TW201142215A - LED lamp with remote phosphor and diffuser configuration utilizing red emitters - Google Patents

Abstract

Lamps and bulbs are disclosed generally comprising different combinations and arrangement of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Some embodiments of the present invention utilize LED chips to provide one or more lighting components instead of providing the components through phosphor conversion. This can provide for lamps that can be operated with lower power and can be manufactured at lower cost. In one embodiment, a red lighting component can be provided by red emitting LEDs as opposed to a red conversion material.

Description

201142215 VI. Description of the Invention: [Technical Field] The present invention relates to solid-state lamps and bulbs, and more particularly to efficient and reliable LED-based lamps and bulbs capable of producing an omnidirectional emission pattern . This application claims the rights of the following applications: US Provisional Patent Application No. 61/339,516, filed March 3, 2013; US Provisional Patent Application No. 3, filed March 3, 2010 US Provisional Patent Application No. 61/386,437, filed September 24, 2012; US Provisional Application No. 61/424,665, filed December 19, 2010; 2 U.S. Provisional Application No. 61/424, 67 曰, filed on December 19, 2013; U.S. Provisional Patent Application No. 61/434,355, filed January 19, 2011; January 23, 2011 U.S. Provisional Patent Application Serial No. 61/435,326, filed on Jan. 24, 2011, to U.S. Provisional Patent Application No. 61/435,759. This application is also a part of the following applications and claims the following applications: US Patent Application No. 12/848,825, filed August 2, 2010; US application filed on September 24, 2010 Patent Application Serial No. 12/889,719; and U.S. Patent Application Serial No. 12/975,820, filed on Dec. 22, 2010. [Prior Art] Incandescent lamps or bulbs or filament-based lamps or bulbs are commonly used as light sources for domestic and commercial installations. However, these lamps are extremely inefficient sources of light with up to 95% loss of input energy, primarily in the form of heat or infrared energy. A common alternative to incandescent lamps (so-called compact fluorescent lamps 154500.doc 201142215 (CFL)) is more effective in converting electricity to light but requires the use of toxic materials. These toxic materials and their various compounds can cause chronic and acute Poisoned and can cause environmental pollution. One solution for improving the efficiency of a lamp or bulb is to use a solid state device such as a light emitting diode (LED) instead of a metal filament to produce light. The light-emitting body generally comprises one or more active layers of semiconductor material that are missing between layers of opposite doping type. When a bias voltage is applied to the doped layers, holes and electrons are injected into the active layer where they recombine to produce light. The light system acts on the active layer and is emitted from each surface of the LED. In order to use LED wafers in circuits or other similar configurations, it is known to encapsulate LED wafers in a package to provide environmental and/or mechanical protection, color selection, light focusing, and the like. ^ LED packages also include for packaging LEDs Electrical leads, contacts, or traces that are electrically connected to external circuitry. In a typical led package 10 illustrated in Figure 1, a single LED wafer 12 is mounted to a reflective cup 13 by means of a solder bond or a conductive epoxy. One or more wire bonds 11 connect the ohmic contacts of the LED wafer 12 to wires 15A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflector cup can be filled with an encapsulant material 16, which can contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength can be absorbed by the phosphor, which responsively emits light at the second wavelength. The entire assembly is then encapsulated in a clear protective resin 14 which can be molded into a lens shape to collimate light emitted from the LED wafer 12. Although the reflector cup 13 can direct light in the upward direction, when the light is reflected (ie, some light is attributed to the actual reflector surface less than 100% reflectivity and 154500.doc 201142215 may be absorbed by the reflective cup), Optical loss can occur. Additionally, thermal stagnation can be a problem with packages such as package 10 shown in Figure 1, as it can be difficult to extract heat via wires 15A, 15B. The conventional LED package 20 illustrated in Figure 2 may be more suitable for high power operation that produces more heat. In the LED package 20, one or more LED chips 22 are mounted to a carrier such as a printed circuit board (PCB) carrier, substrate or submount 23. A metal reflector 24 mounted on the submount 23 surrounds the LED wafer 22 and reflects the light emitted by the LED wafer 22 to move the light away from the package 20. Reflector 24 also provides mechanical protection for LED wafer 22. One or more wire bond connectors 27 are formed between the ohmic contacts on the LED wafer 22 and the electrical traces 25A, 25B on the submount 23. The mounted LED wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer while also acting as a lens. Metal reflector 24 is typically attached to the carrier by means of solder or epoxy bonding. LED wafers (such as the LED chips found in LED package 20 of Figure 2) can be coated by a conversion material comprising one or more phosphors, wherein the phosphors absorb at least some of the LED light. The LED wafer can emit light of different wavelengths such that it emits a combination of light from the LED and the phosphor. LED wafers can be coated with phosphors in a number of different ways, one suitable method of which is described in U.S. Patent Application Serial No. 11/656,759, the entire disclosure of The title is "Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method." Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat the LEDs, a suitable EPD method is described in US Patent Application Serial No. 154500.doc 201142215 entitled "Close Loop Electrophoretic Deposition of Semiconductor Devices" No. 11/473 〇 89. LEd wafers with conversion materials in the vicinity or as direct coatings have been used in a variety of different packages' but suffer from some limitations of device-based structures. When the phosphor material is on or near the LED epitaxial layer (and in some examples a conformal coating on the LED), the phosphor can directly withstand the heat generated by the wafer. This heat can increase the temperature of the phosphor material. Additionally, in such cases, the phosphor can be subjected to incident light from very high concentrations or fluxes of the LED. Since the conversion process is typically not effective at 1%, excess heat is generated in the phosphor layer that is proportional to the incident light flux. In a compact phosphor layer close to the LED wafer, this can result in an increase in the substantial temperature in the phosphor layer because of the large amount of heat generated in the small region. This increase in temperature can be exacerbated when the phosphor particles are embedded in a low thermal conductivity material, such as polyfluorene, which does not provide an effective dissipation path for the heat generated within the phosphor particles. These elevated operating temperatures can cause the phosphor and surrounding materials to degrade over time, as well as resulting in reduced phosphor conversion efficiency and shifting color conversion. Lamps that utilize solid state light sources (such as LEDs) in combination with LEDs or conversion materials at the distal end of the LED have also been developed. Such configurations are disclosed in Tarsa et al. entitled "High Output Radial Dispersing Lamp Using &

Solid State Light Source, U.S. Patent No. 6,35,41. The lamp described in this patent can include a solid state light source that transmits light through a splitter to a disperser having a phosphor. The diffuser allows the light to be dispersed in accordance with the desired pattern 154500.doc 201142215 and/or to change its color by converting at least some of the light to a different wavelength via a phosphor or other conversion material. In some embodiments, the separator separates the source from the disperser a sufficient distance such that heat from the source will not be transferred to the disperser when the source carries the elevated current necessary for indoor illumination. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. A potential disadvantage of having a remotely-lit lamp is that it can have undesirable visual or aesthetic characteristics. When the light does not produce light, the light can have a different surface color than the typical white or clear appearance of a standard Edison bulb. In some examples, the lamp can have a yellow or orange appearance that is primarily produced by phosphor conversion materials such as yellow/green and red phosphors. This appearance can be considered undesirable for many applications where it can cause aesthetic problems with surrounding building elements when the lights are not illuminated. This can have a negative impact on the overall acceptance of these types of lamps by consumers. In addition, the far-end phosphor configuration can be subject to insufficient thermal conductivity compared to a conformal or adjacent phosphor configuration that can be conducted or dissipated through the nearby wafer or substrate surface during the conversion process. Heat Dissipation Road ^ In the absence of an effective heat dissipation path, the thermally isolated distal light body can be subjected to the operating temperature of the party, which can be even comparable in some instances. The conformal temperature in the coated layer. This situation can offset some or all of the benefits achieved by placing the phosphor at the distal end relative to the wafer. In other words, the placement of the phosphor at the distal end relative to the LED wafer can reduce or eliminate the direct heat generation of the phosphor layer due to the heat generated within the LED wafer during operation, but the resulting phosphor temperature reduction can be partially or fully 154500.doc 201142215 is offset by the heat generated in the phosphor layer itself during the light conversion process and the lack of a suitable thermal path to dissipate the heat generated thereby. Another problem affecting the implementation and acceptance of lamps utilizing solid state light sources is related to the nature of the light emitted by the source itself. In order to manufacture efficient lamps or bulbs based on LED sources (and associated conversion layers), it is often desirable to place the LED wafers or packages in a coplanar configuration. This facilitates manufacturing and can reduce manufacturing costs by allowing the use of conventional production equipment and processes. However, coplanar configurations of led wafers typically produce a forward light intensity profile (e.g., Lambertian profile). 0 Such beam profiles are generally not desirable in applications where solid state lights or light bulbs are intended to replace conventional lamps, such as conventional incandescent light bulbs. The conventional lamp has a more omnidirectional beam pattern. While it is possible to mount a LED light source or package in a three-dimensional configuration, it is often difficult and expensive to fabricate such configurations. SUMMARY OF THE INVENTION The present invention provides a lamp and a bulb. The lamps and bulbs generally comprise different combinations and configurations of: a light source, one or more wavelength converting materials, positioned separately or positioned at the distal end relative to the source Multiple zones or layers, and a single diffusion layer. This configuration allows for the manufacture of efficient, reliable and cost-effective lamps and bulbs, and even in the case of a light source consisting of one of the coplanar configurations of the LEDs, a substantially omnidirectional emission pattern can be provided. Additionally, this configuration allows the appearance of the transition zones or layers to be obscured or concealed for aesthetics when the lights are not illuminated. Some embodiments of the present invention utilize LED wafers to provide one or more illumination components rather than providing such components via phosphor conversion. This situation provides a lamp that can be operated with lower power and can be manufactured at a lower cost. In one embodiment, a red illumination component can be provided by a red LED instead of a red 154500.doc 201142215 conversion material. An embodiment of a solid state light according to the present invention includes emitting a first LED that emits light at a first peak and emits one of the second LEDs with a second respective peak. A conversion material is provided, the conversion material being spaced apart from the first LED and the second LED, wherein light from the first LED and the second LED passes through the conversion material. The conversion material absorbs at least some of the light from the second LED and re-emits light with a third respective peak emission. The lamp emits a combination of light from the first peak emission, the second peak emission, and the third peak emission. Another embodiment of a solid state light in accordance with the present invention includes a heat sink and an array of LEDs mounted to the heat sink. The LED array provides light having first and first respective peak wavelengths. A conversion material is included that is mounted to the heat sink, over the LED array, and distal to the LED array. Light from the LEDs passes through the conversion material, wherein the conversion material absorbs a portion of one of the first peak wavelength and the second peak wavelength and re-transmits a respective third peak wavelength. The lamp emits light comprising a combination of the first peak wavelength, the second peak wavelength, and the third peak wavelength. A further embodiment of a solid state light in accordance with the present invention comprises a blue light emitting LED and a red light emitting LED. A phosphor is included over the blue LED and the red LED and spaced apart from the blue LED and the red LED. Light from the blue LED and the red LED passes through the phosphor. The phosphor absorbs at least some of the blue LED light and re-emits light of a respective wavelength. The lamp emits a combination of red, blue and re-emitted fill light. These and other aspects and advantages of the present invention will become apparent from the following description and appended claims. [Embodiment] The present invention is directed to different embodiments of a lamp or bulb structure that are effective, reliable, and cost effective, and in some embodiments can provide from a directional emission source (such as a forward emission source). The pattern is substantially omnidirectionally emitted. The invention is also directed to lamp structures that use solid state illuminators and remote conversion materials (or phosphors) as well as distal diffusing elements or diffusers. In some embodiments, the diffuser not only shields the phosphor from view by the light user, but also disperses or redistributes light from the source of the remote phosphor and/or lamp into the desired emission pattern. In some embodiments, the diffuser dome can be configured to disperse the different emission patterns into a more omnidirectional pattern that can be used in general lighting applications. The diffuser can be used in a composite embodiment having a two-dimensional and three-dimensionally shaped distal conversion material' having a combination of features capable of converting a forward emission from a led source into a beam profile comparable to a standard incandescent bulb. The invention is described herein with reference to conversion materials, wavelength converting materials, remote phosphors, phosphors, scale layers, and related terms. The use of these terms should not be construed as limiting. It should be understood that the use of the term distal phosphor, phosphorescent or scale layer means that all wavelength converting materials are included and equally applicable to all wavelength converting materials. ^ Embodiments may have a dome-shaped (or head-shaped spherical) three-dimensional conversion material over the light source and spaced apart from the light source, and a dome-shaped diffuser spaced apart from the conversion material over the conversion material such that the lamp Shows the structure of the double dome 15450 〇.d〇c 201142215. The space between the various structures can include light mixing chambers that not only promote dispersion of lamp emission but also promote color uniformity. The space between the light source and the conversion material and the space between the conversion materials can serve as a light mixing chamber. Other embodiments may include additional conversion materials or diffusers that may form additional mixing chambers. The order of the dome conversion material and the dome shaped diffuser can be varied such that some embodiments can have a diffuser' within the conversion material while the space therebetween forms a light mixing chamber. These configurations are only a few of the many different conversion materials and diffuser configurations in accordance with the present invention. Some lamp embodiments in accordance with the present invention may comprise a light source having a coplanar configuration of one or more led wafers or packages, wherein the illuminators are mounted on a flat or planar surface. In other embodiments, the LED wafers may not be coplanar, such as on a pedestal or other three-dimensional structure, and the coplanar light source may reduce the complexity of the illuminating configuration, making it easier and less expensive to manufacture. However, coplanar light sources tend to illuminate primarily in the forward direction, such as in a Lambertian emission pattern. In various embodiments, it may be desirable to emit a light pattern that mimics the light pattern of a conventional incandescent light bulb, which is known to provide nearly uniform emission intensity and color uniformity at different emission angles. Different embodiments of the present invention can include features that can transform the emission pattern from a non-uniform sentence to be substantially uniform over a range of viewing angles. In some embodiments, a conversion layer or region can include a phosphor support that can include a thermally conductive material that is at least partially transparent to light from the source and that each absorb light from the source and emit light of a different wavelength. As for a phosphor material. The diffuser can include a diffusing film/particle and associated carrier (such as a glass envelope) and can be used to scatter or redirect at least one of the light emitted by the light source and/or the phosphor carrier. Some light is provided to provide the desired beam profile. In some embodiments, a lamp in accordance with the present invention can emit a beam profile that is compatible with a standard incandescent bulb. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the properties of the scattering layers, can be used to control various lamp properties, such as color uniformity depending on viewing angle. And light intensity distribution. By shielding the phosphor carrier and other internal lamp features, the diffuser provides a desired overall lamp appearance when the lamp or bulb is not illuminated. A heat sink structure can be included. The heat sink structure can be in thermal contact with the light source and in thermal contact with the phosphor carrier to dissipate heat generated within the light source and phosphor layer into the surrounding environment. Electronic circuitry may also be included to provide power to the light source and to provide other capabilities (such as dimming, etc.), and such circuitry may include components (such as threaded turns, etc.) through which electrical power is applied to the light. Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that fit into a standard size bulb housing such as the A19 size bulb housing 30 as shown in FIG. This makes the lamp particularly useful as a replacement for conventional incandescent lamps or bulbs and fluorescent lamps or bulbs, the lamp according to the invention having reduced energy consumption and long life provided by its solid state light source. The lamp according to the invention can also be adapted to other types of standard size temples including, but not limited to, A21 and A23. In some embodiments, the light source may comprise a solid state light source, such as different types of LEDs, LED crystals, LED packages, etc., may use early-LED wafers or packages, while in other embodiments, may be of different types 154500. The array of doc 201142215 is configured with multiple LED chips or packages. By thermally isolating the phosphor from the led wafer and having good heat dissipation, the LED wafer can be driven by a higher current level without detrimental effects on the conversion efficiency of the phosphor and its long-term reliability. This situation may allow over-excitation of the LED wafer to reduce the flexibility of the number of LEDs required to produce the desired luminous flux. This situation in turn reduces the cost of the complexity of the lamp. Such LED packages may include LEDs encapsulated by a material that can withstand elevated luminous flux or may include unencapsulated LEDs. In some embodiments, the light source can include one or more blue light emitting LEDs, and the phosphor layer in the phosphor carrier can comprise one or more materials that absorb one portion of the blue light and emit one or more different The light of the peak wavelength is such that the lamp emits a combination of white light from the blue LED and the conversion material. The conversion material absorbs blue LED light and emits light of different peak wavelengths, including but not limited to red, yellow, and green. The light source can also include different LEDs and conversion materials that emit light of different colors such that the light emits light having desired characteristics such as 'color temperature and color rendering. The separation of the phosphor element from the LED provides the added advantage of easier and more consistent color sorting. This can be done in a number of ways. LEDs from various sorting levels (e.g., 'blue LEDs from various sorting levels') can be assembled together to achieve a substantially uniform wavelength excitation source that can be used in different lamps. These excitation sources can then be combined with a carbon carrier having substantially the same conversion characteristics to provide a lamp that emits light within the desired sorting level. In addition, a plurality of phosphor carriers can be fabricated and the phosphor carriers can be pre-sorted according to different conversion characteristics of the phosphor carriers. Different phosphors I54500.doc 14 201142215 The body can be combined with a source that emits different characteristics to provide a light that emits light within the target color sorting level. Furthermore, the can carrier in the different lamps according to the invention may be provided with a plurality of phosphors. In some embodiments, the plurality of phosphors can comprise yellow/green and red phosphors that impart an orange appearance to the optical carrier. The lamps may comprise blue illuminated LEDs, wherein the yellow/green and red illumination components are provided by the scales and the lamps emit blue, yellow/green or red white light combinations 0 in other embodiments 'multiple peak emissions ( The illumination component can be provided by a led, wherein one or more peak emissions are also provided by a phosphor that absorbs one or more of the peak emissions from the LEDs and re-transmits one or more peak emissions from the phosphor carrier. In an embodiment, the red illumination component may be provided by one or more red illumination LEDs rather than from a red phosphor. The red illuminating LED can comprise an LED made of a material system that provides red emission from the active area, and the red LED can be in an array with the blue LED. This configuration can reduce the cost associated with providing a generally more expensive red phosphor in a phosphor carrier. The invention is described herein with reference to a particular embodiment, but it is understood that the invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein. In particular, the invention is described below with respect to certain lamps having one or more LED or LED wafers or LED packages in different configurations, but it should be understood that the invention is applicable to many other lamps having many different configurations. . An example of a different lamp that is configured in a different manner in accordance with the present invention is described in the following and is described in U.S. Provisional Patent Application Serial No. 154,500. doc. Solid State Lamp" is filed on Jan. 24, 2011 and incorporated herein by reference. Embodiments are described below with reference to one or more LEDs, but it should be understood that this includes LED wafers and LED packages that can have different shapes and sizes than the shapes and sizes shown, and can include different A number of LEDs. It should also be understood that the embodiments described below utilize coplanar light sources, but it should be understood that non-coplanar light sources can also be used. It should also be understood that the LED light source of the lamp can include one or more LEDs, and in embodiments having more than one LED, the LEDs can have different emission wavelengths. Similarly, some LEDs may have phosphor layers or zones that are adjacent or in contact, while other LEDs may have adjacent light-breaking layers of different compositions or no male light layers at all. The invention is described herein with reference to a conversion material in which the phosphor layer and the scale carrier and the diffuser are distal to each other. In this context, the distal ends are spaced apart from each other and/or are not in direct thermal contact. It is also understood that when an element such as a layer, a layer or a substrate is referred to as being "on" another element, it can be directly on the other element or the intervening element can also be present. In addition, terms such as "inside", "outside", "upper", "above", "below", "below" and "below" may be used herein to describe the relationship of one layer or another. . It is to be understood that the terms are intended to encompass the orientations depicted in the drawings and the various aspects of the embodiments. Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections are not to be Restrictions ^ These terms are only used to distinguish 154500.doc • 16- 201142215 One element, component, zone, layer or section with another zone, layer or section. The first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention. Embodiments of the invention are described herein with reference to the cross- Thus, the actual thickness of the layers can be varied, and variations in shape relative to the description are contemplated due to, for example, manufacturing techniques and/or tolerances. The embodiments of the invention should not be construed as limited to the particular shapes of the regions described herein, but rather to include variations in the shape resulting from, for example, manufacture. Areas illustrated or described as square or rectangular will typically have rounded or curved features due to normal manufacturing tolerances. The area illustrated in the figures is, therefore, in the nature of the invention, and is not intended to limit the scope of the invention. 4 shows an embodiment of a lamp 5A according to the present invention comprising a heat sink structure 52 having an optical cavity 54 having a platform 56 for holding a light source 58. Although described below with reference to an optical cavity Embodiments and some embodiments, but it should be understood that many other embodiments without optical cavities may be provided. Such embodiments may include, but are not limited to, a light source on a planar surface of the lamp structure or on a pedestal. Light source 58 can include a number of different illuminators, with the embodiment shown including an LED. Many different commercially available ED wafers or LED packages can be used, including but not limited to, available from N〇rth Carolina.

Durham's Cree, Inc. LED chip or LED package. It will be appreciated that a lamp embodiment without an optical cavity can be provided in which the LEDs are mounted in different ways in these other embodiments. By way of example, the light source can be mounted to the flat surface of the lamp, or a base for holding the LED can be provided. Light source 58 can be mounted to platform 56' using a number of different known mounting methods and materials, wherein light from source 58 is emitted from the top opening of cavity 54. In some embodiments, light source 58 can be mounted directly to platform 56, while in other embodiments 'the light source can be included on a sub-substrate or printed circuit board (PCB), followed by the sub-substrate or printed circuit board (pCB) Installed to platform 56. The platform 56 and heat sink structure 52 can include electrical traces or wires for applying electrical signals to: the conductive paths 1 of the source 58 are some of the conductive traces. Portions of the platform 56 may also be made of a thermally conductive material, and in one embodiment, heat generated during operation may be spread to the platform and then spread to the fin structure. The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials can be used including different metals (such as copper or aluminum) or metal alloys. Copper can have a thermal conductivity of up to 400 W/m-k or more. In some embodiments, the heat sink may comprise high purity aluminum, high purity aluminum at room temperature; having a thermal conductivity of about 2H) W/m-k. In other embodiments, the fin structure may comprise die cast aluminum having a thermal conductivity of about 200 W/m_k. The heat sink 52 may also contain other heat dissipation features such as heat dissipation (10) which are more effectively dissipated into the environment by increasing the surface area of the heat dissipation. In some embodiments, the heat sink fins 6 can be made of a material having a thermal conductivity higher than the remainder of the heat sink. In the illustrated embodiment, the fins 60 are shown in a generally horizontal orientation, although it will be understood that In other embodiments, the video cassette can have a vertical or angled orientation. In still other embodiments, the heat sink can include an active cooling element (4). , fan) convection in the low light 154500.doc -18- 201142215 Thermal resistance. In some embodiments, the heat dissipation from the phosphor carrier is achieved via a combination of convective heat dissipation and conduction through the fin structure 52. The different heat dissipation configurations and structures are described in U.S. Provisional Patent Application No. 6l/339, No. 5i6, entitled "LED Lamp Incorporating Remote Phosphor With Heat Dissipation Feature" by T〇ng et al. Cree, Inc. and incorporated herein by reference. Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of optical cavity 54. In embodiments that do not have an optical cavity, a reflective layer around the source can be included. In some embodiments, the surface may be coated with a material having a reflectance of about 75% or more of the visible wavelength of the light emitted by the source 58 and/or the wavelength converting material ("light"), while in other implementations In the example, the material may have a reflectivity of about 85% or more for the light. In still other embodiments, the material can have a reflectivity of about 95% or greater for the light. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type for mounting in conventional electrical sockets. For example, the fin structure may include features for mounting to a standard threaded swivel that may include a threaded portion that can be screwed into the threaded seat. In other embodiments, the fin structure may include a standard plug and electricity. The socket can be a standard socket, or the heat sink structure can include a GU24 base unit, or the heat sink structure can be a clip and the electrical socket can be a socket that receives and holds the clip (eg, as used in many fluorescent lamps). These are only a few of the options for the heat sink structure and sockets' and can be used to safely deliver electricity from the outlet to the other 154500.doc -19· 201142215 configuration. A lamp in accordance with the present invention can include a power supply or power conversion unit. The power supply or power conversion unit can include a driver to allow the light to be powered by the AC line voltage/current and to provide light source dimming capability. In some embodiments, the power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp, and in some embodiments, the LED driver can comprise less than a cubic centimeter, while in other embodiments, the LED driver can comprise a volume of about 2 cubic centimeters. In some embodiments, the power supply can be non-dimmable, but at a lower cost. It should be understood that the power supplies used may have different topologies or geometries and may also be dimmable. A phosphor carrier "includes over the top opening of the cavity 54" and includes a top-diffusion (four) over the light-filling system 62. In the illustrated embodiment, the scale carrier covers the entire opening and the cavity The opening is shown as being circular and the bowl carrier 62 is a disk. It should be understood that the cavity opening and the carrier carrier can be of many different shapes and sizes. It should also be understood that the body carrier (4) covers the full cavity opening as follows It is further described that the diffuser % is configured to disperse light from the scale carrier and/or LED into a desired lamp emission pattern 'and can comprise a number of different shapes and sizes, depending on the light it receives and the desired emission pattern of the lamp The embodiment of the disc body according to the present invention can be characterized as comprising a conversion material and a heat conductive light transmissive material, and it should be understood that a non-thermally conductive carbon carrier can also be provided. The light transmissive material may be transparent to light emitted from the light source 58 by a light source, and the conversion material shall be of a type that absorbs light from the wavelength of the light source and re-emits light of a different wavelength. In the embodiment, Thermally transparent material 154500.doc • 20- 201142215 includes a carrier layer 64, and the conversion material comprises a phosphor layer 66 on the phosphor carrier. As further described below, various embodiments may include many different thermal and light transmissive materials and conversion materials. When light from source 58 is absorbed by the phosphor in phosphor layer 66, the light is re-emitted in an isotropic direction, with about 5% of the light being emitted forward and 50% being emitted backwards to In the cavity 54. A significant portion of the 'backwardly emitted light' in the previous LED with the conformal fill layer can be directed back into the LED and the likelihood of light escaping is limited by the extraction efficiency of the LED structure. For some LEDs' The extraction efficiency can be about 70%, so a certain percentage of the light that is directed back into the LED from the conversion material can be lost. In a lamp with a remote phosphor configuration in accordance with the present invention, the LED is located at the bottom of the cavity 54. On the platform 56, a higher percentage of the light in the backward phosphor light strikes the surface of the cavity rather than the LED. These surface coatings are additionally reflected back to the phosphor layer 66 with the reflective layer 53 (at the phosphor layer 66). Light can be self-lighted The percentage of light in the light. These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise many different materials and structures including, but not limited to, reflections. Metal or multilayer reflective structures (such as distributed Bragg reflectors). In embodiments without optical cavities, a reflective layer around the LEDs can also be included. Carrier layer 64 can have 0.5 W/mk or 0.5 W/ Made of many different materials with thermal conductivity above mk, such as quartz, tantalum carbide (Sic) (thermal conductivity ~120 W/mk), glass (thermal conductivity 4 w/mk) or sapphire (thermal conductivity) It is ~40 W/mk). In other embodiments, carrier layer 64 can have a thermal conductivity greater than 1.0 W/m-k, while in other embodiments it can have a thermal conductivity greater than 154500.doc -21 · 201142215 at 5.0 W/m-k. In still other embodiments, the carrier layer can have a thermal conductivity greater than 10 W/m-k. In some embodiments, the carrier layer can have a thermal conductivity in the range of from 1.4 W/m-k to 1 〇 w/m-k. The disc carrier may also have different thicknesses depending on the material used, with a suitable thickness ranging from 0.1 mm to 1 〇 claw or 1 〇 mm or more. It should be understood that other thicknesses may be used depending on the characteristics of the material used for the carrier layer. The material should be thick enough to provide adequate lateral heat dissipation for specific operating conditions. In general, the higher the thermal conductivity of the material, the thinner the material may be, while still providing the necessary heat dissipation. Different factors can influence which carrier layer material is used, and different factors include, but are not limited to, cost and transparency to the source light. Some materials may also be more suitable for larger diameters such as glass or quartz. Such materials can provide reduced manufacturing costs by forming a scale layer on a larger diameter carrier layer and then singulating the carrier layer into smaller carrier layers. A number of different phosphors can be used in the phosphor layer 66, with the invention being particularly suitable for emitting white light lamps. As described above, in some embodiments, light source 58 can be an LED based light source and can emit light of a blue wavelength spectrum. The phosphor layer absorbs some blue light and re-emits yellow light. This situation allows the lamp to emit a combination of blue and yellow light. In some embodiments, blue light can be converted by a yellow conversion material using a commercially available YAG:Ce can, but using a system based on (Gd,Y)3(Al,Ga)5Ol2:Ce (such as , Y3Al5〇12:Ce(YAG)) The conversion particles made of phosphors, it is possible to obtain a wide range of broad yellow spectral emission. Other yellow discs that can be used to produce white light when used with an illuminator based on a blue LED include, but are not limited to:

Tb3-xRExOl2: Ce(TAG); RE=Y, Gd, La, Lu; or I54500.doc -22- 201142215

Sr2.x_yBaxCaySi〇4: Eu. The bowl light layer may also be provided with more than one disc, the one or more phosphors being mixed in the phosphor layer 66 or as the second phosphor layer on the carrier layer 64. In some embodiments, each of the two phosphors can absorb LED light and can re-emit light of a different color. In such embodiments, the colors from the two phosphor layers can be combined for achieving a higher CRI white (warm white) with a different white hue. This situation may include light from the yellow phosphor above that may be combined with light from a red phosphor. Different red phosphors can be used, including:

SrxCai.xSzEu, Y; Y=halide;

CaSiAlN3:Eu; or Sr2.yCaySi04:Eu Other phosphors can be used to produce colored illumination by converting substantially all of the light into a particular color. For example, the following phosphors can be used to produce green light:

SrGa2S4: Eu;

Sr2-yBaySi04:Eu; or SrSi2〇2N2:Eu 一些 Some additional phosphors suitable for use as the conversion particles of the phosphor layer 66 are listed below, but other phosphors may be used. Each phosphor exhibits an excitation in the blue and/or UV luminescence spectrum to provide a desired peak luminescence with efficient light conversion and an acceptable Stokes shift: yellow/green 154500. Doc •23- 201142215 (Sr,Ca,Ba)(Al,Ga)2S4:Eu2+

Ba2(Mg,Zn)Si2〇7:Eu2+

Gd〇 46Sr〇.3i AIj.23 〇xFi.38:Eu2 0.06 (Baj.x.ySrxCay)Si04:Eu

Ba2Si04: Eu2+ pushes and intercalates Ce113's L113AI5O12 is doped with Eu2+(Ca,Sr,Ba)Si2〇2N2 .

CaSc204: Ce3 + (Sr, Ba) 2Si04: Eu2+ red

Lu2〇3 :Eu3 + (^^2-xLax)(C6i,xEux)〇4 Sr2Ce1.xEux04 Sr2-xEuxCe〇4 SrTi03:Pr3+,Ga3 +

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ may use phosphor particles of different sizes including, but not limited to, particles in the range of from 1 nanometer (nm) to 30 micrometers (μηι) or more than 3 micrometers (μιη). In terms of scattering and mixing colors, smaller particles are usually larger particles. Better to provide a more uniform light. Larger particles are generally more efficient at converting light than lighter particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer 66 in the binder, and the filler may also have different concentrations or loads of scale material in the binder 154500.doc • 24· 201142215. Typical concentrations range from 30% to 70% by weight. In one embodiment, the phosphor concentration is about 65% by weight and is preferably evenly dispersed throughout the distal disc. The can light layer 66 can also have different zones with different conversion materials and conversion materials of different concentrations. Different materials can be used for the adhesive, wherein the material is preferably strong after curing and is transparent in the visible wavelength spectrum. Suitable materials include polyfluorene oxide, % oxygen resin, glass, inorganic glass, dielectric, BCB, polyamide, polymer and mixtures thereof, wherein the preferred material is polyfluorene (this is due to the high concentration of polyoxyl High transparency and reliability in power LEDs. Suitable polyphenylene oxides based on phenyl and methyl groups are available from D〇w(g) Chemical. Many different curing methods can be used to cure the adhesive. Different curing methods depending on the type of adhesive used include, but are not limited to, thermal curing, ultraviolet (UV) curing, infrared (IR) curing, or air curing. The phosphor layer 66 can be applied using different processes. Different processes include, but are not limited to, spin coating, sputtering, printing, powder coating, electrophoretic deposition (EpD), electrostatic deposition, and others. As mentioned above, the phosphor layer 66 can be coated with the binder material, but It should be understood that no binder is required. In still other embodiments, the phosphor layer 66 can be separately fabricated and then the phosphor layer 66 can be mounted to the carrier layer 64. In one embodiment, the phosphor-binder mixture can be sprayed. Dispersing above the carrier layer 64' then curing the binder to form the phosphor layer 66. In some of these embodiments, the phosphor-binder mixture can be sprayed, poured or dispersed onto the heated carrier layer. On or above 64, so that the 154500.doc • 25· 201142215 proper photoresist bond mixture contacts the carrier layer 64, the heat from the carrier layer 64 is dispersed into the adhesive and the adhesive is cured. A solvent comprising a phosphor-binder mixture that liquefies the mixture and reduces the viscosity of the mixture, thereby making the mixture more suitable for spraying. Many different solvents can be used including, but not limited to, toluene, benzene, Zylene or 〇s_2〇 available from Dow Corning®, and different concentrations of solvent can be used. When the solvent-phosphor-binder mixture is sprayed or dispersed on the heated carrier layer 64, The heat of the carrier layer 64 evaporates the solvent, wherein the temperature of the carrier layer affects the extent to which the solvent evaporates. The heat from the carrier layer 64 also cures the binder in the mixture, thereby A fixed phosphor layer is left on the layer. The carrier layer 64 can be heated to a number of different temperatures depending on the materials used and the desired solvent evaporation and adhesive cure rate. Suitable temperature range is 9 (rc to l5 〇) 〇c, but it should be understood that other temperatures can also be used. Various deposition methods and systems are described in 美国11〇&1〇 et al. entitled "Systems and Methods for Application 〇f 〇ptical Materials to Optical Elements" Patent Application Publication No. 2010/0155763, and the disclosure has also been assigned to Inc. This application is filed concurrently with the present application and is hereby incorporated by reference. The light-receiving layer 66 can have a plurality of different thicknesses depending, at least in part, on the concentration of the light-emitting material and the desired amount of light to be converted by the phosphor layer 66. The light-filling layer according to the present invention may be higher than 30°/. The concentration level (phosphor load) is applied. Other embodiments may have a concentration level above 50%, while in other embodiments, the concentration level may be above 60%. In some embodiments, the 145500.doc -26- 201142215 optical layer can have a thickness in the range of 1 〇 micrometer to 1 〇〇 micrometer, while in other embodiments, the phosphor layer can have a thickness of 40 micrometers to 50 micrometers. The thickness within the range. The methods described above can be used to coat multiple layers of the same or different phosphor materials, and different phosphor materials can be applied in different regions of the carrier layer using known masking processes. The method described above provides some thickness control for the phosphor layer 66, but for even greater thickness control, known methods can be used to grind the phosphor layer to reduce the thickness of the phosphor layer 66 or to level the thickness over the entire layer. . This abrasive feature provides the added advantage of being able to produce a lamp that emits within a fine sorting level on the CIE chromaticity diagram. The sorting is generally light that is known in the art and that is intended to provide the end customer with a led or lamp that emits light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to as sorting in this technique) by color or brightness. Each sorting level typically contains LEDs or lights from a group of colors and brightness, and is typically identified by a sorting level code. White LEDs or lamps can be classified by chromaticity (color) and luminous flux (brightness). The thickness control of the phosphor layer provides greater control in controlling the amount of light that is converted by the phosphor layer to produce a light that emits light within the target sorting level. A plurality of phosphor carriers 62 having phosphor layers 66 of the same thickness can be provided. By using light sources 58 having substantially the same illumination characteristics, lamps having nearly identical emission characteristics can be fabricated, which in some examples can fall within a single sorting level. In some embodiments, the lamp illumination is within a standard deviation from a point on the CIE map, and in some embodiments 'the standard deviation comprises less than 10 steps (1 〇 _step) MacA 154500.doc -27- 201142215 When an ellipse (McAdams ellipse) » In some embodiments, the illumination of the lamp belongs to a 4_step MacAdam ellipse centered on dExWOJU, 0.323). The filler carrier 62 can be mounted and bonded to the opening in the cavity 54 using a different known method or material, such as a thermally conductive bonding material or thermal grease. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, a phosphor carrier can be mounted over the opening using a thermally conductive device such as a clamping mechanism, a screw or a thermal adhesive to hold the phosphor carrier 62 tightly to the ..., sheet, . Structure to maximize thermal conductivity. In one embodiment, a thermal grease layer having a thickness of about 100 μm and a thermal conductivity of 1^02 w/m_k is used. This configuration provides an effective thermal path for dissipating heat from the scale layer 66. As mentioned above, different lamp embodiments without cavities can be provided, and in addition to being above the opening of the cavity, the phosphor carrier can be mounted in many different ways. During operation of the lamp 5, phosphor conversion heating is concentrated in the phosphor layer 66 'such as concentrated in the center of the disc layer 66, most of which slams the phosphor carrier 62 through the phosphor layer 66 and passes through Phosphor carrier ^. The thermally conductive nature of the carrier causes the heat to spread laterally toward the edge of the scale carrier 62 as exhibited by the first heat stream 7'. Heat is passed through the layer of thermal grease at the edges and into the fin structure 52. As shown by the second heat flow 72, heat can be efficiently dissipated into the environment in the heat sink structure 52. As noted above, in the lamp 50, the platform 56 and the fin structure 52 can be thermally coupled or coupled. . This coupling configuration causes the phosphor carrier 62 to share a thermally conductive path for heat dissipation with the source of the light source. The heat from the light source 58 passes through the flat 154500.doc • 28- 201142215. The heat of the unit (as shown by the third heat flow 74) can also be distributed to the heat sink structure 52. (4) The heat of the light carrier woven into the heat sink structure 52 may also flow into the platform 56. As further described below, in other embodiments, the fill carrier 62 and the light source 58 can have separate thermally conductive paths for dissipating heat, wherein such separate paths are referred to as "decoupled", as cited above The method is described in U.S. Provisional Patent Application Serial No. 61/339,516, the entire disclosure of which is incorporated herein. It should be understood that in addition to the embodiment shown in Figure 4, the phosphor carrier can be configured in many different ways. The phosphor layer can be on either surface of the carrier layer or can be mixed in the carrier layer. The phosphor support may also comprise a scattering layer which may be included on the phosphor layer or carrier layer or mixed in the phosphor layer or carrier layer. It should also be understood that the phosphor and scattering layer may not cover the entire surface of the carrier layer and in some embodiments, the conversion layer and the scattering layer may have different concentrations in different regions. It should also be understood that the phosphor support may have surfaces of different roughness or shape to enhance transmission through the phosphor support. As mentioned above, the diffuser is configured to disperse light from the phosphor carrier and LED into the desired lamp emission pattern and can have many different shapes and sizes. In some embodiments, the diffuser can also be disposed on the phosphor carrier to shield the phosphor carrier when the lamp is not emitting light. The diffuser can have a material to impart a substantially white appearance to impart a white appearance to the bulb when the lamp is not illuminated. A number of different diffusers having different shapes and attributes can be used with the lamp 50 and the lamps described below, such as the application entitled "LED Lamp With Remote 154500", filed March 3, 2010, incorporated herein by reference. Doc ·29· 201142215

Their lamps are described in U.S. Provisional Patent Application Serial No. 61/339,515, the entire entire entire entire entire entire entire entire entire content The diffuser can also be in a variety of shapes, including (but not limited to) a substantially asymmetrical "flat shape", as described in the October 10, 2010 application entitled "Non-uniform Diffuser to

In U.S. Patent Application Serial No. 12/901,405, the entire disclosure of which is incorporated herein by reference. Lamps in accordance with the present invention may include many different features in addition to those described above. Referring again to Figure 4, in their lamp embodiment, the cavity 54 can be filled with a transparent thermally conductive material to further enhance the heat dissipation of the lamp. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. The heat from the source will still be conducted via the platform 56, but may also pass through the cavity material to the fin structure 52. This situation will allow for a lower operating temperature of the light source 58 but a risk of an elevated operating temperature for the phosphor carrier 62. This configuration can be used in many different embodiments, but is particularly well suited for lamps with higher light source operating temperatures (compared to the operating temperature of the phosphor carrier). This configuration allows for more efficient heat dissipation from the source in applications that can tolerate additional heating of the phosphor carrier layer. As discussed above, different lamp embodiments in accordance with the present invention can be configured with many different types of light sources. In an embodiment, eight LEDs can be used, with eight LEDs connected in series to the circuit board by two wires. The wires can then be connected to the power supply unit described above. In other examples, more than eight or fewer LEDs may be used, and as may be used above, 'available from Cree' Ine., including eight XL 154500.doc • 30· 201142215 XP-E LED or four XLamp® XP-G LEDs. The different single-string LED circuits are described in the following U.S. Patent Application: U.S. Patent Application Serial No. 12/566,195, entitled,,,,,,,,,,,,,,,,,,,,,, , and van de Ven et al. entitled "Solid State

U.S. Patent Application Serial No. 12/704,730, the disclosure of which is incorporated herein in In still another embodiment, the lamp housing is included in the optical cavity 02 within the heat sink structure 156. Similar to the above embodiments, a lampless cavity lamp 100 can also be provided, wherein the LEd is mounted on the surface of the heat sink or mounted on a three dimensional structure or pedestal structure having a different shape. The light source 1〇4 based on the flat LED is mounted to the stage 1〇6' and the phosphor carrier ι8 is mounted to the top of the cavity 102. The opening 'where the phosphor carrier 1 〇 8 has any of the features described above. In the illustrated embodiment, the phosphor carrier 108 can be in the shape of a flat disk and comprise a thermally conductive transparent material and a phosphor layer. The disc carrier 1 8 can be mounted to the cavity by a thermally conductive material or device as described above. The cavity 1〇2 may have a reflective surface to enhance the emission efficiency, as described above. Light from the source 104 passes through the phosphor carrier 108, and in the phosphor carrier 1'8, a portion of the light is converted from the phosphor in the phosphor carrier 108 to the light of the port 4. In one embodiment, the source 104 may comprise a blue light emitting LED ' and the scale body 1 8 may comprise yellow phosphor light 154500 as described above. Doc -31- 201142215 The yellow phosphor absorbs one part of the blue light and re-emits yellow light. The lamp emits LED light in combination with white light of yellow phosphor light. Like the above, light source 104 can also include a plurality of different LEDs that emit light of different colors, and the phosphor carrier can include other phosphors to produce light having a desired color temperature and color rendering properties. The lamp 100 also includes a shaped diffuser dome 110 mounted over the cavity 〇2. The diffuser dome 110 includes diffusing or scattering particles such as those diffusing or scattering particles listed above. The scattering particles can be provided in a curable adhesive which is formed in a generally dome shape. In the illustrated embodiment, the dome 110 is mounted to the heat sink structure 1〇5 and has an enlarged portion at the end opposite the heat sink structure 105. Different binder materials such as polyfluorene oxide, epoxy, glass, inorganic glass, dielectric, BCB, polyamine, polymers, and mixtures thereof, as discussed above, can be used. In some embodiments, white scattering particles can be used to have a white dome that hides the color of the phosphor in the phosphor carrier 1〇8 in the optical cavity. This imparts a white appearance to the entire lamp 100, which is generally more visually acceptable to the consumer or more attractive to the consumer than the phosphor color. - Embodiment diffusers may include white dioxide particles, white The titanium dioxide particles can impart an overall white appearance to the diffuser dome 11 . The diffuser dome 110 provides the added benefit of distributing the light emitted from the optical cavity in a more uniform pattern. As discussed above, light from a source in an optical cavity can be emitted in accordance with a Lambertian pattern on a large ship. The shape of the I dome i 10 and the scattering properties of the scattering particles cause the light to emit in a more omnidirectional manner 154500. Doc •32- 201142215 The case was launched from the dome. Engineered domes can have different concentrations of scattering particles in different zones or can be shaped into specific emission patterns. In some embodiments (including the embodiments described below), the dome can be engineered to provide an omnidirectional definition of the emission pattern from the lamp in accordance with the Energy Department (d〇£) Energy Star Distribution criteria. One of the criteria that the lamp in this article meets is that the uniformity of emission must be at 〇. To 135. Within 2% of the average value under review, >5〇/0 from the total flux of the lamp must be at 135. To 180. The launch area is launched, with the measurement system at 0. 45. 9, 〇. Performed under azimuth. As mentioned above, the different lamp embodiments described herein may also include Type A trim LED bulbs that meet the D〇E ENERGY STAR® standard. The present invention provides an efficient, reliable, and cost effective lamp. In some embodiments, the entire lamp can include five components that can be assembled quickly and easily. Similar to the above embodiment, the lamp 100 can include a mounting mechanism 11 2 of the type installed in a conventional electrical socket. In the illustrated embodiment, the lamp rim includes a threaded portion 丨丨 2 for mounting to a standard threaded turret. Like the above embodiments, the lamp 100 can include a standard plug and the electrical socket can be a standard socket, or the electrical socket can include a GU24 base unit, or the lamp 1 can be a clip and the electrical socket can receive and hold the clip Socket (for example, as used in many fluorescent lamps). As mentioned above, the space between some of the features of the lamp 100 can be considered a mixing chamber in which the two spaces between the light source 104 and the phosphor carrier 108 comprise a first light mixing chamber. The space between the phosphor carrier 108 and the diffuser 110 can include a second light mixing chamber in which the mixing chamber promotes uniform color and intensity emission of the lamp. The same situation can be applied to the following 154500. Doc-33- 201142215 Examples of phosphor blanks and diffusers having different shapes. In other embodiments, the crucible includes additional diffusers and/or canister carriers that form additional mixing chambers, and the diffusers and/or scale carriers can be configured in a different order. Different lamp embodiments in accordance with the present invention can have many different shapes and sizes. 6 shows another embodiment of a lamp 12A according to the present invention, the lamp 12 is similar to the lamp 1 and similarly includes an optical cavity 122' in the heat sink structure 125 in which the light source 124 is mounted in the optical cavity 122. platform. Similarly, the heat sink structure does not need to have an optical cavity, and the light source can be provided on other structures than the heat sink structure. Such structures may include a planar surface or pedestal having a light source. The photo body carrier 128 is mounted over the cavity opening by a thermal connector. Lamp 12A also includes a diffuser dome 130 mounted to the fin structure 125 above the optical cavity. The diffuser dome can be made of the same material as the diffuser dome 110 described above. 'But in this embodiment, the dome 130 is elliptical or egg-shaped to provide a different lamp emission pattern while still obscuring The color of the phosphor from the phosphor carrier 128. Also note that the fin structure 25 and the platform 126 are thermally decoupled. That is, there is a space between the platform 126 and the heat sink structure such that the platform 126 and the heat sink do not share a heat path for dissipating heat. As mentioned above, this situation provides improved heat dissipation from the optical disk carrier as compared to lamps that do not have a heat path to deplete. Lamp 120 also includes for mounting to screw portion 132. δ In the above embodiment, the filler carrier is two-dimensional (or flat/planar) while the LEDs in the source are coplanar. However, it should be understood that in other lamps 154500. Doc , 34 · 201142215 In the embodiment, the phosphor is loaded with dirt and can be used in different shapes, including different two-dimensional shapes. The term "three-dimensional sound in 一神一维" is intended to be ambiguous except for the plane as shown in the above embodiment. m Shi π shape. Figure 7 to Figure 1 show the different cautions of the three-dimensional phosphor carrier according to the present invention.  Gate embodiments, but it should be understood that the phosphor carriers can take many other shapes. As discussed above, when the phosphor absorbs and re-emits light, it is emitted in an isotropic manner such that the three-dimensional optical carrier is used to convert light from the source and also to dissipate light from the source. A three-dimensional carrier layer of a different shape like the diffuser described above can be illuminated in accordance with an emission pattern having different characteristics. This portion depends on the emission pattern of the light source. The diffuser can then be matched to the emission of the phosphor carrier to provide the desired lamp emission pattern. Figure 7 shows a hemispherical shaped phosphor carrier 154 comprising a hemispherical carrier 155 and a phosphor layer 156. The hemispherical carrier 155 can be made of the same material as the carrier layer described above, and the phosphor layer can be made of the same material as the phosphor layer described above, and the scattering particles can be included in the carrier and phosphorescent as described above. In the layer. In this embodiment, the phosphor layer 156 is shown as being on the outer surface of the carrier 155. It should be understood, that the phosphor layer may be on the inner layer of the carrier, mixed with the carrier' or any combination of the above three. In some embodiments, having a phosphor layer on the outer surface minimizes emission losses. When the illuminator light is absorbed by the phosphor layer 156, the light system is emitted omnidirectionally, and some of the light can be emitted backwards and absorbed by a lamp element such as an LED. Phosphor layer 156 may also have a different index of refraction than hemispherical carrier 155 such that light emitted forward from the phosphor layer may be retroreflected from the inner surface of carrier 155. This light can also be attributed to being absorbed by the lamp element 154500. Doc -35- 201142215 Loss. In the case where the phosphor layer 156 is located on the outer surface of the carrier 155, the light emitted forward does not need to pass through the carrier 155 and will not be lost due to reflection. The light that is emitted backwards will hit the top of the carrier where at least some of the light will be reflected back. This configuration results in a reduction in light from the phosphor layer 156 that is emitted back into the carrier where it can be absorbed. The fill layer 156 can be deposited using many of the same methods described above. In some examples, the three-dimensional shape of the carrier 155 may require additional steps or other processes to provide the necessary coverage. In embodiments in which the solvent _ illuminant_adhesive mixture is sprayed, the support can be heated as described above, and multiple nozzles may be required to provide the desired coverage (e.g., near uniform coverage) over the support. In other embodiments, fewer nozzles can be used to simultaneously rotate the carrier to provide the desired coverage. Similar to the above, the heat from the carrier 155 can evaporate the solvent and help cure the binder. In still other embodiments, the phosphor layer can be formed via an ink immersion process whereby a phosphor layer can be formed on the inner or outer surface of the carrier 155 but it is particularly suitable for formation on the inner surface. The carrier 155 can be at least partially filled with a phosphor mixture adhered to the surface of the carrier or otherwise contact the carrier 155 with the phosphor mixture. The mixture can then be discharged from the support to leave a layer of the disc mixture on the surface. The phosphor mixture layer can then be cured. In one embodiment the mixture may comprise polyethylene oxide (PEO) and a phosphor. The carrier can be filled and then evacuated to leave a layer of PE0-phosphor mixture which can then be thermally cured. The PEO evaporates or is dissipated by heat, leaving a phosphor layer. In some embodiments, the adhesive can be applied to further solidify 154500. Doc-36-201142215 A phosphorescent layer, while in other embodiments, the phosphor can be retained without a binder. Similar to the process for coating a planar carrier layer, such processes can be used in a three-dimensional carrier to coat a plurality of phosphor layers that can have the same or different phosphor materials. The phosphor layer can also be applied to both the interior and exterior of the carrier and can be of different types having different thicknesses in different regions of the carrier. In still other embodiments, different processes can be used, such as coating the carrier with a sheet of phosphor material that can be thermally formed into the carrier. In a lamp utilizing the carrier 155, the illuminator can be disposed at the base of the carrier such that light from the illuminator is emitted upwardly and through the carrier 155. In some embodiments, the illuminator can illuminate in a substantially Lambertian pattern, and the carrier can help disperse the light in a more uniform pattern. Figure 8 shows another embodiment of a three-dimensional phosphor carrier 157 comprising a bullet-shaped carrier 158 and a phosphor layer 159 on the outer surface of the carrier. The carrier 158 and the phosphor layer 159 can be used in accordance with the present invention. The same method as described above is formed from the same material as described above. Different shaped phosphor carriers can be used with different illuminators to provide the desired overall lamp emission pattern. 9 shows a further embodiment of a three-dimensional phosphor carrier 160 comprising a sphere-shaped carrier 161 and a male layer on the outer surface of the carrier, a carrier 161 and a phosphor layer 162, in accordance with the present invention. The same method as described above was used to form the same material as the material described above. Figure 1 shows a phosphor carrier 丨 63 according to still another embodiment of the present invention. The phosphor carrier 163 has a substantially spherical shape carrier 164 and a narrow neck portion 154500. Doc -37- 201142215 165. Similar to the above embodiment, the phosphor carrier 164 includes a phosphor layer 166 on the outer surface of the carrier 164, the phosphor layer 166 being made of the same material as described above and using the same method as described above. The method is formed. In some embodiments, a phosphor carrier having a shape similar to carrier 164 may be more efficient in converting illuminator light and re-emitting the Lambertian light from the source into a more uniform emission pattern. 11 through 13 show another embodiment of a lamp cartridge 7 in accordance with the present invention having a heat sink structure 172, an optical cavity 174, a light source 176, a diffuser dome 1 78, and a threaded portion 180. This embodiment also includes a three-dimensional phosphor carrier 182 comprising a thermally conductive transparent material and a phosphor layer. The three-dimensional phosphor carrier 182 is also mounted to the heat sink structure 172 by a thermal connector. However, in this embodiment, the phosphor carrier 182 is hemispherical in shape and the illuminator is configured such that light from the source passes through the phosphor carrier 182 where at least some of the light is converted. The three-dimensional shape of the phosphor carrier 182 provides a natural separation between the phosphor carrier 182 and the source 176. Therefore, the light source 176 is not mounted in the recess formed in the heat sink of the optical cavity. In other words, the light source 176 is mounted on the top surface of the heat sink structure 172, wherein the optical cavity m is formed by the space between the phosphor carrier m and the top of the heat sink structure 172. This configuration may allow for less Lambertian emissions from the optical cavity 174 because there is no side of the optical cavity that resists or redirects lateral emissions. In the embodiment of the lamp 170, a combination of a blue LED for the light source 176 and a yellow and red phosphor in the disc carrier is utilized. In this case, the phosphor support 182 is yellow or orange, and the diffuser dome 178 shields the 154500. Doc •38- 201142215 color, while dispersing the light into the desired pattern to be emitted in the lamp 17〇, the conduction path for the platform is coupled to the conduction path for the heat sink structure, but it should be understood that in other embodiments, The conduction path of the platform and the conduction path for the heat sink structure can be solved. Figure 14 shows an embodiment of a lamp 19A not according to the present invention. The lamp 19A includes eight LED light sources 192 mounted on a heat sink 194 as described above. The illuminators can comprise a number of different types of LEDs that can be coupled together in many different ways and, in the illustrated embodiment, connected in series. In other embodiments, the LEDs can be interconnected in different combinations of series and parallel interconnects. Note that in this embodiment, the illuminator is not mounted in the optical cavity, but instead is mounted on the top planar surface of the heat sink 194. Figure 15 shows the lamp 19A shown in Figure 14 with a dome shaped phosphor carrier 196 mounted over the light source 丨 92 shown in Figure 14. The lamp 190 shown in Figure 15 can be combined with a diffuser 198 (as described above) to form a lamp with dispersed light emission. As described in more detail below, LED lamps in accordance with the present invention can emit desired combinations of light from different components, some embodiments combining three or more peak emissions (i.e., illumination components) in different embodiments, Different peak emissions may come from different lamp features, such as conversion materials or solid state light sources. The combination of these peak emissions provides light with the desired color, color temperature, and/or color rendering. In some embodiments, the lamp emits white light having a desired color temperature and color rendering. In some embodiments, a lighting unit or lamp in accordance with the principles of the present invention emits light of at least three peak wavelengths (e.g., blue, yellow, and red). To 154500. Doc -39· 201142215 One less first wavelength is emitted by a solid state light source (such as blue light), and at least one second wavelength is emitted by a wavelength converting element (for example, green light and/or yellow light). Depending on the embodiment, light of a third wavelength, such as green light and/or red light, may be emitted by a solid state light source and/or a wavelength converting element. In some embodiments, the at least three peak wavelengths can be emitted by a wavelength converting element or a solid state light source. In some embodiments, the solid state light source can emit light of a wavelength that overlaps, similar or the same as the wavelength converting material. For example, a solid state light source can include light that emits a wavelength that overlaps or is substantially the same as light emitted by a phosphor in a wavelength converting material (eg, a red phosphor added to a yellow phosphor in a wavelength converting material) (eg, , red light) LED. In some embodiments, the solid state light source comprises at least one additional LED that emits light having at least one different peak light wavelength, and/or the wavelength converting material comprises at least one additional phosphor or lumiphor that emits at least one different peak wavelength. . Therefore, the light emitting unit emits light having at least four different peak light wavelengths. As mentioned above, the phosphor support may comprise a plurality of conversion materials such as yellow/green and red phosphors. These phosphors provide a yellow/green component for the emission of white light. However, in various embodiments, such light components may be provided directly from the LED wafer rather than via fill-in conversion. These different configurations may provide certain advantages including, but not limited to, lamps that require lower operating power and that are less expensive by eliminating the need for a particular phosphor. Figure 16 shows an embodiment of a lamp 2 according to the present invention in which the red component can be provided by a red LED rather than from a red phosphor. Light 2〇〇 154500. Doc • 40- 201142215 includes a plurality of LED chips 202 mounted to a carrier 204, which may include a printed circuit board (PCB) carrier, substrate or sub-substrate. Carrier 204 can include interconnected electrical traces (not shown) for applying electrical signals to LED wafer 202. LED wafer 202 can include one or more blue light emitting LEDs 206 and one or more red light emitting LEDs 208. It should be understood that in other embodiments, different commercially available LEDs that emit light of many different colors may be utilized. The phosphor 210' is included above the LED wafer 202 and spaced apart from the LED wafer 202 such that at least some of the light from the [ED wafer 202 passes through the second phosphor 210. Phosphor 210 should be of the type that absorbs light from the wavelength of blue LED 206 and re-emits light of different wavelengths. In the illustrated embodiment, the phosphor 21 is dome shaped and positioned over the LED wafer 202, although it should be understood that the phosphor 21 can employ many different shapes and sizes as described above (such as 'disc or Sphere). The phosphor 21(R) may be in the form of a phosphor support characterized by a conversion material comprising a binder (as described above), but may also comprise a thermally conductive support and a light transmissive material. A glazing body configured with a thermally conductive material is described in U.S. Provisional Patent Application No. 6i/339, No. 5,16, filed on March 3, 2011, entitled "LED Lamp Incorporating Remote Phosphor With Heat Dissipation Features" This application is incorporated herein by reference. In other embodiments, an encapsulant can be formed or mounted over the LED wafer 202, and the second phosphor 210 can be formed as a layer or deposited on the top surface of the encapsulant. The encapsulant can take a number of different shapes, and in the embodiment shown the 'encapsulating agent is dome shaped. In still other embodiments having an encapsulating agent, the second phosphor 210 can be formed as a layer in the encapsulant, 154500. Doc •41 - 201142215 may be formed in the area of the encapsulant. A number of different phosphors can be used in various embodiments in accordance with the present invention, and the phosphor 210 in the illustrated embodiment includes a phosphor that absorbs blue light from the LED wafer and emits yellow light. Many different phosphors can be used for the yellow conversion materials (including those described above). During operation, blue and red light from the LED wafer 202 passes through the phosphor 21, and in the phosphor 21, a portion of the blue light is converted into yellow light. Red light from the red LED wafer can pass through the phosphor 210 without being converted or absorbed. A portion of the blue light may also pass through the phosphor 21〇 along with the red light from the LED wafer 202. Thus, lamp 200 can emit light in a combination of blue, red, and yellow light, and some embodiments emit a warm white light combination having a desired color temperature. Many different blue light emitting LEDs can be used, which can be made from many different materials, with suitable blue light emitting LEDs being made from a system of bismuth nitride materials. Many different red-emitting LEDs can also be used, which can be made from many different materials such as those made from the AlInGaP material system. These materials are merely examples of many different materials that can be used with such LEDs. The use of a red illuminating LED instead of a red phosphor for the red component provides special advantages. Compared to the red phosphor, the red light emitted directly from the active layer of the red LED has a much narrower peak emission, making it easier for the human eye to respond to red light with a sharper peak. In some embodiments, the peak may be smaller 'and the spectrum may have a full width at half maximum (FWHM) of less than 5 nanometers (nm), and in other embodiments, the spectrum may have a FWHM of less than 30 nm. The FWHM peak of the red light of the phosphor can be 15 11111 or 15 154500. Doc •42- 201142215 nm or more. In addition, the red light emitted directly from the LED does not need to be converted and does not suffer from loss of efficiency due to phosphor conversion. Therefore, the amount of power required to generate an overall white emission from the lamp 200 can be reduced by up to 25% or more, resulting in an original 12. A 5 W to 13 W input power operated lamp can operate at 10 W input power. In other embodiments, the power reduction may be greater than 25%, while in other embodiments, the power reduction may be less than 20°/. . This configuration provides the additional advantage of reduced lamp cost by eliminating the need for relatively expensive red phosphors. Red phosphors can also be relatively expensive, and the use of red LEDs for red emission components can produce lamps that are less expensive than similar lamps that use red phosphors. Figure 17 shows another embodiment of a lamp 220 that is similar to the lamp 200 of Figure 14 and that has many of the same features. Lamp 220 includes an LED wafer 222 mounted on carrier 224, wherein the LED wafer includes one or more blue LEDs 226 and one or more red LEDs 228 similar to the LEDs depicted in FIG. In this embodiment, the phosphor comprises a dome-shaped green phosphor 230 over the LED 222, wherein light from the LEDs passes through the phosphor 230. The phosphor absorbs at least some of the light from the blue LED 226 and re-emits green light, and the lamp 220 emits a combination of white light of blue, red and green light. As mentioned above, the lamp and its phosphor can be configured in many different ways in accordance with the present invention. Figure 18 illustrates yet another embodiment of a lamp 250 in which the LED wafer 252 of the lamp 250 is mounted. Like the above embodiment, the LED chip 252 can include a blue LED 256 and a red LED 258. LED crystal 154500. Doc • 43- 201142215 The sheet 252 can be mounted to a carrier 260 similar to the carrier described above, and in the illustrated embodiment, the LED wafer 252 and carrier 260 can be mounted within the optical cavity 254. In other embodiments, the optical cavity can be mounted to the carrier around the LED wafer. The carrier 260 can have a reflective layer 262 on its exposed surface between the LED dies 252 as described above, and the optical cavity 254 can have a reflective surface 264 to redirect light out of the top opening of the optical cavity 254. Phosphor 266 is disposed over the opening of optical cavity 254, and in the illustrated embodiment, phosphor 266 is planar. However, it should be understood that phosphor 266 can take many different shapes including, but not limited to, domes or spheres. Similar to the embodiments described above, phosphor 266 can include a phosphor that absorbs light from LED wafer 252 and emits light of a different color. In the illustrated embodiment, phosphor 266 comprises one of the yellow phosphors that absorb blue light and re-emit yellow light as described above. Similar to the above embodiment, the blue and red light from the LED wafer 252 passes through the phosphor 266 where at least some of the blue light is absorbed by the yellow phosphor and re-emitted into yellow light. Red light from the LED wafer can pass through the yellow phosphor while undergoing little or no absorption. The lamp 250 can emit a combination of white light of blue light, red light and yellow light. In other embodiments, phosphor 266 can comprise one of the green phosphors described above. By providing a red illumination component directly from the red illuminated LED, the light 250 can include the advantages described above. Figure 19 shows another embodiment of a lamp 320 in accordance with the present invention in which an LED die 322 is mounted to a carrier 324 that includes one or more blue LEDs and one or more red LEDs. The second yellow (or green) phosphor 330 is disposed in a spherical shape over the optical cavity. LED light passes through the phosphor 154500. Doc-44 - 201142215 330, wherein at least some of the LED light is converted such that the lamp 32 〇 emits a combination of white light of blue, red and green light. Figures 20 and 21 show another embodiment of a lamp 35 according to the present invention. The lamp 350 is similar to the lamps shown and described in the following application: (9) (7) Year Month 3 Months and 4 is Lamp With US Patent Application No. 61/339,515 to the Remote Phosphor and Diffuser Configuration, and US Patent Application entitled "N〇n-uniform Diffuser to Scatter Light Into Uniform Emission Pattern", October 8, 2010 No. 12/901, 405. The lamp includes a submount or heat sink 352, and a dome shaped phosphor carrier 354 and a dome shaped diffuser 356. The lamp also includes an LED 358'. In this embodiment, [ED 358 is mounted on the planar surface of the heat sink 352] while the phosphor carrier and diffuser are above the LED wafer 358. LED wafer 358 and fill carrier 354 may comprise any of the configurations and characteristics described above, such as 'some embodiments have red and blue light emitting LED wafers. The phosphor support may comprise one or more of the phosphor materials described above, but preferably comprises a phosphor that absorbs blue light and emits yellow light such that the lamp emits a combination of white light of blue, red and yellow light. Lamp 350 can include a mounting mechanism of the type to be installed in a conventional electrical outlet. In the illustrated embodiment, the lamp 350 includes a threaded portion 360 for mounting to a standard threaded seat. Like the above embodiments, the lamp 350 can include a standard plug and the electrical socket can be a standard socket, or the electrical socket can include a GU24 base unit, or the light 350 can be a clip and the electrical socket can be a socket that receives and holds the clip ( For example, as used in many fluorescent lights). A lamp according to the invention may comprise a power supply or a power conversion unit, the 154500. Doc -45- 201142215 The power supply or power #change unit can include a driver to allow the light bulb to be powered by the AC line voltage/current and provide source dimming capability. In some embodiments, the power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp 35A (such as in the body portion 362), and in some embodiments, the LED driver can comprise less than 25 cubic centimeters, while in other embodiments, the LED driver can Contains a volume of approximately 2 cubic centimeters. In some embodiments, the power supply can be non-dimmable, but at a lower cost. It should be understood that the power supplies used may have different topologies or geometries and may be dimmable. Figure 22 shows an embodiment of an LED wafer array 3 mounted to a heat sink 3〇2. Different LED arrays can have many different numbers of LEDs and can be configured in many different ways, with the array shown comprising three red LEDs 304 and five blue LEDs 306. In other embodiments, the array can include four red LEDs and five blue LEDs. Figures 23 through 26 show different embodiments of LED lamps in which phosphor spheres are mounted on an array. These are only a few of the many different shapes and sizes that can be used in the lamp according to the invention. Figure 2 7 shows color targets on a CIE diagram of different lamp embodiments in accordance with the present invention. LED arrays in accordance with the present invention can be coupled together in a number of different series and parallel combinations. In an embodiment, the red and blue LEDs may be interconnected in different groups, which may include various serial and parallel combinations of their own. By having separate strings, the current applied to each string can be controlled to produce the desired lamp color temperature (such as 3000 K). Figure 28 and Figure 29 show that there are 3 154500. Doc -46· 201142215 The performance characteristics of red LEDs and 5 blue (450 nm) LED LED arrays. Some of the LED lamps according to the present invention may have a correlated color temperature (CCT) of from about 12 〇〇 to 35 ,, wherein the color rendering index is 80 or more. Other Lamp Embodiments can emit light having the following luminous intensity distribution from the top of the lamp: between 0° and 145. The variation within the range is not more than 丨〇%. In other embodiments, the lamp can emit light having a distribution of luminous intensity: at 〇. To 135. The variation within the range is not more than 20 ° /. . In some embodiments, at least 5% of the total flux from the lamp is at 135. To 18 baht. In the district. Other embodiments may emit light having the following intensity distribution: at zero. To 120. The variation within the range is not more than 3〇%. In some embodiments, the led light has a color space uniformity such that the chromaticity changes from the weighted average point by no more than 〇 随着 4 as the viewing angle changes. Other lamps are compatible with the operational requirements for 60 watt incandescent replacement bulbs, color space uniformity, light distribution, color rendering index, size, and base type. In some embodiments, a lamp according to the present invention can emit light having a high color rendering index (CRI) such as g 〇 or 80. In some other embodiments the lamp can emit light having a CRI of 90 or greater. The lamp can also produce light with a correlated color temperature (CCT) from 2500 K to 3500 κ. In other embodiments, the light may have a CCT from 2700 K to 3300 K. In still other embodiments, the light may have a CCT from about 2725 K to about 3045 K. In some embodiments 'light can have a CCT of about 2700 K or about 3000 K. In still other embodiments of light tunable, the CCT can be reduced by dimming. Under this condition, the CCT can be reduced to as low as 1500 K or even 1200 K. In some real 154500. Doc • 47- 201142215 In the example, CCTe can be added by dimming depending on the embodiment, and other output spectral characteristics can be changed based on dimming. Figures 30 through 31 show another embodiment of a lamp 4 according to the present invention. The lamp 400 is similar to the lamp 35 shown in Figures 2G and 21 and described above. The lamp 4A includes a heat sink 402 having a longer tab 404 alternating with shorter fins 4A6. This configuration provides the advantage that the heat dissipation from the longer heat sink fins 4〇4 is increased without excessively blocking the downward emission of light due to making all of the Korean films long. That is, the shorter Korean film provides a light path opening for the downwardly emitted light so that the lamp can maintain the desired emission pattern' while effectively dissipating heat. It should be understood that there may be many different combinations of the shorter heat-dissipating Korean film and the (four) heat-dissipating Korean film according to the present invention, such that for each long heat-dissipating Korean chip = in two or more short heat-dissipating fins, or for each short The heat dissipating film is in two or more long fins. It should also be understood that in other embodiments, some of the heat sinks may be cooler than others, and other heat sinks may provide a combination of thinner and thicker heat sinks and no == heat sinking scales. In still other embodiments, the dispersion = some heat dissipation ... by different materials having different thermal conductivity properties, the invention is described as having a red LED providing an illumination component instead of a red ribbed m phase η~ (d) Solution, in other embodiments, the color components can be provided in the same manner. Although the invention has been described in detail with reference to the preferred embodiment of the invention, other configurations are possible. Because of the type described above. Shu Yue (4) and materials should not be limited to I54500. Doc • 48- 201142215 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; Figure 2 shows a cross-sectional view of another embodiment of a prior art LED lamp; Figure 3 shows the size of the A19 replacement bulb Figure 4 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 5 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 6 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 7 to Figure 1 are cross-sectional views of different embodiments of a phosphor carrier in accordance with the present invention; Figure 11 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 12 is a view of the lamp shown in Figure 11 Figure 13 is an exploded view of the lamp shown in Figure 11; Figure 14 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 15 is a perspective view of the lamp of Figure 14 with a phosphor carrier; Figure 16 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 17 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 18 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; A cross-sectional view of an embodiment of a lamp according to the invention; Figure 20 is a root Figure 21 is a cross-sectional view of the lamp shown in Figure 20; Figure 22 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figures 23 through 26 are shown in accordance with Different phosphors of the present invention; Figure 27 shows a color target of a lamp in accordance with the present invention; Figures 28 and 29 show the performance characteristics of a lamp in accordance with the present invention; 154500. Doc • 49- 201142215 Figure 30 is a perspective view of one embodiment of a lamp in accordance with the present invention. Figure 31 is an exploded view of the lamp shown in Figure 30. [Main component symbol description] 10 Typical light-emitting diode (LED) package 11 Wire bond 12 LED chip 13 Reflector cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 LED package 22 LED chip 23 Sub-substrate 24 Metal reflection 25A Electrical Trace 25B Electrical Trace 27 Wire Bonding Connector 30 A19 Size Bulb Shell 50 Lamp 52 Heatsink Structure 53 Reflective Layer 54 Optical Cavity 56 Platform 154500. Doc -50· 201142215 58 Light source 60 Heat sink fin 62 Phosphor carrier 64 Carrier layer 66 Phosphor layer 70 First heat flow 72 Second heat flow 74 Third heat flow 76 Dome diffuser 100 Lamp 102 Optical cavity 104 Light source 105 Heat sink structure 106 Platform 108 Phosphor Carrier 110 Forming Diffuser Dome 112 Mounting Mechanism / Threaded Section 120 Lamp 122 Optical Cavity 124 Light Source 125 Heatsink Structure 126 Platform 128 Phosphor Carrier 130 Diffuser Dome 154500. Doc •51 · 201142215 132 Threaded part 154 Phosphor carrier 155 Hemispherical carrier 156 Phosphor layer 157 Three-dimensional phosphor carrier 158 Bullet carrier 159 Phosphor layer 160 Three-dimensional phosphor carrier 161 Sphere shape carrier 162 Phosphor layer 163 Phosphor carrier 164 Sphere shape Carrier 165 Narrow neck portion 166 Phosphor layer 170 Lamp 172 Heat sink structure 174 Optical cavity 176 Light source 178 Diffuser dome 180 Threaded portion 182 Three-dimensional phosphor carrier 190 Lamp 192 LED light source 194 Heat sink 154500. Doc -52- 201142215 196 Dome-shaped phosphor 198 Diffuser 200 Lamp 202 LED wafer 204 Carrier 206 Blue LED 208 Red LED LED 210 Second phosphor 220 Lamp 222 LED wafer 224 Carrier 226 Blue LED 228 Red LED LED 230 Green Phosphor 250 Lamp 252 LED Chip 254 Optical Cavity 256 Blue Illuminated LED 258 Red Illuminated LED 260 Carrier 262 Reflective Layer 264 Reflective Surface 266 Phosphor 300 LED Wafer Array 154500. Doc -53- 201142215 302 Heat sink

304 red LED

306 Blue Illuminated LED 320 Lamp 322 LED Wafer 324 Carrier 330 Second Yellow (or Green) Phosphor 350 Lamp 352 Sub-Substrate or Heat Sink 354 Dome-shaped Phosphor Carrier 356 Dome-shaped diffuser 358 LED wafer 360 Threaded portion 362 Body part 400 lamp 402 heat sink 404 longer fin 406 shorter fin -54- 154500.doc

Claims (1)

201142215 VII. Patent application scope: 1 _ A solid-state lamp, comprising: a first light-emitting diode (LED) emitting light with a first peak; and a second LED emitting with a second respective peak Illuminating; a conversion material separated from the first LED and the second LED, wherein light from the first LED and the second LED passes through the conversion material 'where the conversion material is absorbed from At least some of the light of the second LED and re-emitting light with a third respective peak emission, the lamp emitting a combination of light from the first peak emission, the second peak emission, and the third peak emission . 2. The lamp of claim 1 wherein the light from the second LED passes through the conversion material without substantial absorption. 3) The lamp of claim 1, wherein the light from the first LED light comprises blue light and the second LED light comprises red light. 4. The lamp of claim 1 wherein the conversion material comprises a scale body in a three dimensional shape. 5. The lamp of claim 1, wherein the conversion material comprises a dome above the first lED and the first led. A lamp of claim 1 wherein the conversion material absorbs light from the first Led and re-emits yellow or green light. 7. If the lamp is requested, the lamp emits a combination of red, blue and white or green light. 8. As requested by the lights, the first and the second led include a flat 154500.doc 201142215 face LED array. 9. 10. 11. 12. 13. 14. 15. 16. In the light of claim 1, the lamp emits a combination of white light from the first LED and the second LED and light from the conversion material. A lamp of claim 1, wherein the conversion material emits light at a fourth peak. The lamp emits light having a combination of the peak emissions. A lamp of claim 1 further comprising a diffuser over the conversion material. The lamp of claim 1 wherein the lamp emits light having an emission pattern conforming to the Energy Star standard. For example, the lamp of item 1 is sized to accommodate an A19 size profile. The lamp of claim 1 wherein the conversion material is planar. A solid state lamp comprising: a heat sink; an array of light emitting diodes (LEDs) mounted to the heat sink and providing light having first and second respective peak wavelengths; and a conversion material The conversion material is mounted to the heat sink, over the LEd array, and at the distal end of the LED array, wherein light from the LEDs passes through the conversion material. The conversion material absorbs the first peak wavelength and the second peak wavelength Having a portion of one and retransmitting a respective third peak wavelength, the lamp emits a light comprising a combination of the first peak wavelength, the second peak wavelength, and the third peak wavelength. A solid state lamp comprising: a blue light emitting diode (LED); 154500.doc 201142215 a red light emitting LED; and a phosphor above and above the blue LED and the red LED a blue LED is spaced apart from the red LED, wherein light from the blue LED and the red LED passes through the phosphor, the phosphor absorbs at least some of the blue LED light and re-transmits a different wavelength The light that emits a combination of red, blue, and re-emitted phosphor light. 154500.doc