TW201142214A - Enhanced color rendering index emitter through phosphor separation - Google Patents

Abstract

LED packages, and LED lamps and bulbs, are disclosed that are arranged to minimize the CRI and efficiency losses resulting from the overlap of conversion material emission and excitation spectrum. In different devices having conversion materials with this overlap, the present invention arranges the conversion materials to reduce the likelihood that re-emitted light from a first conversion materials will encounter the second conversion material to minimize the risk of re-absorption. In some embodiments this risk is minimized by different arrangements where there is separation between the two phosphors. In some embodiments this separation results less than 50% of re-emitted light from the one phosphor passing into the phosphor where it risks re-absorption.

Description

201142214 VI. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to solid state lamps and bulbs, and more particularly to an efficient and reliable basis for enhanced color rendering index (CRI) via separation of different phosphor assemblies. Light-emitting diode (LED) lamps and bulbs. The application for the following applications is as follows: US Provisional Patent Application No. 61/339,516, filed March 3, 2010, and US Provisional Patent Application No. 61/ filed March 3, 2010 U.S. Provisional Patent Application No. 61/386, 437, No. 61/424, 665, filed on September 24, 2012 December 19, 2010 _ _ US Provisional Application No. 61/424 67 、, January 19, 2011 曰 Application for US Provisional Patent Application No. 61/434,355, January 23, 2011 U.S. Provisional Patent Application Serial No. 61/435,326, filed on Jan. 24, 2011, which is incorporated herein by reference. This application is also part of the following application and claims its rights: US Patent Application No. 12/848,825, filed on August 2, 2010, and US Patent Application, September 24, 2010 U.S. Patent Application Serial No. 12/975, filed on Dec. 12/ 889 719, filed Dec. [Prior Art] White woven lamps or bulbs or filament-based lamps or bulbs are commonly used as light sources for domestic and commercial installations. However, these lamps are extremely low-efficiency sources of light as much as 95. /. The input energy loss is mainly in the form of heat or infrared energy. Compared to white woven lamps, small fluorescent lamps are more effective at converting electricity into light 'but require the use of toxic materials (such as 'so that when lamps such as 154497.doc 201142214 are discarded, such toxic materials can pollute the environment, including Groundwater source. One solution for improving the efficiency of a lamp or bulb is to use solid-state devices, such as light-emitting diodes (LEDs) instead of metal filaments to produce light. Luminous ones generally contain the opposite type of doping. One or more active layers of the semiconductor material between the layers. When a bias voltage is applied to the doped layers, XI, holes and electrons are injected into the active layer, in the active layers Recombining to produce light. Self-acting layers and emitting light from all surfaces of the LED. In order to use LED wafers in circuits or other similar configurations, it is known to encapsulate LED wafers in a package to provide environmental and/or mechanical protection, Color selection, light focusing, and the like. The LED package also includes electrical leads, contacts or traces for electrically connecting the LED package to an external circuit. In the exemplary LED package 10 illustrated in Figure 1, by means of A single LED or LED wafer 12 is mounted on the reflective cup 13 by a bonded or conductive epoxy. One or more wire bonds 11 connect the ohmic contacts of the LED wafer 12 to the wires 15A and/or 15B 'The wires can be attached To the reflective cup 13 or integral with the reflective cup 13. The reflective cup may be filled with an encapsulant material 16, which may contain a wavelength converting material such as a phosphor. The LED is emitted at a first wavelength. Light can be absorbed by the phosphor, which responsively emits light at a second wavelength. The entire assembly is then encapsulated in a clear protective resin 14, and the protective resin can be molded into a lens shape to enable self-LED wafer 12 Emission of light collimation ° Although the reflector cup 13 can direct light in the upward direction, it may be reflected when the light is reflected (ie, some of the light is less than 1〇0% of the reflectivity of the actual reflector surface) Cup absorption), optical loss may occur. Additionally, thermal retention may be a problem with packages such as package 10 shown in Figure 1, as 154497.doc 201142214 may be difficult to extract heat via wires 15A, 15B. Habit The LED package 20 may be more suitable for high power operation that can generate more heat. In the LED package 20 'one or more LEDs 22 are mounted to a carrier (such as a printed circuit board (PCB) carrier, substrate or submount 23) The metal reflector 24 mounted on the submount 23 surrounds the LED wafer 22 and reflects the light emitted by the LED 22 to move the light away from the package 20. The reflector 24 also provides mechanical protection of the LED 22. Ohms on the LED wafer 22. One or more wire bond connectors 27 are formed in contact with the electrical traces 25A, 25B on the submount 23. The mounted LEDs 22 are then covered with an encapsulant 26 which provides an environment for the wafer and Mechanical protection also acts as a lens. Encapsulant 26 can also include one or more conversion materials (e.g., phosphors) that absorb light from the LED wafer and re-emit light having different wavelengths of light. The total emission from package 20 can be a combination of light from LED 22 and light re-emitted from the self-converting material. Metal reflector 24 is typically attached to the carrier by means of solder or epoxy bonding. LEDs (e.g., LEDs found in LED package 20 of Figure 2) may also be coated by a conversion material comprising one or more phosphors, wherein the phosphors absorb at least some of the LED light. The LEDs can emit light of different wavelengths such that they emit a combination of light from the LEDs and the phosphor. The LEDs can be coated with phosphors in a number of different ways. One of the suitable methods is described in U.S. Patent Application Serial No. 11/656,759, the entire disclosure of which is incorporated herein by reference. For Wafer Level Phosphor

Coating Method and Devices Fabricated Utilizing Method". Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat 154497.doc • 6 - 201142214 LEDs, one suitable EPD method is described in Tarsa et al. entitled "Close Loop Electrophoretic Deposition of Semiconductor Devices" Patent application No. u/473,089. A lamp utilizing a solid state light source (such as an LED) having a conversion material has also been developed which is separate from the LED or located at the distal end of the LED. Such a configuration is disclosed in U.S. Patent No. 6,3,50,041, to the name of "High Output Radial Dispersing Lamp Using a Solid State Light Source" by Tarsa et al. The lamp described in this patent can include a solid state light source that transmits light through a separator to a diffuser having a phosphor. The diffuser allows the light to be dispersed in a desired pattern and/or to change the color of the light by converting at least some of the light through the wall. In some embodiments, the separator separates the light source from the disperser a sufficient distance such that when the source carries the elevated current necessary for illumination in the room, heat from the source will not be transferred to the disperser. The additional distal phosphor technology is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. The coated LEDs, LED packages, and solid state lamps described above may utilize more than one type of conversion material, such as a phosphor, to produce the desired overall emission temperature and CRI. Each of the phosphors can absorb light from the LED and re-emit light of a different wavelength of light. Some of these conventional configurations may utilize a green/yellow phosphor combined with a red phosphor, wherein such phosphors typically absorb blue LED light and emit green/yellow and red light, respectively. The re-emitted light can be combined with the blue LED light to produce the desired emission characteristics. Such conventional configurations typically mix different phosphors at a location to a 154497.doc 201142214, such as in an LED coating, an LED encapsulant, or a lamp distal phosphor. One disadvantage of mixing the phosphors together is that there can be significant "crosstalk" or r-overlap between the emission spectrum and the excitation spectrum of the different phosphors, which can negatively affect the CRI and emission efficiency of the combined emitted light. Figure 3 shows a graph 30, which shows an example of the emission and excitation characteristics of conventional scales that can be mixed together. The first graph 30 shows the red phosphor excitation spectrum 32, the green phosphor emission spectrum 34, and the red emission spectrum 36»the second graph 40 shows the same red scale emission excitation spectrum 32, yellow disc emission spectrum 42, And the same red phosphor emission spectrum 36. The shaded overlap regions 38, 44 show the portion of the green emission spectrum 34 that overlaps the red excitation spectrum 32 with the yellow emission spectrum 42. This overlap can cause the converted yellow/green fill light to be "resorbed" by the red phosphor. This would have yellow/green light that would have helped convert one part of the overall emission into red light. In the illumination assembly using these fills to produce a combination of white light from the LED and the optical body, 'resorbing the black light on the CIE plot to distort the resulting white light so that the yellow/green peak emission can be shifted to Red light, and the red peak can be shifted to blue light. This can result in a reduction in CRI for overall emissions. There are also some efficiency losses associated with phosphor absorption and emission processes, and repeating this process via red scales to reabsorb yellow/green light results in additional efficiency losses. SUMMARY OF THE INVENTION The present invention is directed to LED packages and LED lamps and bulbs that are configured to minimize CRI and efficiency losses resulting from the overlap of the emission spectrum and the excitation spectrum of the conversion material. In a different device having this overlapping conversion material, the present invention configures the conversion material to reduce the likelihood that light re-emitted from the first conversion material will encounter the second conversion material to minimize the risk of re-absorption. . In some embodiments, this risk is minimized by different configurations 'where there is separation between the two phosphors. An embodiment of a solid state light in accordance with the present invention includes an LED and a first conversion material. The lamp further includes a second conversion material ' spaced apart from the first conversion material, wherein light from the LED passes through the second conversion material. The second conversion material undergoes wavelength conversion and re-emits at least some of the LED light' wherein less than 5% of the light re-emitted from the second phosphor is transferred into the first conversion material. Another embodiment of a solid state light in accordance with the present invention includes a plurality of LEDs and a red phosphor on at least one of the LEDs. The red phosphor is configured' such that light from at least one of the LEDs passes through the red phosphor. The lamp also includes a yellow phosphor or a green phosphor separated from the LEDs and over the LEDs, wherein light from the LEDs also passes through the yellow phosphor or green phosphor. An embodiment includes an LED having a first phosphor coating wherein the first phosphor absorbs some of the light emitted from the LED and re-emits light of a different wavelength. The lamp also includes a second phosphor spaced from the first phosphor, wherein light from the led passes through the second fill. At least some of the led light is absorbed by the second fill and re-emits a different wavelength of light. The emission spectrum of the newly emitted light from the second phosphorescent body overlaps with the excitation spectrum of the first phosphor, and wherein most of the light from the second phosphor does not hit the first phosphor. These and other aspects and advantages of the present invention will be apparent from the description and appended claims appended claims. [Embodiment] The present invention is directed to different embodiments of solid state lamps, bulbs, and led packages that utilize a plurality of conversion materials to produce desired overall emission characteristics, wherein the conversion materials are separated to reduce the effects of overlapping the emission spectrum and the excitation spectrum. Some embodiments of the present invention are directed to solid state lamps that are configured to utilize the two component phosphors by eliminating or reducing resorption (interaction) between two separate phosphor components. It produces white light with a warm color temperature. This can result in the emission of warm white light with a CRI that is significantly higher than the CRI of reconfigurable configurations that are not addressed, such as configurations that mix different phosphors. Resorption is minimized by providing physical separation between the two phosphors to minimize interaction or crosstalk between the two. That is, the separation reduces the amount of light from the first phosphor that interacts with the second phosphor, thereby reducing or eliminating reabsorption of the second filler. This in turn reduces the CRI color shift that this reabsorption can experience. In some embodiments 'the first phosphor can re-emit a wavelength of light' the light of the wavelength does not overlap with the excitation spectrum of the second phosphor such that light re-emitted from the first phosphor passes through the first The diphosphide is not at risk of being absorbed by the second phosphor. However, the emission spectrum of the second phosphor may emit light that at least partially overlaps the excitation spectrum of the first phosphor. In the configuration in which light from the second phosphor passes through the first phosphor, there may be a risk that 154497.doc -10· 201142214 light from the second fill is reabsorbed by the first phosphor. The separation of the phosphor minimizes the amount of re-emitted light that hits the first phosphor, thereby minimizing the amount of light that can be reabsorbed by the first optical body. In order to allow light from the first phosphor to pass through the second phosphor, in some embodiments, a material may be included that causes the emission spectrum of the first phosphor to not overlap the excitation spectrum of the second phosphor. In some embodiments, the 'second phosphor may comprise a yellow/green phosphor that absorbs blue light and re-emits yellow/green light, and the first phosphor may comprise a red phosphor that absorbs blue light and emits red light, wherein yellow The emission spectrum of the /green phosphor overlaps with the excitation spectrum of the red carbon. These embodiments provide separation between the first phosphor and the second phosphor in a manner that minimizes the chance that the yellow/green phosphor emission will encounter the red phosphor, and thus re-emit yellow light/ Green light rarely has a chance to be reabsorbed by red phosphors. Phosphor separation results in an overall lamp or package emission with a car's south CRI and higher phosphor efficiency compared to a mixed phosphor configuration. The separation can take many different forms, which can provide different reductions in the φ disturbance between the first phosphor and the second scale. In some embodiments, the separation can comprise a separate layer on the LED wafer. Each of these layers is a different one of the linings. The individual layers may be stacked on one another or may be included in a side-by-side layer on the LED. Although the crosstalk amount of this configuration is compared to the hybrid embodiment, a certain degree of crosstalk still exists due to the proximity of the two phosphors. At the far end of it, in the embodiment m, one can be provided in another, and this can take many different forms. In some embodiments, the distal end of the conformal coating on the 154497.doc •11-201142214 or the plurality of LEDs, such as one of the phosphors, may be included in the layer, and the The diphosphide can be in the shape of a dome above the first LED. This configuration further reduces the chance of crosstalk between the first phosphor and the second phosphor by further reducing the chance that light emitted from the second phosphor will hit the first phosphor. In still other embodiments, the second phosphor can be disposed over an LED by arranging the first phosphor over an LED (such as in an LED package) (in its own package illusion further) Reducing the possibility of crosstalk. The packages may be configured relative to each other such that light re-emitted from the first-disc in the first package is not emitted onto the second package, such that the first package and the second package There is no chance of crosstalk occurring. In some embodiments, the illuminators can be configured adjacent to one another such that their emissions are combined into a total light, but are configured in such a way that they do not illuminate each other. There are many other configurations that can provide phosphors. Separation of such varying degrees of existence. There are other advantages that may be provided by the present invention, including, but not limited to, cost savings S in the phosphor - the conformal coating is applied to the separation. Less phosphors are typically used in coatings. Therefore, more expensive phosphors can be used for conformal coatings. For example, a well-known color-like phosphor like YAG:Ce3+ has very low cost, but red Filling body Such as 'typically em-doped red discs' can be much more expensive. By coating the red scale as a conformal coating, the amount of more expensive phosphor required per system is reduced, and the result is Cost savings. Another advantage of this configuration is that at least one of the discs at the far end can result in a higher fill light than all of the discs on the led wafer 154497.doc -12- 201142214 Body efficiency. The efficiency is enhanced by the optical cavity effect formed in the space between the illuminator and the distal fill. Compared to the embodiment with the phosphor coating on the wafer, by the distal end - Light body configuration, can also have more flexibility in the highly reflective working chamber. There is also a thermal benefit in having a remote scale. The remote phosphor can be thermally isolated from the heated wafer, resulting in phosphorescence. Less thermal inhibition of bulk material. A third benefit is less optical inhibition of the phosphor material. For some phosphors, the quantum efficiency decreases as the luminous flux density through the phosphor material increases. By having a remote phosphor Through the phosphor The flux density can be reduced, thereby reducing optical suppression. The reduction in thermal inhibition and optical suppression can result in a more stable light output over time (even at high operating temperatures). This article is described with reference to specific examples. The invention, but it should be understood that the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. In particular, the following is directed to one or more LEDs or LEDs having different configurations. The invention is also described in terms of a particular LED package or lamp for a wafer or LED package, but it should be understood that the invention is applicable to many other lamps having many different configurations. Examples of different lamps configured in different ways in accordance with the present invention are described below. And in the U.S. Provisional Patent Application Serial No. 61/435,759, the entire disclosure of which is incorporated herein by reference.

Lamp, filed on January 24, 2011, and incorporated herein by reference. Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that can be mounted into a standard size bulb housing, such as an A19 size bulb housing. This makes these lamps particularly useful as alternatives to conventional incandescent lamps or lamps 154497.doc -13· 201142214 bubble and fluorescent lamps or bulbs, wherein the lamp according to the invention experiences reduced energy consumption provided by its solid state light source And long life. Lamps in accordance with the present invention can also accommodate other types of standard size profiles including, but not limited to, A21 and A23. The following embodiments are described with reference to one or more LEDs, but it should be understood that this scenario is intended to encompass that LED wafers and LED package components can have different shapes and sizes than those shown and can be different. Includes a different number of LEDs. The invention is described herein with reference to conversion materials, phosphors, phosphor layers, and related terms. The use of such terms should not be construed as limiting. It should be understood that the use of the term phosphor or phosphor layer is meant to encompass all wavelength converting materials and equally applicable to all wavelength converting materials. It should also be understood that the light source of the lamp may comprise one or more LEDs, LED wafers or LED packages, and in embodiments having more than one of the LED chips or led packages, the LEDs, LED chips or LED packages There may be different emission wavelengths. Although the invention is described below with reference to phosphor conversion materials, it should be understood that many other conversion materials may be used. The invention is described herein with reference to a conversion material having phosphor layers located distal to each other. In this context, the distal ends are spaced apart from each other and/or are not in direct thermal contact. The invention is also described with reference to LED wafers, but it should be understood that this can encompass both LED and LED packages. It will also be understood that when an element such as a layer, a layer, or a substrate is referred to as "on" another element, it can be directly on the other element or the intervening element can also be present. In addition, terms such as "inside", "outside", "upper", "upper" and "lower" '154497.doc •14· 201142214 "under" and "below" may be used to describe a layer or The relationship between another district. It is to be understood that the terms are intended to encompass other different orientations of the device in addition to the orientation depicted in the Figures. Phosphors are described herein with reference to red luminescent phosphors, but it should be understood that this may include other colors in the spectrum that are close to red, such as orange. The fill film is also described as yellowish light 'but this may also include a green luminescent fill. Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections are not to be limit. The terms are only used to distinguish one element, component, region, layer or section from another. The first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention. Embodiments of the invention are described herein with reference to the cross- Thus, the actual thickness of the layers can be varied, and differences in shape relative to the description due to, for example, manufacturing techniques and/or tolerances are contemplated. The embodiments of the present invention should not be construed as being limited to the particular shapes of the regions described herein, but rather to include a shape that is made by, for example, manufacturing. Areas illustrated or described as square or rectangular will have rounded or curved features that are typically attributed to normal manufacturing tolerances. The area illustrated in the drawings is therefore illustrative in nature and its shape is not intended to illustrate the precise nature of the area of the device and is intended to limit the scope of the invention. 4 shows an embodiment of a lamp 4 according to the present invention, the lamp housing comprising a plurality of LED chips 42 mounted on 154497.doc 201142214 to carrier 44. The carrier 44 may comprise a printed circuit board (PCB) carrier, substrate or sub-substrate. . Carrier 44 may include electrical traces (not shown) for applying electrical signals to the interconnects of LED wafers 42. Each of the ED wafers 42 can include an LED 46 having a conformal coating of a first fill material 48 thereon. Many different commercially available LEDs that emit light of many different colors can be utilized, and many different phosphor materials can be used, such as one of the materials listed below. In some embodiments, the LED can comprise a conventional blue light emitting LED, and the conversion material can comprise a red phosphor. The red phosphor absorbs at least some of the blue light from the LED and re-emits red light. In the illustrated embodiment, the red illuminator is configured to convert only a portion of the blue light from the LED wafer such that the LED wafer emits both blue and red light. By allowing a portion of the blue light to pass through the red dish, the LED wafer 42 does not need to operate with the red phosphor saturated. This may allow the LED wafer 42 to operate with higher emission efficiency. In other embodiments, the red phosphor can be configured to operate in a saturated state by converting substantially all of the blue light to red light such that the LED wafer emits substantially red light. A second phosphor 50' second phosphor 5 is included over the wafer 42 and spaced apart from the LED wafer 42 such that at least some of the light from the ]led wafer 42 passes through the second phosphor 5〇. The second phosphor 5 should be of a type that absorbs light from the wavelength of the LED chip 42 and re-emits light of a different wavelength. In the illustrated embodiment, the second phosphor is in the shape of a dome above the LED wafer, but it should be understood that the second phosphor can take a variety of different shapes and sizes (such as a disk or a second phosphor of the sphere) Phosphor carrier shape 154497.doc 201142214, which is characterized as comprising a conversion material in the binder, but may also comprise a thermally conductive carrier and a light transmissive material. Phosphors with a thermally conductive material are described on March 3, 2010 Application for the day and titled "LED Lamp Inc〇rp〇rating

The "U.S. Provisional Patent Application Serial No. 61/339,5, the entire disclosure of which is incorporated herein by reference. In the case where the second phosphor is formed in the form of a dome, an open space is formed between the LED wafer 42 and the second phosphor 50. In other embodiments, an encapsulant can be formed or mounted over the LED wafer 42, and the second phosphor 50 can be formed or deposited as a layer on the top surface of the encapsulant. The encapsulant can take a number of different shapes, and in the embodiment shown, the encapsulant is dome shaped. In still other embodiments having an encapsulating agent, the second phosphor 50 may be formed in the form of a layer in the encapsulant or in the region of the encapsulant. A number of different phosphors can be used in various embodiments in accordance with the present invention, wherein the second phosphor of the embodiment shown therein comprises a phosphor that absorbs blue light from the LED wafer and emits light. Many different discs can be used for yellow conversion materials (including commercially available YAG:Ce phosphors. As discussed above, a portion of the blue light from the LED wafer passes through the first (red) phosphor without being converted. From the LED B wafer The blue and red light of 42 passes through the second phosphor, and in the second phosphor, a portion of the blue light is converted into yellow light. One portion of the blue light may also pass through the second phosphor together with the red light from the LED wafer 42. Therefore, the lamp emits light of a combination of blue light, red light and yellow light, one of which emits a warm white light combination having a desired color temperature. The blue light from the LED chip 42 can also be provided with a wide range of wide yellow light 154497.doc - 17- 201142214 Many other phosphor conversions for spectral emission. In addition to the YAG:Ce mentioned above, these conversion materials can be filled with light based on the (Gd,Y)3(Al,Ga)5012:Ce system. Other yellow phosphors that can be used to produce white light when used with illuminators based on blue-emitting LEDs include, but are not limited to:

Tb3-xREx〇i2:Ce(TAG); RE=Y, Gd, La, Lu; and Sr2-x_yBaxCaySi〇4:Eu 〇The second glaze 50 can also be configured with more than one yellow 戍 green illuminating The phosphor, or the second phosphor, may comprise more than one layer of a yellow or green luminescent disc. The first phosphor 48 on the LED wafer 42 can comprise a number of different commercially available phosphors, such as a blush-filled red fill that absorbs blue and red light from the LED wafer. Other red luminescent phosphors can be used, including

SfxCai-xSrEu ‘ Y ; γ=halide;

CaSiAlN3:Eu; or Sr2-yCaySi〇4:Eu can use different sizes of phosphor particles, including (but not limited to) in the range of 1 〇 m (4) to 30 microns ((4) or 3 〇 microns ((4)) Particles. In terms of scattering and blending colors, smaller particles are usually larger ◎ + better' to provide more uniform light. Larger particles are usually more efficient at converting light than smaller particles. The light is emitted in a non-uniform manner. In one embodiment, the first and/or second optical bodies may be provided with a binder, and the spheroids may also have a different concentration or load of the light body. 154497.doc 201142214 The material-type concentration is in the range of particle concentration ranging from 3% by weight to 7% by weight. The concentration of the phosphorus in the -, the first and second bodies is about 65 weight /. Preferably, the first and second spheroids are formed in layers having different regions of different conversion materials and different concentrations of conversion materials. Although the barrier is provided in the adhesive, different materials may be used. Where the material is preferably strong after curing and substantially It is transparent in the wavelength spectrum. Suitable materials include polyfluorene oxide, epoxy resin, glass, inorganic glass, dielectric, BCB, polyamine, polymer and their blends. The preferred material is polyfluorene (this) Due to the high transparency and sinfulness of polyoxyl oxide in high power LEDs, suitable polyphenylene oxides based on phenyl and methyl groups are commercially available from D〇w8 Chermcal. Many different curing methods can be used to bond The curing of the agent depends on different factors such as the type of adhesive used. Different curing methods include, but are not limited to, thermal curing, ultraviolet (uv) curing, infrared (IR) curing or air curing. Different processes can be used. To coat the first and second phosphors 48, 5, different processes including, but not limited to, spin coating, sputtering, printing, powder coating, electrophoretic deposition (EPD), and electrostatic deposition, among others, various deposition methods and The system is described in US Patent Application Publication No. 2010/0155763, entitled "Systems and Methods for Application of Optical Materials to Optical Elements" by Donofrio et al., and the disclosure The disclosure of Cree, Inc. and the entire contents of this disclosure is incorporated herein. As mentioned above, the phosphor layer 48 can be coated with a binder material, but it should be understood that no binder is required. In an example, the second phosphor can be fabricated separately in the form of a circle 154497.doc 201142214 and then the second phosphor can be mounted to the carrier 44 and mounted over the LED wafer 42. It can also be combined as described in the following application. A diffuser uses a lamp: U.S. Provisional Patent Application Serial No. 61/339,515, which is incorporated herein by reference. This application also describes many different shapes and sizes of the second phosphor or filler carrier, which shapes and sizes can also be used in the embodiments of the invention described herein. Alternatively, a scattering material may be used in conjunction with the phosphor, one of which contains scattering particles. The scattering particles may also be included in the binder material which may be the same as the binder materials described above with reference to the binders used with the first and second phosphors. Different concentrations of scattering particles are available, depending on the application and the materials used. Suitable scattering particle concentrations range from 0.01. /. To 0.2%, but it should be understood that the concentration can be higher or lower. In some embodiments, the concentration can be as low as 〇 1%. It should also be understood that different concentrations of scattering particles may be present in different zones. For some scattering particles, there may be an increase in loss due to absorption at a higher concentration. Thus, the concentration of the scattering particles can be selected to maintain an acceptable loss while dispersing the light to provide the desired emission pattern. The scattering particles may comprise a number of different materials including, but not limited to, oxidized hair; kaolin; zinc oxide (ZnO); yttrium oxide (Y2〇3); 154497.doc -20· 201142214 titanium dioxide (Ti02); barium sulfate (BaS04); Alumina (A1203); Molten cerium oxide (Si〇2); Asahi dioxide (Si02); Aluminum nitride; Glass beads; Zirconium dioxide (Zr02); Oxide button (Ta05); tantalum nitride (Si3N4); niobium oxide (Nb205); boron nitride (BN); or filler particles (eg, YAG: Ce, BOSE) can be used in various material combinations or the same material More than one combination of different forms of scattering material to achieve a particular scattering effect. The scattering particles can be in many different locations in the lamp. Lamp 40 can also include a reflective material/layer 56 on the surface of carrier 44 that is not covered by lED wafer 42. The reflective layer 56 allows the lamp 4 to efficiently recycle photons' and increase the emission efficiency of the lamp. Light emitted back to the carrier is reflected by the reflective material/layer 56' such that absorption is reduced and light can contribute to useful emission from the lamp. It should be understood that reflective layer 56 can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. It should also be understood that the surface of the LED and the first and second fills 154497.doc • 21- 201142214 can be shaped or textured to enhance light extraction. During operation, an electrical signal is applied to the lamp 40 such that a portion of the blue LED light emitted by the LEDs within the LED wafer 42 that passes through the first phosphor 48 is absorbed by the red phosphor 48 and re-emitted into red light. A portion of the blue light also passes through the red first phosphor 48 without being converted, causing the LED wafer 42 to emit both red and blue light. Light from LED wafer 42 is emitted through second phosphor 50, at least a portion of the blue light from the LED light in second phosphor 50 is converted to yellow light, and in some embodiments, light from LED wafer 42 A portion of it passes through the second phosphor 50 without being converted. As mentioned above, this situation allows the lamp to emit a combination of white light of blue, red and yellow light. When the blue component of the light from the LED wafer is absorbed by the second filler 5, it is re-emitted in all directions. In the embodiment shown, since the filler particles absorb blue light, the yellow light is re-emitted forward and emitted out of the lamp and emitted back to the LED wafer. Light emitted back to the LED wafer 42 can strike the first phosphor 48 on the LED wafer 42. As mentioned above, the excitation spectrum of many red discs overlaps with the emission of many yellow/green phosphors, so that the light from the second wall that is emitted back to the LED wafer 42 has the first phosphor Risk of absorption. This absorbed yellow light can be re-emitted into red light, which can result in a color shift in the overall lamp emission. The second filler 50 is spaced apart (as opposed to mixing the filler) as shown by the lamp 40. The opportunity for the second fill light to encounter the first wall is greatly reduced. Most of the emission paths from the yellow light of the second moth 50 will not hit the first phosphor and there will be no risk of reabsorption. Most of the light that is emitted back to the LED wafer 42 is reflected off the reflective layer on the carrier 44, so that it can help 154497.doc • 22· 201142214 for useful emissions from the lamp. In some embodiments, the H-light body is spaced apart from the first phosphor such that less than 5 G% of the light that is re-emitted by the second dish strikes the first scale or is transmitted to the -4th light body. In other embodiments, the tank is hit below the first-light body or transmitted to the first, light-emitting. In still other embodiments, less than 25% of the second phosphor light hits the first phosphor, while in other embodiments ' 10% or less encounters the first phosphor. Different lamps in accordance with the present invention can be configured in a number of different manners using a number of different features and materials. Figure 5 shows another embodiment of a lamp 7A in accordance with the present invention. The lamp 70 has many of the features and components similar to those shown in Figure 4 and described above, and operates in substantially the same manner. For similar features and components, the same reference numerals are used, it should be understood that the description of the lamp is equally applicable to this embodiment or other embodiments using the same reference numerals below. The lamp 70 includes a plurality of LEDs each mounted on a carrier 44. Wafers 42, wherein each of the LED wafers 42 comprises a blue light emitting LED coated by a red first phosphor 48. The uncovered surface of carrier 44 may also include a reflective layer 56. The lamp 70 includes a second phosphor 72 over the LED wafer, the second phosphor 72 being configured in substantially the same manner as the second phosphor 5 描述 described above. However, in this embodiment, the second phosphor 5 〇 contains a squama material that absorbs blue light and re-emits green light. For example, the following light bodies can be used to generate green light:

SrGa2S4: Eu;

Sr2.yBaySi04:Eu; 154497.doc •23- 201142214

SrSi2〇2N2:Eu; Lu3A150丨2 doped with Ce3+; (Ca,Sr,Ba)Si202N2 doped with Eu2+; CaSc2〇4:Ce3+; and (Sr,Ba)2Si04:Eu2, but emit blue light The red combination can be produced as a combination of light and green light having a lamp 70 in substantially the same manner as the lamp 4A. In some embodiments, the warm white light of the desired temperature is emitted. In addition to the phosphors listed above, some additional suitable phosphors that can be used as the first or second phosphor are listed below. Each phosphor exhibits excitation in the blue and/or UV emission spectrum, providing a desired peak emission with efficient light conversion' and an acceptable Stokes shift: yellow/green (Sr,Ca,Ba)(Al,Ga)2S4 :Eu2+ Ba2(Mg,Zn)Si207:Eu2+

GdowSro nAluOxF, 38:Eu2+0 06 (Ba,.x.ySrxCay)Si04:Eu

Ba2Si04:Eu2+ Red LU2O3 :Eu3 + (Sr2.xLax)(Ce1.xEux)〇4

Sr2Cei.xEux04

Sr2-xEuxCe04 154497.doc •24· 201142214

SrTi03: Pr3+, Ga3 +

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ Figure 8 is a graph showing a comparison of the emission characteristics of a lamp with a hybrid phosphor and a similar lamp with a separate scale as described above. The first emission spectrum 82 is directed to a lamp having a separate red phosphor and a green phosphor' wherein the spectrum exhibits peak values in the blue, green and red wavelength spectra. The second emission spectrum 84 is for a similar lamp' having a mixed red phosphor and green light-breaking body' and exhibits a decrease in blue peak value and offset' and a shift in red light peak as compared to the separated spectrum 82. The overall fill conversion efficiency of the two phosphors was approximately the same (42.5% of the separation versus 46.1% of the mixture), but the CRI was 78.5 for the 88 5 pairs of mixed phosphors of the separated phosphor. Figure 7 shows yet another embodiment of a lamp 〇〇 according to the present invention, the lamp 1 〇〇 comprising a combination of different LED chips that emit light of different colors to produce the desired lamp. The lamp 100 includes a Led wafer 102 mounted on a carrier 1 4, wherein the carrier is similar to the carrier 44 described above. The carrier may have a reflective layer 1〇5 covering its surface between the LED wafers 102. [ED wafer 102 may include a red light emitting LED wafer 106 and a blue light emitting LED wafer 1 8 which together produce the desired red and blue light components of the lamp emission. Red LED wafer 106 may comprise LED 110 coated by red phosphor 112 as described above, wherein some embodiments of LED 11A emit blue light and red phosphor 112 absorbs at least some of the blue light and re-emits red light. In some embodiments, the red phosphor 112 can be configured to absorb substantially all of the blue led light, while in other embodiments 154497.doc • 25· 201142214, the red phosphor 112 can be configured to absorb only blue light. portion. Similar to the above embodiment, a second can 114 is disposed over the LED wafer 1 〇 2 and spaced apart from the LED wafer 102, wherein the second phosphor comprises a fill that absorbs blue light and re-emits yellow light. During operation, red and blue light from the LED wafer passes through the second phosphor, and in the second phosphor, some of the blue light is converted to yellow light. The lamp 1 〇〇 emits a combination of white light of blue light, red light and yellow light. As described above, the separation between the red phosphor and the yellow phosphor minimizes the risk that the red phosphor will reabsorb the yellow light from the second phosphor. Figure 8 shows another lamp 130 in accordance with the present invention, the lamp 130 being similar to the lamp 1A. Instead of a second phosphor having yellow illumination, the lamp 130 has a second phosphor 132 that emits green light, the second phosphor 132 absorbing some of the blue light from its LED wafer 102 such that the lamp emits blue, red and green White light combination of light. As mentioned above, the lamp according to the invention can be configured in many different ways with a number of different carbonaceous materials. 9 shows another embodiment of a lamp 140 in accordance with the present invention. As described above, the lamp 140 includes an LED wafer mounted to the carrier 144, 142. However, in this embodiment, the LED wafer includes a yellow first phosphor. 148's conformal coated blue LED 146. The first phosphor 148 absorbs at least some of the light from the LED 146 and re-emits yellow light. The second phosphor 150 is in the form of a dome above the LED wafer 142 and contains a red fill. The blue light (and yellow light) from the LED wafer 142 passes through the second scale body 150. In the second phosphor 150, at least some of the blue LED light 154497.doc • 26· 201142214 is absorbed by the second phosphor and Re-emitted as red light. Lamp 140 emits a combination of white light of blue, yellow, and red light. 10 shows a further embodiment of a lamp 160 having a lamp wafer 160 mounted on a carrier 164, wherein each of the LED chips 162 includes an LED 166 and one of the green first phosphors 168. Conformal coating. At least some of the blue light from each of the LEDs 166 passes through the first phosphor 168 and is converted to green light' such that each of the LED wafers 162 emits green and blue light. Blue (and green) LED light passes through the second dome-shaped second red phosphor 170 ^ at least some of the LED light is converted to red light at the second phosphor 'where the lamp 160 emits blue light, red light, and green White light combination of light. Illustrating a further embodiment of a lamp i 80 in accordance with the present invention, the lamp housing 8A includes a blue light emitting LED chip 182 mounted to a carrier 184. Instead of conformally coating the LED wafer 182, a first red phosphor 186 is provided over the LED wafer 182 in the form of a dome, wherein light from the LED wafer 182 passes through the first phosphor 186 at the first phosphor 186. At least some of the light is converted to red light. A second green phosphor 188 is disposed over the first phosphor 186 in the form of a dome, wherein red light from the first phosphor 186 and blue light from the LED wafer 182 pass through the second phosphor 188, in the second phosphor In body 188, at least some of the s-lights are converted to green light. The lamp emits a combination of white, blue and green light. The second phosphor 188 is shown on the first scale 186. It should be understood that there may be a space between the first fill 186 and the second phosphor 188 and the scales may be provided in a different order. For example, there is a green light-blocking body inside and a red scale body on the outside. 154497.doc • 27- 201142214 Figure 12 shows another embodiment of a lamp 190 according to the present invention having a blue illuminated LED chip 192 on a carrier 194. The lamp includes red and green phosphors in which the phosphors are shown in different regions of the phosphor dome 196. In the illustrated embodiment, the red first phosphor 198 is on the top portion of the dome and the green second phosphor 2 is on the lower portion of the dome 196. The blue light from the led wafer passes through the first and second phosphor portions 198, 200, in which at least some of the lEd light is converted into red and green light, respectively. The lamp emits a combination of white light in blue, red and green light. It should be understood that other embodiments may include different regions of phosphors that are configured in different ways. Each of the lamps shown in Figures 9 through 12 can include a reflective layer on the carrier, as described above. As mentioned above, the lamps and their scales can be configured in many different ways in accordance with the present invention. Figure 13 shows yet another embodiment of a lamp 250 in which the LED wafer 252 of the lamp 250 is mounted. Like the above-described embodiments, LED wafer 252 can include LED 256 coated by first phosphor 258, and in some embodiments 'LED 256 emits blue light, and the first phosphor absorbs at least some of the blue LED light and Re-emitting red light red phosphor. In this embodiment, the red phosphor absorbs only a portion of the blue light from the LED such that the LED chip 252 emits red and blue light. The LED die 252 can be mounted to a carrier 260 similar to the carrier described above, and in the illustrated embodiment, the LED die 252 and carrier 260 can be mounted within the optical cavity 254. In other embodiments, the optical cavity can be mounted to the carrier around the LED wafer. As described above, the carrier 260 can have a reflective layer 262 on its exposed surface between the LED dies 252, and the optical 154497.doc -28- 201142214 cavity 254 can have a reflective surface 264 to redirect light to the optical cavity 254 Outside the top opening. The first scale 266 is disposed over the opening of the optical cavity 254, and in the illustrated embodiment the second phosphor 266 is planar. However, it should be understood that the first photoreceptor can take many different shapes including, but not limited to, a dome or a sphere. Similar to the above embodiment, the second phosphor 266 can include a dish that absorbs light from the LED wafer 252 and emits light of a different color. In the illustrated embodiment, the second phosphor 266 comprises one of the yellow scales that absorb blue light and re-emit yellow light as described above. Similar to the above-described embodiment, the blue light from the LED chip 252 and the red light pass through the second filler 266' in the second filler 2 66, at least some of the blue light is absorbed by the yellow phosphor and re-emitted as Huang Guang ◎ 25 灯 light can emit blue light, red light and yellow light white light combination. The separation between the LED wafer 252 and the second phosphor 266 greatly reduces the chance that yellow light from the second phosphor 266 will be transferred into the red first phosphor 258. Similar to the above embodiment, this reduces the likelihood that yellow light will be absorbed by the red first phosphor and re-emitted into red light. Figure 14 shows another embodiment of a lamp 280 in accordance with the present invention having a plurality of features similar to lamp 250. However, in this embodiment, the second fill 282 includes a green luminescent phosphor that absorbs some of the blue light from the LED wafer and re-emits green light. In operation, lamp 28A combines blue and red light from the LED wafer with white light from the green phosphor of the second phosphor, wherein separation between the first phosphors results in minimal re-absorption of green light by the first phosphor Chemical. 154497.doc -29- 201142214 Different embodiments can combine illumination components of different illumination concentrations to achieve the desired 'color and temperature. Figure 15 is a CIE diagram 290 showing different combinations of green illumination components and red illumination components that are combined at approximately 3000 k on the black body curve. Combination 1 (c〇mb 1} has the lowest • color 77 amount in its emission spectrum and therefore, the spectrum requires a larger red portion to achieve the desired color and temperature. Combination 2 (comb 2) has the largest green component and therefore has The lowest red component, and the combination 3 (c〇mb 3) has a red component and a green component of the midpoint. Figure 16 shows another embodiment of a lamp 3〇〇 according to the present invention having a lamp 3〇〇 mounted to the carrier 304 The blue LED wafer 302, wherein the LED wafer 302 is disposed in the optical cavity 306 having the reflective surface 308. The first phosphor 310 and the second phosphor 312 are provided in the planar shaped opening of the optical cavity 306, but are disposed adjacent to each other. Wherein the first red phosphor 31 covers about half of the opening, and the first green (or yellow) lining 312 covers the remainder of the optical cavity opening. The blue light from the LED wafer 302 passes through the phosphors 310 and 312 In the phosphors 310 and 312, a portion thereof is converted into red light and green light, respectively. The lamp 300 emits a combination of white light of blue light, red light, and green light. It should be understood that the phosphor may be configured in many different zone configurations, and Can also The form is provided on top of each other. Figure 17 shows another embodiment of a lamp 320 in accordance with the present invention having a blue LED wafer 322 mounted to a carrier 324, wherein the LED wafer 322 is disposed within the optical cavity 326. The first phosphor 328 is disposed over the opening of the optical cavity 326, and the second green (or yellow) phosphor 33 is disposed in a dome form over the first phosphor. The LED light passes through the first and second phosphors. 154497.doc -30- 201142214 wherein at least some of the LED light is converted such that the lamp 32A emits a combination of white light of blue, red and green light. Figure 18 shows another embodiment of a lamp 34 according to the present invention, The lamp 34 is configured similarly to the lamp 32 shown in Fig. 17. However, in this embodiment, the first green phosphor 342 is disposed in a spherical form on the first phosphor 344, wherein the shape of the sphere is promoted. The second phosphor light is re-emitted in a more omnidirectional pattern. In particular, it can promote downward emission of light from the second phosphor 342. Figures 19 and 20 show another lamp 35 according to the present invention. In one embodiment, the lamp 3 50 is similar to the following application Shown and described by them light: On March 3 application and entitled "Lamp Whhph〇sph〇r and

US Patent Application No. 61/339,515 to Diffuser Configurati〇n, and US Patent Application entitled ":^〇11_ uniform Diffuser to Scatter Light Into Uniform Emission Pattern" filed on January 8th, 201st, 2011 Case No. 12/9〇1, 4〇5. The lamp includes a submount or heat sink 352, as well as a dome shaped phosphor carrier 354 and a dome shaped diffuser 356. The lamp also includes an LED 358, which in this embodiment is mounted on a planar surface of the heat sink 352, with the phosphor carrier and diffuser above the LED die 358. LED wafer 358 and phosphor carrier 354 can comprise any of the configurations and characteristics described above, such as some embodiments having a first phosphor on LED wafer 358 and a second phosphor in phosphor carrier 354 The other embodiments have a first phosphor and a second phosphor that are part of the phosphor carrier 354. Lamp 35A can include a mounting mechanism of the type installed in conventional electrical outlets. In the illustrated embodiment, the lamp 154497.doc 31 201142214 350 includes a threaded portion 36〇 for mounting to a standard threaded seat. Like the above embodiment, the lamp 350 can include a standard plug and the electrical socket can be a standard socket, or can include a GU24 base unit, or the lamp 35 can be a clip and the electrical socket can be a socket that receives and holds the clip (eg, , as used in many fluorescent lights). A lamp according to the present invention may comprise a power supply or power conversion unit, which may include a driver to allow the light bulb to be powered by the AC line voltage/current and to provide a source dimming capability. In some embodiments The power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp 35A (such as in the body portion 362), and in some embodiments, the lED driver can comprise less than 25 cubic centimeters of volume, while in other embodiments, the LED driver can Contains a volume of approximately 20 cubic centimeters. In some embodiments the 'power supply can be non-dimmable, but at a lower cost. It should be understood that the power supplies used may have different topologies or geometries and may also be dimmable. The lamp embodiments described herein can be configured to meet the omnidirectional distribution criteria defined by the Energy Department (D〇E) Energy Star, which are incorporated herein by reference. One requirement that this standard meets by the lamps described herein is that the uniformity of emission must be at 〇. To 135. The average value under the view is 2〇0/〇 and is at 135. To 180. In the launch zone, the total flux from the lamp must be >50/〇, where the measurement is in 〇. 45. 90. Performed under azimuth. The different lamp embodiments described herein may also include Type A trim LED bulbs that meet the D〇e Energy Star standard. The present invention provides an efficient, reliable and cost effective lamp of 154497.doc -32 - 201142214. In some embodiments t, the entire lamp can include five components that can be assembled quickly and easily. As discussed above and illustrated in Figure 16, different regions of the phosphor support can have different types of phosphors. In some embodiments, such different regions can provide a seemingly patterned phosphor carrier. Figures 21 and 22 show additional lamp embodiments 4, 45, similar to the lamp 35 展示 shown in Figure 20 and Figure 20. . The lamp or the like also includes a sub-substrate or heat sink 352, a dome-shaped diffuser 356, and an LED 358 mountable on a planar surface of the heat sink 352, wherein the diffuser 356 is above the LED wafer 358. In Fig. 21, a phosphor carrier 4? 2 is included between the LED 358 and the diffuser 356, and in Fig. 22, a phosphor carrier 452 is included between the led 358 and the diffuser 356. The wafers gw and phosphor carriers 402, 452 can comprise any of the configurations and characteristics described above. However, in these embodiments, the phosphor carriers 4〇2, 452 each comprise different first and second phosphors 4〇4, 4〇6, wherein the first phosphor and the second phosphor are in different regions. . For the phosphor carrier 4〇2, the W-th body 404 covers most of the phosphor carrier region, and the second phosphor is disposed in dots on other portions of the phosphor carrier region. The overall disc light carrier 404 appears to be somewhat patterned. In other embodiments, the first optical body may cover the entire phosphor carrier, and the second phosphor may include dots on the first optical body. For the phosphor carrier 452 of Figure 22, the first phosphor 404 can cover a substantial portion of the phosphor carrier, while the second phosphor 4"6 can comprise a strip that covers other portions of the phosphor carrier. In still other embodiments, the first optical body 404 can cover the entire phosphor carrier, and the second phosphor 4〇6 can cover the first optical body in a strip pattern 154497.doc • 33· 201142214. These patterns are only some of the many different patterns that may be included on the phosphor carrier in accordance with the present invention. It should also be understood that the phosphor support according to the present invention may comprise a transparent support material in a two-dimensional (e.g., 'dome" or planar shape, wherein the scale system described above is on the outer or inner surface of the transparent support, Or on both surfaces. Portions of the patterns described above may also be on different spaced apart phosphor carriers. For example, a point arrangement of the scales can be on the first phosphor carrier, the first phosphor carrier being spaced apart from the second phosphor carrier having the other filler. Different phosphor carriers can be planar or three-dimensional. Figure 23 shows yet another embodiment of a lamp 460 in accordance with the present invention. The lamp 46A includes a first illuminator package 462 having a green phosphor 464 and a first illuminator package 466 having a red phosphor 468. The emissions from the packages 464, 466 are oriented such that almost all of the light from each of the illuminators does not fall on the other illuminators. Therefore, light from green phosphor 414 will not pass into red phosphor 468 'in red phosphor 468, which is at risk of being resorbed. This type of lateral separation provides an even greater reduction in the amount of light that can be reabsorbed, and thereby further reduces the negative impact that resorption can have on the Cri of the lamp. Figure 24 shows yet another lamp or display 48 in accordance with the present invention having a plurality of blue LED chips 482 spaced from a layer comprising a plurality of transmission lamp/illuminator pixels 484. Each pixel 484 can include red or green quantum dots or light-breaking bodies 486, 488 that absorb blue light from LED wafer 482 and emit red and green light, respectively. Diffusion or reflective material 49〇 can be matched 154497.doc •34· 201142214 Between red phosphor 486 and green phosphor 488 and configured with a similar heart reduction (iv) interaction or crosstalk between the converter materials. Separation is provided between the red phosphor and the green phosphor, and efficiency improvement can be achieved by including a diffuser or reflective material 49〇 between the phosphors. The diffuser or reflective material may be opaque or translucent, as appropriate, and help prevent light from the phosphor from being reabsorbed by another phosphor. Some of the above embodiments are described with reference to a first conformal phosphor coating having a second phosphor (e.g., in the shape of a dome) spaced apart from the first phosphor. It will be appreciated that the second phosphor may be provided in a number of different shapes than the dome and more than one phosphor may be provided in the form of a dome. For example, the first phosphor may be provided in the form of a dome on one or more of the LEDs, wherein the second phosphor is provided in a dome form over the first dome. It should also be understood that more than two phosphors can be used in different conformal coatings or separated in different dome configurations. It should also be understood that one or more of the phosphors may comprise a disk that may be used in conjunction with other phosphor disks or in combination with a phosphor sphere or dome. Separation can also include in-plane pixelation, such as in-plane separation of LEDs coated with different materials, such as yellow and red phosphors. There may also be many variations in the in-plane package separation as described above. Although the invention has been described in detail with reference to a particular preferred embodiment of the invention, other forms of the invention are possible. Therefore, the spirit and scope of the present invention should not be limited to the types described above. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED lamp; 154497.doc -35- 201142214 Figure 2 shows a cross-sectional view of another embodiment of a prior art LED lamp; Figure 3 shows two Figure 4 is a cross-sectional view of an embodiment of a lamp in accordance with the present invention; Figure 5 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; 6 is a graph showing an emission spectrum of different lamps according to the present invention; FIG. 7 is a cross-sectional view showing another embodiment of the lamp according to the present invention; and FIG. 8 is a cross-sectional view showing another embodiment of the lamp according to the present invention; Figure 9 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; Figure 11 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; Figure 11 is a view of another embodiment of a lamp in accordance with the present invention Figure 2 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; Figure 13 is a cross-sectional view of an embodiment of a lamp in accordance with the present invention, the lamp including an optical cavity; Figure 14 is in accordance with the present invention A cross-sectional view of another embodiment of the lamp, the lamp also includes Figure 15 is a cross-sectional view showing another embodiment of a lamp according to the present invention, the lamp also includes an optical cavity; Figure 17 is a lamp according to the present invention. Figure 1 is a cross-sectional view of another embodiment of a lamp according to the present invention, the lamp also includes an optical cavity; and Figure 19 is a lamp according to the present invention. Front view of another embodiment; 154497.doc • 36· 201142214 FIG. 20 is an exploded view of the lamp shown in FIG. 19; FIG. 21 is an exploded view of another embodiment of the lamp according to the present invention; FIG. Figure 23 is a perspective view of another embodiment of a lamp in accordance with the present invention; and Figure 24 is a cross-sectional view of one embodiment of a lamp or display in accordance with the present invention. [Main component symbol description] 10 Typical LED package 11 Wire bond 12 LED chip 13 Reflector cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 Conventional LED package 22 LED chip 23 Substrate or sub-substrate 24 Metal reflector 25A Electrical Trace 25B Electrical Trace 26 Encapsulant 27 Wire Bonded Connector 30 Curve 32 Red Phosphor Excitation Spectrum 154497.doc 201142214 34 36 38 40 42 44 46 48 50 56 70 72 80 82 84 100 102 104 105 106 108 110 154497.doc Green Phosphor Emission Spectroscopy Red Emission Spectroscopy Shaded Overlap/Green Emission Spectrum Partial Lamp with Red Spectral Overlap/Second Graph LED Wafer/Yellow Phosphor Emission Spectroscopy Carrier/Shaded Overlap/ Partial light-emitting diode (LED) with yellow emission spectrum overlapping with red excitation spectrum First phosphor material Second phosphor reflective material/layer lamp Second phosphor curve First emission spectrum Second emission spectrum lamp LED wafer carrier reflection Layer red LED chip blue LED chip light emitting diode (LED) -38- 201142214 112 Red phosphor 114 Second phosphor 130 Lamp 132 Second Phosphor 140 Lamp 142 LED Wafer 144 Carrier 146 Blue Illuminated LED 148 Yellow First Phosphor 150 Second Phosphor 160 Lamp 162 LED Wafer 164 Carrier 166 Light Emitting Diode (LED) 168 Green First Phosphor Body 170 second dome shaped second free 180 lamp 182 LED wafer 184 carrier 186 first red phosphor 188 second green phosphor 190 lamp 192 blue light emitting LED chip 194 carrier 154497.doc .39. 201142214 196 phosphor circle Top 198 Red First Phosphor 200 Green Second Phosphor 250 Lamp 252 LED Wafer 254 Optical Cavity 256 Light Emitting Diode (LED) 258 First Phosphor 260 Carrier 262 Reflecting Layer 264 Reflecting Surface 266 Second Phosphor 280 Light 282 Second phosphor 290 CIE diagram 300 Lamp 302 Blue LED wafer 304 Carrier 306 Optical cavity 308 Reflecting surface 310 First phosphor 312 Second phosphor 320 Lamp 322 Blue LED wafer 154497.doc -40- 201142214 324 Carrier 326 Optics Cavity 328 Plane Red First Phosphor 330 Second Green (or Yellow) Phosphor 340 Light 342 Second Green Phosphor 344 First phosphor 350 Lamp 352 Sub-substrate or heat sink 354 Dome-shaped phosphor carrier 356 Dome-shaped diffuser 358 Light-emitting diode (LED) / LED 360 Threaded portion 362 Body portion 400 Additional lamp embodiment 402 Phosphor carrier 404 First Phosphor 406 Second Phosphor 450 Additional Lamp Embodiment 460 Lamp 462 First Luminaire Package 464 Green Phosphor 466 Second Luminaire Package 468 Red Phosphor 154497.doc .41 - 201142214 480 Lamp or Display 482 Blue LED chip 484 pixels 486 red quantum dots or phosphors 488 green quantum dots or phosphors 490 diffusion or reflective material 154497.doc -42-

Claims (1)

201142214 VII. Patent application scope: 1. A solid-state lamp comprising: a light-emitting diode (LED); a first conversion material; a second conversion material separated from the first conversion material, wherein Light from the LED passes through the second conversion material, wherein the second conversion material undergoes wavelength conversion and re-emits at least some of the LED light. 2. The lamp of claim 1 wherein light from the LED passes through the first conversion material, wherein at least some of the light from the LED is wavelength converted and re-emitted. 3. The lamp of claim 1, wherein the first conversion material has an excitation spectrum that overlaps with a re-emission spectrum of the second conversion material. 4. A lamp as claimed in claim 1, wherein the second conversion material is above the first conversion material. 5. A lamp as claimed in claim 1, wherein the second conversion material comprises a dome above the first conversion material. 6. The lamp of claim 1, wherein an emission spectrum of the first conversion material does not overlap the excitation spectrum of the second conversion material. 7. The lamp of claim </RTI> wherein the first conversion material absorbs light from the LED and re-emits red light. 8. The lamp of claim 1, wherein the second conversion material absorbs light from the LED and re-emits yellow or green light. 9. The lamp of claim 1 further comprising an optical cavity. 10. The lamp of claim 1 wherein less than 50% of the light of the 154497.doc 201142214 re-emitted from the second conversion material is transferred to the first conversion material. 11. The lamp of claim 1, wherein less than 25% of the light re-emitted from the second conversion material is transferred to the first conversion material. 12. The lamp of claim 1 which emits a white light combination from light comprising at least two of the LED, the first conversion material and the source of the second conversion material. 13. A lamp as claimed in claim 1, wherein the second phosphor is a sphere above the light emitting diode. 14. The lamp of claim 13 further comprising a diffuser above the sphere. 15. The lamp of claim 1, wherein the lamp emits light having an emission pattern that conforms to the Energy Star standard. 16. As claimed in item 1, the lamp is sized to accommodate an Ai9 size profile. 17. A solid state light comprising: a plurality of light emitting diodes (LEDs); a red phosphor 'on at least one of the LEDs, wherein light from at least one of the LEDs Passing through the red phosphor; and a yellow or green phosphor 'separating from the LEDs and above the LEDs, light from the LEDs passes through the yellow or green scale. 18. A solid state light comprising: a light emitting diode (LED) having a first optical body 154497.doc that absorbs some of the light emitted from the LED and re-emits light of a different wavelength -2- 201142214 a coating; and a second phosphor spaced apart from the first phosphor, wherein light from the LED passes through the second scale body 'the second scale body absorbs the LED light At least some and re-emitting a light of a different wavelength, wherein an emission spectrum of the light re-emitted from the second phosphor overlaps with an excitation spectrum of the first phosphor, and wherein light from the second phosphor Most of them will not touch the first-disc. 154497.doc