiment of the invention. Figures 11A and 11B show top and bottom views of the LED assembly 400a. Figures 12A and 12B respectively show schematic cross-sectional views of AA and BB of the LED assembly 400a in Figure 11A. Figure 12C shows another LED assembly 400b. FIG. 13 shows a three-dimensional schematic diagram of the LED assembly 200. Figures 14 and 15 are respectively a top view and a side view of the LED assembly 200a. Figures 16 and 17 show another LED assembly 200b. Figure 18 shows another LED assembly 200c. Figure 19 shows a manufacturing method of the LED assembly 200c. FIG. 20 shows a perspective view of an LED assembly 300 according to another embodiment of the invention. Figures 21A and 21B show top and bottom views of an LED assembly 300a. Figure 22 shows a cross-sectional view of the LED assembly 300a. Figure 23 shows a side view of the LED assembly 300b. FIG. 24 shows a perspective view of the LED assembly 600. Figures 25A and 25B show top views of LED assemblies 600a and 600b. Figures 26A and 26B show two LED bulbs with LED components 300 and 600 as the lamp cores, respectively.

100a‧‧‧LED components

102‧‧‧Upper surface

104‧‧‧Lower surface

106‧‧‧Transparent substrate

107‧‧‧Through hole

108, 108b‧‧‧Blue LED chip

110‧‧‧Wire

112‧‧‧Transparent colloid

114, 116‧‧‧Terminal

118‧‧‧Conductive electrode plate

120‧‧‧Conductive electrode plate

130‧‧‧Vertical pass element

132‧‧‧Transparent adhesive layer

Claims (10)

A light-emitting diode assembly, including: A circuit board; A metal clip on the circuit board, A first substrate, fixed on the circuit board by the metal clip, having a first upper surface and a first lower surface opposite to the first upper surface; A plurality of first light emitting diode chips located on the first upper surface; A transparent colloid, including phosphor, covering the plurality of first light-emitting diode chips and the first upper surface, but not covering the first lower surface; A second substrate having a second upper surface and a second lower surface opposite to the second upper surface; and A plurality of second light emitting diode chips are located on the second upper surface, Wherein, the light-emitting diode assembly has a virtual central axis, and the first lower surface and the second lower surface face the virtual central axis of the light-emitting diode assembly. The light-emitting diode assembly described in item 1 of the scope of patent application further includes a first conductive electrode plate and a second conductive electrode plate located at the same end of the first substrate. According to the light-emitting diode assembly described in item 2 of the scope of patent application, the first conductive electrode plate has a plurality of parts with different widths. According to the light-emitting diode assembly described in claim 2, wherein the metal clip is used to supply power to the first conductive electrode plate to drive the plurality of first light-emitting diode chips. The light-emitting diode assembly described in item 1 of the scope of patent application further includes a transparent adhesive layer located between the first substrate and the plurality of first light-emitting diode chips. According to the light-emitting diode assembly described in item 1 of the scope of patent application, the first lower surface has no light-emitting diode chip disposed on it. According to the light-emitting diode assembly described in item 1 of the scope of patent application, the first upper surface has two terminals, and a part of each of the two terminals is not covered by the transparent colloid. According to the light-emitting diode assembly described in claim 1, wherein the plurality of first light-emitting diode chips are arranged in two rows along the longitudinal direction of the first substrate. According to the light-emitting diode assembly described in item 1 of the scope of patent application, the first substrate and the second substrate are not perpendicular to the circuit board. A kind of light bulb containing A lampshade The light-emitting diode assembly described in item 1 of the scope of patent application is set in the lampshade; and An electrical connection mechanism is connected with the lampshade.

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