TW201144683A - Solid state lamp with thermal spreading elements and light directing optics - Google Patents

Abstract

Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern.

Description

201144683 VI. Description of the Invention: [Technical Field] The present invention relates to solid-state lamps and bulbs, and more particularly to efficient and reliable LED-based lamps and bulbs capable of producing an omnidirectional emission pattern . The present application claims the following claims: US Provisional Patent Application No. 61/339, No. 5, filed on March 3, 2010, and U.S. Provisional Patent Application No. 61/339, filed March 3, 2010 , No. 5 15; US Provisional Patent Application No. 61/386, 437, filed on September 24, 1 ;; US Provisional Application No. 61/424,665, filed on December 19, 2001; 2〇 US Provisional Application No. 61/424 67 曰, filed on December 19, 2010; US Provisional Patent Application No. 61/434,355, filed January 19, 2011; January 23, 2011 U.S. Provisional Patent Application No. 6/435,326, filed on Jan. 24, 2011, and U.S. Provisional Patent Application No. 61/435,759, filed Jan. This application is also a part of the following applications and claims the following applications: US Patent Application No. 12/848,825, filed August 2, 2010; US application filed on September 24, 2010 Patent Application Serial No. 12/889,719; and U.S. Patent Application Serial No. 12/975,820, filed on Dec. 22, 2010. [Prior Art] Incandescent lamps or bulbs or filament-based lamps or bulbs are commonly used as light sources for domestic and commercial installations. However, these lamps are extremely inefficient sources of light with up to 95% loss of input energy, primarily in the form of heat or infrared energy. A common alternative to incandescent lamps (the so-called compact fluorescent lamp I54492.doc 201144683 (CFL)) is more efficient in converting electricity to light but requires the use of toxic materials, which can cause chronic and acute Poisoned and can cause environmental pollution. One solution for improving the efficiency of a lamp or bulb is to use a solid state device such as a light emitting diode (LED) instead of a metal filament to produce light. Light-emitting diodes typically comprise one or more active layers of semiconductor material that are missing between layers of opposite doping type. When a bias voltage is applied to the doped layers, holes and electrons are injected into the active layer where they recombine to produce light. Light self-acting layers and emitting beta from each surface of the LED. In order to use LED wafers in circuits or other similar configurations, it is known to encapsulate LED wafers in a package to provide environmental and/or mechanical protection, color selection, light focusing and The similar package also includes electrical leads, contacts or traces for electrically connecting the LED package to an external circuit. In a typical LED package 1 illustrated in the figure, a single LED wafer 12 is mounted on the reflective cup 13 by means of solder bonding or conductive epoxy. One or more wire bonds 11 connect the ohmic contacts of the LED wafer 12 to wires 15A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflector cup can be filled with an encapsulant material 16, which can contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength can be absorbed by the light illuminator. The phosphor responsively emits light at the second wavelength. The entire assembly is then encapsulated in a clear protective resin 14 which can be molded into a lens shape to collimate light emitted from the LED wafer 12. Although the reflector cup 13 can direct light in the upward direction, when the light is reflected (ie, some of the light is attributed to the actual reflector surface by less than 1% of the reflectivity) 154492.doc 201144683 may be absorbed by the reflective cup ), optical loss can occur. Additionally, thermal stagnation can be a problem with packages such as package 10 shown in Figure 1, as it can be difficult to extract heat via wires 15 Α, 15 》. The conventional LED package 20 illustrated in Figure 2 may be more suitable for generating more High heat operation with high heat. In the 1 £1) package 20, one or more LEd wafers 22 are mounted to a carrier such as a printed circuit board (PCB) carrier, substrate or submount 23. A metal reflector mounted on the submount 23 surrounds the LED wafer 22 and reflects the light emitted by the LED wafer 22 to move the light away from the package. Reflector 24 also provides mechanical protection for LED wafer 22. One or more wire bond connectors 27 are formed between the ohmic contacts on the lED wafer 22 and the electrical traces 25A, 25B on the submount 23. Subsequent coverage of the mounted led wafer 22' encapsulant 26 with encapsulant 26 provides environmental and mechanical protection to the wafer while also acting as a lens. Metal reflector 24 is typically attached to the carrier by means of solder or epoxy bonding. The led wafer (such as the LED wafer found in the LED package 20 of Figure 2) can be coated by a conversion material comprising one or more phosphors, wherein the iso-optic body absorbs at least some of the LED light. The LED wafer can emit light of different wavelengths such that it emits a combination of light from the LED and the fill. LED wafers can be coated with phosphors in a number of different ways, one suitable method of which is described in U.S. Patent Application Serial No. 1 1/656,759, the entire disclosure of All are entitled "Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method". Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat the LEDs, a suitable EPD method described in 154 492. doc 201144683, to the US patent application entitled "Close Loop Electrophoretic Deposition of Semiconductor Devices" by Tarsa et al. In case No. 11/473,089. LED wafers with conversion materials in the vicinity or as direct coatings have been used in a variety of different packages, but encountered some limitations based on the structure of the device. When the phosphor material is on or near the LED epitaxial layer (and in some examples a conformal coating on the LED), the phosphor can directly withstand the heat generated by the wafer, which heat can increase the temperature of the phosphor material. Additionally, in such cases, the phosphor can be subjected to incident light from very high concentrations or fluxes of the LED. Since the conversion process is typically not 100% efficient, excess heat is generated in the phosphor layer that is proportional to the incident light flux. In a compact phosphor layer close to the LED wafer, this can result in an increase in the substantial temperature in the phosphor layer because a large amount of heat is generated in a small area. This increase in temperature can be exacerbated when the phosphor particles are embedded in a low thermal conductivity material, such as polyfluorene, which does not provide an effective dissipation path for the heat generated within the phosphor particles. These elevated operating temperatures can cause the phosphor and surrounding materials to degrade over time, as well as resulting in reduced phosphor conversion efficiency and shifting color conversion. Lamps that utilize solid state light sources (such as LEDs) in combination with LEDs or conversion materials at the distal end of the LED have also been developed. Such a configuration is disclosed in U.S. Patent No. 6,350,041 to the name of "High Output Radial Dispersing Lamp Using a Solid State Light Source" by Tarsa et al. The lamp described in this patent can include a solid state light source that transmits light through a splitter to a disperser having a phosphor. The disperser allows the light to be dispersed in a desired pattern and/or 154492.doc 201144683 or to change its color by converting at least some of the light to a different wavelength via a phosphor or other conversion material. In some embodiments, the separator separates the light source from the disperser a sufficient distance such that when the source carries the elevated current necessary for illumination in the room, heat from the source will not be transferred to the disperser. The additional distal phosphor technology is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. One potential disadvantage of having a remote phosphor lamp is that it can have undesirable visual or aesthetic characteristics. When the light does not produce light, the light can have a different surface color than the typical white or clear appearance of a standard Edison light bulb. In some examples, the lamp can have a yellow or orange appearance that is primarily produced by phosphor conversion materials such as yellow/green and red phosphors. This appearance can be considered undesirable for many applications where it can cause aesthetic problems with surrounding building elements when the lights are not illuminated. This can have a negative impact on the overall acceptance of these types of lamps by consumers. In addition, the distal phosphor configuration can be subject to insufficient thermal heat transfer compared to a conformal or adjacent phosphor configuration that can be conducted or dissipated through the nearby wafer or substrate surface during the conversion process. Dissipate the road. In the absence of an effective heat dissipation path, the thermally isolated distal phosphor can be subjected to elevated operating temperatures, which in some instances may even be higher than comparable conformal coated layers. The temperature in the middle. This situation can offset some or all of the benefits achieved by placing the phosphor at the distal end relative to the wafer. In other words, the placement of the phosphor at the distal end relative to the LED wafer can reduce or eliminate the direct heat generation of the constituting layer due to the heat generated within the LED wafer during operation, but the resulting temperament temperature reduction can be partially Or all 154492.doc 201144683 is offset by the heat generated in the phosphor layer itself during the light conversion process and the lack of a suitable thermal path to dissipate the heat generated thereby. Another problem with the implementation and acceptance of a lamp that utilizes a solid state light source is related to the nature of the light emitted by the source itself. In order to manufacture an effective lamp or bulb based on an LED source (and associated conversion layer), it is often desirable to place the LED wafer or package in a coplanar configuration. This facilitates manufacturing and can reduce manufacturing costs by allowing the use of conventional production equipment and processes. However, coplanar configurations of LED chips typically produce a forward light intensity profile (e.g., a Lambertian profile). Such beam profiles are generally undesirable in applications where solid state lights or light bulbs are intended to replace conventional lamps, such as conventional incandescent bulbs, which have a more omnidirectional beam pattern. While it is possible to mount an LED light source or package in a three-dimensional configuration, it is often difficult and cumbersome to manufacture such configurations. SUMMARY OF THE INVENTION The present invention provides a lamp and a light bulb that generally comprise different combinations and configurations of: a light source, or a plurality of wavelength converting materials, separately positioned relative to the light source or positioned at a distal end Multiple zones or layers, and a single diffusion layer. This configuration allows for the manufacture of efficient, reliable, and cost-effective lamps and bulbs. A substantially omnidirectional emission pattern can be provided even in the case of a light source consisting of a coplanar configuration of LEDs. The lamps in accordance with the present invention may also include thermal features that provide efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps may also include germanium to assist in the general orientation of the emission pattern from the LEDs (eg, & the illusion pattern to a more omnidirectional pattern of optical elements. 154492.doc 201144683 a solid state light in accordance with the present invention One embodiment includes an LED and an optical component over the LED such that light from the LED interacts with the optical component. The optical component changes the emission pattern of the LED to a wider emission pattern. The lamp also includes a phosphor carrier on the optical component, wherein the phosphor carrier converts at least some of the LED light into a different wavelength. Another embodiment of the solid state lamp according to the present invention comprises a heat The dissipating component 'haves a dielectric layer on the heat dissipating component. A heat dissipating substrate is included on the dielectric layer' and an LED is included on the heat dissipating substrate and is in thermal contact with the heat dissipating substrate. The heat dissipating substrate is configured to Dissipating the LED heat before the heat from the LED reaches the dielectric layer. A further embodiment of the solid state light according to the present invention includes a solid state illuminator array 'the solid state illuminator array according to a real a qualitatively directed emission pattern illuminates. A three-dimensional optical element is included on the solid state illuminator array, the optical element modifying the directional emission pattern of the solid state illuminator array to a more omnidirectional emission pattern. From the solid state illuminators The light emitting portion of the light is provided to the light emitting pattern. The present invention and other aspects and advantages will become apparent from the following detailed description and the accompanying drawings. Embodiments The present invention is directed to different embodiments of a lamp or bulb structure that are efficient, reliable, and cost effective, and in some embodiments may provide basic from a directional emission source such as a 'forward emitting source. Upper omnidirectional emission map 154492.doc -10- 201144683 The present invention is also directed to a lamp structure using a solid state illuminator and a distal conversion material (or phosphor) and a distal diffusing element or diffuser. In some embodiments, diffusion Not only to shield the phosphor from the light, but also to light from the source of the remote phosphor and/or lamp Dispersing or redistributing into a desired emission pattern. In some embodiments, the diffuser dome can be configured to disperse the emission pattern into a more omnidirectional pattern that can be used for general lighting applications. The diffuser can have a dimension of 6 and In an embodiment of the three-dimensionally shaped distal conversion material, there is a combination of features capable of converting a forward emission from an LED source into a beam profile comparable to a standard incandescent bulb. Reference herein is made to a conversion material, a wavelength converting material, a remote phosphor. The invention is described in terms of a body, a phosphorescent layer, and related terms. The use of such terms is not to be construed as limiting. It should be understood that the term distal phosphor, phosphor or phosphor layer is used to mean all The wavelength converting material is equally applicable to all wavelength converting materials. Some embodiments of the lamp may have a dome-shaped (or truncated spherical) two-dimensional conversion material above and spaced apart from the light source, and spaced from the conversion material. The dome-shaped diffuser, which is open and above the conversion material, causes the lamp to exhibit a double dome structure. The space between the various structures can include light mixing chambers that not only promote dispersion of lamp emission but also promote color uniformity. The space between the light source and the conversion material and the space between the conversion materials can serve as a light mixing chamber. Other embodiments may include additional conversion materials or diffusers that may form additional mixing chambers. The order of the dome conversion material and the dome shaped diffuser can be varied such that some embodiments can have a diffused interior within the conversion material while the space therebetween forms a light mixing chamber. These configurations are only roots 154492.doc 201144683 A few of the many different conversion materials and diffuser configurations in accordance with the present invention. Some lamp embodiments in accordance with the present invention may comprise a light source having a coplanar configuration of one or more LED wafers or packages, wherein the illuminators are mounted on a flat or planar surface. In other embodiments, the LED wafers may not be coplanar, such as attached to a pedestal or other three dimensional structure. Coplanar light sources can reduce the complexity of illuminator configurations' making them easier and less expensive to manufacture. However, coplanar light sources tend to illuminate primarily in the forward direction, such as in a Lambertian emission pattern. In various embodiments, it may be desirable to emit a light pattern that mimics the light pattern of a conventional incandescent light bulb, which is known to provide uniform emission intensity and color uniformity at different emission angles. Different embodiments of the present invention can include features that can transform the emission pattern from non-uniform to substantially uniform over a range of viewing angles. - Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that fit into a standard size bulb housing, such as the A19 size bulb housing 3 shown in Figure 3. This makes these lamps particularly useful as alternatives to conventional incandescent lamps or bulbs and fluorescent lamps or bulbs in which the lamp according to the present month enjoys reduced energy consumption and long life provided by its solid state light source. Lamps in accordance with the present invention may also accommodate other types of standard size carriages including, but not limited to, A21 and A23. The lamp has high efficiency and low manufacturing cost. The present invention includes an efficient heat dissipation system for laterally spreading heat from the LED wafer before it encounters any dielectric layer. This situation allows the LED to operate at lower temperatures. Thermally efficient heat dissipation systems - some embodiments may include many different elements 154492.doc 201144683 pieces configured in many different ways. Some embodiments include a heat sink substrate having a high thermal conductivity for dissipating heat from the LED wafer laterally prior to encountering any dielectric layer. The heat dissipation system can also include a dielectric layer mounted on a heat dissipating component such as a heat sink or heat pipe. By spreading the LED heat before it hits the dielectric layer, the effects of the thermal resistance of the dielectric layer are minimized. An optical component can be included that efficiently directs or reflects light from a plurality of coplanar LED wafers to a specified beam profile with minimal optical loss. A lamp according to the present invention can comprise one or more remotely located phosphors and/or diffusers that can be included over an optical component, wherein the phosphor carrier converts at least a portion of the light emitted by the (etc.) LED wafer Light into different wavelengths. The scale carrier can also be configured to minimize heating and saturation of the phosphor grains in the fill carrier. A diffuser can also be included over the phosphor carrier to further disperse the light into the desired emission pattern. In some embodiments, the light source can comprise a solid state light source, such as a different type of LED, LED wafer, or LED package. In some embodiments, a single LED wafer or package can be used, while in other embodiments, multiple LED wafers or packages can be configured in different types of arrays. By thermally isolating the phosphor from the LED wafer and having good heat dissipation, the LED wafer can be driven by a higher current level without detrimental effects on the conversion efficiency of the phosphor and its long-term reliability. This situation may allow over-excitation of the LED wafer to reduce the flexibility of the number of LEDs required to produce the desired luminous flux. This situation in turn reduces the cost of the complexity of the lamp. Such LED packages may include LEDs encapsulated by a material that can withstand elevated luminous flux or may include unencapsulated LEDs. The invention is described herein with reference to the particular embodiments thereof, but it is understood that the invention may be embodied in many different forms and should not be construed as being limited to the embodiments illustrated herein. In particular, the invention is described below with respect to certain lamps having one or more LED or LED wafers or LED packages in different configurations, but it should be understood that the invention is applicable to many other lamps having many different configurations. . An example of a different lamp that is configured in a different manner in accordance with the present invention is described in the following and is described in U.S. Provisional Patent Application Serial No. 61/435,759, the entire disclosure of which is incorporated herein by reference.

Lamp, filed on Jan. 24, 2011, incorporated herein by reference. Embodiments are described below with reference to one or more LEDs, but it should be understood that this is intended to encompass LED wafers and LED packages. The components can have different shapes and sizes than the shapes and sizes shown, and can include a different number of LEDs. It should also be understood that the embodiments described below utilize a coplanar light source 'but it should be understood' that non-coplanar light sources can also be used. It should also be understood that the LED light source of the lamp can include one or more LEDs, and in embodiments having more than one LED, the LEDs can have different emission wavelengths. Similarly, some LEDs may have a light-filling layer or zone adjacent or in contact, while other LEDs may have adjacent squama layers of different compositions or no light-filling layers at all. The invention is described herein with reference to a conversion material in which the scale layer and the spheroidal carrier and the diffuser are distal to each other. In this context, the distal ends are spaced apart from each other and/or are not in direct thermal contact. It will also be understood that when an element such as a layer, a region or a substrate is referred to as being "on" another element, it may be directly on the other element or may be intervening 154492.doc 201144683. In addition, terms such as "inside", "outside", "upper", "above", "below" and "below" are used herein to describe the relationship of one layer or another. It will be understood that these terms are intended to encompass the orientation of the drawings and the various orientations of the device. Although the terms 'first', etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections are not to be construed limit. The terms are only used to distinguish one element, component, region, layer or section from another. The first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention. Embodiments of the invention are described herein with reference to the cross- Thus, the actual thickness of the layers can be varied, and variations in shape relative to the description are contemplated due to, for example, manufacturing techniques and/or tolerances. The embodiments of the present invention should not be construed as being limited to the specific shapes & regions of the regions illustrated by t herein, but rather include the shape deviations resulting from the manufacture of (10) as). The regions illustrated or described as square or rectangular will be attributed. It is usually characterized by rounding or bending at normal manufacturing tolerances. The area illustrated in the figures is, therefore, in the nature of the invention, and is not intended to limit the scope of the invention. An efficient 'low cost LED based solid state light can be manufactured and produced based on the different embodiments of the invention described herein. An example that can be implemented by the present invention can be a large-scale replacement of a conventional tungsten-based omnidirectional bulb with a more efficient, longer-life LED-based lamp or bulb (also known as 154492.doc •15-201144683" A-Lamp") The general concepts and innovations described herein can also be applied to replacing various similar tungsten/telephone-based lamps or bulbs with corresponding LED-based lamps or bulbs. The invention is also directed to specific independent LED lamp related devices such as LED substrates and optical components. These devices may be provided to lamp designers and manufacturers for incorporation into many different lamp or bulb designs other than the ones described herein, such as lamps or lamps, where the lamps or bulbs are based Operate in the innovations described in the article. Combinations of different inventive features can also be provided as "light engines" that can be used in different lighting settings. For example, compact single-wafer lamps that provide LEDs, heat sink substrates, optional optical components, optional dielectric layers, and remote phosphor carriers are contemplated for inclusion in other lighting designs. In the tenth unit, all such components will operate in accordance with the innovations described herein. 4 shows an embodiment of a lamp 5A according to the present invention comprising a heat sink structure 52 having an optical cavity 54 having a platform 56 for holding a light source 58. While this and some embodiments have been described below with reference to optical cavities, it should be understood that many other embodiments without optical cavities may be provided. Such embodiments may include, but are not limited to, a light source on a planar surface of the lamp structure or on a pedestal. Light source 58 can include a number of different illuminators, with the embodiment shown including an LED. Many different commercially available LED wafers or LED packages can be used including, but not limited to, LED chips or LED packages available from Cree, Inc. of Durham, North Carolina. It will be appreciated that a lamp embodiment without an optical cavity can be provided in which the LEd is mounted in a different manner in these other embodiments. By way of example, the light source can be mounted to the flat surface of the lamp 154492.doc -16 - 201144683 surface or can provide a base for holding the led. The light source can be mounted to the platform 56 using a variety of known mounting methods and materials, wherein light from the source 58 is emitted from the top opening of the cavity 54. In some embodiments, the light source 58 can be mounted directly to the platform %, while in other embodiments, the light source can be included on a sub-substrate or printed circuit board (PCB), followed by the sub-substrate or printed circuit board (pCB) Installed to platform 56. The platform 56 and heat sink structure 52 can include conductive paths for applying electrical signals to the light source 58 wherein some of the conductive paths are conductive traces or wires. Portions of the platform 56 may also be made of a thermally conductive material, and in some embodiments, heat generated during operation may be spread to the platform and then spread to the fin structure. The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials can be used, including different metals (such as copper or aluminum) or metal alloys. Copper can have a thermal conductivity of up to 400 W/m-k or more. In some embodiments, the heat sink may comprise high purity aluminum, and the high purity aluminum may have a thermal conductivity of about 210 W/m-k at room temperature. In other implementations, the fin structure may comprise die cast aluminum having a thermal conductivity of about 200 W/m-k. The heat sink structure 52 may also include other heat dissipation features such as heat sink fins 6 , which increase the surface area of the heat sink to promote more efficient dissipation into the environment. In some embodiments, heat dissipation The fins 6 can be made of a material having a thermal conductivity higher than the remainder of the heat sink. In the illustrated embodiment, the fins 60 are shown in a generally horizontal orientation, but it should be understood that in other embodiments, the fins may have a vertical or angled orientation. In still other embodiments, the heat sink may comprise Active cooling elements (such as fans) to reduce convection within the lamp 154492.doc • 17· 201144683 thermal resistance. In some embodiments, the heat dissipation from the phosphor carrier is achieved via a combination of convective heat dissipation and conduction through the fin structure 52. The different heat dissipation configurations and configurations are described in U.S. Provisional Patent Application Serial No. 61/339,516, the entire disclosure of which is incorporated herein by reference. Inc. and incorporated herein by reference. The reflective layer 53 can also be included on the heat sink structure 52, such as on the surface of the optical cavity 54. In embodiments that do not have an optical cavity, a reflective layer around the source can be included. In some embodiments, the surface may be coated with a material having a reflectance of about 75% or more of the visible wavelength of the light emitted by the source 58 and/or the wavelength converting material, while in other implementations In one example, the material can have a reflectivity of about 85% or more for the light. In still other embodiments, the material can have a reflectivity of about 95% or greater for the light. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the fin structure may comprise features of the type for mounting in a conventional electrical socket. For example, the heat sink structure can include features for mounting to a standard threaded seat that can include a threaded portion that can be screwed into the threaded seat. In other embodiments, the heat sink structure may comprise a standard plug and the electrical socket may be a standard socket, or a heat sink, the structure may comprise a GU2U seat unit, or the heat sink structure may be a clip and the electrical socket may be a receiving and holding clip A socket for a piece (for example, as used in many fluorescent lamps). These are only those of the heat sink structure and socket options and can also be used to safely deliver electricity from the socket to the lamp 5〇. Others 154492.doc 201144683 Configuration The lamp according to the present invention may include a power supply or power Conversion unit 'The power supply or power conversion unit may include a driver to allow the light bulb to be powered by the AC line voltage/current and to provide light source dimming capability. In some embodiments, the power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp, and in some embodiments, the LED driver can comprise less than 25 cubic centimeters of volume, while in other embodiments, the LED driver can comprise a volume of about 2 cubic centimeters. In some embodiments, the power supply can be non-dimmable, but at a lower cost. It should be understood that the power supplies used may have different topologies or geometries and may also be dimmable. A phosphor carrier 62 is included over the top opening of the cavity 54 and includes a dome shaped diffuser 76 over the phosphor carrier 62. In the illustrated embodiment, the phosphor carrier covers the entire opening, and the cavity opening is shown as being circular and the phosphor carrier 62 is a disk. It should be understood that the cavity opening and the phosphor carrier can be of many different shapes and sizes. 4 It should be understood that the optical carrier (4) does not cover all of the cavity openings. As described further below, diffusion (d) is configured to disperse light from the phosphor carrier and/or LED into a desired lamp emission pattern, and can include many different shapes and sizes, depending on the light it receives and the desired lamp emission. Depending on the pattern. Embodiments of the optical carrier according to the present invention may be characterized as comprising a conversion material and a thermally conductive light transmissive material 'but it is understood that a non-conductive optical carrier may also be provided. The light transmissive material may be transparent to light emitted from the light (four), and the conversion material should be of a type that absorbs light from the same wavelength. In:: the light of the skin and the re-emission of the light, the heat-transmissive material 154492.doc 201144683 comprises a carrier layer 64, and the conversion material comprises a phosphor layer 66 on the phosphor carrier as follows Further described, various embodiments may include many different configurations of thermally conductive light transmissive materials and conversion materials. When light from source 58 is absorbed by the phosphor in phosphor layer 66, the light is re-emitted in an isotropic direction, with about 50% of the light being emitted forward and 50% being emitted back to cavity 54. in. A significant portion of the light that is emitted backwards in the previous LED with the conformal phosphor layer can be directed back into the LED and the likelihood of light escaping is limited by the extraction efficiency of the LED structure. The extraction efficiency for some LEDs can be about 7〇%, so a certain percentage of the light that is redirected back into the LED from the conversion material can be lost. In a lamp having a remote phosphor configuration in accordance with the present invention, the LED is located on the platform 56 at the bottom of the cavity 54. A higher percentage of the rearward phosphor light strikes the surface of the cavity rather than the LED. The surface coating with the reflective layer 53 increases the percentage of light that is reflected back to the scale layer 66 (at the scale layer 66 where light can be emitted from the lamp). This dedicated reflective layer 53 allows the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. In embodiments that do not have an optical cavity, a reflective layer around the LED can also be included. Carrier layer 64 may be made of many different materials having a thermal conductivity of 0.5 W/mk or more, such as quartz, tantalum carbide (Sic) (thermal conductivity 〜120 W/mk), glass (thermal conductivity) The rate is 1 (M.4 W/mk) or sapphire (thermal conductivity is ~40 W/m-kp. In other embodiments, carrier layer 64 may have a thermal conductivity greater than 1.0 W/mk' while in other implementations In an example, it may have a thermal conductivity of 154492.doc • 20·201144683 at 5.0 W/mk. In still other embodiments the carrier layer 64 may have a thermal conductivity greater than 10 W/mk. In some embodiments The carrier layer may have a thermal conductivity in the range of 1.4 W/m_k to 10 W/mk. The filler carrier may also have different thickness depending on the material used, wherein the thickness is in the range of 0·1 mm to 10 mm or more. It should be understood that other thicknesses may be used depending on the properties of the material used for the carrier layer. The material should be thick enough to provide sufficient lateral heat dissipation for specific operating conditions. In general, the thermal conductivity of the material is greater. High, the thinner the material may be, while still providing the necessary heat dissipation. Different factors can influence which carrier layer is used Materials, different factors including, but not limited to, cost and transparency to source light. Some materials may also be more suitable for larger diameters, such as glass or quartz. By forming a phosphor layer on a larger diameter carrier layer and then The carrier layer is singulated into smaller carrier layers. These materials can provide reduced manufacturing costs. 5 different fillers can be used in the fill layer 66, wherein the invention is particularly adapted to emit white light. As described above, in some embodiments, the light source 58 can be an LED-based light source and can emit light of a blue wavelength spectrum. The phosphor layer can absorb some blue light and re-emit yellow light. This situation allows the light to emit blue and yellow light. White light combination. In some embodiments, blue led light can be converted by a yellow conversion material using a commercially available YAG:Ce phosphor, but using a (Gd,Y)3(Al,Ga)5〇12:Ce system Conversion particles made of a disc (such as Y3Al5012:Ce(YAG)) may achieve a full range of broad yellow spectral emission. It can be used to produce white light when used with an illuminator based on blue-emitting LEDs. Other yellow phosphors include (but are not limited to

Tb3.xRExOI2: Ce(TAG); RE=Y, Gd, La, Lu; or 154492.doc •21 · 201144683

Sr2.x.yBaxCaySi〇4: Eu. The phosphor layer may also be provided with more than one phosphor, which is mixed in the phosphor layer 66 or as the second phosphor layer on the carrier layer 64. In some embodiments, each of the two phosphors can absorb the led light and can re-emit light of a different color. In such embodiments, the colors from the two phosphor layers can be combined for achieving a higher CRI white (warm white) with a different white hue. This situation may include light from the yellow phosphor that can be combined with light from the red phosphor. Different red phosphors can be used, including:

SrxCahSiEu, Y; Y=halide;

CaSiAlN3:Eu; or Sr2-yCaySi〇4:Eu. Other phosphors can be used to produce colored illumination by converting substantially all of the light into a particular color. For example, the following phosphors can be used to produce green light:

SrGa2S4: Eu;

Sr2-yBaySi〇4:Eu, or SrSi2〇2N2:Eu 一些 Some additional phosphors suitable for use as the conversion particles of the fill layer 66 are listed below, but other phosphors may be used. Each phosphor exhibits an excitation in the blue and/or UV luminescence spectrum 'provides a desired peak luminescence with efficient light conversion' and an acceptable Stokes shift: yellow/green 154492.doc -22· 201144683 (Sr, Ca, Ba) (Al, Ga) 2S4: Eu2+

Ba2(Mg,Zn)Si2〇7:Eu2+

Gd〇46Sr〇.3iAli23〇xFl.38:Eu 0.06 (Ba1.x.ySrxCay)Si04:Eu

Ba2Si04:Eu2+ • Lu3A15012 doped with C:e3 + doped with (Ca,Sr,Ba)Si202N2 CaSc2〇4:Ce3+ (Sr,Ba)2Si04:Eu2+ red

Lu203: Eu3 + (Sr2.xLax)(Ce1.xEux)04 Sr2Cei.xEux04 Sr2.xEuxCe04 SrTi03:Pr3 + ,Ga3+

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ can use different sizes of phosphor particles, including but not limited to particles ranging from 1 nanometer to 4 micrometers ((4) or 30 micrometers (four) or more). Smaller particle sizes are generally better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some implementations In the example, the phosphor can be provided in the binder (4) in the binder, and the phosphor can also have different concentrations or loads of the binder in the binder. J 54492.doc -23- 201144683. Typical concentration In the range of 30% by weight to 70% by weight, in one embodiment the 'phosphor concentration is about 65% by weight, and preferably evenly dispersed throughout the distal scale. The light blocking layer 66 can also have Different regions of different conversion materials and different concentrations of conversion materials. Different materials can be used for the adhesive, wherein the material is preferably strong after curing and substantially transparent in the visible wavelength spectrum. Suitable materials include polyoxyl, epoxy resin Glass, inorganic glass, dielectric, BCB, polyamide, polymer and their blends. The preferred material is polyfluorene (this is due to the high transparency and reliability of polyoxyl in high power LEDs). Suitable stupid and mercapto-based polyoxyl oxides are commercially available from Dow® Chemical. Many different curing methods can be used to cure the adhesive depending on various factors such as the type of adhesive used. Curing methods include, but are not limited to, thermal curing, ultraviolet (UV) curing, infrared (IR) curing, or air curing. Phosphor layer 66 can be applied using different processes including, but not limited to, spin coating, sputtering , printing, powder coating, electrophoretic deposition (EpD), electrostatic deposition, and others. As mentioned above, the carbon layer 66 can be coated with the binder material 'but it should be understood that no binder is required. In other implementations In an example, the phosphor layer 66 can be separately fabricated and then the phosphor layer 66 can be mounted to the carrier layer 64. In one embodiment, the phosphor-binder mixture can be sprayed or dispersed over the carrier layer 64, followed by The binder is cured to form a phosphor layer 66. In some of these embodiments, the phosphor-binder mixture can be sprayed, poured or dispersed onto or onto the heated carrier layer 64 to provide 154492. D〇< -24· 201144683 When the phosphor bond mixture is contacted with the carrier layer 64, heat from the carrier layer 64 is dispersed into the binder and the binder is cured. These processes may also include phosphor/binder mixtures. a solvent that liquefies the mixture and lowers the viscosity of the mixture, making the mixture more suitable for spraying. Many different solvents can be used including but not limited to toluene, stupid, zylene or from Dow Corning® is available in s_2〇 and can be used in different concentrations. When the solvent-phosphor/binder mixture is sprayed or dispersed on the heated carrier layer 64, the heat from the carrier layer 64 evaporates the solvent, wherein the temperature of the carrier layer affects the extent to which the solvent evaporates. The heat from the carrier layer 64 also cures the binder in the mixture leaving a fixed phosphor layer on the carrier layer. The carrier layer 64 can be heated to a number of different temperatures depending on the materials used and the desired solvent evaporation and adhesive cure speed. Suitable temperatures range from 9 (rc to 15 〇〇c, but it should be understood that other temperatures may be used. Various deposition methods and systems are described in D〇n〇fri〇 et al., entitled "Systems and Methods for Application of Optical US Patent Application Publication No. 2010/0155763, the entire disclosure of which is hereby incorporated by reference in its entirety in its entirety in its entirety in The germanium phosphor layer 66 can have a number of different thicknesses depending, at least in part, on the concentration of the phosphor material and the desired amount of light to be converted by the phosphor layer 66. The phosphor layer according to the present invention can be above a concentration level of 3% (phosphorescence) The body load can be applied. Other embodiments may have a concentration level above 5%, while in still other embodiments, the concentration level may be higher than 6%. In some embodiments 'Phosphorus 154492.doc -25- 201144683 The optical layer may have a thickness in the range of 10 microns to 100 microns, while in other embodiments, the phosphor layer may have a thickness in the range of 40 microns to 50 microns. The method described above may Used to coat multiple layers of the same or different phosphor materials and may be coated with different phosphor materials in different regions of the carrier layer using known masking processes. The methods described above provide for some sort of layer 66 Thickness control' but for even greater thickness control, known methods can be used to grind the fill layer to reduce the thickness of the light-guiding layer 66 or to level the thickness over the entire layer. This abrasive feature provides the added advantage of being able to produce A lamp that emits within a single sorting level on a CIE chromaticity diagram. Sorting is generally known in the art and is intended to ensure that the led or lamp provided to the end customer emits light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to in the art as sorting) by color or brightness. Each sorting level typically contains one color and Brightness group LEDs or lights, and are usually identified by a sorting level code. The white light emitting LEDs or lights can be classified by chromaticity (color) and luminous flux (brightness). Controlling the amount of source light converted by the phosphor layer provides greater control in producing a lamp that emits light within the target sorting level. A plurality of scale carriers 62 having a light layer 66 of the same thickness can be provided. By using light sources 58 having substantially the same illumination characteristics, lamps having nearly identical emission characteristics can be fabricated, which in some examples can fall within a single sorting level. In some embodiments, 'lights are self-contained. Within the standard deviation of the point on the CIE diagram, and in some embodiments 'the standard deviation contains less than 10 steps (1 〇 _step) Maca 154492.doc • 26· 201144683 when the ellipse (McAdams ellipse). In some embodiments, the illumination of the lamp belongs to a 'step size McAdam elliptical inner core centered around CIExy (0.3 I3, 0.323) which may be filled using different known methods or materials such as thermally conductive bonding materials or thermal grease. The light body carrier 62 is mounted and bonded over the opening in the cavity 54. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, a phosphor carrier can be mounted over the opening using a thermally conductive device such as a clamping mechanism, a screw or a thermal adhesive to hold the phosphor carrier 62 tightly to the heat sink structure such that Maximum thermal conductivity. In one embodiment, a thermal grease layer having a thickness of about 100 μηηη and a thermal conductivity of k = 0.2 w/m-k is used. This configuration provides an effective thermally conductive path for dissipating heat from the phosphor layer 66. As mentioned above, different lamp embodiments without cavities can be provided, and in addition to being above the opening of the cavity, the phosphor carrier can be mounted in many different ways. During operation of the lamp 50, phosphor conversion heating is concentrated in the phosphor layer 66, such as concentrated in the center of the phosphor layer 66, most of which strikes the phosphor carrier 62 at the center of the phosphor layer 66 and passes through the phosphor carrier 62. . The thermal conductivity of the carrier layer 64 causes the heat to spread laterally toward the edge of the phosphor carrier 62 as shown by the first heat flow. Heat is passed through the layer of thermal grease at the edges and into the fin structure 52, as shown by the second heat flow 72, in which heat can be efficiently dissipated into the environment. As discussed above, in the lamp 5, the platform 56 can be thermally coupled or coupled to the fin structure 52. This coupling configuration causes the phosphor carrier 62 to share at least a portion of the source 58 with a thermally conductive path for dissipating heat. I from the light source (10) through the flat 154492.doc • 27· 201144683 The heat of the stage 56 (as shown by the third heat flow 74) may also be distributed to the heat sink structure 52» from the light body body 62 into the heat sink structure 52. Heat can also flow into the platform 56. As further described below, in other embodiments, phosphor carrier 62 and light source 58 may have separate thermally conductive paths for dissipating heat, wherein such individual paths are referred to as "decoupled", as cited above by way of reference It is described in U.S. Provisional Patent Application Serial No. 61/339,516, the entire disclosure of which is incorporated herein. It should be understood that in addition to the embodiment shown in Figure 4, the optical carrier can be configured in many different ways. The phosphor layer can be on either surface of the carrier layer or can be mixed in the carrier layer. The phosphor support may also comprise a scattering layer which may be included on the phosphor layer or carrier layer or mixed in the phosphor layer or carrier layer. It should also be understood that the phosphor and scattering layer may not cover the entire surface of the carrier layer, and in some embodiments, the conversion layer and the scattering layer may have different concentrations in different regions. It should also be understood that the phosphor support may have surfaces of different roughness or shape to enhance transmission through the light carrier. As mentioned above, the diffuser is configured to disperse light from the phosphor carrier and LED into the desired lamp emission pattern and can have many different shapes and sizes. In some embodiments, the diffuser can also be disposed over the phosphor carrier to shield the phosphor carrier when the lamp is not emitting light. The diffuser can have a material to impart a substantially white appearance to impart a white appearance to the bulb when the lamp is not illuminated. A number of different diffusers having different shapes and attributes can be used with the lamp 50 and the lamps described below, such as the application entitled "LED Lamp With Remote 154492", filed on March 3, 2010, which is incorporated herein by reference. Doc ·28· 201144683

The lamps described in U.S. Provisional Patent Application Serial No. 51/339,515, the entire disclosure of which is incorporated herein by reference. U.S. Patent Application Serial No. 12/901,405, the entire disclosure of which is incorporated herein by reference. The inventive lamp can include many different features in addition to those described above. Referring again to Figure 4, in their lamp embodiment, the cavity 54 can be filled with a transparent thermally conductive material to further enhance the heat dissipation of the lamp. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. Heat from the source will still be conducted via the platform 56, but can also pass through the cavity material to the fin structure 52. The lower operating temperature of the source 58 will be allowed but pose an increased operating temperature for the phosphor carrier 62. This configuration can be used in many different embodiments, but is particularly suitable for use in comparison High light source operating temperature lamp (compared to the operating temperature of the phosphor carrier). This configuration allows for more efficient heat dissipation from the source in applications where additional heat can be applied to the scale carrier layer. As discussed above. Different lamp embodiments in accordance with the present invention may be configured with a number of different types of light sources. In the embodiment, a human LED may be used, which is connected in series to the circuit board by two wires. The wires are connected to the power supply unit described above. In other embodiments, more than eight or fewer LEDs may be used, and as mentioned above, may be purchased from Cree, Inc. LEDs, including eight red 8 154492.doc • 29- 201144683 XP-E LEDs or four XLamp® XP-G LEDs. Different single-string LED circuits are described in the following US patent applications: van de Ven et al. U.S. Patent Application Serial No. 12/566,195, entitled "Color Control of Single String Light Emitting Devices Having Single String Color Control" and van de Ven et al. entitled "Solid State"

U.S. Patent Application Serial No. 12/704,730, the disclosure of which is incorporated herein by reference. Figure 5 shows a further embodiment of a lamp 1 according to the present invention in which the lamp 1 is contained within an optical cavity 1〇2 within the heat sink structure 105. Similar to the above embodiment, a lampless cavity lamp 100 can also be provided, wherein the LED is mounted on the surface of the heat sink or mounted on a three-dimensional structure or a pedestal structure having a different shape. The light source 104 based on the planar LED is mounted to the platform 1 〇6, and the phosphor carrier 1〇8 is mounted to the top opening of the cavity 102, wherein the phosphor carrier 108 has any of the features described above. In the illustrated embodiment, the fill carrier 108 can be in the shape of a flat disk and comprise a thermally conductive transparent material and a phosphor layer. The phosphor carrier 108 can be mounted to the cavity by a thermally conductive material or device as described above. Cavity 102 can have a reflective surface to enhance emission efficiency, as described above. Light from source 104 passes through phosphor carrier 108, which is partially converted by the phosphor in phosphor carrier 108 into light of different wavelengths. In an embodiment, the light source 104 can comprise a blue light emitting LED, and the lithographic carrier 108 can comprise a yellow scale light 154492.doc -30- 201144683 body as described above, the yellow phosphor absorbing one portion of the blue light and re- Launch yellow light. Lamp 100 emits a combination of LED light and white phosphor of yellow phosphor light. Like the above, light source 104 can also include a plurality of different LEDs that emit light of different colors, and the optical carrier can include other walls to produce light having a desired color temperature and color rendering. The lamp 100 also includes a shaped diffuser dome ho mounted over the cavity 102, the diffuser dome no including diffusing or scattering particles such as the diffusing or scattering particles listed above. The scattering particles can be provided in a curable adhesive which is formed in a generally dome shape. In the illustrated embodiment, the dome 110 is mounted to the heat sink structure 1〇5 and has an enlarged portion at the end opposite the heat sink structure 105. Different binder materials such as polyoxin, epoxy, glass, inorganic glass, dielectric, BCB, polyamine, polymers, and mixtures thereof, as discussed above, can be used. In some embodiments, white scattering particles can be used for having a white dome that hides the color of the phosphor in the phosphor carrier 1〇8 in the optical cavity. This imparts a white appearance to the entire lamp 100, which is generally more visually acceptable to the consumer or more attractive to the consumer than the color of the scale. In an embodiment, the diffuser may comprise white oxidized crystal particles, and the white titanium dioxide particles may be imparted to the diffuser dome 11 . The overall white outer diffuser dome m may provide the following added advantages: the light emitted from the optical cavity is More uniform hook pattern distribution. As discussed above, light from a source in an optical cavity can be emitted in a substantially Lambertian pattern, and the shape of the dome (4) and the scattering properties of the scattering particles cause the light to emit in a more omnidirectional manner. J54492.doc 31 201144683 Launched from the dome. Engineered domes can have different concentrations of scattering particles in different zones or can be shaped into specific emission patterns. In some embodiments, including those described below, the dome can be engineered such that the emission pattern from the lamp follows the omnidirectional distribution criteria defined by the Energy Department (D〇E) Energy Star. One of the criteria met by the lamp herein is that the emission uniformity must be zero. To 135. Within 2% of the average value under review; and >5% of the total flux from the lamp must be at 135. To 180. The launch area is launched, and the measurement system is in the raft. 45. 9, 〇. Performed under azimuth. As mentioned above, the different lamp embodiments described herein may also include Type A trim LED bulbs that meet the d〇e ENERGY STAR® standard. The present invention provides an efficient, reliable, and cost effective lamp. In some embodiments, the entire lamp can include five components that can be assembled quickly and easily. Similar to the above embodiment, the lamp 100 can include a mounting mechanism H2 of the type installed in a conventional electrical outlet. In the illustrated embodiment the 'lamp 1' includes a threaded portion 112 for mounting to a standard threaded seat. Like the above embodiments, the lamp 100 can include a standard plug and the electrical socket can be a standard socket, or the electrical socket can include a GU24 base unit, or the lamp 100 can be a clip and the electrical socket can be a socket that receives and holds the clip ( For example, as used in many fluorescent lights). As mentioned above, the space between some of the features of the lamp 1 〇 0 can be used as a mixing chamber, wherein the space between the source 丨〇 6 and the phosphor carrier 包含 8 contains the first optical mixing cavity room. The chamber of the phosphor carrier 1〇8 and the diffuser 11〇 can include a -first-light chamber, wherein the mixing chamber promotes the color and intensity emission of the uniformity of the lamp. The same situation can be applied to the following 154492.doc • 32- 201144683 embodiments having different shapes (four) light body carriers and diffusers. In other embodiments, "an additional diffuser comprising an additional mixing chamber and or a phosphor carrier" and the diffuser and/or the phosphor carrier may be arranged in a different order. Different lamp embodiments according to the invention may have many Different shapes and sizes. Figure 6 shows another embodiment of a lamp 12 according to the present invention, the lamp (10) being similar to the lamp 1 and similarly comprising an optical cavity 122 in the heat sink structure 125, wherein the light source 124 is mounted to the optical The platform us in the cavity 122. Similar to the above heat sink structure, it is not necessary to have an optical cavity, and the & source can be provided on other structures than the loose track structure. Such structures may include an i-surface or base having a light source. The disk carrier 128 is mounted over the cavity opening by a thermal connector. The lamp 120 also includes a diffuser dome 130 mounted to the heat sink structure 125 above the optical cavity. The diffuser dome 110 described above is made of the same material, but in this embodiment, the dome 130 is elliptical or egg-shaped to provide a different lamp emission pattern while still obscuring from the phosphor carrier 128. Phosphor color. Please also note that the heat sink structure 125 and the platform 126 are thermally decoupled. That is, there is space between the platform 126 and the heat sink structure, so that the platform [μ and the heat sink structure are not shared for heat dissipation. The thermal path. As mentioned above, this situation provides improved heat dissipation from the phosphor carrier compared to a lamp that does not have a light path that resolves light. The lamp 120 also includes a mounting for the screw seat. Threaded portion 132. In the above embodiments the 'phosphor carrier is two-dimensional (or flat/planar) while the LEDs in the source are coplanar. However, it should be understood that in other lamps 154492.doc -33· 201144683

And when the light is re-emitted, there are several examples, but it should be understood that the phosphors carry the shape. As discussed above, when the filler is absorbed, it is emitted in an isotropic manner such that the three-dimensional phosphor carrier is used to convert light from the source and also to dissipate light from the source. Similar to the diffuser described above, differently shaped three-dimensional carrier layers can be illuminated in accordance with emission patterns having different characteristics, depending in part on the emission pattern of the source. The diffuser can then be matched to the emission of the phosphor carrier to provide the desired lamp emission pattern. Figure 7 shows a hemispherical shaped phosphor carrier 154, a phosphor carrier 154 comprising a hemispherical carrier 155 and a fill layer 156. The hemispherical carrier 155 can be made of the same material as the carrier layer described above, and the phosphor layer can be made of the same material as the phosphor layer described above, and the scattering particles can be included in the carrier and phosphorescent as described above. In the layer. In this embodiment, phosphor layer 156 is shown as being on the outer surface of carrier 155 'but it should be understood that the phosphor layer may be on the inner layer of the carrier, mixed with the carrier' or any combination of the three above. In some embodiments, having a phosphor layer on the outer surface minimizes emission losses. When the illuminator light is absorbed by the phosphor layer 156, the light system is emitted omnidirectionally, and some of the light can be emitted backwards and absorbed by a lamp element such as an LED. Phosphor layer 156 may also have a different index of refraction than hemispherical carrier 355 such that light emitted forward from the phosphor layer may be reflected back from the inner surface of carrier 355. This light can also be attributed to the loss of the light element 154492.doc -34- 201144683. In the case where the phosphor layer 156 is located on the outer surface of the carrier 155, the light emitted forward does not need to pass through the carrier 155 and will not be lost due to reflection. The light that is emitted backwards will hit the top of the carrier where at least some of the light will be reflected back. This configuration results in a reduction in light from the phosphor layer 156 that is emitted back into the carrier where it can be absorbed. Phosphor layer 156 can be deposited using many of the same methods described above. In some examples, the three-dimensional shape of the carrier 155 may require additional steps or other processes to provide the necessary coverage. In embodiments in which the solvent-phosphor-binder mixture is sprayed, the support can be heated as described above, and multiple nozzles may be required to provide the desired coverage (e.g., near uniform coverage) over the support. In other embodiments, fewer nozzles can be used while rotating the carrier to provide the desired coverage. Similar to the above, the heat from the carrier 1 55 evaporates the solvent and helps to cure the binder. In still other embodiments, the phosphor layer can be formed via an ink immersion process whereby a phosphor layer can be formed on the inner or outer surface of the carrier 155, but is particularly suitable for formation on the inner surface. The carrier 155 can be at least partially filled with a phosphor mixture adhered to the surface of the carrier, or otherwise contact the carrier 155 with the phosphor mixture. The mixture can then be discharged from the support to leave a layer of phosphor mixture on the surface which can then be cured. In one embodiment, the mixture may comprise polyethylene oxide (PE) and a phosphor. The support can be filled and then the support can be evacuated leaving a layer of PE〇-phosphor mixture which can then be thermally cured. The pE 〇 evaporates or is dissipated by heat, leaving a base layer of light. In some embodiments, a binder may be applied to further stabilize the phosphor layer </ RTI> 154492.doc - 35 - 201144683. In other embodiments, the phosphor may remain without the binder. Similar to the process for coating a planar carrier layer, such processes can be used in a three dimensional carrier to coat a plurality of optical layers that can have the same or different phosphor materials. The phosphor layer can also be applied to both the interior and exterior of the carrier and can be of different types having different thicknesses in different regions of the carrier. In still other embodiments, different processes may be used, such as coating the carrier with a sheet of squama material that may be thermally formed to the carrier. In a lamp utilizing the carrier 155, the illuminator can be disposed at the base of the carrier to cause light from the illuminator to be emitted upwardly and through the carrier 155. In some embodiments, the illuminator can illuminate in a substantially Lambertian pattern, and the carrier can help disperse the light in a more uniform pattern. Figure 8 shows another embodiment of a three-dimensional phosphor carrier 157 comprising a bullet-shaped carrier 158 and a phosphor layer 159 on the outer surface of the carrier, in accordance with the present invention. Carrier 158 and phosphor layer 159 can be formed from the same materials as described above using the same methods as described above. Different shaped phosphor carriers can be used with different illuminators to provide the desired overall lamp emission pattern. Figure 9 shows a further embodiment of a three-dimensional phosphor carrier 160 comprising a sphere-shaped carrier 161 and a phosphor layer 162 on the outer surface of the carrier, in accordance with the present invention. Carrier 161 and phosphor layer 162 can be formed from the same materials as described above using the same methods as described above. Figure 10 shows a phosphor carrier 163 according to still another embodiment of the present invention. The phosphor carrier 163 has a large spherical shape carrier 164 and a narrow neck portion 154492.doc • 36- 201144683 165 ° similar to the above embodiment 'phosphor carrier 163 includes a phosphor layer 166' on the outer surface of the carrier 164. The phosphor layer 166 is made of the same material as described above and is formed using the same method as described above. In some embodiments, a phosphor carrier having a shape similar to carrier 164 may be more efficient in converting illuminator light and re-emitting the Lambertian light from the source into a more uniform emission pattern. Figures U through 13 show another embodiment of a lamp i 7 according to the present invention having a heat sink structure 172, an optical cavity 174, a light source 176, a diffuser dome 178, and a threaded portion 180. This embodiment also includes a three-dimensional carbon support 182'. The two-dimensional spheroidal carrier 182 comprises a thermally conductive transparent material and a phosphor layer. The three-dimensional phosphor carrier 182 is also mounted to the heat sink structure 172 by a thermal connector. However, in this embodiment, the phosphor carrier 182 is hemispherical in shape, and the illuminator is configured such that light from the source passes through the phosphor carrier 182 where at least some of the light is converted. The three-dimensional shape of the phosphor carrier 182 provides a natural separation between the phosphor carrier ι82 and the light source 176. Therefore, the light source 176 is not mounted in the recess formed in the heat sink of the optical cavity. In other words, the light source 176 is mounted on the top surface of the heat sink structure 172, wherein the optical cavity 174 is formed by the space between the phosphor carrier ι82 and the top of the heat sink structure 172. This configuration may allow for less Lambertian emissions from the optical cavity 174 because there is no side of the optical cavity that blocks or redirects lateral emissions. In the embodiment of lamp 170, a blue LED for source 176 and a combination of yellow and red phosphors in the phosphor carrier are utilized. This situation may result in the phosphor carrier 182 being yellow or orange, and the diffuser dome 178 obscuring the 154492.doc -37-201144683 color while dispersing the light into the desired emission pattern. The conduction path for the platform in the lamp i7〇 is combined with the conduction path for the heat sink structure, but in other embodiments, the conduction path for the platform and the conduction path for the heat sink structure are solvable. surface. The figure shows an embodiment of a lamp 9 9 according to the invention, the lamp just comprising eight LED light sources 192 as described above on the heat sink 194. The illuminators can comprise a number of different types of LEDs, Different types of LEDs can be coupled together in different ways in the midnight and in series in the illustrated embodiment. In other embodiments, the LEDs can be interconnected in different series and parallel interconnect combinations. Please note that in this embodiment, the illuminator is not mounted in the optical cavity, but instead is mounted on the top planar surface of the heat sink 194. Figure 15 shows the lamp 190 shown in Figure 14, wherein the dome is filled Light carrier 196 is mounted over light source 192 as shown in Figure 14. Lamp 190 shown in Figure 15 can be combined with diffuser 198 (as described above) to form a lamp having dispersed light emission. The lamp according to the present invention may also include a heat dissipation feature to allow the LED to operate at a lower temperature and include an optical element to change the emission pattern of the lEE wafer to the desired emission pattern. In some embodiments, the emission Pattern can contain The substantially omnidirectional emission pattern. Figures 16 through 18 show another embodiment of a lamp 200 according to the present invention having a heat sink structure 2, a light source 204, a phosphor carrier 206, and a threaded portion 208' The phosphor carrier is three-dimensional and may comprise a thermally conductive transparent material and a layer of phosphor material (as described above, the phosphor carrier is also suitably mounted to the heat sink structure 202 by a thermal joint. 154492.doc • 38· 201144683 Light source 204 includes one or more LED wafers mounted on the top surface of the heat sink structure. It should be understood that the lamp according to the present invention may also include other heat losses than heat sinks (such as heat pipes). The light element 200 also includes a laterally dissipating heat dissipation structure 21〇 under the LED to provide improved thermal management of the heat generated by the LED. In conventional lamp configurations, the LED can be worn on a dielectric substrate (such as , A12〇3), and the heat from it may encounter a thermal resistance dielectric material before there is a chance to spread laterally. The different dissipative structures according to the present invention are configured such that the heat from the coffee is before the thermal resistance dielectric material is encountered. on Figure 19 shows an embodiment of a heat dissipation structure 210 in accordance with the present invention. The heat dissipation structure 210 includes a relatively thick thermally conductive heat sink substrate 212 and a dielectric layer 214 in thermal contact with the heat sink 2A2. One or more of the led wafers 216 may be mounted directly to the heat sink substrate 212 by a thermally conductive material such as 'solder 218. This situation results in the absence of dielectric between the LED wafer 216 and the heat sink substrate 212. The effect of the thermal resistance of the dielectric layer 214 is reduced by the heat of the LED 216 before it hits the dielectric layer, and the heat is more efficiently distributed from the LED 216 8&amp; is placed in close proximity to the The enhanced heat dissipation is provided at the led wafer and minimizes the total number of thermal resistance (eg, dielectric) layers between the led wafer and the heat sink 2〇2. The heat sink substrate 212 can comprise a number of different thermally conductive materials. In some embodiments, the heat sink substrate can comprise a metal such as copper, while in other embodiments the substrate 212 can comprise copper of gold. In still other embodiments, the substrate 2i2 may comprise other thermally conductive materials, such as other gold f substrates, which may be provided in a number of different thicknesses, wherein a suitable thickness is provided for efficient heat from the (e.g.) led 216 154492.doc -39- 201144683 And the thermal conductivity spread laterally. In some embodiments, the thickness of the substrate 212 can range from about 〇5 mm to about 1 mm, while in other embodiments the thickness can range from 0.5 mm to 2 mm. As mentioned above, the substrate 212 should be in intimate thermal contact with the (etc.) LED 216. In some embodiments, conventional lead-free solders can be used (such as,

The (etc.) LED is soldered to the heat dissipation substrate 212 by SnAgCu or AuSn). The dielectric layer in accordance with the present invention should have suitable thermal conductivity and electrical breakdown resistance to allow heat to pass between the heat sink substrate 212 and the heat sink 202 to allow heat to be efficiently dissipated to the surrounding environment while still Provide the required electrical insulation. In some embodiments, the system includes a single dielectric layer. In some embodiments, dielectric layer 214 can be bonded directly to heat sink substrate 212, while in other embodiments, dielectric layer 214 can be bonded directly to the heat sink. FIG. 20 shows an embodiment of an LED (or LED wafer) 216 that is directly bonded to a heat sink substrate 212. Bonding the dielectric layer to the heat sink elements allows for the additional advantage of extending the dielectric layer 214 beyond the boundaries of the heat sink substrate 212 and surrounding the boundaries of the heat sink substrate 212. This situation in turn minimizes the electrical breakdown path along the edge of the heat sink substrate 212 at the boundary. This configuration can include a simple and cost effective structure that provides stacked LEDs 216, solder 218, heat sink substrate 212, dielectric layer 214, and heat sink 202 in a r-clip design. This situation allows the heat generated by the LEDs 216 to be significantly laterally spread to the heat sink substrate 212 prior to spreading to the dielectric layer, and thereby significantly reducing the thermal resistance between the LEDs 216 and the heat sink 202 or the environment. This situation allows for a reduced LED operating temperature at a given operating current, resulting in improved efficiency (efficiency) and reliability while simplifying manufacturing assembly and reducing the cost of 154492.doc -40 - 201144683. This situation provides an improvement over current technology, which typically requires multiple dielectric layers to provide electrical isolation between the LED die and the heat sink. Referring again to Figures 16-18, the lamp 2A can also include an optical component 220 that is configured to direct light from a single Led wafer or plurality of LED wafers into a desired output beam profile. The optical element can be made of a material and can have a shape that allows for efficient change of the emission profile at the expense of minimal light loss. In a preferred embodiment, the optical element can comprise a number of different clear optical materials such as acrylics, polycarbonates, polyoxyxides, glass, ring thinner polymers (such as Zeonex® available from Zeon Corporation) And the available Apei and Topas(g)). Optical element 220 can be configured to at least partially change an emission pattern from the (e) Led to a desired lamp emission pattern. The optical element can be partially or completely changed to the desired emission pattern. In embodiments in which the optical element 220 partially alters the emission pattern, the lamp may utilize a phosphor carrier and/or a diffuser to pattern the remainder of the pattern change. It will be understood that the optical element can have many different shapes and sizes depending on the LED light source emission pattern and the desired lamp emission pattern, and in many embodiments, the optical element comprises a three dimensional (i.e., 'non-planar) shape. Referring now to Figures 21 through 24, one embodiment of optical component 220 includes a curved conical or mushroom shape. The lower portion 2 2 2 may have a curved section 2 2 4 that is sized to fit over the lens of the LED wafer with less or no air gap (best shown in Figure 24). in). This situation helps direct the LED light and collimate the LED light such that light enters the optical element 220. Due to the directionality of light emission from conventional LEDs (e.g., Lambertian), it is challenging to omnidirectional lamp emission from a coplanar LED source to 154492.doc 41 201144683. However, 'comparing to a non-coplanar configuration' coplanar source provides improved thermal management and simplified manufacturing. Optical element 220 can be made of the materials listed above. Total internal reflection (TIR) can be utilized to direct light from coplanar LEDs into a more omnidirectional pattern. The desired beam pattern can be achieved while maintaining the simplicity and performance of the coplanar LED configuration. The optical elements also provide a uniform distribution of light into the distal phosphor or scattering layer, allowing for further improvements in efficiency and high color uniformity of the emitted beam. Figure 25 shows optical element 220 in which the ray traces show how the directional emission of the LED can be changed to a more omnidirectional emission. Light from the LED wafer is coupled to an optical component as described above, wherein one of the LED lights is partially guided along the optical element by TIR bonding. This guided light can be emitted from the optical element 220 from the side emitting surface 226 to provide more than about 7 〇. Or 70. One of the above broad beam patterns. In other embodiments, the emission pattern can exceed about 8 〇. Or 8〇. Above, and in still other embodiments, the emission pattern may exceed 90. Or 9〇. the above. Side 226 may be at a number of different angles depending on the desired angle of emission of light from side 226. In the illustrated embodiment, the side 226 is slightly inclined downwardly, but it should be understood that the surface may be at other angles or perpendicular. A portion of the LED light may also escape from the top surface of the optical element from the top curved surface 228 of the optical component (best shown in Figures 24 and 25) toward the top of the lamp to provide for transmission in addition to the emission from the emitting surface 226. Additional launch. The amount of light escaping may depend on various factors, such as the curvature of the upper curved surface 228 and the material comprising the optical element 22A. This escape light contributes to the overall lamp emission pattern of 154492.doc • 42· 201144683, especially in embodiments where a more omnidirectional emission pattern is emitted. In the illustrated embodiment, the optical element directs light from four LEDs 'but it should be understood' that other embodiments may utilize a single led or multiple LEDs with an optical component to disperse the light from [ED into desired Beam pattern. Referring again to FIGS. 16-18, and as mentioned above, the lamp 2 can also include a distal photo-body carrier 206'. The distal phosphor carrier 206 can have features similar to those described above and materials and material. In other embodiments, the lamp 200 can also include a diffuser, as also described above. By separating the phosphor material from the LED by disposing the phosphor in the remote phosphor carrier, improvement in light conversion efficiency and color uniformity can be obtained. For example, this configuration allows for the use of more dispersed or leaner phosphor concentrations, thereby reducing localized heating of the phosphor particles. This reduces the effect of heat on the efficiency of the phosphor particles. The phosphor carrier 206 can comprise a thermally conductive material as described above to allow heat generated by the photoconversion process to flow efficiently from the phosphor material to the surrounding environment or to the heat sink 202. By shaping the phosphor carrier 206 into a three-dimensional dome shape and illuminating the phosphor carrier with, for example, blue light from the LED 216 via the optical element, it is possible to ensure that each light emitted from the LED has a pass through the phosphor carrier. The almost identical path length of 206. The probability of light conversion by the phosphor material in the phosphor carrier 2〇6 is substantially proportional to the path length of the light passing through the phosphor material (assuming a substantially uniform phosphor concentration), by direct LED light A uniform color emission over a wide beam angle range is achieved with the mixture of down-converted LED light. Another advantage of a lamp arrangement having an optical element 220 and a phosphor carrier 206 (or scattering layer) at the distal end in accordance with the present invention is that the configuration is used to reduce during operation of the lamp 200. The amount of light absorbed, thereby increasing the overall performance of the lamp 200. In a typical LED lamp with one or more phosphors combined with an LED, the phosphor is located in close proximity to the LED wafer. Thus, a significant portion of the light emitted by or scattered by the phosphor is directed back toward the LED wafer and/or other absorbing surfaces surrounding the wafer. This situation can result in light absorption and loss of light at such surfaces. The lamp embodiment described herein can reduce this loss of light because the light emitted or scattered by the remote phosphor carrier 206 (or diffuser) has reduced exposure to or near the surface of the LED wafer. Opportunity (due to the optical design of the optical component). In some embodiments, a low loss scattering or reflective material can be placed on the inner surface of the lamp 2, such as the surface of the dielectric layer or heat sink, to further limit the emission to the remote phosphor carrier or Absorption of scattered light. The lamp 200 shown in Figures 16-18 includes a simple and inexpensive configuration&apos; that is used to achieve physical and thermal contact between the heat sink substrate 212 and the heat sink 202. Optical element 220 can include a central opening or aperture 232 through which a fastener or clamp connector (such as a screw or clip) 234 can be attached and mounted to heat sink 202. The connector 234 can be used to "snap" or press the optical component 220, the heat sink substrate 212, the dielectric layer 214, and the heat sink 202 together. This is used to attach the portions of the lamp 200 together and to press the heat sink substrate 212 to the heat sink 2〇2 (with the dielectric layer therebetween). This situation eliminates the need for additional cost, manufacturing complexity of the adhesive or solder joint between these components, and can inhibit the heat flow between the 154492.doc •44·201144683 LED wafer 216 and the environment. Another advantage of this configuration is that it allows the lamp to be "backed up" during manufacture by allowing easy removal of the defective lamp assembly without compromising the risk of surrounding components. This feature can also provide a reduction in the cost of life because it can be used without replacing the entire lamp assembly housing, etc., which typically has a very long life (bottom (4) and replacement of faulty components (such as 'LED package assemblies). In addition, this component-based assembly can help reduce manufacturing costs by simply replacing the bulb housing/phosphor carrier to achieve a different color point of the lamp', allowing the remainder of the assembly to be spanned across the color point. Uniform manufacturing. As an added benefit, customers can be provided with multiple bulb housings with different phosphor combinations to allow customers to make flexible in-service changes to the color/hue of the lamp. The optical elements can be configured in a number of different ways in accordance with the present invention. The optical elements can have many different shapes, made of many different materials, and can have many different properties. Figures 26-29 show optical elements in accordance with the present invention. Another embodiment of 250 'optical element 250 can utilize mirror and/or scatter reflection to redirect light from the LED source to Beam angle or preferred direction. Optical element 250 is generally flower shaped and is particularly suitable for redirecting light from coplanar solid state light sources, such as coplanar LEDs. Optical elements include a narrow bottom mountable to a coplanar source Or stem segment 252. In the embodiment shown, the bottom section comprises a hollow section, but it should be understood that the 'bottom section can comprise many different shapes and may not be hollow. 154492.doc -45- 201144683 Containing an upper reflective segment 254 with an upper reflective segment 254 along the edge

The optical element moves up and unfolds from the bottom section 252. The upper section 254 includes a series of reflective vanes or lobes 256 over the LEDs 258 (best shown in Figure 28) such that light from the LEDs 25 8 strikes the bottom surface of the blades 25 6 and is reflected. In the illustrated embodiment, the width of the blade 256 increases as it moves up the optical element 250 to reflect more LED light at the top, but it should be understood that in other embodiments, the second blade may follow It is also understood that the shifting along the optical element has the same or reduced width. It is also understood that different ones of the blades may have different widths or may have a width that increases or decreases in different ways as moving up the optical element. The reflection of the LED light from the blade 256 helps to disperse the light from the LED 258 into the desired emission pattern. The blades 256 can be angled or curved from the bottom section and the blades can have different bends or angles depending on the pattern to be emitted. Different bends or angles may exist in different portions of the blade 256, and different ones of the blades may have different angles and bends. Referring now to Figure 28, a blade 260 having an increased curvature is shown in which the increased curvature results in a higher beam angle reflection. The light reflected from the 咼 curvature blade 260 is more emitted upwards downward. This situation can result in an overall lamp emission in which one portion of the emission is at a higher beam angle, which is particularly useful in embodiments that require omnidirectional emission (e.g., Energy Star® emission). There may also be a space 262 between the vanes 256 that allows light from the LEDs 258 to pass. Light from the blades 256 can provide forward light from the led, which can also be used in embodiments requiring omnidirectional emission. Different embodiments may have different numbers of 154492.doc -46 - 201144683 mesh and size 256 and space 262 depending on the pattern to be emitted. In some embodiments, the space 262 between the vanes 256 can include a conversion or disperser material that can convert or disperse the LED light as it passes through the space. Optical article 250 can provide particular advantages because the dispersing element can be lightweight and inexpensively fabricated from s or angled or reflective polymeric elements. In other embodiments, optical component 250 can comprise only reflective paper or plastic. In addition, by relying on specular and/or scatter reflections, the size of the component can be reduced relative to components utilizing TIR, since the TIR surface can only be reflected up to a difference between the refractive index of the component and the surrounding environment. ^The incident light of the angle. It should be understood that the specular and/or scattering optical elements can have many different shapes and sizes and can be configured in many different ways. In some embodiments, the spaces between the blades may comprise different shapes such as holes or slots, and the spaces may be located at a number of different locations. It should also be understood that in addition to being mounted to the light source, the optical components can be mounted in the lamp in a number of different ways. In some embodiments, the photonic element can be mounted to a disc carrier or diffuser. Other optical component embodiments may include a combination of TIR, specular reflection, and scattering to achieve desired beam dispersion. As with the optical components shown in Figures 21 through 25 and described above, the optical component 25 can be used in a lamp that also includes the optical carrier 2 (best shown in Figure 28). The disc carrier 264 can have the same features as those described above and can be made of the same material. The phosphor carrier can have a dome shape over the optical element 25 and the coffee (5), and 154492.doc -47 - 201144683 has 3 conversion material such as a phosphor that converts at least a portion of the LED light passing therethrough . The phosphor carrier 264 can also disperse light, thereby eliminating variations in the emission intensity due to the blocked or reflected light from the optical element 25 〇. Other embodiments may also include a diffuser (not shown) over the phosphor carrier to further disperse the light into a pattern to be emitted. The diffuser can have the same features as the diffuser described above and can be made of the same material as the diffuser described above. LED arrays in accordance with the present invention can be coupled together in a number of different series and parallel combinations. In an embodiment, the red LEDs and the blue LEDs may be interconnected in different groups, which may include various serial and parallel combinations of their own. By having separate strings, the current applied to each string can be controlled to produce the desired lamp color temperature (such as 3000 κ). Figure 28 and Figure 29 show three red LEDs and five blue (450 nm) LEDs. Performance Characteristics of LED Arrays 0 Some LED lamps according to the present invention may have a correlated color temperature (CCT) from about 12 〇〇 to 3500 K, where the color rendering index is 80 or more. Other Lamp Embodiments can emit light having the following luminous intensity distribution from the top of the lamp: between 0° and 150. The variation within the range is not more than 10%. In other embodiments, the lamp can emit light having a distribution of luminous intensity: at 〇. As for 35. The change within the range is not more than 20%. In some embodiments, at least 5% of the total flux from the lamp is at 135. To 180. In the district. Other embodiments may emit light having the following intensity distribution: at zero. To 120. The change within the range is not more than 30%. In some embodiments, the LED lamp has a color space uniformity such that the chromaticity self-weighted average point varies by no more than 0.004 as the viewing angle changes. Other 154492.doc • 48- 201144683 The lamp can conform to a 60 watt incandescent replacement bulb Operating requirements for luminous efficacy, color space uniformity, light distribution, color rendering index, size, and base type. In some embodiments, a lamp in accordance with the present invention can emit light having a high color rendering index (CRI) such as 8 〇 or higher. In some other embodiments, the light can emit light having a CRI of 90 or greater. The lamp can also produce light with a correlated color temperature (CCT) from 2500 K to 3 500 K. In other embodiments, the light may have a CCT from 2700 K to 3300 K. In still other embodiments, the light may have a CCT from about 2725 K to about 3045 K. In some embodiments, the light can have a CCT of about 2700 K or about 3000 K. In still other embodiments of light tunable, the CCT can be reduced by dimming. Under this condition, the CCT can be reduced to as low as 1500 κ or even 1200 K. In some embodiments, it may be increased by dimming depending on the embodiment, and other output spectral characteristics may be changed based on the S-circumferential light. Although the invention has been described in detail with reference to a particular preferred embodiment of the invention, other forms are possible. Therefore, the spirit and scope of the present invention should not be limited to the types described above. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; Figure 2 shows a cross-sectional view of another embodiment of a prior art LED lamp; Figure 3 shows the size specification of the A19 replacement lamp; Figure 5 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 6 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; 154492.doc -49 Figure 7 to Figure 1 is a cross-sectional view of a different embodiment of a phosphor carrier in accordance with the present invention; Figure 11 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 12 is a lamp shown in Figure 11 Figure 13 is an exploded view of the lamp shown in Figure 11; Figure 14 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 15 is a perspective view of the lamp of Figure 14 with a phosphor carrier Figure 16 is a perspective view of another embodiment of the lamp in accordance with the present invention; Figure 17 is a cross-sectional view of the top portion of the lamp shown in Figure 16; Figure 18 is an exploded view of the lamp shown in Figure 16; 19 is a system of an embodiment of a dielectric substrate and a heat sink according to the present invention Figure 20 is a perspective view of an embodiment of an LED wafer on a metal substrate in accordance with the present invention; Figure 21 is a perspective view of one embodiment of an optical component in accordance with the present invention; Figure 22 is a view of Figure 21 Figure 23 is a side view of the optical element shown in Figure 21; Figure 24 is a cross-sectional view of the optical element shown in Figure 21; Figure 25 is a side view of the optical element in accordance with the present invention, Figure 26 is a perspective view of another embodiment of an optical component in accordance with the present invention; Figure 27 is a plan view of the optical component shown in Figure 26; and Figure 28 is a lamp in accordance with the present invention; A side view of another embodiment. [Main component symbol description] 154492.doc -50· 201144683 10 Typical light-emitting diode (LED) package 11 wire bond 12 LED chip 13 Reflector cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 LED package 22 LED Wafer 23 Sub-substrate 24 Metal Reflector 25A Electrical Trace 25B Electrical Trace 27 Wire Bonding Connector 30 A19 Size Bulb Shell 50 Lamp 52 Heat Sink Structure 53 Reflective Layer 54 Optical Cavity 56 Platform 58 Light Source 60 Heat Sink 62 Phosphor Carrier 154492.doc -51 · 201144683 64 Carrier layer 66 Phosphor layer 70 First heat flow 72 Second heat flow 74 Third heat flow 76 Dome diffuser 100 Lamp 102 Optical cavity 104 Light source 105 Heat sink structure 106 Platform 108 Phosphor carrier 110 Forming Diffuser dome 112 mounting mechanism / threaded portion 120 lamp 122 optical cavity 124 light source 125 fin structure 126 platform 128 phosphor carrier 130 diffuser dome 132 threaded portion 154 phosphor carrier 155 hemispherical carrier 154492.doc -52- 201144683 156 157 158 159 160 161 162 163 164 165 166 170 172 174 176 178 180 182 190 192 194 196 198 200 Phosphor layer 3D Light body carrier bullet-shaped carrier phosphor layer three-dimensional phosphor carrier sphere shape carrier phosphor layer phosphor carrier sphere shape carrier narrow neck part phosphor layer lamp fin structure optical cavity light source diffuser dome thread part three-dimensional phosphor carrier lamp LED light source heat sink Dome-shaped phosphor carrier diffuser lamp 154492.doc -53- 201144683 202 Heat sink structure 204 Light source 206 Phosphor carrier 208 Threaded portion 210 Heat dissipation structure 212 Thermally conductive heat sink substrate 214 Dielectric layer 216 LED wafer 218 Solder 220 Optical component 222 Lower portion 224 Curved section 226 Side emitting surface 228 Upper curved surface 232 Central opening or hole 234 Fastener or clamp connector 250 Optical element 252 Narrow bottom or stem section 254 Upper reflective section 256 Reflecting blade or flap

258 LED 260 with increased curvature of the blade 262 Space 264 Phosphor carrier -54- 154492.doc

Claims (1)

201144683 VII. Patent application scope: 1. A solid-state lamp comprising: a light-emitting diode (LED); an optical component above the LED such that light from the LEI and the optical Component interaction, the optical element changing the emission pattern of the LED to a wider emission pattern; and a phosphor carrier on the optical component, the phosphor carrier at least some of the LED light The light is converted to a different wavelength. 2. The lamp of claim 1 wherein the optical component comprises a substantially transparent material&apos; light from the LED is directed by the optical component into a wider emission pattern. 3. The lamp of claim 2 wherein the LED light is directed in the optical element by total internal reflection or refraction. 4. The lamp of claim 2, wherein the optical element has a curved conical shape. 5. The lamp of claim 2, wherein a portion of the LED light is directed by the optical element to be 70 relative to the LED. Or 70. The above angle is emitted. 6. The lamp of claim 2, wherein one of the LED lights passes through the optical element to provide the lamp for forward transmission. The lamp of claim 2, wherein the optical element has a three-dimensional shape. 8. A lamp as claimed in claim 1, wherein the optical element utilizes specular and/or diffuse reflection to change the emission pattern of the LED to a wider emission pattern. 9. A lamp as claimed, wherein the optical element comprises a reflective surface from which at least some of the light is reflected. 154492.doc 201144683 1 灯. The lamp of claim 9, wherein the reflective surface is above the LED. 11. The lamp of claim 10, further comprising an opening in the reflective surfaces to allow passage of LED light. 12. The lamp of claim 9, wherein the optical element is flower shaped. 13. The lamp of claim 12, wherein the optical element comprises - or a plurality of reflective vanes above the lED, wherein light from the LED is reflected from the vanes. 14. The lamp of claim 12, which further comprises an opening in the vanes or between the vanes to allow passage of LED light. 15. A solid state lamp comprising: a heat dissipating component; a dielectric layer on the heat dissipating component; a heat dissipating substrate, the heat dissipating substrate on the dielectric layer; and a light emitting A diode (LED) on the heat sink substrate and in thermal contact with the heat sink substrate, the heat sink substrate spreading the LED heat before the heat from the LED reaches the dielectric layer. 16. The lamp of claim 15 wherein the heat sink substrate comprises a high thermal conductivity material. 17. The lamp of claim 15 wherein the led is mounted to the heat sink substrate by a thermally conductive mechanism or material. 18. The lamp of claim 15 wherein the heat dissipating component comprises a heat sink. 19. The lamp of claim 15 which further comprises an optical component to change the emission pattern from the LED to a wider emission pattern. 20. The lamp of claim 15 which further comprises a distal phosphor carrier or a diffuser. 154492.doc -2-