TWI774091B - Light-emitting diode assembly - Google Patents

Abstract

An LED assembly includes a substrate, an LED chips, a first electrode and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The LED chip and the first electrode are formed on the first surface. The second electrode is formed on the second surface. In a cross-sectional view, the first electrode and the second electrode have different length.

Description

Light Emitting Diode Assembly

Embodiments of the invention relate to a light emitting diode (LED) device and a fabrication method, and more particularly, to an LED device capable of providing a full-circumferential light field and a related fabrication method.

At present, we can see the application of various LED products in daily life, such as traffic signs, locomotive tail lights, car headlights, street lights, computer indicators, flashlights, LED backlights, etc. Except for the front-end chip process, almost all of these commodities must go through the back-end packaging process.

The main function of the LED package is to provide the necessary electrical, optical and thermal support for the LED chip. If semiconductor products such as LED chips are exposed to the atmosphere for a long time, they will be affected by water vapor or chemical substances in the environment and age, resulting in deterioration in characteristics. In LED packaging, epoxy resin is often used to coat the LED chip to effectively isolate the atmosphere. In addition, in order to achieve the goal of brighter and more power saving, the LED package also needs to have good heat dissipation and light extraction efficiency. If the heat generated when the LED chip emits light is not dissipated in time, the heat accumulated in the LED chip will adversely affect the characteristics, life and reliability of the components. Optical design is also an important part of the LED packaging process. How to export light more effectively, the angle and direction of light are the key points of design.

In addition to thermal issues, the packaging technology of white LEDs also needs to consider issues such as color temperature, color rendering index, and phosphors. Moreover, if the white LED uses blue LED chips and yellow-green phosphors, the shorter the wavelength of blue light, the greater the damage to the human eye. Therefore, it is necessary to effectively block the blue light in the package structure to avoid the leakage of blue light.

In order for LED products to be competitive in the market, how to make LED packaging process stable, low cost, and high yield is also the goal pursued by LED packaging.

A light-emitting diode assembly includes: a substrate, a light-emitting diode chip, a first electrode, and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The light emitting diode chip and the first electrode are located on the first surface. The second electrode is formed on the second surface and is electrically connected to the first electrode. In a cross section, the first electrode and the second electrode have different lengths.

FIG. 1 is a schematic perspective view of a light-emitting diode (LED) device 100 according to an embodiment of the present invention. The LED assembly 100 includes a transparent substrate 106, which, in one embodiment, is a non-conductive glass substrate. The transparent substrate 106 has an upper surface 102 and a lower surface 104 facing opposite directions. As shown in FIG. 1 , the transparent substrate 106 is roughly in the shape of a long strip, and has two terminals 114 and 116 . In this specification, transparent is only used to mean that light can pass through, which may be completely transparent or translucent, or semitransparent. In another embodiment, the material of the transparent substrate 106 may be sapphire, silicon carbide, or diamond-like carbon.

Figure 2A shows a top view of the LED assembly 100a. Please also refer to Figure 1. On the upper surface 102 , a plurality of blue LED chips 108 are fixed and are electrically connected to each other through a circuit formed by a bonding wire 110 . Each blue LED chip 108 can be a single LED with a forward voltage of about 2~3V (hereinafter referred to as "low voltage chip"), or has several light emitting diodes connected in series with a forward voltage greater than low Voltage chips, such as 12V, 24V, 48V, etc. (hereinafter referred to as "high voltage chips"). Specifically, different from the wire bonding method, the high-voltage chip forms a plurality of light-emitting diode units (ie, a light-emitting diode structure with at least a light-emitting layer) on a common substrate through a semiconductor process. The common substrate may be a crystal-grown substrate or a non-grown substrate. In FIGS. 1 and 2A, the blue LED chips 108 are arranged in two rows along two sides of a longitudinal axis connecting the two terminals 114 and 116 of the transparent substrate 106, and are connected in series with each other by the bonding wires 110. , which is equivalent to a high forward voltage light-emitting diode. However, the present invention is not limited to this. In other embodiments, the blue LED chips 108 on the upper surface 102 can be arranged in any pattern, and the electrical connections with each other can include, series, parallel, and series-parallel hybrid, Or the connection method of bridge structure.

As shown in FIG. 2A , near the terminal 114 , the transparent substrate 106 has a via hole 107 . The via hole 107 has a via hole that penetrates the transparent substrate 106 to the upper surface 102 and the lower surface 104 , and a conductive material is formed therein to fill the via hole or only cover the inner wall of the via hole to form the via hole 107 . The conductive material in the through hole can provide electrical connection between the two ends of the through hole 107 . On the upper surface 102 near the terminal 114, a conductive electrode plate 118 is provided. The conductive electrode plate 118 does not directly contact the through hole 107 , that is, does not directly contact the conductive objects in the through hole. One of the blue LED chips 108 adjacent to the terminal 114 (designated as 108a ) is electrically connected to the conductive electrode plate 118 with a bonding wire 110 . One of the blue LED chips 108 close to the terminal 114 (marked as 108b ) is electrically connected to the via 107 by another bonding wire 110 .

All the bonding wires 110 and the blue LED chips 108 on the upper surface 102 are covered by the transparent gel 112 to prevent the bonding wires 110 and the blue LED chips 108 from aging and possibly caused by moisture or chemicals in the atmosphere. damage. The main constituent of the transparent gel 112 may be epoxy resin or silicone. The transparent colloid 112 contains at least one phosphor, which can be excited by part of the blue light (for example, its peak value is 430nm-480nm) emitted by the blue LED chip 108 to generate yellow light (for example, its peak value is 570nm-590nm) ) or yellow-green light (for example, its peak value is 540nm-570nm). When the yellow or yellow-green light is properly mixed with the remaining blue light, the human eye perceives it as white light. Figure 1 is just a schematic diagram. In one example, the LED assembly 100 in FIG. 1 may not be able to see the bonding wires 110 and the blue LED chip 108 under the transparent gel 112 as shown in FIG. 1 because of the phosphors in the transparent gel 112 .

Figure 2B shows a bottom view of the LED assembly 100a. As shown in FIG. 2B , no LED chips are disposed on the lower surface 104 . On the lower surface 104 close to the terminal 114, there is another conductive electrode plate 120, a part of which overlaps with the through hole 107, and directly contacts the conductive objects in the through hole to be electrically connected to each other. However, in another embodiment, the conductive electrode plate 120 may not be directly connected to the via hole 107 , but may be electrically connected to the via hole 107 through another conductor, such as the bonding wire 110 . On the lower surface 104 near the terminal 116, another conductive electrode plate 122 may optionally be provided. Such a design can make the conductive electrode plate 122 and the conductive electrode plate 120 coplanar, so that the LED assembly 100a can be placed stably, and damage caused by falling over during transportation or handling can be avoided. In this embodiment, the conductive electrode plate 122 can be a floating connection on the circuit, and is not electrically connected to any electronic components, circuits, or other electrode plates in the LED assembly 100a, because its main purpose is to enable the LED assembly 100a to Place smoothly.

As shown in the embodiment of FIGS. 2A and 2B , the boundary between the conductive electrode plates 120 and 118 is located within the lower surface 104 and the upper surface 102 , that is, not substantially beyond the boundary between the lower surface 104 and the upper surface 102 . The conductive electrode plates 120, 118 and 122 need not be approximately rectangular in shape, nor do they need to be approximately the same size. In another embodiment, one of the conductive electrode plates 120 and 118 is approximately rectangular, and the other is approximately circular, so as to facilitate the identification of the positive and negative electrodes of the LED assembly 100a.

From an electrical point of view, the blue LED chip 108 and the via hole 107 are connected in series between the conductive electrode plates 120 and 118 . The conductive electrode plates 120 and 118 can be used as two power input terminals of the LED assembly 100a. The positive and negative power terminals of a driving power source (not shown) can be electrically connected to the conductive electrode plates 120 and 118, respectively, to drive the blue LED chip 108 to emit light.

FIG. 3A shows a schematic cross-sectional view along AA of the LED assembly 100 a in FIG. 2A ; and FIG. 3B is a schematic cross-sectional view at BB of the LED assembly 100 a in FIG. 2A .

Similar to the previous description, in FIG. 3A, the blue LED chip 108b is electrically connected to the via hole 107 through a bonding wire 110, which is connected to the conductive electrode plate 120 of the lower surface 104; in FIG. 3B, the blue LED chip 108b is The chip 108a is electrically connected to the conductive electrode plate 118 on the upper surface 102 through another bonding wire 110 . FIG. 4 shows that the LED assembly 100 is disposed in a light bulb, and the light bulb includes a lampshade 180 , the LED assembly 100 , a circuit board 192 , a heat dissipation mechanism 182 , and an electrical connection mechanism 183 (eg, an Edison lamp socket). The terminal 114 of the LED assembly 100 is fixed on the circuit board 192 ; the circuit board 192 is connected with the heat dissipation mechanism 182 to separate the heat generated by the LED assembly 100 from the bulb; the electrical connection mechanism 183 is connected with the heat dissipation mechanism 182 . Because the conductive electrode plates 120 and 118 for driving the blue LED chip 108a are located on the upper surface 102 and the lower surface 104 of the same terminal 114 side of the transparent substrate 106, respectively, a conductor such as solder can be used to connect the conductive electrode plate 120 to the same terminal 114 side. 118 is simultaneously soldered to a circuit board, as shown in Figure 5A. The solder 190 can not only provide the electrical connection of the driving power source to make the LED component 100 emit light, but also provide mechanical support to the terminal 114, so that the LED component 100 can stand vertically on the circuit board 192 and emit light to the surroundings, which can provide full-circumferential light. field. In FIG. 5A , the LED assembly 100 is only supported by the mechanism of the solder 190 , and can stand approximately vertically on the circuit board 192 , and the circuit board 192 supplies power to the LED assembly 100 through the solder 190 at the same time. FIG. 5B is a clip made of metal clips 194, and the LED assembly 100 is clipped and fixed to the circuit board 192 approximately vertically. The metal clip 194 simultaneously provides two functions of power supply and mechanism fixing, and can also achieve the effect of reducing the complexity and cost of the manufacturing process. However, the LED assembly 100 can also be obliquely inserted on the circuit board 192 in a non-vertical manner.

In the embodiment of FIG. 3A , a vertical conductive element 130 may be disposed at the position of the via hole 107 on the upper surface 102 as an electrical connection between the via hole 107 and a bonding wire 110 . For example, the vertical conduction element 130 is a pn junction diode (eg, a vertical light-emitting diode, a Schottky diode, or a Zener diode), a resistor, or a metal block with conductive silver Adhesive on the via hole 107 . In another embodiment, the vertical conduction element 130 and the conductive silver paste may be omitted, and a bonding wire 110 may directly contact the via hole 107 to generate electrical connection.

In FIGS. 3A and 3B , there is a transparent adhesive layer 132 under each blue LED chip 108 for fixing the blue LED chip 108 on the upper surface 102 of the transparent substrate 106 . In FIGS. 3A and 3B, there is a corresponding transparent adhesive layer 132 under each blue LED chip 108 in a one-to-one relationship, but the invention is not limited thereto. In one embodiment, there are several transparent adhesive layers 132 on the upper surface 102 , and several blue LED chips 108 are adhered on each transparent adhesive layer 132 ; in another embodiment, there is only a single transparent adhesive layer on the upper surface 102 132, on which all blue LED chips 108 are carried. The larger the area of the transparent adhesive layer 132 is, the better the heat dissipation effect of the blue LED chip 108 on the transparent adhesive layer 132 is, but it may cause the disadvantage of greater shear caused by the difference in thermal expansion coefficient. Therefore, the size of the area of the transparent adhesive layer 132 and the quantity of the blue LED chips 108 can be determined according to practical applications. In one embodiment, the transparent adhesive layer 132 is mixed with some thermally conductive particles with high thermal conductivity, such as alumina powder, diamond-like carbon, or silicon carbide (SiC), the thermal conductivity of which is greater than 20W/ mK, in addition to improving the heat dissipation effect, can also have the effect of light scattering.

In FIGS. 3A and 3B , the material of the transparent adhesive layer 132 , for example, can be epoxy resin or silicone, and mixed with the same, similar or different materials as the transparent colloid 112 . fluorescent powder. For example, the phosphor can be YAG or TAG phosphor. As previously described, the transparent colloid 112 with phosphor powder covers the surrounding and above the bonding wires 110 and the blue LED chip 108 , and the transparent adhesive layer 132 is located under the blue LED chip 108 . In other words, each blue LED chip 108 is not only sandwiched by the transparent gel 112 and the transparent adhesive layer 132 , but also substantially completely wrapped by a transparent capsule formed by the transparent gel 112 and the transparent adhesive layer 132 . The blue light emitted by the blue LED chip 108 is either converted into yellow-green light by the phosphor powder, or mixed with the yellow-green light. Therefore, the LED assembly 100a in FIGS. 3A and 3B can prevent the problem of blue light leakage.

FIG. 6 shows a process method for forming the LED device 100a of FIGS. 3A and 3B. First, a transparent substrate 106 is provided. Via holes 107 are pre-formed on the transparent substrate 106 (step 148). For example, the through hole 107 can be formed by melting a through hole from the transparent substrate 106 made of glass material by laser light, and then filling the through hole with a conductive material. Step 150 precuts the transparent substrate 106 . Some grooves are first formed on the transparent substrate 106 to roughly predefine the position of each LED assembly 100 on the transparent substrate 106 to facilitate subsequent cutting. In step 152 , the conductive electrode plates 118 and 120 are respectively attached to the transparent substrate 106 at positions close to the upper surface 102 and the lower surface 104 of the terminal 114 . Step 152 also forms the conductive electrode plate 112 on the transparent substrate 106, if present. In another embodiment, the conductive electrode plate is formed on the upper surface 102 or the lower surface 104 by printing. In step 154, a transparent adhesive layer 132 with phosphor powder is formed on the upper surface 102, and the position of the transparent adhesive layer 132 is first designed to place the blue LED chip 108 thereon. The method for forming the transparent adhesive layer 132 , for example, may be by dispensing, printing or spraying to form the transparent adhesive layer 132 on the upper surface 102 .

Step 155 is to fix the blue LED chip 108 on the transparent adhesive layer 132 . For example, the blue LED chip 108 can be sucked up from the blue tape by a vacuum nozzle and placed on the transparent adhesive layer 132 . The placement position of the blue LED chip 108 is preferably completely surrounded by the periphery of a transparent adhesive layer 132 , that is, the area of the transparent adhesive layer 132 is larger than that of the blue LED chip 108 to avoid the problem of blue light leakage. The vertical conduction element 130 can be adhered to the via hole 107 on the upper surface 102 by using conductive silver glue. Step 156 forms bonding wires 110 that electrically connect one blue LED chip 108 to another blue LED chip 108 , blue LED chip 108 a to conductive electrode plate 118 , and blue LED chip 108 b to vertical conductive element 130 . In step 157 , a transparent colloid 112 with phosphor powder can be formed on the upper surface 102 by dispensing or printing, covering the bonding wires 110 and the blue LED chip 108 . In step 158, the individual LED components 100 can be separated out along the previously pre-formed grooves by manual cracking or machine cutting.

It can be seen from the process method in FIG. 6 that in the process of forming the LED device, except for forming the conductive electrode plate 120 or 122 on the lower surface 104 , other steps are generally performed on the upper surface 102 . Because the lower surface 104 only has a large area like a conductive electrode plate and is not easily scratched, the process carrier can use the method of attracting or holding the lower surface 104 to transport or fix the transparent substrate 106 to avoid The delicate structures on the upper surface 102 are damaged by mechanical stress such as friction and scratches. The process yield can be improved considerably.

In the embodiments shown in FIGS. 3A, 3B and 6, the light-emitting direction of the blue LED chip 108 is not limited in any way. For the lower part, the blue LED chip 108 can provide mixed light through the transparent adhesive layer 132 and the transparent substrate 106; for the surrounding and the upper part, through the transparent colloid 112, the blue LED chip 108 can also provide mixed light. Therefore, the LED assembly 100a can be regarded as a light-emitting element that can provide six-sided lighting, and the light bulb with the LED assembly 100 in FIG. 4 can be regarded as an Omnidirectional lighting device.

In FIGS. 2A, 2B, 3A and 3B, the blue LED chip 108 is directly adhered to the transparent substrate 106 by the transparent adhesive layer 132, but the present invention is not limited thereto. 7A and 7B respectively show, in another embodiment, the top view and the bottom view of the LED assembly 100b. Two cross-sectional views of the LED device 100b are shown in FIGS. 8A and 8B. FIG. 9 shows the manufacturing method of the LED device 100b. Figures 7A, 7B, 8A, 8B and 9 are similar and corresponding to Figures 2A, 2B, 3A, 3B and 6, respectively, wherein the elements, devices or steps corresponding to the same symbols or symbols are similar or identical element, device or step. For the sake of brevity, its explanation may be omitted in this specification.

Different from FIG. 2A , FIG. 7A has an additional submount 160 , which is placed within the periphery of the transparent adhesive layer 132 and sandwiched between the blue LED chip 108 and the transparent adhesive layer 132 . The material of the sub-substrate 160 may be transparent glass, sapphire, silicon carbide, or diamond-like carbon. Different from FIGS. 3A and 3B, part or all of the blue LED chip 108 in FIGS. 8A and 8B is fixed on the sub-substrate 160, and the sub-substrate 160 is fixed on the transparent substrate 106 by the transparent adhesive layer 132 .

In FIG. 9, steps 154a and 155a replace steps 154 and 155 in FIG. 6, respectively. Step 154a attaches the sub-substrate 160 to the transparent substrate 106 with the transparent adhesive layer 132 having phosphor powder. In one embodiment, the transparent adhesive layer 132 is formed on the backside of the sub-substrate 160 first, and then the sub-substrate 160 is attached to the transparent substrate 106; in another embodiment, the transparent adhesive layer 132 is formed on the transparent substrate by coating first 106 on the upper surface 102, and then the sub-substrate 160 is attached to the transparent adhesive layer 132. Step 155a is followed by fixing the blue LED chip 108 on the sub-substrate 160 .

In the embodiments shown in FIGS. 7A, 7B, 8A, 8B and 9, the blue LED chip 108 can be fixed on the sub-substrate 160 with the same or similar material as the transparent adhesive layer 132 . However, the present invention is not limited to this. In one embodiment, the blue LED chip 108 can be fixed on the sub-substrate 160 by transparent glue or eutectic metal without phosphor. In another embodiment, conductive strips are printed on the sub-substrate 160, and the blue LED chip 108 is fixed thereon in a flip chip manner, so the step 156 in FIG. 9 may be omitted, however, The blue LED chip 108b still needs to pass through the bonding wire 100 to be electrically connected to the via hole 107 ; and the blue LED chip 108a also needs to pass through the bonding wire 100 to be electrically connected to the conductive electrode plate 118 . In another embodiment, the blue LED chip 108 is fixed on the sub-substrate 160 with an anisotropic conductive film (ACF).

The LED assembly 100b in Figures 7A, 7B, 8A, 8B and 9 enjoys the same benefits as the LED assembly 100a in Figures 2A, 2B, 3A, 3B and 6. For example, the terminal 114 of the LED component 100b can be fixed on a circuit board with solder alone and provide electrical connection of the driving power at the same time; the lower surface 104 of the LED component 100b is less afraid of scratches, and the process yield can be effectively improved ; The LED assembly 100b can be applied to a full-circumference lighting device; the LED assembly 100b can reduce or eliminate the problem of blue light leakage.

FIGS. 8C and 8D show two cross-sectional views of the LED assembly 100c, which are the deformations of FIGS. 8A and 8B, respectively. A single transparent adhesive layer 132 is used in the LED assembly 100b (in FIGS. 8A and 8B ) to attach the sub-substrate 160 to the transparent substrate 106 . Different from the LED assembly 100b, the LED assembly 100c (shown in Figures 8C and 8D) uses two transparent adhesive layers 132 and 133 to fix the sub-substrate 160 on the transparent substrate 106. At least one of the transparent adhesive layers 132 and 133 contains phosphor. In the embodiment of FIGS. 8C and 8D, the transparent adhesive layer 132 has phosphor powder, and the transparent adhesive layer 133 does not. The material of the transparent adhesive layer 133 can be, for example, epoxy resin or silicone. Since the transparent adhesive layer 133 has no phosphor, it can provide a better adhesive effect and be attached to the transparent substrate 106 . The transparent adhesive layers 132, 133 may be the same or different materials. In another embodiment, another transparent adhesive layer 133 may also be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase mutual adhesion.

The blue LED chips 108 in the light emitting diode assembly 100 of FIG. 1 are electrically connected to each other through bonding wires 110 , but the invention is not limited thereto. FIG. 10 is a three-dimensional schematic diagram of a light emitting diode assembly 400 according to an embodiment of the present invention, wherein the blue LED chip 108 is fixed on the upper surface 102 by flip chip. Figures 11A and 11B show top and bottom views of the LED assembly 400a. FIG. 12A shows a schematic cross-sectional view along AA of the LED assembly 400 a in FIG. 11A ; and FIG. 12B is a schematic cross-sectional view at BB of the LED assembly 400 a in FIG. 11A . Figures 10, 11A, 11B, 12A, and 12B are similar and correspond to Figures 1, 2A, 2B, 3A, and 3B, respectively, wherein the elements, devices or steps corresponding to the same symbols or symbols are similar or identical. element, device or step. For the sake of brevity, its explanation may be omitted in this specification.

FIGS. 12A and 12B are different from FIGS. 3A and 3B. In FIGS. 12A and 12B, conductive strips 402 are printed on the transparent substrate 106, and the blue LED chips 108 are electrically connected to each other through the conductive strips 402. connect. Therefore, the blue LED chip 108 shown in Figs. 12A and 12B can emit light from all around and up and down, so the LED assembly 400a can be regarded as a light-emitting element that can provide six-sided light emission. FIG. 12C shows another LED assembly 400b, wherein a phosphor layer 131 is coated on the lower surface 104. The phosphor layer 131 has phosphor powder, which can convert the light emitted by the blue LED chip 108 into another color. light. In this way, the chance of blue light leaking from the lower surface 104 can be reduced. In another embodiment, the blue LED chips 108 in the LED assembly 400a can be replaced with white LED chips, and each white LED chip is basically a blue LED chip with a phosphor layer formed on the surface. In this way, the problem of blue light leakage can be avoided.

Although the LED assemblies 100a and 100b in the previous embodiments both have via holes 107, as part of a circuit, the conductive electrode plates 120 and 118 on the upper and lower surfaces 102 and 104 of the transparent substrate 106 can be used as two parts of the LED assemblies 100a and 100b. The input terminal of the driving power supply, but the present invention is not limited to having a via hole.

FIG. 13 shows a schematic perspective view of an LED assembly 200 according to an embodiment of the present invention. 14 and 15 are a top view and a side view of the LED assembly 200a, respectively. Different from the LED assemblies 100a and 100b, the LED assembly 200a in FIGS. 14 and 15 has conductive electrode plates 118 and 119 formed on the two terminals 114 and 116 of the upper surface 102 of the transparent substrate 106, respectively. In the LED assembly 200 a, the conductive electrode plates 118 and 119 have two terminals 114 and 116 that partially extend out or extend beyond the transparent substrate 106 . Moreover, the LED assembly 200a does not have the via hole 107 . The manufacturing method and steps of the LED device 200 or 200a in Figures 13, 14 and 15 can be inferred with reference to the foregoing description, and thus will not be repeated.

In the LED assembly 200a, there is a single corresponding transparent adhesive layer 132 under each blue LED chip 108, but the invention is not limited thereto. As previously described, in other embodiments, a plurality of blue LED chips 108 may share a transparent adhesive layer 132 , or all blue LED chips 108 may be attached to the transparent substrate 106 only through a transparent adhesive layer 132 .

Figures 16 and 17 show another LED assembly 200b, which is similar to the LED assembly 200a in Figures 14 and 15, but each blue LED chip 108 in Figures 16 and 17 is attached to a primary substrate 160 , and the sub-substrate 160 is fixed on the transparent substrate 106 through the transparent adhesive layer 132 . The details of the LED assembly 200b can be inferred with reference to the LED assembly 100b in FIGS. 8A and 8B and related descriptions, and will not be described again.

Figure 18 shows a side view of another LED assembly 200c. FIG. 19 shows a method of manufacturing the LED device 200c. Fig. 18 is similar to Fig. 17, the top view of Fig. 18 may be similar to that of Fig. 16, and Fig. 19 is similar to that of Fig. 9, and the similarities will not be repeated. Different from FIG. 17 , in FIG. 18 , the conductive electrode plates 118 and 119 are attached to the transparent adhesive layer 132 . In the process method in FIG. 19 , a step 151 is inserted between the steps 150 and 152 , which coats the transparent adhesive layer 132 on the transparent substrate 106 . In other words, the formation of the transparent adhesive layer 132 can be performed before the conductive electrode plates 118 and 119 are attached. The transparent adhesive layer 132 can be epoxy resin or silicone, and is mixed with the same or similar phosphors as in the transparent colloid 112 . For example, the phosphor can be YAG or TAG phosphor.

The LED assemblies 200 b and 200 c in FIGS. 17 and 18 use a single transparent adhesive layer 132 to fix the sub-substrate 160 on the transparent substrate 106 . However, the present invention is not limited to this. In other embodiments, the LED assemblies 200b and 200c can be modified to use the two transparent adhesive layers 132 and 133 shown in FIGS. 8C and 8D to attach the sub-substrate 160 to the transparent substrate 106 . In another embodiment, another transparent adhesive layer 133 may also be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase mutual adhesion.

The lower surfaces 104 of the LED assemblies 200a, 200b and 200c have no patterns at all, and there is no problem of scratches on the lower surfaces 104 at all. The LED components 200a, 200b and 200c can be applied to the application of the full-circumferential light field, and there is no problem of blue light leakage. For example, a bulb can be soldered or a conductive fixture to fix the conductive electrode plates 118 and 119 of the two terminals 114 and 116 in the LED components 200a, 200b or 200c, and at the same time provide the driving power through the two electrode plates. Electrical connection.

FIG. 20 shows a schematic perspective view of an LED assembly 300 according to another embodiment of the present invention. Figures 21A and 21B show top and bottom views of an LED assembly 300a. FIG. 22 shows a cross-sectional view of the LED assembly 300a. Conductive electrode plates 120 and 122 are formed on the two terminals 114 and 116 of the lower surface 104 of the transparent substrate 106 of the LED assembly 300 a, respectively. In Figs. 21A, 21B and 22, the LED assembly 300a has two vias 107A, 107B formed near the terminals 114, 116, respectively. The conductive electrode plate 120 passes through the through hole 107A, and the conductive electrode plate 122 passes through the through hole 107B, and is electrically connected to the blue LED chip 108 on the upper surface 102 . The blue LED chip 108 is disposed and electrically connected between the vias 107A and 107B, and is also disposed and electrically connected between the conductive electrode plates 120 and 122 . The details and possible changes in the LED assembly 300a can be inferred with reference to the descriptions of other embodiments in this specification, and will not be repeated here.

FIG. 23 shows a side view of the LED assembly 300b. The sub-substrate 160 is sandwiched between the blue LED chip 108 and the transparent adhesive layer 132 . The details and possible changes in the LED assembly 300b can be inferred by reference to the descriptions of other embodiments in this specification, and will not be repeated here.

Although in the LED assemblies 200 and 300 , the conductive electrode plates located at the two terminals partially span or extend beyond the two terminals 114 and 116 of the transparent substrate 106 , the invention is not limited thereto. FIG. 24 shows a schematic perspective view of the LED assembly 600 . FIG. 25A shows LED assembly 600a, which is one possible top view of LED assembly 600. FIG. In FIG. 25A , one edge of the conductive electrode plates 118 and 119 is cut flush with the edge of the transparent substrate 106 . FIG. 25B shows LED assembly 600b, which is another possible top view of LED assembly 600. FIG. In FIG. 25B , the conductive electrode plates 118 and 119 are completely seated within the transparent substrate 106 .

FIG. 26A shows an LED bulb 500a with the LED assembly 300 as a core. The LED light bulb 500a has two fixtures 502 . The clamp 502 may be V-shaped or Y-shaped. In one embodiment, the clamp 502 can be rectangular and has a groove for fixing the LED assembly 300 . Each jig 502 is made of a conductive material. The two tips of the jig 502 are used to clamp and fix the conductive electrode plates at the two terminals of the LED assembly 300 , and make the upper surface 102 of the LED assembly 300 face upwards (direction Z). The fixture 502 also electrically connects the conductive electrode plates at both ends of the LED assembly 300 to the Edison socket of the LED bulb 500a, so as to provide the power required for the LED assembly 300 to emit light. FIG. 26B is similar to FIG. 26A, but uses the LED assembly 600 as an LED bulb 500b with a core. Different from the LED bulb 500a, the upper surface 102 of the LED assembly 600 in the LED bulb 500b faces the Y direction, which is substantially perpendicular to the rotation axis (Z direction) of the LED bulb 500b. Of course, the LED components 300 or 600 in Figures 26A and 26B can be replaced with the previously introduced LED components 200. The details and possible changes can be inferred by referring to the descriptions of other embodiments in this specification, and no longer Tired.

The lower surfaces 104 of the LED components 300a and 300b only have large conductive electrode plates 120 and 122 that are not afraid of scratches, and the process yield can be considerably improved. The lower surfaces 104 of the LED assemblies 600a and 600b have no patterns at all, and are not afraid of being scratched. The LED components 300a, 300b, 600a and 600b can be applied to the application of the full-circumferential light field, and there is no problem of blue light leakage.

Although the above embodiments all use the blue LED chip 108 as the light source, the present invention is not limited thereto. In other embodiments, some or all of the LED chips are not blue, but red or green.

Some embodiments of the present invention can emit light in all directions due to the existence of the transparent substrate 106 and the transparent adhesive layer 132 , so it can be applied to the application of all-round light. In some embodiments, all the blue LED chips 108 are substantially covered by the transparent adhesive layer 132 and the transparent gel 112, so there is no blue light leakage problem. The LED assembly in some embodiments can receive power supply and mechanical support at the same time as long as one terminal is fixed; the LED assembly in some embodiments can simultaneously receive power supply from two terminals when two terminals are mechanically fixed; in some embodiments There are no detailed patterns or circuits on the lower surface of the LED components, so it is less afraid of scratches, which can be easily taken or fixed during the manufacturing process and improve the process yield.

The above are only a few embodiments of the present invention, but each embodiment can be referred to, combined or replaced with each other unless they conflict with each other. The scope of the present invention.

100, 100a, 100b, 100c: LED components 102: Upper surface 104: Lower surface 106: Transparent substrate 107, 107A, 107B: Via holes 108, 108a, 108b: blue LED chips 110: welding wire 112: Transparent colloid 114, 116: Terminal 118: Conductive electrode plate 119: Conductive electrode plate 120: Conductive electrode plate 122: Conductive electrode plate 130: Vertical conduction element 131: phosphor layer 132, 133: Transparent adhesive layer 148, 150, 151, 152, 154, 154a, 155, 155a, 156, 157, 158: Steps 160: Sub-substrate 180: Lampshade 182: Cooling mechanism 183: Electrical connection mechanism 190: Solder 192: circuit board 194: Metal clip 200, 200a, 200b, 200c: LED components 300, 300a, 300b: LED components 400, 400a, 400b: LED components 402: Conductive strip 500a, 500b: LED bulbs 502: Fixtures 600, 600a, 600b: LED components

FIG. 1 is a three-dimensional schematic diagram of an LED assembly according to an embodiment of the present invention.

Figure 2A shows a top view of the LED assembly 100a.

Figure 2B shows a bottom view of the LED assembly 100a.

Figures 3A and 3B show schematic cross-sectional views of AA and BB in Figure 2A, respectively.

FIG. 4 shows the LED assembly 100 disposed in a light bulb.

Figure 5A shows the LED assembly 100 being secured with solder.

Figure 5B shows the LED assembly 100 being secured with metal clips.

Figure 6 shows a process method for forming the LED components of Figures 3A and 3B.

FIGS. 7A and 7B show a top view and a bottom view of the LED assembly 100b, respectively.

Figures 8A and 8B show schematic cross-sections AA and BB in Figure 7A.

8C and 8D show two cross-sectional views of the LED device 100c.

FIG. 9 shows the manufacturing method of the LED device 100b.

FIG. 10 is a schematic perspective view of a light emitting diode assembly 400 according to an embodiment of the present invention.

Figures 11A and 11B show top and bottom views of the LED assembly 400a.

12A and 12B respectively show schematic cross-sectional views along AA and BB of the LED assembly 400a in FIG. 11A.

Figure 12C shows another LED assembly 400b.

FIG. 13 shows a schematic perspective view of the LED assembly 200 .

14 and 15 are a top view and a side view of the LED assembly 200a, respectively.

Figures 16 and 17 show another LED assembly 200b. Figure 18 shows another LED assembly 200c.

FIG. 19 shows a method of manufacturing the LED device 200c.

FIG. 20 shows a schematic perspective view of an LED assembly 300 according to another embodiment of the present invention.

Figures 21A and 21B show top and bottom views of an LED assembly 300a.

FIG. 22 shows a cross-sectional view of the LED assembly 300a.

FIG. 23 shows a side view of the LED assembly 300b.

FIG. 24 shows a schematic perspective view of the LED assembly 600 .

Figures 25A and 25B show top views of LED assemblies 600a and 600b.

Figures 26A and 26B show two LED light bulbs with LED assemblies 300 and 600 as the core, respectively.

100a: LED Components

102: Upper surface

104: Lower surface

106: Transparent substrate

107: Via hole

108, 108b: blue LED chip

110: welding wire

112: Transparent colloid

114, 116: Terminal

118: Conductive electrode plate

120: Conductive electrode plate

130: Vertical conduction element

132: Transparent adhesive layer

Claims (10)

A light bulb, comprising: a light emitting diode assembly, comprising: a substrate having a first surface facing opposite directions, a second surface, and a first surface or both ends of the second surface a first terminal and a second terminal; a plurality of light-emitting diode chips fixed on the first surface; a plurality of circuits electrically connected to the plurality of light-emitting diode chips; a transparent colloid containing a first fluorescent powder, disposed on the first surface, covering the plurality of light-emitting diode chips and the plurality of circuits; a transparent adhesive layer located between the substrate and the plurality of light-emitting diode chips; and a first electrode a board, disposed on the first surface, partially straddling or extending beyond the first terminal, and electrically connected to the plurality of light-emitting diode chips through the plurality of lines, serving as a power input for the light-emitting diode element wherein, at least one of the plurality of lines has two ends, and the two ends are directly connected with two adjacent light-emitting diode chips among the plurality of light-emitting diode chips; wherein, the transparent adhesive layer extends to the between the first electrode plate and the base plate; a fixture, connected with the first electrode plate; and a lamp socket, electrically connected to the first electrode plate through the fixture. The light bulb of claim 1, wherein the substrate is a transparent substrate comprising sapphire, ceramic material, silicon carbide, or diamond-like carbon. The light bulb of claim 1, wherein the transparent adhesive layer comprises a second phosphor. The light bulb of claim 1, wherein the transparent adhesive layer comprises a plurality of transparent adhesive layers separated from each other, and the plurality of light emitting diode chips are disposed on the plurality of transparent adhesive layers in a one-to-one manner. The light bulb of claim 1, wherein the transparent adhesive layer comprises a single transparent adhesive layer, and all the plurality of light emitting diode chips are disposed on the single transparent adhesive layer. The light bulb as claimed in claim 1, wherein the transparent colloid covers the top and the periphery of the plurality of light-emitting diode chips. The light bulb of claim 1, further comprising a primary substrate disposed between the plurality of light-emitting diode chips and the transparent adhesive layer. The light bulb according to claim 1, wherein, in a cross section, the thickness of the first electrode plate is greater than that of the transparent adhesive layer. The light bulb of claim 1, wherein the plurality of circuits comprise at least one bonding wire, which is electrically connected to two of the plurality of light-emitting diode chips. The light bulb of claim 1, wherein the transparent colloid completely surrounds the plurality of wires.

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