TW201144686A - LED lamp with active cooling element - Google Patents

Abstract

Solid state lamp or bulb structures are disclosed that can provide an essentially omnidirectional emission pattern from directional emitting light sources, such as forward emitting light sources. The present invention is also directed to lamp structures using active elements to assist in thermal management of the lamp structures and in some embodiments to reduce the convective thermal resistance around certain of the lamp elements to increase the natural heat convection away from the lamp. Some embodiments include integral fans or other active elements that move air over the surfaces of a heat sink, while other embodiments comprise internal fans or other active elements that can draw air internal to the lamp. The fan's movement of the air over these surfaces can agitate otherwise stagnant air to decrease the convective thermal resistance and increasing the ability of the lamp to dissipate heat generated during operation.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to solid state lamps and light bulbs, and more particularly to efficient and active elements having a contribution to dissipating heat from the lamps and bulbs during operation. A reliable light-emitting diode (LED) based light. The present application claims the following claims: U.S. Provisional Patent Application No. 61/339,516, filed March 3, 2010, and US Provisional Patent Application No. 61/339, filed on March 3, 2010 U.S. Provisional Patent Application No. 61/386, 665, and 2nd, pp. 515, pp. US Provisional Application No. 61/424 67 曰, filed on December 19, 1999. This application is also part of the following application and claims its rights: US Patent Application No. 12/848,825, filed on September 24, 2010 U.S. Patent Application Serial No. 12/889, 719, filed on Dec. 22, 2011. [Prior Art] White woven lamps or bulbs or filament-based lamps or bulbs are commonly used as a source of light for household appliances and commercial applications. However, these lamps are extremely low-efficiency sources of light as much as 95 〇/. The input energy loss, 纟 | is in the form of heat or infrared energy. A common alternative to white woven lamps (so-called compact fluorescent lamps (CFLs)) is more effective in converting electricity to light but requires the use of toxic materials. These toxic materials and their various compounds can cause chronic and acute It can also lead to pollution of the clothing environment. One solution for improving the efficiency of a lamp or bulb is to use a solid state device such as a light emitting diode instead of gold 154494.doc 201144686 to generate light. The light emitting diode generally comprises a layer sandwiched by the opposite doping type. One or more active layers between the semiconductor materials. When a bias voltage is applied to the doped layers, 'holes and electrons are injected into the active layer where they recombine to produce light. The light system is self-acting and is emitted from each surface of the LED. To use LED chips in circuits or other similar configurations, it is known to encapsulate LED wafers in a package to provide environmental and/or mechanical protection, color selection, light focusing and The LED package also includes electrical leads, contacts or traces for electrically connecting the LED package to an external circuit. In a typical LED package illustrated in Figure 1, by means of solder bonding or conductive epoxy The resin mounts a single LED wafer 12 on the reflective cup 13. One or more wire bonds 11 connect the ohmic contacts of the LED wafer 12 to the wires 15A and/or 15B, which can be attached to the reflective cup 13 or to the reflective cup 13 The reflector cup may be filled with an encapsulant material 16, which may contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength may be absorbed by the phosphor, the phosphor The light at the second wavelength is responsively emitted. The entire assembly is then encapsulated in a clear protective resin 14, which can be molded into a lens shape to collimate light emitted from the LED wafer 12. Although the reflective cup 13 Light can be directed in the upward direction, but optical loss can occur when the light is reflected (ie, some light is likely to be absorbed by the reflective cup due to the actual reflector surface being less than 100% reflective). In addition, heat Retention can be a problem with packages such as the package shown in Figure la1, as it may be difficult to extract heat via wires 15 A, 15 B. The conventional LED package 20 illustrated in Figure 2 may be more suitable for generating more 154494 .doc 201144686 High-heat operation with high heat. In the LED package 20, one or more LED chips 22 are mounted on a carrier such as a printed circuit board (PCB) carrier, substrate or sub-substrate 23. twenty three The upper metal reflector 24 surrounds the LED wafer 22 and reflects the light emitted by the LED wafer 22 to move the light away from the package 20. The reflector 24 also provides mechanical protection of the LED wafer 22. The ohmic contact and sub-substrate 23 on the LED wafer 22 One or more wire bond connectors 27 are formed between the upper electrical traces 25A, 25B. The mounted LED wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer. Acting as a lens. The metal reflector 24 is typically attached to the carrier by means of solder or epoxy bonding. The LED wafer can be coated by a conversion material comprising one or more phosphors (such as in the LED package 20 of Figure 2) The LED wafers are found, wherein the phosphors absorb at least some of the LED light. The LED wafers can emit light of different wavelengths such that they emit a combination of light from the LEDs and the phosphor. LED wafers can be coated with phosphors in a number of different ways, one suitable method of which is described in U.S. Patent Application Serial No. 11/656,759, the entire disclosure of The title is "Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method." Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat the LEDs, a suitable EPD method is described in U.S. Patent Application Serial No. 11/473,089, to No. LED wafers with conversion materials in the vicinity or as direct coatings have been used in various packages with 154494.doc 201144686 'but some limitations of device-based structures have been encountered. g phosphor materials are on or near the LED epitaxial layer (and In some instances, the conformal coating of the 匕3 on the LED) can directly withstand the heat generated by the wafer, which heat can increase the temperature of the phosphor material. Additionally, in such cases, the phosphor can be subjected to incident light from very high concentrations or fluxes of lED. Since the conversion process is typically not 100% efficient, excessive heat is generated in the phosphor layer that is proportional to the incident light flux. "In a compact phosphor layer close to the LED wafer, this can result in an increase in the substantial temperature in the phosphor layer because in small regions A lot of heat is generated in it. This increase in temperature can be exacerbated when the phosphor particles are embedded in a low thermal conductivity material, such as polyfluorene, which does not provide an effective dissipation path for the heat generated within the phosphor particles. These elevated operating temperatures can cause the phosphor and surrounding materials to degrade over time, as well as resulting in reduced phosphor conversion efficiency and shifting color conversion. Lamps that utilize solid state light sources (such as LEDs) in combination with LEDs or conversion materials at the distal end of the LED have also been developed. These configurations are disclosed in Tarsa et al. entitled "High Output Radial Dispersing Lamp Using a

The lamp described in this patent may comprise a solid state light source that transmits light to a disperser having a phosphor via a separator, in US Patent No. 6,350,041. The disperser allows the light to be dispersed in a desired pattern and/or to change its color by converting the light to a different wavelength via a phosphor or other conversion material. In some embodiments, the separator separates the source from the diffuser a sufficient distance such that when the source carries the increased current necessary for illumination within 3⁄4, heat from the source will not be transferred to the 154494.doc 201144686 diffuser. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. One potential disadvantage of having a remote phosphor lamp is that it can have undesirable visual or aesthetic characteristics. When the light does not produce light, the light can have a different surface color than the typical white or clear appearance of a standard Edison light bulb. In some examples, the lamp may have a yellow or orange appearance that is primarily produced by a phosphor conversion material. This appearance can be considered undesirable for many applications where it can cause aesthetic problems with surrounding building components when the lights are not illuminated. This can have a negative impact on the overall acceptance of these types of lamps by consumers. In addition, the remote photometric configuration can be subject to insufficient thermal conduction as compared to a conformal or adjacent phosphor configuration that is thermally conductive in the phosphor layer during the conversion process that can be conducted or dissipated via a nearby wafer or substrate surface. Heat dissipation path. In the absence of an effective heat dissipation path, the 'thermally isolated distal lining may be subjected to elevated operating temperatures'. The elevated operating temperature may in some cases be even higher than the comparable conformal coated layer. The temperature in the middle. This situation can offset some or all of the benefits achieved by placing the scale on the distal end relative to the wafer. In other words, the placement of the phosphor at the distal end relative to the LED wafer can reduce or eliminate the direct heat generation of the phosphor layer due to the heat generated within the LED wafer during operation, but the resulting phosphor temperature reduction can be partially or fully The ground is offset by the heat generated in the phosphor layer itself during the light conversion process and the lack of a suitable thermal path to dissipate the heat generated thereby. Another problem affecting the implementation and acceptance of lamps utilizing solid state light sources is related to the nature of the light emitted by the source itself. In order to manufacture an effective lamp or bulb based on an LED source (and phase 154494.doc 201144686 associated conversion layer), it is often desirable to place the LED wafer or package in a coplanar configuration. This facilitates manufacturing and can reduce manufacturing costs by allowing the use of conventional production equipment and processes. However, coplanar configurations of LED chips typically produce a forward light intensity profile (e.g., a Lambertian profile). Such beam profiles are generally undesirable in applications where solid state lights or light bulbs are intended to replace conventional lamps, such as conventional white woven bulbs, which have a more omnidirectional beam pattern. While it is possible to mount an LED light source or package in a three-dimensional configuration, it is often difficult and expensive to manufacture such configurations. As mentioned, lamps with LED wafers (with conversion materials in the vicinity or as direct coatings and remote conversion materials) can be subjected to increased temperatures (especially under high current operation, these LED wafers can also generate heat). And can suffer from the harmful effects of heat accumulation. The lamp can contain heat sinks to extract heat away from the LED wafer and/or conversion material, but even these lamps may suffer from insufficient heat dissipation. Unlike traditional incandescent and fluorescent Compared to lighting, good heat consumption f and the full-burning LED wafer junction temperature pose unique challenges for solid-state lighting solutions. 1 There is almost no previous lamp technology—except for pure natural convection to dissipate heat from the lamp. Situation: Convection heat to ambient air dissipates ambient air as the maximum heat dissipation bottleneck of the lighting fixture system. This It shape is especially true for smaller lighting fixtures with a limited form factor, in smaller lighting fixtures, heat sinks The size is limited, such as in the case of a slit: package replacement. High convective thermal resistance is at least partially caused by weak natural convection in weak natural convection only by ambient air The buoyancy flow is carried away. The float: the movement is usually very slow, especially for small-sized objects. [Invention] I54494.doc 201144686 The present invention provides a solid-state lamp and a bulb, which can be significantly reduced in convection thermal resistance without significant increase The operation of the lamp or bulb or its power consumption. Different embodiments may be configured to enhance convective heat transfer around such elements by including active elements that disturb or agitate the air surrounding the elements of the lamp. The inventive lamp can have many different components including, but not limited to, different combinations and configurations of: a light source, one or more wavelength converting materials, a plurality of zones that are positioned separately relative to the light source or positioned at the distal end or a layer, and a separate diffusion layer. An embodiment of a solid state light source according to the present invention comprises a light emitting diode (LED) and a heat sink, wherein the LED is in thermal contact with the heat sink. The lamp further comprises a configuration An active search mechanism for reducing at least some of the convective thermal resistance of the lamp elements. In some embodiments, the actuating mechanism may comprise an integral fan. Another embodiment of the solid state light source includes a plurality of light emitting diodes (LEDs) and a heat sink. The heat sink is configured for the electrodes to cause thermal contact between the LEDs and the heat sink. The air flows through the surface of the heat sink to reduce the convective thermal resistance of the heat sink. The re-embodiment of the solid state light source according to the present invention comprises a plurality of [ED and a heat sink] the heat sink is disposed relative to the LEDs In order to bring the LEDs into thermal contact with the money sheet, including a fan, the fan is internal to the lamp and configured to allow air to flow across the surface of the lamp to reduce convective thermal resistance at the surfaces. Another heat sink having a heat sink core of the light source - the embodiment includes a plurality of LEDs. The LEDs are disposed on the heat sink 154494.doc 201144686 and are in thermal contact with the heat sink. A fan is disposed within the heat sink core and includes a base having drive electronics. The base is mounted to the heat sink ^ and is within the heat sink core. A diffuser dome is mounted on the LEDs above the panel, wherein the fan does not draw air into the heat sink core and allows air to flow into the diffuser cavity. The above and other aspects and advantages of the invention will be apparent from the description and appended claims. [Embodiment] The present invention is directed to an improved solid state lamp or bulb structure that is efficient, reliable, and cost effective. In some embodiments, a lamp in accordance with the present invention can provide a substantially omnidirectional emission pattern from a solid state light source while still having features that allow the lamps and their light sources to operate at a reasonable temperature. One (four) may have a light source comprising a directional emission source, such as a forward-emitting source, wherein the lamps include features for dispersing the pupil toward a more uniform emission suitable for the lamp. In order to allow operation at acceptable temperatures, the lamp structures may include active components to facilitate thermal management of the lamp structures and to reduce convective thermal resistance around certain components of the lamp components. Reducing the thermal resistance increases the 'natural thermal convection away from the lamp. • Some embodiments include LED-based lamps or LED-based bulb replacements that include heat sinks for drawing heat away from the LED wafer or conversion material. Some embodiments may include fins with fins, although it should be understood that different embodiments may have fins without fins. It should also be understood that other lamps may not have heat dissipation 154494.doc -11- 201144686, where active thermal management components allow operation at reasonable temperatures with the help of heat sinks. For example, an active component (such as a fan) can be within a housing and the active component can direct ambient air flow through the apertures and/or channels in the housing and/or into the apertures and/or Or the channel is made of a poorly thermally conductive material such as plastic. It should also be understood that the fins may be included in different positions within the lamp, such as wholly or partially within the lamp housing, in the optical cavity or in the threaded portion. The active elements can be configured to move or agitate the gas inside or outside the lamp element to help reduce thermal resistance. It should be further understood that portions of the lamp, such as the outer casing, the threaded portion, and portions of the optical cavity, may comprise plastic or insulating materials, wherein the active components may be assisted with or without the aid of a thermally conductive material such as a heat sink t. The heat dissipation of the components. In some embodiments having a heat sink, 'the convective thermal resistance can be measured to be greater than 8 t/w when measured as a bare heat sink, and when the heat sink is integrated into the lamp or bulb, this measurement can be Increase to greater than 1 (). _. This relatively high = convective thermal resistance can be produced by weak natural convection, in which the heat is carried away by the buoyancy flow of the air. The buoyancy flow of air is usually very slow (especially for smaller geometries like typical lamps or bulbs, the fin convection thermal resistance can be much larger than the conduction junction of the LED junction to the heat sink, and therefore 'can be the system thermal path The most significant bottleneck. The present invention may include a number of different mechanisms to reduce convective thermal resistance and reduce such bottlenecks, such as mechanisms for moving or illuminating the lamp elements. In an embodiment, the integrated fan element Can be included in the lamp or bulb to provide a light agitation or forced convection over 5 points. Other machines 154494.doc -12· 201144686 can be used to move or agitate the air, including but not limited to diaphragm Or jet induced flow. In still other embodiments, such devices may be used to move other cooling materials or materials above the elements of the lamp to reduce thermal resistance. Even a relatively small amount of light over a portion of the lamp or bulb The air can also significantly reduce the convective thermal resistance of the system. This can result in a lower junction temperature of the LED and a lower junction temperature of the phosphor material, resulting in better luminous efficiency of the system and Better reliability. A better thermal system can also allow LEDs to be driven at higher currents, thereby reducing the cost of LEDs per light output. Although pure natural convection in air typically provides a convective heat transfer coefficient of about 5 W/m2-K. However, forced convection can increase the coefficient by one or even two orders of magnitude. The lamp used in accordance with the invention should have a long service life and should consume a minimum amount of power 'and should be as quiet as possible. Equal Wind: Can be provided as part of a modular design of the lamp. That is, if the fan or drive electronics fail before other components of the lamp, the fan or drive electronics can be easily removed and replaced. The portion of the lamp is provided in a plurality of different portions of the airflow that pass through different portions of the lamp. In some embodiments, the fan may be referred to as a gas stream for the heat sink, and the heat samples around the heat sink have fins. In the case of , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Special In the case of a consistent example, there is a small 'between adjacent fins' to provide more heat-dissipating Korean films (adjacent to the tabs: there is an additional advantage between the fins and the smaller space) 154494.doc •13 - 201144686 In other embodiments, the 'fan can be formed with the lamp, so that the ambient air is taken into the internal space inside the lamp, including the inside of the heat sink or the inside of the bulb. In these embodiments, air can be provided. a channel that allows air to enter the lamp and also allows air from the bulb to pass out of the bulb. These fan configurations provide % of the air string from the bulb to the bulb and then again. This can result in Air flows through the bulb, thereby agitating the air therein and thereby reducing the thermal resistance above the components of the lamp. In some embodiments, 'air can flow through the LEDs inside the bulb, thereby reducing the thermal resistance above the LED. This also allows the LED to operate at lower temperatures. In a different embodiment with a heat sink, the air may also flow through the heat sink when it is drawn into the bulb and/or out of the bulb. This air flow can also pass through other components, such as drive electronics. Fans can be included in many different lamps, but are particularly well suited for solid state illuminators with remote transmissive materials (or phosphors) and distal diffusing elements or diffusers. In some embodiments, the diffuser not only serves to shield the phosphor from view by the lamp user, but also disperses or redistributes light from the source of the remote phosphor and/or lamp into the desired emission pattern. In one of these embodiments, the diffuser dome can be configured to disperse the forward emission pattern into a more omnidirectional pattern that can be used in general lighting applications. The diffuser can be used in embodiments having a two-dimensional and three-dimensional shape of a distal conversion material such as a sphere or dome. This combination of features provides the ability to transform the incoming light from the LED source into a beam profile comparable to a standard incandescent bulb. In some of these lamp embodiments, air inlets and outlets may be provided to allow air to flow into and out of the diffuser and/or the distal phosphor 154494.doc 201144686 space. The active element can be provided with an improved thermal configuration by positioning relative to the inlet of the diffuser and/or the internal volume of the phosphor to move or impart air within the volume. - or a plurality of outlets may be spaced from the inlets to allow an air path to exit the diffuser and/or the volume of material to be converted. In various embodiments, the inlet and outlet may be configured such that the air passage passes through different lamp elements, such as LEDs, driver circuits, before passing outside the outlet. In a lamp having a diffuser dome and a dome of conversion material, the air path can pass through the diffuser dome and the conversion material dome before passing to the exterior. In other embodiments, the air path may pass over the driver circuit and the heat sink before entering the volume between the diffuser and the dome of the conversion material, after which the air path is passed to the exterior via the outlet. In some of these lamps, there may be different inlet outlets for each dome. The outlets may be positioned relative to the heat sink, or the heat sink may be in any portion of the air path as it enters and/or exits. The invention is described herein with reference to conversion materials, wavelength converting materials, remote phosphors, phosphors, light layers, and related terms. The use of such terms should not be construed as limiting. It should be understood that the use of the term distal phosphor, phosphor or phosphor layer is meant to encompass all wavelength converting materials and equally applicable to all wavelength converting materials. Some embodiments of the lamp may have a dome-shaped (or frusto-spherical) three-dimensional conversion material over the light source and spaced apart from the light source, and a dome-shaped diffuser spaced apart from the conversion material and over the conversion material, The lamp is shown to exhibit a double dome structure. The space between the various structures can include light mixing chambers that not only promote dispersion of lamp emission but also promote color uniformity. The space between the light source and the conversion material and the space between the conversion materials can serve as a 154494.doc •15· 201144686 light mixing chamber. Other embodiments may include additional conversion materials or diffusers that may form additional mixing chambers. The order of the dome conversion material and the dome shaped diffuser can be varied such that some embodiments can have a expander inside the conversion material while the space therebetween forms a light mixing chamber. These configurations are only a few of the many different conversion materials and diffuser configurations in accordance with the present invention. Some lamp embodiments in accordance with the present invention may comprise a light source having a coplanar configuration of one or more LED wafers or packages, wherein the illuminators are mounted on a flat or planar surface. In other embodiments, the LED chips may not be coplanar on the pedestal or other three dimensional structure. Coplanar light sources reduce the complexity of the illuminator configuration, making it easier and less expensive to manufacture. However, coplanar light sources tend to illuminate primarily in the forward direction, such as in a Lambertian emission pattern. In various embodiments, it may be desirable to emit a light pattern that simulates a light pattern of a white light bulb that is known to provide nearly uniform emission intensity and color uniformity at different emission angles. Different embodiments of the present invention can include features that can transform the emission pattern from non-uniform to substantially uniform over a range of viewing angles. In a two-part embodiment, a conversion layer or region may comprise a disk carrier, which may comprise a thermally conductive material that is at least partially transparent to light from the source and each absorbs light from the wire and emits a different wavelength At least a phosphor material of light. The diffuser can comprise a diffusing film/particle and associated carrier (such as a glass envelope) and can be used to scatter or redirect at least some of the light emitted by the source and/or the bowl carrier to provide a desired beam profile. In the case of a solid towel, (4) the lamp of the present invention emits a beam profile compatible with a standard white woven bulb. 154494.doc -16- 201144686 The properties of the diffuser (such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the properties of the scattering layers) can be used to control various lamp properties, such as The color uniformity and light intensity distribution are changed by the viewing angle. By shielding the phosphor carrier and other internal light features, the diffuser provides a desired overall lamp appearance when the lamp or bulb is not illuminated. As mentioned, a heat sink or fin structure can be included that can be in thermal contact with the source and in thermal contact with the phosphor carrier to dissipate heat generated within the source and phosphor layer into the environment. Electronic circuitry may also be included to provide power to the light source and to provide other capabilities (such as dimming, etc.), and such circuitry may include components (such as a screw mount, etc.) for applying electrical power to the light. Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that can be mounted into a standard size bulb housing (such as the A19 size bulb 30 as shown in Figure 3). This makes the lamp particularly useful as an alternative to conventional incandescent lamps or bulbs and fluorescent lamps or bulbs, wherein the lamp according to the present invention enjoys reduced energy consumption and long service life provided by its solid state light source. Lamps in accordance with the present invention may also accommodate other types of standard size profiles including, but not limited to, A21 and A23. In some embodiments, the light source can comprise a solid state light source, such as a different type of 'LED, LED wafer or lED package. In some embodiments, a single LED Ba sheet or package can be used. In other embodiments, multiple LED wafers or packages configured in different types of arrays can be used. By having a good heat dissipation between the filler and the (4) wafer thermal barrier, the LED wafer can be driven by a higher current level without conversion efficiency to the phosphor and its long-term reliability. 154494.doc -17· 201144686 Causes harmful effects. This may allow over-excitation of the LED wafer to reduce the flexibility of the number of LEDs required to produce the desired luminous flux, which in turn reduces the cost of the complexity of the lamp. Such LED packages may comprise LEDs encapsulated by a material that can withstand elevated luminous flux or may include unencapsulated LEDs. In some embodiments, the light source can include one or more blue light emitting LEDs, and the phosphor layer in the phosphor carrier can comprise one or more materials that absorb one portion of the blue light and emit one or more different wavelengths The light is such that the lamp emits a combination of white light from the blue LED and the conversion material. The conversion material absorbs blue LED light and emits different colors of light, including (but not limited to) yellow and green. The light source can also include different LEDs and conversion materials that emit light of different colors such that the light emits light having desired characteristics such as color temperature and color rendering. Conventional lamps with red and blue LED chips can withstand different operating temperatures

Degree and color instability under dimming. This can be attributed to the different behavior of the red and blue LEDs at different temperatures and operating powers (current/voltage) and the different operating characteristics over time. This effect can be subtly mitigated by implementing an active control system that increases the cost and complexity of the entire lamp. This problem can be solved by combining a light source having the same type of illuminator with a distal spheroidal carrier, which can comprise a multi-photon, a multi-layer scale, in accordance with various embodiments of the present invention. The light body is maintained relatively cold via the heat dissipation configuration disclosed herein. In some embodiments, the remote optical carrier can absorb light from the illuminator and can re-emit light of different colors' while still experiencing efficiency and reliability in reducing the operating temperature of the fill. 154494.doc 201144686 The separation of the fill element from the LED provides an added advantage: easier and more consistent color sorting. This can be done in a number of ways. LEDs from various sorting levels (e.g., blue LEDs from various sorting levels) can be assembled together to achieve a substantially uniform wavelength source of excitation that can be used in different lamps. These excitation sources can then be combined with a phosphor carrier having substantially the same conversion characteristics to provide a lamp that emits light within the desired sorting level. In addition, a large number of phosphor carriers can be fabricated and pre-sorted according to their different conversion characteristics. Different phosphor carriers can be combined with light sources that emit different characteristics to provide a light that emits light within a target color sorting level. Some of the lamps in accordance with the present invention can also provide improved emission efficiency by surrounding the light source with a reflective surface. This results in enhanced photon recycling by reflecting most of the light re-emitted from the conversion material back toward the source. To further enhance efficiency and provide a desired emission profile, the surface of the light-guiding layer, carrier layer or diffuser can be smooth or scattered. In some embodiments, the inner surface of the carrier layer and the diffuser can be optically smoothed to promote total internal reflection behavior that reduces the amount of light (downconverted or scattered light) that is directed back from the phosphor layer. . This reduces the amount of light that can be emitted back by the led wafer of the lamp, the associated substrate, or other non-ideal reflective surfaces inside the lamp. The invention is described herein with reference to certain embodiments, but it is understood that the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. In particular, the present invention is described below with respect to certain lamps having one or more LED or LED wafers or LED packages in different configurations. 'But it should be understood that the present invention is applicable to many other lamps having many different configurations. . Embodiments are described below with reference to one or more LEDs, but it should be understood that 154494.doc -19- 201144686 This is a stomach wafer and LED package. The components can have different shapes and sizes than the shapes and sizes shown, and can include a different number of LEDs. It should also be understood that the embodiments described below utilize coplanar light sources' but it should be understood that non-coplanar light sources may also be used. It should also be understood that the LED light source of the lamp can include one or more LEDs, and in embodiments having more than one LED, the LEDs can have different emission wavelengths. Similarly, some LEDs may have phosphor layers or regions adjacent or in contact, while other LEDs may have adjacent phosphor layers of different compositions or no phosphor layers at all. The present invention is described herein with reference to conversion materials, phosphor layers and phosphors. The carrier and the diffuser are distal to each other. In this context, the distal ends are spaced apart from each other and/or are not in direct thermal contact. It will also be understood that when an element such as a layer, region or substrate is referred to as "on" another element, it may be directly on the other element or the intervening element may also be present. In addition, terms such as "inside", "outside", "upper", "above", "below", "below" and "below" may be used herein to describe the relationship of one layer or another. . It is to be understood that the terms are intended to encompass the orientations depicted in the drawings and the various aspects of the embodiments. The terms first, second, etc. may be used to describe various elements, components, regions, layers and/or sections, but such elements, components, regions, layers and/or sections are not to be limit. The terms are only used to distinguish one element, component, region, layer or section from another. Therefore, a first element, component, region, layer or section discussed hereinafter may be referred to as a second element, component, 154494.doc • 20-201144686 zone, layer or, without departing from the teachings of the present invention. Section. Embodiments of the present invention are described herein with reference to the cross-sectional illustration of the schematic illustration of the embodiments of the invention. Thus, the actual thickness of the layers can be varied, and variations in shape relative to the description are contemplated due to, for example, manufacturing techniques and/or tolerances. The embodiments of the invention should not be construed as being limited to the particular shapes of the regions illustrated herein, but rather to include such variations as those which are manufactured, for example. Areas illustrated or described as square or rectangular will generally have the characteristics of rounded or singular due to normal 4 tolerances. The area illustrated in the figures is, therefore, in the nature of the invention, and is not intended to limit the scope of the invention. 4 shows an embodiment of a lamp 5A according to the present invention comprising a heat sink structure 52 having a light cavity 54 having a platform 56 for holding a light source 58. Although this and some embodiments are described below with reference to optical cavities, it should be understood that many other embodiments without optical cavities may be provided. Such embodiments may include, but are not limited to, a light source on a planar surface of the lamp structure or on a pedestal. Light source 58 can include a number of different illuminators, with the embodiment shown including an LED. Many different commercially available LED wafers or led packages can be used including, but not limited to, LED chips or LED packages available from Cree, Lnc. of N〇nh-Durham. It will be appreciated that a lamp embodiment without an optical cavity can be provided, wherein in other embodiments the lED is mounted in a different manner. By way of example, the light source can be mounted to a flat surface in the lamp' or a susceptor for holding the LED can be provided. Light source 58 can be mounted to platform 56 using a number of different known mounting methods and materials, wherein light from source 58 is emitted from the top opening of cavity 54 154494.doc -21 - 201144686. In some embodiments, light source 58 can be mounted directly to platform 56, while in other embodiments 'the light source can be included on a sub-substrate or printed circuit board (PCB)' followed by the sub-substrate or printed circuit board (pCB) Mounted to platform 56 flat σ 56 and heat sink structure 52 may include conductive paths for applying electrical signals to light source 58 'where the conductive traces are conductive traces or wires. Portions of the platform 56 may also be made of a thermally conductive material, and in some embodiments, heat generated during operation may be spread to the platform and then spread to the fin structure. The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials can be used, including different metals (such as copper or aluminum) or metal alloys. Copper can have a thermal conductivity of up to 400 W/m-k or more. In some embodiments, the heat sink may comprise a high purity, and the high purity may have a thermal conductivity of about 2 U at room temperature of W/m-k. In other embodiments, the fin structure may comprise a die cast with a thermal conductivity of about 200 W/m_k. The heat sink structure 52 may also include other heat dissipation features such as heat dissipation, fins 6 () that increase the surface area of the heat sink to promote more efficient dissipation into the ring. In some embodiments, the heat sink fins 6 can be made of a material having a thermal conductivity higher than the remainder of the heat sink. In the illustrated embodiment, the fins 60 are shown in a generally horizontal orientation, although it should be understood that in other embodiments, the fins may have a vertical or angled orientation. In still other embodiments, the heat sink may include an active cooling element, such as a fan, to reduce the convective thermal resistance within the lamp. In some embodiments, the thermal dissipation of the (4) photobody carrier is achieved via a combination of convective heat dissipation and conduction through the fin structure 52. The different heat dissipation configurations and structures are described in U.S. Provisional Patent Application No. 154,494, filed on Jun. No. s. The title is "LED Lamp incorporating Rem〇te ph〇sph〇r ... Oil Dissipation Features" and is also given to Cree, Inc. This application is incorporated herein by reference. Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of optical cavity 54. In embodiments that do not have an optical cavity, a reflective layer around the source can be included. In some embodiments, the surface may be coated with (4) a reflectance of about 75% or more of the visible wavelength of the light emitted by the source 58 and/or the wavelength converting material ("light"), while in other In embodiments, the material may have a reflectivity of about 85% or more for the light. In still other embodiments 10, the material may have a reflectivity of about 95% or more for the light. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type for mounting in conventional electrical sockets. For example, the heat sink structure can include features for mounting to the target (four) lobe, which can include a threaded portion that can be screwed into the threaded seat. In other embodiments, the heat sink structure may comprise a standard plug and the electrical socket may be a standard socket, or the heat sink structure may comprise a GU24 base unit 'or the heat sink structure may be a clip and the electrical socket may receive and hold the clip The socket (for example, as used in many fluorescent lamps). These are just a few of the options for the heat sink structure and the socket, and other configurations that safely deliver electrical power from the socket to the lamp 5 can also be used. The lamp according to the invention may comprise a power supply or a power conversion unit, which may include a driver to allow the lamp 154494.doc -23- 201144686 to be powered by the AC line voltage/current and to provide light source dimming capability . In some implementations, the power supply may include an off-line constant current LED driver using a non-isolated quasi-spectrum flyback topology. The LED driver can be mounted within the lamp and in some embodiments the led driver can comprise a volume of less than 25 cubic centimeters. In other embodiments, the brush driver can comprise a volume of about a square centimeter. In some embodiments, the power supply can be non-dimmable, but at a lower cost, the power supply used can have different topologies or geometries, and can also be dimmable. A phosphor carrier 62 is included over the top opening of the cavity 54 and includes a dome shaped diffuser 76 over the phosphor carrier 62. In the embodiment shown, the scale carrier covers the entire opening, and the cavity opening is shown as being circular and the phosphor carrier 62 is a disk. It should be understood that the cavity opening and phosphor carrier can be of many different shapes and sizes. It should also be understood that the light trap carrier 62 may not cover all of the cavity openings. As further described below, 'Diffuser % is configured to disperse light from the phosphor carrier and/or LED into a desired lamp emission pattern, and can include many different shapes and sizes, depending on the light it receives and the desired emission pattern of the lamp. And set. Embodiments of the phosphor support according to the present invention may be characterized as comprising a conversion material and a thermally conductive light transmissive material, although it will be understood that a non-thermally conductive phosphor support may also be provided. The light transmissive material may be transparent to light emitted from source 54 and the conversion material should be of a type that absorbs light from the wavelength of the source and re-emits light of different wavelengths. In the illustrated embodiment, the thermally conductive light transmissive material comprises a carrier layer 64' and the conversion material comprises a phosphor layer 66 on the phosphor carrier. As further described below, various embodiments may include thermally conductive light transmissive materials 154494.doc • 24· 201144686 and many different configurations of conversion materials. When light from source 58 is absorbed by the light body in fill layer 66, the light is The isotropic direction is re-emitted, with approximately 5% of the light being transmitted forward and 500/. The light is emitted back into the cavity 54. A significant portion of the light that is emitted backwards in the previous LED with the conformal constituting layer can be directed back to the led t and the likelihood of light escaping is limited by the extraction efficiency of the LED structure. For some LEDs, the extraction efficiency can be about 70%, so a certain percentage of the light that is directed back into the LED from the conversion material can be lost. In a lamp having a remote fill configuration in accordance with the present invention, the LED is located on the platform 56 at the bottom of the cavity 54 and a higher percentage of the light in the rearward structured light strikes the surface of the cavity rather than LED. Coating the service with the reflective layer 53 increases the percentage of light that is reflected back to the phosphor layer 66 (at the phosphor layer 66, the light can be emitted from the lamp). These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. In embodiments that do not have an optical cavity, a reflective layer around the LED can also be included. Carrier layer 64 may be made of many different materials having a thermal conductivity of 0.5 W/mk or more, such as quartz, tantalum carbide (Sic) (thermal conductivity ~12 〇 W/mk), glass (heat) The conductivity is ι·(μ.4 w/m_k) or sapphire (thermal conductivity is ~40 W/mk) » In other embodiments, the carrier layer 64 can have a thermal conductivity greater than 1.0 W/mk, while In other embodiments, it may have a thermal conductivity greater than 5.0 W/mk. In still other embodiments, the carrier layer 64 has a thermal conductivity greater than 10 W/mk. In some embodiments, the carrier layer 154494 .doc -25- 201144686 may have a thermal conductivity in the range of 1.4 W/mk to 10 W/mk. The scale carrier may also have different thicknesses depending on the material used, with a suitable thickness ranging from 0.1 mm to 10 mm or more. It should be understood that other thicknesses may be used depending on the properties of the material used for the carrier layer. The material should be thick enough to provide sufficient lateral heat dissipation for specific operating conditions. In general, the thermal conductivity of the material is greater. High 'materials may be thinner while still providing the necessary heat dissipation. Different factors can affect which load is used Layer materials, different factors including, but not limited to, cost and transparency to source light. Some materials may also be more suitable for larger diameters, such as glass or quartz. By forming a phosphor layer on a larger diameter carrier layer and then Singulating the carrier layer into smaller carrier layers can provide reduced manufacturing costs. Many different discs can be used in the fill layer 66, with the invention being particularly adapted to emit white light. As described above, in some embodiments, light source 58 can be an LED-based light source and can emit light of a blue wavelength spectrum. The phosphor layer can absorb some of the blue light and re-emit yellow light. This situation allows the lamp to emit white light of blue and yellow light. In some embodiments, the blue LED light can be converted by using a yellow conversion material of a commercially available YAG:Ce phosphor, but the use is based on (0 丫) 3 (eight 1, 〇 3) 50 〗 2: 匚6 system (such as 丫3 person 15012: 匚6 (YAG)) made of phosphor particles, it is possible to obtain a wide range of broad yellow spectral emission. It can be used together with illuminators based on blue-emitting LEDs. Other yellow phosphor produce white light when including (but not limited to):

Tb3-xRExO, 2: Ce(TAG); RE=Y, Gd, La, Lu; or

Si*2-x.yBaxCaySi〇4: The Eu 〇 phosphor layer may also be provided with more than one phosphor, and the one or more phosphors 154494.doc -26- 201144686 are mixed in the phosphor layer 66 or as the second on the carrier layer 64. Phosphor layer. In some embodiments, each of the two scales can absorb LED light and can re-emit light of different colors. In these embodiments, the colors from the two phosphor layers can be combined. Used to achieve a more CRI white (warm white) with different white tones. This situation may include light from the yellow phosphor above that may be combined with light from a red phosphor. Different red phosphors can be used, including:

SrxCai.xSiEu, Y; Y=halide;

CaSiAlN3:Eu; or Sr2-yCaySi〇4:Eu 〇 Other phosphors can be used to produce colored luminescence by converting substantially all of the light into a particular color. For example, the following phosphors can be used to produce green light:

SrGa2S4: Eu;

Sr2.yBaySi〇4:Eu; or SrSi202N2:Eu. Some additional fillers suitable for use as conversion particles for the phosphor layer 66 are listed below, although other phosphors may be used. Each phosphor exhibits excitation in the blue and/or UV luminescence spectrum, providing a desired peak luminescence with efficient light conversion and an acceptable Stokes shift: yellow/green (Sr ,Ca,Ba)(Al,Ga)2S4 :Eu2+

Ba2(Mg,Zn)Si2〇7:Eu2+ 154494.doc -27- 201144686

Gd〇.46Sr〇.3iAl1.23〇xF1.3 8:Eu2+0 〇6 (Ba Bu x-ySrxCay)Si〇4:Eu

Ba2Si〇4:Eu2+ red

Lu2〇3: Eu3 + (Sr2-xLax)(Ce1.xEux)〇4 Sr2Cei.xEux04 Sr2-xEuxCe04 SrTi03:Pr3+,Ga3 +

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ may use different sized light body particles including, but not limited to, particles ranging from meters (nm) to 30 microns (μιη) or 30 microns (μιη) or more. In terms of scattering and mixing colors, smaller particles are usually better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer "in the binder, and the phosphor may also have different concentrations or loads of phosphor material in the binder. Typical concentrations range from 30% to 70% by weight. In one embodiment, the resolution of the carcass is about 65% by weight, and is preferably uniformly dispersed throughout the distal phosphor. The phosphor layer 66 can also have conversion materials with different conversion materials and different concentrations. Different zones. Different materials can be used for the adhesive, wherein the material is preferably strong after curing and is substantially transparent in the visible wavelength spectrum. Suitable materials include polyfluorene 154494.doc • 28- 201144686 Oxygen oxy-moon tree, glass Inorganic glass, dielectric, BCB, polyamine, polymer and their mixtures, among which the preferred material is polyfluorene (this is due to the high transparency and reliability of polyoxo in high power LED). Suitable bases • Polyphenyl and methyl groups are available from Dow® Chemical. Many different curing methods can be used to cure the adhesive depending on the type of adhesive used. Different curing methods include, but are not limited to, thermal curing, ultraviolet (uv) curing, infrared (IR) curing or air curing. The polishing layer 66 can be applied using different processes, including but not limited to 3⁄4 Tanning, splashing, printing, powder coating, electrophoretic deposition, electrostatic deposition, and others. As mentioned above, the phosphor layer 66 can be coated with the binder material, but it should be understood that no binder is required. In an embodiment, the phosphor layer 66 can be separately fabricated and then the phosphor layer 66 can be mounted to the carrier layer 64. In one embodiment, the phosphor-adhesive mixture can be sprayed or dispersed over the carrier layer 64, followed by The binder cures to form phosphor layer 66. In some of these embodiments, the phosphor/binder mixture can be sprayed, poured or dispersed onto or onto heated carrier layer 64 such that When the phosphor binder mixture contacts the carrier layer 64, heat from the carrier layer 64 is dispersed into the binder and the binder is cured. These processes may also include solvents in the disc-binder mixture. The solvent liquefies the mixture and reduces the viscosity of the mixture, making the mixture more suitable for spraying. Many different solvents can be used including, but not limited to, toluene, benzene, zylene or from Dow. Corning® commercially available OS-20, and may use solvents of different concentrations of 154494.doc •29· 201144686. When spraying or dispersing the solvent-phosphor-binder mixture onto the heated carrier layer 64 The heat of the carrier layer 64 evaporates the solvent 'where the temperature of the carrier layer affects the rapid evaporation of the solvent. The heat from the carrier layer 64 also cures the binder in the mixture leaving a fixed fill layer on the carrier layer. The carrier layer 64 can be heated to a number of different temperatures, depending on the materials used and the desired solvent evaporation and adhesive cure rate. Suitable temperatures range from 90 °C to 150 °C, but it should be understood that other temperatures may be used. Various deposition methods and systems are described in D〇n〇fri〇 et al. entitled "Systems and Methods for Application of Optical

U.S. Patent Application Publication No. 2010/0155763, the disclosure of which is incorporated herein by reference. The carbon layer 66 can have a plurality of different thicknesses depending, at least in part, on the concentration of the plexite material and the desired amount of light to be converted by the structuring layer 66. The phosphor layer according to the present invention can be coated at a concentration level higher than 30% (phosphor load). Other embodiments may have a concentration level above 50%, while in other embodiments the concentration level may be above 60 〇/〇. In some embodiments, the light-filling layer can have a thickness in the range of 10 microns to 100 microns, while in other embodiments, the phosphor layer can have a thickness in the range of 40 microns to 5 microns. The methods described above can be used to coat multiple layers of the same or different phosphor materials, and different phosphor materials can be applied in different regions of the carrier layer using known masking processes. The method described above provides some thickness control for the phosphor layer 66, but for even greater thickness control, the can light layer can be ground to reduce the fill layer 66 using a method known as !54494^ • 30· 201144686 Thickness or leveling the thickness over the entire layer. This abrasive feature provides the added advantage of being able to produce a lamp that emits within a single sorting level on the CIE chromaticity diagram. Sorting is generally known in the art and is intended to ensure that the led or lamp provided to the end customer emits light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to as sorting in this technique) by color or brightness. Each sorting level typically contains LEDs or lights from a group of colors and brightness, and is typically identified by a sorting level code. White LEDs or lamps can be classified by chromaticity (color) and luminous flux (brightness). The thickness control of the phosphor layer provides greater control in controlling the amount of light that is converted by the phosphor layer to produce a light that emits light within the target sorting level. A plurality of wall carriers 62 having a calender layer 66 of the same thickness can be provided. Lamps having nearly identical emission characteristics can be fabricated by using light sources 5 8 having substantially the same illumination characteristics, which in some examples can fall within a single sorting level. In some embodiments 'lamp illumination is within the standard deviation from the point on the CIE diagram, and in some embodiments 'the standard deviation contains less than 1 〇 step (1〇_step) McAdams ellipse . In some embodiments, the illumination of the lamp is within a 4-step MacAdam ellipse centered at CIExy (0.3 13, 0.323). The filler carrier 62 can be mounted and bonded to the opening in the cavity μ using a different known method or material, such as a thermally conductive bonding material or a thermal grease. Conventional thermal greases may contain ceramic materials such as oxidized wrinkles and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, 154494.doc • 31· 201144686 thermally conductive devices (such as 'clamp mechanism, A screw or thermal adhesive) mounts the phosphor carrier over the opening to hold the phosphor carrier 62 tightly to the fin structure to maximize thermal conductivity. In one embodiment, a thermal grease layer having a thickness of about 100 μηιη and a thermal conductivity of 1^0.2 w/m_k is used. This configuration provides an effective thermally conductive path for dissipating heat from the phosphor layer 66, as mentioned above, providing different lamp embodiments without cavities, and in addition to being above the opening of the cavity, the phosphor carrier is also It can be installed in many different ways. During operation of the lamp 50, phosphor conversion heating is concentrated in the phosphor layer 66, such as centered on the phosphor layer 66, most of which strikes the phosphor carrier 62 at the center of the phosphor layer 66 and passes through the phosphor carrier 62. . The thermally conductive nature of the carrier layer 64 causes the heat to spread laterally toward the edge of the rim carrier, as exhibited by the first heat stream 70. Heat is passed through the thermal grease layer at the edges and into the fin structure 52, as shown by the second heat flow 72, in which heat can be efficiently dissipated to the environment. As discussed above, in the lamp 5〇, the platform % and the heat sink structure can be connected or consuming the configuration light carrier (4). The light source shares a heat conduction path for heat dissipation along a small portion. The heat from the light source through the platform 56 (e.g., by the third flow 74 screens, +, 丄 ... L 4) can also be distributed to the heat sink structure 52. The heat from the phosphor carrier 62 flowing into the diffuser sheet gentleman s τ heat sheet structure 52 can also flow into the platform 56. As will be described in the following, in other embodiments, the phosphor carrier 62 and the light source 54 can be used for separate heat conduction paths for heat dissipation, wherein such individual paths are referred to as "decoupling." It should be understood that in addition to the example shown in Figure 4, the phosphor carrier can be configured in different ways. The disc layer can be on either surface of the carrier layer 154494.doc • 32· 201144686 or can be mixed in the carrier layer. The scale carrier may also comprise a scattering layer which may be included on the scale layer or carrier layer or mixed in the phosphor layer or carrier layer. It should also be understood that the phosphor and scattering layer may not cover the entire surface of the carrier layer, and in some embodiments, the conversion layer and the scattering layer may have different concentrations in different regions. It should also be understood that the phosphor support may have surfaces of different roughness or shape to enhance transmission through the phosphor support. As mentioned above, the diffuser is configured to disperse light from the phosphor carrier and LED into the desired lamp emission pattern and can have many different shapes and sizes. In some embodiments, the diffuser can also be disposed over the phosphor carrier to shield the phosphor carrier when the lamp is not emitting light. The diffuser can have a material to impart a substantially white appearance to impart a white appearance to the bulb when the lamp is not illuminated. At least four properties or characteristics of the diffuser can be used to control the output beam characteristics of the lamp 5〇. The first attribute or characteristic is a diffuser geometry that is independent of the disc layer geometry. The second attribute or characteristic is the diffuser geometry for the phosphor layer geometry. 1 Three properties or characteristics are diffuser scattering properties, including The nature of the scattering layer and the smoothness/roughness of the diffuser surface. The fourth attribute or characteristic is the distribution of diffusers on the surface (such as the intentional unevenness of the scattering). These attributes allow control of, for example, the ratio of axially emitted light relative to "lateral" emitted light (~90.) and also relative to "high angle" (>~13〇.). These properties can also be applied differently depending on the geometry of the phosphor carrier and the light source and the pattern of light emitted by the photo carrier and the light source. For a bis-transistor carrier and/or a light source (such as the one shown in Figure 4, 154494.doc • 33- 201144686, etc.), the emitted light is substantially forward (e.g., Lambertian). The attributes listed above for these embodiments can provide for the dispersion of the forward emission pattern into a broad beam intensity profile. Variations in the second and fourth properties may be particularly useful for achieving a broad beam omnidirectional emission from the forward emission profile. For a three-dimensional scale carrier (described in more detail below) and a three-dimensional source, the emitted light is greater than 90 under conditions where the emission is not blocked by other lamp surfaces, such as heat sinks. It can already have a significant emission intensity. As a result, the diffuser properties listed above can be used to provide further adjustment or fine adjustment of the beam profile from the phosphor carrier and source such that it more closely matches the desired output beam intensity, color uniformity, color point, and the like. In some embodiments, the beam profile can be adjusted to substantially match the output from a conventional incandescent bulb. With respect to the first attribute above regarding the diffuser geometry independent of the phosphor geometry, in embodiments where the light system is uniformly emitted from the diffuser surface, 'relative to the lateral direction (~9 〇.) And the amount of light referred to as "forward" (axially or ~ 〇.) relative to "high angle" (>~130°) may depend extremely on the cross-sectional area of the diffuser when viewed from the other side. Many different diffusers having different shapes and properties can be used in different embodiments herein, including but not limited to such embodiments as shown and described in the following applications:

Tong's special title is "LED Lamp With Remote Phosphor and

U.S. Patent Application Serial No. 61/339,515 to Diffuser ConHguration, and U.S. Patent Application Serial No. 12/901,405, entitled,,,,,,,,,,,,,,,,,, The case is also given to Cree, 154494.doc -34 · 201144686

Inc, and is incorporated herein in its entirety. In addition to their features described herein, in their lamp embodiments, the cavity according to the present invention may include many different features. Referring again to Figure 4 54, the "hot material" can be filled to further enhance the heat dissipation of the lamp. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. The heat from the source will still be via The platform 56 conducts, but can also pass through the cavity material to the fin structure 52. This situation will allow for lower operating temperatures of the source 58, but pose a higher operating temperature hazard for the phosphor carrier 62. This configuration can be used for Many different embodiments, but particularly suitable for lamps with higher light source operating temperatures (compared to the operating temperature of the phosphor carrier), allowing for more efficient application in applications that can tolerate additional heating of the phosphor carrier layer The heat is dissipated from the light source. As discussed above, different lamp embodiments in accordance with the present invention may be configured with many different types of light sources. Figure 5 shows another embodiment of the lamp 21, which is similar to that described above and The lamp 5 shown in Figure 4. The lamp 21A includes a heat sink structure 212 having a cavity 214 having a platform 216 configured to hold the light source 218. The phosphor carrier 220 can be included in the cavity 214. Above the opening and at least partially covering the opening ^ In this embodiment, the light source 28 can comprise a plurality of LEDs configured in a separate LED package or in an array in a single multi-LED package. [Embodiment of the ED package, each of the LEDs may include its own primary optics or lens 222. In embodiments having a single multi-LED package, a single primary optic or lens 224 may cover all of the LEDs It should also be understood that LEDs and LED arrays may have secondary optics or may have a combination of primary light and secondary optics. It should be understood that lensless LEDs may be provided and in the array In an embodiment, each of the LEDs may have its own lens. Like the lamp 50, the heat sink structure and platform may be configured with the necessary electrical traces or wires to provide an electrical signal to the light source 21 8 . In one embodiment, the illuminators can be coupled in different series and parallel configurations. In one embodiment, eight LEDs can be used, which are connected in series to the circuit board by two wires. The wires are connected to the power supply unit described above. In other embodiments, more than eight or fewer LEDs may be used and as mentioned above, LEDs available from Cree, Inc. may be used, including Eight XLamp® XP-E LEDs or four XLamp® XP-G LEDs. Different single-string LED circuits are described in the following U.S. patent application: van De Ven et al. entitled "Color Control of Single String Light Emitting Devices" US Patent Application Serial No. 12/566,195 to Having Single String Color Control, and U.S. Patent Application Serial No. 12/704,730, entitled "Solid State Lighting Apparatus with Compensation Bypass Circuits and Methods of Operation Thereof", by van de Ven et al. The two applications are hereby incorporated by reference. In the lamps 50 and 210 described above, the light source shares a thermal path (referred to as thermal coupling) for dissipating heat with the phosphor carrier. In some embodiments, if the thermal path for the phosphor carrier and the source is not thermally coupled (referred to as thermal decoupling), the heat dissipation of the phosphor carrier can be enhanced. Figure 6 shows yet another embodiment of a lamp 300 in accordance with the present invention that includes an optical cavity 302 within a heat sink structure 305. Similar to the above embodiment, a 154494.doc-36-201144686 lampless cavity lamp 300 can also be provided, wherein the LEDs are mounted on the surface of the heat sink or mounted on a three-dimensional structure or pedestal structure having a different shape. A light source 304 based on a flat = LED is mounted to the platform 306, and a phosphor carrier 3〇8 is mounted to the top opening of the cavity 302, wherein the phosphor carrier 3〇8 has any of the features described above. In the illustrated embodiment, the phosphor carrier 3〇8 can be in the shape of a flat disk and comprise a thermally conductive transparent material and a phosphor layer. Phosphor carrier 308 can be mounted to the cavity together with a thermally conductive material or device as described above. Cavity 302 can have a reflective surface to enhance emission efficiency, as described above. Light from source 304 passes through phosphor carrier 3〇8, which is partially converted by the phosphor in phosphor carrier 3〇8 into light of different wavelengths in phosphor carrier 308. In an embodiment, the light source 3〇4 may comprise a blue light emitting LED 'and the phosphor carrier 3 8 may comprise a yellow phosphor as described above. The yellow phosphor absorbs a portion of the blue light and re-emits yellow light . The lamp 3 00 emits a combination of LED light and white phosphor of yellow phosphor light. Like the above, light source 304 can also include a plurality of different LEDs that emit light of different colors, and the phosphor carrier can include other phosphors to produce light having a desired color temperature and color rendering properties. Lamp 300 also includes a shaped diffuser dome 31 mounted on cavity 302. The diffuser dome 310 includes diffusing or scattering particles such as those diffusing or scattering particles listed above. Provided in a curable adhesive 'the curable adhesive is formed in a generally dome shape. In the illustrated embodiment, the dome 310 is mounted to the heat sink structure 305 and has an enlarged portion at the end opposite the heat sink structure 305. Different binder materials such as polyfluorene oxide, epoxy resin, glass, inorganic glass, dielectric, BC:B, polyamide, polymer and the like can be used as described above in 154494.doc -37· 201144686 Mixture. In some embodiments, white scattering particles can be used for a white dome that hides the color of the phosphor in the phosphor carrier 3〇8 in the optical cavity. This gives the entire lamp a white appearance of 3, which is generally more visually acceptable to the consumer or more attractive to the consumer than the color of the phosphor. In one embodiment, the diffuser can comprise white titanium dioxide particles, and the white titanium dioxide particles can impart an overall white appearance to the diffuser dome 3 1 . The diffuser dome 310 provides the added benefit of distributing the light emitted from the optical cavity in a more uniform pattern. As discussed above, light from a source in the optical cavity can be emitted in a substantially Lambertian pattern, and the shape of the dome 31 and the scattering properties of the scattering particles cause the light to travel from the dome in a more omnidirectional emission pattern. The dome of the design may have different concentrations of scattering particles in different zones or may be shaped into a particular emission pattern. In some embodiments, the dome can be engineered such that the emission pattern from the lamp follows the omnidirectional distribution criteria defined by the Energy Source (DOE) Energy Star. The requirement for the lamp 3 〇〇 is that the uniformity of the emission must be at 〇. As for 35. Within 20% of the average value under review; and >5% of the total flux from the lamp must be between 135 and 180. Launched in the launch area, where the measurement system is in the 〇. 45. , - azimuth. As mentioned above, the different lamp embodiments described herein may also include a-type trim LED bulbs that meet the DOE Energy Star standard. The present invention provides an efficient, reliable, and cost effective lamp. In some embodiments, the entire lamp can include five components that can be assembled quickly and easily. 154494.doc -38- 201144686 Similar to the above embodiment, the lamp 300 can include a mounting mechanism of the type installed in conventional electrical outlets. In the illustrated embodiment, the lamp 3A includes a threaded portion 312 for mounting to a standard threaded seat. Like the above embodiments, the lamp 300 can include a standard plug and the electrical socket can be a standard socket, or the electrical socket can include a GU24 base unit, or the lamp 3 can be a clip and the electrical socket can receive and hold the clip Socket (for example, as used in many fluorescent lamps). As discussed above, the space between some of the features of the lamp 3 can be considered as a mixing chamber, wherein the space between the source 306 and the phosphor carrier 3〇8 includes the first light mixing chamber. The workspace between the phosphor carrier 3 〇 8 and the diffuser 31 可 can include a first light mixing chamber that promotes uniform color and intensity emission of the lamp. The same can be applied to the following embodiments of phosphor carriers and diffusers having different shapes. In other embodiments, additional diffusers and/or phosphor carriers that form additional mixing chambers may be included, and the diffusers and/or scale carriers may be configured in a different order. Different lamp embodiments in accordance with the present invention can have many different shapes and sizes. 31 shows another embodiment of a lamp 32A in accordance with the present invention, similar to lamp 3, and similarly includes an optical cavity 322 in a heat sink structure 325, wherein light source 324 is mounted to platform 326 in optical cavity 322. . Similar to the above, the rose sheet structure does not need to have an optical cavity, and the light source can be provided on other structures than the heat sink structure. Such structures may include a planar surface or pedestal having a light source. Phosphor carrier 328 is mounted over the inter-cavity opening by a thermal connector. Lamp 320 also includes a diffuser dome 330 mounted to the heat sink structure 325 above the optical cavity. The diffuser dome can be made of the same material as described above and the diffuser dome 31〇 shown in Figure 15, but in this embodiment 154494.doc -39- 201144686 the 'the dome 300 is shaped as Elliptical or egg-shaped to provide a different lamp emission round while still obscuring the color of the phosphor from the phosphor carrier 328. Also note that the heat sink structure 325 and the platform 326 are thermally decoupled. That is, there is a space between the platform 326 and the heat sink structure such that it does not share a heat path for heat dissipation. As mentioned above, this provides improved heat dissipation from the phosphor carrier as compared to lamps that do not have a decoupled thermal path. Lamp 300 also includes a threaded portion 332 for mounting to a threaded seat. Figures 8 through 1 show another embodiment of a lamp 34A in accordance with the present invention, which is similar to the lamp 32 shown in Figure 31. The lamp 34A includes a heat sink structure 345 having an optical cavity 342 (where the optical cavity 342 has a light source 344 on the platform 346) ' and a phosphor carrier 348 lamp 34 above the optical cavity further includes a threaded portion 352 ^ The lamp 340 also includes a diffuser dome 35A, but in this embodiment the 'diffuser dome is flattened at the top to provide the desired emission pattern' while still obscuring the color of the phosphor. Lamp 340 also includes an interface layer 354 between light source 344 and fin structure 345 from light source 344. In some embodiments, the interface layer can comprise a thermally insulating material' and the light source 344 can have features that promote dissipation of the thermal self-illuminator to the edge of the substrate of the light source. This situation can promote heat dissipation to the outer edge of the fin structure 345. At these outer edges, heat can be dissipated via the fins. In other embodiments, the interface layer 354 can be electrically insulating to electrically isolate the heat sink structure 345 from the light source 344. Electrical connection to the top surface of the source can then be made. In the above embodiments, the phosphor carrier is two-dimensional (or flat/planar) while the LEDs in the source are coplanar. However, it should be understood that in other lamps 154494.doc -40· 201144686, the phosphor carrier can take many different shapes, including different

Light. A three-dimensional carrier layer similar to the above-described diffuser L light source and also dispersing different shapes from the light source may have emission patterns of different characteristics to emit light depending on the emission pattern of the light source. The diffuser can then be matched to the emission of the phosphor carrier to provide the desired lamp emission pattern. Figure 11 shows a hemispherical shaped phosphor carrier 354 comprising a hemispherical carrier 355 and a fill layer 356. The hemispherical carrier 355 can be made of the same material as the carrier layer described above, and the phosphor layer can be made of the same material as the phosphor layer described above, and the scattering particles can be included in the carrier and phosphorescent as described above. In the layer. In this embodiment, phosphor layer 356 is shown as being on the outer surface of carrier 355 'But it should be understood that the phosphor layer may be on the inner layer of the carrier, mixed with the carrier' or any combination of the three above. In some embodiments Having a phosphor layer on the outer surface minimizes emission losses. When the illuminator light is absorbed by the phosphor layer 356, the light system emits omnidirectionally, and some of the light can be emitted backwards and absorbed by a lamp element such as an LED. Phosphor layer 356 can also have a different index of refraction than hemispherical carrier 355 such that light emitted forward from the phosphor layer can be reflected back from the inner surface of carrier 355. This light can also be attributed to the loss of the light element by 154494.doc •41 · 201144686. In the case where the phosphor layer 356 is located on the outer surface of the carrier 355, the light emitted forward does not need to pass through the carrier 355 and will not be lost due to reflection. The light that is emitted backwards will hit the top of the carrier where at least some of the light will be reflected back. This configuration results in a decrease in the light emitted from the phosphor layer 3 56 back into the carrier. In the carrier, light can be absorbed. Phosphor layer 356 can be deposited using many of the same methods described above. In some examples, the three-dimensional shape of the carrier 355 may require additional steps or other processes to provide the necessary coverage. In embodiments where the solvent-phosphor-binder mixture is sprayed, the support can be heated as described above, and multiple nozzles may be required to provide the desired coverage (e.g., 'near uniform coverage') over the support. In other embodiments, fewer nozzles can be used to simultaneously rotate the carrier to provide the desired coverage. Similar to the above, the heat from the carrier 35 5 evaporates the solvent and helps to cure the binder. In still other embodiments, the phosphor layer can be formed via an ink immersion process' whereby a phosphor layer can be formed on the inner or outer surface of the carrier 355, but it is particularly suitable for formation on the inner surface. The carrier 35 5 may be at least partially filled with a scale mixture adhered to the surface of the carrier or otherwise contact the carrier 355 with the phosphor mixture. The mixture can then be discharged from the support to leave a layer of phosphor mixture on the surface. The layer of phosphor mixture can then be cured. In one embodiment, the mixture may comprise polyethylene oxide (PEO) and a phosphor. The support can be filled and then the support can be evacuated leaving a layer of PEO-phosphor mixture which can then be thermally cured to evaporate or be dissipated by heat, thereby leaving a fill layer. In some embodiments, a binder may be applied to further stabilize the phosphor layer, while in other embodiments, the phosphor may remain without the binder. Similar to the process for coating a planar carrier layer, such processes can be used in a three-dimensional carrier to coat a plurality of phosphor layers that can have the same or different phosphor materials. The phosphor layer can also be applied to both the interior and exterior of the carrier and can be of different types having different thicknesses in different regions of the carrier. In still other embodiments, different processes can be used, such as coating the carrier with a sheet of phosphor material that can be thermally formed to the carrier. In a lamp utilizing the carrier 355, the illuminator can be disposed at the base of the carrier such that light from the illuminator is emitted upwardly and through the carrier 355. In some embodiments, the illuminator can illuminate in a substantially Lambertian pattern and the carrier can help disperse the light in a more uniform pattern. Figure 12 shows another embodiment of a three-dimensional phosphor carrier 357 comprising a bullet-shaped carrier 358 and a phosphor layer 359 on the outer surface of the carrier, in accordance with the present invention. Carrier 358 and phosphor layer 359 can be formed from the same materials as described above using the same methods as described above. Different shaped phosphor carriers can be used with different illuminators to provide the desired overall lamp emission pattern. Figure 13 shows a further embodiment of a three-dimensional phosphor carrier 360 comprising a sphere-shaped carrier 361 and a disc layer on the outer surface of the carrier, in accordance with another embodiment of the present invention. Carrier 361 and phosphor layer 362 can be formed from the same materials as described above using the same methods as described above. Figure 14 shows a phosphor carrier 363 which is not in accordance with the present invention. The phosphor carrier 3 63 has a substantially spherical shape carrier 3 64 and a narrow neck portion 154494.doc • 43· 201144686 365. Like the above embodiment, the phosphor carrier 363 includes a light-emitting layer 366 on the outer surface of the carrier 364, the phosphor layer 366 being made of the same material as described above and using the method described above. The same method is formed. In some embodiments t, a phosphor carrier having a shape similar to the carrier 364 may have more in converting the illuminator light and re-emitting the Lambertian-like light from the light source into a more uniform emission pattern. effectiveness. Embodiments having a three-dimensional structure (such as a pedestal) that holds the LEDs can provide a more dispersed light pattern from the two-dimensional filler carrier. In these embodiments the 'LEDs can be at different angles within the phosphor carrier such that the LEDs provide a light emission pattern that is less similar to the Lambertian pattern than a planar LED source. This can then be further dispersed by a three-dimensional phosphor carrier, wherein the disperser fine-tunes the emission pattern of the lamp. 15 through 17 show another embodiment of a lamp 3 〇 according to the present invention having a heat sink structure 372, an optical cavity 374, a light source 376, a diffuser dome 378, a threaded portion 380, and a housing 38. The example also includes a three-dimensional phosphor-loaded 鳢 382 'three-dimensional carbon carrier 3 82 comprising a thermally conductive transparent material and a phosphor layer. The three-dimensional phosphor carrier 382 is also mounted to the heat sink structure 372 by a thermal connector. However, in this embodiment, the phosphor carrier 382 is hemispherical and the illuminator is configured such that light from the source passes through the phosphor carrier 382 where at least some of the light is converted. The shape of the three-dimensional shape of the barrier carrier 382 provides for a natural separation between the phosphor carrier 382 and the source 376. Therefore, the light source 376 is not mounted in the recess formed in the heat sink of the optical cavity. The light source 376 is mounted on the top surface of the heat sink structure 372, wherein the optical cavity 374 is formed by the space between the phosphor carrier 154494.doc • 44- 201144686 382 and the top of the heat sink structure 372. This configuration allows

Directional lateral emission of the optical cavity side

378 blocks this color, and the light carrier 382 can be yellow, and the diffuser dome simultaneously disperses the light into the desired emission pattern. In lamp 370, the conductive path for the platform is coupled to the conductive path for the heat sink structure, but it should be understood that in other embodiments, the conductive path for the platform can be decoupled from the conductive path for the heat sink structure. . Figure 18 shows an embodiment of a lamp 39A in accordance with the present invention comprising eight LED light sources 392 mounted on a heat sink 394 as described above. The illuminators can be coupled together in many different ways and, in the embodiment shown, connected in series. Note that in this embodiment, the illuminator is not mounted in the optical cavity but is mounted on the top planar surface of the heat sink 394. Figure 19 shows the lamp 390 illustrated in Figure 18 with a dome shaped phosphor carrier 396 mounted over the light source 392. The lamp 390 shown in Figure 19 can be combined with the diffuser 398 as shown in Figures 20 and 21 to form a light dispersion of the lamp. Figures 22 through 24 show yet another embodiment of a lamp 41 in accordance with the present invention. Lamp 410 includes many of the same features as lamp 370 shown in Figures 15-17 above. However, in this embodiment, the phosphor carrier 412 is bullet shaped and functions in much the same manner as other embodiments of the phosphor carrier described above. It should be understood that these shapes are only two of the different shapes that the phosphor carrier can employ in various embodiments of the present invention. Figure 25 shows another embodiment of a lamp 420 in accordance with the present invention. Lamp 420 also includes 154494.doc -45- 201144686 including a heat sink 422 having an optical cavity 424 having a light source 426 and a fill carrier 428. Lamp 420 also includes a diffuser dome 430 and a threaded portion 432. However, in this embodiment, the optical cavity 424 can include a separate collar structure 434' as shown in Figure 26, which can be removed from the heat sink 422. This situation provides a single piece that can be coated with a reflective material more easily than the entire heat sink. The collar structure 434 can be threaded to mate with threads in the fin structure 422. The collar structure 434 provides the advantage of adding: the PCB can be mechanically clamped down to the heat sink. In other embodiments, the collar structure 434 can include a mechanical snap-on device rather than a thread for easier manufacture. As mentioned above, the shape and geometry of the three-dimensional phosphor carrier can assist in transforming the emission pattern of the illuminator into another more desirable emission pattern. In an embodiment t, the shape and geometry of the three-dimensional phosphor carrier can assist in changing the Lambertian emission pattern to a more uniform emission pattern at different angles. The disperser can then further transform the light from the phosphor carrier into the final desired emission pattern while obscuring the yellow appearance of the disc when the light is extinguished. Other factors may also contribute to the ability of the illuminator, phosphor carrier, and disperser to produce the desired pattern to be emitted. Figure 27 shows an embodiment of an illuminator footprint 440, a phosphor carrier footprint 442, and a diffuser footprint 444 in accordance with an embodiment of the lamp of the present invention. The phosphor carrier occupies the area 2 and the occupant footprint 444 shows the lower edge of such features around the illuminator 440. In addition to the consistent shape of such features, the distances m and D2 between the edges of such features can also affect the ability of the phosphor carrier and disperser to provide the desired pattern to be emitted. The shape and the distance between the edges can be optimized based on the emission pattern t of the illuminator to obtain the desired lamp emission pattern. It should be understood that in other embodiments, different portions of the lamp (such as 'the entire optical cavity') may be removed. Such features that enable the collar structure 414 to be removed may allow for easier coating of the optical cavity with a reflective layer' and may also allow for removal and replacement of the optical cavity in the event of a failure of the optical cavity. A lamp in accordance with the present invention can have a light source comprising a plurality of different numbers of LEDs, some of which have less than 30 LEDs and in other embodiments have less than 20 LEDs. Still other embodiments may have less than one LED, with fewer LED wafers, the substantially lower cost and complexity of the light source. In some embodiments, the area covered by the plurality of wafer light sources may be less than 30 mm2, and in other embodiments, the area may be less than 2 〇 mm2. In still other embodiments, the area may be less than 1 〇 mm 2 . Some embodiments of the lamp according to the present invention also provide a steady-state light output greater than 4 〇〇 lumens and, in other embodiments, provide a steady-state light output greater than 6 〇〇 lumens. In still other embodiments, the lamp can provide a steady state light output of greater than 800 lumens. Some lamp embodiments can provide this light output by the thermal management features of the lamp, which allow the lamp to be relatively cold to the touch. In one embodiment, the touch temperature of the lamp remains less than 6 〇 C, and in other embodiments, the touch temperature of the lamp remains less than 5 〇. In still other embodiments, the touch temperature of the lamp remains less than 4 〇e > c. Some embodiments of the lamp according to the present invention may also operate at greater than lumens/watt efficiency' and in other embodiments may be greater than 5 〇 lumens, watt efficiency operation. In still other embodiments, the lamp may be greater than 55 lumens/ Special Operation Some embodiments of the lamp according to the present invention can produce light having a color rendering index (CRI) greater than 154494.doc 201144686 70, and in other embodiments, produce light having a CRI greater than 80. In still other embodiments, the lamp can operate at a CRI greater than 90. An embodiment of the lamp according to the invention may have a phosphor 'the phosphors provide a lamp emission having a brightness of greater than 80, and a lumen equivalent of greater than 320 lumens per optical watt at a @3000K correlated color temperature (CCT) Radiation (LER). The lamp according to the invention can also be used as it is. To 135. The distribution luminescence within 40% of the average of the viewing angles is observed, and in other embodiments, the distribution may be within 30% of the average of the same viewing angles. Still other embodiments may have a distribution of 20% of the average value for the same inspection angle (according to Energy Star specifications). These embodiments may also be at 135. To 180. At least 5% of the total flux is emitted at a viewing angle. It should be understood that a lamp or bulb in accordance with the present invention may be configured in many different ways than those described above. The above embodiments are discussed with reference to a remote phosphor, but it should be understood that alternative embodiments may include at least some of the LEDs having a conformal phosphor layer. This situation may be particularly useful for emitting light of different colors from different types of illuminators. Light source. These embodiments may additionally have some or all of the features described above. Such different configurations may include those configurations shown and described in the above incorporated application: U.S. Provisional Patent Application No. entitled "LED Lamp With Remote Ph〇sph〇r and Diffuser Configuration" by Tong et al. U.S. Patent Application Serial No. 12/901,405, the entire disclosure of which is incorporated herein by reference. 154494.doc -48- 201144686 As discussed above, a lamp in accordance with the present invention can include an active component that helps reduce convective thermal resistance. Many different active components can be used, and some embodiments can include one or more fans that can be provided in many different locations in different embodiments in accordance with the present invention. The fans can be configured to agitate air surrounding certain elements of the lamp to reduce convective thermal resistance. These fans can be used in lamps having fins configured in different ways or in lamps that do not have heat sinks. Figures 28 and 29 show an embodiment of a lamp 700 in accordance with the present invention that can take many different shapes and sizes, but in the illustrated embodiment has dimensions adapted to the size of the xenon lamp bulb as shown in Figure 3. . The lamp 7A includes a heat sink 702 in which the LED 704 is mounted to the base 706, which in turn is mounted to the heat sink 702. LEDs can be mounted to many different pedestal shapes, such as T〇ng et al., filed on August 2, 2010 and entitled "LED_Based"

Their pedestal shapes are disclosed in U.S. Patent Application Serial No. 12/848,825, the entire disclosure of which is incorporated herein. This application is incorporated herein by reference. The LEDs can also be provided in a planar configuration, as described and illustrated in the above embodiment. The heat sink 702 is similar to the heat sink described in the above embodiments and can be in thermal contact with all or some of the heat generating elements of the lamp to dissipate heat generated during operation. Similar to the heat sink described above, the heat sink 7〇2 may at least partially comprise a thermally conductive material' and may impart multiple (4) thermal conductivities (d), including different metals (such as copper or aluminum) or metal alloys. The heat sink 7〇2 may also include heat sink fins 708 that increase the surface area of the heat sinks 7〇2 to promote more efficient dissipation into the environment. In the illustrated embodiment, the fins 708 are shown in a generally horizontal orientation of water 154494.doc • 49-201144686, but it should be understood that in other embodiments the 'tabs may have vertical/orthogonal or angled Orientation. Lamp 700 further includes a base/slot 71 (such as a threaded seat) that includes features that allow the lamp to be screwed into or connected to a power source. As above, other embodiments may include a standard plug and the electrical socket may be a standard socket, may include a GU24 base unit, or it may be a clip and the electrical socket may be a socket that receives and holds the clip (eg, such as many fluorescent Used in the lamp). Similar to the above embodiments, the base/slot may also include a power supply or power conversion unit that may include a driver to allow the light bulb to be powered by the AC line voltage/current and, in some embodiments, a light source Dimming ability. Lamp 700 also includes a bulb or diffuser dome 712 that may have the characteristics of a diffuser dome as described above. It should include diffuser scattering properties, and different embodiments of diffuser dome 712 can include a carrier made of a different material such as glass or plastic and one or more scattering films, layers or regions. As discussed above, the scattering properties of the diffuser dome can be provided as one or more of the scattering particles listed above. In some embodiments, the diffuser dome 712 can be configured to scatter light emitted from the LEDs 704 on the pedestal 706 into a more uniform emission pattern. That is, the scattering properties of the diffuser dome 712 can change the light pattern from [ED 704 to a more uniform emission pattern. It should be understood that the lamp may also comprise a wall carrier configured in a planar or three dimensional manner as described above. Fan 714 is included in lamp 700, and in the illustrated embodiment, fan 714 is located at the base of heat sink 702 between base 710 and heat sink 7〇2. Fan 714 is configured to break into ambient air and allow air to flow over the surface of heat sink 154494.doc -50- 201144686 702. The drive circuit from the base 71 turns power to the fan 714 (and the LED 704). 30 through 32 show an embodiment of a fan 714 in accordance with the present invention. The fan 714 includes a rotor 716 that rotates about a center mount 71 8 in response to an electrical signal. The center mount 718 can include bearings 72〇 to allow relative free rotation of the rotor. Different types of bearings can be used. The preferred bearing is a ceramic that improves the life of the fan. The center mount 718 also includes electrical contacts 722, both of which are provided to apply an electrical signal to the fan 714. The other contacts M2 are configured to pass through the center mount 718 such that electrical signals applied to the contacts are passed through to the LEDs 704. Fan 714 can be of many different shapes and sizes, and in some embodiments can have a diameter of less than 100 mm. In other embodiments, the diameter may be less than 75 mm, and in still other embodiments, the diameter may be less than 5 in the embodiment. In one embodiment, the fan 714 may have a diameter of about 4 mm. The fan can also be configured to move air at different rates, with some embodiments moving less than 3 cubic feet per minute (CFM) of air and other embodiments moving less than 2 CFM of air. In one embodiment, the rate of air flow is about 丨CFM. The power consumed by the fan should be as low as possible, which results in some embodiments consuming less than 〇5 W and other embodiments consuming less than 0.3 W. In still other embodiments, the fan can consume less than 0.1 W. The noise generated by the fan should also be minimized, with some embodiments producing less than 30 decibels (dB) of noise, and other embodiments producing less than 20 dB of noise. In still other embodiments, the fan can produce less than 15 dB of noise. The reliability of the fan should be maximized, some of which have a service life of more than 50,000 hours, and the other 154494.doc • 51 · 201144686 embodiments have a service life of more than 100,000 hours. Cost should also be minimized. In some embodiments, each cost is less than one dollar. In some embodiments, the rotation of the rotor 716 can have an approximately linear dependence on the fan drive voltage. In one embodiment, a driving voltage of 35 V produces a rotor rotation of 820 rpm, wherein the power consumption of the fan is estimated to be about 0.1 W. At a driving voltage of 12 V, the rotor rotates at 36 rpm and produces noise in the range of twenty dB. It is estimated that the noise generated under 35 乂 operation is much lower and can be in the range of more than a dozen db. Fans with ceramic ball bearings increase the operating life under normal operating conditions to more than i〇〇k hours. At reduced rotational speeds (for example, 3 5 v), the life of the fan can be longer. Figures 33 and 34 show experiments in which the fan reduces the convective thermal resistance of the heat sink. H is commercially available heat sink T for A bulb replacement (Figure 33) and heat sink S for MR16 lamp (Figure 34). The convection thermal resistance was measured using a conventional claw 111 fan. In the case of fan shutdown (pure natural convection), the heat sinks T and S respectively show the osaka / convection heat ^ When the fan is operated under the nominal 12 V#, the convective thermal resistance is about 2 5 _ And 2.7 ° C / W (or 69% and 79% lower than pure natural convection, respectively). In the fan of 3.5. Under reduced operating conditions of V, the convective thermal resistance is 嶋 6.1 ° C / w (or 26% and 53% lower than pure natural convection). In addition to the reduction in convective thermal resistance, another advantage of the integrated wind-group design is illustrated in FIG. Image 73 shows the heat buildup in the laterally oriented lamp M2. Image 734 illustrates the heat dissipation provided in a 7% lateral light with a fan in accordance with the present invention. In the case of forced convection flow from the fan element 154494.doc • 52· 201144686, the heat sink convection thermal resistance in lamp 730 is relatively less susceptible to the spatial orientation of the illuminator. In contrast, pure natural convection can have a convective thermal performance change of greater than 20% based on the orientation of the fins. It is worth noting that the forced flow of 0.5 m/s from the fan in the simulation is relatively low, corresponding to about 1 CFM (cubic 呎/min p. This air flow rate is about 20 times lower than that of a typical cpu cooling fan. With the help of the forced flow of the fan element, the heat sink fins 708 of the heat sink 7〇2 can be made much denser, thereby further increasing the convective heat transfer by increasing the surface area. In the case of pure natural convection, it is difficult to achieve a denser Heat sink fins because dense fin structures block natural convection flow to a greater extent and reduce convective heat transfer. Fan components with minimal power consumption can significantly reduce system convection heat in such denser fin configurations This allows the lower junction temperature of the LED and the lower junction temperature of the phosphor material, resulting in better illumination efficiency and better reliability of the system. A better thermal system allows the LED to be driven at a higher current. Reducing the cost per light output 0 As mentioned above, the fan can be deployed in many different locations in the lamp to provide air flow across different regions or different features of the lamp. Figure 36 The column shows another embodiment of a lamp 740 according to the present invention. The lamp 74A includes a heat sink 742, wherein the LED 744 is mounted in a planar orientation at the top of the heat sink 742 and in thermal contact with the heat sink 742. The base/slot 746 Mounted to heat sink 742, as opposed to LED 744. The base/slot can be configured similar to base/slot 710 shown in Figures 28 and 29. Base/slot 746 can include allowing lamp 74 to be screwed to the thread The features in the socket may also include drive or power conversion circuitry 154494.doc • 53· 201144686 (as described above). In this embodiment, one of the bases/slots 746 is partially disposed within the core 754 of the heat sink 742. Lamp 740 further includes a phosphor carrier 748 and a diffuser dome 750, which may be made of the same materials described above and may have different configurations (as described above). Diffuser dome and conversion The carrier may also be configured as described in the following patent application: US Patent Application entitled "Non-Uniform Diffuser to Scatter Light Into Uniform Emission Pattern", filed on October 8, 2010 by Tong et al. Application Serial No. 12/901, 404. This application is hereby incorporated hereinby incorporated by reference in its entirety in its entirety, the disclosure of the disclosure the the the the the the the the the the the the the the the Within the core 754 of the heat sink 742, at the top of the base/slot 746 and under the LED 744. The fan can be similar to the fan 714' described above with reference to Figures 3A through 32 and can have such sizes And many of the operating characteristics. Similar to fan 714, fan 752 should be modular, reliable, low noise, and consume very little additional power. Fan 752 can also be electrically coupled to base/slot 746 to obtain its operating power. Fan 752 can also be configured to conduct electrical signals from base/slot 746 to LED 744. As described first below, the fan 752 draws air from the outside of the lamp into the fin core 754 and into the diffuser cavity 75 < Air is introduced through the fin core 754 and the diffuser cavity 756 and out of the diffuser cavity to provide a lamp air flow that carries the heat generated during operation and allows the lamp to operate at reduced temperatures. 154494.doc -54 - 201144686 Referring again to FIGS. 36-38, the heat sink 742 includes a lower fin inlet 758' that allows air to enter the fin core 754 when the fan 752 is in operation. Although inlet 758 is shown as being at a particular location in heat sink 742, it should be understood that it can be in many different locations and that there can be many different numbers of inlets. The inlet 758 can be configured to provide a desired air flow across the fins 742 as air is drawn into the fin core 754. Fan 752 causes air to flow into diffuser cavity 756 via diffuser cavity inlet 760 adjacent [ΕΕ) 744 after being drawn to core 754. Figure 37 best illustrates the positioning of the phosphor carrier and diffuser dome on the heat sink 742. Phosphor carrier imaginary line 762 shows the location of the lower edge of phosphor carrier 748 on heat sink 742. As shown by imaginary line 762, the diffuser two-chamber inlet 760 is within the lower edge of the fill carrier. Air entering the diffuser cavity 756 via the diffuser cavity inlet enters the interior of the phosphor carrier 748. Air circulates within the phosphor carrier 748 and is then transferred to the interior of the diffuser via the slot 766. The air then circulates at least partially within the diffuser dome. As best shown by the imaginary line 764, the lower edge of the diffuser dome can overlap the opening between the fins 743 such that air from the slot 766 can then pass over the fins 743 to the diffuser cavity. outer. This configuration provides for the fan to be embedded in the heat sink cavity/core 754 so that the fan is not directly visible from the outside and further reduces fan noise. This configuration also provides internal air flow to the lamp. As shown in Figure 38, the fan/52 draws cooling air from the outside of the lamp 74 through a lower inlet 758 near the base of the heat sink 742. Air is drawn through the heat sink core 754 and over the base/slot 746' at its ten air to cool the circuitry therein. Air then flows into the diffuser cavity 756 in J54494.doc -55- 201144686. In the diffuser cavity 756 it can pass through the LED and impart the originally stagnant air within the diffuser cavity 756. This air flow results in increased air pressure within the diffuser cavity 756 as compared to the air pressure outside the lamp. This pressure differential causes air to exit the diffuser cavity 756 at the edge of the diffuser dome of the overlapping fins 742. In some embodiments, it may be particularly helpful to maximize air flow through the internal spacing between the fins. This forced air flow breaks the boundary air layer, allowing colder air to displace the stagnant warmer air trapped in the space between the fins. When S air is not drawn into the fin core 754 or out of the diffuser cavity 756, at least a portion of the air may flow through the fins 753. This forced air flow agitates the air within the fins, breaking the boundary air layer and allowing the cooler air to displace the stagnant warmer air boundary layer in the gap between the fins. This continuous air flow through the lamp 740 provides an effective configuration for reducing the convective thermal resistance at different locations within the lamp 74. This in turn enhances the overall convective heat dissipation of the lamp 74. The simulation of the embodiment shown reflects that the air flow of about 丨CFM (cubic 呎/min) reduces the natural convection thermal resistance of a typical heat sink by almost 5 〇〇 / ^ at this air flow rate, the noise from the fan is usually extremely low. For example, a commercially available fan of the required size and providing the necessary air flow can have a noise level of about 22 dB, a power consumption of 〇·5 w, and an MTTF of 3 to 5 hours. Lifetime (this depends on the bearing material) and as low as $0.50 each. In the case of reduced convection thermal resistance, the LED junction temperature can be significantly reduced. 154494.doc -56- 201144686 For example, if the heat sink without integrated fan has rc/w (relative to _ input power convection thermal resistance and the heat sink with integrated fan has 3.VC / W convection Thermal resistance, and LED_ takes about i2 w of input power, the LED junction temperature can be reduced by an integrated fan to reduce the thief. This leads to enhanced reliability and / or lower system cost (where higher current Driving less LEDs.) It should be understood that the wind is included in many different lamps that are configured in a number of different ways. Figure 39 shows another lamp in accordance with the present invention, the lamp 78 is similar to that in Figures 36-38. The lamp 74() is shown. The lamp also includes a heat sink LED 784, a base/slot 786, and a diffuser dome 788. It also includes an internal fan that does not take ambient air into the lamp. However, implemented here. In the example, there is no disc carrier to provide simplified air flow within the lamp. Fan 79G draws air to the lamp via the lower fin population (9): and allows air to flow through the diffuser inlet 794 into the diffuser dome. The air then circulates within the diffuser dome 788 and over the LED. Helps agitate, the stagnant air and reduce the convective thermal resistance within the lamp. As above, the lower edge of the diffuser dome 788 overlaps the heat sink fins 796' such that air can exit via the spacing between the heat sinks   Diffuser dome, this allows the air to leave - the originally stagnant air between the heat sinks. As discussed above, in various embodiments, there may be many different inlet and outlet configurations that are provided within the lamp or Different process paths above different features of the lamp. The invention should not be limited to the air paths shown in the above embodiments. Although the invention has been described in detail with reference to the <RTIgt; particular preferred configurations of the invention, 154494.doc-57 - 201144686 Other types are possible. Therefore, the spirit and scope of the present invention should not be limited to the types described above. [Schematic Description] Circle 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; A cross-sectional view showing another embodiment of a prior art LED lamp; FIG. 3 is a cross-sectional view showing an embodiment of the A19 replacement lamp; FIG. 4 is a cross-sectional view of an embodiment of the lamp according to the present invention; A cross-sectional view of another embodiment of a lamp having a diffuser dome; FIG. 6 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; and FIG. 7 is another embodiment of a lamp in accordance with the present invention. Figure 3 is a perspective view of another embodiment of a lamp in accordance with the present invention, wherein the diffuser dome has a different shape; Figure 9 is a cross section of the lamp shown in Figure 8 Figure 10 is an exploded view of the lamp shown in Figure 8; Figure 11 is a cross-sectional view of one embodiment of a three-dimensional phosphor carrier in accordance with the present invention; Figure 12 is another embodiment of a three-dimensional phosphor carrier in accordance with the present invention. Figure 13 is a front view of another embodiment of a three-dimensional filler carrier in accordance with the present invention; Figure 14 is a side view of another embodiment of a three-dimensional filler carrier in accordance with the present invention; 154494.doc • 58· 201144686 Figure 15 is a perspective view of another embodiment of a lamp according to the present invention having a three-dimensional phosphor carrier; Figure 16 is a cross-sectional view of the lamp shown in Figure 15; An exploded view of the lamp shown in Figure 15; Figure 18 is an illustration of the lamp in accordance with the present invention A perspective view of an embodiment of a lamp comprising a heat sink and a light source; Figure 19 is a perspective view of the lamp of Figure 42 having a dome shaped phosphor carrier; Figure 20 is a dome shaped diffuser in accordance with the present invention A side view of one embodiment, FIG. 21 is a cross-sectional view of an embodiment of a dome-shaped diffuser shown in FIG. 44 having dimensions; FIG. 22 is a perspective view of another embodiment of a lamp in accordance with the present invention. Figure 23 is a cross-sectional view of the lamp shown in Figure 22; Figure 24 is an exploded view of the lamp shown in Figure 22; Figure 25 is another embodiment of the lamp in accordance with the present invention; Figure 26 is a cross-sectional view of one embodiment of a collar cavity in accordance with the present invention; Figure 27 is a schematic view showing the footprint of different features of an embodiment of a lamp in accordance with the present invention; Figure 29 is a perspective exploded view of the lamp shown in Figure 28; Figure 30 is a bottom plan view of a fan that can be used in an embodiment of the lamp in accordance with the present invention; 31 is a perspective view of the fan shown in FIG. 30; 154494.doc -5 9- 201144686 Figure 32 is a plan view of the fan shown in Figure 30; Figure 33 is a graph showing the thermal resistance associated with the voltage applied to the fan of a particular heat sink; Figure 34 is a view showing and applying to another heat sink Another graph of the voltage-dependent thermal resistance of the fan; Figure 35 shows the thermal characteristics of a lamp without a fan compared to a lamp having a fan; Figure 36 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; 37 is a cross-sectional view of the lamp of FIG. 36 taken along section line 37-37; FIG. 38 is a cross-sectional view of the lamp shown in FIG. 36 showing the air flow path through the lamp shown in FIG. 36; 39 is a cross-sectional view of still another embodiment of the lamp according to the present invention. [Main component symbol description] 10 Typical LED package 11 Wire bond 12 LED chip 13 Reflector cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 Conventional LED package 22 LED chip 23 Substrate or sub-substrate 154494.doc -60 201144686 24 Metal Reflector 25A Electrical Trace 25B Electrical Trace 26 Encapsulant 27 Wire Bonding Connector 30 A19 Size Bulb Shell 50 Lamp 52 Heatsink Structure 53 Reflective Layer 54 Optical Cavity 56 Platform 58 Light Source 60 Heat Sink 62 Phosphor Carrier 64 Carrier layer 66 Phosphor layer 70 First heat flow 72 Second heat flow 74 Third heat flow 76 Dome diffuser 210 Lamp 212 Heat sink structure 214 Cavity 216 Platform 154494.doc • 61- 201144686 218 Light source 220 Phosphor carrier 222 Primary optics or 224 single primary optics 300 lamp 302 optical cavity 304 light source 305 fin structure 306 platform 308 phosphor carrier 310 shaped diffuser dome 312 threaded portion 320 lamp 322 optical cavity 324 light source 325 fin structure 326 platform 328 phosphorescence Body carrier 330 diffuser dome 332 threaded portion 340 lamp 342 optical cavity 344 light source 345 heat sink structure 154494.doc, 62· 201144686 346 platform 348 phosphor carrier 350 diffuser dome 352 threaded portion 354 interface layer 355 hemispherical carrier 356 phosphor layer 357 three-dimensional phosphor carrier 358 bullet Carrier 359 phosphor layer 360 three-dimensional phosphor carrier 361 sphere shape carrier 362 phosphor layer 363 phosphor carrier 364 sphere shape carrier 365 narrow neck portion 366 phosphor layer 370 lamp 372 fin structure 374 optical cavity 376 light source 378 diffuser dome 380 thread portion 381 Enclosure 154494.doc •63- 201144686 382 3D Phosphor Carrier 390 Lamp 392 LED Source 394 Heatsink 396 Dome-shaped Phosphor Carrier 398 Diffuser 410 Lamp 412 Phosphor Carrier 420 Lamp 422 Heatsink 424 Optical Cavity 426 Light Source 428 Light carrier 430 diffuser dome 432 threaded portion 434 collar structure 440 illuminator footprint 442 phosphor carrier footprint 444 diffuser footprint 700 lamp 702 heat sink 704 light emitting diode (LED) 706 pedestal 708 heat sink fin Slice 154494.doc -64- 201144686 710 Base/slot 712 Bulb or diffuser dome 714 Fan 716 Rotor 718 Center mount 720 Bearing 722 Electric contact 730 Image 732 Light 734 Image 736 Lateral light 740 Light 742 Heat sink 743 Heat sink fin 744 Light Diode (LED) 746 Base/Slot 748 Phosphor Carrier 750 Diffuser Dome 752 Internal Fan 754 Core 756 Diffuser Cavity 758 Lower Heatsink Entry 760 Diffuser Cavity Entrance 762 Phosphor Carrier Negative Line 154494.doc • 65- 201144686 764 imaginary line 766 slot 780 lamp 782 heat sink 784 light emitting diode (LED) 786 base / slot 788 diffuser dome 790 internal fan 792 lower heat sink inlet 794 diffuser inlet 796 heat sink fin D1 Distance D2 Distance 154494.doc - 66 -

Claims (1)

201144686 VII. Patent application scope: 1 · A solid-state light source, comprising: a light-emitting diode (LED); a sheet of thermal contact; and at least some of the lamp elements are opposite to a heat sink, wherein the LED and the heat-dissipating fan It is configured to reduce the flow resistance. 2. The source of claim 1 3. The source of claim 1 one or more surfaces. Wherein the fan is adjacent to the heat sink. Wherein the fan causes air to flow through the heat sink 4. The light source of claim 1, further comprising - a diffuser dome on the heat sink and above the LED. Internally and extracting the ambient air inside the lamp 5. If the light source is called the item i, the fan is in the light assembly - 6. The light source of the item 4 is where the fan is inside the heat sink Air is drawn into the heat sink and air is caused to flow into the diffuser dome. 2. The light source of claim 7, further comprising a phosphor carrier configured to pass at least - of the light from the LED through the phosphor carrier. 8. If the source of the item is requested, the fan is modular. 9. The light source of claim 1, further comprising a base for connection to a power source. 10. The light source of claim 9, further comprising drive electronics formed integrally with the base. 11. The light source of claim 9, wherein the fan is located between the base and the heat sink 154494.doc 201144686. 12. The light source of claim 4, wherein the diffuser dome disperses light from the LED β 13 · a solid state light source comprising: a plurality of light emitting diodes (LEDs); a heat sink opposite to the light source The LEDs are configured such that the LEDs are in thermal contact with the heat sink; and a fan is internal to the lamp and configured to allow air to flow across the surface of the lamp to reduce convective thermal resistance at the surfaces. 14. A solid state light source comprising: a light emitting diode (LED); a heat sink 'where the LED is in thermal contact with the heat sink; and a bulk active air imparting mechanism configured to reduce at least some of the light elements Convection thermal resistance. 15. A solid state light source comprising: a plurality of light emitting diodes (LEDs); a heat sink 'configured relative to the LEDs to cause the LEDs to be in thermal contact with the heat sink; and an active tl piece ' Inside the lamp and configured to allow air to flow across the surface of the lamp to reduce convective thermal resistance at the surfaces. 154494.doc * 2 -