CN102859259A - LED based pedestal-type lighting structure - Google Patents
LED based pedestal-type lighting structure Download PDFInfo
- Publication number
- CN102859259A CN102859259A CN2011800207092A CN201180020709A CN102859259A CN 102859259 A CN102859259 A CN 102859259A CN 2011800207092 A CN2011800207092 A CN 2011800207092A CN 201180020709 A CN201180020709 A CN 201180020709A CN 102859259 A CN102859259 A CN 102859259A
- Authority
- CN
- China
- Prior art keywords
- light
- pedestal
- led
- remote phosphor
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.
Description
It is that 61/339,516 U.S. Provisional Patent Application and the sequence number submitted on March 3rd, 2010 are the rights and interests of 61/339,515 U.S. Provisional Patent Application that the application requires in the sequence number that on March 3rd, 2010 submitted to.
Background of the present invention
Background technology
Light emitting diode (LED or LEDs) is the solid-state devices that converts electric energy to light, and generally includes the one or more semi-conducting material active layers that are clipped between the relative doped layer.When whole doped layer applies bias voltage, hole and electronics are injected into active layer, hole and electronics in active layer again in conjunction with to produce light.From active layer and from all surface utilizing emitted light of LED.
For led chip is used for circuit or other similar configuration, known method is that led chip is enclosed in the packaging part so that environment and/or mechanical protection, color selection and optically focused etc. to be provided.The LED packaging part also comprises for electrical lead, contact or the trace (trace) that the LED packaging part are electrically connected to external circuit.In typical LED packaging part 10 shown in Figure 1, single led chip 12 is installed on the reflector 13 by weld bonds agent or conductive epoxy resin.One or more bonding wire 11 is connected to lead-in wire 15A and/or 15B with ohm contact of led chip 12, and described lead-in wire can be connected to reflector 13 or integrate with it.Reflector can be filled with the encapsulant 16 that can contain material for transformation of wave length (such as fluorophor).Light by the first wavelength of LED emission can be absorbed by fluorophor, can launch the light of second wave length as the response fluorophor.Whole assembly is sealed in the transparency protected resin 14 subsequently, and this protection resin can be molded as lens shape with the light of calibration from led chip 12 emissions.Although reflector 13 can guide light along upward direction, and when light is reflected (, because the reflectivity of actual reflector surface is less than 100%, some light may be reflected cup and absorb), light loss may occur.In addition, for packaging part (all packaging parts 10 as shown in Figure 1a), heat retention may be problem, extracts (extract) heat because may be difficult to by lead-in wire 15A, 15B.
Traditional LED packaging part 20 shown in Figure 2 may be more suitable for high-power operation, and this can produce more heat.In LED packaging part 20, one or more led chips 22 are installed on the carrier, such as printed circuit board (PCB) (PCB) carrier, substrate or sub-installed part (submount) 23.The solid metal reflector 24 that is installed on the sub-installed part 23 reflects away from packaging part 20 around led chip 22 and with the light that led chip 22 is launched.Reflector 24 also provides mechanical protection to led chip 22.One or more bonding wire connecting line 11 is formed between electric trace 25A, the 25B on ohm contact and the sub-installed part 23 on the led chip 22.The led chip 22 of installing covers for sealed dose 26 subsequently, and sealant can provide environment and mechanical protection to chip, simultaneously also as lens.Solid metal reflector 24 is connected to carrier by scolder or epobond epoxyn usually.
Led chip (such as the led chip of finding in the LED packaging part 20 of Fig. 2) can be coated with the transition material that comprises one or more fluorophor, and wherein these fluorophor absorb at least a portion LED light.Led chip can be launched different wave length, so that the light that its emission is combined into from the light of LED and fluorophor.Led chip can utilize multiple diverse ways coated with fluorophor, wherein a kind of suitable method is 11/656 belonging to being entitled as of the people such as Chitnis " Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method(wafer level phosphor painting method and the device that utilizes the method to make) " and series number, be described in 759 and 11/899,790 the U.S. Patent application.Alternatively, LED can utilize additive method (such as electrophoretic deposition (EPD)) to apply, wherein a kind of suitable EPD method is described in the 11/473rd, No. 089 U.S. Patent application that belongs to being entitled as of the people such as Tarsa " the closed loop electrophoretic deposition of Close Loop Electrophoretic Deposition of Semiconductor Devices(semiconductor devices) ".
In these embodiments, fluorescent material is positioned on the LED epitaxial loayer or very near the LED epitaxial loayer, and comprises in some cases the conformal coating (conformal coat) of LED top.In these configurations, fluorescent material may be subject to the impact of the direct heat of chip, and this can cause the fluorescent material heating.As time goes on, the operating temperature of this rising can cause the degraded (degradation) of fluorescent material.Also can cause the reduction of Phosphor-conversion efficient and the colour cast of converting colors.
Developed the lamp that utilizes solid state light emitter (such as LED), wherein transition material and LED separate or away from LED, this being configured in belongs to the 6th of being entitled as of the people such as Tarsa " the high outputting radial broad light that High Output Radial Dispersing Lamp Using a Solid State Light Source(utilizes solid state light emitter) ", disclose in 350, No. 041 United States Patent (USP)s.Lamp described in this patent can comprise solid state light emitter, and this solid state light emitter transfers to the scatterer (disperser) with fluorophor with light by separator.Scatterer can become light scattering in the pattern of expectation and/or change its color by Phosphor-conversion at least a portion light.In certain embodiments, separator separates enough distances with light source and scatterer, so that the heat from light source can not be passed to scatterer when the required high electric current of light source conveying chamber intraoral illumination.
Developed LED-based bulb, a plurality of low-light level LED(that its utilization is mounted to three-dimensional surface for example, the LED of 5mm), to realize wide angle lighting fitting.Yet these designs do not provide the interior best omnidirectional radiation of uniformity requirement scope of the standard of dropping on.These bulbs also comprise a large amount of interconnected LED, and this makes them become very complicated, expensive and unreliable.This is so that these LED bulbs are usually impracticable for the majority of illumination purpose.
Also developed other LED bulbs of table top (mesa) the formula design that utilizes light source, wherein had a LED on the end face, and have seven above LED on the sidewall of table top.(provide with reference to C.Crane
).Yet this configuration can not provide omnidirectional radiation pattern, and the forward pattern of biasing can be provided basically on the contrary.The table top that is used for this bulb also comprises the hollow housing from the ability of emitter dissipation heat that may limit bulb.This can limit the drive current that can be applied to LED.This design that utilizes several LED is relative complex also, and does not meet the demand of the low-cost LED bulb of manufacturing in enormous quantities.
Technical field
The present invention relates to solid state lamp and bulb, lamp and the bulb based on light emitting diode (LED) that can provide with based on the similar omnidirectional radiation pattern of radiation pattern of the light source of filament are provided particularly.
Summary of the invention
The invention provides efficient, reliable, cost efficient and can be arranged as lamp that omnidirectional radiation pattern is provided and the various embodiment of bulb.Different embodiment can comprise solid-state emitters, and described solid-state emitters is arranged in to be had on the pedestal of heat management feature with the heat localization in the control emitter.These embodiment can also comprise shaping (shaped) remote phosphor, and described remote phosphor also can have the heat management feature and gather with the transition heat in the control remote phosphor.Different embodiment can also have diffuser (diffuser) feature to produce the radiation pattern of the expectation that is used for lamp and bulb.
Comprise pedestal and be positioned at solid state light emitter on the pedestal according to an embodiment of lamp of the present invention.The fluorophor that is shaped is arranged as away from solid state light emitter, so that pass remote phosphor and convert different wave length to from least some light of solid state light emitter.Comprise diffuser, diffuse into omnidirectional radiation pattern with the light with the lamp emission.
An embodiment according to LED-based bulb of the present invention comprises having a plurality of elongated bases.Comprise a plurality of LED, each LED can be mounted to a face, and wherein pedestal comprises thermally conductive pathways, so that from LED heat conduction.Diffuser arranges that with respect to LED so that pass diffuser from the light of LED, wherein diffuser changes the radiation pattern of (modify regulates) LED to form the bulb radiation pattern of expectation.
Another embodiment according to solid state lamp of the present invention comprises the pedestal with a plurality of solid state light emitters, and wherein pedestal comprises Heat Conduction Material at least in part.Comprise heat spreader structures, wherein heat susceptor is coupled to this heat spreader structures.Heat from solid state light emitter conducts to heat spreader structures by pedestal.Comprise that heat is coupled to the remote phosphor of heat spreader structures, wherein the heat from remote phosphor conducts in the heat spreader structures.
Another embodiment according to LED-based bulb of the present invention comprises the pedestal with a plurality of LED, and wherein pedestal comprises Heat Conduction Material at least in part.Comprise heat spreader structures, wherein heat susceptor is coupled to this heat spreader structures.Remote phosphor is arranged with respect to LED, so that pass remote phosphor and convert different wave length to from least a portion light of LED.The white light that this lamps emission is combined into from the light of LED and remote phosphor.
An embodiment according to bulb of the present invention or lamp source comprises a plurality of solid-state emitters and the pedestal with end face.This pedestal also has a plurality of the first sides and a plurality of the second side.The first side can be in and end face forms position greater than the angles of 90 degree, and the second side can be in and end face forms position less than the angles of 90 degree.Solid state light emitter is mounted at least some first and second sides.
Those skilled in the art will be appreciated that these and other Characteristics and advantages of the present invention from by reference to the accompanying drawings detailed description hereinafter, in the accompanying drawing:
Description of drawings
Fig. 1 illustrates the sectional view of an embodiment of prior art LED lamp;
Fig. 2 illustrates the sectional view of another embodiment of prior art LED lamp;
Fig. 3 is the side view according to an embodiment of pedestal of the present invention;
Fig. 4 is the perspective view according to an embodiment of LED lamp of the present invention;
Fig. 5 is the perspective view according to another embodiment of LED lamp of the present invention;
Fig. 6 is the perspective view of LED lamp shown in Figure 5, and the light from its light source is shown;
Fig. 7 is the sectional view according to another embodiment of LED lamp of the present invention;
Fig. 8 is the polar diagram that illustrates for the radiation pattern of an embodiment of LED lamp according to the present invention;
Fig. 9 is the perspective view according to another embodiment of LED lamp of the present invention;
Figure 10 is the side view according to another embodiment of pedestal of the present invention;
Figure 11 is the perspective view of pedestal shown in Figure 10;
Figure 12 is the perspective view according to another embodiment of lamp of the present invention;
Figure 13 is the perspective view according to another embodiment of pedestal of the present invention;
Figure 14 is the perspective view according to another embodiment of LED lamp of the present invention; And
Figure 15 is the perspective view according to another embodiment of pedestal of the present invention.
The specific embodiment
The present invention relates to provide the different embodiment of the modulated structure of the led chip that is mounted to heat conducting base.This allows the LED lamp almost to form the omnidirectional light radiation pattern of imitation conventional incandescent bulb.LED bulbs more according to the present invention especially are suitable as A level bulb and replace the LED lamp.Pedestal special by shape according to embodiments of the invention and that have a surface that solid-state emitters be fit to be installed consists of, and pedestal can be made or the heat conducting element that provides away from emitter is provided by Heat Conduction Material.Some embodiment of pedestal can contain a plurality of LED-based emitters, and at least some emitters are luminous on the different directions away from pedestal.When with remote phosphor and diffuser dome (dome) when using, the special angle of LED and radiation pattern can be so that light fixture have omnidirectional radiation pattern.
Pedestals more according to the present invention can be mounted to heat spreader structures, so that can be diffused into heat spreader structures away from the heat of emitter conduction, heat can be dissipated to the surrounding environment from heat spreader structures.This configuration also allows pedestal successfully to be combined with the remote phosphor with good inhomogeneity shaping of special color, and wherein remote phosphor also is mounted to radiator.Remote phosphor can have multiple different shape, is arranged at least in part general spherical shape in the spherical fluorophor such as pedestal.This provides and has made pedestal produce improved better color homogeneity and its emitter provide approximate spot light in remote phosphor configuration.Pass fluorescent material with almost identical angle and almost pass the fluorophor of same amount from the light of pedestal emitter emission.That is, almost identical from the light path of the photon that passes through fluorophor of the photon of pedestal emitter, so that the LED bulb has better emission color homogeneity.
The configuration of this approximate spot light also provides the more uniform radiation of watching from different viewing angles, so that some embodiment are specially adapted to replace the light source based on incandescent lamp of standard.As discussed further below, owing to have improved heat management, the feature of remote phosphor configuration also is to have higher photon conversion efficiency.
Can comprise different solid-state emitters on the pedestal, such as LED, led chip or other LED packaging part/elements (" led chip " or " a plurality of led chip ").In certain embodiments, pedestal can be used in the lamp of transmitting white, and wherein lamp emission is from the light of the LED on the pedestal and the white light that is combined into from the light of one or more fluorophor in the remote phosphor.In certain embodiments, pedestal can comprise the blue emission led chip, and the remote phosphor that is shaped can comprise the fluorescent material that absorbs blue light and launch gold-tinted.In operating process, a part of blue led chip light passes remote phosphor, and remaining light is by the yellow fluorescence bulk absorption and be emitted as gold-tinted or green glow again, wherein the white light that is combined into of these lamps emission blue LED lights and fluorophor light.Also can comprise different LED and the transition material of emission different colours light according to lamp of the present invention, absorption optical and launch again the light of different colours is so that the light that the lamp emission has desired character (such as colour temperature and colour rendering (color rendering)).
Can have still less element according to lamp of the present invention, and be easier to make, cost is lower.For example, owing to have remote phosphor, the led chip on the pedestal can be driven by higher drive current, and does not have the risk from the heat degraded fluorophor of led chip.Therefore, need still less led chip can realize the light flux of expecting.Pedestal also provides in the mode of cost efficient a plurality of emitters is installed, and provides simultaneously hot path to dissipate from the heat of emitter.
Describe the present invention with reference to specific embodiment herein, it should be understood that, the present invention can adopt multiple different form and should not be construed as and be limited to the embodiment that sets forth herein.Particularly, present invention is described for the particular lamp with LED, led chip or LED element (" led chip ") in hereinafter disposing about difference or illumination component, it should be understood that the present invention can be used for having many other lamps of many different configurations.Element can have difformity and the size outside the diagram, and can comprise LED or the led chip of varying number.
It will also be appreciated that when mention element such as layer, zone or substrate be positioned at another element " on " time, this element can be located immediately on other elements, perhaps also can have intermediary element.In addition, such as " inside ", " outside ", " top ", " top ", " bottom ", " below " and " under " relational terms and the similar terms relation that can be used for herein describing a layer or another zone.It should be understood that these terms are intended to comprise the different azimuth except orientation shown in the accompanying drawing of device.
Although first, second grade of term can be used for describing various elements, parts, zone, layer and/or part herein, these elements, parts, zone, layer and/or part are not limited by these terms should.These terms only are used for an element, parts, zone, layer or part and another zone, layer or part difference are come.Therefore, in the situation that does not break away from instruction of the present invention, the first element of hereinafter discussing, parts, zone, layer or part can be described as the second element, parts, zone, layer or part.
Reference is described embodiments of the invention as the cross-sectional view of the indicative icon of the embodiment of the invention herein.Like this, the actual (real) thickness of layer may be different, and for example, because manufacturing technology and/or tolerance, illustrated variation in shape is foreseeable.The embodiment of the invention should not be construed as the concrete shape that is limited to zone described herein, and for example is understood to include because the deviation in shape that causes.Because normal manufacturing tolerance, the zone that is described as square or rectangle in diagram or the literary composition has circle or bending features usually.Therefore, zone shown in the drawings is in fact schematically, and its shape does not lie in the accurate shape that device area is shown and is not intended to limit the scope of the invention.
Fig. 3 shows an embodiment according to LED pedestal 50 of the present invention, and this pedestal is arranged as led chip 52 is remained in LED lamp or the bulb (" LED lamp "), and wherein pedestal 50 and LED thereof are as the light source of LED lamp.Pedestal 50 normally elongated and can have a plurality of surfaces that can keep from different perspectives a plurality of led chips.In the embodiment shown, pedestal 50 has end face 54, and led chip 52 is mounted to end face 54.When pedestal 50 was vertically installed, end face almost was level.Pedestal also comprises a plurality of pedestal emitters surface 56, and at least some pedestal emitter surfaces also are arranged as and keep led chip 52.It should be understood that pedestal 50 can have the emitter surface 56 of various shape and varying number and size, these emitter surfaces can be arranged with 54 one-tenth different angles of end face.Have in the embodiment shown 6 emitter surfaces, top and each emitter surface that each emitter surface is positioned at pedestal have identical size and identical angle basically.In the illustrated embodiment, the side is in and the position of end face 54 formation greater than 90 ° angle, so that the thickness of pedestal 50 reduces downwards from end face 54.In certain embodiments, the angle of side and end face can be about 95 ° or larger, and in other embodiments, the angle of side and end face can be about 100 ° or larger.In other other embodiment, the angle of side and end face can be about 105 ° or larger.In one embodiment, the angle of side and end face is about 105 °.
Led chip 52 can be included at least some emitter sides 56, and in the illustrated embodiment, led chip 52 is included on three sides 56.Can use commercially available many different led chips or LED packaging part, include but not limited to led chip or the LED packaging part of commercially available Cree company from Durham, the North Carolina state.Led chip is by utilizing hereinafter described known method and material to install in position.In this embodiment, exposed sides 56a is included between the side 56 with led chip 52, but it should be understood that in other embodiments, led chip 52 can be mounted to some or all exposed sides 56a, does not therefore have exposed sides between some or all led chips.Luminous flux and the light radiation pattern of expectation that the quantity that is included in the led chip on end face and the side depends on the luminous flux of led chip 52 and utilizes the LED lamp of pedestal 50.Each do not had led chip in different embodiment in end face and the side 54,56 or have more than one led chip.By at end face 54 and side 56 emitter being set, light is from upwards emission and arrive the side with slightly downward angle of pedestal.When light during with hereinafter described mode scattering, the combination of this light emission direction meets the requirement that the omnidirectional light radiation is provided.
The surface of pedestal 50 should comprise reflecting layer/surface, particularly in the zone that is not covered by led chip 52.Among the embodiment of the LED lamp that utilizes remote phosphor of describing hereinafter, because the isotropism feature of fluorescent emission, about 50% fluorescent emission towards pedestal backward.In other embodiment that utilize the diffusion dome, some pass the light of dome and can return towards pedestal 50 scatterings.The pedestal 50 that the surface has the good reflection rate can improve the lamp emission effciency, reflects at least some to penetrate to postbacking/photon of scattering, so that these photons are conducive to the emission of LED lamp.Because extract loss and/or lower surface reflectivity, led chip and device substrate have lower effective reflectivity usually.The emission effciency that the reflecting surface that is not covered by led chip has improved the LED lamp is set.It should be understood that reflecting layer/surface can comprise multiple different material and structure, include but not limited to white paint, reflective particle, reflective metals or reflection multilayer semiconductor, such as distributed Bragg reflector (DBR).In certain embodiments, the surface can be coated with having about 75% or the material of higher reflectivity to light, and in other embodiments, and material can have about 85% or higher reflectivity to light.In other other embodiment, material can have about 95% or higher reflectivity to light.
Heat spreader structures 74 can comprise Heat Conduction Material at least in part, and can use multiple different material, such as different metals, comprises copper, aluminium or metal alloy.Heat spreader structures 74 also can comprise other heat dissipation characteristics, such as the hot fin of the surface area that increases radiator, more effectively rejects heat in the surrounding environment being conducive to.Radiator reflecting layer or material also can be arranged on the surface of heat spreader structures 74, with the mode reverberation on the reflecting layer of pedestal 50/surface as described above.In one embodiment, can comprise the reflecting layer around the end face 82 of the heat spreader structures 74 of pedestal 72, this reflecting layer can be made and can be utilized known method to be formed on the heat spreader structures 74 by above-mentioned material.
Pedestal 72 can utilize different known methods or material (such as heat conduction jointing material or hot grease) to be mounted to heat spreader structures 74.Traditional thermally conductive grease can contain such as the ceramic material of beryllium oxide and aluminium nitride or such as the metal particle of collargol.In other embodiments, pedestal 72 can be mounted to heat spreader structures by heat-transfer device, such as passing through clamp mechanism, screw or heat adhesive.These devices and material can closely be fixed to heat spreader structures 74 with pedestal 72, so that the thermal conductivity maximization.In one embodiment, use the hot grease of the thermal conductivity of thickness with about 100 μ m and k=0.2W/mk.This configuration provides effective thermally conductive pathways, is used for heat is conducted to heat spreader structures from pedestal 72.
Heat spreader structures 74 also can comprise for the feature that power supply is connected to different electrical sockets.In certain embodiments, heat spreader structures can comprise the feature of inserting the type in the traditional electrical socket.For example, it can comprise the feature that is mounted to the standard screw socket, and can comprise the threaded portion that can screw in screw socket.In other embodiments, it can comprise standard plug, and electrical socket can be standard socket or can comprise the GU24 elementary cell.In other embodiments, it can comprise clip, and electrical socket can be the socket (for example, employed in many fluorescent lamps) that holds and keep this clip.These are the minority selection of heat spreader structures and socket, and also can use other configurations.
In certain embodiments, heat spreader structures 74 can comprise for the signal of telecommunication is applied to pedestal 72 and then is applied to the electric conductor of its led chip 76 from electrical socket.Also can comprise the power supply unit (not shown), to regulate or to revise this signal of telecommunication before being applied to pedestal 72 at the signal of telecommunication from socket.This can comprise that signal conversion (for example, the conversion of analog to digital), signal rectification and/or signal zoom in or out.
Fig. 5 shows an embodiment according to LED lamp 90 of the present invention, comprises being similar to pedestal 92, heat spreader structures 94 and the led chip 96 that same characteristic features above-mentioned and shown in Figure 4 is arranged.In this embodiment, LED lamp 90 comprises the remote phosphor 98 of the shaping of arranging around pedestal 92, so that pass remote phosphor from least a portion light of led chip 96.According to the present invention, remote phosphor 98 can adopt multiple different shape, such as hemispherical, elliposoidal, taper etc., and can have multiple different size.In certain embodiments, remote phosphor can provide incomplete covering above pedestal 92.In the illustrated embodiment, remote phosphor 98 is for being mounted to the sphere of heat spreader structures 94, and wherein pedestal 92 and led chip 96 thereof are arranged in the spherical fluorophor 98 at least in part.Lamp 90 also comprises for the threaded portion 95 that lamp 90 is mounted to screw socket.
The fluorophor 98 that multiple different fluorophor can be used for being shaped, the present invention is particularly suitable for the lamp of transmitting white.(luminescent coating or its mixing).As mentioned above, in according to some embodiments of the present invention, led chip 96 can be launched the light of blue wavelength spectrum and the fluorophor 98 of shaping can absorb at least some blue lights and launch gold-tinted (or green glow) again.The white light that this allows lamp emission blue light and gold-tinted to be combined into.In certain embodiments, blue LED light can utilize commercially available YAG:Ce Phosphor-conversion by yellow conversion material, but utilizes based on (Gd, Y)
3(Al, Ga)
5O
12: Ce is (such as Y
3Al
5O
12: the conversion particle that fluorophor Ce (YAG)) is made also can be realized omnibearing yellow spectrum emission.When using with the emitter based on blue-ray LED, also can form white light with other yellow fluorophor, include but not limited to:
Tb
3-xRE
xO
12: Ce (TAG); RE=Y, Gd, La, Lu; Perhaps
Sr
2-x-yBa
xCa
ySiO
4:Eu
The fluorophor 98 that is shaped can comprise the second fluorescent material, this second fluorescent material or can mix with the remote phosphor 98 that is shaped or can be included on the shaping fluorophor as the second layer.In certain embodiments, each absorbed LED light in two kinds of fluorophor and can launch again the light of different colours.In these embodiments, can be in conjunction with to form the higher CRI white light (warm white) of different white tones from the color of two luminescent coatings.This can comprise the light from above yellow fluorophor, and this light can be combined with the light from red-emitting phosphors.Can use different red-emitting phosphors, comprise:
Sr
xCa
1-xS:Eu, Y; Y=halide;
CaSiAlN
3: Eu; Perhaps
Sr
2-yCa
ySiO
4:Eu
Can use other fluorophor, to generate colorful light-emitting by basically converting all light to specific color.For example, can generate green glow with following fluorophor:
SrGa
2S
4:Eu；
Sr
2-yBa
ySiO
4: Eu; Perhaps
SrSi
2O
2N
2:Eu
The below has enumerated some other applicable fluorophor, but also can use other fluorophor.Every kind of fluorophor all shows excitated blue and/or UV emission spectrum, and the peak emission of expectation is provided, and has effective light conversion, and has acceptable Stokes shift (Stokes shift):
Yellow/green
(Sr，Ca,Ba)(Al,Ga)
2S
4:Eu
2+
Ba
2(Mg,Zn)Si
2O
7:Eu
2+
Gd
0.46Sr
0.31Al
1.23O
xF
1.38:Eu
2+0.06
(Ba
1-x-ySr
xCa
y)SiO
4:Eu
Ba
2SiO
4:Eu
2+
Red
Lu
2O
3:Eu
3+
(Sr
2-xLa
x)(Ce
1-xEu
x)O
4
Sr
2Ce
1-xEu
xO
4
Sr
2-xEu
xCeO
4
SrTiO
3:Pr
3+,Ga
3+
CaAlSiN
3:Eu
2+
Sr
2Si
5N
8:Eu
2+
Can use the phosphor particle of different size, the scope that includes but not limited in 10 nanometers (nm) to 30 microns (μ m) or larger particle.Less particle size usually more large-sized particle can be disperseed and blend color better, so that more uniform light to be provided.With less Particle Phase ratio, larger particle is more effectively changed light usually, but the not too uniform light of emission.
In certain embodiments, can provide spherical transparent material, and fluorophor can be deposited on la m or the outside layer or on both.In order to form layer, fluorophor can be arranged in the binding agent (binder), and fluorophor also can have different concentration or fluorescent material useful load in binding agent.Typical concentration range is 30-70% by weight.In one embodiment, phosphor concentration by weight is about 65%, and preferably is uniformly distributed in whole remote phosphor.The fluorophor 98 that is shaped can also have different zones, and different transition materials and different transition material concentration wherein are set.
Different materials can be used for binding agent, and is firm and be transparent basically in visible wavelength spectrum after material is preferably and solidifies.Suitable material comprises silicones, epoxy resin, glass, unorganic glass, dielectric, BCB, polyamide, polymer and composition thereof, and preferred material is silicones, because it has the high grade of transparency and reliability in high-capacity LED.Commercially available suitable phenyl and methyl silicon resin from
Chemical company.According to the different factors such as employed types of binder, can utilize multiple different curing to come cured binders.Different curings includes but not limited to heating, ultraviolet ray (UV), infrared ray (IR) or air curing.
Luminescent coating can apply by using different technique, includes but not limited to spin coating, sputter, printing and powder coating.As mentioned above, luminescent coating can be used with binder material, but it should be understood that binding agent is optional.In other other embodiment, transparent ball can be made and then be mounted to luminescent coating individually.
The remote phosphor 98 that is shaped can comprise that also improved heat management feature is to reduce the Phosphor-conversion heat.Fluorophor only produces heat during operation from the light transfer process.In remote phosphor configuration, if remote phosphor does not possess the suitable thermally conductive pathways Phosphor-conversion heat that dissipates, then this heat can build up to unacceptable level.If there is not effective dissipation of heat path, the remote phosphor of heat isolation may bear the operating temperature of rising, and this can cause the fluorophor degraded, conversion efficiency is low and colour cast.
In certain embodiments, the remote phosphor 98 of shaping can comprise the transparent material of Heat Conduction Material and form is the remote fluorescence shape of expectation.In the illustrated embodiment, remote phosphor is spherical, but as indicated above, fluorophor can have multiple other shapes.Fluorophor can be used as layer and is arranged on the spherical transparent material or can mixes with sphere material.In the operating period of LED lamp 90, the Phosphor-conversion heat concentrates in the fluorescent material.The heat conductivility of ball type carrier helps towards spherical edge these heats of cross direction profiles that contact with heat spreader structures 94 in the illustrated embodiment.Preferably, spherical be mounted to heat spreader structures by the Heat Conduction Material such as the hot grease layer, and heat flows into the heat spreader structures and effectively is dissipated in the surrounding environment in heat spreader structures from sphere.
The transparent material that is shaped can comprise different materials, such as glass, quartz, carborundum (SiC), sapphire or other materials.The transparent material that is shaped can also have different thickness, and suitable thickness range is 0.1mm to 10mm or larger.It should be understood that according to the properties of materials that is used for carrier layer, also can adopt other thickness.Material should be enough thick, thereby expand for the specific operation condition provides enough horizontal heats.Usually, the thermal conductivity of material is higher, can provide the material of the necessary dissipation of heat thinner.These materials are the cross direction profiles heat effectively, and the result does not need the larger area required than the material of low heat conductivity.Different factors can affect employed material, include but not limited to cost and to the transparency of light source light.
Except the as discussed above conversion efficiency of pedestal 92 and the configuration of shaping fluorophor 98, this configuration also can provide the conversion uniformity.With reference now to Fig. 6,, show the LED lamp 100 that class is lower than LED lamp 90, and similarly feature is used identical reference number.Led chip 96 is intensive to be arranged on the top of pedestal 92 and to be positioned at shaping fluorophor 98, preferably, be positioned at the shaping fluorophor the center or near.This configuration permission led chip 96 is similar to the spot light in the shaping fluorophor 98, passes identical optical path length so that light 102 is advanced with almost identical angular illumination shaping fluorophor 98 and by remote phosphor (for example, the sphere of covering).Suppose that the shaping fluorophor has almost identical thickness generally, then light will experience fluorescent material and other light conversion of similar level of similar quantity.This allows to keep color homogeneity for the light of emission, because remote phosphor has the consistent fluorescent coating in space.
It should be understood that according to the present invention remote phosphor can be arranged according to multiple different mode with pedestal.In certain embodiments, remote phosphor can comprise or the layer on the remote phosphor that is shaped in the scattering particles that mixes or mix with transparent Heat Conduction Material with fluorescent material.These scattering particles can comprise multiple different material, include but not limited to:
Silica gel;
Zinc oxide (ZnO);
Yittrium oxide (Y
2O
3);
Titanium dioxide (TiO
2);
Barium sulfate (BaSO
4);
Aluminium oxide (Al
2O
3);
Vitreous silica (SiO
2);
Fumed silica (SiO
2);
Aluminium nitride;
Bead;
Zirconium dioxide (ZrO
2);
Carborundum (SiC);
Tantalum oxide (TaO
5);
Silicon nitride (Si
3N
4);
Niobium oxide (Nb
2O
5);
Boron nitride (BN); Perhaps
Phosphor particle (for example, YAG:Ce, BOSE).
Can in the various combinations of material or in the multi-form combination of same material, use more than one scattering particles, to reach specific dispersion effect.The remote phosphor that is shaped or diffuser dome can comprise that also roughening or moulding surface are to strengthen the light extraction.
Fig. 7 shows the embodiment according to LED lamp 120 of the present invention, and it is similar to LED lamp 90 shown in Figure 5 and comprises that led chip 124 is mounted to the pedestal 122 of its end face and side.Pedestal 122 is mounted to heat spreader structures 126, and the remote phosphor 128 of shaping also is mounted to heat spreader structures 126 above pedestal 122.Lamp 120 also comprises the shaping diffuser dome 130 that also is mounted to heat spreader structures 126, but it should be understood that it can multitude of different ways be installed in the lamp 120.Diffusion dome 130 can comprise all diffusions as indicated above or scattering particles.Scattering particles can be arranged in the curable adhesive that forms common domed shape.In certain embodiments, the dome that white scattering particles can be hidden in the color with fluorophor the white in the remote phosphor of shaping uses, to give the substantially outward appearance of white of LED lamp.The diffuser dome is arranged as diffusion or scattering from the light of remote phosphor, so that the light pattern of LED lamp emission expectation, such as omnidirectional light.Lamp 120 also comprises for the threaded portion 132 that lamp 120 is mounted to screw socket.
According to the present invention, the diffuser dome can have multiple different shape and can multiple different mode be arranged in the lamp.In certain embodiments, diffuser dome and fluorescent material can comprise single element.In certain embodiments, fluorophor comprises the layer on diffuser or the fluorophor, and diffuser material can be mixed.Have at light fixture in the situation of blue-light LED chip, can use the diffusion dome with fluorescent material and neutral scattering particle, thus the white light that lamp emission is combined into from the light of fluorophor and led chip.
As mentioned above, LED lamp according to the present invention can be arranged as at different emission angles the omnidirectional radiation pattern with limited emission variation is provided.Fig. 8 is the polar coordinates Figure 140 that illustrates according to the relevant distribution of illumination intensity on the space, angle in far field (far field) of an embodiment of LED lamp of the present invention.In polar coordinates Figure 140, θ is the inclination angle with as shown in Figure 3 z axle, and
It is the azimuth with the x axle.Around the numeral 142 expression tiltangleθs of circle, wherein 0 ° of expression is located immediately at the base top surface top.From 0 ° to 180 ° distribution with from 360 ° to 180 ° be distributed symmetrically.The azimuth
By a plurality of parts (slice) expression, wherein these parts form continuous band in polar diagram.Strength Changes size around the bandwidth at special angle θ place has been reacted at 360 ° of azimuths, this angle θ place.The azimuth mean intensity at azimuth average line 144 each angle θ place of expression.According to the present invention, the use of pedestal, remote phosphor and diffusion sphere can be eliminated effectively
Variation on every side.In the illustrated embodiment, for from 0 ° to 150 ° θ,
On average (relatively) intensity changes in 0.920 to 0.696 scope.This is corresponding to the Strength Changes of the a+13.8% around the mean value 0.808.It should be understood that the varying strength that can provide according to other embodiments of the invention above and below this value 13.8% changes.
In the embodiment of some lamps, the remote phosphor of larger shaping can provide higher high reflectance surface and the ratio of led chip/element surface area, that is, and and higher cavity reflectivity and efficient.Larger remote phosphor can also reduce transition density and relevant heat.That is to say to have the incident photon flux density that the larger area remote phosphor is tending towards reducing per unit fluorophor area.Larger remote phosphor also allows more easily the fluorophor that produces heat is carried out heat management, so that the fluorophor operating temperature can remain near surrounding environment, and then improves fluorophor efficient and increases the service life.Yet these larger fluorophor may cause the material cost higher for the encapsulation generation of larger remote phosphor and lamp.
It should be understood that multiple different pedestal can be used in the different embodiment according to the subject invention.Fig. 9 shows another embodiment according to LED lamp 160 of the present invention, comprises the pedestal 162 that is mounted to radiator 164.In this embodiment, pedestal normally has the triangle of end face 166 and three sides 168.Led chip 170 is mounted to each face 166,168, wherein forms between the led chip and is electrically connected (not shown), and is luminous so that led chip responds the signal of telecommunication.LED lamp 160 also can comprise remote phosphor or the diffuser dome of above-mentioned shaping.
Figure 10 and Figure 11 show another embodiment according to pedestal 180 of the present invention, and pedestal has end face 182, three emitter sides 184 and three open side 186.Led chip 188 is installed on the end face 182, in each emitter side 184 led chip is installed, and pedestal has four led chips altogether like this.With above-mentioned embodiment, led chip 188 comprises electrical connection, and is luminous so that led chip 188 responds the signals of telecommunication.In pedestal 180, emitter side 184 and the angle that end face 182 forms greater than 90 ° wherein in one embodiment, form about 105 ° angle with end face.It should be understood that emission dignity 184 can form multiple different angle from end face 182.In this embodiment, the angle of open side 186 and end face 182 is less than 90 °.
Figure 12 shows another embodiment according to LED lamp 190 of the present invention, has utilized the pedestal 180 shown in Figure 10 and Figure 11.。Pedestal 180 is mounted to heat spreader structures 192, and its medium-long range shaping fluorophor 194 is made by the material identical with the remote phosphor of above-mentioned shaping.The remote phosphor that is shaped also is mounted to heat spreader structures 192, and wherein pedestal 180 is arranged in the remote phosphor 194.This embodiment also can comprise further light scattering or diffuse into the diffuser dome of omni patterns.
Figure 13 shows the again embodiment according to pedestal 210 of the present invention, and pedestal has end face 212 and four emitter sides 214.Led chip 216 is arranged on in these faces each and is connected to each other in the manner described above, and is luminous with the response signal of telecommunication.In this embodiment, each emitter side 214 forms the angle of spending less than 90 with end face 212.In this embodiment, side 214 forms about 80 ° angle with end face 212, but it should be understood that side 214 and end face 212 can form a plurality of other angles, comprising but be not limited to about 90 °, 100 ° and 105 °.Other pedestals according to the present invention can have the surface of the varying number in different angles and orientation, to form the radiation pattern of expectation.In the illustrated embodiment, pedestal 210 comprises basically solid-state Heat Conduction Material, but it should be understood that other embodiment can comprise hollow or have the pedestal of other heat dissipation characteristics (such as heat pipe).Pedestal 210 can be used for according in the different LED lamp of the present invention, comprise have aforesaid heat spreader structures, the LED lamp of long-range shaping fluorophor and diffuser dome.
Figure 14 shows an embodiment according to LED lamp 230 of the present invention, has utilized to be similar to pedestal shown in Figure 13 210 and led chip 216 thereof.Lamp 230 comprises heat spreader structures 232 and closure member 234, and this closure member can be aforesaid long-range shaping fluorophor or diffuser dome.LED lamp 230 also comprises be used to the threaded portion 236 that is mounted to screw socket.In this embodiment, pedestal 210 is installed in the closure member 234 by heat pipe 238, and heat pipe is from pedestal 210 conduction heats, and heat is conducted to into heat spreader structures 232, heat can more effectively be dissipated in the surrounding environment in heat spreader structures.It should be understood that other heat conducting elements also can be used for according in the embodiments of the invention.
It should be understood that multiple different pedestal can be arranged on as shown in figure 14 the heat pipe.Figure 15 shows another embodiment of the pedestal 250 with end face 252 and five emitter sides 254, and each face has the led chip 256 that can be connected in the manner described above other.In this embodiment, emitter side 254 and the angle of end face 252 formation less than 90 °, but in other embodiments, some or all sides and end face 252 can form the angle greater than 90 °.Pedestal is mounted to from pedestal conduction heat to dissipate heat into the heat pipe 258 the surrounding environment, such as passing through above-mentioned heat spreader structures.
Can arrange according to the multiple different mode outside above-described embodiment according to lamp of the present invention.In certain embodiments, the led chip that is mounted to pedestal can be the white emission body, such as the warm white emitter.In the some of them of these embodiment, the remote phosphor of shaping may needn't be changed the light from led chip.The diffuser dome can contain the neutral scattering element, led chip light is diffused into the radiation pattern of expectation.Yet, it should be understood that the remote phosphor of shaping also can be used for having on the pedestal among the embodiment of white emission body, with the light of further change emitter emission.In other other embodiment, pedestal can contain the emitter of white emission body and different colours, and the different embodiment of these lamps use remote phosphor and diffuser, to produce the lamp emission of expectation.
Can utilize the diverse ways manufacturing according to pedestal of the present invention.As mentioned above, then pedestal can bend to base shape from the metallic plate punching press.This manufacture method cost efficient, but the pedestal that forms is hollow and may possess the pre-requisite abilities that conducts heat in the situation of not using attachment device (such as heat pipe) from emitter.Yet it should be understood that to provide the punch pad with extra heat management feature, dissipates with the heat that expectation is provided.
Alternatively, pedestal can be die casting, but this need to spend the processing cost at initial stage, utilizes instrument to make in enormous quantities so that these pedestals cost when in enormous quantities is more worthwhile.Use casting die, aluminum material can be used for pedestal, and pedestal can be the die casting that has recess in the position of led chip to be installed.Recess area should have the shape identical with led chip trace (footprint), and is a bit larger tham the led chip trace, and recess depths should be able to keep its led chip, so that led chip can not skid off recess easily.And then pedestal can make its electroplating surface with thin Ni/Cu or Ni/Ag layer, to have again mobile (reflowability).Subsequently, dry film can be pressed in the surface of recess area, and whole pedestal can be coated with reflectance coating such as white paint, reflective particle, reflective metals, DBR etc.Then dry film can be removed from recess area, to expose Cu or the Ag surface in the recess, then soldering paste can be coated with from the teeth outwards.Then led chip can be placed in the recess by picking and placeing method.In certain embodiments, led chip can have the back face metalization surface of electric insulation.The surface tension of recess and soldering paste can remain on the appropriate location with led chip before at Reflow Soldering (reflow).For inclined surface, pedestal can be oriented to so that gravity helps led chip is remained in its recess.Form in the situation of the pedestal that surpasses 90 ° of angles at base-plates surface and end face, pedestal should be inverted, so that led chip is remained in the recess of side.Then pedestal can Reflow Soldering, and the pedestal that has led chip on the end face may need again Reflow Soldering.Can form positive electrical lead to be connected to each other led chip.
It should be understood that different manufacture methods according to the present invention can have than more or less step mentioned above, and when utilizing different elements, can have different steps.For example, have in the situation of LED being installed the surface in metal-core printed circuit board, can come mounting base with diverse ways.In metal-cored PCB, can cut out groove, thereby allow it crooked so that can be around pedestal.Can use eutectic solder that metal-cored PCB is bonded to pedestal.
Although describe the present invention in detail with reference to some preferred disposition of the present invention, yet other versions also are feasible.Therefore, the spirit and scope of the present invention should not be limited to above-mentioned form.
Claims (54)
1. lamp comprises:
Pedestal;
Solid state light emitter is positioned on the described pedestal;
The shaping fluorophor is arranged to away from described solid state light emitter, so that pass described remote phosphor and be converted to different wave length from least a portion light of described solid state light emitter; And
Diffuser, the light that lamp is launched diffuses into omnidirectional radiation pattern.
2. lamp according to claim 1, wherein, described diffuser diffusion is from the light of described solid state light emitter and from the light of described shaping remote phosphor.
3. lamp according to claim 1, wherein, described diffuser comprises the diffuser dome.
4. lamp according to claim 1, wherein, described diffuser and described shaping remote phosphor are combined as a whole.
5. lamp according to claim 1 also comprises heat spreader structures, wherein, passes described pedestal and enters described heat spreader structures from the heat of described solid state light emitter.
6. lamp according to claim 5, wherein, described remote phosphor also is mounted to described heat spreader structures.
7. lamp according to claim 5, wherein, described shaping remote phosphor comprises Heat Conduction Material, and wherein, conversion heat conducts to described heat spreader structures.
8. lamp according to claim 1, wherein, described pedestal is elongated, and described solid state light emitter is installed on the top of described pedestal.
9. lamp according to claim 1, wherein, described pedestal comprises Heat Conduction Material at least in part.
10. lamp according to claim 1, wherein, described pedestal comprises a plurality of surfaces, and described solid state light emitter comprises a plurality of emitters, each described emitter is mounted to a described surface.
11. lamp according to claim 9, wherein, described pedestal has end face and forms a plurality of sides greater than the angles of 90 degree with described end face, and at least some in these sides have in described a plurality of emitter.
12. lamp according to claim 9, wherein, described pedestal has end face and forms a plurality of sides greater than the angles of about 105 degree with described end face.
13. lamp according to claim 1, wherein, described solid state light emitter is arranged with respect to described remote phosphor, so that the same thickness that the light of emission passes described remote phosphor from described light source along different directions.
14. lamp according to claim 1 has Strength Changes about ± 20% or omnidirectional radiation pattern still less.
15. lamp according to claim 1 has Strength Changes about ± 15% or omnidirectional radiation pattern still less.
16. lamp according to claim 1, wherein, described light source comprises the blue emission body, and described remote phosphor comprises the fluorophor that absorbs blue light and launch different wave length again, the white light that described lamp emission blue LED light and transition material light are combined into.
17. the bulb based on light emitting diode (LED) comprises:
Elongated pedestal has a plurality of surfaces;
A plurality of LED, each described LED can be mounted to a described surface, and described pedestal comprises the thermally conductive pathways of heat away from described LED conduction; And
Diffuser arranges that with respect to described LED so that pass described diffuser from the light of described LED, wherein said diffuser changes the radiation pattern of described LED, forms the bulb radiation pattern of expectation.
18. bulb according to claim 17, wherein, described diffuser changes over omni patterns with the radiation pattern of described LED.
19. bulb according to claim 17, wherein, described diffuser comprises the diffuser dome.
20. bulb according to claim 17 also comprises the shaping fluorophor that is arranged as away from described LED, so that pass described remote phosphor and be converted to different wave length from least some light of described LED.
21. bulb according to claim 17 also comprises heat spreader structures, wherein said thermally conductive pathways heat is coupled to described heat spreader structures.
22. bulb according to claim 21 also comprises the remote phosphor that is mounted to described heat spreader structures, conducts to described radiator from the heat of described remote phosphor.
23. bulb according to claim 17, wherein, described pedestal comprises Heat Conduction Material at least in part.
24. bulb according to claim 17, wherein, described pedestal has end face and forms a plurality of sides greater than the angles of 90 degree with described end face, and at least some in these sides have a described LED.
25. bulb according to claim 9, wherein, described pedestal has end face and forms a plurality of sides greater than the angles of about 105 degree with described end face.
26. bulb according to claim 20, wherein, described LED arranges with respect to described remote phosphor, so that the same thickness that the light of emission passes described remote phosphor from described LED along different directions.
27. bulb according to claim 20, wherein, described LED is similar to the spot light in the described remote phosphor.
28. bulb according to claim 18 has Strength Changes about ± 20% or omnidirectional radiation pattern still less.
29. bulb according to claim 18 has Strength Changes about ± 15% or omnidirectional radiation pattern still less.
30. a solid state lamp comprises:
Pedestal has a plurality of solid state light emitters, and wherein said pedestal comprises Heat Conduction Material at least in part;
Heat spreader structures, described heat susceptor is coupled to described heat spreader structures, and wherein the heat from described solid state light emitter conducts to described heat spreader structures by described pedestal; And
Remote phosphor, heat are coupled to described heat spreader structures, and wherein the heat from described remote phosphor conducts to described heat spreader structures.
31. lamp according to claim 30 also comprises the diffuser that is arranged as helping from the light scattering of described remote phosphor and described light source to pattern.
32. lamp according to claim 30, wherein, described remote phosphor is arranged to pass described remote phosphor and convert different wave length to from least some light of described solid-state emitters.
33. lamp according to claim 30, wherein, described pedestal has end face and forms a plurality of sides greater than the angles of 90 degree with described end face, and at least some in these sides have in the described solid state light emitter.
34. lamp according to claim 30, wherein, described light source is arranged with respect to described remote phosphor, so that the light of launching from described light source along different directions passes the about identical thickness of described remote phosphor.
35. lamp according to claim 30, wherein, described light source is similar to the spot light in the described remote phosphor.
36. lamp according to claim 31, wherein, described omnidirectional radiation pattern has approximately ± 20% or Strength Changes still less.
37. lamp according to claim 30, wherein, described pedestal also comprises heat pipe.
38. the bulb based on light emitting diode (LED) comprises:
Pedestal has a plurality of LED, and wherein, described pedestal comprises Heat Conduction Material at least in part;
Heat spreader structures, described heat susceptor is coupled to described heat spreader structures; And
Remote phosphor is arranged with respect to described LED, so that pass described remote phosphor and convert different wave length to from least some light of described LED, wherein, the white light that described lamps emission is combined into from the light of described LED and described remote phosphor.
39. described bulb also comprises for the threaded portion that described bulb is mounted to screw socket according to claim 38.
40. described bulb comprises the replacement of A level bulb according to claim 38.
41. described bulb also comprises the diffuser dome according to claim 38.
42. described bulb according to claim 38, wherein, described LED emission blue light, and described remote phosphor comprises the fluorescent material that absorbs blue light and launch gold-tinted or green glow again.
43. a bulb or lamp source comprise:
A plurality of solid-state emitters;
Pedestal, have end face, a plurality of the first side and a plurality of the second side, wherein, described the first side is in and the position of described end face formation greater than the angles of 90 degree, and described the second side is in and the position of described end face formation less than the angles of 90 degree, and described solid state light emitter is mounted at least some in described the first and second sides.
44. described light source according to claim 43, wherein, described solid state light emitter comprises light emitting diode (LED).
45. described light source according to claim 43, wherein, at least one in the described solid state light emitter is mounted to described end face.
46. described light source according to claim 43, wherein, described pedestal is made by Heat Conduction Material.
47. described light source according to claim 43, wherein, described solid state light emitter is electric coupling in series.
48. described light source according to claim 43, wherein, the contiguous described end face in described the first side, and contiguous described the first side, described the second side.
49. described light source according to claim 48, wherein, described solid state light emitter is mounted at least some in described the first side.
50. described light source according to claim 48, wherein, described solid state light emitter is installed on described the first side of one.
51. described light source comprises the first and second sides alternately according to claim 43.
52. described light source according to claim 43, wherein, the contiguous described end face in described the first and second sides and alternately.
53. 2 described light sources according to claim 5, wherein, described solid state light emitter is mounted at least some in described the first side.
54. described light source according to claim 43, wherein, when described pedestal when being vertical, described end face is approximate to be level.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33951610P | 2010-03-03 | 2010-03-03 | |
| US33951510P | 2010-03-03 | 2010-03-03 | |
| US61/339,515 | 2010-03-03 | ||
| US61/339,516 | 2010-03-03 | ||
| US12/848,825 | 2010-08-02 | ||
| US12/848,825 US8562161B2 (en) | 2010-03-03 | 2010-08-02 | LED based pedestal-type lighting structure |
| PCT/US2011/000397 WO2011109091A1 (en) | 2010-03-03 | 2011-03-02 | Led based pedestal-type lighting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102859259A true CN102859259A (en) | 2013-01-02 |
| CN102859259B CN102859259B (en) | 2016-11-02 |
Family
ID=43971453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180020709.2A Active CN102859259B (en) | 2010-03-03 | 2011-03-02 | Pedestal-type light structures based on LED |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8562161B2 (en) |
| EP (1) | EP2542822A1 (en) |
| JP (2) | JP5564121B2 (en) |
| KR (1) | KR20130036218A (en) |
| CN (1) | CN102859259B (en) |
| TW (1) | TW201202628A (en) |
| WO (1) | WO2011109091A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103162135A (en) * | 2013-02-27 | 2013-06-19 | 朱婉露 | Light-emitting diode (LED) lamp bulb |
| CN103791459A (en) * | 2014-01-24 | 2014-05-14 | 苏州镭易特照明科技有限公司 | LED bulb lamp emitting light at 360 degrees |
Families Citing this family (101)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| US20220029064A1 (en) * | 2004-05-07 | 2022-01-27 | Bruce H. Baretz | Enclosures with light emitting diodes within |
| US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
| US8541931B2 (en) * | 2009-03-17 | 2013-09-24 | Intematix Corporation | LED based lamp including reflective hood to reduce variation in illuminance |
| US8434883B2 (en) * | 2009-05-11 | 2013-05-07 | SemiOptoelectronics Co., Ltd. | LLB bulb having light extracting rough surface pattern (LERSP) and method of fabrication |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
| US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
| US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
| US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
| US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
| US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
| US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
| US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
| US9310030B2 (en) * | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
| US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
| US9275979B2 (en) * | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
| US9062830B2 (en) | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
| US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
| US8384105B2 (en) * | 2010-03-19 | 2013-02-26 | Micron Technology, Inc. | Light emitting diodes with enhanced thermal sinking and associated methods of operation |
| US8455888B2 (en) | 2010-05-20 | 2013-06-04 | Industrial Technology Research Institute | Light emitting diode module, and light emitting diode lamp |
| US10037947B1 (en) * | 2010-06-29 | 2018-07-31 | Cooledge Lighting Inc. | Electronic devices with yielding substrates |
| US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
| US8421329B2 (en) * | 2010-08-20 | 2013-04-16 | Silitek Electronic (Guangzhou) Co., Ltd. | Luminaire having light-emitting elements disposed on protrusions |
| WO2012052063A1 (en) * | 2010-10-22 | 2012-04-26 | Osram Ag | Led light source and associated structural unit |
| JP5049414B2 (en) | 2010-11-04 | 2012-10-17 | パナソニック株式会社 | Light bulb shaped lamp and lighting device |
| KR101781424B1 (en) | 2010-11-26 | 2017-09-26 | 서울반도체 주식회사 | LED Illumination Equipment |
| US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
| US9068701B2 (en) * | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
| US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
| JP5281665B2 (en) * | 2011-02-28 | 2013-09-04 | 株式会社東芝 | Lighting device |
| US8395310B2 (en) * | 2011-03-16 | 2013-03-12 | Bridgelux, Inc. | Method and apparatus for providing omnidirectional illumination using LED lighting |
| US8803412B2 (en) * | 2011-03-18 | 2014-08-12 | Abl Ip Holding Llc | Semiconductor lamp |
| US8461752B2 (en) * | 2011-03-18 | 2013-06-11 | Abl Ip Holding Llc | White light lamp using semiconductor light emitter(s) and remotely deployed phosphor(s) |
| US8272766B2 (en) | 2011-03-18 | 2012-09-25 | Abl Ip Holding Llc | Semiconductor lamp with thermal handling system |
| JP5759781B2 (en) * | 2011-03-31 | 2015-08-05 | ローム株式会社 | LED bulb |
| JP5172988B2 (en) * | 2011-04-12 | 2013-03-27 | シャープ株式会社 | Lighting device |
| EP2727436A1 (en) * | 2011-06-28 | 2014-05-07 | Cree, Inc. | Compact high efficiency remote led module |
| US20130044492A1 (en) * | 2011-08-18 | 2013-02-21 | Beat-Sonic Co., Ltd. | Led lamp |
| KR101326518B1 (en) | 2011-09-02 | 2013-11-07 | 엘지이노텍 주식회사 | Lighting device |
| KR101227526B1 (en) * | 2011-09-05 | 2013-01-31 | 엘지전자 주식회사 | Lighting apparatus |
| US8992051B2 (en) | 2011-10-06 | 2015-03-31 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
| US20130088848A1 (en) * | 2011-10-06 | 2013-04-11 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
| US9194541B2 (en) * | 2011-11-10 | 2015-11-24 | Epistar Corporation | Illumination apparatus |
| US9255666B2 (en) * | 2011-11-10 | 2016-02-09 | Epistar Corporation | Illumination apparatus |
| DE202011109399U1 (en) * | 2011-12-22 | 2013-03-25 | "Steinberg" Leuchtmittelwerke Gmbh | Lamp |
| KR20130080613A (en) * | 2012-01-05 | 2013-07-15 | 금호전기주식회사 | Led lighting apparatus using color filter |
| KR20130084884A (en) * | 2012-01-18 | 2013-07-26 | 삼성전자주식회사 | Illuminating device |
| KR102017538B1 (en) | 2012-01-31 | 2019-10-21 | 엘지이노텍 주식회사 | Lighting device |
| CN203521471U (en) * | 2012-02-16 | 2014-04-02 | 松下电器产业株式会社 | Lamp and light-emitting device |
| WO2013123128A1 (en) * | 2012-02-17 | 2013-08-22 | Intematix Corporation | Solid-state lamps with improved emission efficiency and photoluminescence wavelength conversion components therefor |
| US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
| JP5374668B1 (en) * | 2012-03-26 | 2013-12-25 | パナソニック株式会社 | Illumination light source and illumination device |
| CN103375708B (en) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | Light-emitting diode lamp source device |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| US8680755B2 (en) * | 2012-05-07 | 2014-03-25 | Lg Innotek Co., Ltd. | Lighting device having reflectors for indirect light emission |
| US9634201B2 (en) | 2012-05-14 | 2017-04-25 | Koninklijke Philips N.V. | Light emitting device with nanostructured phosphor |
| KR101349843B1 (en) * | 2012-05-17 | 2014-01-10 | 엘지전자 주식회사 | Lighting apparatus |
| JP6228598B2 (en) * | 2012-06-05 | 2017-11-08 | フィリップス ライティング ホールディング ビー ヴィ | Illumination device having remote wavelength conversion layer |
| CN102777791B (en) * | 2012-07-12 | 2015-09-09 | 深圳和而泰照明科技有限公司 | Light fixture and full optic angle LED bulb thereof |
| JP2014022171A (en) * | 2012-07-18 | 2014-02-03 | Ushio Inc | Led bulb |
| EP2876357A4 (en) * | 2012-07-23 | 2016-06-22 | Guizhou Guangpusen Photoelectric Co Ltd | Method for constructing universal led bulb and snap ring lens type led bulb and led lamp |
| EP2886933B1 (en) * | 2012-07-23 | 2018-04-18 | Guizhou Gzgps Co., Ltd | Method for forming led bulb with high interchangeability and universality and integrated led bulb and lamp |
| TW201418622A (en) * | 2012-08-08 | 2014-05-16 | Switch Bulb Co Inc | LED bulb having a uniform light-distribution profile |
| EP2703711A1 (en) | 2012-08-28 | 2014-03-05 | Wentai Technology Corporation | LED lamp and heat dissipation device thereof |
| WO2014036705A1 (en) * | 2012-09-06 | 2014-03-13 | Liu Lehua | Led lamp using glass lamp cover with internally coated remote fluorescent powder |
| DE102012220264A1 (en) * | 2012-11-07 | 2014-05-08 | Osram Gmbh | Bulb for reflector lamp, has scattering piston which is arranged equally from base element which supports light emitting component within litter piston, so that scattering piston scatters light diffusely in specific portion |
| JP2014103062A (en) * | 2012-11-22 | 2014-06-05 | Enplas Corp | Lighting fixture |
| CN103851372B (en) * | 2012-12-04 | 2016-06-29 | 展晶科技(深圳)有限公司 | Light emitting diode bulb |
| US20140198506A1 (en) * | 2013-01-14 | 2014-07-17 | Genesis Photonics Inc. | Lighting device |
| KR20140094314A (en) * | 2013-01-22 | 2014-07-30 | 서울반도체 주식회사 | LED Lamp |
| JP2014165082A (en) * | 2013-02-26 | 2014-09-08 | Toshiba Lighting & Technology Corp | Lighting device |
| US9435492B2 (en) | 2013-03-15 | 2016-09-06 | Cree, Inc. | LED luminaire with improved thermal management and novel LED interconnecting architecture |
| US8899794B2 (en) | 2013-03-15 | 2014-12-02 | Bby Solutions, Inc. | LED bulb optical system with uniform light distribution |
| US9388946B1 (en) | 2013-03-15 | 2016-07-12 | Inner Lighting, LLC | Lighting device having a vertical portion and horizontal portion |
| US9416922B1 (en) | 2013-03-15 | 2016-08-16 | Inner Lighting, LLC | Switchable solid state lighting system |
| WO2014194024A1 (en) * | 2013-05-29 | 2014-12-04 | Venntis Technologies LLC | Light emitting device with heat sink |
| US20140375202A1 (en) * | 2013-06-25 | 2014-12-25 | Uniled Lighting Tw., Inc. | Led bulb |
| TW201506296A (en) * | 2013-08-12 | 2015-02-16 | Delta Electronics Inc | Light emitting diode bulb |
| US9541241B2 (en) * | 2013-10-03 | 2017-01-10 | Cree, Inc. | LED lamp |
| TWM473612U (en) * | 2013-10-25 | 2014-03-01 | Unity Opto Technology Co Ltd | LED holder and bulb thereof |
| TWI481795B (en) * | 2013-12-27 | 2015-04-21 | Harvatek Corp | A light emitting diode lamp |
| EP3097347B1 (en) * | 2014-01-20 | 2017-06-28 | Philips Lighting Holding B.V. | Lighting device with foldable housing |
| US9464802B2 (en) * | 2014-02-19 | 2016-10-11 | Ozyegin Universitesi | Flow controlled effective LED based lighting system |
| US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
| DE102015001723A1 (en) | 2015-02-05 | 2016-08-11 | Sergey Dyukin | The method of improving the characteristics of lighting devices with a front lighting of the light guide, which include the luminophore, which is illuminated with semiconductor structures. |
| US20170030530A1 (en) * | 2015-07-24 | 2017-02-02 | Curtis Alan Roys | Method and assembly for replacing incandescent lights |
| WO2017031138A1 (en) | 2015-08-17 | 2017-02-23 | Infinite Arthroscopy Inc, Limited | Light source |
| WO2017060084A2 (en) * | 2015-10-08 | 2017-04-13 | Philips Lighting Holding B.V. | A light emitting device. |
| WO2017087448A1 (en) | 2015-11-16 | 2017-05-26 | Infinite Arthroscopy Inc, Limited | Wireless medical imaging system |
| US10267489B2 (en) * | 2015-12-22 | 2019-04-23 | Citizen Electronics Co., Ltd. | Light-emitting apparatus |
| US10244599B1 (en) | 2016-11-10 | 2019-03-26 | Kichler Lighting Llc | Warm dim circuit for use with LED lighting fixtures |
| US10578510B2 (en) * | 2016-11-28 | 2020-03-03 | Applied Materials, Inc. | Device for desorbing molecules from chamber walls |
| CN110831488B (en) | 2017-02-15 | 2022-03-11 | 青金石控股有限责任公司 | Wireless medical imaging system including a head unit and an optical cable containing an integrated light source |
| JP2018124560A (en) * | 2018-03-02 | 2018-08-09 | 日本電気硝子株式会社 | Fluorescent wheel for projector, and light-emitting device for projector |
| JP6880328B2 (en) * | 2018-09-07 | 2021-06-02 | ルミレッズ ホールディング ベーフェー | Support for light emitting elements and luminaires |
| WO2020247861A1 (en) * | 2019-06-06 | 2020-12-10 | Mcgovern Roy | Flashlight with rectangular wide-beam illumination |
| US11371687B2 (en) * | 2019-08-23 | 2022-06-28 | Lumileds Llc | Wide beam angle LED assembly |
| EP4085219A1 (en) * | 2020-01-02 | 2022-11-09 | Signify Holding B.V. | Lighting device |
| USD938584S1 (en) | 2020-03-30 | 2021-12-14 | Lazurite Holdings Llc | Hand piece |
| USD972176S1 (en) | 2020-08-06 | 2022-12-06 | Lazurite Holdings Llc | Light source |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030038291A1 (en) * | 2001-08-24 | 2003-02-27 | Densen Cao | Semiconductor light source |
| WO2009091562A2 (en) * | 2008-01-15 | 2009-07-23 | Philip Premysler | Omnidirectional led light bulb |
| WO2009158422A1 (en) * | 2008-06-26 | 2009-12-30 | Osram Sylvania, Inc. | Led lamp with remote phosphor coating and method of making the lamp |
| US20090322197A1 (en) * | 2008-06-30 | 2009-12-31 | Rene Helbing | Light emitting device having a transparent thermally conductive layer |
Family Cites Families (367)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2394992A (en) | 1943-06-30 | 1946-02-19 | Holophane Co Inc | Lighting unit |
| US3143592A (en) | 1961-11-14 | 1964-08-04 | Inland Electronics Products Co | Heat dissipating mounting structure for semiconductor devices |
| US3581162A (en) | 1969-07-01 | 1971-05-25 | Rca Corp | Optical semiconductor device |
| NL7302483A (en) | 1972-02-22 | 1973-08-24 | ||
| US4204246A (en) | 1976-02-14 | 1980-05-20 | Sony Corporation | Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block |
| JPH0416447Y2 (en) | 1985-07-22 | 1992-04-13 | ||
| US5140220A (en) | 1985-12-02 | 1992-08-18 | Yumi Sakai | Light diffusion type light emitting diode |
| JPH0381903A (en) | 1989-08-24 | 1991-04-08 | Fuji Electric Co Ltd | Display device |
| US5838101A (en) | 1992-10-28 | 1998-11-17 | Gte Products Corporation | Fluorescent lamp with improved CRI and brightness |
| JPH06283006A (en) | 1993-03-26 | 1994-10-07 | Toshiba Lighting & Technol Corp | Glass globe for illumination and lighting fixture |
| DE4311937A1 (en) | 1993-04-10 | 1994-10-13 | Telefunken Microelectron | Light-emitting device |
| EP0714348A4 (en) | 1993-07-27 | 1998-05-06 | Physical Optics Corp | Light source destructuring and shaping device |
| US5655830A (en) | 1993-12-01 | 1997-08-12 | General Signal Corporation | Lighting device |
| US5463280A (en) | 1994-03-03 | 1995-10-31 | National Service Industries, Inc. | Light emitting diode retrofit lamp |
| JP2596709B2 (en) | 1994-04-06 | 1997-04-02 | 都築 省吾 | Illumination light source device using semiconductor laser element |
| CA2134902C (en) | 1994-04-07 | 2000-05-16 | Friedrich Bertignoll | Light diffusing apparatus |
| US5585783A (en) | 1994-06-28 | 1996-12-17 | Hall; Roger E. | Marker light utilizing light emitting diodes disposed on a flexible circuit board |
| US5561346A (en) | 1994-08-10 | 1996-10-01 | Byrne; David J. | LED lamp construction |
| US5519596A (en) | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
| US5688042A (en) | 1995-11-17 | 1997-11-18 | Lumacell, Inc. | LED lamp |
| US5806965A (en) | 1996-01-30 | 1998-09-15 | R&M Deese, Inc. | LED beacon light |
| JPH09265807A (en) | 1996-03-29 | 1997-10-07 | Toshiba Lighting & Technol Corp | Led light source, led signal lamp, and traffic signal |
| US5890794A (en) | 1996-04-03 | 1999-04-06 | Abtahi; Homayoon | Lighting units |
| JP3009626B2 (en) | 1996-05-20 | 2000-02-14 | 日吉電子株式会社 | LED luminous bulb |
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| US5949347A (en) | 1996-09-11 | 1999-09-07 | Leotek Electronics Corporation | Light emitting diode retrofitting lamps for illuminated signs |
| TW330233B (en) | 1997-01-23 | 1998-04-21 | Philips Eloctronics N V | Luminary |
| JP3138653B2 (en) | 1997-02-25 | 2001-02-26 | 三山化成株式会社 | Injection machine |
| US5934798A (en) | 1997-03-07 | 1999-08-10 | Truck-Lite Co., Inc. | Light emitting diode license lamp |
| US5850126A (en) | 1997-04-11 | 1998-12-15 | Kanbar; Maurice S. | Screw-in led lamp |
| IT1292717B1 (en) | 1997-04-24 | 1999-02-11 | Incerti & Simonini Di Incerti | LOW VOLTAGE LIGHTING DEVICE. |
| US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
| US5947588A (en) | 1997-10-06 | 1999-09-07 | Grand General Accessories Manufacturing Inc. | Light fixture with an LED light bulb having a conventional connection post |
| JPH11177149A (en) | 1997-12-10 | 1999-07-02 | Hiyoshi Denshi Kk | Electric lamp |
| US6147367A (en) | 1997-12-10 | 2000-11-14 | Industrial Technology Research Institute | Packaging design for light emitting diode |
| JP3817665B2 (en) | 1998-01-26 | 2006-09-06 | 三菱電機株式会社 | lighting equipment |
| US6276822B1 (en) | 1998-02-20 | 2001-08-21 | Yerchanik Bedrosian | Method of replacing a conventional vehicle light bulb with a light-emitting diode array |
| JPH11260125A (en) | 1998-03-13 | 1999-09-24 | Omron Corp | Light source module |
| JP4109756B2 (en) | 1998-07-07 | 2008-07-02 | スタンレー電気株式会社 | Light emitting diode |
| US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| CN1125939C (en) | 1998-09-17 | 2003-10-29 | 皇家菲利浦电子有限公司 | LED lamp |
| US6793374B2 (en) * | 1998-09-17 | 2004-09-21 | Simon H. A. Begemann | LED lamp |
| DE69937993C5 (en) | 1998-09-28 | 2019-01-10 | Koninklijke Philips N.V. | LIGHTING ARRANGEMENT |
| US6220731B1 (en) | 1998-11-10 | 2001-04-24 | Altman Stage Lighting Co., Inc. | Cyclorama light |
| JP4122607B2 (en) | 1998-11-30 | 2008-07-23 | 東芝ライテック株式会社 | Aviation sign lights |
| GB2345954B (en) | 1999-01-20 | 2003-03-19 | Ian Lennox Crawford | Non-filament lights |
| US6218785B1 (en) | 1999-03-19 | 2001-04-17 | Incerti & Simonini Di Incerti Edda & C. S.N.C. | Low-tension lighting device |
| US6270722B1 (en) | 1999-03-31 | 2001-08-07 | Nalco Chemical Company | Stabilized bromine solutions, method of manufacture and uses thereof for biofouling control |
| US6456961B1 (en) | 1999-04-30 | 2002-09-24 | Srinivas Patil | Method and apparatus for creating testable circuit designs having embedded cores |
| DE19922176C2 (en) | 1999-05-12 | 2001-11-15 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement and its use in a lighting device |
| US6268801B1 (en) | 1999-06-03 | 2001-07-31 | Leotek Electronics Corporation | Method and apparatus for retro-fitting a traffic signal light with a light emitting diode lamp module |
| US6517221B1 (en) | 1999-06-18 | 2003-02-11 | Ciena Corporation | Heat pipe heat sink for cooling a laser diode |
| JP2001053341A (en) | 1999-08-09 | 2001-02-23 | Kazuo Kobayashi | Surface-emitting indicator |
| US6550953B1 (en) | 1999-08-20 | 2003-04-22 | Toyoda Gosei Co. Ltd. | Light emitting diode lamp device |
| US6227679B1 (en) | 1999-09-16 | 2001-05-08 | Mule Lighting Inc | Led light bulb |
| WO2001024583A1 (en) | 1999-09-29 | 2001-04-05 | Transportation And Environment Research Institute Ltd. | Light emitting diode (led) lamp |
| JP4078002B2 (en) | 1999-10-18 | 2008-04-23 | 常盤電業株式会社 | Luminescent body and signal lamp |
| US6350041B1 (en) * | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
| AU2001246355A1 (en) | 2000-02-11 | 2001-08-20 | Gerhard Abler | Lighting body |
| US7550935B2 (en) * | 2000-04-24 | 2009-06-23 | Philips Solid-State Lighting Solutions, Inc | Methods and apparatus for downloading lighting programs |
| JP5016746B2 (en) | 2000-07-28 | 2012-09-05 | キヤノン株式会社 | Imaging apparatus and driving method thereof |
| GB2366610A (en) | 2000-09-06 | 2002-03-13 | Mark Shaffer | Electroluminscent lamp |
| US6583550B2 (en) * | 2000-10-24 | 2003-06-24 | Toyoda Gosei Co., Ltd. | Fluorescent tube with light emitting diodes |
| DE20018435U1 (en) | 2000-10-27 | 2001-02-22 | Shining Blick Entpr Co | Light bulb with bendable lamp bulbs contained therein |
| US6819486B2 (en) | 2001-01-17 | 2004-11-16 | 3M Innovative Properties Company | Projection screen having elongated structures |
| TW552726B (en) | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
| JP2007059930A (en) | 2001-08-09 | 2007-03-08 | Matsushita Electric Ind Co Ltd | Led lighting fixture and card type led lighting light source |
| JP4076329B2 (en) | 2001-08-13 | 2008-04-16 | エイテックス株式会社 | LED bulb |
| US6465961B1 (en) | 2001-08-24 | 2002-10-15 | Cao Group, Inc. | Semiconductor light source using a heat sink with a plurality of panels |
| US6746885B2 (en) * | 2001-08-24 | 2004-06-08 | Densen Cao | Method for making a semiconductor light source |
| US6634770B2 (en) | 2001-08-24 | 2003-10-21 | Densen Cao | Light source using semiconductor devices mounted on a heat sink |
| TW533750B (en) | 2001-11-11 | 2003-05-21 | Solidlite Corp | LED lamp |
| WO2003056636A1 (en) * | 2001-12-29 | 2003-07-10 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
| DE50310999D1 (en) | 2002-01-07 | 2009-02-12 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | LAMP |
| EP1490453B1 (en) | 2002-03-25 | 2012-08-15 | Philips Intellectual Property & Standards GmbH | Tri-color white light led lamp |
| US6796698B2 (en) | 2002-04-01 | 2004-09-28 | Gelcore, Llc | Light emitting diode-based signal light |
| US7048412B2 (en) | 2002-06-10 | 2006-05-23 | Lumileds Lighting U.S., Llc | Axial LED source |
| JP2004055772A (en) | 2002-07-18 | 2004-02-19 | Citizen Electronics Co Ltd | Led light emitting device |
| US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
| US6764202B1 (en) | 2002-09-25 | 2004-07-20 | Larry Herring | Illuminator |
| US6896381B2 (en) | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
| JP4203985B2 (en) | 2002-10-25 | 2009-01-07 | 株式会社クラベ | Illumination lighting device |
| DE10251955A1 (en) | 2002-11-08 | 2004-05-19 | Hella Kg Hueck & Co. | High-power LED insert module for motor vehicle, has dielectric in flat contact with heat sink and conductive track structure |
| US7080924B2 (en) | 2002-12-02 | 2006-07-25 | Harvatek Corporation | LED light source with reflecting side wall |
| US20080037257A1 (en) * | 2002-12-11 | 2008-02-14 | Charles Bolta | Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement |
| US7258464B2 (en) | 2002-12-18 | 2007-08-21 | General Electric Company | Integral ballast lamp thermal management method and apparatus |
| EP1588430A1 (en) | 2003-01-27 | 2005-10-26 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar short pass reflector and method of making |
| JP3910543B2 (en) | 2003-02-07 | 2007-04-25 | 星和電機株式会社 | Spot lighting fixture |
| US6936857B2 (en) * | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
| US20040223315A1 (en) | 2003-03-03 | 2004-11-11 | Toyoda Gosei Co., Ltd. | Light emitting apparatus and method of making same |
| US7556406B2 (en) * | 2003-03-31 | 2009-07-07 | Lumination Llc | Led light with active cooling |
| US20040201990A1 (en) | 2003-04-10 | 2004-10-14 | Meyer William E. | LED lamp |
| US6910794B2 (en) | 2003-04-25 | 2005-06-28 | Guide Corporation | Automotive lighting assembly cooling system |
| US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| EP1627178B1 (en) | 2003-05-05 | 2018-11-07 | GE Lighting Solutions, LLC | Led-based light bulb |
| US6864513B2 (en) | 2003-05-07 | 2005-03-08 | Kaylu Industrial Corporation | Light emitting diode bulb having high heat dissipating efficiency |
| US6860620B2 (en) | 2003-05-09 | 2005-03-01 | Agilent Technologies, Inc. | Light unit having light emitting diodes |
| US7329029B2 (en) | 2003-05-13 | 2008-02-12 | Light Prescriptions Innovators, Llc | Optical device for LED-based lamp |
| WO2004107213A1 (en) | 2003-05-31 | 2004-12-09 | Nhn Corporation | A method of managing websites registered in search engine and a system thereof |
| US6803607B1 (en) | 2003-06-13 | 2004-10-12 | Cotco Holdings Limited | Surface mountable light emitting device |
| US20080106893A1 (en) | 2004-07-02 | 2008-05-08 | S. C. Johnson & Son, Inc. | Lamp and bulb for illumination and ambiance lighting |
| JP2005021635A (en) | 2003-07-04 | 2005-01-27 | Amada Insatsu Kako Kk | Freely derricking assembly ornamental body |
| US7172314B2 (en) | 2003-07-29 | 2007-02-06 | Plastic Inventions & Patents, Llc | Solid state electric light bulb |
| US7029935B2 (en) | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| JP4236544B2 (en) | 2003-09-12 | 2009-03-11 | 三洋電機株式会社 | Lighting device |
| MY130919A (en) | 2003-09-19 | 2007-07-31 | Mattel Inc | Multidirectional light emitting diode unit |
| JP2005108700A (en) * | 2003-09-30 | 2005-04-21 | Toshiba Lighting & Technology Corp | Light source |
| US6982518B2 (en) | 2003-10-01 | 2006-01-03 | Enertron, Inc. | Methods and apparatus for an LED light |
| JP4934954B2 (en) | 2003-10-15 | 2012-05-23 | 日亜化学工業株式会社 | Heat sink and semiconductor device provided with heat sink |
| CN100472823C (en) | 2003-10-15 | 2009-03-25 | 日亚化学工业株式会社 | Light-emitting device |
| US7094362B2 (en) | 2003-10-29 | 2006-08-22 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
| US7144135B2 (en) | 2003-11-26 | 2006-12-05 | Philips Lumileds Lighting Company, Llc | LED lamp heat sink |
| AU2004300444B2 (en) | 2003-12-11 | 2009-06-11 | Signify North America Corporation | Thermal management methods and apparatus for lighting devices |
| US7309145B2 (en) | 2004-01-13 | 2007-12-18 | Seiko Epson Corporation | Light source apparatus and projection display apparatus |
| US6948829B2 (en) | 2004-01-28 | 2005-09-27 | Dialight Corporation | Light emitting diode (LED) light bulbs |
| KR200350484Y1 (en) | 2004-02-06 | 2004-05-13 | 주식회사 대진디엠피 | Corn Type LED Light |
| US7250715B2 (en) | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
| US7086756B2 (en) | 2004-03-18 | 2006-08-08 | Lighting Science Group Corporation | Lighting element using electronically activated light emitting elements and method of making same |
| US7824065B2 (en) | 2004-03-18 | 2010-11-02 | Lighting Science Group Corporation | System and method for providing multi-functional lighting using high-efficiency lighting elements in an environment |
| JP4451178B2 (en) | 2004-03-25 | 2010-04-14 | スタンレー電気株式会社 | Light emitting device |
| JP2005286267A (en) | 2004-03-31 | 2005-10-13 | Hitachi Lighting Ltd | Light emitting diode lamp |
| CN101427286B (en) | 2004-04-01 | 2011-06-15 | 库珀惠洛克公司 | Method and apparatus for providing a notification appliance with a light emitting diode |
| US20050242711A1 (en) | 2004-04-30 | 2005-11-03 | Joseph Bloomfield | Multi-color solid state light emitting device |
| US7819549B2 (en) | 2004-05-05 | 2010-10-26 | Rensselaer Polytechnic Institute | High efficiency light source using solid-state emitter and down-conversion material |
| US7086767B2 (en) | 2004-05-12 | 2006-08-08 | Osram Sylvania Inc. | Thermally efficient LED bulb |
| KR20060000977A (en) | 2004-06-30 | 2006-01-06 | 엘지.필립스 엘시디 주식회사 | Back light unit of liquid crystal display device |
| US20060002108A1 (en) | 2004-06-30 | 2006-01-05 | Ouderkirk Andrew J | Phosphor based illumination system having a short pass reflector and method of making same |
| JP2006040850A (en) | 2004-07-23 | 2006-02-09 | Shuji Fukuya | Lighting system using ultraviolet light emitting diode |
| US7140753B2 (en) | 2004-08-11 | 2006-11-28 | Harvatek Corporation | Water-cooling heat dissipation device adopted for modulized LEDs |
| US7265488B2 (en) | 2004-09-30 | 2007-09-04 | Avago Technologies General Ip Pte. Ltd | Light source with wavelength converting material |
| DE102004051382A1 (en) | 2004-10-21 | 2006-04-27 | Oec Ag | Microlens array |
| US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| US7165866B2 (en) | 2004-11-01 | 2007-01-23 | Chia Mao Li | Light enhanced and heat dissipating bulb |
| US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
| US7344902B2 (en) | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| CN2757374Y (en) | 2004-11-18 | 2006-02-08 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| JP2006156187A (en) * | 2004-11-30 | 2006-06-15 | Mitsubishi Electric Corp | Led light source device and led electric bulb |
| JP2006156837A (en) | 2004-11-30 | 2006-06-15 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device, luminescent module and lighting device |
| WO2006059728A1 (en) | 2004-12-03 | 2006-06-08 | Sony Corporation | Light pickup lens, light emitting element assembly, surface light source device, and color liquid crystal display unit assembly |
| US20060124953A1 (en) | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
| EP1672755B1 (en) | 2004-12-17 | 2015-09-23 | Nichia Corporation | Light emitting device |
| US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
| US8125137B2 (en) * | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| TWI266079B (en) | 2005-01-10 | 2006-11-11 | Shiu-Hua Huang | Steering lens and light emitting system using the same |
| US20060187653A1 (en) | 2005-02-10 | 2006-08-24 | Olsson Mark S | LED illumination devices |
| CN101303113A (en) | 2005-02-24 | 2008-11-12 | 莱特浩斯科技有限公司 | Light emitting device and light emitting object using the same |
| GB2424507B (en) | 2005-03-22 | 2007-02-21 | Smartslab Ltd | Modular display system |
| WO2006104553A1 (en) | 2005-03-25 | 2006-10-05 | Five Star Import Group L.L.C. | Led light bulb |
| US7758223B2 (en) | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
| US7270446B2 (en) | 2005-05-09 | 2007-09-18 | Lighthouse Technology Co., Ltd | Light module with combined heat transferring plate and heat transferring pipes |
| JP4539851B2 (en) | 2005-05-23 | 2010-09-08 | シャープ株式会社 | Backlight module and display device |
| JP2007049019A (en) | 2005-08-11 | 2007-02-22 | Koha Co Ltd | Light emitting device |
| US20070045641A1 (en) | 2005-08-23 | 2007-03-01 | Yin Chua Janet B | Light source with UV LED and UV reflector |
| US8563339B2 (en) * | 2005-08-25 | 2013-10-22 | Cree, Inc. | System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices |
| KR100722590B1 (en) | 2005-08-30 | 2007-05-28 | 삼성전기주식회사 | LED lens for backlight |
| DE102005042066A1 (en) | 2005-09-03 | 2007-03-15 | Osram Opto Semiconductors Gmbh | Backlight arrangement with arranged in lighting groups semiconductor light sources |
| JP2007081090A (en) | 2005-09-14 | 2007-03-29 | Fujikura Ltd | White light emitter and lighting device |
| WO2007041574A1 (en) | 2005-10-03 | 2007-04-12 | S. C. Johnson & Son, Inc. | Light apparatus |
| CN100464411C (en) | 2005-10-20 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Encapsulation method and structure of light emitting diode |
| US7377674B2 (en) | 2005-10-28 | 2008-05-27 | Advanced Accessory Systems, Llc | Low profile light for article carrier system |
| US7354174B1 (en) | 2005-12-05 | 2008-04-08 | Technical Consumer Products, Inc. | Energy efficient festive lamp |
| JP2007165811A (en) | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | Light emitting device |
| US7213940B1 (en) * | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
| WO2007073496A2 (en) * | 2005-12-22 | 2007-06-28 | Cree Led Lighting Solutions, Inc. | Lighting device |
| US7413325B2 (en) | 2005-12-28 | 2008-08-19 | International Development Corporation | LED bulb |
| JP5013713B2 (en) | 2006-01-04 | 2012-08-29 | ローム株式会社 | Light emitting device and manufacturing method thereof |
| TW200728848A (en) | 2006-01-20 | 2007-08-01 | Au Optronics Corp | Light diffusion module and backlight module using the same |
| GB0604250D0 (en) | 2006-02-28 | 2006-04-12 | Tahmosybayat Ghollam | Lens assembly |
| US7682850B2 (en) | 2006-03-17 | 2010-03-23 | Philips Lumileds Lighting Company, Llc | White LED for backlight with phosphor plates |
| ITRE20060052A1 (en) | 2006-04-28 | 2007-10-29 | Incerti Simonini Snc | SECONDARY OPTICAL DEVICE FOR LEDS LAMPS |
| EA200870494A1 (en) | 2006-05-02 | 2009-06-30 | Супербалбс, Инк. | PLASTIC LED LAMP |
| US7549782B2 (en) * | 2006-05-11 | 2009-06-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor light source configured as a light tube |
| KR20090031370A (en) | 2006-05-23 | 2009-03-25 | 크리 엘이디 라이팅 솔루션즈, 인크. | Lighting device |
| KR100754405B1 (en) | 2006-06-01 | 2007-08-31 | 삼성전자주식회사 | Lighting device |
| US7708452B2 (en) | 2006-06-08 | 2010-05-04 | Lighting Science Group Corporation | Lighting apparatus including flexible power supply |
| US7682052B2 (en) * | 2006-06-21 | 2010-03-23 | Osram Sylvania Inc. | Heat sink |
| US7922359B2 (en) | 2006-07-17 | 2011-04-12 | Liquidleds Lighting Corp. | Liquid-filled LED lamp with heat dissipation means |
| JP4761207B2 (en) | 2006-07-21 | 2011-08-31 | 株式会社東京精密 | Wafer storage method |
| US20130293098A1 (en) | 2006-08-03 | 2013-11-07 | Intematix Corporation | Solid-state linear lighting arrangements including light emitting phosphor |
| US7663152B2 (en) | 2006-08-09 | 2010-02-16 | Philips Lumileds Lighting Company, Llc | Illumination device including wavelength converting element side holding heat sink |
| US20080062694A1 (en) | 2006-09-07 | 2008-03-13 | Foxconn Technology Co., Ltd. | Heat dissipation device for light emitting diode module |
| WO2008032251A1 (en) | 2006-09-14 | 2008-03-20 | Koninklijke Philips Electronics N.V. | Lighting assembly and method for providing cooling of a light source |
| JP4981390B2 (en) | 2006-09-20 | 2012-07-18 | オスラム・メルコ株式会社 | LED lamp |
| JP2008091140A (en) | 2006-09-29 | 2008-04-17 | Toshiba Lighting & Technology Corp | Led bulb and lighting equipment |
| KR100835063B1 (en) * | 2006-10-02 | 2008-06-03 | 삼성전기주식회사 | SURFACE LIGHT SOURCE DEVICE USING LEDs |
| TWM309750U (en) | 2006-10-18 | 2007-04-11 | Lighthouse Technology Co Ltd | Light emitting diode package |
| US7659549B2 (en) | 2006-10-23 | 2010-02-09 | Chang Gung University | Method for obtaining a better color rendering with a photoluminescence plate |
| JP2008108835A (en) | 2006-10-24 | 2008-05-08 | Harison Toshiba Lighting Corp | Semiconductor light emitting device and method for manufacturing the same |
| USD546980S1 (en) * | 2006-10-25 | 2007-07-17 | Hsin-Chih Chung Lee | LED bulb |
| WO2008052318A1 (en) | 2006-10-31 | 2008-05-08 | Tir Technology Lp | Light source comprising a light-excitable medium |
| CN100572908C (en) | 2006-11-17 | 2009-12-23 | 富准精密工业(深圳)有限公司 | Led lamp |
| KR100930171B1 (en) * | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | White light emitting device and white light source module using same |
| US20080149166A1 (en) | 2006-12-21 | 2008-06-26 | Goldeneye, Inc. | Compact light conversion device and light source with high thermal conductivity wavelength conversion material |
| DE102006061164B4 (en) | 2006-12-22 | 2018-12-27 | Osram Opto Semiconductors Gmbh | Light-emitting device |
| US20110128742A9 (en) | 2007-01-07 | 2011-06-02 | Pui Hang Yuen | High efficiency low cost safety light emitting diode illumination device |
| US7686478B1 (en) * | 2007-01-12 | 2010-03-30 | Ilight Technologies, Inc. | Bulb for light-emitting diode with color-converting insert |
| US9159888B2 (en) * | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US9024349B2 (en) * | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US7753568B2 (en) | 2007-01-23 | 2010-07-13 | Foxconn Technology Co., Ltd. | Light-emitting diode assembly and method of fabrication |
| USD553267S1 (en) * | 2007-02-09 | 2007-10-16 | Wellion Asia Limited | LED light bulb |
| US20080192458A1 (en) | 2007-02-12 | 2008-08-14 | Intematix Corporation | Light emitting diode lighting system |
| US20080212332A1 (en) | 2007-03-01 | 2008-09-04 | Medinis David M | LED cooling system |
| CN100573944C (en) | 2007-03-07 | 2009-12-23 | 光宝科技股份有限公司 | White light emitting diode |
| US7976182B2 (en) | 2007-03-21 | 2011-07-12 | International Rectifier Corporation | LED lamp assembly with temperature control and method of making the same |
| EP1975505A1 (en) | 2007-03-26 | 2008-10-01 | Koninklijke Philips Electronics N.V. | Lighting device |
| JP2008262765A (en) | 2007-04-11 | 2008-10-30 | Stanley Electric Co Ltd | Light-emitting diode lamp fitting with wave length conversion layer |
| TWM319375U (en) | 2007-04-23 | 2007-09-21 | Guo-Chiou Jiang | LED lamp |
| WO2008134056A1 (en) | 2007-04-26 | 2008-11-06 | Deak-Lam Inc. | Photon energy coversion structure |
| US7540761B2 (en) | 2007-05-01 | 2009-06-02 | Tyco Electronics Corporation | LED connector assembly with heat sink |
| JP5006102B2 (en) | 2007-05-18 | 2012-08-22 | 株式会社東芝 | Light emitting device and manufacturing method thereof |
| US8425101B2 (en) | 2007-05-29 | 2013-04-23 | Koninklijke Philips Electronics N.V. | Illumination system, luminaire and backlighting unit |
| JP4920497B2 (en) | 2007-05-29 | 2012-04-18 | 株式会社東芝 | Optical semiconductor device |
| JP2008300570A (en) | 2007-05-30 | 2008-12-11 | Panasonic Electric Works Co Ltd | Light emitting device |
| US8403531B2 (en) | 2007-05-30 | 2013-03-26 | Cree, Inc. | Lighting device and method of lighting |
| JP2008300117A (en) | 2007-05-30 | 2008-12-11 | Toshiba Lighting & Technology Corp | Light emitting diode lighting system |
| JP2008300203A (en) | 2007-05-31 | 2008-12-11 | Toshiba Lighting & Technology Corp | Luminaire |
| US8209841B2 (en) | 2007-06-05 | 2012-07-03 | I2Ic Corporation | Method of manufacturing multicolored illuminator |
| US7999283B2 (en) | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
| WO2009003176A1 (en) | 2007-06-27 | 2008-12-31 | The Regents Of The University Of California | Optical designs for high-efficacy white-light emitting diodes |
| JP2009016058A (en) | 2007-06-29 | 2009-01-22 | Toshiba Lighting & Technology Corp | Illumination device, and illumination fixture using this |
| JP2009016153A (en) | 2007-07-04 | 2009-01-22 | Yohohama Electron Kk | Led lamp for illumination |
| TWI347687B (en) | 2007-07-13 | 2011-08-21 | Lite On Technology Corp | Light-emitting device with open-loop control |
| US7607802B2 (en) | 2007-07-23 | 2009-10-27 | Tamkang University | LED lamp instantly dissipating heat as effected by multiple-layer substrates |
| US7663315B1 (en) * | 2007-07-24 | 2010-02-16 | Ilight Technologies, Inc. | Spherical bulb for light-emitting diode with spherical inner cavity |
| US20090039375A1 (en) | 2007-08-07 | 2009-02-12 | Cree, Inc. | Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same |
| EP2179319A1 (en) | 2007-08-10 | 2010-04-28 | Koninklijke Philips Electronics N.V. | Lighting device |
| US8397027B2 (en) | 2007-08-10 | 2013-03-12 | Emc Corporation | Methods and systems for multi-caching |
| DE102007037862A1 (en) | 2007-08-10 | 2008-10-30 | Siemens Ag | Heating arrangement, used on LED arrays, improved cooling performances at high oscillation frequencies |
| TW200907238A (en) | 2007-08-10 | 2009-02-16 | Ama Precision Inc | Illumination apparatus having heat dissipation protection loop |
| CN101368719B (en) | 2007-08-13 | 2011-07-06 | 太一节能系统股份有限公司 | LED lamp |
| TW200907239A (en) | 2007-08-13 | 2009-02-16 | Topco Technologies Corp | Light-emitting diode lamp |
| US7810956B2 (en) | 2007-08-23 | 2010-10-12 | Koninklijke Philips Electronics N.V. | Light source including reflective wavelength-converting layer |
| DE102007040444B8 (en) * | 2007-08-28 | 2013-10-17 | Osram Gmbh | Led lamp |
| JP5044329B2 (en) | 2007-08-31 | 2012-10-10 | 株式会社東芝 | Light emitting device |
| DE102007045540A1 (en) * | 2007-09-24 | 2009-04-02 | Osram Gesellschaft mit beschränkter Haftung | Lighting device with light buffer |
| US7588351B2 (en) * | 2007-09-27 | 2009-09-15 | Osram Sylvania Inc. | LED lamp with heat sink optic |
| WO2009045438A1 (en) | 2007-10-03 | 2009-04-09 | Superbulbs, Inc. | Glass led light bulbs |
| JP4124479B1 (en) | 2007-10-16 | 2008-07-23 | 株式会社モモ・アライアンス | Lighting device |
| US7915627B2 (en) * | 2007-10-17 | 2011-03-29 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
| US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
| USD593222S1 (en) | 2007-10-19 | 2009-05-26 | Koninklijke Philips Electronics N.V. | Solid state lighting spot |
| US20090113296A1 (en) * | 2007-10-26 | 2009-04-30 | Microsoft Corporation | Displaying a map and associated symbolic context information |
| TW200921934A (en) * | 2007-11-06 | 2009-05-16 | Prodisc Technology Inc | Discrete light-emitting diode light source device of wavelength conversion unit |
| US8368100B2 (en) | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
| US7726836B2 (en) | 2007-11-23 | 2010-06-01 | Taiming Chen | Light bulb with light emitting elements for use in conventional incandescent light bulb sockets |
| US7810954B2 (en) | 2007-12-03 | 2010-10-12 | Lumination Llc | LED-based changeable color light lamp |
| US7989236B2 (en) | 2007-12-27 | 2011-08-02 | Toyoda Gosei Co., Ltd. | Method of making phosphor containing glass plate, method of making light emitting device |
| US8940561B2 (en) | 2008-01-15 | 2015-01-27 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
| US8337029B2 (en) | 2008-01-17 | 2012-12-25 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| JP5463447B2 (en) | 2008-01-18 | 2014-04-09 | 三洋電機株式会社 | Light emitting device and lamp provided with the same |
| WO2009093163A2 (en) | 2008-01-22 | 2009-07-30 | Koninklijke Philips Electronics N.V. | Illumination device with led and a transmissive support comprising a luminescent material |
| WO2009100160A1 (en) | 2008-02-06 | 2009-08-13 | C. Crane Company, Inc. | Light emitting diode lighting device |
| US7866850B2 (en) | 2008-02-26 | 2011-01-11 | Journée Lighting, Inc. | Light fixture assembly and LED assembly |
| WO2009107052A1 (en) | 2008-02-27 | 2009-09-03 | Koninklijke Philips Electronics N.V. | Illumination device with led and one or more transmissive windows |
| US8558438B2 (en) | 2008-03-01 | 2013-10-15 | Goldeneye, Inc. | Fixtures for large area directional and isotropic solid state lighting panels |
| CN101946337B (en) | 2008-03-28 | 2012-12-05 | 松下电器产业株式会社 | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
| US8288943B2 (en) | 2008-04-08 | 2012-10-16 | Koninklijke Philips Electronics N.V. | Illumination device with LED and a transmissive support comprising a luminescent material |
| EP2276967A1 (en) | 2008-04-17 | 2011-01-26 | Koninklijke Philips Electronics N.V. | Led based light source |
| JP2009266780A (en) | 2008-04-30 | 2009-11-12 | Toshiba Lighting & Technology Corp | Luminous body and luminaire |
| TW201007091A (en) | 2008-05-08 | 2010-02-16 | Lok F Gmbh | Lamp device |
| JP2009277586A (en) | 2008-05-16 | 2009-11-26 | San Corporation Kk | Electric lamp type led luminaire |
| US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
| US8212469B2 (en) | 2010-02-01 | 2012-07-03 | Abl Ip Holding Llc | Lamp using solid state source and doped semiconductor nanophosphor |
| US20090296387A1 (en) | 2008-05-27 | 2009-12-03 | Sea Gull Lighting Products, Llc | Led retrofit light engine |
| EP2301071B1 (en) | 2008-05-29 | 2019-05-08 | Cree, Inc. | Light source with near field mixing |
| JP2009295299A (en) | 2008-06-02 | 2009-12-17 | Tamura Seisakusho Co Ltd | Illumination body |
| US8013501B2 (en) | 2008-06-04 | 2011-09-06 | Forever Bulb, Llc | LED-based light bulb device |
| US9074751B2 (en) | 2008-06-20 | 2015-07-07 | Seoul Semiconductor Co., Ltd. | Lighting apparatus |
| US7618157B1 (en) * | 2008-06-25 | 2009-11-17 | Osram Sylvania Inc. | Tubular blue LED lamp with remote phosphor |
| CN101614363A (en) * | 2008-06-25 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Light emitting diode illuminating apparatus |
| US20090322800A1 (en) | 2008-06-25 | 2009-12-31 | Dolby Laboratories Licensing Corporation | Method and apparatus in various embodiments for hdr implementation in display devices |
| US8410681B2 (en) | 2008-06-30 | 2013-04-02 | Bridgelux, Inc. | Light emitting device having a refractory phosphor layer |
| JP5081746B2 (en) * | 2008-07-04 | 2012-11-28 | パナソニック株式会社 | lamp |
| KR101266226B1 (en) | 2008-07-09 | 2013-05-21 | 우시오덴키 가부시키가이샤 | Light emitting device and method for manufacturing the same |
| US8579476B2 (en) | 2008-07-15 | 2013-11-12 | Nuventix, Inc. | Thermal management of led-based illumination devices with synthetic jet ejectors |
| KR100924912B1 (en) * | 2008-07-29 | 2009-11-03 | 서울반도체 주식회사 | Warm white light emitting apparatus and back light module comprising the same |
| GB2462411B (en) | 2008-07-30 | 2013-05-22 | Photonstar Led Ltd | Tunable colour led module |
| US8427059B2 (en) | 2008-07-31 | 2013-04-23 | Toshiba Lighting & Technology Corporation | Lighting device |
| US7922356B2 (en) | 2008-07-31 | 2011-04-12 | Lighting Science Group Corporation | Illumination apparatus for conducting and dissipating heat from a light source |
| JP2010040494A (en) | 2008-08-07 | 2010-02-18 | Msm Tech Co Ltd | Fluorescent lamp type led lamp capable of attaching and detaching led driving device |
| EP2154420A1 (en) | 2008-08-13 | 2010-02-17 | GE Investment Co., Ltd. | Light-emitting diode illumination apparatus |
| US8188595B2 (en) | 2008-08-13 | 2012-05-29 | Progressive Cooling Solutions, Inc. | Two-phase cooling for light-emitting devices |
| CN101338887A (en) | 2008-08-13 | 2009-01-07 | 伟志光电（深圳）有限公司 | Energy-saving environment-friendly LED reflectoscope and its making process |
| JP4755276B2 (en) * | 2008-09-04 | 2011-08-24 | パナソニック株式会社 | Light source for illumination |
| JP5290670B2 (en) * | 2008-09-04 | 2013-09-18 | パナソニック株式会社 | lamp |
| JP2010073438A (en) * | 2008-09-17 | 2010-04-02 | Panasonic Corp | Lamp |
| KR101039073B1 (en) | 2008-10-01 | 2011-06-08 | 주식회사 아모럭스 | Radiator and Bulb Type LED Lighting Apparatus Using the Same |
| KR100901180B1 (en) | 2008-10-13 | 2009-06-04 | 현대통신 주식회사 | Heat emittimg member having variable heat emitting path and led lighting flood lamp using said it |
| DE202008013667U1 (en) | 2008-10-15 | 2008-12-18 | Li, Chia-Mao | Multi-shell reflector cup |
| JP4651701B2 (en) | 2008-10-17 | 2011-03-16 | 三洋電機株式会社 | Lighting equipment |
| JP4869317B2 (en) | 2008-10-29 | 2012-02-08 | 株式会社東芝 | Red phosphor and light emitting device using the same |
| PL2347172T3 (en) | 2008-11-06 | 2020-09-07 | Signify Holding B.V. | Illumination device |
| BRPI0916006A2 (en) | 2008-11-18 | 2015-11-03 | Koninkl Philips Electronics Nv | "eletric lamp" |
| JP5359734B2 (en) | 2008-11-20 | 2013-12-04 | 豊田合成株式会社 | Light emitting device and manufacturing method thereof |
| JP2010129300A (en) * | 2008-11-26 | 2010-06-10 | Keiji Iimura | Semiconductor light-emitting lamp and electric-bulb-shaped semiconductor light-emitting lamp |
| US8348837B2 (en) | 2008-12-09 | 2013-01-08 | Covidien Lp | Anoscope |
| JP5327601B2 (en) | 2008-12-12 | 2013-10-30 | 東芝ライテック株式会社 | Light emitting module and lighting device |
| US8169135B2 (en) | 2008-12-17 | 2012-05-01 | Lednovation, Inc. | Semiconductor lighting device with wavelength conversion on back-transferred light path |
| ES2550263T3 (en) | 2009-01-09 | 2015-11-05 | Koninklijke Philips N.V. | Light source with LEDs, light guide and reflector |
| US8021025B2 (en) | 2009-01-15 | 2011-09-20 | Yeh-Chiang Technology Corp. | LED lamp |
| US7600882B1 (en) | 2009-01-20 | 2009-10-13 | Lednovation, Inc. | High efficiency incandescent bulb replacement lamp |
| FR2941346A1 (en) | 2009-01-21 | 2010-07-23 | Cassiopee Decoration | Lighting device for illuminating lamp, has electrical power supplying units having rigid pins and electric wire for supplying electrical power to LEDs and extending in conduit when plate is installed on free end of support part |
| US7828453B2 (en) | 2009-03-10 | 2010-11-09 | Nepes Led Corporation | Light emitting device and lamp-cover structure containing luminescent material |
| US8653723B2 (en) | 2009-02-17 | 2014-02-18 | Cao Group, Inc. | LED light bulbs for space lighting |
| US7851819B2 (en) | 2009-02-26 | 2010-12-14 | Bridgelux, Inc. | Transparent heat spreader for LEDs |
| JP5333758B2 (en) | 2009-02-27 | 2013-11-06 | 東芝ライテック株式会社 | Lighting device and lighting fixture |
| US20100244729A1 (en) | 2009-03-30 | 2010-09-30 | Amerihua International Enterprises Inc. | Gazing Ball Having A Battery-Powered LED Device |
| US20100246165A1 (en) | 2009-03-31 | 2010-09-30 | Diaz Edmundo B | Invisible and/ or non-invisible designed inflatables combined with electric black ultra-violet lights and inflator nozzle fixture accessories |
| KR100944181B1 (en) | 2009-04-07 | 2010-02-24 | 용남순 | Led lamp with a radial shape |
| JP5363864B2 (en) | 2009-04-13 | 2013-12-11 | 日東光学株式会社 | Light emitting device and light bulb type LED lamp |
| US8750671B1 (en) | 2009-04-16 | 2014-06-10 | Fusion Optix, Inc | Light bulb with omnidirectional output |
| CN101865372A (en) | 2009-04-20 | 2010-10-20 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
| CN102439351A (en) | 2009-05-04 | 2012-05-02 | 皇家飞利浦电子股份有限公司 | Light source comprising a light emitter arranged inside a translucent outer envelope |
| WO2010132526A2 (en) | 2009-05-13 | 2010-11-18 | Light Prescriptions Innovators, Llc | Dimmable led lamp |
| US7956546B2 (en) * | 2009-05-15 | 2011-06-07 | Bridgelux, Inc. | Modular LED light bulb |
| JP2010267826A (en) | 2009-05-15 | 2010-11-25 | Rohm Co Ltd | Led lighting system and liquid crystal display device |
| US8922106B2 (en) | 2009-06-02 | 2014-12-30 | Bridgelux, Inc. | Light source with optics to produce a spherical emission pattern |
| JP5438213B2 (en) | 2009-06-10 | 2014-03-12 | レンセレイアー ポリテクニック インスティテュート | Solid state light source bulb |
| US8186852B2 (en) | 2009-06-24 | 2012-05-29 | Elumigen Llc | Opto-thermal solution for multi-utility solid state lighting device using conic section geometries |
| US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
| KR20110008445A (en) | 2009-07-20 | 2011-01-27 | 백일선 | Connector having a portion for grounding |
| CN101986001B (en) | 2009-07-28 | 2013-09-04 | 富准精密工业(深圳)有限公司 | Light-emitting diode (LED) lamp |
| TWM372923U (en) | 2009-08-14 | 2010-01-21 | Risun Expanse Corp | Lamp structure |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| KR100980588B1 (en) | 2009-08-27 | 2010-09-06 | 윤인숙 | Led lamp |
| CN102032481B (en) | 2009-09-25 | 2014-01-08 | 东芝照明技术株式会社 | Lamp with base and lighting equipment |
| TWI391609B (en) | 2009-09-28 | 2013-04-01 | Yu Nung Shen | Light emitting diode lighting device |
| JP5469177B2 (en) | 2009-09-30 | 2014-04-09 | パナソニック株式会社 | Lighting device |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| US9103507B2 (en) | 2009-10-02 | 2015-08-11 | GE Lighting Solutions, LLC | LED lamp with uniform omnidirectional light intensity output |
| US9217542B2 (en) | 2009-10-20 | 2015-12-22 | Cree, Inc. | Heat sinks and lamp incorporating same |
| WO2011050267A2 (en) | 2009-10-22 | 2011-04-28 | Waqidi Falicoff | Solid-state light bulb |
| US8371722B2 (en) | 2009-11-04 | 2013-02-12 | Forever Bulb, Llc | LED-based light bulb device with Kelvin corrective features |
| US8410512B2 (en) | 2009-11-25 | 2013-04-02 | Cree, Inc. | Solid state light emitting apparatus with thermal management structures and methods of manufacturing |
| JP5354209B2 (en) | 2010-01-14 | 2013-11-27 | 東芝ライテック株式会社 | Light bulb shaped lamp and lighting equipment |
| CN102844619B (en) | 2010-02-12 | 2016-12-28 | 科锐公司 | There is the luminaire of radiating piece |
| US9310030B2 (en) * | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
| US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
| US9062830B2 (en) | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
| US9052067B2 (en) | 2010-12-22 | 2015-06-09 | Cree, Inc. | LED lamp with high color rendering index |
| US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
| US10240772B2 (en) | 2010-04-02 | 2019-03-26 | GE Lighting Solutions, LLC | Lightweight heat sinks and LED lamps employing same |
| USD629928S1 (en) * | 2010-04-05 | 2010-12-28 | Foxconn Technology Co., Ltd. | LED lamp |
| TW201139931A (en) | 2010-05-10 | 2011-11-16 | Yadent Co Ltd | Energy-saving lamp |
| US8201983B2 (en) | 2010-06-01 | 2012-06-19 | Young Lighting Technology Inc. | Illuminating device |
| US8596821B2 (en) | 2010-06-08 | 2013-12-03 | Cree, Inc. | LED light bulbs |
| US9062853B2 (en) | 2010-07-12 | 2015-06-23 | National University Corporation Nagoya University | Broadband infrared light emitting device |
| US9732930B2 (en) | 2010-07-20 | 2017-08-15 | Panasonic Intellectual Property Management Co., Ltd. | Light bulb shaped lamp |
| US8167677B2 (en) | 2010-08-10 | 2012-05-01 | Liquidleds Lighting Corp. | Method of assembling an airtight LED light bulb |
| US8568009B2 (en) | 2010-08-20 | 2013-10-29 | Dicon Fiberoptics Inc. | Compact high brightness LED aquarium light apparatus, using an extended point source LED array with light emitting diodes |
| CN102384376B (en) | 2010-09-06 | 2014-05-07 | 光宝电子(广州)有限公司 | Light emitting diode bulb, lamp and lighting device of using same |
| RU2546469C2 (en) | 2010-09-08 | 2015-04-10 | Чжэцзян Ледисон Оптоэлектроникс Ко., Лтд. | Led lamp |
| US8272762B2 (en) | 2010-09-28 | 2012-09-25 | Lighting Science Group Corporation | LED luminaire |
| US8415865B2 (en) | 2011-01-18 | 2013-04-09 | Silitek Electronic (Guangzhou) Co., Ltd. | Light-guide type illumination device |
| US8421321B2 (en) | 2011-01-24 | 2013-04-16 | Sheng-Yi CHUANG | LED light bulb |
| US8421320B2 (en) | 2011-01-24 | 2013-04-16 | Sheng-Yi CHUANG | LED light bulb equipped with light transparent shell fastening structure |
| DE102011004718A1 (en) | 2011-02-25 | 2012-08-30 | Osram Ag | Method for manufacturing transparent cover of incandescent lamp-retrofit lamp, involves inserting inner piston wall into outer piston wall so that hollow space is formed between walls, and introducing heat conducting filling into space |
| US8272766B2 (en) | 2011-03-18 | 2012-09-25 | Abl Ip Holding Llc | Semiconductor lamp with thermal handling system |
| CN102759020B (en) | 2011-04-26 | 2014-07-02 | 光宝电子(广州)有限公司 | Ball type light emitting diode lamp bulb |
| US8282250B1 (en) | 2011-06-09 | 2012-10-09 | Elumigen Llc | Solid state lighting device using heat channels in a housing |
| TWM416727U (en) | 2011-06-17 | 2011-11-21 | Enlight Corp | Bulb structure |
| US8740415B2 (en) | 2011-07-08 | 2014-06-03 | Switch Bulb Company, Inc. | Partitioned heatsink for improved cooling of an LED bulb |
| US8759843B2 (en) | 2011-08-30 | 2014-06-24 | Abl Ip Holding Llc | Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism |
| US20130063945A1 (en) | 2011-09-12 | 2013-03-14 | Chaun-Choung Technology Corp. | Bulb-type led lamp having replaceable light source module |
| US8641237B2 (en) | 2012-02-09 | 2014-02-04 | Sheng-Yi CHUANG | LED light bulb providing high heat dissipation efficiency |
| US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
-
2010
- 2010-08-02 US US12/848,825 patent/US8562161B2/en active Active
-
2011
- 2011-03-02 TW TW100107048A patent/TW201202628A/en unknown
- 2011-03-02 CN CN201180020709.2A patent/CN102859259B/en active Active
- 2011-03-02 WO PCT/US2011/000397 patent/WO2011109091A1/en active Application Filing
- 2011-03-02 KR KR1020127025848A patent/KR20130036218A/en not_active Application Discontinuation
- 2011-03-02 EP EP11709232A patent/EP2542822A1/en not_active Withdrawn
- 2011-03-02 JP JP2012556063A patent/JP5564121B2/en active Active
-
2013
- 2013-08-29 US US14/014,272 patent/US9217544B2/en active Active
-
2014
- 2014-06-13 JP JP2014122643A patent/JP2014194954A/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030038291A1 (en) * | 2001-08-24 | 2003-02-27 | Densen Cao | Semiconductor light source |
| WO2009091562A2 (en) * | 2008-01-15 | 2009-07-23 | Philip Premysler | Omnidirectional led light bulb |
| WO2009158422A1 (en) * | 2008-06-26 | 2009-12-30 | Osram Sylvania, Inc. | Led lamp with remote phosphor coating and method of making the lamp |
| US20090322197A1 (en) * | 2008-06-30 | 2009-12-31 | Rene Helbing | Light emitting device having a transparent thermally conductive layer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103162135A (en) * | 2013-02-27 | 2013-06-19 | 朱婉露 | Light-emitting diode (LED) lamp bulb |
| CN103791459A (en) * | 2014-01-24 | 2014-05-14 | 苏州镭易特照明科技有限公司 | LED bulb lamp emitting light at 360 degrees |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201202628A (en) | 2012-01-16 |
| US9217544B2 (en) | 2015-12-22 |
| US20140003048A1 (en) | 2014-01-02 |
| JP2013521613A (en) | 2013-06-10 |
| WO2011109091A1 (en) | 2011-09-09 |
| CN102859259B (en) | 2016-11-02 |
| US20110215696A1 (en) | 2011-09-08 |
| JP5564121B2 (en) | 2014-07-30 |
| US8562161B2 (en) | 2013-10-22 |
| KR20130036218A (en) | 2013-04-11 |
| EP2542822A1 (en) | 2013-01-09 |
| JP2014194954A (en) | 2014-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102859259B (en) | Pedestal-type light structures based on LED | |
| CN103180658B (en) | Solid state lamp with thermal diffusion component and guide-lighting optical device | |
| JP5865884B2 (en) | Lighting device, electric heating structure, and electric heating element | |
| US9500325B2 (en) | LED lamp incorporating remote phosphor with heat dissipation features | |
| US9024517B2 (en) | LED lamp with remote phosphor and diffuser configuration utilizing red emitters | |
| KR101644897B1 (en) | Light emitting device | |
| CN104364919B (en) | LED packages with the seal for having flat surfaces | |
| CN102741606B (en) | There is the illuminating device of the compartment fluorophor of formation | |
| US20160131327A1 (en) | Light source module and lighting device having the same | |
| TW201133953A (en) | Saturated yellow phosphor converted LED and blue converted red LED | |
| CN103765077A (en) | Compact high efficiency remote LED module | |
| US20110068354A1 (en) | High power LED lighting device using high extraction efficiency photon guiding structure | |
| JP2011523511A (en) | Light source that mixes light in the near field | |
| CN103080641A (en) | Compact optically efficient solid state light source with integrated thermal management | |
| KR102300558B1 (en) | Light source module | |
| TW201403870A (en) | Light emitting diode element and manufacturing mathod thereof | |
| AU2012200593B2 (en) | Lighting device, heat transfer structure and heat transfer element | |
| TW201144699A (en) | High efficacy LED lamp with remote phosphor and diffuser configuration | |
| JP2019117851A (en) | Light-emitting device and manufacturing method thereof | |
| TW201142215A (en) | LED lamp with remote phosphor and diffuser configuration utilizing red emitters | |
| WO2014111247A1 (en) | Led chips on devices and advanced methods of manufacturing them |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |