TW201946295A - Light-emitting diode assembly - Google Patents

Abstract

An LED assembly includes a substrate, an LED chips, a first electrode and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The LED chip and the first electrode are formed on the first surface. The second electrode is formed on the second surface. In a cross-sectional view, the first electrode and the second electrode have different length.

Description

Light-emitting diode assembly

Embodiments of the invention relate to a light emitting diode (LED) device and manufacturing method, and more particularly to an LED device capable of providing a full-circumferential light field and a related manufacturing method.

At present, you can see the application of a variety of LED products, such as traffic lights, vehicle headlights, street lights, computer indicators, flashlights, LED backlights, and so on. Except for the front-end wafer manufacturing process, these products almost have to go through the back-end packaging process.

The main function of the LED package is to provide the necessary support for LED chip electricity, light and heat. If a semiconductor product such as an LED wafer is exposed to the atmosphere for a long time, it will be affected by water vapor or chemicals in the environment and aging, resulting in degradation of characteristics. In LED packaging, epoxy resin is often used to coat the LED chip to effectively isolate the atmosphere. In addition, in order to achieve the goal of brighter and more power-efficient, LED packages also need to have good heat dissipation and light extraction efficiency. If the heat generated when the LED chip emits light is not dissipated in time, the heat accumulated in the LED chip will adversely affect the characteristics, life and reliability of the element. Optical design is also an important part of the LED packaging process. How to lead light more effectively, the angle of light emission and the direction are all important points in the design.

In addition to the thermal issue, white LED packaging technology also needs to consider issues such as color temperature, color rendering index, and phosphor. Moreover, if the white LED uses a blue LED chip with yellow-green phosphor, the shorter the wavelength of the blue light, the greater the harm to the human eye. Therefore, it is necessary to effectively block the blue light in the packaging structure to avoid the leakage of blue light.

In order for LED products to be competitive in the market, how to make LED packaging process stable, low cost, and high yield is also the goal pursued by LED packaging.

A light emitting diode assembly includes: a substrate, a light emitting diode wafer, a first electrode, and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The light emitting diode wafer and the first electrode are located on the first surface. The second electrode is formed on the second surface and is electrically connected to the first electrode. In a section, the first electrode and the second electrode have different lengths.

FIG. 1 is a schematic perspective view of a light-emitting diode (LED) component 100 according to an embodiment of the present invention. The LED assembly 100 includes a transparent substrate 106. In one embodiment, it is a non-conductive glass substrate. The transparent substrate 106 has an upper surface 102 and a lower surface 104 that face opposite directions. As shown in FIG. 1, the transparent substrate 106 is substantially in a long shape and has two terminals 114 and 116. In this specification, transparent is only used to indicate that light can be transmitted, and it may be completely transparent or translucent, or semitransparent. In another embodiment, the material of the transparent substrate 106 may be sapphire, silicon carbide, or diamond-like carbon.

FIG. 2A shows a top view of the LED assembly 100a. Please also refer to Figure 1. On the upper surface 102, a plurality of blue light LED chips 108 are fixed, and the lines are electrically connected to each other through a bonding wire 110. Each blue light LED chip 108 can be a single LED with a forward voltage of about 2 ~ 3V (hereinafter referred to as a "low voltage chip"), or it can have several light emitting diodes connected in series and the forward voltage is greater than low. Voltage chip, such as 12V, 24V, 48V, etc. (hereinafter referred to as "high voltage chip"). Specifically, unlike the wire bonding method, a high-voltage wafer is formed by a semiconductor process on a common substrate to form a plurality of light-emitting diode units (that is, a light-emitting diode structure having at least a light-emitting layer) electrically connected to each other. The common substrate may be a long-crystalline substrate or a non-long-crystalline substrate. In FIGS. 1 and 2A, the blue LED chips 108 are arranged in two rows along two sides of one of the longitudinal axes of the two terminals 114 and 116 connecting the transparent substrate 106, and are connected in series with each other by bonding wires 110. In this way, it becomes equivalent to a high forward voltage light-emitting diode. However, the present invention is not limited to this. In other embodiments, the blue LED chips 108 on the upper surface 102 can be arranged in an arbitrary pattern, and the electrical connections between the blue LED chips 108 can be in series, in parallel, or in series and parallel hybrid, Or bridge connection.

As shown in FIG. 2A, the transparent substrate 106 has a via hole 107 near the terminal 114. The via hole 107 has a through hole that penetrates the transparent substrate 106 directly to the upper surface 102 and the lower surface 104, and a conductive object is formed to fill the via hole or only cover the inner wall of the via hole to form the via hole 107. The conductive material in the through hole can provide electrical connection between the two ends of the through hole 107. A conductive electrode plate 118 is provided near the upper surface 102 of the terminal 114. The conductive electrode plate 118 does not directly contact the via hole 107, that is, does not directly contact the conductive objects in the via hole. One of the blue LED chips 108 (designated as 108 a) near the terminal 114 is electrically connected to the conductive electrode plate 118 by a bonding wire 110. One of the blue LED chips 108 (designated as 108b) near the terminal 114 is electrically connected to the via hole 107 with another bonding wire 110.

All the bonding wires 110 and the blue LED chips 108 on the upper surface 102 are covered by the transparent gel 112, which is used to prevent the aging and the possible damage of the bonding wires 110 and the blue LED chips 108 from atmospheric moisture or chemicals. damage. The main component of the transparent colloid 112 may be an epoxy resin or a silicone. The transparent colloid 112 contains at least one kind of phosphor, which can be excited by part of the blue light emitted by the blue LED chip 108 (for example, its wave peak is 430nm-480nm), and generates yellow light (for example, its wave peak is 570nm-590nm ) Or yellow-green light (for example, its peak value is 540nm-570nm). When the yellow or yellow-green light is properly mixed with the remaining blue light, the human eye will treat it as white light. Figure 1 is just a schematic. In one example, the LED assembly 100 in FIG. 1 may not be able to see the bonding wire 110 and the blue LED chip 108 under the transparent colloid 112 because of the fluorescent powder in the transparent colloid 112 as shown in FIG. 1.

FIG. 2B shows a bottom view of the LED assembly 100a. As shown in FIG. 2B, no LED chip is disposed on the lower surface 104. On the lower surface 104 close to the terminal 114, another conductive electrode plate 120 is provided, a part of which overlaps with the via hole 107, and directly contacts the conductive objects in the via hole to be electrically connected to each other. However, in another embodiment, the conductive electrode plate 120 may not be directly connected to the via hole 107, but may be electrically connected to the via hole 107 through another conductor, such as a bonding wire 110. On the lower surface 104 near the terminal 116, another conductive electrode plate 122 may be selectively provided. Such a design can make the conductive electrode plate 122 and the conductive electrode plate 120 coplanar, thereby the LED assembly 100a can be placed relatively stably and can avoid damage caused by falling over during transportation or handling. In this embodiment, the conductive electrode plate 122 may be a floating connection on the circuit, and is not electrically connected to any electronic component, circuit, or other electrode plate in the LED component 100a, because its main purpose is to enable the LED component 100a to Place it smoothly.

As shown in the embodiment of FIGS. 2A and 2B, the boundary between the conductive electrode plates 120 and 118 is located within the lower surface 104 and the upper surface 102, that is, substantially does not exceed the boundary between the lower surface 104 and the upper surface 102. The shapes of the conductive electrode plates 120, 118, and 122 need not be approximately rectangular, and the sizes need not be substantially the same. In another embodiment, one of the conductive electrode plates 120 and 118 is substantially rectangular, and the other is substantially circular to facilitate identification of the positive and negative electrodes of the LED assembly 100a.

From an electrical point of view, the blue LED chip 108 and the via hole 107 are connected in series between the conductive electrode plates 120 and 118. The conductive electrode plates 120 and 118 can be used as two power input terminals of the LED assembly 100a. A positive power terminal and a negative power terminal of a driving power source (not shown) can be electrically connected to the conductive electrode plates 120 and 118, respectively, to drive the blue LED chip 108 to make it emit light.

FIG. 3A is a schematic cross-sectional view taken along the line AA of the LED assembly 100a in FIG. 2A; and FIG. 3B is a schematic cross-sectional view taken along the line BB of the LED assembly 100a in FIG. 2A.

Similar to the previous description, in FIG. 3A, the blue LED chip 108b is electrically connected to the via hole 107 through a bonding wire 110, which is connected to the conductive electrode plate 120 on the lower surface 104. In FIG. 3B, the blue LED The chip 108 a is electrically connected to the conductive electrode plate 118 on the upper surface 102 through another bonding wire 110. FIG. 4 shows that the LED assembly 100 is disposed in a light bulb. The light bulb includes a lamp cover 180, the LED assembly 100, a circuit board 192, a heat dissipation mechanism 182, and an electrical connection mechanism 183 (eg, an Edison lamp holder). The terminal 114 of the LED assembly 100 is fixed on the circuit board 192; the circuit board 192 is connected to the heat dissipation mechanism 182, and is used to connect the tropical light bulb generated by the LED assembly 100; the electrical connection mechanism 183 is connected to the heat dissipation mechanism 182. Because the conductive electrode plates 120 and 118 for driving the blue LED chip 108a are located on the upper surface 102 and the lower surface 104 of the same terminal 114 side of the transparent substrate 106, respectively, the conductive electrode plate 120 and 118 is soldered to a circuit board at the same time, as shown in Figure 5A. Solder 190 can not only provide the electrical connection of the driving power to make the LED component 100 emit light, but also provide mechanical support to the terminal 114, so that the LED component 100 stands vertically on the circuit board 192 and emits light to the surroundings, which can provide full ambient light. field. In FIG. 5A, the LED assembly 100 is supported by the solder 190 mechanism, and can stand on the circuit board 192 substantially vertically. The circuit board 192 supplies power to the LED assembly 100 through the solder 190 at the same time. FIG. 5B is a clip made of a metal clip 194, which clamps the LED assembly 100 and fixes it to the circuit board 192 approximately vertically. The metal clip 194 provides two functions of power supply and mechanism fixing at the same time, which can also reduce the complexity and cost of the production process. However, the LED component 100 can also be inserted obliquely on the circuit board 192 in a non-vertical manner.

In the embodiment of FIG. 3A, a vertical conducting element 130 may be provided at the position of the via hole 107 on the upper surface 102 as an electrical connection between the via hole 107 and a bonding wire 110. For example, the vertical conducting element 130 is a pn junction diode (for example, a vertical light emitting diode, a Schottky diode, or an zener diode), a resistor, or a metal block, which is made of conductive silver. Adhesive is adhered to the via hole 107. In another embodiment, the vertical conductive element 130 and the conductive silver paste may be omitted, and a bonding wire 110 may directly contact the conductive hole 107 to generate an electrical connection.

In FIGS. 3A and 3B, a transparent adhesive layer 132 is disposed under each blue LED chip 108 to fix the blue LED chip 108 on the upper surface 102 of the transparent substrate 106. In FIGS. 3A and 3B, each of the blue LED chips 108 has a corresponding transparent adhesive layer 132 under a one-to-one relationship with each other, but the present invention is not limited thereto. In one embodiment, there are several transparent adhesive layers 132 on the upper surface 102, and several blue LED chips 108 are adhered on each transparent adhesive layer 132. In another embodiment, there is only a single transparent adhesive layer on the upper surface 102. 132, on which all the blue LED chips 108 are carried. The larger the area of the transparent adhesive layer 132 is, the better the heat dissipation effect is on the blue LED chip 108 thereon, but it may have the disadvantage that the greater the stress caused by the difference in thermal expansion coefficient. Therefore, the area of the transparent adhesive layer 132 and the number of blue LED chips 108 to be carried may depend on the actual application. In one embodiment, the transparent adhesive layer 132 is mixed with some thermal conductive particles with high thermal conductivity, such as alumina powder, diamond-like carbon, or silicon carbide (SiC), and the thermal conductivity is greater than 20 W / mK, in addition to improving the heat dissipation effect, can also have the effect of light scattering.

In FIGS. 3A and 3B, the material of the transparent adhesive layer 132 may be, for example, epoxy resin or silicone, and is mixed with the same, similar, or different materials from the transparent colloid 112. Fluorescent powder. For example, the phosphor can be YAG or TAG phosphor. As described previously, the transparent colloid 112 with fluorescent powder covers the periphery and the top of the bonding wire 110 and the blue LED chip 108, and the transparent adhesive layer 132 is located below the blue LED chip 108. In other words, each blue LED chip 108 is not only sandwiched by the transparent colloid 112 and the transparent adhesive layer 132, but is also substantially completely surrounded by a transparent capsule formed by the transparent colloid 112 and the transparent adhesive layer 132. . The blue light emitted by the blue light LED chip 108 is either converted into yellow-green light by the phosphor or mixed with yellow-green light. Therefore, the LED module 100a in FIGS. 3A and 3B can prevent the problem of blue light leaking out.

FIG. 6 shows a process for forming the LED assembly 100a in FIGS. 3A and 3B. First, a transparent substrate 106 is provided. Via holes 107 are formed in advance on the transparent substrate 106 (step 148). For example, a through hole can be melted out of the transparent substrate 106 made of glass with laser light, and then a conductive object is filled in the through hole to form the through hole 107. Step 150 pre-cuts the transparent substrate 106. Some grooves are formed on the transparent substrate 106 first, and the positions of each LED component 100 on the transparent substrate 106 are roughly defined in advance to facilitate subsequent cutting. In step 152, the conductive electrode plates 118 and 120 are respectively attached to the transparent substrate 106 near the upper surface 102 and the lower surface 104 of the terminal 114. If there is a conductive electrode plate 112, it is also formed on the transparent substrate 106 in step 152. In another embodiment, the conductive electrode plate is formed on the upper surface 102 or the lower surface 104 by printing. In step 154, a transparent adhesive layer 132 with phosphor is formed on the upper surface 102, and its position is first designed to place the blue LED chip 108 thereon. For the method for forming the transparent adhesive layer 132, for example, the transparent adhesive layer 132 may be formed on the upper surface 102 by means of dispensing, printing, or spraying.

Step 155 fixes the blue LED chip 108 on the transparent adhesive layer 132. For example, a vacuum nozzle can be used to suck the blue LED chip 108 from the blue tape and place it on the transparent adhesive layer 132. The placement position of the blue LED chip 108 is preferably completely surrounded by the periphery of a transparent adhesive layer 132, that is, the area of the transparent adhesive layer 132 is larger than the area of the blue LED chip 108 to avoid the problem of blue light leakage. At this time, the vertical conductive element 130 may be adhered to the conductive hole 107 of the upper surface 102 with conductive silver glue. Step 156 forms a bonding wire 110, which electrically connects one blue LED chip 108 to another blue LED chip 108, the blue LED chip 108a to the conductive electrode plate 118, and the blue LED chip 108b to the vertical conduction element 130. In step 157, a transparent colloid 112 having a fluorescent powder can be formed on the upper surface 102 by dispensing or printing, so as to cover the bonding wire 110 and the blue LED chip 108. In step 158, the LED components 100 can be separated from each other along the previously formed grooves by manual cracking or machine cutting.

It can be known from the manufacturing method of FIG. 6 that during the formation of the LED component, except for forming the conductive electrode plate 120 or 122 on the lower surface 104, the other steps are generally performed on the upper surface 102. Because the lower surface 104 has only a large area such as a conductive electrode plate and is not easily scratched, the process carrier can be used to hold or hold the lower surface 104 to carry or fix the transparent substrate 106 to avoid The delicate structure on the upper surface 102 is damaged by mechanical stress such as friction and scratch. Process yield can be improved considerably.

In the embodiments in FIGS. 3A, 3B, and 6, the light emitting direction of the blue LED chip 108 is not limited in any way. For the lower part, the blue LED chip 108 can provide mixed light through the transparent adhesive layer 132 and the transparent substrate 106; for the surroundings and above, through the transparent colloid 112, the blue LED chip 108 can also provide mixed light. Therefore, the LED assembly 100a can be regarded as a light emitting element capable of providing six-sided light emission, and the light bulb with the LED assembly 100 in FIG. 4 can be regarded as an Omnidirectional lighting device.

In FIGS. 2A, 2B, 3A, and 3B, the blue LED chip 108 is directly adhered to the transparent substrate 106 with a transparent adhesive layer 132, but the present invention is not limited thereto. 7A and 7B respectively show an upper view and a lower view of the LED assembly 100b in another embodiment. The cross-sectional views of the second LED module 100b are shown in FIGS. 8A and 8B. FIG. 9 shows a manufacturing method of the LED assembly 100b. Figures 7A, 7B, 8A, 8B, and 9 are similar to and corresponding to Figures 2A, 2B, 3A, 3B, and 6, respectively, where the same symbols or symbols correspond to components, devices, or steps that are similar or identical Element, device or step. For brevity, explanations may be omitted in this specification.

Different from FIG. 2A, FIG. 7A has a submount 160 placed inside the periphery of the transparent adhesive layer 132 and sandwiched between the blue LED chip 108 and the transparent adhesive layer 132. The material of the sub substrate 160 may be transparent glass, sapphire, silicon carbide, or diamond-like carbon. Different from FIGS. 3A and 3B, some or all of the blue LED chips 108 in FIGS. 8A and 8B are fixed on the sub substrate 160, and the sub substrate 160 is fixed on the transparent substrate 106 with a transparent adhesive layer 132. .

In FIG. 9, steps 154a and 155a replace steps 154 and 155 in FIG. 6, respectively. Step 154a fixes the sub-substrate 160 on the transparent substrate 106 with a transparent adhesive layer 132 having fluorescent powder. In one embodiment, the transparent adhesive layer 132 is formed on the back surface of the sub substrate 160 first, and then the sub substrate 160 is attached to the transparent substrate 106. In another embodiment, the transparent adhesive layer 132 is coated on the transparent substrate first. On the upper surface 102 of 106, the sub-substrate 160 is then attached to the transparent adhesive layer 132. In step 155a, the blue LED chip 108 is then fixed on the sub substrate 160.

In the embodiments in FIGS. 7A, 7B, 8A, 8B, and 9, the blue LED chip 108 can be fixed on the sub-substrate 160 by using the same material as the transparent adhesive layer 132 or a similar material. However, the present invention is not limited to this. In one embodiment, the blue LED chip 108 may be fixed on the sub-substrate 160 with a transparent glue or eutectic metal containing no fluorescent powder. In another embodiment, conductive strips are printed on the sub-substrate 160, and the blue LED chip 108 is fixed on the flip-chip method, so step 156 in FIG. 9 may be omitted. However, The blue LED chip 108b still needs to be electrically connected to the via hole 107 through the bonding wire 100; and the blue LED chip 108a also needs to be electrically connected to the conductive electrode plate 118 through the bonding wire 100. In another embodiment, the blue LED chip 108 is fixed on the sub substrate 160 by an anisotropic conductive film (ACF).

The LED assembly 100b in FIGS. 7A, 7B, 8A, 8B, and 9 enjoys the same benefits as the LED assembly 100a in FIGS. 2A, 2B, 3A, 3B, and 6. For example, the terminal 114 of the LED component 100b can be fixed on a circuit board with solder alone and provide electrical connection of the driving power at the same time; the lower surface 104 of the LED component 100b is less afraid of scratches, and the process yield can be effectively improved The LED component 100b can be applied to a full-circumference lighting device; the LED component 100b can reduce or eliminate the problem of blue light leakage.

FIG. 8C and FIG. 8D show cross-sectional views of the LED module 100c bis, which are deformations of FIGS. 8A and 8B, respectively. In the LED device 100b (in FIGS. 8A and 8B), a single transparent adhesive layer 132 is used to fix the sub substrate 160 on the transparent substrate 106. Different from the LED assembly 100b, the LED assembly 100c (as shown in FIGS. 8C and 8D) uses two transparent adhesive layers 132 and 133 to fix the sub substrate 160 on the transparent substrate 106. At least one of the transparent adhesive layers 132 and 133 includes a phosphor. In the embodiments shown in FIGS. 8C and 8D, the transparent adhesive layer 132 has a fluorescent powder, and the transparent adhesive layer 133 does not. The material of the transparent adhesive layer 133 may be, for example, epoxy resin or silicone. Because the transparent adhesive layer 133 has no fluorescent powder, it can provide a relatively good adhesive effect and be adhered to the transparent substrate 106. The transparent adhesive layers 132 and 133 may be the same or different materials. In another embodiment, another transparent adhesive layer 133 may be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase mutual adhesion.

The blue LED chips 108 in the light emitting diode module 100 in FIG. 1 are electrically connected to each other through the bonding wires 110, but the present invention is not limited thereto. FIG. 10 is a three-dimensional schematic view of a light-emitting diode assembly 400 according to an embodiment of the present invention. The blue LED chip 108 is fixed on the upper surface 102 by a flip-chip method. 11A and 11B show an upper view and a lower view of the LED module 400a. FIG. 12A is a schematic cross-sectional view taken along the line AA of the LED assembly 400a in FIG. 11A; and FIG. 12B is a schematic cross-sectional view taken along the line BB of the LED assembly 400a in FIG. 11A. Figures 10, 11A, 11B, 12A, and 12B are similar to and corresponding to Figures 1, 2A, 2B, 3A, and 3B, respectively, where the same symbols or symbols correspond to components, devices, or steps that are similar or identical. Element, device or step. For brevity, explanations may be omitted in this specification.

Figures 12A and 12B are different from Figures 3A and 3B. In Figures 12A and 12B, conductive stripes 402 are printed on the transparent substrate 106, and the blue LED chips 108 are electrically connected to each other through the conductive stripes 402. connection. Therefore, the blue LED chip 108 in FIG. 12A and FIG. 12B can emit light to the surroundings and the upper and lower sides. Therefore, the LED assembly 400a can be regarded as a light emitting element that can provide six-sided light emission. FIG. 12C shows another LED component 400b, in which a fluorescent layer 131 is coated on the lower surface 104. The fluorescent layer 131 has a fluorescent powder, which can convert the light emitted by the blue LED chip 108 into another color. Light. As such, the chance of blue light leaking from the lower surface 104 can be reduced. In another embodiment, the blue LED chip 108 in the LED assembly 400a may be replaced with a white LED chip, and each white LED chip is basically a blue LED chip with a fluorescent layer formed on the surface. In this way, the problem of blue light leakage can be avoided.

Although the LED components 100a and 100b in the previous embodiment both have through holes 107, as part of a circuit, the conductive electrode plates 120 and 118 on the upper and lower surfaces 102 and 104 of the transparent substrate 106 can be used as the second components of the LED components 100a and 100b. The driving power input terminal, but the present invention is not limited to having a through hole.

FIG. 13 is a schematic perspective view of an LED assembly 200 according to an embodiment of the present invention. 14 and 15 are a top view and a side view of the LED assembly 200a, respectively. Different from the LED assemblies 100a and 100b, the LED assemblies 200a in FIGS. 14 and 15 are formed with conductive electrode plates 118 and 119 on the two terminals 114 and 116 on the upper surface 102 of the transparent substrate 106, respectively. In the LED assembly 200 a, the conductive electrode plates 118 and 119 partially extend or extend beyond the two terminals 114 and 116 of the transparent substrate 106. Moreover, the LED module 200a does not have a via hole 107. The manufacturing methods and steps of the LED components 200 or 200a in Figs. 13, 14 and 15 can be inferred by referring to the foregoing description, and will not be repeated here.

In the LED component 200a, there is a single corresponding transparent adhesive layer 132 under each blue LED chip 108, but the present invention is not limited thereto. As described previously, in other embodiments, many blue LED chips 108 may share a transparent adhesive layer 132, or all the blue LED chips 108 may be adhered to the transparent substrate 106 only through a transparent adhesive layer 132.

16 and 17 show another LED assembly 200b, which is similar to the LED assembly 200a in FIGS. 14 and 15, but each of the blue LED chips 108 in FIGS. 16 and 17 is fixed to a primary substrate 160, and the sub substrate 160 is fixed on the transparent substrate 106 through the transparent adhesive layer 132. The details in the LED component 200b can be inferred by referring to the LED component 100b in FIG. 8A and FIG. 8B and related descriptions, and will not be described again.

FIG. 18 shows a side view of another LED assembly 200c. FIG. 19 shows a manufacturing method of the LED assembly 200c. Figure 18 is similar to Figure 17, the top view of Figure 18 may be similar to Figure 16, and Figure 19 is similar to Figure 9, and the same points are not repeated. Different from FIG. 17, in FIG. 18, the conductive electrode plates 118 and 119 are attached to the transparent adhesive layer 132. In the manufacturing method in FIG. 19, step 151 is inserted between steps 150 and 152, and a transparent adhesive layer 132 is coated on the transparent substrate 106. In other words, the formation of the transparent adhesive layer 132 can be performed before the conductive electrode plates 118 and 119 are attached. The transparent adhesive layer 132 may be epoxy resin or silicone, and is mixed with the same or similar fluorescent powder as the transparent colloid 112. For example, the phosphor can be YAG or TAG phosphor.

The LED components 200 b and 200 c in FIGS. 17 and 18 use a single transparent adhesive layer 132 to fix the sub-substrate 160 on the transparent substrate 106. However, the present invention is not limited to this. In other embodiments, the LED components 200b and 200c may be modified, and the two sub-layers 160 and 133 in the 8C and 8D diagrams are used to fix the sub-substrate 160 on the transparent substrate 106. In another embodiment, another transparent adhesive layer 133 may be formed between the sub-substrate 160 and the transparent adhesive layer 132 to increase mutual adhesion.

The lower surfaces 104 of the LED components 200a, 200b, and 200c have no pattern at all, and there is no problem of scratching the lower surface 104 at all. The LED components 200a, 200b and 200c can be applied to the application of the entire ambient light field, and there is no blue light leakage problem. For example, a light bulb can use solder or a conductive fixture to fix the LED components 200a, 200b, or 200c, and the conductive electrode plates 118 and 119 located at the two terminals 114 and 116, and provide driving power through the two electrode plates at the same time. Electrical connection.

FIG. 20 is a schematic perspective view of an LED assembly 300 according to another embodiment of the present invention. 21A and 21B show an upper view and a lower view of an LED assembly 300a. FIG. 22 shows a cross-sectional view of the LED module 300a. On the two ends 114 and 116 of the lower surface 104 of the transparent substrate 106 of the LED assembly 300a, conductive electrode plates 120 and 122 are formed, respectively. In FIGS. 21A, 21B, and 22, the LED module 300a has two through holes 107A and 107B formed at positions close to the terminals 114 and 116, respectively. The conductive electrode plate 120 passes through the via hole 107A, and the conductive electrode plate 122 passes through the via hole 107B, and is electrically connected to the blue LED chip 108 on the upper surface 102. The blue LED chip 108 is disposed and electrically connected between the through holes 107A and 107B, and is also disposed and electrically connected between the conductive electrode plates 120 and 122. The details and possible changes in the LED component 300a can be deduced by referring to the descriptions of other embodiments in this specification, and will not be repeated here.

FIG. 23 shows a side view of the LED module 300b. The sub-substrate 160 is sandwiched between the blue LED chip 108 and the transparent adhesive layer 132. The details and possible changes in the LED component 300b can be inferred by referring to the descriptions of other embodiments in this specification, and will not be repeated here.

Although in the LED assemblies 200 and 300, the conductive electrode plates located at the two terminals partially extend or extend beyond the two terminals 114, 116 of the transparent substrate 106, the present invention is not limited thereto. FIG. 24 is a schematic perspective view of the LED assembly 600. Figure 25A shows the LED assembly 600a, which is a possible top view of the LED assembly 600. In FIG. 25A, both sides of the conductive electrode plates 118 and 119 are aligned with the edge of the transparent substrate 106. Figure 25B shows the LED assembly 600b, which is another possible top view of the LED assembly 600. In FIG. 25B, the conductive electrode plates 118 and 119 are completely located inside the transparent substrate 106.

FIG. 26A shows an LED light bulb 500a with the LED assembly 300 as a lamp core. The LED bulb 500a has two fixtures 502. The clamp 502 may be a V-shape or a Y-shape. In one embodiment, the clamp 502 may be rectangular and has a groove for fixing the LED component 300. Each of the clamps 502 is made of a conductive object. The two ends of the clamp 502 are used to clamp the conductive electrode plates that fix the two terminals of the LED assembly 300, and the upper surface 102 of the LED assembly 300 faces upward (direction Z). The clamp 502 also electrically connects the conductive electrode plates at both ends of the LED assembly 300 to the Edison socket of the LED bulb 500a to provide the power required for the LED assembly 300 to emit light. FIG. 26B is an LED light bulb 500b similar to FIG. 26A, but with the LED assembly 600 as a lamp core. Different from the LED bulb 500a, the upper surface 102 of the LED assembly 600 in the LED bulb 500b faces the Y direction, and is substantially perpendicular to the rotation axis (Z direction) of the LED bulb 500b. Of course, the LED components 300 or 600 in FIGS. 26A and 26B can be replaced with the LED components 200 described previously. For details and possible changes, refer to the description of other embodiments in this specification and infer that Tired.

The lower surfaces 104 of the LED components 300a and 300b only have large-area conductive electrode plates 120 and 122 that are not afraid of scratches, and the process yield can be improved considerably. The lower surfaces 104 of the LED components 600a and 600b have no pattern at all, and are not afraid of scratching. The LED components 300a, 300b, 600a, and 600b can be applied to the application of the entire ambient light field, and there is no blue light leakage problem.

Although the above embodiments all use the blue LED chip 108 as a light source, the present invention is not limited thereto. In other embodiments, some or all of the LED chips are not blue light, but red or green light.

In some embodiments of the present invention, the presence of the transparent substrate 106 and the transparent adhesive layer 132 can emit light in all directions, so it can be applied to all-round light applications. In some embodiments, all the blue LED chips 108 are substantially wrapped by the transparent adhesive layer 132 and the transparent colloid 112, so there is no blue light leakage problem. In some embodiments, the LED component can receive power supply and mechanism support at the same time as long as one terminal is fixed. In some embodiments, the LED component can receive power supply from both terminals at the same time when the two terminals are mechanically fixed; in some embodiments, The lower surface of the LED component does not have a detailed pattern or circuit, so it is less afraid of scratches, which can be easily taken or fixed during the manufacturing process, which improves the process yield.

The above descriptions are only a few embodiments of the present invention, but the respective embodiments can be referred to, merged or replaced with each other without conflicting with each other. All equal changes and modifications made in accordance with the scope of the patent application of the present invention should be The scope of the invention.

100, 100a, 100b, 100c‧‧‧LED components

102‧‧‧ Top surface

104‧‧‧ lower surface

106‧‧‧ transparent substrate

107, 107A, 107B‧‧‧via

108, 108a, 108b ‧‧‧ Blue LED Chip

110‧‧‧ welding wire

112‧‧‧ transparent colloid

114, 116‧‧‧ Terminal

118‧‧‧Conductive electrode plate

119‧‧‧Conductive electrode plate

120‧‧‧Conductive electrode plate

122‧‧‧Conductive electrode plate

130‧‧‧Vertical Conduction Element

131‧‧‧Fluorescent layer

132, 133‧‧‧ transparent adhesive layer

148, 150, 151, 152, 154, 154a, 155, 155a, 156, 157, 158‧‧‧ steps

160‧‧‧times substrate

180‧‧‧ Lampshade

182‧‧‧Cooling mechanism

183‧‧‧Electrical connection mechanism

190‧‧‧solder

192‧‧‧Circuit Board

194‧‧‧metal clip

200, 200a, 200b, 200c‧‧‧LED components

300, 300a, 300b‧‧‧LED components

400, 400a, 400b‧‧‧LED components

402‧‧‧Conductive strip

500a, 500b‧‧‧LED bulb

502‧‧‧Fixture

600, 600a, 600b‧‧‧LED components

FIG. 1 is a schematic perspective view of an LED component according to an embodiment of the present invention.

FIG. 2A shows a top view of the LED assembly 100a.

FIG. 2B shows a bottom view of the LED assembly 100a.

Figures 3A and 3B show schematic cross-sections of AA and BB in Figure 2A, respectively.

FIG. 4 shows that the LED assembly 100 is disposed on a light bulb.

FIG. 5A shows that the LED module 100 is fixed with solder.

FIG. 5B shows that the LED module 100 is fixed by a metal clip.

FIG. 6 shows a manufacturing method for forming the LED components in FIGS. 3A and 3B.

7A and 7B show an upper view and a lower view of the LED assembly 100b, respectively.

Figures 8A and 8B show schematic cross-sections of AA and BB in Figure 7A.

8C and 8D show cross-sectional views of the LED assembly 100c.

FIG. 9 shows a manufacturing method of the LED assembly 100b.

FIG. 10 is a schematic perspective view of a light emitting diode assembly 400 according to an embodiment of the present invention.

11A and 11B show an upper view and a lower view of the LED module 400a.

12A and 12B are schematic cross-sectional views taken along AA and BB of the LED module 400a in FIG. 11A, respectively.

FIG. 12C shows another LED assembly 400b.

FIG. 13 is a schematic perspective view of the LED assembly 200.

14 and 15 are a top view and a side view of the LED assembly 200a, respectively.

16 and 17 show another LED assembly 200b. Figure 18 shows another LED assembly 200c.

FIG. 19 shows a manufacturing method of the LED assembly 200c.

FIG. 20 is a schematic perspective view of an LED assembly 300 according to another embodiment of the present invention.

21A and 21B show an upper view and a lower view of an LED assembly 300a.

FIG. 22 shows a cross-sectional view of the LED module 300a.

FIG. 23 shows a side view of the LED module 300b.

FIG. 24 is a schematic perspective view of the LED assembly 600.

25A and 25B show top views of the LED assemblies 600a and 600b.

Figures 26A and 26B show two LED bulbs with LED components 300 and 600 as the lamp core, respectively.

Claims (10)

A light emitting diode assembly includes: A circuit board A metal clip on the circuit board, A first substrate, which is fixed to the circuit board by the metal clip, has a first upper surface, and a first lower surface opposite to the first upper surface; A plurality of first light emitting diode wafers located on the first upper surface; A transparent colloid containing fluorescent powder, covering the plurality of first light emitting diode wafers and the first upper surface, and not covering the first lower surface; A second substrate having a second upper surface and a second lower surface opposite to the second upper surface; and A plurality of second light emitting diode wafers located on the second upper surface, The light-emitting diode component has a virtual central axis, and the first lower surface and the second lower surface face the virtual central axis of the light-emitting diode component. According to the light emitting diode assembly described in item 1 of the patent application scope, it further includes a first conductive electrode plate and a second conductive electrode plate at the same end of the first substrate. The light-emitting diode assembly according to item 2 of the scope of patent application, wherein the first conductive electrode plate has a plurality of portions with different widths. The light-emitting diode assembly according to item 2 of the scope of the patent application, wherein the metal clip is used to supply power to the first conductive electrode plate to drive the plurality of first light-emitting diode wafers. The light-emitting diode device described in item 1 of the patent application scope further includes a transparent adhesive layer between the first substrate and the plurality of first light-emitting diode wafers. The light-emitting diode module according to item 1 of the scope of patent application, wherein no light-emitting diode wafer is disposed on the first lower surface. According to the light emitting diode assembly described in item 1 of the patent application scope, wherein the first upper surface has two terminals, and each of the two terminals has a part that is not covered by the transparent colloid. The light-emitting diode module according to item 1 of the scope of the patent application, wherein the plurality of first light-emitting diode wafers are arranged in two rows along the long side direction of the first substrate. The light-emitting diode device according to item 1 of the scope of patent application, wherein the first substrate and the second substrate are not perpendicular to the circuit board. A light bulb containing A lampshade The light-emitting diode assembly as described in item 1 of the scope of patent application, which is arranged in the lampshade; and An electrical connection mechanism is connected to the lampshade.