TW201142198A - LED lamp with active cooling element - Google Patents

Abstract

Solid state lamp or bulb structures are disclosed that can provide an essentially omnidirectional emission pattern from directional emitting light sources, such as forward emitting light sources. The present invention is also directed to lamp structures using active elements to assist in thermal management of the lamp structures and in some embodiments to reduce the convective thermal resistance around certain of the lamp elements to increase the natural heat convection away from the lamp. Some embodiments include integral fans or other active elements such as diaphragm-pump type active cooling elements, that move air over the surfaces of a heat sink, while other embodiments comprise internal fans or other active elements that can draw air internal to the lamp. The movement of the air over these surfaces can agitate otherwise stagnant air to decrease the convective thermal resistance and increasing the ability of the lamp to dissipate heat generated during operation.

Description

201142198 VI. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to solid state lamps and light bulbs, and more particularly to efficient and active elements having a contribution to dissipating heat from the lamps and bulbs during operation. A reliable light-emitting diode (LED) based light. The present application claims the following claims: US Provisional Patent Application No. 61/339, No. 5, filed March 3, 2010, and No. 61/339,515, filed on March 3, 2010. Application No. 61/386,437 of the US Provisional Patent Application No. 61/386,437, filed on September 24, 2010, and US Provisional Application No. 61/424 67〇, January 19, 2010 U.S. Provisional Patent Application No. 61/434,355, January 23, 2011, U.S. Provisional Patent Application No. 61/435,326, and U.S. Provisional Patent Application No. 61/435,759. This application is also a continuation of the application of the following application and claims its rights: U.S. Patent Application No. 12/985,275, filed on Jan. 5, 2011, filed on Jan. U.S. Patent Application Serial No. 12/ 889, 719, filed on Sep. 22, 2010, and U.S. Patent Application Serial No. 12/975,820, filed on December 22, 2010 U.S. Utility Model Application No. 13/022,490, filed on the 7th. [Prior Art] Incandescent lamps or bulbs or filament-based lamps or bulbs are commonly used as light sources for domestic and commercial installations. However, these lamps are extremely inefficient sources of light 'up to 95% of their input energy loss' mainly in the form of heat or infrared energy 154495.doc 201142198. A common alternative to incandescent lamps (so-called compact fluorescent lamps (CFLs)) is more efficient in converting electricity to "the use of toxic materials, which can cause chronic and acute poisoning and can be One solution that leads to environmental pollution 1 to improve the efficiency of lamps or bulbs is to use solid state devices such as light emitting diodes (LEDs) instead of metal filaments to produce light. Light-emitting diodes typically comprise one or more active layers of a semiconductor material sandwiched between layers of opposite doping type. When a bias voltage is applied to the doped layers, the holes and electrons are injected into the active layer, where they recombine to produce light. The light system acts on the active layer and is emitted from each surface of the LED. In order to use LED wafers in circuits or other similar configurations, it is known to encapsulate LED wafers in a package to provide environmental and/or mechanical protection, color selection, light focusing, and the like. The LED package also includes electrical leads, contacts or traces for electrically connecting the LED package to an external circuit. In a typical LED package 10 illustrated in FIG. i, a single-LED wafer 12 is mounted on a reflective cup 13 by means of solder bonding or conductive epoxy... or a plurality of wire bonds 11 connect the ohmic contacts of the LED wafer 12 to Wires 15A and/or 15B may be attached to or integral with the reflective cup 13. The reflector cup can be filled with an encapsulant material 16, which can contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength can be absorbed by the phosphor, which responsively emits light at the second wavelength. The entire assembly is then encapsulated in a clear protective resin 14 which can be molded into a lens shape to collimate light emitted from the LED wafer 12. Although the reflector cup 13 can guide light in the upward direction, when the light is reflected (also 154495.doc 201142198, some of the light may be absorbed by the reflector cup due to the reflectivity of the actual reflector surface being less than 1%). ), optical loss can occur. Alternatively, thermal retention can be a problem with packages such as the package shown in Figure lat, as it may be difficult to extract heat via wires 15A, 15B. The conventional LED package 2 illustrated in Figure 2 may be more suitable for high power operation that produces more heat. The LE_m - or a plurality of coffee wafers 22 are mounted to a carrier (such as a printed circuit board (PCB) carrier, substrate or submount 23). A metal reflector 24 mounted on the submount 23 surrounds the LED wafer 22 and reflects the light emitted by the LED wafer 22 to move the light away from the package. Reflector 24 also provides mechanical protection for LED wafer 22. One or more wire bond connectors 27 are formed between the ohmic contacts on the LED wafer 22 and the electrical traces 25A, 25B on the submount 23. The mounted led wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer while also acting as a lens. The metal reflector 24 is typically attached to the carrier by means of solder or epoxy bonding. The LED wafer can be coated by a conversion material comprising one or more phosphors (such as the LEDs found in the LED package 20 of Figure 2). Wafer), wherein the fills absorb at least some of the LED light. The LED wafer can emit light of a different wavelength such that it emits a combination of light from the LED and the fill. LED wafers can be coated with phosphors in a number of different ways, one suitable method of which is described in U.S. Patent Application Serial No. 1 1/656,759, the entire disclosure of All are entitled "Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method". Alternatively, LEDs can be coated using other methods such as electrophoresis 154495.doc * 6 - 201142198 (EPD), a suitable EpD method described in Tarsa et al. entitled "close Loop Electrophoretic Deposition of Semiconductor Devices" U.S. Patent Application Serial No. 1 1/473,089. Led wafers with conversion materials in the vicinity or as direct coatings have been used in a variety of different packages' but suffer from some limitations of device-based structures. When the light-breaking material is on or near the LED epitaxial layer (and in some cases a conformal coating on the LED), the phosphor can directly withstand the heat generated by the wafer. This heat can increase the temperature of the phosphor material. . Additionally, in such cases, the phosphor can be subjected to incident light from very high concentrations or fluxes of the LED. Since the conversion process is typically not 100 Å/〇 effective, excess heat is generated in the phosphor layer that is proportional to the incident light flux. In a compact light barrier layer close to the LED wafer, this can result in an increase in the substantial temperature in the phosphor layer because of the large amount of heat generated in the small region. This increase in temperature can be exacerbated when the phosphor particles are embedded in a low thermal conductivity material, such as polyfluorene, which does not provide an effective dissipation path for the heat generated within the phosphor particles. Such elevated operating temperatures can cause the phosphor and surrounding materials to degrade over time' and cause a decrease in phosphor conversion efficiency and a shift in color conversion. Lamps that utilize solid state light sources (such as LEDs) in combination with LEDs or conversion materials at the distal end of the LED have also been developed. These configurations are disclosed in Tarsa et al. 53⁄43⁄4 for "High Output Radial Dispersing Lamp Using a

Solid State Light Source, U.S. Patent No. 6,350,041. The lamp described in this patent may comprise a solid state light source that transmits light through a separator to a disperser having a phosphor 154495.doc 201142198 light body. The diffuser allows the light to be dispersed in a desired pattern and/or to change its color by converting the light to at least some different wavelengths via a phosphor or other conversion material. In some embodiments, the separator separates the source from the disperser a sufficient distance such that when the source is carried to the elevated current necessary for internal illumination, the heat from the source will not be transferred to the disperser. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. One potential disadvantage of having a remote phosphor lamp is that it can have undesirable visual or aesthetic characteristics. When the light does not produce light, the light can have a different surface color than the typical white or clear appearance of a standard Edison light bulb. In some examples, the lamp may have a yellow or orange appearance that is primarily produced by a phosphor conversion material. This appearance can be tolerated for many applications where it can cause aesthetic problems with the surrounding building 7C when the light is not illuminated. This can have a negative impact on the overall acceptance of these types of lamps by consumers. Additionally, the distal phosphor configuration can be subject to insufficient thermal heat transfer as compared to a conformal or adjacent phosphor configuration that can be conducted or dissipated through the nearby wafer or substrate surface during the conversion process. The dissipated way without the effective heat dissipation path, the thermally isolated distal phosphor can be subjected to the operating temperature of the rising south, and the elevated operating temperature can be even higher than comparable in some examples t. The temperature in the coated layer. This situation can offset some or all of the benefits achieved by placing the phosphor at the distal end relative to the crystal moon. In other words, the placement of the distal scale relative to the led wafer reduces or eliminates the direct heat generation of the 154495.doc 201142198 phosphor layer due to the heat generated in the LED wafer during operation, but the resulting phosphor temperature is reduced. The small amount may be partially or fully attributed to the heat generated in the phosphor layer itself during the light conversion process and the lack of a suitable thermal path to dissipate the heat generated thereby. Another problem affecting the implementation and acceptance of lamps utilizing solid state light sources is related to the nature of the light emitted by the source itself. In order to manufacture an effective lamp or bulb based on an LED source (and associated conversion layer), it is often desirable to place the LED wafer or package in a coplanar configuration. This facilitates manufacturing and can reduce manufacturing costs by allowing the use of conventional production equipment and processes. However, coplanar configurations of LED chips typically produce a forward light intensity profile (e.g., a Lambertian profile). Such beam profiles are generally undesirable in applications where solid state lights or light bulbs are intended to replace conventional lamps, such as conventional incandescent bulbs, which have a more omnidirectional beam pattern. While it is possible to mount an LED light source or package in a three-dimensional configuration, it is often difficult and expensive to manufacture such configurations. As mentioned, lamps with LED wafers (with conversion materials in the vicinity or as direct coatings and remote conversion materials) can be subjected to increased temperatures (especially under high current operation, these LED wafers can also generate heat). And can suffer from the harmful effects of heat accumulation. The lamp can contain heat sinks to extract heat away from the LED slabs and/or conversion materials, but even these lamps may suffer from insufficient heat dissipation. Compared to fluorescent lighting, good thermal dissipation and fully controlled LED wafer junction temperatures present unique challenges for solid-state lighting solutions. Current lamp technology uses almost pure natural convection to dissipate heat from the lamp. The following situation: Convection heat to ambient air dissipates ambient air as the maximum heat dissipation bottle head of the lighting fixture system. This situation is especially true for smaller lighting fixtures with a limited form factor, 154495.doc 201142198 in smaller lighting In appliances, the size of the fins is limited, such as in the case of A-smoke replacements. High convection thermal resistance is at least partially weakly natural to the opposite 'in a weak natural pair The medium heat is only carried away by the buoyancy flow of the ambient air. The buoyancy flow is usually very slow, especially for small-sized objects. [Invention] The present invention provides a solid-state lamp and a bulb which can significantly reduce the convective thermal resistance. Operating without significantly increasing the size of the lamp or bulb or its power consumption. Different embodiments may be configured to enhance convective heat transfer around such elements by including active elements that disturb or agitate the air surrounding the elements of the lamp. A lamp in accordance with the present invention can have many different components including, but not limited to, different combinations and configurations of one source, one or more wavelength converting materials, separately positioned relative to the source, or positioned distally A region or layer, and a separate diffusion layer. An embodiment of the solid state light source according to the present invention includes a light emitting diode (LED) and a heat sink, wherein the LED is in thermal contact with the heat sink. An integrated diaphragm or membrane pump cooling element configured to reduce convective thermal resistance of at least some of the light source elements. A solid state light lamp according to the present invention The embodiment includes a plurality of LEDs and a heat sink. The heat sink is disposed relative to the LEDs such that the LEDs are in thermal contact with the heat sink. A diaphragm or film pump cooling element is included, the diaphragm or film pump cooling element Inside the lamp and configured to allow air to flow across the surface of the lamp to reduce convective thermal resistance at the surfaces. An embodiment of a diaphragm-type active cooling element in accordance with the present invention includes an outer casing having an outer casing opening. A diaphragm or film is disposed on the opening 154495.doc •10-201142198 and is capable of vibrating. Also includes a passage hole to allow air to flow through the outer casing in a preferred direction in response to vibration of the film. The present invention will be apparent from the following detailed description and the accompanying drawings. Solid state light or bulb structure. In some embodiments, a lamp in accordance with the present invention can provide a substantially omnidirectional emission pattern from a solid state light source while still having features that allow the lamps and their light sources to operate at a reasonable temperature. Some of the lamps may have light sources comprising directional emission sources, such as 'forward emitting sources, wherein the lamps include features to disperse the directional source into a more uniform emission suitable for the lamp. In order to allow operation at acceptable temperatures, the lamp structures may include active components to facilitate thermal management of the lamp structures and to reduce convective thermal resistance around certain components of the lamp components. Reducing the thermal resistance increases the natural heat convection away from the lamp. Some embodiments include an L E D based lamp or an L E D based A bulb replacement that includes a heat sink for drawing heat away from the LED wafer or conversion material. Some embodiments may include a heat sink with a Korean chip, but it should be understood that different embodiments may have a heat sink that does not have a sheet. It should also be understood that other lamps may not have a heat sink' wherein the active thermal management component allows operation at a reasonable temperature without the aid of a heat sink. For example, an active component (such as a fan or membrane-type active cooling component) can be within the housing, and the active component can direct ambient air 154495.doc 201142198 airflow through the access hole in and/or within the peripheral And / or channels and / or valves. It should also be understood that the heat sink may be included in various locations within the lamp, such as wholly or partially within the lamp housing, in the optical cavity or in the threaded portion. The active elements can be configured to move or agitate the air inside or outside the lamp element to help reduce thermal resistance. It should be further understood that portions of the lamp, such as the outer casing, the threaded portion, and portions of the optical cavity, may comprise plastic or insulating materials, wherein the active components may be assisted with or without the aid of a thermally conductive material such as a heat sink. The heat dissipation of the components. In the case of some embodiments with heat sinks, when the test is performed as a bare heat sink, the convective heat resistance can be measured to be greater than 8 < t / w, and # heat sink integrated in 3 lights or bulbs 'this measurement The value can be increased to greater than 1 (rc/w. This relatively high convective thermal resistance can be generated by weak natural convection, which is carried away by buoyancy flow of ambient air. The buoyancy flow of air is usually extremely slow ( Especially for smaller geometries like typical lamps or bulbs. The thermal resistance of the strip-to-machine can be much greater than the conduction resistance of the LED junction to the heat sink, and thus can be the most significant bottleneck in the thermal path of the system.彳匕3 A mechanism for reducing the convective thermal resistance and reducing the bottleneck, such as a mechanism for moving or urging air around the lamp element. In the embodiment, the "body fan element" may be included in the lamp or the bulb. Air agitation or forced convection is provided above the component. Other machines can be used = mobile air_including, but not limited to, vibrating membranes or jet-inducing elements on top of the other embodiments, these 11 pieces can be used to move Other cooling material above the light or Materials to reduce thermal resistance. I54495.doc 12 201142198 Even a relatively small amount of air blowing over a portion of a lamp or bulb can significantly reduce system convection thermal resistance, which can result in a lower junction temperature of the LED and The lower junction temperature of the phosphor material results in better illumination efficiency and better reliability of the system. A better thermal system can also allow LEDs to be driven at higher currents, thereby reducing the cost of LED per light output. Pure natural convection in air typically provides a convective heat transfer coefficient of about 5 W/m2_K, but forced convection can increase the coefficient by one or even two orders of magnitude. Fans and other active cooling elements used in lamps according to the present invention Should have a long service life 'should consume the least amount of power' and should be as quiet as possible. In addition, these fans can be provided as part of the modular design of the lamp, that is, the right fan or drive electronics in the lamp Other components occur before P can easily remove and replace the fan or drive electronics. Fans and other active cooling components can be provided as a lamp material in many different locations. Providing a flow of gas across different portions of the lamp. In some embodiments, the active cooling elements can be configured to provide air around the fins agitating the heat sink. The fins have fins implemented with the lamps In an example, air from the active cooling elements can be configured to impart stagnant air that can accumulate between the fins or break their stagnant state. This situation factor can be particularly important in embodiments, in such embodiments There is a small space between the adjacent pins. The implementation of the main components but the components can provide more cooling fins for the village (there are advantages between the adjacent fins. 翊J54495.doc -13- 201142198 ... on-chip beta or lamp / Inside the package. In these embodiments, an air passage is provided which allows air to enter the lamp and also allows the flow of gas from the bulb to pass out of the bulb. These fan configurations provide an air stream that is passed from outside the bulb to the bulb and then re-emitted. This can cause air to flow through the bulb' to agitate the air therein and thereby reduce the heat above the components of the lamp. In the second embodiment, air can flow through the LEDs inside the bulb, thereby reducing the thermal resistance above the LED. This also allows the LED to operate at lower temperatures. In various embodiments having fins, air may also flow through the fins when they are not taken into the bulb and/or out of the bulb. The air stream can also pass through other components, such as drive electronics. Fans and other active cooling elements can be included in many different lamps, but are particularly well suited for solid state illuminators having a remote conversion material (or phosphor) and a distal diffusing element or diffuser. In some embodiments, the diffuser not only serves to shield the phosphor from view by the lamp user, but also disperses or redistributes light from the source of the remote phosphor and/or lamp into the desired emission pattern. In some of these embodiments, the diffuser dome can be configured to disperse the forward emission pattern into a more omnidirectional pattern that can be used in general lighting applications. The diffuser can be used in embodiments having a one-dimensional and three-dimensional shape of a distal conversion material such as a 'ball or dome shape. This combination of features provides the ability to transform the incoming light from the LED source into a beam profile comparable to a standard incandescent bulb. In some of these lamp embodiments, an air inlet and outlet may be provided to allow air to flow into and out of the diffuser and/or the distal scale. The active element can be provided with an improved thermal configuration to move or impart air within the volume by positioning relative to the interior of the diffuser and/or scale body 154495.doc 201142198. One or more outlets may be spaced from the inlets to allow an air path to exit the diffuser and/or the volume of material to be converted. In various embodiments, the inlet and outlet may be configured such that the air path passes through different lamp elements, such as LEDs, driver circuitry, before exiting the outlet. In a lamp with a dome of the expansion dome and a dome of the conversion material, the air path 1 can pass through the diffuser dome and the dome of the conversion material before passing to the exterior. In other embodiments, the air path may pass over the driver circuit and the heat sink before entering the volume between the diffuser and the dome of the conversion material, and the money air path is passed to the exterior via the outlet. In some lamps, there may be different inlet outlets for each dome. The outlets can be positioned relative to the heat sink, or the heat sink can be in any portion of the airway that is in and out of the air. The invention is described herein with reference to conversion materials, wavelength converting materials, remote phosphors, spheroids, light layers, and related terms. The use of such terms should not be construed as limiting. It should be understood that the use of the term distal phosphor, scale or phosphor layer is meant to encompass all wavelength converting materials and equally applicable to all wavelength converting materials. A lamp-perimeter embodiment may have a dome-shaped U-segment spherical shape that is spaced above the light source and spaced apart from the light source, and a dome-shaped diffuser spaced apart from the conversion material and over the conversion material So that the lamp shows a double dome: structure. The space between the various structures can include a light mixing chamber that can only promote dispersion of lamp emission and also promote color uniformity. The space between the light source and the conversion material and the space between the conversion materials are chargeable, and the chamber is first mixed. Other embodiments may include an amount of additional mixing chamber 154495.doc • 15- 201142198 External conversion material or diffuser. The order of the dome conversion material and the dome shaped diffuser can be varied such that some embodiments can have a diffuser inside the conversion material while the space therebetween forms a light mixing chamber. These configurations are only a few of the many different conversion materials and diffuser configurations in accordance with the present invention. Some lamp embodiments in accordance with the present invention may comprise a light source having a coplanar configuration of one or more lED wafers or packages, wherein the illuminators are mounted on a flat or planar surface. In other embodiments, the LED wafers may not be coplanar, such as attached to a pedestal or other three dimensional structure. Coplanar light sources reduce the complexity of the illuminator configuration, making it easier and less expensive to manufacture. However, coplanar light sources tend to illuminate primarily in the forward direction, such as in a Lambertian emission pattern. In various embodiments, it may be desirable to emit a light pattern that mimics the light pattern of a conventional incandescent light bulb, which is known to provide nearly uniform emission intensity and color uniformity at different emission angles. Different embodiments of the present invention can include features that can transform the emission pattern from a non-uniform sentence to be substantially uniform over a range of viewing angles. In some embodiments the '-conversion layer or region may comprise a wall carrier, the phosphor (4) may comprise a thermally conductive material that is at least partially transparent to light from the source and each that absorbs light from the S source and emits light of a different wavelength To the can light body material. The diffuser can include a diffusing film/particle and associated carrier (such as a glass envelope) and can be used to scatter or redirect at least some of the light source and/or the phosphor carrier, to provide a desired beam profile. . In a practical example, a lamp according to the present invention can emit a beam profile that is compatible with a standard white woven bulb. The nature of the diffuser (for example, geometry, scattering of the scattering layer 154495.doc -16 - 201142198 quality, surface roughness or smoothness, and the spatial distribution of the properties of the scattering layers) can be used to control various lamps Properties, such as color uniformity and light intensity distribution, depending on the viewing angle. By shielding the phosphor carrier and other internal light features, the diffuser provides a desired overall lamp appearance when the lamp or bulb is not illuminated. As mentioned, a heat sink or fin structure can be included that can be in thermal contact with the source and in thermal contact with the phosphor carrier to dissipate heat generated within the source and phosphor layer into the environment. Electronic circuitry may also be included to provide power to the light source and to provide other capabilities (such as dimming, etc.), and such circuitry may include components (such as a screw mount, etc.) for applying electrical power to the light. Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that can be mounted into a standard size bulb housing such as the A19 size bulb housing 30 as shown in FIG. This makes the lamp particularly useful as an alternative to conventional incandescent lamps or bulbs and fluorescent lamps or bulbs, wherein the lamp according to the present invention enjoys reduced energy consumption and long service life provided by its solid state light source. Lamps in accordance with the present invention may also accommodate other types of standard size profiles including, but not limited to, A21 and A23. In some embodiments the light source can comprise a solid state light source, such as a different type of LED, LED wafer or LED package. Single-LED wafers or packages can be used in some embodiments, while in other embodiments, multiple LED wafers or packages configured in different types of arrays can be used. By (4) photorefractive (4) thermal isolation of the wafer and good heat dissipation, the LED wafer can be driven by a higher current level without detrimental effects on the conversion efficiency of the scale and its long-term reliability. This may allow over-excitation of the coffee wafer to reduce the flexibility of the number of LEDs required to produce the desired luminous flux of 154495.doc 17 201142198. This in turn reduces the cost of the complexity of the lamp. Such LED packages may comprise LEDs encapsulated by a material that can withstand elevated luminous flux or may include unencapsulated LEDs. In some embodiments, the light source can include one or more blue light-emitting LEDs, and the phosphor layer in the light-breaking body carrier can comprise one or more materials that absorb one portion of the blue light and emit one or more different The light of the wavelength is such that the lamp emits a combination of white light from the blue LED and the conversion material. The conversion material absorbs blue LED light and emits different colors of light, including (but not limited to) yellow and green. The light source can also include different LEDs and conversion materials that emit light of different colors to cause the lamp to emit light having desired characteristics such as color temperature and color rendering. Conventional lamps with red and blue LED chips can withstand color instability at different operating temperatures and dimming. This can be attributed to the different behavior of red and blue LEDs at different temperatures and operating powers (current/voltage) and different operating characteristics over time. This effect can be slightly mitigated by implementing an active control system that increases the cost and complexity of the entire lamp. This problem can be solved by combining a light source having the same type of illuminator with a remote phosphor carrier, which can comprise a plurality of phosphors via a different embodiment of the invention, via the multilayer phosphor The heat dissipation configuration disclosed herein remains relatively cold. In some embodiments, the distal phosphor carrier can absorb light from the illuminator and can re-emit light of different colors while still experiencing efficiency and reliability in reducing the operating temperature of the phosphor. Separation of the phosphor element from the LED provides an added advantage: easier and more consistent color sorting by 154495.doc -18· 201142198. This can be done in a number of ways. LEDs from various sorting levels (e.g., blue LEDs from various sorting levels) can be assembled together to achieve a substantially uniform wavelength source of excitation that can be used in different lamps. These excitation sources can then be combined with a phosphor carrier having substantially the same conversion characteristics to provide a lamp that emits light within the desired sorting level. In addition, a large number of phosphor carriers can be fabricated and pre-sorted according to their different conversion characteristics. Different phosphor carriers can be combined with light sources that emit different characteristics to provide a light that emits light within a target color sorting level. Some of the lamps in accordance with the present invention can also provide improved emission efficiency by surrounding the light source with a reflective surface. This results in enhanced photon recycling by reflecting most of the light re-emitted from the conversion material back toward the source. To further enhance efficiency and provide a desired emission profile, the surface of the carbon layer, carrier layer or diffuser can be smooth or scattered. In some embodiments, the inner surface of the carrier layer and the diffuser can be optically smoothed to promote total internal reflection behavior that reduces the amount of light (downconverted or scattered light) that is directed back from the phosphor layer. . This reduces the amount of light that can be absorbed by the LED chip of the lamp, the associated substrate, or other non-ideal reflective surfaces inside the lamp. The invention is described herein with reference to certain embodiments, but it should be understood that the invention can be The various forms are embodied and should not be construed as being limited to the embodiments set forth herein. In particular, the invention is described below with respect to certain lamps having one or more LED or LED wafers or LED packages in different configurations, but it should be understood that the invention is applicable to many other lamps having many different configurations. . An example of a different lamp that is configured in a different manner in accordance with the present invention is described below and described in U.S. Provisional Patent Application Serial No. 154,495, filed on Jan. S〇lid is filed on Jan. 24, 2011, and is incorporated herein by reference. Embodiments are described below with reference to one or more LEDs, but it should be understood that this is intended to encompass LED wafers and LED packages. The components can have different shapes and sizes than the shapes and sizes shown, and can include a different number of LEDs. It should also be understood that the embodiments described below utilize a coplanar light source 'but it should be understood that a non-coplanar light source can also be used. It should also be understood that the LED light source of the lamp may comprise one or more LEDs' and in embodiments having more than one LED, the LEDs may have different emission wavelengths. Similarly, some LEDs may have phosphor layers or regions that are adjacent or in contact, while other lEDs may have adjacent phosphor layers of different compositions or no phosphor layers at all. The invention is described herein with reference to a conversion material in which the phosphor layer and the phosphor carrier and diffuser are distal to each other. In this context, the distal ends are spaced apart from each other and/or are not in direct thermal contact. It should also be understood that when an element such as a layer, region or substrate is referred to as being "on" another 70 "on", It may be directly on another component or an intervening component may also be present. In addition, terms such as "inside", "outside", "upper", "upper", "lower", "lower" and "lower" are used herein to describe the relationship of one layer or another. It will be understood that these terms are intended to encompass the orientations depicted in the drawings and the various aspects of the embodiments. Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections are not to be limit. These terms are only used to distinguish one element, component, region, layer or segment from another region, layer or segment. The first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention. Embodiments of the invention are described herein with reference to the cross- Thus, the actual thickness of the layers can be different' and it is contemplated that there may be differences in shape relative to the description due to, for example, manufacturing techniques and/or tolerances. The embodiments of the invention should not be construed as limited to the particular shapes of the regions described herein, but rather to include variations in the shape resulting from, for example, manufacture. Regions illustrated or described as square or rectangular will generally have rounded or curved features due to normal manufacturing tolerances. Thus, the regions illustrated in the figures are schematic in nature and are not intended to illustrate the region of the device. The precise shape is not intended to limit the scope of the invention. 4 shows an embodiment of a lamp 5A according to the present invention comprising a heat sink structure 52 having an optical cavity 54 having a platform 56 for holding a light source 58. While this and some embodiments have been described below with reference to optical cavities, it should be understood that many other embodiments without optical cavities may be provided. Such embodiments may include, but are not limited to, a light source on a planar surface of the lamp structure or on a pedestal. Light source 58 can include a number of different illuminators, with the embodiment shown including an LED. Many different commercially available lED wafers or LED packages can be used including, but not limited to, commercially available from N〇nh Car〇lina.

Durham's Cree, Inc. LED chip or led package. It will be appreciated that a lamp embodiment without an optical cavity can be provided in which the LEDs are mounted in different ways in these other embodiments. By way of example, the light source can be mounted to the flat surface of the lamp 154495.doc 21 201142198, or a pedestal for holding the led can be provided. Light source 58 can be mounted to platform 56' using a number of different known mounting methods and materials in which light from source 58 is emitted from the top opening of cavity 54. In some embodiments 'light source 58 can be mounted directly to platform 56, while in other embodiments' the light source can be included on a sub-substrate or printed circuit board (PCB), which is then the sub-substrate or printed circuit board (pCB) Installed to platform 56. Platform 56 and heat sink structure 52 can include conductive paths for applying electrical signals to light source 58, wherein some of the conductive paths are conductive traces or wires. Portions of the platform 56 may also be made of a thermally conductive material, and in some embodiments, heat generated during operation may be spread to the platform and then spread to the fin structure. The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials can be used, including different metals (such as steel or inscriptions) or metal alarms. Copper can have a thermal conductivity of up to 400 W/m_k or more. In some embodiments, the heat sink may comprise high purity aluminum, and the high purity aluminum may have a thermal conductivity of 210 W/m-k at room temperature. In other embodiments, the fin structure may comprise a die cast having a thermal conductivity of about 200 W/m_k. The heat sink structure 52 may also include other heat dissipation features such as heat sink fins 6 (the other surface area of the heat sinks to promote more efficient dissipation into the environment. In some embodiments, the heat sink 60 It can be made of a material with a thermal conductivity higher than that of the remaining heat sink. In the illustrated embodiment, the Korean piece 60' is shown in a generally horizontal orientation. It should be understood, in other embodiments, the L piece is oriented straight or angled. In still other embodiments, a 冷3 active cooling element (such as a fan) is used to reduce convection within the lamp 154495.doc -22· 201142198 thermal resistance. In some embodiments, the heat dissipation from the phosphor carrier is achieved via a combination of convective heat dissipation and conduction through the fin structure 52. The different heat dissipation configurations and structures are described in U.S. Provisional Patent Application Serial No. 61/339,516, the entire disclosure of which is incorporated herein by reference in its entirety in Phosphor with Heat Dissipation Features, also given to Cree, Inc. This application is incorporated herein by reference. Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of optical cavity 54. In embodiments that do not have an optical cavity, a reflective layer around the source can be included. In some embodiments, the surface may be coated with a material having a reflectance of about 75% or more of the visible wavelength of the light emitted by the source 58 and/or the wavelength converting material, while in other implementations In one example, the material can have a reflectivity of about 85% or more for the light. In still other embodiments, the material can have a reflectivity of about 95% or more for the light. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type for mounting in conventional electrical sockets. For example, the heat sink structure can include features for mounting to a standard threaded seat that can include a threaded portion that can be screwed into the threaded seat. In other embodiments, the 'heat sink structure may include a standard plug and the electrical socket may be a standard socket, or the heat sink structure may include a GU24❹ unit, or the heat sink structure may be a clip and the electrical socket may be a JU holding clip. Socket (for example, used in fluorescent lights). These are only a few of the options for the heat sink structure and sockets 154495.doc -23· 201142198, and other configurations that safely deliver electricity from the outlet to the lamp 5〇 can also be used. A lamp in accordance with the present invention may include a power supply or power conversion unit that may include a driver to allow the lamp to be powered by the AC line voltage/current and to provide source dimming capability. In some embodiments, the power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp, and in some embodiments, the LED driver can comprise less than 25 cubic centimeters of volume, while in other embodiments, the LED driver can comprise a volume of about 2 cubic centimeters. In some embodiments, the power supply can be non-dimmable, but at a lower cost. It should be understood that the power supplies used may have different topologies or geometries' and may also be dimmable. A phosphor carrier 62 is included over the top opening of the cavity 54 and includes a dome shaped diffuser 76 over the fill carrier 62. In the illustrated embodiment, the phosphor carrier covers the entire opening, and the cavity opening is shown as being circular and the phosphor carrier 62 is a disk. It should be understood that the cavity opening and phosphor carrier can be of many different shapes and sizes. It should also be understood that the phosphor carrier 62 may not cover all of the cavity openings. As described further below, the diffuser 76 is configured to disperse light from the phosphor carrier and/or LED into a desired lamp emission pattern, and can include many different shapes and sizes, depending on the light it receives and the desired lamp. Depending on the launch pattern. Embodiments of the phosphor support according to the present invention may be characterized as comprising a conversion material and a thermally conductive light transmissive material, although it will be understood that a non-thermally conductive phosphor support may also be provided. The light transmissive material may be transparent to light emitted from source 54 and the conversion material shall be of the type that absorbs light from the wavelength of the source and re-emits light of the same wavelength. In the illustrated embodiment, the thermally conductive light transmissive material comprises a carrier layer 64' and the conversion material comprises a phosphor layer 66 on the phosphor carrier. As further described below, various embodiments may comprise a plurality of thermally conductive light transmissive materials and conversion materials. Different configurations. When light from source 58 is absorbed by the phosphor in phosphor layer 66, the light is re-emitted in an isotropic direction, with about 50% of the light being emitted forward and 50% being emitted back to cavity 54. in. In a leading LED with a conformal phosphor layer, a significant portion of the back-emitting light can be directed back into the led and the likelihood of light escaping is limited by the extraction efficiency of the LED structure. The extraction efficiency for some LEDs can be about 7〇%, so a certain percentage of the light that is redirected back into the LED from the conversion material can be lost. In a lamp having a remote can light configuration in accordance with the present invention, the LED is located on the platform 56 at the bottom of the cavity 54. A higher percentage of the rearward phosphor light strikes the surface of the cavity rather than the LED. . Coating the service with the reflective layer 53 increases the percentage of light that is reflected back to the phosphor layer 66 (at the phosphor layer 66, the light can be emitted from the lamp). These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. In embodiments that do not have an optical cavity, a reflective layer around the LED can also be included. Carrier layer 64 may be made of many different materials having a thermal conductivity of 0.5 W/mk or more, such as quartz, tantalum carbide (Sic) (thermal conductivity 〜120 W/mk), glass (thermal conductivity) The rate is m 4 w/m_k) or sapphire (thermal conductivity is ~40 W/mk). In other embodiments, the carrier layer can have a thermal conductivity of greater than 154495.doc • 25 to 201142198 at 1.0 W/m-k and in other embodiments it can have a thermal conductivity greater than 5.0 W/m-k. In still other embodiments, the carrier layer 64 can have a thermal conductivity greater than 10 W/m-k. In some embodiments, the carrier layer can have a thermal conductivity in the range of 1.4 W/m-k to 10 W/m-k. The disc carrier may also have different thicknesses depending on the material used, with a suitable thickness ranging from 0.1 mm to 10 mm or more. It should be understood that other thicknesses may be used depending on the characteristics of the material used for the carrier layer. The material should be thick enough to provide adequate lateral heat dissipation for specific operating conditions. In general, the higher the thermal conductivity of the material, the thinner the material may be, while still providing the necessary heat dissipation. Different factors can influence which carrier layer material is used, and different factors include, but are not limited to, cost and transparency to the source light. Some materials may also be more suitable for larger diameters such as glass or quartz. Such materials can provide reduced manufacturing costs by forming a carbon layer on a larger diameter carrier layer and the carrier layer is singulated into smaller carrier layers. A number of different phosphors can be used in the phosphor layer 66, with the invention being particularly suitable for emitting white light lamps. As described above, in some embodiments, light source 58 can be an LED based light source and can emit light of a blue wavelength spectrum. The phosphor layer absorbs some blue light and re-emits yellow light. This situation allows the lamp to emit a combination of blue and yellow light. In some embodiments, the blue LED light can be converted by a yellow conversion material using a commercially available YAG:Cei||light body, but using a (Gd,Y)3 based (Al,Ga) 5012:Ce system (eg, Y3Al5〇12:Ce (YAG) phosphor converted particles, it is possible to obtain a wide range of broad yellow spectral emission. Other yellow phosphors that can be used to produce white light when used with blue-emitting LED-based illuminators include, but are not limited to: 154495.doc •26· 201142198

Tb3-xREx012: Ce(TAG); RE=Y, Gd, La, LU; or

The Sr2-x-yBaxCaySi〇4:Euo phosphor layer may also be provided with more than one phosphor, the one or more phosphors being mixed in the phosphor layer 66 or as the second layer of the carrier layer 64. In some embodiments, each of the two phosphors can absorb LED light and can re-emit light of different colors. In such embodiments, the colors from the two layers of light can be combined for achieving a higher CRI white (warm white) with a different white hue. This situation may include light from the yellow phosphor above that may be combined with light from a red carbon body. Different red phosphors can be used, including:

SrxCai-xSiEu ‘ Y ; Y=halide;

CaSiAlN3:Eu; or Sr2-yCaySi〇4:Eu 〇 Other phosphors can be used to produce colored luminescence by converting substantially all of the light into a particular color. For example, the following scales can be used to produce green light:

SrGa2S4: Eu;

Sr2_yBaySi〇4:Eu; or SrSi2〇2N2:Eu. Some additional phosphors suitable for use as the conversion particles of the phosphor layer 66 are listed below, but other phosphors may be used. Each phosphor exhibits excitation in the blue and/or UV luminescence spectrum, providing a desired peak luminescence with efficient light conversion and an acceptable Stokes shift: 154495.doc -27 - 201142198 Yellow/Green (Sr, Ca, Ba) (Al, Ga) 2S4: Eu2+

Ba2(Mg,Zn)Si2〇7:Eu2+

Gd〇.46Sr〇.3 1 A1i.23〇xF 1.3 8:Eu2 + 〇 〇6 (Bai.x.ySrxCay)Si04:Eu

Ba2Si04: Eu2+ red

Lu203: Eu3 + (Sr2.xLax) (Cei.xEux) 〇 4

Sr2Cei.xEux04 Sr2.xEuxCe〇4 SrTi03:Pr3 + ,Ga3+

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ may use squama particles of different sizes including, but not limited to, particles in the range of from nanometers (nm) to 30 micrometers (μιη) or more than 30 micrometers (μιη). In terms of scattering and mixing colors, smaller particles are usually better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer 66 in a binder, and the phosphor may also have a different concentration or loading of phosphor material in the binder. Typical concentrations range from 30% to 70% by weight. In one embodiment, the phosphor concentration is about 65% by weight and is preferably evenly dispersed throughout the distal scale. Phosphor layer 66 may also have different regions with different conversion materials and conversion materials of the same concentration. Different materials can be used for the adhesive, wherein the material is preferably strong after curing and substantially transparent within visible wavelengths. Suitable materials include polyoxo, epoxy, glass, inorganic glass, dielectric, BCB, polyamine, polymers and mixtures thereof, of which the preferred material is poly-crushed oxygen (this is due to the high concentration of polyoxyl High transparency and reliability in power LEDs. Suitable phenyl and sulfhydryl-based polyfluorenes are available from Dow® Chemical. Many different curing methods can be used to cure the adhesive, depending on the bonding used. Different curing methods depending on the type of agent include, but are not limited to, thermal curing, ultraviolet (UV) curing, infrared (IR) curing, or air curing. Phosphor layer 66 can be applied using different processes, including different processes. (but not limited to) spin coating, sputtering, printing, powder coating, electrophoretic deposition (Epd), electrostatic deposition, and others. As mentioned above, the phosphor layer 66 can be coated with the binder material, but it should be understood that No adhesive is required. In still other embodiments, the phosphor layer 66 can be separately fabricated and then the phosphor layer 66 can be mounted to the carrier layer 64. In one embodiment, the phosphor_binder mixture can be sprayed or Scattered over the carrier layer 64 'and then the binder is cured to form the phosphor layer 66. In some of these embodiments, the phosphor-binder mixture can be sprayed, poured or dispersed onto the heated carrier. On or above layer 64, such that when the phosphor binder mixture contacts carrier layer 64, heat from carrier layer 64 is dispersed into the binder and the binder is cured. These processes may also include a filler-adhesive. a solvent in the mixture which liquefies the mixture 154495.doc -29- 201142198 and reduces the viscosity of the mixture, making the mixture more suitable for spraying. Many different solvents can be used including, but not limited to, toluene, benzene, Zylene or OS-20 available from Dow Corning®, and different concentrations of solvent can be used. When the solvent-disc-binder mixture is sprayed or dispersed on the heated carrier layer 64 'The heat from the carrier layer 64 evaporates the solvent' wherein the temperature of the carrier layer affects the extent to which the solvent evaporates. The heat from the carrier layer 64 also cures the binder in the mixture to the carrier layer. Leaving a solid disc layer. The carrier layer 64 can be heated to a number of different temperatures, depending on the materials used and the desired solvent evaporation and adhesive cure rate. Suitable temperature ranges from 90 ° C to 150 ° C, but it should be understood that other temperatures may also be used. Various deposition methods and systems are described in U.S. Patent Application Serial No. entitled "Systems and Methods for Application 〇f 〇ptical Materials to Optical Elements" by D〇n〇fri〇 et al. The present application is hereby incorporated by reference in its entirety in its entirety in its entirety in the entire disclosure of the entire disclosure of the disclosure of the disclosure of the disclosure of The light-breaking layer 66 can have a number of different thicknesses depending, at least in part, on the concentration of the optical material and the desired amount of light to be converted by the phosphor layer 66. The phosphor layer according to the present invention can be coated at a concentration level higher than 30% (phosphor load). Other embodiments may have a concentration level above 50%, while in other embodiments, the concentration level may be above 6〇%. In some embodiments, the phosphor layer can have a thickness in the range of 10 microns to 1 micron, while in other embodiments, the phosphor layer can have a thickness in the range of 4 to 5 microns. The methods described above can be used to coat multiple layers of the same or different phosphor materials 154495.doc • 30· 201142198 and different phosphor materials can be applied in different regions of the carrier layer using known masking processes. The method described above provides some thickness control for the scale layer 66' but for even greater thickness control, known methods can be used to grind the light-weighting layer to reduce the thickness of the scale layer 66 or level the entire layer The thickness above. This abrasive feature provides the added advantage of being able to produce a lamp that emits within a single sorting level on the CIE chromaticity diagram. Sorting is generally known in the art and is intended to ensure that the LEd or lamp provided to the end customer emits light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels by color or brightness (generally referred to in the art as sorting, each sorting level typically contains one color and brightness group) Group of LEDs or lights, and usually identified by a sorting level code. White light-emitting LEDs or lights can be classified by chromaticity (color) and luminous flux (brightness). Control of the thickness of the phosphor layer is controlled by The amount of source light converted by the phosphor layer provides greater control in producing a lamp that emits light within the target sorting level. A plurality of phosphor carriers 62 having phosphor layers 66 of the same thickness can be provided. Light sources 58' having substantially the same illumination characteristics can produce lamps having nearly identical emission characteristics, which in some examples can fall within a single sorting level. In some embodiments, the illumination of the lamps belongs to the self-CIE diagram. Within the standard deviation of the point, and in some embodiments, the standard deviation comprises less than 1 〇 step (1〇_step) McAdams ellipse. In some embodiments, the illumination of the lamp In a 4_step MacAdam ellipse centered on CIExy (0.313, 0.323). Phosphorescent carriers can be used using different known methods or materials (such as thermally conductive bonding materials or 154495.doc -31 - 201142198 thermal grease) 62 is mounted and bonded over the opening in cavity 54. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride or metal particles such as colloidal silver. In other embodiments, thermal conductivity may be used. A device such as a 'sweet mechanism, screw or thermal adhesive mounts the filler carrier over the opening to hold the phosphor carrier 62 tightly to the heat sink structure' to maximize thermal conductivity. In an embodiment, a thermal grease layer having a thickness of about 100 μm and a thermal conductivity of k = 0.2 W/mk is used. This configuration provides an effective heat transfer path for dissipating heat from the disc 66. As mentioned above Also, different lamp embodiments without cavities can be provided, and in addition to being above the opening of the cavity, the scale carrier can be mounted in a number of different ways. During operation of the lamp 50, phosphor conversion heating is concentrated on phosphorescence. Layer support For example, concentrated in the center of the phosphor layer 66, most of the LED light strikes the phosphor carrier 62 at the center of the phosphor layer 66 and passes through the phosphor carrier 62. The thermal conductivity of the carrier layer 64 causes the heat to face the dish in the lateral direction. The edge of the carrier Q is dispersed as shown by the first heat flow 7G. Heat is passed through the thermal grease layer at the edges and into the heat sink structure 52 as shown by the heat flow 72, in the heat sink structure 52, heat It can be efficiently dissipated into the environment. As discussed above, in the lamp 5G, the platform 56 is rail-connected or face-to-face with the fin structure. This lightweight configuration results in the phosphor carrier 62 and the light source 58 to ^, Part of the heat-conducting path for heat dissipation is shared. The heat from the light source 58 passing through the platform 56 (e.g., by the first: rail, the ancient 7j-", ... the claw 74 can also be spread to the heat sink structure 52. From the phosphor carrier 62, it flows into 瑕*,,,,,,,,. The heat in the structure 52 may also flow further into the following. In other embodiments, the fill and light source 54 may have a separate thermally conductive path for dissipating heat, 154495.doc -32- 201142198 wherein the individual paths are Called "decoupling." It should be understood that in addition to the embodiment shown in Figure 4, the light body carrier can be configured in many different ways. The bowl of light may be on either surface of the carrier layer or may be mixed in the carrier layer. The phosphor support may also comprise a scattering layer which may be included on the phosphor layer or carrier layer or mixed in the phosphor layer or carrier layer. It should also be understood that the phosphor and scattering layer may not cover the entire surface of the carrier layer, and in some embodiments, the conversion layer and the scattering layer may have different concentrations in different regions. It should also be understood that the phosphor support may have surfaces of different roughness or shape to enhance transmission through the phosphor support. As mentioned above, the diffuser is configured to disperse light from the phosphor carrier and LED into the desired lamp emission pattern and can have many different shapes and sizes. In some embodiments, the diffuser can also be disposed over the phosphor carrier to shield the phosphor carrier when the lamp is not emitting light. The diffuser can have a material to impart a substantially white appearance to impart a white appearance to the bulb when the lamp is not illuminated. At least four properties or characteristics of the diffuser can be used to control the output beam characteristics of the lamp 5〇. The first attribute or characteristic is the diffuser geometry that is independent of the phosphor layer geometry. The second attribute or property is the diffuser geometry for the phosphor layer geometry. The third property or characteristic is diffuser scattering properties' including the nature of the scattering layer and the smoothness/roughness of the diffuser surface. The fourth attribute or characteristic is the distribution of the diffuser on the surface (such as the intentional inhomogeneity of the scattering). These attributes allow control of, for example, the ratio of axially emitted light relative to "lateral" emitted light (~90.) and also relative to "high angle" (>~13〇.). These properties can also be applied differently depending on the geometry of the phosphor carrier and the source of light and the pattern of light emitted by the phosphor and the light source. For two-dimensional phosphor carriers and/or light sources (such as those shown in Figure 4), the emitted light is generally rabbit-forward (e.g., Lambertian). For these embodiments, the above-listed stipulations can provide a variation of the forward emission pattern into a broad beam intensity profile. The variation of the first-throat attribute and the fourth attribute can be particularly applicable to the forward emission profile. Achieve a wide beam omnidirectional emission. For a three-dimensional phosphor carrier (described in more detail below) and a three-dimensional source, the emitted light is greater than that emitted by other lamp surfaces (such as 'diffusion and heat; ΐ) 90. It can already have the emission intensity of the plume. As a result, the diffuser properties listed above can be used to further adjust the beam profile from the phosphor carrier and source to match the desired output beam more closely. Strength, color, and color point. In some embodiments the 'adjustable beam m substantially matches the output 0 from a conventional incandescent bulb as described above with respect to the first property of the diffuser geometry independent of the phosphor geometry, in the light system self-diffuser In the embodiments in which the surface is uniformly emitted, relative to the lateral direction (~9〇.) and relative to the "high angle" (>~130°) means "forward" (push up or ~〇.) The amount can vary greatly depending on the cross-sectional area of the diffuser when viewed from the other side. Many different diffusers having different shapes and attributes can be used in different embodiments herein, including but not limited to such embodiments shown and described in the following application. With Rem〇te ph〇sph〇r and

U.S. Patent Application Serial No. 61/339,515, 154, 495, filed to D.S. No. 12/901,405, the disclosure of which is hereby incorporated herein in its entirety in its entirety in the entirety the the the the the the the the the the the Referring again to Figure 4, in their lamp embodiment, the cavity 54 can be filled with a transparent thermally conductive material to further enhance the heat dissipation of the lamp. The cavity conductive material can provide a second time for dissipating heat from the source 58. The path is from. The heat from the source will still be conducted via the platform 56, but may also pass through the cavity material to the fin structure 52. This will allow the lower operating temperature of the source 58 but cause an increase in the phosphor carrier 62. Danger of operating temperature. This configuration can be used in many different embodiments, but is particularly suitable for lamps with higher light source operating temperatures (compared to the operating temperature of the phosphor carrier). The application of tolerance to additional heating of the phosphor support layer allows for more efficient dissipation of heat from the source. As discussed above, different lamp embodiments in accordance with the present invention may be configured with many different types of light sources. Figure 5 shows the lamp 21 In another embodiment of the lamp, the lamp 21A is similar to the lamp 5〇β lamp 21〇 described above and shown in FIG. 4, comprising a heat sink structure 212 having a cavity 214 having a configuration to hold The platform 216 of the light source 218. The phosphor carrier 22 can be included over the opening of the cavity 214 and at least partially cover the opening. In this embodiment, the light source 218 can include a plurality of LEDs, the plurality of LEDs being configured separately [ Arrays are arranged in an ED package or in a single multi-LED package. For embodiments that include a separate LED package, each of the LEDs can include its own primary light 154495.doc • 35- 201142198 Learning device or lens 22 2. In embodiments with a single multi-LED package, a single primary optic or lens 224 can cover all of the LEDs. It should also be understood that the LEDs and LED arrays can have secondary optics or can have primary optics and A combination of secondary optics. It will be appreciated that lensless LEDs may be provided and in the array embodiment 'each of these LEDs may have its own lens. Similar lamps 50' heat sink structure and platform may Electrical traces or wires are provided to provide electrical signals to light source 218. In each embodiment the 'illuminators can be coupled in different series and parallel configurations. In one embodiment, eight LEDs can be used, Eight LEDs are connected in series to the board by two wires. The wires can then be connected to the power supply unit described above. In other embodiments, more than eight or fewer LEDs may be used and as mentioned above, may be purchased from Cree, Inc.

LEDs include eight XLamp® XP-E LEDs or four XLamp® XP-G LEDs. Different single-string LED circuits are described in the following U.S. Patent Application. Van de Ven et al. entitled "Color Control of Single"

U.S. Patent Application Serial No. 12/566,195 to String Light Emitting Devices Having Single String Color Control, and van de

Ven et al. titled "Solid State Lighting Apparatus with

U.S. Patent Application Serial No. 12/7, the entire disclosure of which is incorporated herein by reference. In the lamps 50 and 210 described above, the light source shares a thermal path (referred to as heat dissipation) for dissipating heat with the phosphor carrier. In some embodiments, if the thermal path for the phosphor carrier and the source is not thermally coupled (referred to as thermal decoupling), the heat dissipation of the phosphor carrier can be enhanced by I54495.doc • 36· 201142198. Figure 6 shows a further embodiment of a lamp 3 according to the present invention comprising an optical cavity 3〇2 within a heat sink structure 305. Similar to the above embodiments, a lampless cavity lamp 300 can also be provided in which the LEDs are mounted on the surface of the heat sink or mounted on a three dimensional structure or pedestal structure having a different shape. A planar LED based light source 304 is mounted to the platform 306 and a phosphor carrier 3〇8 is mounted to the top opening of the cavity 302, wherein the phosphor carrier 3〇8 has any of the features described above. In the illustrated embodiment, the phosphor support can be in the shape of a flat disk and comprise a thermally conductive transparent material and a phosphor layer. Phosphor carrier 308 can be mounted to the = cavity together with a thermally conductive material or device as described above. The cavity 302 can have a reflective surface to enhance the emission efficiency, as described in the above two. * Light from the source 304 passes through the phosphor carrier 3〇8, in the phosphor carrier 308, the 13⁄4 light-part (four) light carrier The light body is converted into light of different wavelengths. In an embodiment, the 'light source 3〇4 may comprise a blue light emitting LED, and the phosphor carrier 3〇8 may comprise a yellow phosphor as described above, which absorbs the blue portion and re-emits yellow Light. The lamp 300 emits a combination of LED light and white light of yellow phosphor light. Like the above, light source 304 can also contain many different colors that emit light of different colors, and the phosphor carrier can include other phosphors to produce light having a desired color temperature and color rendering properties. The lamp 3 also includes a shaped diffuser dome 31 mounted over the cavity, the diffuser dome 310 comprising diffusing or scattering particles such as those diffusing or scattering particles as listed above. The scattering particles can be provided in a curable 154495.doc -37- 201142198 binder. The curable binder is formed in a generally dome shape. In the illustrated embodiment, the dome 310 is mounted to the heat sink structure 3〇5 and has an enlarged portion at the end opposite the heat sink structure 305. Different binder materials such as polyoxin, epoxy, glass, inorganic glass, dielectric, BCB, polyamine, polymers, and mixtures thereof, as discussed above, can be used. In some embodiments, white scattering particles can be used for a white dome that hides the color of the phosphor in the phosphor carrier 3〇8 in the optical cavity. This imparts a white appearance to the entire lamp 300, which is generally more visually acceptable to the consumer or more attractive to the consumer than the color of the phosphor. In one embodiment, the diffuser can include white titanium dioxide particles. The white titanium dioxide particles can impart an overall white appearance to the diffuser dome 31. The diffuser dome 310 provides the added benefit of distributing the light emitted from the optical cavity in a more uniform pattern. As discussed above, light from a source in the optical cavity can be emitted in a substantially Lambertian pattern, and the shape of the dome 31 and the scattering properties of the scattering particles cause the light to be emitted from the dome in a more omnidirectional emission pattern. Engineered domes can have different concentrations of scattering particles in different zones or can be shaped into specific emission patterns. In some embodiments, the dome can be engineered such that the emission pattern from the lamp follows the omnidirectional distribution criteria defined by the source of energy (DOE) sources. The requirement of this standard for lamp 3 在于 is that the uniformity of emission must be at 〇. To 135. Within 2% of the average value under review; and >5% of the total flux from the lamp must be at 135. It is launched in the launch area of 8〇, where the measurement system is in the 〇. 45. Performing at azimuth angles As mentioned above, the different lamp embodiments described herein may also be J54495.doc • 38 - 201142198 including Type A trimmed LED bulbs that meet the DOE Energy Star standard. The present invention provides efficient and reliable And cost-saving lights. In some embodiments, the entire lamp can include five components that can be assembled quickly and easily. Similar to the above embodiment, the lamp 300 can include a mounting mechanism of the type installed in conventional electrical outlets. In the illustrated embodiment, the lamp 3A includes a threaded portion 3丨2 for mounting to a standard threaded seat. Like the above embodiments, the lamp 300 can include a standard plug and the electrical socket can be a standard socket, or the electrical socket can include a GU24 base unit, or the lamp 300 can be a clip and the electrical socket can be a socket that receives and holds the clip ( For example, as used in many fluorescent lights). As mentioned above, the space between some of the features of the lamp 3 can be considered as a mixing chamber, wherein the space between the source 306 and the phosphor carrier 3〇8 contains the first light mixing chamber. The two spaces between the phosphor carrier 3〇8 and the diffuser 31〇 may comprise a first light mixing chamber, wherein the mixing chamber promotes uniform color and intensity emission of the lamp. The same can be applied to the following embodiments of phosphor carriers and diffusers having different shapes. Additional diffusers and/or phosphor carriers forming additional mixing chambers may be included in other embodiments, and the diffusers and/or phosphor carriers may be configured in a different order. Different lamp embodiments in accordance with the present invention can have many different shapes and sizes. Figure 31 shows another embodiment of a lamp 32A in accordance with the present invention, similar to lamp 3G0, and similarly includes an optical cavity 322 in the fin structure milk, wherein the source 324 is mounted to the optical cavity as well as the platform. Like the above, the heat sink structure need not have an optical cavity, and the light source can be provided on other structures than the heat sink structure. Such structures may include a planar surface or pedestal having a light source. The scale carrier is intended to be mounted over the opening 154495.doc •39- 201142198 by means of a thermal connector. Lamp 320 also includes a diffuser dome 330 mounted to the heat sink structure 325 above the optical cavity. The diffuser dome may be made of the same material as the diffuser dome 31〇 described above and illustrated in Figure 15 but in this embodiment the dome 300 is shaped as an ellipse or an egg to provide a different The lamp emits a pattern while still obscuring the color of the phosphor from the phosphor carrier 328. Also note that the fin structure 325 and the platform 326 are pyrolyzed. That is, there is a space between the platform 326 and the heat sink structure such that it does not share a thermal path for dissipating heat. As mentioned above, this can provide improved heat dissipation from the phosphor carrier, as compared to a lamp phase that does not have a decoupled thermal path. Lamp 300 also includes a threaded portion 332 for mounting to a threaded seat. Figures 8 through 1 show another embodiment of a lamp 34A in accordance with the present invention, which is similar to the lamp 32 shown in Figure 31. Lamp 34A includes a heat sink structure 345 having an optical cavity 342 (where optical cavity 342 has light source 344 on platform 346) and a phosphor carrier 348 over the optical cavity. Lamp 34A further includes a threaded portion 352. Lamp 340 also includes diffuser dome 35A, but in this embodiment f, the diffuser dome is planarized at the top to provide the desired pattern' while still obscuring the color of the bowl. Lamp 340 also includes an interface layer 354 between light source 344 and fin structure 345 from light source 344. In some embodiments, the interface layer can comprise a thermally insulating material, and the source 344 can have features that promote dissipation of the thermal self-illuminator to the edge of the substrate of the source. This situation can promote heat dissipation to the outer edges of the fin structure 345 where heat can be dissipated via the fins. In other embodiments, the interface layer 354 can be electrically insulating to electrically isolate the heat sink structure 345 from the light source 344. The electricity can then be applied to the top surface of the source. 154495.doc • 40· 201142198 Connections® In the above embodiments, the phosphor carrier is two-dimensional (or flat/planar) while the LEDs in the source are coplanar. However, it should be understood that in other lamp embodiments, the phosphor carrier can take on many different shapes, including different two-dimensional shapes. The term "three-dimensional" is intended to mean any shape other than the plane as shown in the above embodiments. Figures 35 through 38 show different embodiments of a two-dimensional fill carrier in accordance with the present invention, but it should be understood that the scale carriers can take many other shapes. As discussed above, when the light body absorbs and re-emits light, it is emitted in an isotropic manner such that the three-dimensional phosphor carrier is used to convert light from the source and also disperse light from the source. Similar to the diffuser described above, the three-dimensional carrier layers of different shapes may have emission patterns of different characteristics to emit light depending on the emission pattern of the light source. The diffuser can then be matched to the emission of the phosphor carrier to provide the desired lamp emission pattern. Figure 11 shows a hemispherical shaped phosphor carrier 354 comprising a hemispherical carrier 355 and a phosphor layer 356. The hemispherical carrier 355 can be made of the same material as the carrier layer described above, and the phosphor layer can be made of the same material as the phosphor layer described above, and the scattering particles can be included in the carrier and phosphorescent as described above. In the layer. In this embodiment, phosphor layer 356 is shown on the outer surface of carrier 355, but it should be understood that the light-constituting layer can be located on the inner layer of the carrier, mixed with the carrier, or any combination of the three above. In some embodiments, having a fill layer on the outer surface minimizes emission losses. When the illuminator light is absorbed by the dish layer 356, the light system is emitted omnidirectionally, and some of the light can be emitted backwards and absorbed by a lamp element such as an LED 154495.doc -41 · 201142198. Phosphor layer 356 can also have a different index of refraction than hemispherical carrier 355 such that light emitted forward from the phosphor layer can be reflected back from the inner surface of carrier 355. This light can also be lost due to absorption by the lamp elements. In the case where the phosphor layer 356 is located on the outer surface of the carrier 355, the light emitted forward does not need to pass through the carrier 355 and will not be lost due to reflection. The light that is emitted backwards will hit the top of the carrier where at least some of the light will be reflected back. This configuration results in a reduction in light emitted from the phosphor layer 356 back into the carrier where light can be absorbed. The lining layer 356 can be deposited using a number of methods in the same manner as described above. In some examples, the three-dimensional shape of the carrier 355 may require additional steps or other processes to provide the necessary coverage. In embodiments where the solvent/barrier_gluer mixture is sprayed, the carrier may be heated as described above, and multiple nozzles may be required to provide the desired coverage (such as near uniform coverage) over the carrier. In other embodiments, fewer nozzles can be used while rotating the carrier to provide the desired coverage. Similar to the above, the heat from the carrier 35 5 evaporates the solvent and helps to cure the binder. In still other embodiments, the phosphor layer can be formed via an ink immersion process whereby a phosphor layer can be formed on the inner or outer surface of the carrier 355, but is particularly suitable for formation on the inner surface. The carrier 35 5 may be at least partially filled with a phosphor mixture adhered to the surface of the carrier, or otherwise contact the carrier 355 with the phosphor mixture. The SiO mixture can then be discharged from the support to leave a layer of phosphor mixture on the surface which can then be cured. In one embodiment, the mixture may comprise polyethylene oxide (PE) and a phosphor. The carrier can be filled and connected to I54495.doc -42· 201142198 to empty the carrier, leaving a layer of PEO-phosphor mixture, which can then be thermally cured to evaporate or be dissipated by heat, thereby leaving Lower phosphor layer. In some embodiments, a binder may be applied to further fix the phosphor layer, while in other embodiments, the phosphor may remain without an adhesive. Similar to the process for coating a planar carrier layer, such processes can be used in a three-dimensional carrier to coat a plurality of phosphor layers that can have the same or different phosphor materials. The disc layer may also be applied to both the interior and exterior of the carrier and may have different types having different thicknesses in different regions of the carrier. In still other embodiments, different processes can be used, such as coating the carrier with a sheet of phosphor material that can be thermally formed into the carrier. In a lamp utilizing the carrier 355, the illuminator can be disposed at the base of the carrier such that light from the illuminator is emitted upwardly and through the carrier 355. In some embodiments, the illuminator can illuminate in a substantially Lambertian pattern and the carrier can help disperse the light in a more uniform pattern. Fig. 12 shows another embodiment of a three-dimensional phosphor carrier 357 according to the present invention. The three-dimensional filler carrier 357 comprises a bullet-shaped carrier 358 and a light-filling layer 359 on the outer surface of the carrier. Carrier 358 and phosphor layer 359 can be formed from the same materials as described above using the same methods as described above. Different shaped phosphor carriers can be used with different illuminators to provide the desired overall lamp emission pattern. Figure 13 shows a further embodiment of a three-dimensional illuminant carrier 360 comprising a sphere-shaped carrier 361 and a phosphor layer 362 on the outer surface of the carrier, in accordance with the present invention. The carrier 361 and the can light layer 362 can be formed of the same material as described above from 154495.doc • 43· 201142198 using the same method as described above. Figure 14 shows a phosphor carrier 363 having a substantially spherical shape carrier 364 and a narrow neck portion 365 in accordance with yet another embodiment of the present invention. Like the above embodiment, the phosphor carrier 363 includes a light-filling layer 366 on the outer surface of the carrier 364. The light-filling layer 366 is made of the same material as described above and is used as described above. The method is formed in the same way. In some embodiments, a fill carrier having a shape similar to carrier 364 may be more efficient in converting illuminator light and re-emitting the Lambertian light from the source into a more uniform emission pattern. Embodiments having a three-dimensional structure (such as a 'base) that holds the LEDs can provide a more dispersed light pattern from the three-dimensional phosphor carrier. In these embodiments the 'LEDs can be angled within the scale carrier such that the LEDs provide a light emission pattern that is less similar to the Lambertian pattern than a planar LED source. This can then be further dispersed by a three-dimensional phosphor carrier, wherein the disperser fine-tunes the emission pattern of the lamp. 15 through 17 show another embodiment of a lamp 37 according to the present invention having a heat sink structure 372, an optical cavity 374, a light source 376, a diffuser dome 378, a threaded portion 380, and a housing "I. This implementation The example also includes a three-dimensional phosphor carrier 382' three-dimensional phosphor carrier 382 comprising a thermally conductive transparent material and a light-filling layer. The three-dimensional phosphor carrier 382 is also mounted to the heat sink structure 372 by a thermal connector. However, in this embodiment The phosphor carrier 382 is hemispherical and the illuminator is configured such that light from the source passes through the phosphor carrier 382' in the phosphor carrier 382, at least some of which is converted. The three-dimensional shape of the filler carrier 382 The shape provides a natural separation between the phosphor carrier 382 and the 154495.doc • 44 - 201142198 source 376. Therefore, the source 376 is not mounted in the recess in the heat sink forming the optical cavity. In fact, the light source 376 is mounted on the heat sink. On the top surface of the sheet structure 372, wherein the optical cavity 374 is formed by the space between the phosphor carrier 382 and the top of the heat sink structure 372. This configuration allows for less from the optical cavity 374. The primary emission is because there is no side of the optical cavity that blocks or redirects the lateral emission. In embodiments that utilize a blue LED and a yellow phosphor for the light source 376, the phosphor carrier 382 may be yellow. And the diffuser dome 3 78 shields the color while dispersing the light into the desired emission pattern. In the lamp 37, the conduction path for the platform is coupled to the conduction path for the heat sink structure, but it should be understood that in other implementations In an example, the conductive path for the platform can be decoupled from the conductive path for the heat sink structure. Figure 18 shows an embodiment of a lamp 39A in accordance with the present invention, which is mounted to heat sink 394 as described above. The eight LED light sources 3 92. The illuminators can be coupled together in many different ways, and in series in the illustrated embodiment. Note that in this embodiment, the illuminators are not mounted in the optical cavity. Rather, it is mounted on the top planar surface of the heat sink 394. Figure 19 shows the lamp 390 shown in Figure 18, wherein the dome shaped phosphor carrier 396 is mounted over the light source 392. The lamp 390 shown in Figure 19 can be as Figure 20 and as shown in Figure 21 in combination with diffuser 398 to form a light-dissipated light emission. Figures 22 through 24 show yet another embodiment of a lamp in accordance with the present invention. Lamp 410 includes the same as in Figures 15 through 17 above. The display lamp 370 exhibits many of the same features. However, in this embodiment, the phosphor carrier 412 is bullet shaped and is nearly identical to other embodiments of the phosphor carrier described above 154495.doc -45- The manner of 201142198 works. It should be understood that these shapes are only two of the different shapes that the phosphor carrier can employ in different embodiments of the invention. Figure 25 shows another embodiment of a lamp 42 according to the present invention. The lamp 42A also includes a heat sink 422 having an optical cavity 424 having a light source 426 and a phosphor carrier 428. Lamp 420 also includes a diffuser dome 43 and a threaded portion 432. However, in this embodiment, the optical cavity 424 can include a separate collar structure 434, as shown in Figure 26, which can be removed from the heat sink like the collar structure 434. This situation provides a single piece that can be coated with a reflective material more easily than the entire heat sink. The collar structure 434 can be threaded to mate with threads in the fin structure 422. The collar structure 434 provides the advantage of adding: the PCB can be mechanically clamped down to the heat sink. In other embodiments, the collar structure 434 can include a mechanical snap-on device rather than a thread for easier manufacture. As mentioned above, the shape and geometry of the three-dimensional phosphor carrier can assist in transforming the emission pattern of the illuminator into another more desirable emission pattern. In an embodiment, the shape and geometry of the two-dimensional phosphor carrier can assist in changing the Lambertian emission pattern to a more uniform emission pattern at different angles. The diffuser can then further transform the light from the phosphor carrier into a final desired emission pattern while obscuring the yellow appearance of the phosphor when the light is extinguished. Other factors may also contribute to the ability of the illuminator, phosphor carrier, and disperser to produce the desired pattern to be emitted. Figure 27 shows an embodiment of an illuminator footprint 440, a phosphor carrier footprint 442, and a diffuser footprint 444 in accordance with an embodiment of the lamp of the present invention. Phosphor carrier footprint 442 and disperser footprint 444 show the lower edges of such features around illuminator 440. 154495.doc -46- 201142198 In addition to the actual shape of these features, the distances D1 and D2 between the edges of such features can also affect the ability of the phosphor carrier and disperser to provide the desired pattern to be emitted. The shape of the features and the distance between the edges can be optimized based on the emission pattern of the illuminator to obtain the desired lamp emission pattern. It should be understood that in other embodiments, different portions of the lamp (e.g., the entire optical cavity) may be removed. Such features that enable the removal of the collar structure 4丨4 may allow for easier coating of the optical cavity with a reflective layer, and may also allow for removal and replacement of the optical cavity in the event of a failure of the optical cavity. A lamp in accordance with the present invention can have a light source comprising a plurality of different numbers of LEDs, some of which have less than 30 LEDs and in other embodiments have less than 20 LEDs. Still other embodiments may have less than one LED 'where fewer LED wafers, the lower the cost and complexity of the light source is generally lower. In some embodiments, the area covered by multiple wafer sources may be less than 30 mm 2 , and In other embodiments, the area may be less than 2 〇 mm 2 ^ in still other embodiments, the area may be less than 1 〇. Some embodiments of the lamp according to the present invention also provide a steady-state light output greater than 4 〇〇 lumens, and in other embodiments, provide a steady-state light output greater than 6 〇 0 lumens. In still other embodiments Medium, the lamp provides a steady state light output of greater than 800 lumens. Some lamp embodiments can provide this light output by the thermal management features of the lamp. These thermal management features allow the lamp to be relatively cold to the touch. In one embodiment, the touch temperature of the lamp remains less than 6 〇 c, and in other embodiments, the touch temperature of the lamp remains less than 50 〇 c. In still other embodiments, the touch temperature of the lamp remains less than 4 〇. (: Some embodiments of the lamp according to the present invention may also operate at an efficiency greater than 4 〇 lumens per watt 154495.doc • 47- 201142198' and in other embodiments may operate at greater than 5 〇 lumens per watt. In still other embodiments, the lamp can operate greater than 55 lumens per watt. Some embodiments of the lamp in accordance with the present invention can produce light having a color rendering index (CRI) greater than 70, and in other embodiments, produce greater than 80 CRI light. In still other embodiments, the lamp can operate at a CRI greater than 90. One embodiment of the lamp according to the present invention can have scales that provide lamp emission with a CRI greater than 80, and Lumen equivalent radiation (LER) greater than 320 lumens/optical watt at @3000 K correlated color temperature (CCT). Lamps according to the present invention may also follow 40% of the mean value from 〇 to 丨35. The distribution within the luminescence' and in other embodiments, the distribution may be within 30% of the average of the same viewing angle. Still other embodiments may have a distribution of 20% of the average over the same viewing angle (in accordance with energy Star The embodiments may also emit more than 5% of the total flux at a viewing angle of from 135 to 180. It should be understood that the lamp or bulb according to the present invention may be in many different ways than the above embodiments. The above embodiments are discussed with reference to a remote phosphor, but it should be understood that alternative embodiments may include at least some of the LEDs having a conformal phosphor layer. This situation may be particularly useful for emitting different colors from different types of illuminators. Lights of the light source. These embodiments may additionally have some or all of the features described above. These different configurations may include those configurations shown and described in the above incorporated application. :Tong et al., U.S. Provisional Patent Application No. 154495.doc-48-201142198 61/339,515, entitled "LED Lamp whh Rem〇te (10) and Diffuser Configuration" and Tong et al., entitled "Non- U.S. Patent Application Serial No. 12/901,405, the disclosure of which is incorporated herein by reference. Active elements of resistance. Many different active elements can be used, and some embodiments can include one or more fans that can be provided in many different positions in different embodiments in accordance with the present invention. Air may be configured to agitate the air surrounding certain elements of the lamp to reduce convective thermal resistance. The fans may be used in lamps having fins configured in different ways or in lamps that do not have heat sinks. Figures 28 and 29 show an embodiment of a lamp 7A in accordance with the present invention that can take many different shapes and sizes, but in the illustrated embodiment has an A-size bulb shell adapted as shown in Figure 3. size of. The lamp 7A includes a heat sink 702 in which the LED 704 is mounted to the base 706, which in turn is mounted to the heat sink 702. The LEDs can be mounted to a number of different pedestal shapes, such as disclosed in U.S. Patent Application Serial No. 12/848,825, the entire disclosure of which is incorporated herein by reference. Their pedestal shapes. This application is incorporated herein by reference. The LEDs can also be provided in a planar configuration as described and illustrated in the above embodiments. The heat sink 702 is similar to the heat sink described in the above embodiments and can be in thermal contact with all or some of the lamp heat generating elements to dissipate during operation.

The heat generated. A heat sink 702 similar to the heat sink described above can be at least A /.丨 4 points contain thermally conductive materials and can be used with many different thermal materials, including f;] gold 154495.doc • 49- 201142198 genus (such as copper or aluminum) or metal alloys. The heat sink 7〇2 may also include heat sink fins 708 that increase the surface area of the heat sinks 7〇2 to promote more efficient dissipation into the environment. In the illustrated embodiment, the fins 708 are shown in a generally horizontal/longitudinal orientation, although it should be understood that in other embodiments, the fins may have a vertical/orthogonal or angular orientation. The lamp 700 further includes a base/slot 71 (such as a threaded swivel) that includes features that allow the lamp to be screwed into or connected to a power source. As above, other embodiments may include a standard plug and the electrical socket may be a standard socket, may include a GU24 base unit, or it may be a clip and the electrical socket may be a socket that receives and holds the clip (eg, such as many fluorescent Used in the lamp). Similar to the above embodiments, the base/slot may also include a power supply or power conversion unit that may include a driver to allow the light bulb to be powered by the AC line voltage/current and, in some embodiments, a light source Dimming ability. Lamp 700 also includes a bulb or diffuser dome 712 that may have the characteristics of a diffuser dome as described above. It should include diffuser scattering properties, and different embodiments of the diffuser dome 712 can include a carrier made of a different material such as glass or plastic and one or more scattering films, layers or regions, as discussed above, diffusion The scattering properties of the dome may be provided as one or more of the scattering particles listed above. In some embodiments, the diffuser dome 712 may be configured to emit LEDs 704 from the pedestal 706. Light is scattered into a more uniform emission pattern. That is, the scattering properties of the diffuser dome 712 can change the light pattern from [ED 704 to a more uniform emission pattern. It should be understood that the lamp may also comprise a phosphor carrier configured in a planar or three dimensional manner as described above. 154495.doc -50- 201142198 Fan 714 is included in lamp 700, and in the illustrated embodiment, fan 714 is located at the bottom of heat sink 7〇2, between the base and the heat sink. The fan 7U is configured to enter ambient air and allow air to flow over the surface of the heat sink 7〇2. The drive circuit from the base 71 turns power to the fan 714 (and the LED 704). Figures 30 through 32 show an embodiment of a fan in accordance with the present invention. Fan 714 includes a rotor 716 that rotates about a center mount 718 in response to an electrical signal. The center mount 718 can include bearings 72〇 to allow relative free rotation of the rotor. Different types of bearings can be used, and the preferred bearings in & are ceramics that improve the life of the fan. The center mount 718 also includes electrical contacts 722, both of which are provided to apply an electrical signal to the fan 714. Other contacts 722 are configured to pass through the center mount 718 such that electrical signals applied to the contacts are passed through to the LEDs 704. Fan 714 can be of many different shapes and sizes, and in some embodiments can have a diameter of less than 100 mm. In other embodiments, the diameter may be less than 75 mm, and in still other embodiments, the diameter may be less than % _. In one embodiment, the direct control of the fan 714 can be about 4 mm. The fan can also be configured to move air at different rates, with some embodiments moving less than 3 cubic feet per knives (CFM) of air and other embodiments moving less than 2 CFM of air. In the embodiment, the rate of air flow is about 1 CFM. The power consumed by the fan should be as low as possible, with some embodiments consuming less than 0.5 W and other embodiments consuming less than 03 w. In still other embodiments the fan may consume less than 〇 1 W. The noise generated by the fan should also be minimized. Some of the embodiments produce less than 30 decibels (dB) of noise, and the other 154495.doc - 51 · 201142198 embodiments produce less than 20 dB of noise. In still other embodiments, the fan can produce less than 15 dB of noise. The reliability of the fan should be maximized, with some embodiments having a service life of greater than 50, 〇〇〇 hours, and other embodiments having a service life of greater than 100,000 hours. Cost should also be minimized, in some embodiments each costing less than one dollar. In some embodiments, the rotation of the rotor 716 can have an approximately linear dependence on the fan drive voltage. In one embodiment, a driving voltage of 35 V produces a rotor rotation of 820 rpm, wherein the power consumption of the fan is estimated to be about 0.1 W. At a driving voltage of 12 V, the rotor rotates at 36 rpm and produces noise in the range of twenty dB. It is estimated that the noise generated under 35 ¥ operation is much lower and can be in the range of more than ten db. Fans with ceramic ball bearings increase the operating life under normal operating conditions to more than 100 k hours. At reduced rotational speeds (for example, 3 5 v), the life of the fan can be longer. Figures 33 and 34 show the experimental effectiveness of the fan in reducing the convective thermal resistance of the heat sink. The convective thermal resistance of the commercially available heat sink τ (Fig. 33) for the A bulb replacement and the heat sink S (Fig. 34) for the MR16 lamp was measured using a conventional 4 〇 111〇1 wind fan. In the case of a fan off (pure natural convection), the fins T and S respectively exhibit convective thermal resistance. When the fan is operated at nominal 12 V, the convective thermal resistance is approximately 2 5 (>c/w and 2.7 °C/W (or 69% and 79% lower than the pure natural convection, respectively). Under the reduced operating conditions of 3.5 V, the convective thermal resistance is 5 9 <>c/w and 6.1 °C/w (or 26% lower than pure natural convection and 53./〇). In addition to convection thermal resistance In addition to the reduction, another 154495.doc -52- 201142198 advantage of the integrated fan module design is illustrated in Figure 35. Image 7 views the heat buildup in the laterally oriented lamp 732. Image 734 illustrates the fan in accordance with the present invention The heat dissipation provided by the lateral light w. The heat sink convective thermal resistance in the lamp 734 is relatively less susceptible to the spatial orientation of the illuminator in the presence of forced convection from the fan element. In contrast, based on The orientation of the fins, pure natural convection can have a convective thermal performance change of more than 20%. It is worth noting that the forced flow of 0.5 m/s from the fan in the simulation is relatively low, corresponding to about 1 CFM (cubic Suction/minute). & air flow material is about 20 times lower than typical coffee cooling fan. With the help of the forced flow, the heat sink fins 708 of the heat sink 7〇2 can be made much denser, thereby further increasing the convective heat transfer by increasing the surface area. In the case of pure natural 'convection, it is difficult to achieve dense heat dissipation. Fins, because the dense fin structure blocks natural convection flow to a greater extent and reduces convective heat transfer. Fan components with minimal power consumption can significantly reduce system convection of these denser fin configurations Thermal resistance. This allows the lower junction temperature of the led and the lower junction temperature of the phosphor material, resulting in better luminous efficiency and better reliability of the system. The better thermal system allows the LED to be driven at a higher current. This reduces the cost per light output. As mentioned above, the fan can be deployed in many different locations in the lamp to provide air flow across different regions or different features of the lamp. Figures 36-38 show a lamp in accordance with the present invention In another embodiment of the 740, the lamp 74A includes a heat sink 742, wherein the LED 744 is mounted in a planar orientation at the top of the heat sink 742 and in thermal contact with the heat sink 742. The base/slot 746 Mounted to heat sink 742, 154495.doc • 53- 201142198 Contrary to LED 744. The base/slot can be configured similar to the base/slot 710 shown in Figures 28 and 29. Base/slot 746 can include permission The lamp 740 is screwed into the features in the threaded seat and may also include a drive or power conversion circuit (as described above). In this embodiment, one of the bases/slots 746 is partially disposed within the core 754 of the heat sink 742. 740 further includes a phosphor carrier 748 and a diffuser dome 750, which may be made of the same materials described above and may have different configurations (as described above). The diffuser dome and the conversion carrier can also be configured as described in the following patent application: T〇ng et al., filed on October 8, 2010, entitled "Non-Uniform Diffuser to Scatter Light Into Uniform Emission" U.S. Patent Application Serial No. 12/901,404. This application is incorporated herein by reference. It should also be understood that 'only a diffuser or only a phosphor carrier may be provided. The lamp 740 further includes an internal fan 752 disposed within the core 754 of the heat sink 742 at the top of the base/slot 746 and below the LED 744. The fan can be similar to the fan 714' described above with reference to Figures 3A through 32 and can have many of these sizes and operational characteristics. Similar to fan 714, fan 752 should be modular, reliable, low noise, and consume very little additional power. Fan 752 can also be electrically coupled to base/slot 746 to obtain its operating power. Fan 752 can also be configured to conduct electrical signals from base/slot 746 to LED 744. As described first below, the fan 752 draws air from the outside of the lamp into the fin core 754 and into the diffuser cavity 756. Air is introduced to pass 154495.doc -54 - 201142198 through the fin core 754 and the diffuser cavity 756 and away from the diffuser cavity, thereby providing heat generated by the carry lamp during operation and allowing the lamp to operate at reduced temperatures The lamp air flows. Referring again to Figures 36-38, the heat sink 742 includes a lower fin inlet 758' that allows air to enter the fin core 754 when the fan 752 is in operation. Although the inlet 758 is shown as being at a particular location in the heat sink 742, it should be understood that it can be in many different locations and that there can be many different numbers of inlets. The inlet 758 can be configured to provide a desired air flow across the fins 742 as air is drawn into the fin core 754. After being drawn into the core 754, the fan 752 causes air to flow into the diffuser cavity 756 via the diffuser cavity inlet 760 adjacent the LED 744. Figure 37 best shows the phosphor carrier and diffuser dome on the heat sink 742

The fan is embedded in the fin cavity/core 754, which is provided for delivery outside the diffuser cavity. Further reduce fan noise. This is equipped with t. As shown in Figure 38, the fan does not directly see the fan from the outside and i also provides internal air flow to the lamp 154495.doc • 55- 201142198 752 via the lower inlet 758 near the base of the heat sink 742 from the lamp 740 The outside draws cooling air. Air is drawn through the fin core 754 and over the base/slot 746' where the air cools the circuitry therein. The air then flows into a diffuser cavity 754 where it can pass through the LED and agitate the otherwise stagnant air within the diffuser cavity 756. This air flow results in increased air pressure within the diffuser cavity 756 as compared to the air pressure outside the lamp. This pressure differential causes air to exit the diffuser cavity 756 at the edge of the diffuser dome of the overlapping fins 742. In some embodiments, it may be particularly helpful in maximizing the flow of air through the internal spaces between the fins. This forced air flow breaks the boundary air layer, allowing colder air to displace the stagnant warmer air trapped in the space between the fins. When air is drawn into the fin core 754 or out of the diffuser cavity 756, at least a portion of the air can flow through the fins 753. This forced air flow can agitate the air within the fins, thereby breaking the boundary air layer and allowing The cold air replaces the stagnant warmer air boundary layer in the gap between the pieces. This continuous air flow through the lamp 740 provides an effective configuration for reducing the convective thermal resistance at different locations within the lamp 74. This in turn enhances the overall convective heat dissipation of the lamp 74. The simulation of the illustrated embodiment reflects an air flow of about 1 CFM (cubic 呎/min) that reduces the natural convection thermal resistance of a typical heat sink by almost 5%. At this air flow rate, the noise from the fan is usually extremely low. For example, a commercially available fan of the required size and providing the necessary air flow can have a noise level of approximately 22 dB, a power consumption of 〇 5 W, 3 〇, 〇〇〇 to 5 〇, 〇〇〇 I54495.doc -56- 201142198 The MTTF service life of the hour (depending on the bearing material) and the cost of each $0.50. In the case of reduced convection thermal resistance, the LED junction temperature can be significantly reduced. For example, if a heat sink without an integrated fan has a convection thermal resistance of 7t>c/w (relative to the LED input power) and a heat sink with an integrated fan has a convection thermal resistance of 3.5° C/W, and The LED lamp draws about 12 watts of input power, and the LED junction temperature can be reduced by almost 4 藉 by the integrated fan. This results in enhanced reliability and/or lower system cost (where less LEDs are driven at higher currents). It should be understood that the fan can be included in many different lamps that are configured in many different ways. Figure 39 shows another embodiment of a lamp 78A in accordance with the present invention, the lamp 78A being similar to the lamp 740 shown in Figures 36-38. The lamp 78A also includes a heat sink 782, an LED 784, a base/slot 786, and a diffuser dome 788. It also includes an internal fan 79 〇 β that draws ambient air into the lamp 780. However, in this embodiment, there is no phosphor carrier, thereby providing simplified air flow within the lamp. Fan 790 draws air into lamp 78A via lower fin inlet 792 and allows air to flow into diffuser dome via diffuser inlet 794. Air then circulates within the diffuser dome 788 and over the LED. This helps agitate the originally stagnant air and reduce the convective thermal resistance within the lamp 780. As above, the lower edge of the diffuser dome 788 overlaps the heat sink fins 796 such that air can exit the diffuser dome 788 via the spacing between the heat sink fins 796. This allows the leaving air to agitate the originally stagnant air between the fins. As discussed above, in various embodiments, there may be many different inlet and outlet configurations that provide different air paths within the lamp or over different features of the lamp 154495.doc • 57· 201142198. The invention should not be limited to the air path shown in the above embodiments. As also discussed above, many different active cooling elements can be used in the lamp according to the invention. [0040] Figure 41 and Figure 41 show another embodiment of an active cooling element 800 comprising a film or diaphragm. Positive displacement pump. Cooling element 800 is not configured to move air by rotation (like a fan), but instead is configured to move air by vibration or movement of a diaphragm or membrane ("diaphragm") 8〇2. The lamp 8A includes a housing 8〇4, wherein the diaphragm 8〇2 covers the housing opening 8〇6. The housing can be made of a number of different materials, some of which comprise relatively low thermal conductivity materials such as plastic. As described further below, the upward movement of the diaphragm 8〇2 can cause air to move through the outer casing 804, which can be used to cool the lamp in accordance with the present invention. Diaphragm 802 can comprise a number of different elastomeric materials made from different organic and/or inorganic materials. The diaphragm 802 should be relatively soft and flexible and durable enough to withstand many of the four cycles of up and down. Many different materials, such as glue, can be used to mount the diaphragm over the housing opening 8〇6 or the membrane can be held in place by mechanical members such as facets, screws, nails, and the like. The membranes can also be mounted in a combination of such materials and methods for movement of a plurality of different mechanical and electromechanical methods and materials to actuate the opening of the membrane 8^. In an embodiment, the diaphragm 802 can cover a dust film of the top or bottom surface or all or part of both. The electric ## can be applied to the pressure-reducing amine "10" electric film, which can cause strain in the piezoelectric material and can deflect the diaphragm. The electric signal of different J-level is applied to the piezoelectric) 154495. Doc • 58- 201142198 Turning the electrical signal on or off can cause diaphragm 802 to vibrate or agitate. This action can in turn move air through housing 804, as described below. It should be understood that diaphragms made of different materials There may be different natural vibration frequencies, and in some embodiments 'the varying electrical signal applied to the piezoelectric film may cause the diaphragm 8〇2 to be at the natural frequency of the diaphragm or within the acceptable natural frequency range of the diaphragm. The frequency is vibrated. This allows air to move through the housing 804 in an efficient manner. It should be understood that many other methods can be used to cause vibration of the diaphragm 8 。 2. Electronic components disposed in the power supply unit of the lamp can be used. To generate the necessary electrical signals to be applied to the piezoelectric film. In still other embodiments, electronics separate from the power supply unit may be provided, or electronic components may be provided as part of the component 800. The component 800 is configurable There are different mechanisms that cooperate with the diaphragm 8〇2 to move the air in the desired direction. For the element 8〇〇, the desired air flow can be in the direction indicated by the arrow 808. The housing 8〇4 can be configured with a plurality of Valves that move air through the top air vent 810 and away from the top air vent 810 in the direction shown by arrow 808. Including the bottom air vent 812, in the illustrated embodiment, the bottom air vent 812 can be substantially parallel to the top air vent 81 The same size and alignment with the top air vent 810. It should be understood that in other embodiments, there may be a different number of top air holes 81 and bottom air holes 812, and the holes may have different sizes. In some embodiments, The same aligned top and bottom holes 810, 812 can result in reduced flow resistance of the air passing through the outer casing 8.4. Each of the top and bottom holes 81, 812 has its own one-way nozzle or 阙. 814, each of the nozzles or spaces of Yanhai allows only air to flow through its respective holes in the direction indicated by the arrow 154495.doc -59 · 201142198 head 808. When the diaphragm 8〇2 moves downward, Pressure in The accumulation in the outer casing 804, which in turn causes the valve 814 to close above the bottom aperture 812. This same pressure causes the valve 814 above the top aperture 81 打开 to open, allowing air to flow out of the top aperture 81 in the direction of arrow 808. As pressure builds up within the outer casing, air flows to the outside of the top hole 8. The pressure within the outer casing 8〇4 decreases as the diaphragm moves upward. This pressure reduces the valve 8丨4 above the top hole 810. The valve is closed and the valve above the bottom hole is opened. The reduced pressure in the outer casing 804 also causes air to flow into the outer casing via the bottom hole 812. Repeated up and down movement of the diaphragm 802 causes the valve 814 to repeatedly open and close, which is provided again. The overall component air flow in the direction of arrows 8〇8. Element 800 can be configured in many different locations in different lamps as described above. In some embodiments, as shown in Figures 28 and 29 and as described above, the fan can be configured to form a body with the heat sink of the lamp. The heat sink may be configured similarly to the heat sink 702 described above and may be in thermal contact with all or some of the elements of the lamp heat generating component to dissipate heat fins generated during operation to at least partially comprise a thermally conductive material and may be used Many different thermally conductive materials, including different metals (such as copper or aluminum) or metal alloys. The heat sink may also include heat sink fins 7A8 which increase the surface area of the heat sink to promote more efficient dissipation into the environment. The 70 piece 800 can be configured to move air across the heat sink and its fins to disturb or agitate the boundary air layer around the heat sink fins. This in turn allows colder air to displace the stagnant warmer air trapped in the space between the fins, thereby reducing the thermal resistance at the fins. This can cause heat to dissipate from the heat sink in a more efficient manner. In some embodiments, the top aperture 81 〇 154495.doc • 60· 201142198 of the component 8 can be sized and spaced to align with the opening between the heat sink fins when the component is mounted in the lamp. This alignment provides direct air flow between the fins, which can more effectively disturb the boundary air layer. In other embodiments, the component 800 can also be disposed within the lamp, with some embodiments being configured similar to the lamp 740 shown in Figures 36-38 and described above. Like internal fan 752, component 8A can be disposed within core 754 of heat sink 742. Similar to the action of fan 752 described above, element 800 can draw air from outside the lamp into the heat sink core and not into the diffuser cavity. Air is introduced through the fin core and diffuser cavity and out of the diffuser cavity' to provide the lamp air flow that carries the heat generated during operation and allows the lamp to operate at reduced temperatures. The heat sink can include different inlets configured in many different ways to allow air to enter the heat sink core while the component is in operation. As described above, air can be transferred from the phosphor carrier to the diffuser dome slot "air then circulates at least partially within the diffuser dome" and the empty fluorine can then pass over the heat sink fins to pass the diffuser cavity. This configuration provides for embedding component 800 in the heat sink cavity/core such that component 800 is not directly visible from the outside and component noise can be further reduced. This configuration also provides internal air flow to the lamp. As described above, different lamp embodiments can be configured to create many different air flow paths inside and outside the lamp. Although the invention has been described in detail with reference to a particular preferred embodiment of the invention, other forms are possible. Therefore, the spirit and scope of the present invention should not be limited to the types described above. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; Figure 2 shows a cross-sectional view of another embodiment of a prior art LED lamp; Figure 3 shows an A1 9 replacement bulb Figure 4 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 5 is a cross-sectional view of another embodiment of a lamp having a diffuser dome; Figure 6 is a perspective view of the lamp in accordance with the present invention; Figure 7 is a cross-sectional view of another embodiment of a lamp having a diffuser dome; Figure 8 is a perspective view of another embodiment of a lamp in accordance with the present invention. Fig. 9 is a cross-sectional view of the lamp shown in Fig. 8; Fig. 10 is an exploded view of the lamp shown in Fig. 8; Fig. 11 is a three-dimensional phosphor according to the present invention; Figure 1 is a cross-sectional view of another embodiment of a three-dimensional phosphor carrier in accordance with the present invention; Figure 13 is a cross-sectional view of another embodiment of a three-dimensional filler carrier in accordance with the present invention. Figure 14 is a three-dimensional phosphorescent light according to the present invention. Figure 15 is a perspective view of another embodiment of a lamp according to the present invention. The lamp has a two-dimensional phosphor carrier; Figure 16 is a cross-sectional view of the lamp shown in Figure 15. 154495.doc • 62· 201142198 FIG. 17 is an exploded view of the lamp shown in FIG. 15; FIG. 18 is a perspective view of an embodiment of a lamp according to the present invention, the lamp including a heat sink and a light source; A perspective view of the lamp of Fig. 42 having a dome shaped phosphor carrier; Fig. 20 is a side elevational view of one embodiment of a dome shaped diffuser in accordance with the present invention; and Fig. 21 is a circle shown in Fig. 44 having dimensions Figure 22 is a perspective view of another embodiment of a lamp according to the present invention having a three-dimensional phosphor carrier; Figure 23 is a cross-sectional view of the lamp shown in Figure 22; Figure 24 is an exploded view of the lamp shown in Figure 22; Figure 25 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; Figure 26 is a cross-sectional view of one embodiment of a collar cavity in accordance with the present invention; Figure 27 is a diagram showing the occupation of different features of an embodiment of a lamp in accordance with the present invention. Figure 28 is a perspective view of another embodiment of the lamp in accordance with the present invention; Figure 29 is a perspective exploded view of the lamp shown in Figure 28; Figure 30 is an embodiment of a lamp that can be used in accordance with the present invention. Figure 31 is a perspective view of the fan shown in Figure 3; Figure 32 is a top view of the fan shown in Figure 30; Figure 33 is a view showing the voltage of the fan applied to a particular heat sink A graph of the thermal resistance; 154495.doc * 63 - 201142198 Figure 34 is another graph showing the thermal resistance associated with the voltage applied to the fan of another heat pump; the heat of the lamp without the fan Figure 35 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 37 is a cross-sectional view of the lamp of Figure % taken along section line 37-37; Figure 37 is a cross-sectional view of the lamp shown in Figure 36, showing the air flow path of the lamp shown in Figure 36; Figure 39 is a cross-sectional view of still another embodiment of the lamp in accordance with the present invention; One embodiment of a film type or diaphragm type active cooling element Cross-sectional view; FIG. 41 and a plan view of an embodiment of a thin film type according to the present invention or a diaphragm one active cooling element. [Main component symbol description] 10 Typical LED package 11 wire bond 12 LED chip 13 Reflector cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 Conventional LED package 22 LED chip 154495.doc -64 - 201142198 23 Substrate or Sub-substrate 24 Metal reflector 25A Electrical trace 25B Electrical trace 26 Encapsulant 27 Wire bond 30 A19 size bulb 50 Lamp 52 Heat sink structure 53 Reflective layer 54 Optical cavity 56 Platform 58 Light source 60 Heat sink fins 62 Phosphor Body carrier 64 carrier layer 66 phosphor layer 70 first heat stream 72 second heat stream 74 third heat stream 76 dome shaped diffuser 210 lamp 212 fin structure 214 cavity 154495.doc -65- 201142198 216 platform 218 light source 220 phosphor carrier 222 Primary optics or 224 Single primary optics 300 Lamp 302 Optical cavity 304 Light source 305 Heat sink structure 306 Platform 308 Phosphor carrier 310 Formed diffuser dome 312 Threaded portion 320 Lamp 322 Optical cavity 324 Light source 325 Heat sink structure 326 Platform 328 Phosphor carrier 330 diffuser dome 332 threaded portion 340 lamp 342 optical cavity 344 light source 154495.doc -66- 201142198 345 heat sink structure 346 platform 348 phosphor carrier 350 diffuser dome 352 threaded portion 354 interface layer 355 hemispherical carrier 356 lining layer 357 three-dimensional phosphor carrier 358 bullet Shape carrier 359 phosphor layer 360 three-dimensional phosphor carrier 361 sphere shape carrier 362 phosphor layer 363 phosphor carrier 364 sphere shape carrier 365 narrow neck portion 366 phosphor layer 370 lamp 372 fin structure 374 optical cavity 376 light source 378 diffuser dome 380 thread Portion 154495.doc -67- 201142198 381 Enclosure 382 3D Phosphor Carrier 390 Lamp 392 LED Source 394 Heatsink 396 Dome-shaped Phosphor Carrier 398 Diffuser 410 Lamp 412 Phosphor Carrier 420 Lamp 422 Heatsink 424 Optical Cavity 426 Light Source 428 Phosphor carrier 430 diffuser dome 432 threaded portion 434 collar structure 440 illuminator footprint 442 phosphor carrier footprint 444 disperser footprint 700 lamps 702 heat sink 704 light emitting diode (LED) 706 pedestal 154495.doc - 68 - 201142198 708 Cooling fins 710 Base/slot 712 Bulb or diffuser dome 714 Fan 716 Rotor 718 Center mount 720 Bearing 722 Electric contact 730 Image 732 Light 734 Image 736 Lateral light 740 Light 742 Heat sink 743 Cooling fin 744 Light two Polar Body (LED) 746 Base/Slot 748 Phosphor Carrier 750 Diffuser Dome 752 Internal Fan 754 Core 756 Diffuser Cavity 758 Lower Heatsink Entry 760 Diffuser Cavity Entrance 154495.doc -69- 201142198 762 Phosphor Carrier imaginary line 764 imaginary line 766 slot 780 lamp 782 heat sink 784 light emitting diode (LED) 786 base / slot 788 diffuser dome 790 internal fan 792 lower heat sink inlet 794 diffuser inlet 796 heat sink fin 800 active Cooling element 802 diaphragm or film. 804 housing 806 housing opening 808 arrow 810 top air hole 812 bottom air hole D1 distance D2 distance 154495.doc -70-

Claims (1)

201142198 VII. Patent application scope: 1. A solid-state light source, comprising: a light-emitting diode (LED); a heat sink 'where the LED is in thermal contact with the heat sink; and a bulk diaphragm pump type cooling element A configuration is provided to reduce the convective thermal resistance of at least some of the light source elements. 2. The light source of claim 1, wherein the diaphragm cooling element is adjacent to the heat sink. 3. The light source of claim 1, wherein the diaphragm cooling element causes air to flow through one or more surfaces of the heat sink. 4. The source of claim 1 further comprising a diffuser dome on the heat sink and above the LED. 5. If the light source of the item ’, where the diaphragm cooling element is in the lamp assembly, is internal and draws ambient air inside the lamp. 6. The light source of claim 4, wherein the diaphragm cooling element is inside the heat sink and draws air into the heat sink and allows air to flow into the diffuser dome. 7. The light source of claim </ RTI> further comprising a phosphor carrier configured to cause at least some of the light from the LED to pass through the phosphor carrier. The light source of claim 1 further includes a base for connection to a power source. The light source further includes drive electronics integral with the base. 9. The light source of the kiss item 8 wherein the diaphragm cooling element is located between the base and the heat sink of 154495.doc 201142198. Ίο. 11. 12. 13. 14. 15. 16. A solid state lamp comprising: a plurality of light emitting diodes (LEDs); a heat sink 'configured relative to the LEds such that the LEds and the heat sink a sheet of thermal contact; and a diaphragm positive displacement pump cooling element integral with the lamp and configured to allow air to flow across the surface of the lamp to reduce convective thermal resistance at the surfaces. The lamp further includes a diffuser cavity above the LEDs, the diaphragm cooling element configured to allow air to flow into the diffuser cavity and allow air to exit the diffuser cavity. The lamp of claim 10, wherein the heat sink comprises heat sink fins, the film cold portion 7C moving air across the heat sink fins and moving therebetween. The lamp of claim 10, further comprising: a photo carrier disposed in the diffuser cavity above the LED, wherein the film cooling element causes air to flow into the phosphor carrier. A diaphragm pump type active cooling element, comprising: a housing opening, an outer casing having a film 'being above the opening of the housing and capable of vibrating; and a passage hole' allowing the air to vibrate in response to the vibration of the film Flowing through the outer casing in a preferred direction. Item 14 cold; gp element 'which further includes an air flow hole that allows air to flow into and out of the outer casing in response to vibration of the membrane. 154495.doc 201142198 check valve feature or asymmetrical geometry contained above the holes. 17. A solid state light comprising: a light emitting diode (LED); a heat sink 'relative to the LED Arranged to bring the LED into thermal contact with the heat sink; and: an active cooling element integral with the lamp and configured to allow air to flow across the surface of the lamp to reduce convection at the surfaces Resistor, wherein the lamp is mounted in an A19 size bulb. 18. A solid state lamp comprising: a light emitting diode (LED); a heat sink disposed relative to the LED such that the LED and the heat sink a sheet of thermal contact; and an active cooling element 'which is integral with the lamp and configured to allow air to flow across the surface of the lamp to reduce convective thermal resistance at the surface, wherein the lamp emission has a substantially omnidirectional emission The light of the pattern 19. The lamp of claim 18, wherein the emission pattern conforms to the omnidirectional emission criterion defined by Energy Star. 154495.doc