CN103075667A - Full-angle light emitting diode (LED) light source body and production process for same - Google Patents
Full-angle light emitting diode (LED) light source body and production process for same Download PDFInfo
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- CN103075667A CN103075667A CN2013100097229A CN201310009722A CN103075667A CN 103075667 A CN103075667 A CN 103075667A CN 2013100097229 A CN2013100097229 A CN 2013100097229A CN 201310009722 A CN201310009722 A CN 201310009722A CN 103075667 A CN103075667 A CN 103075667A
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Abstract
The invention discloses a full-angle light emitting diode (LED) light source body and a production process for the same. The LED light source body comprises a transparent carrier, an LED chip group and polar plates, wherein the LED chip group is electrically connected with the polar plates, and is fixedly arranged on the transparent carrier; fluorescent gel covers the LED chip group; and the LED chip group consists of full-angle LED chips. The LED chip group comprises at least two LED chips which are connected in parallel or in series. The LED chip group consisting of the full-angle LED chips is fixedly arranged on the transparent carrier to realize the full-angle light emitting of the light source body; and in addition, the full-angle LED light source body also has the advantages of simple and rational structure, simple process, environment friendliness, high reliability and the like.
Description
Technical field
The present invention relates to led light source body technique field, especially a kind of full-shape emitting led light source body and production technology thereof.
Background technology
At present, because of LED(Light Emitting Diode, light emitting diode) have that brightness height, heat are low, the advantages such as environmental protection, controllability are strong, long service life, be used in all trades and professions.But the light source in the existing LED light source body generally adopts LED lamp pearl, and the lighting angle of LED lamp pearl generally at 120 degree take interior and throw light on for single direction, and for reaching the full angle illumination effect, a plurality of LED lamp pearls can only be fixed on the multiaspect carrier, or arrange one and reach multiaspect even the luminous purpose of full-shape LED lamp pearl is opposing.
Chinese patent application number is to disclose a kind of stereo luminous LED light source in 200920194738.0, and it comprises support, is provided with the vertical die bond position of two back ofs the body at the end of described support; On described two die bond positions, be welded with respectively the LED wafer, the opposing setting of LED wafer on described two die bond positions; End at described support also is packaged with the wafer package colloid, and described each LED wafer package is in described wafer package colloid; Periphery at described wafer package colloid is coated with fluorescent material, its complex structure, and light efficiency is low and production technology is more complicated, can not realize that the full-shape of light source body is luminous simultaneously.
Thus, the inventor considers the led light source body is improved, and this case produces thus.
Summary of the invention
The problem that the present invention solves provides a kind of, solves existing led light source body and can not realize the problem that full-shape is luminous.
For addressing the above problem, the technical solution used in the present invention is:
A kind of full-shape emitting led light source body, this led light source body comprises printing opacity carrier, led chip group and pole plate; Described led chip group is electrically connected with pole plate, and is fixed on the described printing opacity carrier, is coated with fluorescent glue on the described led chip group, and this led chip group is comprised of the emitting led chip of full-shape.
Further, described led chip group is formed by at least two led chips parallel connections or series connection.
Further, described printing opacity carrier is light-passing board, printing opacity gengon or transparent heat conduction plastic cement.
Further, described light-passing board or printing opacity gengon are made by safety glass.
Further, described light-passing board or printing opacity gengon are made by acrylic.
Further, described fluorescent glue is comprised of transparent colloid, fluorescent material, interfacial agent and brightener.
Further, described transparent colloid is silicon rubber, one-component or two component.
Further, the production technology of described full-shape emitting led light source body: may further comprise the steps:
The printing opacity carrier is provided;
Printed wiring figure on described printing opacity carrier;
Printing opacity carrier at printed wiring figure is fixed a plurality of led chips;
In parallel or the series connection formation led chip group with a plurality of led chips, and be electrically connected pole plate;
The spraying fluorescent glue forms full-shape emitting led light source body.
Further, described led chip group adopts transparent heat-conducting glue to be fixed on the carrier.
The present invention's employing is comprised of the emitting led chip of full-shape, and described led chip group is fixed on the described printing opacity carrier, realizes that the full-shape of light source body is luminous; The present invention also is coated with fluorescent glue in the led chip group, and this fluorescent glue is comprised of transparent colloid, fluorescent material, interfacial agent and brightener, and wherein interfacial agent and brightener effectively reach the purpose that strengthens light efficiency; Above-mentioned printing opacity carrier can be light-passing board or printing opacity gengon, thereby has widened the scope of application of product, and this carrier preferably adopts safety glass to make, thereby reaches the purposes such as cost is low, high temperature resistant, light transmission efficiency is high.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of the present invention in embodiment one;
Fig. 3 is the section of structure of the present invention in embodiment one;
Fig. 4 is the structural representation of the present invention in embodiment two;
Fig. 5 is the section of structure of the present invention in embodiment two;
Fig. 6 is process flow diagram of the present invention.
The specific embodiment
The present inventor finds that existing led light source body existence can not realize the luminous deficiency that waits of full-shape.
For the problems referred to above, the present inventor proposes a kind of technical scheme of solution, and is specific as follows: as shown in Figure 1, a kind of full-shape emitting led light source body, this led light source body comprises printing opacity carrier 1, led chip group 2 and pole plate 3; Described led chip group 2 is electrically connected with pole plate 3, and be fixed on the described printing opacity carrier 1, be coated with fluorescent glue 4 on the described led chip group 2, this led chip group 2 is comprised of the emitting led chip of full-shape, and led chip group 2 is formed by 21 parallel connections of at least two led chips or series connection.
As shown in Figure 1, the production technology of above-mentioned full-shape emitting led light source body: may further comprise the steps:
Printing opacity carrier 1 is provided; Printed wiring figure on described printing opacity carrier 1; Fix a plurality of led chips 21 at the printing opacity carrier 1 of printed wiring figure; With a plurality of led chip 21 in parallel or series connection formation led chip groups 2, wherein said led chip group 2 adopts transparent heat-conducting glue to be fixed on the carrier 1, and is electrically connected pole plate 3; Spraying fluorescent glue 4 forms full-shape emitting led light source body.
Embodiment one: as shown in Figure 2 to Figure 3, a kind of full-shape emitting led light source body, this led light source body comprises printing opacity carrier 1A, led chip group 2A and pole plate 3A; Described led chip group 2A is electrically connected with pole plate 3A, and be fixed on the described printing opacity carrier 1A, be coated with fluorescent glue 4A on the described led chip group 2A, this led chip group 2A is comprised of the emitting led chip of full-shape, and the led chip group is formed by at least two led chip 21A parallel connections or series connection.Above-mentioned printing opacity carrier 1A is light-passing board, and described light-passing board is made by safety glass or acrylic, and light-passing board preferably adopts safety glass to make; Fluorescent glue 4A is comprised of transparent colloid, fluorescent material, interfacial agent and brightener, and wherein transparent colloid is silicon rubber, one-component or two component.
Embodiment two: extremely shown in Figure 5 such as Fig. 4, and a kind of full-shape emitting led light source body, this led light source body comprises printing opacity carrier 1B, led chip group 2B and pole plate 3B; Described led chip group 2B is electrically connected with pole plate 3B, and be fixed on the described printing opacity carrier 1B, the upper B of described led chip group 2B is coated with fluorescent glue 4B, and this led chip group 2B is comprised of the emitting led chip of full-shape, and the led chip group is formed by at least two led chip 21B parallel connections or series connection.Above-mentioned printing opacity carrier 1B is printing opacity gengon (sees Fig. 4 and Fig. 5, in the present embodiment take four limit body printing opacity carriers as example), and described printing opacity gengon is made by safety glass or acrylic, and the printing opacity gengon preferably adopts safety glass to make; Above-mentioned fluorescent glue 4B is comprised of transparent colloid, fluorescent material, interfacial agent and brightener, and wherein transparent colloid is silicon rubber, one-component or two component.
Above-mentioned printing opacity carrier also can be transparent heat conduction plastic cement.
The present invention has the following advantages:
1, uses the luminous led chip of full angle and the printing opacity carrier structure that is connected among the present invention, utilize simultaneously the light transmission of the luminous and carrier of the full angle of led chip, thereby realize the full angle illumination of light source body;
2, be covered among the present invention on the led chip group and be coated with fluorescent glue, and this fluorescent glue is comprised of transparent colloid, fluorescent material, interfacial agent and brightener, wherein interfacial agent and brightener effectively strengthen light efficiency;
3, the printing opacity carrier selects safety glass to make among the present invention, has low, the high temperature resistant and light transmission efficiency advantages of higher of cost;
4, the full-shape emitting led light source body described in the present invention also has simple and reasonablely, and technique is simple, environmental protection, high reliability.
The above record, only for utilizing the embodiment of this origination techniques content, modification, variation that any those skilled in the art use this creation to do all belong to the claim that this creation is advocated, and are not limited to those disclosed embodiments.
Claims (9)
1. full-shape emitting led light source body, it is characterized in that: this led light source body comprises printing opacity carrier, led chip group and pole plate; Described led chip group is electrically connected with pole plate, and is fixed on the described printing opacity carrier, is coated with fluorescent glue on the described led chip group, and this led chip group is comprised of the emitting led chip of full-shape.
2. a kind of full-shape emitting led light source body according to claim 1 is characterized in that: in parallel or series connection forms described led chip group by at least two led chips.
3. a kind of full-shape emitting led light source body according to claim 1, it is characterized in that: described printing opacity carrier is light-passing board, printing opacity gengon or transparent heat conduction plastic cement.
4. a kind of full-shape emitting led light source body according to claim 3, it is characterized in that: described light-passing board or printing opacity gengon are made by safety glass.
5. a kind of full-shape emitting led light source body according to claim 3, it is characterized in that: described light-passing board or printing opacity gengon are made by acrylic.
6. a kind of full-shape emitting led light source body according to claim 1, it is characterized in that: described fluorescent glue is comprised of transparent colloid, fluorescent material, interfacial agent and brightener.
7. a kind of full-shape emitting led light source body according to claim 1, it is characterized in that: described transparent colloid is silicon rubber, one-component or two component.
8. the production technology of the described full-shape emitting led light source of claim 1 body is characterized in that: may further comprise the steps:
The printing opacity carrier is provided;
Printed wiring figure on described printing opacity carrier;
Printing opacity carrier at printed wiring figure is fixed a plurality of led chips;
In parallel or the series connection formation led chip group with a plurality of led chips, and be electrically connected pole plate;
The spraying fluorescent glue forms full-shape emitting led light source body.
9. the production technology of full-shape emitting led light source body according to claim 8, it is characterized in that: described led chip group adopts transparent heat-conducting glue to be fixed on the carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100097229A CN103075667A (en) | 2013-01-11 | 2013-01-11 | Full-angle light emitting diode (LED) light source body and production process for same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013100097229A CN103075667A (en) | 2013-01-11 | 2013-01-11 | Full-angle light emitting diode (LED) light source body and production process for same |
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| CN103075667A true CN103075667A (en) | 2013-05-01 |
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| CN104019394A (en) * | 2014-06-18 | 2014-09-03 | 无锡市崇安区科技创业服务中心 | Combined type surface mount device LED white-light lamp and color rendering adjusting method thereof |
| WO2016029808A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Light emission and heat dissipation structure of led light source and light emission and heat dissipation method therefor |
| CN110350064A (en) * | 2013-07-01 | 2019-10-18 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
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| CN203068213U (en) * | 2013-01-11 | 2013-07-17 | 郑香奕 | Light emitting diode (LED) light source body of omni-directional light emitting |
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| CN200961839Y (en) * | 2006-09-21 | 2007-10-17 | 赖金鸿 | LED lumination module |
| CN201513856U (en) * | 2009-06-19 | 2010-06-23 | 江苏名家汇电器有限公司 | High-power LED lamp based on heat-conducting nanoparticle |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110350064A (en) * | 2013-07-01 | 2019-10-18 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
| CN104019394A (en) * | 2014-06-18 | 2014-09-03 | 无锡市崇安区科技创业服务中心 | Combined type surface mount device LED white-light lamp and color rendering adjusting method thereof |
| WO2016029808A1 (en) * | 2014-08-26 | 2016-03-03 | 蔡鸿 | Light emission and heat dissipation structure of led light source and light emission and heat dissipation method therefor |
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Application publication date: 20130501 |