TW201144685A - LED lamp incorporating remote phosphor with heat dissipation features - Google Patents

Abstract

An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote planar phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphor arranged according to the present invention can operate at lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor.

Description

201144685 VI. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to solid state lamps and light bulbs, and more particularly to efficient and reliable light-emitting diodes (LEDs) comprising a remote phosphor having heat dissipation characteristics. ) lights and bulbs. This application claims the rights of the following applications: US Provisional Patent Application No. 61/339, 5 16, filed March 3, 2010; March 3, 2010, US Patent Application for Application US Provisional Patent Application No. 61/386, 437, filed on September 24, 2002, and US Provisional Application No. 61/424,665, filed December 19, 2010 US Provisional Application No. 61/424 67 曰, filed on December 19, 2013; US Provisional Patent Application No. 61/434,355, filed January 19, 2011; January 23, 2011 U.S. Provisional Patent Application Serial No. 61/435,326, filed on Jan. 24, 2011. This application is also a part of the following applications and claims the following applications: 20 1 US Patent Application No. 12/848,825, filed on August 2, 2010; application on September 24, 2010 U.S. Patent Application Serial No. 12/889,719; and U.S. Patent Application Serial No. 12/975,820, filed on Dec. 22, 2010. This invention was made with government support under Contract No. FC__08NT01577 of the US Department of Energy. The government has certain rights in the invention. [Prior Art] A light-emitting diode (LED) is a solid-state device that converts electrical energy into light, and generally comprises one of semiconductor materials sandwiched between layers of opposite doping type or a plurality of active layers of J54446.doc 201144685. When a waste is applied across the miscellaneous layers, holes and electrons are injected into the active layer' in the active layer, and the holes recombine with the electrons to produce light. Self-acting layer and emit light from all surfaces of the LED. In order to use LED wafers in circuits or other similar configurations, it is known to enclose LED wafers in a package to provide environmental and/or mechanical protection, color selection, optical t-focus, and the like. The LED package also includes electrical leads, contacts or traces for electrically connecting the led package to an external circuit. In the exemplary LED package 10 illustrated in the drawings, the single-LED wafer 12 is mounted on the reflective cup 13 by means of solder bonding or conductive epoxy. One or more wire bonds u connect the ohmic contacts of the LED wafer 12 to wires 15A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflector cup can be filled with an encapsulant material 16, which can contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength can be absorbed by the phosphor, and the light emitter can emit light at the second wavelength in response thereto. Next, the entire assembly is encapsulated in a clear protective resin (10), and the clear protective resin u can be molded into the shape of a lens. The light collimated from the LED emitted by the LED^i2. Although the reflective cup 13 can direct light in an upward direction, it may occur when light is emitted (ie, some of the light may be absorbed by the reflective cup due to less than (10)% of the reflectivity of the actual reflector surface). Light loss. In addition, thermal retention can be a problem with packages such as package 10 in which τ does not exhibit, as it may be difficult to extract heat via wires 15 , 15 .

The conventional LED package 2 is described. May be more suitable for producing more powerful operation. On an LED package, or a W carrier, the carrier such as a printed circuit board (PCB) carrier, 154446.doc 201144685 substrate or sub-substrate 23. A metal reflector 24 mounted on the submount 23 surrounds the LED wafer 22 and reflects the light emitted by the LED wafer 22 away from the package 20 » reflector 24 also provides mechanical protection of the LED wafer 22. One or more wire bond connectors 27 are formed between the ohmic contacts on the LED wafer 22 and the electrical traces 25A, 25B on the submount 23. The mounted LED wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer while also acting as a lens. Metal reflectors 24 are typically attached to a carrier by means of solder or epoxy bonding. LED wafers (such as 'the LED wafers visible in LED package 20 of FIG. 2') may be coated to include one or more light-emitting elements. A conversion material of the body, wherein the phosphors absorb at least some of the LED light. The conversion material can emit light of different wavelengths such that the LED package emits a combination of light from the LED wafer and light from the phosphor. A number of different methods can be used to coat the (or the like) LED wafers in the form of a phosphor. One of the suitable methods is described in U.S. Patent Application Serial No. 656/759, the entire disclosure of which is incorporated herein by reference. Etc.'s application and both are entitled "wafer Level

Phosphor Coating Method and Devices Fabricated Utilizing

Method". Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat the LEDs. One suitable EPD method is described in Tarsa et al. entitled "Close Loop Electrophoretic Deposition of Semiconductor"

US Patent Application Serial No. 11/473, No. 89. These types of LED chips have been used in different lamps, but have encountered some limitations based on the structure of the device. "The phosphor material is on the LED epitaxial layer or very close to the LED epitaxial layer, and in some cases, Lin Guang The bulk material contains a conformal coating over the 154446.doc 201144685 LED. In such configurations, the phosphor material is subjected to direct wafer heating due to the lack of a heat dissipation path (other than via the wafer itself). Thus, operating the phosphor at a temperature above the temperature of the led wafer can cause the phosphor material 'adhesive material and/or encapsulated rider to degrade over time. This elevated operating temperature can also result in a decrease in phosphor conversion efficiency' and thus often results in a shift in the perceived color of the LED light. Lamps utilizing solid state light sources (e.g., led) with conversion materials have also been developed that are separate from or disposed at the distal end of the LED. These configurations are disclosed in Tarsa et al. entitled "High 〇utput Radial Dispersing"

U.S. Patent No. 6'350,041, the entire disclosure of which is incorporated herein by reference. The lamp described in this patent can include a solid state light source that transmits light through a splitter to a disperser having a phosphor. The disperser allows the light to be dispersed in a desired pattern and/or to change the color of the light by converting at least some of the light through the phosphor. In some embodiments the "separator separates the light source from the disperser a sufficient distance such that when the source carries the elevated current necessary for illumination in the room, heat from the source will not be transferred to the disperser. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. However, the phosphor generates heat during the light conversion process, and this phosphor conversion heating can account for 20% to 30°/ of the total heat generated in the LED package. . In applications where the phosphor is located in close proximity to the wafer (eg, the phosphor is conformally applied to the wafer), the high local density σ 激励 of the excitation photons emerging from the surface of the wafer results in very localized local heating and thus hinders light. The peak temperature in the layer is 154446.doc 201144685 degrees. In many remote phosphor applications, this photon density is spread over a larger scale region, generally resulting in a reduced local temperature. However, in many remote phosphor configurations, the heat from the phosphor conversion heating generally has insufficient heat dissipation paths to dissipate the heat of conversion of the phosphor. In the absence of an effective heat dissipation path, the thermally isolated distal phosphor can be subjected to elevated operating temperatures, and in some instances, such elevated operating temperatures may even be comparable to comparable conformal coatings. The temperature is higher. This situation can result in degradation, inefficient conversion, and color shifting, some of which are avoided by having a remote disc. SUMMARY OF THE INVENTION The present invention provides various embodiments of efficient, reliable, and cost effective lamps and bulbs. The various embodiments can be configured with a distal conversion material that helps reduce or eliminate thermal spread from the illuminator to the phosphor material. The lamps and bulbs may also include thermal management features to allow for efficient transfer of heat generated by the conversion away from the distal conversion material. This situation reduces or eliminates the negative effects of rising temperatures on the efficiency and reliability of the conversion material. In various embodiments, the conversion material can comprise a phosphor carrier that can be formed in a 2-dimensional shape. An embodiment of a lamp according to the invention comprises a light source and a planar phosphor carrier located at the distal end of the light source. The phosphor support can comprise a thermally conductive material and a conversion material that is at least partially transparent to light from the source, and the conversion material absorbs light from the source and emits light of a different wavelength. A heat sink structure is included wherein the phosphor carrier is thermally coupled to the heat sink structure. 154446.doc 201144685 An embodiment of an LED-based lamp in accordance with the present invention includes an LED light source' and a planar phosphor disposed at a distal end of the light source. Light emitted from the light source passes through the phosphor and at least some of the light is converted by the phosphor. The lamp further includes a thermally conductive path for conducting the heat transfer of the phosphor away from the phosphor and dissipating the heat. A further embodiment of a lamp according to the invention comprises a heat sink structure and an LED based light source. A conversion material is disposed at the distal end of the source and is configured to absorb light from the source and re-emit light of different wavelengths. A first heat conduction path transmits the heat generated by the conversion away from the conversion material to the heat sink. According to still another embodiment of the lamp of the present invention, a light source and an optical cavity are included, the optical cavity including an opening in the cavity Phosphor support on. The light source is mounted in the optical cavity at a distal end of the phosphor carrier, wherein light from the source passes through the phosphor carrier. The optical cavity further includes a reflective surface to reflect light from the source and the phosphor carrier. A thermally conductive path causes the phosphor conversion heat to be conducted away from the phosphor to dissipate the heat. These and other aspects and advantages of the present invention will be apparent from the description and appended claims. [Embodiment] ^Inventives are directed to different embodiments of a lamp or bulb structure comprising a - distal conversion material - the distal conversion material can be configured such that less heat from the illuminator heats the conversion material, wherein the distal The end-converting material can also be operated without any substantial heat accumulation (due to the light conversion process) in the conversion material. 154446.doc •9- 201144685 : and == = :: high::degree may be __ effect. Some negative ~ ring. The present invention also conceals the conversion material for a feature including a lamp, such as a lamp, such that the conversion material is not visible to the lamp user' and can also disperse or redistribute light from the source of the distal conversion material and/or the lamp. Cheng is going to launch a round case. Different embodiments may have many different shapes and sizes, and in different lamp embodiments the 'conversion material' may include one or more conversion materials (such as a phosphor). A thermal path may be included for dissipating the thermal self-converting material during operation while maintaining the conversion material at the far end of the money such that most or all of the heat from the source does not enter the conversion material and reduces the dishing The local density of the incident excitation photons of the layer. This situation allows the remote conversion material to operate at lower temperatures and reduced photon excitation densities than the conversion materials that are used to dissipate the heat transfer path of the heat of conversion. By being located at the distal end and remaining relatively cold, the conversion material can operate more efficiently and does not suffer from heat-related color shifts. Operating at lower temperatures also reduces the heat-related degradation of the conversion material and increases the long-term reliability of the conversion material. Different distal configurations in accordance with the present invention may also allow the conversion material to operate at lower excitation densities, which may reduce the likelihood that the phosphor will be optically saturated due to incident light from the source. In some embodiments of the lamp according to the invention, the conversion material may comprise a scale carrier comprising: one or more phosphors "carriers" disposed on or integral with the carrier layer or material The layer may comprise a plurality of different thermally conductive materials that are substantially transparent to light of a desired wavelength, such as light emitted by an illuminator of the lamp. In some embodiments, the body carrier can be provided with means for dissipating the accumulation of conversion heating, and in embodiments the phosphor carrier is in good thermal contact with the fin structure. The phosphor carrier can be mounted to the heat sink by the heat of the side of the (4) light body (4). A light source can be mounted in the lamp (such as in the heat sink structure or on the heat sink structure). So that there is a knife gap between the light source and the filler material, that is, the phosphor carrier and its phosphor are located at the far end of the light source. The light source is also configured such that at least some of the light emitted by the light source Passing through the optical carrier and the (4) light body, wherein the light from the light source is converted by the light body. In some embodiments, the conversion can include 3 photon down conversion "the converted light" The wavelength is longer than the wavelength of the source light. In other embodiments, the conversion can include an upconversion wherein the wavelength of the converted light is shorter than the wavelength of the source light. In either case, the conversion can result in a conversion process Heat is generated in the phosphor. Phosphor conversion heat can be conducted through the thermally conductive carrier layer and conducted into the heat sink structure, where the phosphor conversion heat can be dissipated into the environment. In some embodiments the carrier layer can be collected. Self phosphorus The heat generated by the light layer causes the heat to spread in the lateral direction and conduct heat to the heat sink structure. The heat sink structure can be configured with different features that help dissipate heat into the environment, and the thermal management configuration allows the plant to be far away. The phosphorescent layer maintains a lower operating temperature, resulting in the benefits mentioned above. As further described below, the lamp according to the present invention can be configured in many different ways. In some embodiments, the light source can comprise a solid state light source, such as Different types of LEDs, led wafers 154446.doc 201144685 or LED packages with different lens or optics configurations. In other embodiments, a single led wafer or package may be used, while in other embodiments, different types of arrays may be used. Use and configure multiple LED wafers or packages. By thermally or not thermally contacting the phosphor with the LED wafer and having good heat dissipation, the LED wafer can be driven by a higher current level without causing phosphorescence The conversion efficiency of the body and the detrimental effects of the long-term sin of the phosphor. This situation can take into account the flexibility of over-exciting the LED chip so that a lower number of LEDs to produce the desired luminous flux, which in turn reduces the cost and/or complexity of the lamp. Such led packages may also include LEDs encapsulating materials that can withstand elevated luminous flux, or An unencapsulated led may be included. In some embodiments the 'light source may comprise one or more blue illuminated LEDs, and the fill in the fill carrier may comprise one or more materials, the one or more The material absorbs a portion of the blue light and emits one or more different wavelengths of light such that the lamp emits a combination of white light from the blue LED and the conversion material. The conversion material can absorb the blue LED light and emit light of different colors, including (but not Limited to yellow and green. The light source may also contain different LEDs and conversion materials that emit light of different colors to cause the lamp to emit light having desired characteristics such as color temperature and color rendering. For some applications, it may be desirable (to meet the specific requirements of color point/color temperature and/or color rendering) that a portion of the light emitted by the light source and/or the phosphor layer substantially comprises red light. Conventional lamps having both red and blue LED chips can withstand color instability at different operating temperatures and dimming. This situation can be attributed to the different behavior of the red and blue LEDs at different temperatures and operating power (current/voltage), and over time 154446.doc •12· 201144685 Operating characteristics. This effect can be slightly mitigated by implementing an active control system. The cost and complexity of the active control system may add to the entire lamp. This problem can be solved by combining a light source having the same type of illuminator with a remote phosphor, which can include the heat dissipation configuration disclosed herein, in accordance with various embodiments of the present invention. While maintaining relatively cold multiple types or layers and/or regions of phosphors. The distal phosphor carrier absorbs light from the illuminator and can re-emit light of different colors (including red light) while still experiencing the reduced efficiency and reliability of the operating temperature of the phosphor. The separation of the phosphor element from the LED provides the added advantage of easier and more consistent color sorting. This situation can be achieved in several ways. LEDs from various sorting levels (e.g., blue LEDs from various sorting levels) can be assembled in the future to achieve an excitation source of substantially wavelength uniformity that can be used in different lamps. These LEDs can then be combined with a wall carrier having substantially the same conversion characteristics to provide a second emission of light that can be produced within the desired classification level: a plurality of phosphor carriers can be fabricated and different depending on the phosphor carrier The conversion characteristics are used to pre-select the static storage enterprises (4). Different phosphor carriers can be used to classify light within the class with light sources that emit different characteristics.仏 for emission in target color. In various embodiments according to the present invention, the structure and material heat dissipation L structure may comprise different dissipative features 1 , and the heat sink structure may include a heat sink feature (blocking, sigma or thermal example) In the middle, the 哉 哉 社 社 社 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , According to the invention, J54446.doc -13· 201144685 can be configured in different ways, such as a light-filling layer disposed on different surfaces of the carrier layer, patterned on the surface(s) of the carrier layer a phosphor region, or a phosphor region that is uniformly or non-uniformly distributed across or through the carrier layer. "The phosphor carrier may also include other materials such as scattering particles." In other embodiments, the phosphor carrier may comprise more than one. Phosphor material. The lamp according to the present invention can also provide improved emission efficiency by surrounding the light source with a reflective surface. This can be achieved by reflecting a large amount of light re-emitted from the conversion material back toward the source. Enhanced photon recycling. To further enhance efficiency and provide a desired illumination profile, the surface of the phosphor layer or carrier layer can be smooth or scattered. In some embodiments, the inner surface of the carrier layer can be optically smooth to facilitate Total internal reflection behavior that reduces the amount of light (down-converted or scattered light) that is directed backwards from the phosphor layer. Accordingly, in some cases, the carrier layer or phosphor layer can be One or more outer surfaces are roughened or otherwise modified to promote light emission from the otherwise surface. Additionally, a combination of one or more roughened outer surfaces and a smooth inner surface may be used to promote penetration in a preferred direction. Light emission through the carrier and the phosphor layer. The properties of the carrier layer and the phosphor layer such as surface roughness, reflectivity and refractive index can generally be used to direct or direct light emitted or transmitted by the carrier/phosphor layer through the carrier/phosphor layer. Leading in a preferred direction, for example, by reducing the backwards absorption by the LED chip of the lamp, the associated substrate, or other non-ideal reflective surfaces within the interior of the lamp The amount of light, improved beam intensity profile and color uniformity, etc., provides improved efficiency. The lining layer and/or carrier layer may comprise a substantially two-dimensional geometry such as a flat or disc-shaped wheel 154446.doc -14 - 201144685 Curtain p ° planar shape may facilitate fabrication and coating of phosphor layers and reduce manufacturing. The invention is described herein with reference to specific embodiments, but it should be understood that the invention may be embodied in many different forms and should not be construed as limited Embodiments set forth herein. DETAILED DESCRIPTION OF THE INVENTION The present invention is described below with respect to different configurations of particular lamps having LED or LED wafers or LED packages, but it should be understood that the present invention can be used with many different array configurations. Other lamps. Examples of different lamps configured in different ways according to the present invention are described below, and U.S. Provisional Patent Application entitled "s〇lid for Price" by Le et al. No. 61/435,759, the disclosure of which is incorporated herein by reference. The embodiments below are described with reference to one or more LEDs, but it should be understood that this scenario is intended to encompass LED wafers and LED packages. The components may have different shapes and sizes than those of their shape and size, and may include a different number of LEDs. It should also be understood that the embodiments described below may use coplanar light sources, but it should be understood that non-coplanar light sources may also be used. The invention is described herein with reference to a conversion material, a phosphor layer, and a phosphor carrier, all of which are located at the "distal end" of the source or LED. The distal end of the context refers to spacing and/or direct thermal contact. It is also understood that when an element such as a layer, a layer or a substrate is referred to as being "on" another element, the element can be directly on the other element or the intervening element can also be present. In addition, relative terms such as r, "outside", "upper", "above", "lower", "below" and "below" may be used herein to describe a layer or another. Relationship. It should be understood that these terms 154446.doc -15· 201144685 are intended to encompass the orientation depicted in the figures and other different orientations of the device. Although the terms "first", "second" and the like may be used herein to describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or sections It should not be limited by these terms. The terms are used to distinguish one element, component, region, layer, Therefore, a first element, component, region, layer or layer discussed below may be referred to as a second element, component, region, layer, or section, without departing from the teachings of the invention. The cross-sectional views are illustrative of the embodiments of the present invention. Thus, the actual thickness of the layers can be varied and is expected to differ from the illustrated shapes as a result of, for example, manufacturing techniques and/or tolerances. The embodiment of the invention should not be construed as being limited to the particular shapes of the regions described herein, but should include variations in the shape resulting from, for example, manufacturing. Zones that are described or described as square or rectangular will typically have rounded or curved features that result from normal manufacturing tolerances. Accordingly, the regions illustrated in the figures are illustrative in nature and are not intended to limit the scope of the invention.

3 shows an embodiment of a lamp 50 according to the present invention, the lamp 5A including a heat sink structure 52 having an optical cavity 54 having a platform 56 for holding the light source 58. While this embodiment and some of the following examples are described with reference to an optical cavity, it should be understood that many other embodiments without an optical cavity can be provided. Light source 58 can include a number of different illuminators, and the illustrated embodiment includes LEDs that can include many different commercially available lED wafers or lED 154446.doc • 16· 201144685 packages, including but not limited to North Car〇Hna of Durham

Cree, Inc. purchased their LED chips or LED packages. Light source 58 can be mounted to platform 56 using a number of different known mounting methods and materials, with light from source 58 being emitted from the top opening of cavity 54. In some embodiments, the light source 58 can be mounted directly to the platform 56, while in other embodiments, the light source can be included on a sub-substrate or (4) circuit board (pCB), which is then printed on the sub-substrate or printed circuit board (PCB) ) is mounted to platform 56. Platform 56 and heat sink '·,. The structure 52 can include conductive paths for applying electrical signals to the light source 58, wherein the conductive paths are conductive traces or wires. All or part of the platform % may also be made of a thermally conductive material and the thermally conductive material may be thermally bonded to the heat sink structure 52 or integrated with the heat sink structure 52. In a two-part embodiment, the light sources of the lamps can be provided in the form of an array of coplanar illuminators that are mounted on a flat or planar surface. The eight-plane light source reduces the complexity of the illuminator configuration, making the illuminator 2 easier and less expensive. However, coplanar light sources tend to emit primarily in the directing direction (such as in accordance with the Lambertian emission pattern). The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials including: the same metal (such as copper or aluminum) or a metal alloy can be used. In some embodiments, the heat sink can comprise high purity aluminum. The high purity may have a thermal conductivity of about 21 〇 w/m_k under the shirt. In other embodiments, the heat sink structure may comprise die cast aluminum, the die cast aluminum has a heat conductivity of about 200 W/mk, and the heat sink structure 52 may also include other heat dissipation features (Justice hot sheets 60), such other heats. The dissipation feature increases the surface area of the heat sink to promote more efficient dissipation of heat into the environment. In some embodiments 154446.doc 201144685 the heat sinking strip 60 may be made of a material having a higher thermal conductivity than the remainder of the heat sink. In the illustrated embodiment, the Korean tabs are shown in a generally horizontal orientation, although it should be understood that in other embodiments, the fins may have a vertical or angled orientation. Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of optical cavity 54. In some embodiments, the surfaces may be coated with a material having a reflectance of about 75% or more for visible wavelength light ("light") emitted by light source 58 and/or wavelength converting material. In other embodiments, the material may have a reflectivity of about 85% or more for the light. In still other implementations, the 35 material may have a reflectivity of about 95% or more for the light. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type used in conventional electrical sockets. For example, the fin structure can include features for mounting to a standard threaded mount (four) that can include a threaded portion that can be screwed into the threaded seat. In other embodiments, the fin structure It may include a standard plug and the electrical socket may be a standard socket' or the heat sink structure may comprise a GU24 base unit, or the heat sink structure may be a clip and the electrical socket may be a socket for receiving and holding the clip (eg 'like many fires Used in light fixtures. These are only a few of the options for heat sink construction and sockets' and other configurations that safely deliver electricity from the socket to the lamp 50. The lamp according to the invention may comprise a The power conversion unit can include a driver to allow the bulb to be supplied by the ac line voltage/current and provide light source dimming capability. In some embodiments 154446.doc 201144685, the power supply can include non-isolated An off-line constant current LED driver of a quasi-resonant flyback topology. The LED driver can be mounted within the lamp and in some embodiments, the LED driver can comprise a less than 25 cubic centimeters Volume, while in other embodiments, the LED driver can comprise a volume of about 2 cubic centimeters. In some embodiments, the power supply can be non-dimmable, but at a lower cost. It should be understood that The power supply can have a different topology or geometry and can also be dimmable. The phosphor carrier 62 is included over the top opening of the cavity 54, and in the thinness shown, in the example, fills the light The body carrier 62 covers the entire opening. The cavity opening is not circular and the phosphor carrier 62 is a disk, but it should be understood that the cavity opening and the phosphor carrier can be of many different shapes and sizes. The phosphor carrier 62 may not cover the entire cavity opening. The phosphor carrier according to the present invention may be characterized as comprising a conversion material and a thermally conductive light transmissive material. The light transmissive material may be transparent to light emitted from the light source 58, and the conversion The material should be of the type that absorbs light from the wavelength of the source and re-emits light of different wavelengths. In the illustrated embodiment, the thermally conductive light transmissive material comprises a carrier layer 64 and the conversion material comprises a carrier layer 64 Light layer 66. As further described below, different embodiments may include many different configurations of the carrier layer and the phosphor layer. § Light from source 58 is absorbed by the scales in fill layer 66, and the light is in an isotropic direction. Re-emitted, wherein about 5% of the light is emitted forward and 50% of the light is emitted back into the cavity 54. In a pre-LED with a conformal phosphor layer, a significant portion of the back-emitting light can be The possibility of guiding back into lED and the light escape is limited by the extraction efficiency of the LED structure. For some LEDs, the extraction efficiency can be about 7〇%, so the self-converting material is guided back to the LED. A percentage of the light in the light may be lost. In a lamp having a remote phosphor configuration in accordance with the present invention, the LED is located on the platform 56 at the bottom of the cavity 54 at a higher percentage of the phosphor light that is emitted backwards. Light strikes the surface of the cavity rather than the LED. The surface coating with the reflective layer 53 increases the percentage of light that is reflected back to the phosphor layer 66 (at the phosphor layer 66, the light can be emitted from the lamp). These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. A reflective layer can also be included in embodiments that do not have an optical cavity. In embodiments where the LEDs are mounted on a planar surface or on a pedestal, a reflective layer can also be included around the LED to increase efficiency in much the same manner as a reflective layer in an embodiment having an optical cavity. The carrier layer 64 may be made of many different materials having a thermal conductivity of 〇_5 w/mk or more than 5 w/mk, such as quartz, tantalum carbide (Sic) (thermal conductivity: 120 W/mk), glass ( The thermal conductivity is m·4 w/m_k) or sapphire (thermal conductivity is ~40 W/mk). The phosphor support may also have different thicknesses depending on the materials used, with suitable thicknesses ranging from 〇1 mm to 1 或 or more. It should be understood that other thicknesses may also be used depending on the particular material used for the material of the carrier layer. The material should be thick enough to provide adequate lateral heat dissipation for specific operating conditions. In general, the higher the thermal conductivity of the material, the thinner the material, while still providing the necessary heat dissipation. Different factors can influence the use of that carrier layer material, and different factors include (but are limited to) cost and transparency to the source light. Some materials may also be more suitable for larger diameters, such as glass or quartz. Such materials can provide reduced manufacturing costs by forming a phosphor layer on a larger diameter carrier layer and then singulating the carrier layer into smaller carrier layers. A number of different phosphors can be used in the phosphor layer 66, with the invention being particularly suitable for emitting white light lamps. As described above, in some embodiments, light source 58 can be an LED based light source and can emit light of a blue wavelength spectrum. The phosphor layer absorbs some blue light and re-emits yellow light. This situation allows the lamp to emit a combination of blue and yellow light. In some embodiments, the blue LED light can be converted by a yellow conversion material using a commercially available YAG:Ce phosphor, but is used based on (Gd'YMALGahOaCe system (such as,

YsAlsOaCMYAG)) Phosphors made of converted particles, may get full

A wide range of broad yellow light emission. Other yellow phosphors that can be used to produce white light when used with an illuminator based on a blue LED include, but are not limited to:

Tb3.xREx012: Ce(TAG); RE=Y, Gd, La, Lu; or

The Sr2-x-yBaxCaySi〇4:Eu 〇 phosphor layer may also be provided with more than one phosphor, the one or more phosphors being mixed in the phosphor layer 66 or being placed vertically or laterally on the carrier layer 64 as a separate phosphor layer/region. . In some embodiments, each of the two (four) light bodies can absorb LED light and can re-emit light of different colors. In such embodiments, the colors from the two (four) light layers can be combined for achieving a higher CRI white (warm white) with a different self-color hue. In this case, the light from the yellow phosphor can be combined with the light from the red plexisphere. Different red phosphors can be used, including: 154446.doc •21 · 201144685

SrxCa^xSiEu, Υ; telluride;

CaSiAlN3:Eu; or

Sr2-yCaySi〇4:Eu 〇 Other phosphors can be used to produce colored luminescence by converting substantially all of the light into a particular color. For example, the following phosphors can be used to produce green light:

SrGa2S4: Eu; Sr2-yBaySi〇4: Eu; or SrSi2〇2N2: Eu. Some additional phosphors suitable for use as the conversion particles of the phosphor layer 66 are listed below, but other scales may be used. Each-filler exhibits sensitization in the blue and/or UV luminescence spectrum, efficient light conversion, and has shift): Provides a desired peak luminescence with an acceptable Stokes shift (St〇kes yellow) /Green (Sr,Ca,Ba)(Al,Ga)2S4:Hu2+

Ba2(Mg,Zn)Si2〇7:Eu2+

Gd〇.46Sr〇.3iAl,.23〇xF,.38:Eu2+0 06 (Bai.x.ySrxCay)Si04:Eu

Ba2Si04: Eu2+ red

Lu2〇3 :Eu3 + (Sr2.xLax)(CeI.xEux)04

Sr2Cei.xEux04 154446.doc •22- 201144685

Sr2.xEuxCe04 SrTi03:Pr3 + 5Ga3 +

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ may use filler particles of different sizes including, but not limited to, particles in the range of from 1 nanometer (nm) to 30 micrometers (Mm) or more than 30 micrometers (μm). In terms of scattering and mixing colors, smaller particles are usually better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer 66 in a binder, and the phosphor may also have a different concentration or loading of phosphor material in the binder. Typical concentrations range from 30% to 70% by weight. In one embodiment, the concentration of the phosphor is about 65% by weight and is preferably uniformly dispersed throughout the extruding phosphor. The phosphor layer 66 can also have different regions of different conversion materials and conversion materials of different concentrations. Different materials can be used for the adhesive, wherein the material is preferably strong after curing and substantially transparent in the visible wavelength spectrum. Suitable materials include polyfluorene oxide, epoxy resin, glass, inorganic glass, dielectric, BCB, polyamine, amine, polymer and their blends. The preferred material is polyfluorene (this is composed of polyfluorene). High transparency and reliability of oxygen in high power LEDs). Suitable base, base and methyl polyoxo oxygen are commercially available from D〇w® Chemical. Many different curing methods can be used to cure the adhesive depending on various factors such as the type of adhesive used. Different curing methods include, but are not limited to, thermal curing, ultraviolet (UV) curing, infrared (IR) curing, or air solidation. 154446.doc • 23· 201144685. The phosphor layer 66 can be applied using a variety of processes including, but not limited to, spray coating, spin coating, sputtering, printing, powder coating, electrophoretic deposition (EPD), electrostatic deposition. As mentioned above, the phosphor layer 66 can be coated with the binder material 'but it should be understood' that no binder is required. Phosphor layer 66 can be fabricated separately in yet other embodiments and phosphor layer 66 is then mounted to carrier J. In one embodiment, the phosphor-adhesive mixture can be sprayed or dispersed over the carrier layer 64. The adhesive is then cured to form the phosphor layer 66. In some of these embodiments, the phosphor_binder mixture can be sprayed or dispersed onto the heated carrier layer 64 such that when the phosphor binder mixture contacts the carrier layer 64, 'from the carrier layer 64 The heat is dispersed in the adhesive and the adhesive is cured. These processes may also include a solvent for the phosphor-bonded J/3⁄4 compound which liquefies the mixture and lowers the viscosity of the mixture, thereby making the mixture more suitable for spraying. Many different solvents can be used including, but not limited to, toluene, benzene, di-f-benzene (2>?1^6) or os_2(R) available from Dow Corning®, and different concentrations of solvent can be used. When the solvent-phosphor-adhesive mixture is sprayed or dispersed on the heated carrier layer 64, the heat from the carrier layer 64 evaporates the solvent, wherein the temperature of the carrier layer affects the extent to which the solvent evaporates. From the carrier layer 64 The heat can also cure the binder of the mixture, leaving a fixed phosphor layer on the carrier layer. Carrier layer 64 can be heated to a number of different temperatures depending on the materials used and the desired solvent evaporation and adhesive cure rate. Suitable temperatures range from 90eC to 150t, although it should be understood that other temperatures may be used. I54446.doc •24- 201144685 Various deposition methods and systems are described in US Patent Application Publication No. 2010/0155763, entitled "Systems and Methods for Application of Optical Materials to Optical Elements" by Donofrio et al., and the disclosure It has been assigned to Cree, Inc. and the entire contents of this publication. The fill layer 66 can have a number of different thicknesses depending on the concentration of the illuminant material and the desired amount of light to be converted by the phosphor layer 66. The barrier layer according to the present invention can be applied at a concentration level (phosphor load) of more than 30%. Other embodiments may have greater than 50°/. The concentration level is, while in still other embodiments, the concentration level can be as high as 60%. In some embodiments, the light-breaking layer can have a thickness in the range of 10 microns to 100 microns, while in other embodiments, the phosphor layer can have a thickness in the range of 40 microns to 50 microns. The methods described above can be used to coat multiple layers of the same or different filler materials, and different phosphor materials can be applied in different regions/regions of the carrier layer using known masking and/or printing processes. The method described above provides some thickness control for the phosphor layer 66, but for even greater thickness control 'a known method can be used to grind the phosphor layer to reduce the thickness of the phosphor layer 66 or level the entire layer. Thickness "This abrasive feature provides the added advantage of being able to produce a lamp that emits within a single sorting level on the CIE chromaticity diagram. Sorting is generally light known in the art and intended to ensure that the LEDs or lamps provided to the end customer emit light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to as sorting in the art) by color or brightness. Each sorting level usually contains LEDs or lights from a group of colors and brightness, and 154446.doc •25· 201144685 is often identified by a sorting level code. White LEDs or lamps can be classified by chromaticity (color) and luminous flux (brightness). Thickness control of the phosphor layer provides greater control in producing a lamp that emits light within the target sorting level by controlling the amount of source light converted by the phosphor layer. A plurality of phosphor carriers 62 having phosphor layers 66 of the same thickness can be provided. By using a light source 58 having substantially the same illumination characteristics, a lamp having a nearly one color point can be fabricated, which in some instances can fall within a single color sorting level. In some embodiments, the illumination of the lamp is within a standard deviation from a point on the CIE map, and in some embodiments, the standard deviation comprises less than a 10-step McAdams ellipse. In some embodiments, the illumination of the lamp belongs to a 4-step MacAdam ellipse centered at CIExy (〇_313, 0.323). The light-breaking body carrier 62 can be mounted and bonded to the opening in the cavity 54 using a different known method or material, such as a thermally conductive bonding material or thermal grease. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, a phosphor carrier can be mounted over the opening using a thermally conductive device such as a clamp mechanism, a screw or a thermal adhesive to hold the phosphor carrier 62 tightly to the heat sink structure ' Maximum thermal conductivity. In one embodiment, a thermal grease layer having a thermal conductivity of about ηηι thickness & k = 0.5 w/m_k is used. This configuration provides an efficient thermally conductive path for dissipating heat from the phosphor layer 66. During operation of the lamp 50, phosphor conversion heating is concentrated in the phosphor layer μ, such as concentrated in the center of the can light layer 66, with most of the LED light striking the canister carrier 62 in the scale layer 66 and passing through the dish Body carrier 62. The thermal conductivity of the carrier layer 64 154446.doc -26· 201144685 causes the heat to be distributed in the transverse direction, as indicated by the first heat flow. At the edge of the VI carrier 62, and into the heat sink structure 52, if the heat at the edge passes through the thermal grease layer structure 52, the heat can be effectively displayed - the heat flow 72 is displayed, and the heat is dissipated. Dissipated into the environment. As discussed above, in the lamp 5, the junction is coupled to the heat sink structure 52 thermally coupled to the secondary coupling σ. This coupling configuration causes the Phosphorus Qiuqiu Tian m esthetic carrier 62 to share at least 4 knives with the light source 58 for the heat dissipation of the guide channel 56, the heat from the light source 58 through the platform 56 (as by the third The heat flow 74 /, can also be distributed to the bulk film. From the phosphor carrier 62 flowing into the heat sinking film ^52φ / U52 Α ”, the heat in the structure 52 can also flow into the flat 〇. As described in the following paragraphs, 'in other embodiments, the phosphor carrier=light source 58 can be There are separate thermally conductive paths for dissipating heat, wherein such individual paths are referred to as "decoupling." It should be understood that the fill carrier can be configured in many different ways than the embodiment shown in FIG. Some of these different embodiments are illustrated in Figures 4 through 10, but it should be understood that in other embodiments, there may be a configuration of the evening. 4 shows another embodiment of a spheroidal carrier 8 according to the present invention. The phosphor carrier 80 comprises a carrier layer 82 and a phosphor layer 84. The carrier layer 82 and the phosphor layer 84 can be made of the same materials as described above and It can be formed using the same process. In this embodiment, the phosphor layer 84 is on the bottom surface of the carrier layer 82 such that the light from the LED source first passes through the phosphor layer 84. The converted light and the LED light that leaks through the phosphor layer 84 then pass through the carrier layer. 82. In this configuration, the carrier layer 82 should be transparent to light from both the phosphor layer 84 and the LED light source. In this embodiment, the phosphor layer 84 need not cover the entire bottom surface of the carrier layer 82. Rather, the edges of the carrier layer 82 may not be covered by the phosphor 154446.doc -27- 201144685 layer 84 to allow good thermal contact with the heat sink. However, in some embodiments, the phosphor layer 84 can cover the entire bottom surface of the carrier layer 82. Figure 5 shows still another embodiment of a phosphor support 1 according to the present invention. The phosphor support 100 does not comprise a separate phosphor layer and a carrier layer, but comprises a carrier layer 102 in which the phosphor 1〇4 is dispersed throughout the carrier. Layer 1〇2. As with the previous embodiment, when the phosphor generates heat during the conversion, the heat is dispersed in the lateral direction over the entire carrier layer 1〇2, and the heat in the carrier layer 丨〇2 can be dissipated in the heat sink. In the phosphor layer 1〇4, it is dispersed in the carrier layer at a nearly uniform concentration, but it should be understood that in other embodiments, the phosphors 1〇4 may have different concentrations in different regions of the carrier layer 102. It should also be understood that more than one phosphor may be included in the carrier layer that is uniformly dispersed or dispersed in zones of different concentrations. 6 shows another embodiment of a phosphor carrier 12A according to the present invention. The phosphor carrier 120 also includes a carrier layer 122 and a phosphor layer 124. The carrier layer 122 and the phosphor layer 124 are similar to those described above and illustrated in FIG. Show the same components. In this embodiment, a scattering particle layer 126 can be included on the carrier layer 122 and displayed on the phosphor layer 124. It should be understood that the scattering particle layer 126 can be located on the carrier layer or in many different locations in the carrier layer. The scattering particle layer is included to disperse light as it is emitted from the filler carrier layer 120 to impart a pattern of light to be emitted. In this embodiment, the scattering particles are configured to disperse the light in a substantially uniform pattern. In some embodiments, the scattering particle layer can be deposited using the methods described above with reference to the deposition of the phosphor layer, and the scattering particle layer can comprise densely packed particles. The scattering particles may also be included in the binder material, which may be the same as the viscous material described above with reference to the binder used with the phosphor layer. The scattering of the coarse sub-layer may vary depending on the coating and material used. "There are different concentrations of scattering particles. Suitable scattering particle concentrations range from 0_01 /. to 0.2% 'but it should be understood that the concentration can be higher or lower. In some In the embodiment, the concentration may be lower than that of the smear. The scattering particle layer 126 may have different concentrations of scattering particles in different regions. For some scattering particles, there may be attribution to the weighting. The increase in loss due to the absorption of the degree. Therefore, the concentration of the scattering particles can be selected to maintain an acceptable loss number, and (4) the light is dispersed to provide the desired emission pattern. The scattering particles can contain many Different silicones; including but not limited to: oxidation (ΖηΟ); yttrium oxide (Υ203); titanium dioxide (Ti02); barium sulfate (BaS04); alumina (A1203); molten silica (X02); Cerium oxide (SiO 2 ); aluminum nitride; glass microbead; cerium oxide (Zr02); lanthanum carbide (SiC); lanthanum oxide (Ta05); tantalum nitride (Si3N4); 154446.doc -29· 201144685 oxidation铌(Nb205); boron nitride (BN); or huguang Particles (eg, YAG:Ce, b〇se) may use one or more scattering materials in various combinations of materials or a combination of different forms of the same material to determine the scattering effect. In the embodiment, the scattering particles may be used. Included in carrier layer 122, phosphor layer 124, or both carrier layer 122 and light layer 124. Figure 7 shows another embodiment of a phosphor carrier 140 having a carrier layer 142 and phosphorescence in accordance with another embodiment of the present invention. Body (4), carrier layer 142 and scale 144 are similar to the same elements described above and illustrated in Figure 5. In this embodiment, 'scattering particles 146 are dispersed in carrier layer M2 to pass through carrier layer M2. (d) Dispersion of both light and dish light. The same scattering particles as those described above may be used, and in different embodiments 'the scattering particles may be included in different concentrations. Other embodiments may include Zones of different concentrations' to scatter light passing through the carrier layer into the desired emission pattern. Figure 8 shows another embodiment of a phosphor carrier 16 according to the present invention, the phosphor carrier 160 comprising a carrier layer! 62 and a carrier layer Phosphor layer 164 on the bottom surface of 162, both carrier layer 162 and phosphor layer 164 are configured in a manner similar to the same elements described above and illustrated in Figure 4. In this embodiment, 'scattering particle layer 166 includes On the top surface of the carrier layer 162, and may have the same material deposited in the same manner as the scattering particle layer 126 of Figure 6. In some embodiments, the scattering particles in the scattering particle layer i 66 can be configured to The light from the phosphor layer 164 and the LED light leaking through the phosphor layer 164 -30-154446.doc 201144685 both scatter. In still other embodiments, the scattering particles can be configured to scatter only one of the lights. It should be understood that the scattering particles may also be dispersed in either the carrier layer 162 or the phosphor layer 164 or both the carrier layer 162 and the phosphor layer 164. Other embodiments of the phosphor carrier may also include features to enhance light extraction from the lamp. A certain amount of light can strike the surface of the carrier layer or the light-breaking layer outside of the escape angle such that the light will be reflected back toward the cavity of the heat sink structure. Some of this light can be absorbed' while other parts of the light can undergo total internal reflection (TIR). Figure 9 shows an embodiment of a phosphor carrier 18 having a feature configured to reduce such losses. Similar to the above embodiment, the phosphor carrier comprises a carrier layer 182 and a phosphor layer 184, in this embodiment. The surface of the phosphor layer is roughened or shaped to provide a varying surface angle. This situation increases the likelihood that light will strike the surface within the escape angle of the light such that the light can contribute to useful emissions. A known roughening or etching process can be used to shape the surface. The scale carrier layer 18 can also be provided with scattering particles at different locations to disperse the light, as described above. Forming or roughening may be included on different surfaces of the phosphor support according to the present invention. Figure 10 shows another embodiment of a phosphor support 2 according to the present invention. Phosphor support 200 comprises a support layer 202 and a phosphor layer 204. In this embodiment, a "formed/roughened layer is provided on the top surface of the carrier layer 2" while a phosphor layer is provided on the roughened surface. The shaped/roughened surface provides a varying surface to increase the likelihood of light escaping through the phosphor carrier 2 . The roughened surface may be included on the other surface of the carrier layer 2' and the phosphor carrier 2' may also be provided with scattering particles as described above. It is to be further understood that the roughened surface can be included on any of the surfaces of the embodiment of the phosphor support layer described above, not 154446.doc 201144685. Lamps in accordance with the present invention may include many different features in addition to those described above. Referring again to Figure 3, in some embodiments the cavity ^ can be filled with a transparent thermal material to enhance the heat dissipation of the lamp in an S-step. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. The heat from the source will still be conducted via the platform 56, <RTI ID=0.0>>> This situation will allow for a lower operating temperature of the source 58, but a risk of an elevated operating temperature for the phosphor carrier 62. This configuration can be used in many different embodiments, but is particularly well suited for lamps with higher light source operating temperatures (compared to the operating temperature of the phosphor carrier). This configuration allows for more efficient heat dissipation from the source in applications where the additional heating of the phosphor support layer can be achieved. As discussed above, different lamp embodiments in accordance with the present invention can be configured with many different types of light sources. Figure u shows another embodiment of a lamp 21A similar to the lamp 5〇 described above and shown in Figure 3. Lamp 21A includes a fin structure 212 having a cavity 214 that is configured with a platform 216 to hold light source 218. Phosphor support 22A can be included over the opening of cavity 214 and at least partially cover the opening. In this embodiment, the light source 218 may include a plurality of LEDs disposed in a separate LED smear or disposed in a single-multiple LED package. In each of the embodiments, the illuminators may be different. The series and parallel configurations are consumable. In one embodiment, eight LEDs can be used that are connected in series to the circuit board by two wires. The wires can then be connected to the power supply unit described above. In other embodiments, more than eight or less LEDs can be used, 154446.doc •32· 201144685 and as mentioned above, LEDs available from Cree, Inc., including eight XLamp® XP-E LED or four XLamp® XP-G LEDs. The different single-string LED circuits are described in the following U.S. Patent Application: U.S. Patent Application Serial No. 12/566,195, entitled,,,,,,,,,,, U.S. Patent Application Serial No. 12/704,730, the entire disclosure of which is incorporated herein by reference. For embodiments that include a separate LED package, each of the LEDs can include its own LED primary optics or lens 222. In embodiments having a single multi-LED package, a single primary optic or lens 224 can cover all of the LEDs. It should be understood that the LEDs may not have lenses, and in an array embodiment, each of the LEDs may have its own lens. Similarly, an unpackaged LED can be provided on a "on-wafer chip" or "on-wafer" configuration. It should also be understood that each LED can be provided with secondary optics that are configured in different ways. Similar to the lamp 5' heat sink structure and platform, the necessary electrical traces or wires are provided to provide electrical signals to the light source 218. In the lamps 5A and 21A described above, the light source shares a heat path (referred to as thermal coupling) for dissipating heat with the phosphor carrier. In some embodiments, if the thermal path for the phosphor carrier and the source is not thermally coupled (referred to as thermal decoupling), the heat dissipation of the phosphor carrier can be enhanced. Figure 12 shows another embodiment of a lamp 240 in accordance with the invention 154446.doc • 33- 201144685. The lamp 240 also includes a heat sink structure 242 having a cavity 244 having a platform 246 for mounting the light source 248. The can carrier 250 is mounted over the opening of the cavity 244 by a thermally conductive material and at least partially covers the opening' such that at least some of the light from the source passes through the phosphor carrier 250. In this embodiment, the fin structure 242 and the platform 246 have separate heat dissipation paths that are substantially thermally isolated from one another (although convection can result in some thermal coupling between the two paths). Heat from source 248 is conducted along fourth heat stream 252 and through platform 246 where heat can be dissipated into the environment or another fin structure (not shown), such as a connector of the lamp. Heat from the phosphor carrier 250 is conducted along the fifth heat stream 254 and into the fin structure 242 where it is dissipated into the environment. Thermal separation between the fin structure 242 and the platform 246 can be provided by physical separation of the two, or by providing a thermally resistive material between the two, such as via a known thermal insulator ( For example, dielectric). Figure 13 is a graph showing the peak operating temperature of a conformal phosphor material compared to the operating temperature of a remote phosphor carrier having a carrier layer, the carrier layers having different thermal conductivities and configured to heat It can be dissipated via a thermal path as described above. Graph 260 further compares the thermal performance of these different configurations of heat-smoothing and pyrolysis heat sinks. The first solid line 262 shows the junction temperature of the illuminator having the heat decoupled fins as described above and the second line 264 shows the junction temperature of the illuminator for the heat sink. The operating temperature of the coupled configuration is slightly lower than the operating temperature of the decoupling configuration. The first dashed line 266 shows the peak phosphor temperature of a lamp having a conformal phosphor coated LED and a 154446.doc -34 - 201144685 thermally decoupled heat sink. The second dashed line 268 shows the peak phosphor temperature of the same lamp that does not have a heat-and-light heat sink. In a conformal coating configuration 'phosphor operates at substantially uniform peak phosphor temperature' and the thermally coupled lamp operates at a peak phosphor temperature that is lower than the peak phosphor temperature of the decoupled configuration. Comparatively, 'the third solid line 270 shows the peak phosphor temperature of the remote phosphor carrier disposed on the heat sinking heat sink, wherein the temperature is for a range of 2 w/mK to 1 〇〇 w/mK or more. Carrier layer measurements of different thermal conductivities within the range. The fourth solid line 272 shows the same distal phosphor support and the same range of thermal conductivity, with the phosphor carrier on the thermally decoupled heat sink. A remote phosphor carrier having a carrier layer with a thermal conductivity greater than 1.05 W/mk and disposed on a pyrolytic heat sink can be operated at a lower phosphor temperature 'thus achieving a coated LED with a conformal photobody coating High conversion efficiency. This situation allows the use of materials such as conventional glass, fused silica, sapphire and tantalum carbide. Thermally coupled heat sinks can be used, but thermally coupled heat sinks require slightly higher thermal conductivity and operate at higher temperatures than thermally coupled configurations. Figure 14 shows another embodiment of a lamp 270 in accordance with the present invention, the lamp 270 being configured in a different manner to provide the desired thermal characteristics of the distal phosphor and the filler carrier. Lamp 270 includes a light source 272 mounted to the top surface of fin structure 274. The heat sink structure can be made of a thermally conductive material as described above and includes a heat dissipating structure such as fins 275, during operation, heat is diffused from light source 272 into heat sink structure 274, and heat spreads in heat sink structure 274. To the fins 275 and the environment. Lamp 270 also includes a collar 276 having a collar cavity 278 that is worn on the top surface of the heat sink structure 274. The collar cavity 278 extends through the socket so that it is open at the bottom and at the top. When the light collar 276 is mounted to the heat sink structure 274, the light source 272 is configured such that the light source 272 emits light from the top opening of the collar cavity 278. In this embodiment, light source 272 is also configured such that light source 272 is within collar cavity 278. Phosphor carrier 280 is mounted over the top opening of collar cavity 278 by a thermally conductive material or device as described above. The phosphor carrier 28 is configured such that light from the source 272 passes through the phosphor carrier 28, and at least some of the light in the phosphor carrier 280 is configured by the converter carrier as described above. The structures and features described in the different embodiments include, but are not limited to, carrier layers, phosphors, scattering particles, and/or roughening/forming. The lamp collar 276 is also made of a thermally conductive material 'to dissipate heat from the phosphor carrier 280 into the lamp collar 276. Heat from the lamp collar 276 can be dissipated directly into the environment or can be dispersed into the fin structure 274 where heat can be dissipated into the environment. The thermal path for the phosphor carrier and the light source is coupled such that heat from the phosphor carrier and heat from the lamp collar 276 can be dispersed into the heat sink structure 274 and the light source heat can be spread from the heat sink structure 274 to the lamp The collar 27 bushing 276 also has a skirt 282 that is tightly mounted about the top portion of the fin structure 274 to allow the lamp collar 276 to be coupled to the fin structure 274 - for display purposes. . A graph 285 of the characteristics of the different far-end discs in the middle. The first dashed line 286 shows the base or plate temperature of the lamp. For a light dissipating fin, the base or plate temperature remains constant at about 74.7 °C. The second dashed line 288 shows the peak temperature of the phosphor in the different π embodiments of the distal scale carrier I54446.doc-36 · 201144685 according to the present invention. For 5 mm thick glass with a spin-on phosphor layer and 〇.5 mm thick sapphire with a spin-coated phosphor layer, the peak phosphor operating temperature is lower than the temperature of the base. Similar: This situation above allows for greater emission efficiency and less heat-related degradation of the phosphor. Although the invention has been described in detail with reference to a particular preferred configuration of the invention, the eight versions are possible. Therefore, the spirit and scope of the present invention should not be limited to the versions described above. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; Figure 2 shows a cross-sectional view of another embodiment of a prior art LED lamp; Figure 3 is an embodiment of a lamp in accordance with the present invention Figure 4 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 5 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 6 is a phosphor in accordance with the present invention; Figure 7 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 8 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; A front view of a further embodiment of a phosphor carrier according to the invention; 154446.doc • 37- 201144685 Figure 395 is a cross-sectional view of a further embodiment of a phosphor carrier according to the invention; Figure 12 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; Figure 13 is a graph showing the operating temperatures of different illuminators and features of a lamp in accordance with the present invention; Figure 14 is based on this Side view of another embodiment of a lamp out; and FIG 15 is a graph showing steady state operating temperature in accordance with one embodiment of the lamp according to the present invention. [Main component symbol description] 10 typical light-emitting diode (LED) package 11 wire bonding 12 LED chip 13 reflective cup 14 clear protective resin 15 导线 wire 15 导线 wire 16 encapsulant material 20 LED package 22 led wafer 23 sub-substrate 24 metal reflection 25 Α Electrical Trace 25Β Electrical Trace 154446.doc -38- 201144685 27 Wire Bonding Connector 50 Lamp 52 Heatsink Structure 53 Reflective Layer 54 Optical Cavity 56 Platform 58 Light Source 60 Heat Sink 62 Phosphor Carrier 64 Carrier Layer 66 Phosphor Layer 70 First heat flow 72 Second heat flow 74 Third heat flow 80 Phosphor carrier 82 Carrier layer 84 Phosphor layer 100 Phosphor carrier 102 Carrier layer 104 Phosphor 120 Filler carrier 122 Carrier layer 124 Phosphor layer 126 Scatter particle layer 154446. Doc · 39 201144685 140 Photostructure carrier 142 Carrier layer 144 Phosphor 146 Scatter particles 160 Phosphor carrier 162 Carrier layer 164 Phosphor layer 166 Scatter particle layer 180 Light carrier carrier 182 Carrier layer 184 Phosphor layer 200 Phosphor carrier 202 Carrier Layer 204 Phosphor layer 210 Lamp 212 Heat sink structure 214 Cavity 2 16 Platform 218 Light source 220 Phosphor carrier 222 LED main optics or lens 224 Single main optics or lens 240 Lamp 242 Heat sink structure 154446.doc -40- 201144685 244 Cavity 246 Platform 248 Light source 250 Phosphor carrier 252 Fourth heat flow 254 fifth heat flow 260 curve 262 first solid line 264 second solid line 266 first dashed line 268 second dashed line 270 third solid line / lamp 272 fourth solid line / light source 274 heat sink structure 275 fin 276 light ring 278 collar cavity 280 phosphor carrier 282 skirt 285 curve 286 苐 a dashed line 288 second dashed line 154446.doc -41 -

Claims (1)

201144685 VII. Patent application scope: ][· A lamp comprising: a light source; a planar private body carrier, the planar can body carrier being located at a distal end of the light source and comprising a heat conductive material and a conversion material, the heat conductive material For *light from the source at least eight, * n "^ knife transparent, and the conversion material absorbs light from the source and emits light of different wavelengths; and a heat sink structure 'the phosphor carrier is thermally coupled to the heat sink A lamp according to claim 1, wherein the phosphor carrier comprises a carrier layer and a lamp of the scale layer D of the first item, wherein the phosphor carrier comprises scattering particles. The lamp, wherein the money carrier comprises a roughened or shaped surface. 5. The lamp of claim 1 wherein the heat from the phosphor carrier layer is conducted to the heat through the thermal coupling. 6. In the sheet structure, wherein the light source comprises a blue light emitting light and the phosphor carrier comprises a phosphor which absorbs blue light and re-emits • a different wavelength of light 'the light is emitted blue The LED light is combined with the perceived white light of the conversion material light. 7. The lamp of claim 1, further comprising an optical cavity mounted on an opening in the cavity, the light source being mounted In the cavity, wherein light from the light source passes through the phosphor carrier. 8. A lamp based on a light-emitting diode (LED), the lamp comprising: 154446.doc 201144685 an LED light source; a planar phosphor The planar phosphor is disposed at a distal end of the light source such that light emitted from the light source passes through the phosphor and is converted by the phosphor; and a heat conduction path for causing phosphor conversion heat conduction away from the phosphorescence 9. The lamp of claim 8 further comprising a heat sink, the heat shield having at least a portion of the heat sink. 10 - a lamp comprising: a heat sink structure; a light source of a light emitting diode; a conversion material 'the conversion material is located at a distal end of the light source and configured to absorb light from the light source and re-emit light of different wavelengths; and a first heat conduction path The first heat conduction path is used to conduct heat generated by the conversion away from the conversion material to the heat sink. 11. The lamp of claim 10, wherein the heat from the τ Mumu hai hai- light source is conducted via the first heat conduction path 12. The light source of claim 1 wherein the first heat conduction path and the second heat conduction path are *. The conductive path and the second conductive path 13. The light of claim 10, wherein The first path is lighter. 14. A lamp comprising: a light source; an optical cavity above one of the openings of the cavity, the optical cavity being included in the 154446.doc 201144685 phosphor carrier, the light source being mounted thereon An optical cavity is located at a distal end of the phosphor carrier, wherein light from the light source passes through the phosphor carrier'. The optical cavity further includes a reflective surface to reflect light from the light source and the phosphor carrier; and a thermally conductive path The thermally conductive path is used to cause the phosphor conversion heat to be conducted away from the phosphor and dissipate the heat. 1 5 • The lamp of claim 14, wherein the optical cavity is integrated with the heat sink and the heat conduction path is passed through the heat sink 154446.doc