TW201144684A - LED lamp incorporating remote phosphor and diffuser with heat dissipation features - Google Patents

Abstract

An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can have a three-dimensional shape, and can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can be arranged to operate at a lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and to conceal the phosphor carrier.

Description

201144684 VI. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to solid state lamps and bulbs, and more particularly to efficient and reliable light-emitting diodes comprising remote scales having heat dissipation characteristics ( LED) lights and bulbs. The present application claims the following claims: U.S. Provisional Patent Application No. 61/339,516, filed March 3, 2010, and U.S. Provisional Patent Application No. 61/339, 5, filed on March 3, 2010. No. 61/386,437, US Provisional Patent Application No. 61/424, 665, filed on September 24, 2010; US Provisional Application No. 61/424,665, filed December 19, 2010; December 19, 2013 U.S. Provisional Application No. 61/424,67 ;; US Provisional Patent Application No. 61/434,355, filed January 1, 2011; US Provisional Patent Application for January 23, 2011 U.S. Provisional Patent Application Serial No. 61/435,759, filed on Jan. 24, 2011. This application is also part of the following US patent application application and claims the following claims: US Patent Application No. 12/848,825, filed August 2, 2010; September 24, 2010 U.S. Patent Application Serial No. 12/889,719, filed on Jan. 22, s. [Prior Art] A light-emitting diode (LED) is a solid-state device that converts electrical energy into light, and generally comprises one or more active layers sandwiched between layers of opposite doping types. When a bias is applied across the doped layers, holes and electrons 154502.doc 201144684 are injected into the active layer where the holes recombine with the electrons to produce light. Self-acting layer and emit light from all surfaces of the led. In order to use a led wafer in a circuit or other similar configuration, it is known to enclose an LED wafer in a package to provide environmental and/or mechanical protection, color selection, light focusing, and the like. The led package also includes electrical leads, contacts or traces for electrically connecting the led package to an external circuit. In a typical LED package 1 shown in Fig. 1, a single LED wafer 12 is mounted on a reflective cup 13 by means of solder bonding or conductive epoxy. One or more wires are combined to "connect the ohmic contacts of the LED wafer 12 to the wires 15 A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflective cup may be filled There is an encapsulant material 16. The encapsulant material 16 may contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength may be absorbed by the phosphor, and the phosphor may be emitted at the second wavelength in response thereto. The entire assembly is then encapsulated in a clearing protective resin 14, which can be molded into the shape of a lens to collimate the light emitted from the LED wafer 12. Although the reflective cup 13 can be in the upward direction Light is guided upwards, but when light is reflected (ie, some light can be absorbed by the reflective cup due to less than 100% reflectivity of the actual reflective surface), light loss may occur. In addition, thermal retention may be The problem of packaging (such as the package shown in Figure 1) is that it may be difficult to extract heat via wires [SA, bb. The conventional lED package 2 illustrated in Figure 2 may be more suitable for generation. More hot high power operation. In LED package In one of the two, one or more LED wafers are attached to a carrier such as a printed circuit board (pCB) carrier, a substrate or a sub-substrate 23. The metal reflector mounted on the sub-substrate 23 surrounds 154502.doc 201144684 The LED wafer 22 is reflected and reflected by the LED wafer 22 to move the light away from the package 20. The reflector 24 also provides mechanical protection for the LED wafer 22. The ohmic contact on the LED wafer 22 and the submount 23 One or more wire bond connectors 27 are formed between the electrical traces 25A, 25B. The mounted LED wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer while also serving as a lens The metal reflector 24 is typically attached to the carrier by means of a solder or epoxy bond. LED wafers (such as 'the LED chips visible in the LED package 20 of Figure 2) can be coated to include one or more walls Light body conversion material, wherein the linings absorb at least some of the LED light. The conversion material can emit light of different wavelengths such that the LED package emits a combination of light from the LED chip and light from the light-filling body. Can use many not The method of coating the (etc.) LED wafer with a scale, one suitable method of which is described in U.S. Patent Application Serial No. 11/656,759, the entire disclosure of which is incorporated herein by reference. Rwa Level Phosphor Coating Method and Devices Fabricated Utilizing Method. Alternatively, LEDs can be coated using other methods such as electrophoretic deposition (EpD), one suitable EPD method described in Tarsa et al.

Close Loop Electrophoretic Deposition of Semiconductor Devices, U.S. Patent Application Serial No. 11/473, No. 89. These types of LED chips have been used in different lamps, but have encountered some limitations based on the structure of the device. The phosphor material is on or very close to the LED epitaxial layer, and in some examples, the phosphor material comprises a conformal coating over the LED. In these configurations, the phosphor material is subjected to wafer heating due to the lack of a heat dissipation path (except via the wafer itself). Thus, the fill material can operate at temperatures above the LED wafer. This elevated operating temperature can cause degradation of the phosphor material, bonding material, and/or encapsulant material over time. This elevated operating temperature can also result in a decrease in the efficiency of the scale conversion&apos; and thus often causes a shift in the perceived color of the led light. Lamps have also been developed that utilize solid state light sources (such as led) with conversion materials that are separate from the led or located at the distal end of the led. Such a configuration is disclosed in U.S. Patent No. 6,350,041 to the name of "High Output Radial Dispersing Lamp Using a Solid State Light Source" by Tarsa et al. The lamp described in this patent can include a solid state light source that transmits light through a splitter to a diffuser having a plexiform. The disperser allows the light to be dispersed in a desired pattern and/or to change the color of the light by converting at least some of the light through the phosphor. In some embodiments, the separator separates the light source from the disperser a sufficient distance such that when the source carries the elevated current necessary for illumination in the room, heat from the source will not be transferred to the disperser. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, to the name of "Lighting Device" by Negley et al. However, the phosphor generates heat during the light conversion process, and this phosphor conversion heating can account for 20% to 30% of the total heat generated in the LED package. In applications where the disk is located in close proximity to the wafer (eg, the phosphor is conformally applied to the wafer), the high local density of the excitation photons emitted from the surface of the wafer can result in very high local heating and thus phosphorescence. The high peak temperature in the layer. In many remote scale applications, this photon density is spread over a larger fill area ‘substantially resulting in a reduced local temperature. However, in many remote phosphor configurations, the heat from the phosphor conversion heating generally has insufficient heat dissipation paths to dissipate the heat of conversion of the phosphor. In the absence of an effective heat dissipation path, the thermally isolated distal phosphor can be subjected to elevated temperatures to stay in temperature, and in some instances, such elevated operating temperatures may even be comparable to comparable conformal coatings. The temperature in the layer is higher. This situation can result in degradation, inefficient conversion, and color shifting, some of which are avoided by having a remote phosphor. SUMMARY OF THE INVENTION The present invention provides various embodiments of efficient, reliable, and cost effective lamps and bulbs. The various embodiments can be configured with a distal conversion material that helps reduce or eliminate thermal spread from the illuminator to the phosphor material. The lamps and bulbs may also include thermal management features to allow for efficient transfer of heat generated by the conversion away from the distal conversion material. This situation reduces or eliminates the negative effects that elevated temperatures may have on the efficiency and reliability of the conversion material. In various embodiments, the conversion material can comprise a phosphor carrier that can be formed in 2- or 3-dimensional form. The various embodiments can be configured to accommodate a recognized standard size profile and can include various configurations having a conversion material positioned at the distal end of the lamp source. These different embodiments may also be provided with features for promoting uniform color or intensity illumination of the lamp or bulb. An embodiment of a lamp according to the invention comprises a light source and a phosphor carrier located at the distal end of the light source. The phosphor support can comprise a thermally conductive material and a conversion material that is transparent to at least a portion of the light from the source and wherein the conversion material absorbs light from the source and emits light of a different wavelength. A heat sink structure is included wherein the phosphor carrier is thermally coupled to the heat sink structure. An embodiment of an LED-based lamp in accordance with the present invention includes an LED light source 'and a phosphor disposed at a distal end of the light source. Light emitted from the light source passes through the phosphor and at least some of the light is converted by the phosphor. The lamp further includes a thermally conductive path for thermally transferring the phosphor conversion away from the phosphor and dissipating the heat. A further embodiment of a lamp according to the invention comprises a heat sink structure and an LED based light source. A conversion material is disposed at the distal end of the source and configured to absorb light from the source and re-emit light of a different wavelength. A first thermally conductive path is included to conduct the converted heat away from the conversion material to the heat sink. These and other aspects and advantages of the invention will be apparent from the description and appended claims appended claims [Embodiment] The present invention is directed to a different embodiment of a lamp or bulb structure comprising a __ distal conversion material, the distal conversion material being configurable to cause less heat from the illuminator to heat the conversion material, Wherein the remote conversion material is also capable of operating without substantial heat accumulation (due to the light conversion process) in the conversion material. This situation reduces or eliminates the negative effects that elevated temperatures may have on the efficiency and availability of the conversion material. The present invention is also directed to a lamp comprising features that lightly convert the material such that the conversion material is not seen by the light, and that the light source from the distal conversion material and/or the light source can also be used. The light is dispersed or redistributed into the desired pattern of emission. Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that can be mounted to a standard size bulb housing such as the A19 size bulb housing 30 as shown in FIG. This situation makes the lamps particularly useful as alternatives to conventional incandescent lamps or bulbs and fluorescent lamps or bulbs, wherein the lamp according to the present invention enjoys reduced energy consumption and long life due to its solid state light source. Lamps in accordance with the present invention may also accommodate other types of standard size profiles including (but not limited to) A21 and A23. In various lamp embodiments, the conversion material may comprise one or more conversion materials (such as phosphors), which may include a thermal path 'for dissipating the thermal self-converting material during operation while maintaining the conversion material at the source The distal end is such that most or all of the heat from the source does not enter the conversion material and reduces the local density of the incident excitation photons of the phosphor layer. This situation allows the remote conversion material to operate at lower temperatures and reduced photon excitation densities than conversion materials lacking a thermally conductive path for dissipating heat transfer. By being located at the transport end and remaining relatively cold, the conversion material can operate more efficiently and does not suffer from heat-related color shifts. Operating at lower temperatures also reduces the heat-related degradation of the conversion material and increases the long-term reliability of the conversion material. Different distal configurations in accordance with the present invention may also allow the conversion material to operate at lower excitation densities, which may reduce the likelihood that the filler will be optically saturated due to incident light from the source. In some embodiments of the lamp according to the present invention, the conversion material may comprise a scale carrier comprising: one or more disposed on the carrier layer or material or integral with the carrier layer or material of 154502.doc 10 201144684 Phosphors. The carrier layer can comprise a plurality of different thermally conductive materials that are substantially transparent to light of a desired wavelength, such as light emitted by an illuminator of the lamp. In some embodiments, the phosphor support can be provided with means for dissipating the accumulation of switching heat, and in one embodiment, the phosphor carrier is in good thermal contact with the fin structure. The phosphor carrier can be mounted to the heat sink by thermal contact at the edges of the scale carrier. A light source can be mounted at a location in the lamp (such as in the heat sink structure or on the heat sink structure) such that there is a split between the light source and the phosphor material; that is, the phosphor carrier and its phosphor are located at the source Remote. The S-light source is also configured such that at least some of the light emitted by the source passes through the phosphor carrier and its phosphor, wherein at least some of the light from the source is converted by the phosphor. In some embodiments, the conversion can include photon down conversion, wherein the converted light has a wavelength that is longer than the wavelength of the source light. In other embodiments, the conversion can include an upconversion wherein the wavelength of the converted light is shorter than the wavelength of the source light. In either case, the conversion can cause heat to be generated in the phosphor due to the conversion process. The phosphor conversion heat can be "conducted by the thermally conductive carrier layer and conducted into the heat sink structure in the heat sink structure, and the phosphor conversion heat can be dissipated into the environment. In some embodiments, the carrier layer can collect (four) light layers. The heat generated causes the heat to spread in the lateral direction and conduct heat to the heat sink structure. The heat sink structure can be configured with different features such as 4 to help dissipate heat into the environment, and this thermal management configuration allows the remote phosphor layer to be maintained. A lower operating temperature, resulting in the benefits mentioned above. 154502.doc 201144684 As further described below, the lamp according to the present invention can be configured in many different ways. In some embodiments, the light source can comprise a solid state light source, such as Different types of LEDs, LED wafers or LED packages with different lens or optics configurations. In other embodiments, a single led wafer or package can be used, while in other embodiments, multiple types of arrays can be used and configured. LED wafer or package. By thermally or indirectly contacting the phosphor with the LED chip and having good heat dissipation, higher current can be used The level is used to drive the LED wafer without causing deleterious effects on the conversion efficiency of the phosphor and the long-term sin of the phosphor. This situation allows for the flexibility of over-exciting the LED chip so that a lower number of LEDs can be used To produce the desired luminous flux, which in turn reduces the cost and/or complexity of the lamp. Such led packages may also include LEDs encapsulating a material that can withstand elevated luminous flux, or may contain an intact capsule. In some embodiments, the light source may comprise one or more blue light emitting LEDs, and the phosphor in the phosphor carrier may comprise one or more materials that absorb one of the blue portions and One or more different wavelengths of light are emitted such that the lamp emits a combination of white light from the blue LED and the conversion material. The conversion material can absorb the blue LED light and emit light of different colors 'including but not limited to yellow and green. The light source can also include different LEDs and conversion materials that emit light of different colors such that the light emits light having desired characteristics such as color temperature and color rendering. For some applications, it may be necessary (for full Specific requirements for full color point/color temperature and/or color rendering) such that a portion of the light emitted by the source and/or phosphor layer contains substantially red light. There are both red and blue LED chips. 154502.doc • 12· 201144684 The conventional lamp can withstand color instability at different operating temperatures and dimming. This situation can be attributed to the difference between red and blue LEDs at different temperatures and operating power (current/voltage). Behavior, and operational characteristics over time. This effect can be slightly mitigated by implementing an active control system that may add cost and complexity to the entire lamp. Different embodiments in accordance with the present invention may be A source having the same type of illuminator is combined with a remote phosphor that can include multiple types or layers that remain relatively cold via the heat dissipating configuration disclosed herein and / or phosphor of the area. The distal phosphor carrier absorbs light from the illuminator and can re-emit light of different colors (including red light) while still experiencing the reduced efficiency and reliability of the operating temperature of the phosphor. The separation of the phosphor element from the LED provides the added advantage of easier and more consistent color sorting. This situation can be achieved in several ways. LEDs from various sub-levels (e.g., blue LEDs from various sorting levels) can be assembled in the future to achieve an excitation source that can be used for substantially wavelengths in different lamps. These LEDs can then be combined with a phosphor carrier having substantially the same conversion characteristics to provide a lamp that emits light within the desired sorting level. In addition, the multi-disc optical carrier can be fabricated and the material carriers can be sorted according to the different conversion characteristics of the phosphor carrier. The non-photobody carrier can be combined with a light emitting different characteristics to provide a light that emits light within the target color sorting level. Structures and materials in accordance with various embodiments of the present invention. In some embodiments, the central heat sheet structure can include different heat sink structures that can include a thermally conductive material having heat 154502.doc • 13· 201144684 dissipative features such as &apos;fins or heat pipes. In still other embodiments, the fin structure may comprise different types of lamp loops that may be worn to different features such as individual fins. Different disc carriers in accordance with the present invention may be configured in different ways, such as a phosphor layer disposed on different surfaces of the carrier layer, a phosphor layer patterned on the surface(s) of the carrier layer or evenly Or a phosphor region that is distributed non-uniformly across or through the carrier layer. The phosphor support may also include other materials such as scattering particles&apos; while in other embodiments, the phosphor support may comprise more than one phosphor material. The lamp according to the present invention can also provide improved emission efficiency by surrounding the light source with a reflective surface. This situation can result in enhanced photon recycling by reflecting a large amount of light re-emitted from the conversion material back toward the source. To further enhance efficiency and provide a desired illumination profile, the phosphor layer, carrier layer or diffuser surface can be smooth or scattering. In some embodiments, the inner surface of the carrier layer and the diffuser may be optically smooth to promote total internal reflection behavior, and the internal reflection behavior of the mystery reduces the light directed backward from the phosphor layer (downconverted light) Or the amount of light scattered). Accordingly, in some cases, one or more of the outer surfaces of the carrier layer or phosphor layer may be roughened or otherwise modified to promote light emission from the otherwise surface. Alternatively, a combination of one or more roughened outer surfaces and a smooth inner surface may be used to promote light emission through the carrier and the phosphor layer in a preferred direction. The properties of the carrier layer and the phosphor layer such as surface roughness, reflectivity, and refractive index can generally be used to direct or direct light emitted or transported by the carrier/phosphor layer through the carrier/phosphor layer to a preferred direction (eg, Improved beam intensity profile and color uniformity by reducing the amount of light that can be absorbed by the led wafer of the lamp, the associated substrate 154502.doc -14·201144684 or other non-ideal reflective surfaces within the interior of the lamp Sexuality provides improved efficiency. • The phosphor layer and/or carrier layer may comprise substantially two-dimensional or three-dimensional geometric shapes. Two-dimensional geometries such as planar or disc-shaped profiles can facilitate the fabrication and coating of phosphorescent layers and reduce manufacturing costs. Three-dimensional (e.g., substantially spherical, conical, tubular, rectangular, etc. shapes) can promote the distribution of light to a particular direction, for example, to achieve a particular resulting beam intensity profile or uniformity depending on the viewing angle. The invention is described herein with reference to a particular embodiment, but it is understood that the invention may be embodied in many different forms and should not be construed as being limited to the embodiments illustrated herein. In particular, the invention is described below with respect to different configurations of particular lamps having LED or LED chips or LED packages, but it should be understood that the invention is applicable to many other lamps having many different array configurations. An example of a different lamp that is configured in a different manner in accordance with the present invention is described below, and U.S. Provisional Patent Application Serial No. 61/435,759, filed on Jan. 24, 2011. The application is incorporated herein by reference. The embodiments below are described with reference to one or more LEDs, but it should be understood that this scenario is intended to encompass LED wafers and LED packages. The components may have different shapes and sizes than those of their shape and size, and may include a different number of LEDs. It should also be understood that the embodiments described below may use coplanar light sources, but it should be understood that non-coplanar light sources may also be used. Reference is made herein to a conversion material, a phosphor layer, and a phosphor carrier. 154502.doc -15- 201144684 discloses that all such components are located at the "distal end" of the source or LED. The distal end of the context refers to spacing and/or direct thermal contact. It is also understood that when an element such as a layer, a layer or a substrate is referred to as being "on" another element, the element can be directly on the other element or the intervening element can also be present. In addition, relative terms such as "inside", "outside", "upper", "above", "lower", "below" and "below" may be used herein to describe one or another Relationship. It should be understood that these terms are intended to encompass other different orientations of the device in the <RTI ID=0.0> Although the terms "first", "second" and the like may be used herein to describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or sections should not Limited by these terms. The terms are used to distinguish one element, component, region, layer, Therefore, a first element, component, region, layer or layer discussed below may be referred to as a second element, component, region, layer, or section, without departing from the teachings of the invention. Embodiments of the invention are described herein with reference to the cross-section illustrations, which are illustrated in the accompanying drawings. Thus, the actual thickness of the layers can be varied and is expected to differ from the illustrated shapes as a result of, for example, manufacturing techniques and/or tolerances. The embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described herein, but should include variations in the shapes resulting from the manufacture of (9). Zones that are described or described as square or rectangular will typically have rounded or curved features that result from normal manufacturing tolerances. Accordingly, the regions illustrated in the figures are illustrative in nature and are not intended to limit the scope of the invention. 4 shows an embodiment of a lamp 5 according to the present invention. The lamp 5A includes a heat sink structure 52 having an optical cavity 54 having a platform 56 for holding the light source 58. While this embodiment and some of the following examples are described with reference to an optical cavity, it should be understood that many other embodiments without an optical cavity can be provided. Such situations may include, but are not limited to, the light source being located on a planar surface or on a base. Light source 58 can include a number of different illuminators, and the illustrated embodiment includes LEDs that can include many different commercially available LED wafers or LED packages including, but not limited to, Cree, available from Durham, North Carolina. Lnc. purchased their LED chips or ΕΙ) package. Light source 58 can be mounted to platform 56 using a number of different known mounting methods and materials, with light from source 58 being emitted from the top opening of cavity 54. In some embodiments, the light source 58 can be mounted directly to the platform 56, while in other embodiments, the light source can be included on a sub-substrate or printed circuit board (ΚΒ), and then the sub-substrate or printed circuit board ( pCB) is installed to platform 56. Platform 56 and heat sink, structure 52 may include conductive paths for applying electrical signals to light source 58, some of which are conductive traces or wires. All or a portion of the platform 56 can also be made of a thermally conductive material and the thermally conductive material can be thermally coupled to the heat sink structure 52 or the thermally conductive material can be integrated with the heat sink structure 52. In some embodiments, the light of the lamps can be raised in the form of an array of coplanar illuminators that are mounted on a flat or planar surface. The /, "surface light source" reduces the complexity of the illuminator configuration, making the manufacture of illuminator 154502.doc 17 201144684 easier and less expensive. However, coplanar light sources tend to emit primarily in the x-direction (such as &apos;in accordance with the Lainbertian emission pattern). In various embodiments, it may be desirable to emit a light pattern that simulates a light pattern of a conventional incandescent light bulb that can provide nearly uniform illumination intensity and color uniformity at different emission angles. Different embodiments of the present invention are configured with a diffuser as described below that achieves this uniform or substantially isotropic lamp emission pattern when a planar light source is used to emit an emission pattern such as Lambertian. The fin structure 52 can comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive materials comprising different metals, such as copper or metal, or metal alloys can be used. In some embodiments, the fins may comprise high purity aluminum, which may have a thermal conductivity of about 21 () w/m at room temperature. In other embodiments, the heat sink, the structure may comprise die cast in ru, and the die cast has a conductivity of about 200 W/m-k. The fin structure 52 may also include other heat dissipating features (e.g., heat sink fins 60) that increase the surface area of the fins to promote more efficient dissipation of heat into the environment. In some embodiments, the heat sink fins 60 may be formed of a higher heat than the remainder of the heat sink. In the embodiment shown, the fins are substantially watery. It is understood that in other embodiments, the Korean films may be oriented vertically or at an angle. In still other embodiments, the heat sink can be: an active cooling element (such as a fan) to reduce the convective thermal resistance within the lamp. The heat dissipation of the dispersion and saliva I::&apos; from the phosphor carrier is achieved by a combination of convective heat management and &lt;RTIgt; Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of light 154502.doc 201144684. In some embodiments, the surfaces may be coated with a material having a reflectance of about 75% or more for visible wavelength light ("light =") emitted by light source 58 and/or wavelength converting material, and In other embodiments, the material may have a reflectivity of about 85% or more for the light. In still other embodiments, the material can have about 95 for the light. /〇 or more than 95% reflectivity. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type used in conventional electrical sockets. For example, the heat sink structure can include features for mounting to a standard Edison slot, which can include a threaded portion that can be tightened into the threaded seat. In other embodiments, the heat sink structure may comprise a standard plug and the electrical socket may be a standard socket 'or the heat sink structure may comprise a base unit, or the heat sink structure may be a clip and the electrical socket may receive and hold the The socket of the clip (for example, as used in many fluorescent lamps). These are only a few of the options for the heat sink structure and the socket, and other configurations that safely deliver electrical power from the socket to the lamp 50 can also be used. A lamp in accordance with the present invention can include a power conversion unit. The power conversion unit can include a driver to allow the light bulb to be powered by the ac line voltage/current and to provide light source dimming capability. In some embodiments, the =source supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp and in some embodiments, the LED driver can comprise a volume y of less than 25 cubic centimeters. In other embodiments, the LED driver can comprise a volume of about 2 cubic centimeters. In some embodiments, the power supply may be non-dimmable, but 154502.doc • 19- 201144684 This lower s should understand that the power supply used may have different topologies or geometries, and Can be dimmable. A phosphor carrier 62 is included over the top opening of the cavity 54, and in the illustrated embodiment, the phosphor carrier 62 covers the entire opening. The cavity opening is shown as being circular and the phosphor carrier 62 is a disk, although it should be understood that the cavity opening and the phosphor carrier can be of many different shapes and sizes. It should also be understood that the phosphor carrier 62 may not cover the entire cavity opening. The phosphor support according to the present invention can be characterized as comprising a conversion material and a thermally conductive light transmissive material. The light transmissive material may be transparent to light emitted from source 58, and the conversion material should be of a type that absorbs light from the wavelength of the source and re-emits light of different wavelengths. In the illustrated embodiment, the thermally conductive light transmissive material comprises a carrier layer 64&apos; and the conversion material comprises a phosphor layer 66 on the carrier layer 64. As described further below, various embodiments may include many different configurations of the carrier layer and the phosphor layer. § When light from source 58 is absorbed by the dish in scale layer 66, the light is re-emitted in an isotropic direction, with about 5% of the light being emitted forward and 50% being emitted backwards. In the cavity 54. In previous LEDs with a conformal phosphor layer, a significant portion of the back-emitting light can be directed back into the led and the likelihood of light escaping is limited by the extraction efficiency of the LED structure. For some LEDs, the extraction efficiency can be about 70%, so a certain percentage of the light that is directed back to the led from the conversion material can be lost. In a lamp having a remote phosphor configuration in accordance with the present invention, the LED is located on a platform 56 at the bottom of the cavity 54 and a higher percentage of the phosphor light emitted rearward strikes the surface of the cavity rather than the LED. . The surface coating with the reflective layer 53 increases the percentage of light that is reflected back to 154502.doc • 20·201144684 to the phosphor layer 66 (where the light can be emitted from the phosphor at the phosphor layer 66). These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures including, but not limited to, reflective metal or multilayer reflective structures such as distributed Bragg reflectors. A reflective layer can also be included in embodiments that do not have an optical cavity. In embodiments where the LEDs are mounted on a planar surface or on a pedestal, a reflective layer can also be included around the LED to increase efficiency in much the same manner as a reflective layer in an embodiment having an optical cavity. The carrier layer 64 may be made of many different materials having a thermal conductivity of 〇·5 w/m_k or 〇5 w/m_k or more, such as quartz, strontium carbide (Sic) (thermal conductivity 〜120 W/mk), glass. (The thermal conductivity is m.4 w/mk) or sapphire (thermal conductivity is ~40 W/mk). The phosphor support may also have different thicknesses depending on the material used, with a suitable thickness ranging from 〇1(7)(7) to (7) mm or more than 10 mm. It should be understood that other thicknesses of beta material may also be used depending on the nature of the material used for the carrier layer to be thick enough to provide sufficient lateral heat dissipation for a particular operating condition. In general, the higher the thermal conductivity of the material, the thinner the material may be, while still providing the necessary heat dissipation. Different factors may affect which carrier layer material is used. 'Different factors include, but are not limited to, cost and transparency to source light. Some materials may also be more suitable for larger diameters such as glass or quartz. Such materials can provide reduced manufacturing costs by forming a phosphor layer on a larger diameter carrier layer and then singulating the carrier layer into smaller carrier layers. A number of different discs can be used in the phosphor layer 66, with the invention being particularly suitable for emitting white light lamps. As described above, in some embodiments, light 154502.doc - 21 · 201144684 source 58 can be an LED-based light source and can emit light of a blue wavelength spectrum. The fill layer absorbs some of the blue light and re-emits the yellow light. This situation allows the lamp to emit a combination of blue and yellow light. In some embodiments, the blue LED light can be converted by a yellow conversion material using a commercially available YAG:Ce phosphor, but used by a (Gd'YWAUGahOaCe system (such as Y3Al5〇12:Ce(YAG)). Converted particles made of wall-light bodies may achieve a wide range of broad yellow spectral emission. Other yellow illuminators that can be used to produce white light when used with blue-emitting lEd-based illuminators include (but are not limited to):

Tb3.xRExOl2: Ce(TAG); RE=Y, Gd, La, Lu; or

Sr2_x-yBaxCaySi〇4: Eu. The phosphor layer may also be provided with more than one phosphor, which is mixed in the disc layer 66 or as a separate phosphor layer/region vertically or laterally on the carrier layer 64. In some embodiments, the two Each of the phosphors can absorb LED light and can re-emit light of different colors. In these embodiments, the colors from the two phosphor layers can be combined for achieving a higher CRI white (warm white) with a different white hue. This situation may include light from the yellow phosphor above that may be combined with light from a red phosphor. Different red phosphors can be used, including:

SrxCaj.xSrEu, Y; Y=halide;

CaSiAlN3:Eu; or Sr2-yCaySi〇4:Eu. Other scales can be used to produce a shirt color luminescence by converting substantially all of the light into a particular color center. For example, the following phosphors can be used to produce green 154502.doc •22· 201144684 Light:

SrGa2S4: Eu;

Sr2-yBaySi〇4:Eu; or SrSi2〇2N2:Eu 下文 Listed below - some additional scales suitable for use as the conversion particles of the disc layer 66, but other phosphors may be used. Each phosphor exhibits an excitation in the blue and/or UV luminescence spectrum 'provides a desired peak luminescence with efficient light conversion' and an acceptable Stokes shift: yellow/green (Sr ,Ca,Ba)(Al,Ga)2S4:Eu2+

Ba2(Mg,Zn)Si2〇7:Eu2+

Gd〇.46Sr〇.3iAli.23〇xFl-38:Eu 0.06 (Bai.x.ySrxCay)Si〇4-Eu

Ba2Si04: Eu2+ red

Lu2〇3 :Eu3 + (Sr2.xLax)(Ce,.xEux)〇4

Sr2Csi_xEiix〇4

Sr2.xEuxCe〇4

SrTi03: Pr3+, Ga3+

CaAlSiN3: Eu2+

Sr2Si5N8:Eu2+ can use different sizes of filler particles 'including (but not limited to) in the range of 10奈-23·154502.doc 201144684 meters (nm) to 30 micron (μΐη) or 30 micron (μιη) Particles inside. In terms of scattering and mixing colors, smaller particles are usually better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer 66 in a binder, and the phosphor may also have a different concentration or loading of phosphor material in the binder. Typical concentrations range from 30% to 70% by weight. In one embodiment, the phosphor concentration is about 65% by weight, and is preferably uniformly dispersed throughout the distal phosphor. The phosphor layer 66 can also have different regions of different conversion materials and conversion materials of different concentrations. Different materials can be used for the binder 'where the material is preferably strong after curing and transparent in the visible wavelength spectrum. Suitable materials include polyox, oxygen, glass, inorganic glass, dielectric, BCB, polyamide, polymers and mixtures thereof. The preferred material is polyfluorene (this is due to polyoxyl High transparency and reliability in high power LEDs). Suitable polyphenylene oxides based on phenyl and methyl are commercially available from Dow® Chemical. Many different curing methods can be used to cure the adhesive depending on various factors such as the type of adhesive used. Different curing methods include, but are not limited to, thermal curing, ultraviolet (UV) curing, infrared (IR) curing, or air curing. Different processes can be used to coat the disc layer 66. Other processes include, but are not limited to, spray coating, spin coating, sputtering, printing, powder coating, electrophoretic deposition (EPD), electrostatic deposition, as mentioned above. Phosphor layer 66 can be applied along with the binder material, although it should be understood that no binder is required. In addition, in its embodiment, the light-filling layer 66 can be separately fabricated and then the scale layer 66 can be mounted to the carrier layer 64. In one embodiment, the phosphor/binder mixture can be sprayed or dispersed over the carrier layer 64, followed by curing of the binder to form the phosphor layer 66. In some of these embodiments, the phosphor-adhesive mixture can be sprayed or dispersed onto the heated carrier layer 64 such that when the filler binder mixture contacts the carrier layer 64, the carrier The heat of layer 64 is dispersed in the binder and cures the binder. These processes may also include a solvent in the phosphor-adhesive mixture which liquefies the mixture and lowers the viscosity of the mixture to make the mixture more suitable for spraying. Many different solvents can be used including, but not limited to, toluene, benzene, zylene or OS-20 available from Dow Corning®, and different concentrations of solvent can be used. When the solvent-phosphor-adhesive mixture is sprayed or dispersed on the heated carrier layer 64, the heat from the carrier layer 64 evaporates the solvent, wherein the temperature of the carrier layer affects the rapid extent of solvent evaporation. The heat from the carrier layer 64 also cures the binder in the mixture leaving a fixed phosphor layer on the carrier layer. Carrier layer 64 can be heated to a number of different temperatures depending on the materials used and the desired solvent evaporation and adhesive cure rate. Suitable temperatures range from 90 ° C to 15 ° t ' but it should be understood that other temperatures may also be used. Various deposition methods and systems are described in U.S. Patent Application Publication No. 2010/0155763, entitled "Systems and Methods for Application of Optical Materials to Optical Elements," by D. Nofri et al. And to cree, jnc. and the entire contents of this disclosure are incorporated herein. 154502.doc -25- 201144684 The scale layer 66 can have a number of different thicknesses depending on the concentration of the disc material and the desired amount of light to be converted by the scale layer 66. The phosphor layer according to the present invention can be applied at a concentration level higher than 30% (phosphor load). Other embodiments may have a concentration level above 50%, while in still other embodiments, the concentration level may be above 60%. In some embodiments, the phosphor layer can have a thickness in the range of 10 microns to 100 microns, while in other embodiments the phosphor layer can have a thickness in the range of 40 microns to 50 microns. The methods described above can be used to coat multiple layers of the same or different phosphor materials, and different moth materials can be applied in different regions/regions of the carrier layer using known masking and/or printing processes. The method described above provides some thickness control for the scale layer 66, but for even greater thickness control 'a known method can be used to grind the disc layer to reduce the thickness of the layer 66 or level the entire layer The thickness above. This abrasive feature provides the added advantage of being able to produce a lamp that emits within a single sorting level on the CIE chromaticity diagram. Sorting is generally light known in the art and intended to ensure that the LEDs or lamps provided to the end customer emit light in an acceptable range of colors. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to as sorting in the art) by color or brightness. Each sorting level typically contains a Led or a light from a group of colors and brightness, and is typically identified by a sorting level code. White LEDs or lamps can be classified by chromaticity (color) and luminous flux (brightness). Thickness control of the phosphor layer provides greater control in producing a lamp that emits light within the target sorting level by controlling the amount of source light converted by the phosphor layer. A plurality of phosphor carriers 62 having phosphor layers 66 of the same thickness can be provided. By using a light source 58 having the same luminescent properties of 154502.doc -26- 201144684, a lamp having almost a color point can be fabricated, which in some examples can belong to a single color in the selected % level. . In some embodiments, the illumination of the lamp is within a standard deviation from the point on the Cie diagram, and in some embodiments, the standard deviation comprises less than a 10-step 10-Made ellipse (McAdams ellipse). In some embodiments, the illumination of the lamp belongs to a 4-step MacAdam ellipse centered at CIExy (0.313, 0.323). Phosphor support 62 can be mounted and bonded to the opening in cavity 54 using a different known method or material, such as a thermally conductive bonding material or thermal grease. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, the phosphor carrier can be mounted over the opening π using a thermally conductive device such as a clamping mechanism, a screw or a thermal adhesive to hold the scale carrier 62 tightly to the heat sink structure. To maximize thermal conductivity. In the embodiment, a thermal grease layer having a thickness of about 1 〇〇 μηι and (4) a thermal conductivity of .5 w/m_k is used. This configuration provides an efficient thermal path for dissipating heat from the scale layer 66. During operation of the lamp 50, the phosphor conversion heat concentrates the light (4) in the center of the light layer 66 such as the concentrated (four) light, and most of the coffee is in the scale. The spheroidal carrier 62 is struck and passes through the optical carrier Μ. The thermally conductive nature of the carrier layer 64 causes this heat to be exhibited in the lateral ± direction _ light body (4) edge as shown by the first heat flow 70. Heat is passed through the thermal grease at the edges: and into the fin structure 52, as shown by the second heat flow 72, in which the heat can be efficiently dissipated to the environment as discussed above. In the lamp 5G, the platform 56 is thermally coupled to the heat sink structure 52. 154502.doc -27- 201144684 is connected or coupled. This coupling configuration results in a partial use of the jeweler W nine-body carrier 62 and the light source 58 at least P Knife - use the heat of the heat-conducting path 56 for heat dissipation (such as the first heat flow through the platform field from the first = 敎 $ source 58) or # ή β| s* ^ ^ month cloth to the heat sink Structure 52. The phosphorus precursor body 62 flows into the heat sink. The heat from the L 铒W肀 can also flow into the flat 。. As further described below, in the Fuxian-In the Eighth embodiment, the phosphor carrier 62 and the precursor 58 may have a thermally conductive path for soaping, wherein the four early paths are referred to as "decoupling." It should be understood that the phosphor carrier can be configured in many different ways than the embodiment shown in FIG. Some of these different embodiments show: Figures 5 through n, but it should be understood that in other embodiments, there may be a configuration of the evening. Figure 5 shows an alternative embodiment of a light-transmissive carrier 8 according to the present invention. The filler carrier 80 comprises a carrier layer 82 and a disc layer 84. The carrier layer 82 and the phosphor layer 84 can be made of the same materials as described above. It can be formed using the same process. In this embodiment, the phosphor layer 84 is on the bottom surface of the carrier layer 82 such that light from the LED source first passes through the phosphor layer 84. The converted light and the LED light leaking through the phosphor layer 84 then pass through the carrier layer 82. In this configuration, the carrier layer 82 should be transparent to light from both the phosphor layer 84 and the phosphor source. In this embodiment, the phosphor layer 84 need not cover the entire bottom surface of the carrier layer 82. Rather, the edges of the carrier layer 82 may not be covered by the phosphor layer 84 to allow good thermal contact with the heat sink. However, in some embodiments the phosphor layer 84 can cover the entire bottom surface of the carrier layer 82. Figure 6 shows a further embodiment of a phosphor support according to the invention 'phosphor carrier 100 does not comprise a separate phosphor layer and a carrier layer' but comprises a carrier layer 102 in which the phosphors 1〇4 are dispersed throughout the carrier In layer 102. 154502.doc -28 - 201144684 As in the previous embodiment 'When the phosphor generates heat during the conversion, heat is dispersed in the transverse direction over the entire carrier layer 102, in which heat can be dissipated in the heat sink . In this embodiment, the phosphors i 〇 4 are dispersed in the carrier layer at a nearly uniform concentration'. However, it should be understood that in other embodiments, the spheroids 104 may have different concentrations in different regions of the carrier layer 102. It should also be understood that more than one phosphor may be included in the carrier layer that is uniformly dispersed or dispersed in zones of different concentrations. 7 shows another embodiment of a phosphor support 12 according to the present invention. Phosphor support 120 also includes a carrier layer 122 and a phosphor layer 124. The carrier layer 122 and the phosphor layer 124 are similar to those described above and illustrated in FIG. Show the same components. In this embodiment, the scattering particle layer 126 can be included on the carrier layer 122 and displayed on the phosphor layer 24". It should be understood that the scattering particle layer 126 can be located on the carrier layer or at a number of different locations in the carrier layer. The scattering particle layer is included to disperse light as it is emitted from the phosphor carrier layer 12 to impart a pattern of light emission. In this embodiment the 'scattering particles are configured to disperse the light in a substantially uniform pattern. The "scattering particle layer" may be deposited by the method described above for the deposition of the reference light layer, and the scattering particle layer may comprise densely packed particles. The scattering particles may also be included in the binder material, which may be the same as those described above with reference to the adhesives used in the layer-like adhesives. (4) The particle layer may depend on the coating and material used. There are different concentrations of scattering particles. Suitable scattering particle concentration ranges: to 〇, 2%, but it should be understood that the concentration can be higher or lower. In this embodiment, the concentration can be as low as 〇 〇. It should also be understood that the scattering particle layer 154502.doc • 29· 201144684 126 may have different concentrations of scattering particles in different regions. For some scattered particles, there may be an increase in loss due to absorption at a higher concentration. Thus, the concentration of the scattering particles can be selected to maintain an acceptable loss number while dispersing the light to provide the desired emission pattern. The scattering particles may comprise many different materials, including but not limited to: tannin; oxidized (ZnO); oxidized (Y2〇3); titanium dioxide (Ti02); barium sulfate (BaS04); aluminum oxide (A1203); Molten cerium oxide (Si〇2); smoky cerium oxide (Si〇2); aluminum nitride; glass microbeads; cerium oxide (Zr02); lanthanum carbide (SiC); oxidized giant (Ta05);矽(Si3N4); yttrium oxide (Nb205); boron nitride (BN); or spheroidal particles (eg, YAG:Ce, BOSE) may use more than one scattering of various combinations of materials or combinations of different forms of the same material The material is used to achieve a specific scattering effect. It should be understood that in other embodiments 154502.doc • 30· 201144684 the 'scattering particles' may be included in the carrier layer 122, the phosphor layer ι24 or the carrier layer 122 and the phosphor layer 124. In another embodiment of the phosphor carrier 140 not in accordance with the present invention, the phosphor carrier 140 has a carrier layer 142 and a phosphor 144, which is similar to that described above and shown in FIG. In this embodiment, the scattering particles 146 are dispersed in the carrier layer 142. To disperse both the LED light and the phosphor light through the carrier layer 142. The same scattering particles as the scattering particles described above can be used, and in various embodiments, the scattering can be included at different concentrations. Other embodiments may include regions of different concentrations to scatter light passing through the carrier layer into the desired emission pattern. Figure 9 shows another embodiment of a phosphor carrier 16 according to the present invention, the phosphor carrier 160 comprising The bulk layer 162 and the phosphor layer 164 on the bottom surface of the carrier layer 162 are both configured in a manner similar to the same elements described above and illustrated in Figure 5. In this embodiment The scattering particle layer 166 is included on the top surface of the carrier layer 162 and may have the same material deposited in the same manner as the scattering particle layer 126 of Figure 7. In some embodiments 'scattering in the scattering particle layer 166 The particles can be configured to scatter both light from the phosphor layer 164 and lEd light that leaks through the phosphor layer 164. In still other embodiments, the 'scattering particles can be configured to only make one of the spotlights It should be understood that 'scattering particles may also be dispersed in carrier layer 162 or phosphor layer 164 or both carrier layer 162 and phosphor layer 164. Other embodiments of the phosphor carrier may also include features to enhance light extraction from the lamp. A certain amount of light can strike the carrier layer outside the escape angle or fill the surface of the layer so that the light will be reflected back toward the cavity of the heat sink structure. Some of this light can be Absorbs' while other parts of the light can undergo total internal reflection (TIR). Figure 10 shows an embodiment of a phosphor carrier 180 having features configured to reduce such losses. Similar to the above embodiment, the phosphor carrier comprises a carrier layer 182 and a phosphor layer 184. In this embodiment, the surface of the phosphor layer is roughened or shaped to provide a varying surface angle. This situation increases the likelihood that light will strike the surface within the escape angle of the light such that the light can contribute to useful emissions. The surface can be shaped using known roughening or etching processes. Phosphor carrier layer 182 may also be provided with scattering particles at different locations to disperse light, as described above. Forming or roughing may be included on different surfaces of the phosphor carrier according to the present invention. Figure 11 shows another embodiment of a light-filling carrier 2 according to the present invention. The phosphor carrier 200 comprises a carrier layer 2〇2 and a phosphor layer 2〇4. In this embodiment, a formed/roughened layer is provided on the top surface of the carrier layer 2〇2 while the light-filling layer k is applied to the rough-chained surface. The shaped/roughened surface provides a varying surface to increase the likelihood of light escaping through the phosphor carrier 2 . The roughened surface may be included on other surfaces of the carrier layer 2〇2, and the phosphor carrier 200 may also be provided with scattering particles as described above. It is to be further understood that the roughened surface can be included on any of the surfaces of the different phosphor support layer embodiments described above. Lines in accordance with the present invention may include many different features in addition to the features described above. Referring again to Figure 4, in some embodiments, the cavity 5 can be filled with a transparent thermally conductive material to further enhance the heat dissipation of the lamp. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. 154502.doc •32· 201144684 , ... the original heat will still conduct through the platform 56 'but can also pass through the cavity material to the fin structure 52 . This situation will allow for a lower operating temperature of light source 58, but +; phosphor carrier 62 poses a risk of elevated operating temperatures. This configuration can be used in different embodiments, but is particularly suitable for lamps having a higher degree of light source operation (compared to the operating temperature of the phosphor carrier). This configuration allows for more efficient heat dissipation from the source in applications where additional heating of the secret carrier layer can be desired. As discussed above, different lamp embodiments in accordance with the present invention can be configured with many different types of light sources. Figure 12 shows another embodiment of a lamp 21 , similar to the lamp 5 描述 described above and shown in Figure 4 . Lamp 21A includes a fin structure 212 having a cavity 214 that is configured with a platform 216 to hold light source 218. The spheroidal carrier 220 can be included over the opening of the cavity 214 and at least partially cover the opening. In this embodiment 'light source 2丨8 may comprise a plurality of LEDs' disposed in a separate LED package or in an array in a single multi-LED package. In each embodiment, the illuminators may be different The series and parallel configurations are coupled. In one embodiment, eight LEDs can be used that are connected in series to the circuit board by two wires. The wires can then be connected to the power supply unit described above. In other embodiments, more than eight or fewer LEDs can be used, and as mentioned above, LEDs available from Cree, Inc. can be used, including eight XLamp® XP-E LEDs or four XLamps. ® XP-G LED. Different single-string LED circuits are described in the following U.S. patent applications: van de

Ven et al. titled "Color Control of Single String Light

Emitting Devices Having Single String Color Control" 154502.doc • 33· 201144684 US Patent Application No. 12/566,195, and van de Ven et al. entitled "Solid State Lighting Apparatus with Compensation Bypass Circuits and Methods of Operation Thereof" U.S. Patent Application Serial No. 12/704,730, the disclosure of which is incorporated herein by reference. For embodiments that include a separate LED package, each of the LEDs can include its own LED primary optics or lens 222. In embodiments having a single multi-LED package, a single primary optic or lens 224 can cover all of the LEDs. It should be understood that the LEDs may not have lenses, and in an array embodiment, each of the LEDs may have its own lens. Similarly, an unpackaged LED can be provided on a "on-wafer chip" or "on-wafer" configuration. It should also be understood that each LED can be provided with secondary optics that are configured in different ways. Similar to the lamp 5, the heat sink structure and platform can be configured with the necessary electrical traces or wires to provide electrical signals to the light source 218. The light source is shared with the scale carrier. In some embodiments, if in the lamps 50 and 21A described above, the heat path for heat dissipation (referred to as thermal coupling) is not thermally coupled to the thermal path of the phosphor carrier to the source (referred to as Thermal Decoupling The heat dissipation of the bowl carrier can be enhanced. Figure 13 shows another embodiment of the lamp 240 according to the present invention. The lamp 24A also includes a heat sink structure 242 having a cavity 244. The cavity 244 has a platform (10) for mounting the light source state. 嶙 No forging m stalks and to ' _, one - &quot; work 厶 τ η, Between Τ 曰疋 曰疋 曰疋 之 之 之 之 之 之 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 曰疋 磷 磷 磷 磷 磷 磷 磷 磷250. In this case, you can do this. In this example, the heat sink words are partially covered with 'm' so that 154502.doc, 34·201144684 and platform 246 from the light source are substantially thermally isolated from each other. A separate heat dissipation path (although convection may cause some thermal coupling between the two paths from the heat of the light source 248 to conduct along the fourth heat flow 252 and through the platform 246 where heat may be dissipated into the environment Or another fin structure (not shown), such as a connector for the lamp. From phosphorus The heat of the light body carrier 250 is conducted along the fifth heat flow 254 and into the heat sink structure 242 where heat is dissipated to the environment. Thermal separation between the heat sink structure 242 and the platform 246 can be achieved by Provided by the following means: by physical separation of the two, or by providing a thermally resistive material between the two, such as via a known thermal insulator (eg, dielectric). A plot MO of the peak operating temperature of the conformal phosphor material compared to the operating temperature of the distal phosphor support of the carrier layer, the carrier layers having different thermal conductivities and configured such that heat can be passed as described above The thermal path dissipation 9 graph 260 further compares the thermal performance of these different configurations of the thermally coupled and decoupled heat sink. The first solid line 262 exhibits an illuminator that does not have a thermally decoupled heat sink as described above. The junction temperature and the first solid line 264 show the illuminance of the illuminator for the thermally coupled heat sink. The operating temperature of the coupling configuration is slightly lower than the operation of the decoupling configuration by 2 degrees. The first dashed line 266 shows that there is insurance Shaped phosphor coating The LED and: the peak phosphor temperature of the decoupled heat sink lamp. The second dashed line 268 exhibits the peak phosphor temperature of the same lamp with the thermally coupled heat sink. In the protection: coating configuration 'phosphor At substantially the peak squama temperature, the lamp is operated at a peak phosphor temperature below the peak temperature of the solution. 154502.doc -35- 201144684 The triple solid line 270 shows the peak phosphor temperature of the remote phosphor carrier disposed on the thermally coupled heat sink, wherein the temperature is for a carrier having a different thermal conductivity in the range of 0.2 w/mK to 100 w/mK or more. Layer measurement. The fourth solid line 272 shows the same distal phosphor support and the same range of thermal conductivity, with the phosphor carrier on the thermally decoupled heat sink. A remote phosphor carrier having a carrier layer with a thermal conductivity greater than 1.05 W/mk and disposed on a thermally decoupled heat sink can operate at a lower phosphor temperature' thus achieving a higher than conformal phosphor coated LED Conversion efficiency. This situation allows the use of materials such as conventional glass, fused silica, sapphire and carbon carbide. Thermally coupled heat sinks can be used, but thermally coupled heat sinks require a slightly higher thermal conductivity and operate at temperatures higher than the thermally coupled configuration. Figure 15 shows another embodiment of a lamp 27 according to the present invention. The lamp 27 is configured in a different manner to provide the desired thermal characteristics of the distal phosphor and phosphor carrier. Lamp 270 includes a light source 272 mounted to the top surface of fin structure 274. The heat sink structure can be made of a thermally conductive material as described above and includes a heat dissipating structure such as fins 275. During operation, heat is diffused from the source 272 into the fin structure 274 where it is thermally dissipated into the fins 275 and the environment. The lamp 270 also includes a lamp collar 276 having a collar cavity 278 on the top surface of the heat sink structure 274. The collar cavity Μ extends through the collar 'when it is open to the heat sink structure 274 at the bottom and top; the Mf 276_European source 272 is configured such that the top opening of the light source 272 sleeve core cavity 278 emits light . In # μ ^ , in this target, the light source 2] is such that the light source 272 is within the collar cavity 278. J54502.doc -36 - 201144684 The canister carrier 280 is over the top opening of the collar cavity 278 by a thermally conductive material or device as described above. Phosphor support 28 is configured such that light from source 272 passes through phosphor carrier 28, and at least some of the light in the phosphor carrier 280 is converted. Phosphor support 28A can be configured with the structures and features described in the various embodiments described above, including but not limited to carrier layers, phosphors, scattering particles, and/or roughened/formed 8 lamp collars 276. It is also made of a thermally conductive material such that heat from the phosphor carrier 280 is spread into the sleeve ring 276. Heat from the lamp collar 276 can be dissipated directly into the environment or can be dispersed into the fin structure 274 where heat can be dissipated into the environment. The thermal path for the phosphor carrier and the source is coupled 'so that heat from the phosphor carrier and heat from the sleeve 276 can be dispersed into the fin structure 274, and the source heat can be spread from the fin structure 274 to the lamp Collar 276. The collar 276 also has a skirt 282 that fits snugly around the top portion of the fin structure 274 to allow efficient conduction between the collar 276 and the fin structure 274. Figure 16 is a graph 285 showing the operational characteristics of different remote phosphor carriers used in lamps 27A. The first dashed line 286 shows the base or plate temperature of the lamp, and the temperature of the base or plate remains constant at approximately 74, 7C for the disassembled heat sink. A second dashed line 288 shows the peak temperature of the phosphor in various embodiments of the remote phosphor carrier in accordance with the present invention. For a 5 mm thick glass with a spin-on phosphor layer and for a spin-coated phosphor layer, the ο"mm thick sapphire' peak phosphor operates at a lower temperature than the base. Similar to the above, this situation allows for a larger emission efficiency of the fill and less heat-related degradation. I54502.doc -37· 201144684 FIG. 17 shows still another embodiment of a lamp 300 in accordance with the present invention, the lamp 300 including an optical cavity 302 within the heat sink structure 305. The LED-based light source 304 is mounted to the platform 306' and the phosphor carrier 308 is mounted to the top opening of the cavity 302 where the phosphor carrier 308 has any of the features of the phosphor carriers described above. The phosphor carrier 3〇8 comprises a thermally conductive transparent material and a phosphor&apos; and the phosphor carrier 308 is mounted to the cavity by a thermally conductive material or device as described above. Cavity 302 can have a reflective surface to enhance emission efficiency (as described above). Light from source 304 passes through phosphor carrier 3〇8, where a portion of the light is converted by the phosphors in phosphor carrier 3〇8 into light of different wavelengths. In an embodiment, light source 3〇4 may comprise a blue light emitting LED and phosphor carrier 308 may comprise a yellow light barrier as described above, the yellow phosphor absorbing one portion of the blue light and re-emitting yellow light. The lamp 300 emits a combination of LED light and white light of yellow carbon light. Like the above, light source 304 can also include a plurality of different LEDs that emit light of different colors, and the optical carrier can include other fills to produce light having a desired color temperature and color rendering. The lamp 300 also includes a shaped diffuser dome 31〇 mounted over the cavity 3〇2, the shaped diffuser dome 310 including diffusing or scattering particles such as those diffusing or scattering particles listed above. The scattering particles can be provided in a curable adhesive which is formed in a generally dome shape. Additionally or alternatively, a scattering structure may also be provided as part of the diffuser dome. In some embodiments, a scattering structure is provided instead of scattering particles. In the illustrated embodiment, the dome 310 is mounted to the heat sink structure 154502.doc -38 - 201144684 305 ' and has an enlarged portion at the end opposite the heat sink structure 3〇5. Different binder materials such as polyfluorene, epoxy, glass, inorganic glass, dielectric, Bcb, polyamine, polymers, and mixtures thereof, as discussed above, can be used. In some embodiments, white scattering particles can be used to have a white dome that hides the color of the phosphor in the phosphor carrier 308 in the optical cavity. This situation gives the entire lamp a white 観, which is generally more visually acceptable to the consumer or more attractive to the consumer than the color of the phosphor. In an embodiment, the diffuser can comprise white titanium dioxide particles that impart an overall white appearance to the diffuser dome 310. The diffuser dome 3 10 provides the added benefit of distributing the light emitted from the optical cavity in a more omnidirectional and/or uniform pattern. As discussed above, light from a source of light in a cavity can be emitted in a substantially forward or Lambertian pattern, and the shape of the dome 310 and the scattering properties of the scattering particles/structures cause the light to self-circle in a more omnidirectional emission pattern. Top launch. Engineered domes can have different concentrations of scattering particles/structures or can be shaped into specific emission patterns. In some embodiments, the dome can be engineered such that the emission pattern from the lamp follows the = direction distribution criteria defined by the Energy Department. As described herein, some of the lamp embodiments of the different lamp embodiments described herein may include an A-type trim LED bulb that satisfies d〇e Energy Star. One of the requirements of this standard met by lamp 300 is that the uniformity of emission must be at 〇. To 135. Within 2% of the average value under review, and >5% of the total flux from , must be at 135. To (10). The emission area is emitted, and the measurement system is at 〇〇, 45. 90. Fang Wei fr &amp; nr, Ren Bu, 10,000 points into the corner. The present invention provides an efficient 154502.doc •39-201144684 blame for the cost of the franchise. In some embodiments, the entire lamp can include five components that can be assembled quickly and easily. Similar to the above embodiment, the lamp 300 can include a mounting mechanism of the type to be installed in a conventional electrical outlet. In the illustrated embodiment, the lamp 300 includes a threaded portion 312 for mounting to a standard threaded seat. Like the above embodiment, the lamp 300 can include a standard plug and the electrical socket can be a standard socket, a bayonet mount, a pin base (such as a GU24 base unit), or the lamp 3 can be a clip and the electrical socket can be A socket that accepts and holds the clip (eg, as used in many fluorescent lamps). Different lamp embodiments in accordance with the present invention can have many different shapes and sizes. 18 shows another embodiment of a lamp 32A according to the present invention. The lamp 32 is similar to the lamp 300 and similarly includes an optical cavity 322 in the heat sink structure 325, wherein the light source 324 is mounted to the platform in the optical cavity 322. 326. Phosphor carrier 328 is mounted over the cavity opening by a thermal connector. The lamp also includes a diffuser dome 330 that is mounted to the heat sink structure 325 above the optical cavity 322. The diffuser dome can be made of the same material as the diffuser dome 31〇 described above and shown in Figure 17, but in this embodiment the 'dome 330 is shaped as an ellipse or egg to provide A different lamp emits a pattern ' while still obscuring the color of the dish from the scale carrier 328. It should also be noted that the 'heat sink structure 325 is similar to the platform. That is, there is a space between the platform 326 and the heat sink structure such that the platform 326 and the heat sink structure do not share a heat path for heat dissipation. As mentioned above, this situation provides improved heat dissipation of the (IV) light body carrier as compared to lamps that do not have a heat path that resolves light. The lamp fan also includes a threaded portion 332 for women's to the threaded seat with 154502.doc -40- 201144684. 19 through 21 show another embodiment of a lamp 34 according to the present invention, the lamp 340 being similar to the lamp 32 shown in Fig. 18. Lamp 34A includes a heat sink structure 345 having an optical cavity 342 (where optical cavity 342 has light source 344 on platform 346) and a phosphor carrier 348 over optical cavity 342. Lamp 34A further includes a threaded portion 352. The lamp 34A also includes a diffuser dome 35, in which the diffuser dome is planarized at the top to provide the desired emission pattern while still obscuring the phosphor color. Lamp 340 also includes an interface layer 354 between light source 344 and fin structure 345 from light source 344. In some embodiments, the interface layer can comprise a thermally insulating material, and the light source 344 can have features that promote dissipation of the thermal self-illuminator to the edge of the substrate of the light source. This situation can promote heat dissipation to the outer edge of the heat sink structure 345. At these outer edges, heat can be dissipated via the heat sink fins. In other embodiments, the interface layer 354 can be electrically insulating to provide the heat sink I. The structure 345 is electrically isolated from the light source 344. "The electrical connection to the top surface of the light source can then be performed." In the above embodiment, the phosphor carrier is a flat plane while the LEDs in the source are coplanar. However, it should be understood that in other lamp embodiments, the phosphor carrier can take on many different shapes, including different three-dimensional shapes. The term "three-dimensional" is intended to mean any shape that is different from the plane as shown in the above embodiments, and that the three-dimensional phosphor carrier can be mounted to the heat sink in the same manner as the two-dimensional planar phosphor carrier described above. Figures 22 through 25 show different embodiments of a three-dimensional phosphor carrier in accordance with the present invention, but it should be understood that the phosphor carriers can be in many other shapes. 154502.doc 41 201144684 Figure 22 shows a hemispherical shaped phosphor carrier 354 comprising a hemispherical carrier 355 and a phosphor layer 356. The hemispherical carrier 355 can be made of the same material as the carrier layer described above, and the phosphor layer can be made of the same material as the scale layer described above and the scattering particles can be included in the carrier layer as described above. And in the phosphor layer. In some embodiments, the three-dimensional carrier need not be thermally conductive. In this embodiment, the light-fill layer 356 is shown as being on the outer surface of the carrier 355. It should be understood, however, that the phosphor layer can be located on the inner layer of the carrier, mixed with the carrier, or any combination of the three above. In some embodiments, having a phosphor layer on the outer surface minimizes emission losses. When the illuminator light is absorbed by the phosphor layer 356, the light system emits omnidirectionally, and some of the light can be emitted backwards and absorbed by a lamp element such as an LED. The light-filling layer 356 may also have a refractive index different from (for example, greater than) the refractive index of the hemispherical carrier 355 in the case where the phosphor layer is on the inner surface of the carrier, such that the light emitted from the phosphor layer is emitted forward. It can be reflected back from the inner surface of the carrier 355. This light can also be lost due to absorption by the lamp element. In the case where the phosphor layer 356 is located on the outer surface of the carrier 355, the forwardly emitted light does not need to pass through the carrier 355 and will not be lost due to reflection. The light that is emitted backwards will hit the top of the carrier, especially if the index of refraction of the scale layer is greater than the index of refraction of the carrier, at least some of the light will be reflected back at the top of the carrier. Additionally, particularly where the refractive index of the carrier layer is greater than the refractive index of the surrounding environment (e.g., air), some of the light will be reflected back from the inner surface of the carrier layer. This configuration results in a reduction in light emitted from the phosphor layer 3 56 back into the carrier where light can be absorbed. In general, the surface of the phosphor layer and the carrier layer can be made such that the surfaces are substantially smoothed by the 154502.doc -42- 201144684 - limiting the light directed toward the source. Steps enhance the desired benefits of the following measures: Other benefits can be obtained by the following operations: making the outermost surface of the phosphor layer, and coating the garment to the surface as shown in FIG.

When the outer surface of the carrier is such that the outermost surface of the surface of the carrier has a surface roughness or other features for enhancing light extraction, thereby making it more advantageous for self-phosphorescence relative to rearward light emission. The layer + carrier layer structure is previously extracted by light. The disc layer 356 can be deposited using many of the same methods described above. In some examples, the three-dimensional shape of the carrier (5) may require additional steps or other processes to provide the necessary coverage. In embodiments where the solvent _phosphor _ binder mixture is sprayed, the carrier can be heated as described above, and multiple nozzles may be required to provide the desired coverage (e.g., near uniform coverage) over the carrier. In other embodiments, fewer nozzles can be used while rotating the carrier to provide the desired coverage. Similar to the above, the heat from the carrier 35 5 evaporates the solvent and helps to cure the binder. In still other embodiments, the phosphor layer can be formed via an ink immersion process whereby a phosphor layer can be formed on the inner and/or outer surface of the carrier 355, but is particularly suitable for forming on the inner surface on. Carrier 355 can be at least partially filled with a phosphor mixture adhered to the surface of the carrier, or otherwise contact carrier 355 with the phosphor mixture. The mixture can then be discharged from the support to leave a layer of phosphor mixture on the surface which can then be cured. In one embodiment, the mixture may comprise polyethylene oxide (pE0) and a phosphor. The support can be filled and then the support can be evacuated leaving a layer of ΡΕ0-phosphor mixture which can then be thermally cured. ΡΕ0 evaporates or is dissipated by heat, thus 154502.doc • 43· 201144684 Leaves a broken layer. In some embodiments 'the adhesive can be applied to further fix the phosphor layer' while in other embodiments the phosphor can be retained without the binder. Similar to the process for coating a planar carrier layer, such processes can be used in a three-dimensional carrier to coat a plurality of phosphor layers that can have the same or different phosphor materials. The can light layer can also be applied to both the interior and exterior of the carrier and can be of different types having different thicknesses in different regions of the carrier. In still other embodiments, different processes can be used, such as coating the carrier with a sheet of light-blocking material that can be thermally formed to the carrier. In a lamp utilizing the carrier 355, the illuminator can be disposed at the base of the carrier such that light from the illuminator is emitted upwardly and through the carrier 355. The carrier not only converts at least some of the light passing through the carrier, but also assists in dispersing the light in a desired pattern. In some embodiments, the illuminator can illuminate in a substantially Lambertian pattern and the carrier can help to make the light more uniform The pattern is scattered. Figure 23 shows another embodiment of a three-dimensional phosphor carrier 357 comprising a bullet-shaped carrier 358 and a phosphor layer 359 on the outer surface of the carrier, in accordance with the present invention. Carrier 358 and phosphor layer 359 can be formed from the same materials as described above using the same methods as described above. Different shaped phosphor carriers can be used with different illuminators to provide the desired overall lamp emission pattern. Figure 24 shows a further embodiment of a three-dimensional phosphor carrier 360 comprising a sphere-shaped carrier 361 and a phosphor layer 362 on the outer surface of the carrier, in accordance with the present invention. Carrier 36 and phosphor layer 362 can be formed from the same materials as described above using the same methods as described above. 154502.doc • 44 - 201144684 Figure 25 shows a phosphor carrier 363 having a substantially spherical shape carrier 364 and a narrow neck portion 365 in accordance with yet another embodiment of the present invention. Similar to the above embodiment, the phosphor carrier 363 includes a light-guiding layer 3 66 on the outer surface of the carrier 364, and the phosphor layer 366 is made of the same material as described above and is used as described above. The method is formed in the same way. In some embodiments, a phosphor carrier having a shape similar to carrier 364 may be more efficient in converting illuminator light and re-emitting the Lambertian light from the source into a more omnidirectional emission pattern. Figures 26 through 28 show another embodiment of a lamp 37 according to the present invention having a heat sink structure 372, an optical cavity 374, a light source 376, a diffuser dome 378', and a threaded portion 38A. This embodiment also includes a three-dimensional optical carrier 382 that includes a transparent material and at least one phosphor layer. The three-dimensional phosphor carrier 382 can be mounted to the heat sink structure 372. In some embodiments, the carrier 382 is mounted to the heat sink structure by a thermal connector. However, in this embodiment, the phosphor carrier 382 is in the shape of a sphere, and the illuminator is configured such that light from the source passes through the scale carrier, e.g., in the filler carrier 382, at least some of the light is converted. The shape of the three-dimensional phosphor carrier 382 provides a natural separation between the three-dimensional scale carrier, such as light source 376. Therefore, the light source 376 is not mounted in the recess in the heat sink forming the photonic cavity. Actually, the light source Μ is mounted on the top surface of the diffuser structure 372 where the optical cavity (7) is formed by the space between the phosphor carrier 382 and the top of the heat sink structure 372. In an embodiment utilizing a lamp 370 for the blue hairpin (four) light body of light source 376, the 'filler carrier 382 can be yellow, and the diffuser dome 154502.doc -45· 201144684 378 masks the color, At the same time, the light is dispersed into the desired pattern to be emitted. The conduction path for the platform in the lamp 37A is coupled to the conduction path for the heat sink structure, but it should be understood that in other embodiments, the conduction path for the platform and the conduction path for the heat sink structure may be Solution light. 29 to 31 show still another embodiment of a lamp 39 according to the present invention. Lamp 390 includes many of the same features as lamp 37A shown in Figures 26-28. However, in this embodiment, the phosphor carrier 392 is bullet-shaped and functions in much the same manner as other embodiments of the phosphor carrier described above. These shapes are only two of the different shapes that the phosphor carrier can employ in different embodiments of the invention. 32 shows another embodiment of a lamp 4 according to the present invention. The lamp 4A also includes a heat sink 402 having an optical cavity 404 having a light source 4〇6 and a phosphor carrier 408^light 400. A diffuser dome 41 and a threaded portion 412 are also included. However, in this embodiment, the optical cavity 4〇4 can include a separate collar structure 414 that can be removed from the heat sink 402, as shown in FIG. This situation provides a single piece that can be coated with a reflective material more easily than the entire heat sink. The collar structure 414 can be threaded to match the threads in the fin structure 402. The collar structure 414 provides the added benefit of mechanically clamping the PCB down to the heat sink. In other embodiments the collar structure 414 can include a mechanical snap-on device rather than a thread for easier manufacturing. It should be understood that in other embodiments, different portions of the lamp (e.g., the entire optical cavity) can be removed. Such features that enable the collar structure 414 to be removed may allow for easier coating of the optical cavity with a reflective layer, and may also allow removal and replacement of the optical cavity β under fault conditions 154502.doc • 46- 201144684. The lamp of the present invention can have a light source comprising many different numbers of LEDs, some of which have less than 30 LEDs and the other embodiments have less than 20 LEDs. Still other embodiments may have less than one [ED, where the fewer LED wafers] the substantially lower cost and complexity of the light source. In some embodiments 'the area covered by the plurality of wafer sources may be less than 3 〇 mm ' and in other embodiments 'the area may be less than 2 〇 mm 2 . In still other embodiments, the area may be less than 1 〇 mm, some embodiments of the lamp according to the present invention also provide a steady-state light output greater than 4 〇〇 lumens, and in other embodiments, Steady-state light output greater than 6 lumens. In still other embodiments, the lamp can provide a steady state light output of greater than 8 〇〇 lumens. Some lamp embodiments can provide this light output by the thermal management features of the lamp, which allow the lamp to remain relatively cold to the touch. In one embodiment, the touch temperature of the lamp remains less than 6 〇 (&gt;c, and in other embodiments, the touch temperature of the lamp remains less than 5 〇〇c. In still other embodiments, the touch temperature of the lamp remains Less than 4 〇 &lt; t. Some embodiments of the lamp according to the present invention may also operate at greater than 4 〇 lumens per watt, and in other embodiments may operate at greater than 5 〇 lumens per watt. In embodiments, the lamp may operate at greater than 55 lumens per watt. "Some embodiments of the lamp according to the present invention may produce light having a color rendering index (CRI) greater than 7 inches, and in other embodiments, produce greater than 80 Light of CRI. In still other embodiments, the lamp may operate at a CRI greater than 90. Embodiments of the lamp according to the present invention may have a scale body 'a phosphor such as δHeil provides a lamp emission having a CRI greater than 8G, And a lumen equivalent of radiation (LER) greater than 320 lumens per optical watt at a correlated color temperature (CCT) of @ 154502.doc • 47- 201144684 3000 K. The lamp according to the invention may also be at 0 To 13 5. The distribution of light within the 40/&gt; of the average value of the viewing angle is 'and in other embodiments, the distribution may be within 30% of the average of the same viewing angle. Still other embodiments may have the same A distribution of 20% of the average value of the inspection angle (according to the Energy Star specification). These embodiments can also emit light of 5% greater than the total flux at 135 to 180. The above embodiment is Reference is made to the remote phosphor, but it should be understood that alternative embodiments may include at least some of the LEDs having a conformal phosphor layer. This situation may be particularly applicable to lamps having light sources that emit different colors of light from different types of illuminators. These embodiments may additionally have some or all of the features described above. Although the invention has been described in detail with reference to the particular preferred embodiments of the invention, other forms are possible. Therefore, the spirit of the invention And the scope should not be limited to the types described above. [Schematic Description of the Drawings] Figure 1 shows a front view of one embodiment of a prior art LED lamp; Figure 2 shows a cross section of another embodiment of a prior art LED lamp Figure 3 shows a cross-sectional view of an embodiment of a lamp according to the present invention; Figure 4 is a cross-sectional view of another embodiment of a phosphor carrier in accordance with the present invention; Figure 5 is a front view of another embodiment of a phosphor carrier in accordance with the present invention; Section 154502.doc-48-201144684, another embodiment of a phosphor carrier according to the present invention, Figure 7 is a cross section S3_FIG. of another embodiment of a phosphor carrier according to the present invention, and Figure 8 is based on A cross-sectional view of another embodiment of a phosphor carrier of the present invention; and Figure 9 is a cross section of another embodiment of a phosphor carrier according to the present invention [SI · Figure, Figure 2 is another embodiment of a phosphor carrier according to the present invention 1 is a cross-sectional view of still another embodiment of a phosphor carrier according to the present invention; FIG. 12 is a cross-sectional view of another embodiment of a lamp according to the present invention; A cross-sectional view of another embodiment of the lamp of the invention; Figure 14 is a graph showing the operating temperatures of different illuminators and features of the lamp in accordance with the present invention; Figure 15 is a side view of another embodiment of a lamp in accordance with the present invention. Figure 16 shows the basis Figure 7 is a cross-sectional view of another embodiment of a lamp according to the present invention having a diffuser dome; Figure 18 is a lamp according to the present invention. A cross-sectional view of another embodiment, the lamp also having a diffuser dome; Figure 19 is a perspective view of another embodiment of a lamp according to the present invention having a diffuser dome of a different shape; 154502 .doc -49- 201144684 Figure 2A is a cross-sectional view of the lamp shown in Figure 19; circle 21 is an exploded view of the lamp shown in Figure 19; Figure 22 is an embodiment of a three-dimensional phosphor carrier in accordance with the present invention Figure 23 is a cross-sectional view showing another embodiment of a three-dimensional phosphor carrier according to the present invention; Figure 24 is a cross-sectional view showing another embodiment of a three-dimensional phosphor carrier according to the present invention; A cross-sectional view of another embodiment of the inventive three-dimensional phosphor carrier; Figure 26 is a perspective view of another embodiment of a lamp having a diffuser dome of a different shape in accordance with the present invention; Figure 27 is Figure 26 A cross-sectional view of the lamp shown in Figure 28; Figure 28 is Figure 26. Figure 28 is a perspective view of another embodiment of a lamp having a diffuser dome having a different shape; Figure 30 is a lamp of the type shown in Figure 29; Figure 31 is an exploded view of the lamp shown in Figure 29; Figure 32 is a cross-sectional view of another embodiment of the lamp in accordance with the present invention; and Figure 33 is an embodiment of a collar cavity in accordance with the present invention. A cross-sectional view of an example. [Main component symbol description] 10 Typical light-emitting diode (LED) package 11 wire bonding 12 LED chip 154502.doc -50- 201144684 13 Reflecting cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 LED package 22 LED Wafer 23 Sub-substrate 24 Metal Reflector 25A Electrical Trace 25B Electrical Trace 27 Wire Bonding Connector 30 A19 Size Bulb Shell 50 Lamp 52 Heat Sink Structure 53 Reflective Layer 54 Optical Cavity 56 Platform 58 Light Source 60 Heat Sink 62 Phosphor Carrier 64 carrier layer 66 phosphor layer 70 first heat flow 154502.doc • 51 · 201144684 72 second heat flow 74 third heat flow 80 phosphor carrier 82 carrier layer 84 phosphor layer 100 phosphor carrier 102 carrier layer 104 phosphor 120 phosphor carrier 122 Carrier layer 124 phosphor layer 126 scattering particle layer 140 filler carrier 142 carrier layer 144 phosphor 146 scattering particles 160 phosphor carrier 162 carrier layer 164 phosphor layer 166 scattering particle layer 180 phosphor carrier 182 carrier layer 184 phosphor layer 200 phosphor Carrier 154502.doc -52- 201144684 202 carrier layer 204 phosphorescence 210 Lamp 212 Heat sink structure 214 Cavity 216 Platform 218 Light source 220 Phosphor carrier 222 LED main optics or lens 224 Single main optics or lens 240 Lamp 242 Heat sink structure 244 Cavity 246 Platform 248 Light source 250 Phosphor carrier 252 Four heat flow 254 Fifth heat flow 260 Curve 262 First solid line 264 Second solid line 266 First dashed line 268 No. - Dotted line 270 Third solid line / Light 154502.doc -53- 201144684 272 Fourth solid line / light source 274 Heat sink structure 275 fin 276 light collar 278 collar cavity 280 phosphor carrier 282 skirt 285 curve 286 first dashed line 288 second dashed line 300 lamp 302 optical cavity 304 LED-based light source 305 heat sink structure 306 platform 308 Phosphor carrier 310 diffuser dome 312 threaded portion 320 lamp 322 optical cavity 324 light source 325 fin structure 326 platform 328 phosphor carrier 154502.doc • 54- 201144684 330 diffuser dome 332 threaded portion 340 lamp 342 optical cavity 344 light source 345 Heatsink Structure 346 Platform 348 Phosphor Carrier 350 Diffuser Dome 352 threaded portion 354 interface layer / hemisphere opening 355 hemispherical carrier 356 phosphor layer 357 three-dimensional phosphor loading 358 bullet carrier 359 phosphor layer 360 three-dimensional phosphor loading 361 sphere shape carrier 362 light layer 363 phosphor carrier 364 sphere shape Carrier 365 narrow neck portion 366 phosphor layer 370 lamp 154502.doc -55- 201144684 372 heat sink structure 374 optical cavity 376 light source 378 diffuser dome 380 threaded portion 382 three-dimensional phosphor carrier 390 lamp 392 phosphor carrier 400 lamp 402 heat sink 404 optical cavity 406 light source 408 phosphor carrier 410 diffuser dome 412 threaded portion 414 collar structure 154502.doc -56-

Claims (1)

201144684 VII. Patent application scope: 1. A lamp comprising: a light source; a three-dimensional phosphor carrier, the three-dimensional phosphor carrier is located at a distal end of the light source and comprises a heat conductive material and a conversion material, the heat conductive material is from The light of the source is at least partially transparent ' and the conversion material absorbs light from the source and emits light of a different wavelength; and a heat sink structure that is thermally coupled to the heat sink structure. 2) The lamp of claim 1, wherein the phosphor carrier comprises a carrier layer and a light filling layer. 3. The lamp of claim 1 wherein the phosphor carrier comprises scattering particles. 4. The lamp of claim 1 wherein the phosphor carrier comprises a roughened or shaped surface. 5. The lamp of claim 1 wherein heat from the phosphor support layer is conducted into the heat sink structure via the thermal face. 6. A lamp as claimed, wherein the light source comprises a blue light emitting LED and the phosphor carrier comprises a phosphor that absorbs blue light and re-emits light of a different wavelength 'the light emitting blue LED Light combines with the perceived white light of the converted material light. 7. The lamp of claim 1, further comprising an optical cavity mounted on an opening in the cavity, the light source being mounted in the cavity - wherein light from the source passes through The phosphor carrier. 8. The lamp of claim 7 wherein the optical cavity comprises a reflective surface. 154502.doc 201144684 9. The lamp of claim 1, further comprising a diffuser element on the illuminant carrier. 10. The lamp of claim 9, wherein the diffuser element disperses light from a narrow or Langer-emitting circular into a more omnidirectional emission pattern. 11. A lamp as claimed in claim 1, wherein the phosphor carrier has a shape from a group comprising: hemispherical, bullet, conical, tubular and rectangular. 12. As claimed in the lamp, it emits light having an emission pattern that conforms to Energy Star. 13. As requested in the light, the light is sized to accommodate an A19 size profile. 14. A light-emitting diode (LED)-based lamp, the lamp comprising: an LED light source; a three-dimensional phosphor disposed at a distal end of the light source such that light emitted from the light source passes through the phosphor And being converted by the phosphor; and a thermally conductive path for conducting the phosphor conversion heat away from the fill and dissipating the heat. 15. A lamp comprising: a heat sink structure; a light source based on a light emitting diode (LED); a conversion material located at a distal end of the light source and configured to absorb light from the light source and Re-emitting light of different wavelengths; a first heat conduction path for causing the conversion to generate 154502.doc -2- 201144684 heat conduction away from the conversion material to the heat sink; and a diffuser located at the diffuser Above the conversion material. 16. 17. 18. The lamp of claim 15 wherein the heat from the first source is conducted away from the source via a second thermally conductive path. The lamp of claim 15, wherein the first thermally conductive path is coupled to the second thermally conductive path. The lamp of claim 15, wherein the first conductive path and the second conductive path are decomposed. A lamp comprising: a light source; a heat sink structure; an optical cavity; the optical cavity comprising a phosphor carrier, the phosphor carrier being over one of the openings of the cavity and thermally coupled to the heat sink structure, a light source mounted in the optical cavity at a distal end of the phosphor carrier, wherein light from the source passes through the phosphor carrier; and a diffuser element over the optical cavity, wherein the optical The light of the cavity passes through the diffuser element. 154502.doc