JP4124479B1 - Lighting device - Google Patents

Abstract

Provided is a lighting device using high power LEDs in place of downlights and spotlights, which have been realized by conventional lamps, in consideration of cost reduction in manufacturing.
An illumination apparatus that performs illumination using light emitted from a solid light emitting element, includes a hollow portion in which the solid light emitting element is disposed, and an opening in one direction of the hollow portion. And a reflection unit 54 disposed in the hollow portion 56, and a part of the inner wall surface of the hollow portion 56 is a plane whose normal is perpendicular to the central axis of the housing portion 2. A plurality of holding surfaces 41 of the solid light emitting element 32 are configured, and the reflection unit 54 reflects the light emitted from the solid light emitting element 32 toward the opening 57.
[Selection] Figure 4

Description

  The present invention relates to an illuminating device, and more particularly to an illuminating device using a solid light emitting element as a light source.

  In recent years, environmental awareness has increased, and solid-state light-emitting devices, particularly light-emitting diodes, have attracted attention as new light sources that replace incandescent lamps, fluorescent lamps, mercury lamps, and other lamps. This is because the light emitting diode is a light source that has a longer life than the light sources of the lamps described above, and does not contain harmful substances such as mercury and lead, that is, it is an environmentally friendly light source.

  Among light-emitting diodes (hereinafter referred to as LEDs), so-called high-power LEDs having an input capacity of 1 W or more have high emission intensity and are optimal for lighting applications. Moreover, the light conversion efficiency of LED is improving year by year, and illumination using a high power LED as a light source is also expected as an energy-saving light source.

  Among them, there is an increasing expectation for a lighting device using a high power LED instead of a downlight or a spotlight that has been realized by conventional lamps.

In view of such a situation, in the LED lighting apparatus disclosed in Patent Document 1, as shown in FIG. 22, the housing 1310 having an opening on the lower surface and the center portion are recessed compared to the peripheral portion. A concave mirror 1314 housed in the housing 1310 with the center portion facing upward, and a plurality of LEDs 1302 are arranged along the peripheral portion of the concave mirror 1314 with the light emitting surface facing the center portion of the concave mirror 1314. The Then, the light from the LED 1302 is reflected by the concave mirror 1314 to illuminate through the opening of the housing 1310.
JP 2007-80533 A

  However, the LED lighting apparatus disclosed in Patent Document 1 is considered problematic in the following respects.

  Although not explicitly disclosed in Patent Document 1, it is general that the LED 1302 is mounted on a substrate and then placed on the LED lighting fixture. At this time, it is desirable to mount a plurality of LEDs 1302 on a planar substrate and then place them on the LED lighting fixture. By doing in this way, there exists a merit, such as aiming at the reduction of the cost concerning manufacture. However, in the LED lighting device disclosed in Patent Document 1, although the LED 1302 is attached to the cap portion 1312 as shown in FIG. 22, the light emitting surface is arranged at the center of the concave mirror 1314 along the circumference. Arranged on the side. Therefore, it is necessary to arrange the LEDs 1302 three-dimensionally.

  For this reason, it is considered difficult to mount a plurality of LEDs 1302 on a flat substrate and arrange them three-dimensionally in the LED lighting apparatus. Therefore, it is estimated that it is necessary to mount each LED 1302 on another individual board. This directly leads to an increase in manufacturing costs.

  The present invention has been made in view of the above-mentioned circumstances, and is a lighting device using high power LEDs that takes into consideration the reduction of manufacturing costs, particularly downlights and spots realized by conventional lamps. It aims at providing the illuminating device using high power LED replaced with a light.

  An object of the present invention is to provide an illumination device that performs illumination using light emitted from a solid state light emitting device, the housing unit having a hollow structure in which the solid state light emitting device is disposed and having an opening in one direction of the hollow structure. And a reflecting means that is disposed in the hollow structure and reflects light emitted from the solid state light emitting element, wherein a part of the inner wall surface of the hollow structure is a central axis that is an axis passing through the center of the housing means It is possible to solve the problem by forming a plurality of holding surfaces of the solid-state light emitting element, each of which has a plane whose normal line is perpendicular to the edge, and the reflecting means reflects the light emitted by the solid-state light emitting element toward the opening. it can.

  With this configuration, the plurality of holding surfaces of the solid-state light emitting element can be realized by planes whose normals are perpendicular to the central axis. Thereby, there exists an effect that a solid light emitting element can be simply arrange | positioned, without arrange | positioning in three dimensions.

  Here, the illuminating device further includes support means on which the solid-state light emitting element is mounted, and the plurality of holding surfaces are arranged so as to form a regular polygonal column space in a circumferential direction of the central axis. In addition, the support means may be arranged in close contact with all the holding surfaces. The supporting means is substantially rectangular and has a base portion made of a flexible metal, an electrical insulating layer having a thermal conductivity of 1 [W / (m · K)] or more, There may be provided a notch portion which is located on the boundary between any two surfaces of the holding surface and penetrates into a predetermined shape along an arbitrary axis parallel to the short side direction of the support means. Further, only one supporting means may be provided.

  With this configuration, there is an effect that the support means can be closely arranged along the holding surface constituting the regular polygonal column. The support means has flexibility, so that the lighting device can be constituted by only one support means. This leads to cost reduction.

  Here, the solid-state light emitting device is a packaged product having an anode electrode and a cathode electrode, and the support means is further bonded to an anode pad portion, which is a pad to which the anode electrode is bonded, and the cathode electrode. The anode pad portion and the cathode pad portion may be located on a predetermined axis parallel to the short side direction of the support means.

  With this configuration, there is an effect that it is possible to prevent a load from being applied to a joint portion of the solid-state light emitting element that is a package product to the support means.

Here, the solid state light emitting device may be a bare chip semiconductor.
With this configuration, there is an effect that it is possible to realize an illumination device using a bare chip semiconductor which is characterized by being densely arranged.

Here, all the holding surfaces may hold the same number of the solid state light emitting devices.
With this configuration, there is an effect that the uniformity of illumination (light distribution characteristic) by the present illumination device can be improved.

Here, the reflection means may include a reflection surface facing the holding surface for each holding surface.
With this configuration, there is an effect that the light emitted from the solid state light emitting element can be efficiently reflected and used for illumination.

  Here, the illumination device may further include a diffusing unit that diffuses light emitted from the solid state light emitting device. Further, the diffusing means may be provided on the surface of the reflecting surface, and may have a dimple shape or an uneven shape.

  With this configuration, there is an effect that the directivity of light emitted from the solid state light emitting device can be weakened.

  Here, in the cross section along the central axis, the reflection surface may have an elliptical arc shape, and the solid state light emitting device may be disposed on one focal point of the elliptical arc shape. The angle formed by the central axis and the long-side axis of the elliptical arc shape is a value within a predetermined range, and the other focal point of the elliptical arc shape is disposed in the vicinity of the opening or outside the opening. Also good.

  With this configuration, there is an effect that the illumination (light distribution characteristic) by the illumination device can be easily defined.

  Here, the solid state light emitting devices may be divided into two or more groups based on the emission color, and light emission control may be performed for each group.

  With this configuration, there is an effect that the color tone of illumination by the present illumination device can be arbitrarily set.

  According to the present invention, an illuminating device using a high-power LED in consideration of cost reduction in manufacturing, particularly an illuminating device using a high-power LED instead of a downlight and a spotlight realized by conventional lamps. Can be provided.

  Hereinafter, embodiments of a lighting device according to the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
The lighting device 1 according to Embodiment 1 of the present invention uses light emitted from a solid state light emitting device 32 instead of a downlight or a spotlight (hereinafter referred to as a conventional product) that has been configured using conventional lamps. Illuminating, having a hollow portion 56 in which the solid-state light emitting element 32 is disposed, a housing portion 2 having an opening 57 in one direction of the hollow portion 56, and a solid portion disposed in the hollow portion 56. A reflection unit 54 that reflects the light emitted from the light emitting element 32, and a part of the inner wall surface of the hollow portion 56 is from a plane that is directed from a normal direction to a central axis that is an axis that passes through the center of the housing 2. A plurality of holding surfaces 41 of the solid light emitting element 32 are configured, and the reflection unit 54 reflects the light emitted from the solid light emitting element 32 toward the opening 57. By adopting such a configuration, the solid state light emitting elements 32 can be arranged in a plane, and the number of parts can be reduced and the cost can be reduced as compared with the conventional product.

  First, the structure of the illuminating device 1 which concerns on Embodiment 1 of this invention is demonstrated. FIG. 1 is a perspective view showing an appearance of the lighting device 1. FIG. 2 is a plan view seen from the side surface (direction A shown in FIG. 1) of the lighting device 1. FIG. 3 is a plan view seen from the light emitting direction of the lighting device 1 (the B direction shown in FIG. 1) (for the sake of explanation, the protective translucent plate 51 is removed). FIG. 4 is a cross-sectional view showing the structure of the lighting device 1 on the C1-C2 plane (the plane along the central axis of the casing 2) in FIG. FIG. 5 is a cross-sectional view showing the structure of the illumination device 1 on the D1-D2 plane in FIG.

  As shown in FIGS. 1 to 5, the lighting device 1 includes a housing 2 and a protective translucent plate 51. In addition, a substrate 31 (corresponding to the supporting means of the present invention), a solid state light emitting element 32, a power supply unit 52, a wiring cable 53, and a reflecting unit 54 (corresponding to the reflecting means of the present invention) are provided therein. Has been.

  The casing portion 2 corresponds to the casing means of the present invention, and usually has a high thermal conductivity in consideration of heat dissipation (preferably a metal having a thermal conductivity of 200 [W / (m · K) or more]). Consists of. For example, the housing | casing part 2 is comprised with aluminum. The reason why aluminum is used for the housing part 2 is that it is inexpensive, easy to form, has good recyclability, has a thermal conductivity of 200 [W / (m · K) or more], and And high heat dissipation characteristics. Furthermore, it is also effective to anodize the casing 2 made of aluminum. The surface area of the housing | casing part 2 can be expanded and there exists an effect which improves heat dissipation.

  In addition, in this Embodiment, although the housing | casing part 2 is comprised as a cylinder, it is not limited to this. It may be a triangular prism, a quadrangular prism, or the like, and may be arbitrarily set as necessary.

  The housing | casing part 2 is equipped with the hollow part 56 (equivalent to the hollow structure of this invention). The hollow portion 56 has an opening 57 in one direction. FIG. 6 is a plan view of the housing 2 as viewed from the direction of the opening 57. FIG. 7 is a cross-sectional view showing the structure of the surface along the central axis of the housing part 2.

  As shown in FIGS. 6 and 7, the inner wall surface of the hollow portion 56 has a normal axis perpendicular to the central axis of the casing portion 2 (the central axis of the casing portion 2 is an axis passing through the center of the casing portion 2). In this embodiment, the casing 2 is configured as a cylinder, but the holding surface 41 is an axis passing through the center of the casing 2 along the height direction of the cylinder. Several are provided. The holding surface 41 holds the solid light emitting element 32. Specifically, the substrate 31 on which the solid light emitting element 32 is mounted is disposed in close contact (that is, the solid light emitting element 32 is held via the substrate 31).

  The holding surface 41 is disposed so as to form a regular polygonal column space in the circumferential direction of the central axis of the housing portion 2 (so as to be a side surface of the regular polygonal column space) (in the present embodiment, Is represented as a regular dodecagonal column, but is not limited to this, and may be a regular triangular column, a regular quadrangular column, or the like).

  The reason for arranging the holding surface 41 in this way is to reduce the number of parts and the cost. The board | substrate 31 used for the illuminating device 1 has a softness | flexibility, Comprising: With respect to all the holding surfaces 41 which form the side surface of regular polygonal column space, it can arrange | position closely closely. That is, the board | substrate 31 is arrange | positioned along the side surface (several holding surface 41) of regular polygonal column space, Therefore It is also possible to comprise the illuminating device 1 with the board | substrate 31 of only one object. This leads to cost reduction.

  Moreover, the illuminating device 1 is an illuminating device which replaces a conventional product. For this reason, the lighting device 1 is required to have a brightness that is equal to or higher than that of the conventional product and that is equal in size to the conventional product.

  First, regarding brightness, a high power LED is employed as the solid state light emitting element 32. In this case, it is necessary to use a large number of high power LEDs. The lighting device 1 includes a large number of high-power LEDs, and therefore can satisfy the brightness requirement.

  However, by adopting a large number of high power LEDs as described above, if the size of the lighting device is increased, the demand for the size cannot be satisfied. Therefore, in the lighting device 1, the holding surface 41 that is the side surface of the hollow portion 56 holds the solid light emitting element 32 (high power LED).

  Here, the total area of the holding surfaces 41 can be easily made larger than the area of the bottom surface 43 of the housing part 2. Therefore, the lighting device 1 can arrange a large number of solid-state light emitting elements 32 (high power LEDs) in a compact manner without enlarging the housing portion 2. Therefore, it is possible to meet the demand for the above size.

  The board | substrate 31 is corresponded to the support means of this invention, and is arrange | positioned inside the hollow part 56 which the housing | casing part 2 has. FIG. 8 is a diagram showing the configuration of the substrate 31. The substrate 31 has a substantially rectangular shape. FIG. 8 shows an example thereof, which is a planar substrate that includes a base portion 61, an insulating layer 62, and a wiring layer 63. A resist film is formed on the surface of the wiring layer 63 opposite to the insulating layer 62 except for the element mounting pads 66 and the wiring pads 67.

  Here, the base portion 61 is a flexible metal plate. Specifically, it is a metal such as stainless steel. The thickness may be arbitrary as long as flexibility can be ensured, but according to the test conducted by the inventors, the thickness of 0.2 [mm] was optimum.

  The insulating layer 62 is also an insulating layer having flexibility and having a sufficient withstand voltage (electrical insulating property). Here, polyimide or the like has conventionally been used as the flexible insulating layer. However, the thermal conductivity of this polyimide is about 0.2 [W / (m · K)]. This value is a very small value, and when a high power LED is used as the solid state light emitting device 32, it is not appropriate to use it as a mounting substrate. It is difficult to dissipate heat generated from the high power LED, and there is a concern that the high power LED may be broken.

  The insulating layer 62 employed by the inventors has a thermal conductivity higher than that of polyimide, and has a thermal conductivity of at least 1 [W / (m · K)]. A filler is added to the insulating layer 62 in order to increase the thermal conductivity. Furthermore, it has been confirmed that both flexibility and withstand voltage have performances that can withstand practical use.

  The wiring layer 63 is made of a metal such as copper, and is a layer in which wiring and element mounting pads 66 and wiring pads 67 are formed. The thickness of the wiring layer 63 may be arbitrary, but is preferably several tens to several hundreds [μm]. Thus, the flexibility of the substrate 31 is not hindered. As described above, the substrate 31 having flexibility and high thermal conductivity can be configured.

  Here, the substrate 31 is a through hole, and is provided with a notch 65 along the axis E. The axis E is an arbitrary axis parallel to the short side direction of the substrate 31. However, the solid light emitting element 32 does not exist on the axis E.

  The cut portion 65 is a portion that becomes a bent portion of the substrate 31. The substrate 31 uses metal for the base portion 61 in order to improve heat dissipation, and the inventors employ stainless steel (thickness 0.2 [mm]), which is a highly flexible metal.

  However, stainless steel has strong spring properties and is difficult to bend at a desired position. For this reason, the inventors have devised that the substrate 31 can be bent at a desired position by providing the notch 65. That is, the presence of the notch 65 allows the substrate 31 to be bent in a desired position and parallel to the short side direction of the substrate 31.

  Bending the substrate 31 at a desired position and parallel to the short side direction of the substrate 31 is important because it is closely related to bringing the substrate 31 described later and the housing portion 2 into close contact with each other.

  In addition, as long as the notch part 65 can be arrange | positioned on the boundary position 42 of the adjacent holding surface 41 as shown in FIG. 5, you may set a shape and a number arbitrarily.

  However, it is important to set so that the same number of solid light emitting elements 32 can be held on all holding surfaces 41 (in this embodiment, one solid light emitting element 32 is held on all holding surfaces 41. However, the number is not limited to one, and may be two or more.) If the number of solid light emitting elements 32 held on each holding surface 41 is not the same (that is, if the number is different), the light distribution of the lighting device 1 is in the circumferential direction with respect to the central axis of the housing portion 2. This is because it becomes non-uniform.

  The solid state light emitting device 32 used here is a packaged product having an anode electrode and a cathode electrode, and a bare chip semiconductor packaged in a ceramic or resin housing. On the axis F which is a predetermined axis parallel to the short side direction of the substrate 31 (however, the axis F is not provided on the axis E), the anode pad portion 66a and the cathode pad portion 66b are used as element mounting pads 66. It is desirable to provide an anode electrode and a cathode electrode by soldering or the like.

  Here, the reason is that the anode pad portion 66 a and the cathode pad portion 66 b are provided on the axis F parallel to the short side direction of the substrate 31, and the substrate 31 is bent at the notch portion 65. The axis E for performing this bending is an axis parallel to the short side direction of the substrate 31 as described above.

  At this time, since the anode pad portion 66a and the cathode pad portion 66b are also provided on the axis F parallel to the short side direction of the substrate 31, when the substrate 31 is bent, the anode pad portion 66a and the cathode pad portion 66b are connected to each other. It is possible to prevent a load from being applied to a soldering portion (not shown) formed when the anode electrode and the cathode electrode of the solid light emitting element 32 are mounted.

  If a load is applied to a soldering part (not shown), the occurrence of solder cracks or the like is a concern. Therefore, the inventors provide the anode pad portion 66a and the cathode pad portion 66b on the axis F parallel to the short side direction of the substrate 31, thereby providing soldered portions (not shown) in the anode pad portion 66a and the cathode pad portion 66b. ).

  The wiring pad 67 is electrically connected to a wiring cable 53 that is an electric wiring from the power supply unit 52 that supplies power to the solid state light emitting device 32. The connection at this time has the following structure.

  A relay component 71 is mounted on the wiring pad 67. The relay component 71 has a configuration shown in FIG. FIG. 9 is a perspective view showing an appearance of the relay component 71.

  As shown in FIG. 9, the relay component 71 is substantially U-shaped when viewed from the side. That is, the relay component 71 has a planar first member 74 connected to the wiring pad 67 and the length of the first member 74 on the surface opposite to the surface connected to the wiring pad 67 of the first member 74. Two spires 72 connected perpendicularly to the first member 74 are provided at both ends in the direction.

  Here, the shape of the relay component 71 is not limited to the U-shape, and may be an L-shape. That is, the relay component 71 has a planar first member 74 connected to the wiring pad 67 and the length of the first member 74 on the surface opposite to the surface connected to the wiring pad 67 of the first member 74. One spire portion 72 connected perpendicularly to the first member 74 may be provided at one end in the direction. However, considering the convenience of mounting on the substrate 31, the U-shape is desirable.

  The reason is as follows. When the relay component 71 is mounted on the substrate 31, it is efficient to mass-produce the lighting device 1 by using an automatic mounting device. At this time, the relay component 71 is embossed and automatically arranged on the substrate 31.

  At this time, if the relay component 71 is L-shaped, the balance of the relay component 71 is lost during the automatic placement of the substrate 31 and it is difficult to place the relay component 71 at a desired position. On the other hand, if the U-shape is used, the balance of the relay component 71 is not lost, and the substrate 31 can be automatically arranged at a desired position.

  The relay component 71 is made of a conductive material. As shown in FIG. 10, the relay component 71 is mounted on the wiring pad 67 of the substrate 31 by soldering. Furthermore, the spire 72 is connected to the lug terminal 68 of the wiring cable 53 by soldering. Therefore, it is necessary to select a material having heat resistance that can withstand soldering for the relay component 71. Usually, the relay component 71 is made of a metal such as aluminum or copper.

  The relay component 71 is preferably mounted on the wiring pad 67 by a reflow soldering method. Thereby, the relay component 71 can be mounted on the wiring pad 67 simply and reliably.

  In addition, it is desirable that a predetermined step 73 is provided in the spire portion 72 of the relay component 71. In this way, the lug terminal 68 attached by soldering or caulking to the end of the wiring cable 53 from which the insulating layer has been removed is inserted into the spire 72 of the relay component 71, and both are soldered. The solder shape at the time of joining by attachment comes to be sandwiched from the upper and lower sides of the lug terminal 68, and it becomes possible to join more reliably. In addition, the soldering at the time of joining in the state inserted in the spire part 72 of the relay component 71 may be manual soldering using a soldering iron.

  Here, conventionally, when the wiring cable 53 is electrically connected to the substrate 31, the end of the wiring cable 53 is connected to the wiring pad 67 by a spot solder method (manual soldering using a soldering iron). Was.

  However, in this method, since the wiring pad 67 and the wiring cable 53 are connected only by soldering, the connection strength is not sufficient. Therefore, there is a possibility that the wiring cable 53 may be detached from the wiring pad 67 due to vibration accompanying the occurrence of a major earthquake. In particular, the substrate 31 is a metal substrate, and since the metal substrate has high thermal conductivity, it is difficult to raise the temperature of the wiring pad 67 to a desired temperature. Therefore, there is an increased risk that the wiring cable 53 is detached from the wiring pad 67 due to poor soldering.

  As a countermeasure, it is conceivable to provide a wiring through-hole portion (not shown) in the substrate 31. In this way, it is possible to reduce the risk that the wiring cable 53 is detached from the wiring through hole (not shown).

  However, since the substrate 31 is a metal substrate, there is a problem that an excessive portion is electrically connected to cause an electrical short circuit. Therefore, it is not easy to provide a through hole portion (not shown).

  Moreover, although the connector terminal which can be attached to the board | substrate 31 using the reflow method is developed, the volume of such a connector terminal is large in general. Therefore, there is a problem that the connector terminal blocks light emitted from the solid state light emitting device 32 mounted on the substrate 31.

  On the other hand, the relay part 71 employed in the lighting device 1 is very compact, and such a problem does not occur. Therefore, the merit is great.

  Here, the substrate 31 needs to be in close contact with the housing 2 (holding surface 41). This is because the heat generated in the solid state light emitting element 32 is transferred to the housing portion 2 through the substrate 31 and radiated from the surface to the atmosphere.

  If the adhesion between the substrate 31 and the housing 2 (holding surface 41) is low, air enters between them. Since the thermal conductivity of air is low, the heat transfer from the substrate 31 to the housing unit 2 is reduced. In order to avoid this, it is desirable that a double-sided tape (not shown) or the like is sandwiched between the substrate 31 and the housing 2 (holding surface 41) to improve adhesion.

  When using a double-sided tape, it is important to select one that does not contain a substrate. This is because the heat conductivity from the substrate 31 to the housing portion 2 is hindered because the base material has a low thermal conductivity.

  Further, the holding surface 41 needs to be a flat surface. If the holding surface 41 is configured as a curved surface, the substrate 31 and the housing portion 2 (holding surface 41) cannot be brought into close contact with each other. This is mounted on the substrate 31 by soldering the solid light emitting element 32 to the anode pad portion 66a and the cathode pad portion 66b as described above. Since this soldering portion (not shown) is not flexible, it cannot be bent, and therefore, it is impossible to bring the portion into close contact with the curved surface. As described above, the holding surface 41 needs to be a flat surface.

  Further, it is necessary to arrange the substrate 31 so that the cut portion 65 is located at the boundary position 42 between the adjacent holding surfaces 41. The notch portion 65 is a position where the substrate 31 is bent as described above. Therefore, the boundary position 42 between the adjacent holding surfaces 41 coincides with the bending position of the substrate 31. Doing so leads to improving the adhesion between the substrate 31 and the holding surface 41.

  If there is a deviation between the boundary position 42 between the adjacent holding surfaces 41 and the bending position of the substrate 31, the bending position of the substrate 31 interferes with the holding surface 41. This is a factor that hinders the adhesion between the substrate 31 and the holding surface 41. Therefore, it is important to arrange the substrate 31 so that the cut portion 65 is positioned on the boundary position 42 between the adjacent holding surfaces 41.

  As described above, the substrate 31 is the inner wall surface of the hollow portion 56 of the casing 2 and forms a regular polygonal column space (here, a regular dodecagonal column) in the circumferential direction of the central axis of the casing 2. The holding surface 41 is closely arranged. In order to take such a structure, the illuminating device 1 can be comprised using the board | substrate 31 which is planar shape which mounted many solid light emitting elements 32. FIG.

  The solid light emitting element 32 is disposed on the substrate 31. The solid light emitting element 32 is, for example, an LED. The solid state light emitting device 32 is a so-called high power LED with a power consumption per unit of 1 W or more, and is a surface mount type LED. The high power LED has a high luminous intensity and is suitable for lighting device applications. When the illumination device 1 is used as general illumination, the emission color of the solid-state light emitting element 32 to be used is preferably a daylight color, a daylight white color, a white color, a warm white color, or a color corresponding to a light bulb color. Specifically, for example, the plurality of solid-state light emitting elements 32 include daylight colors, daylight whites, whites, and warm whites defined in 4.2 “Chromaticity Range” of JISZ9112 “Classification by light source color and color rendering of fluorescent lamps”. Or it emits light corresponding to the color of the bulb.

  The plurality of solid state light emitting devices 32 may emit blue light having a peak wavelength of 380 to 500 nm. Blue is said to have an effect of suppressing mental excitement. Therefore, the illumination device 1 that emits blue light is suitable as a security light.

  By the way, the high power LED used for the solid state light emitting device 32 has a large power consumption, and accordingly, the energy released as heat is also large. Therefore, if this heat accumulates in the vicinity of the high-power LED, it causes a decrease in luminous intensity, deterioration of life characteristics, and the like. Therefore, it is important to handle this heat appropriately.

  Therefore, the high power LED used for the solid state light emitting device 32 is a surface mount type LED. The reason why the surface-mount type LED is used is that the electrode area of the LED itself is large, and therefore the area in contact with the substrate 31 is large. That is, in the surface mount type LED, the generated heat can be efficiently conducted to the substrate 31.

  Moreover, the board | substrate 31 is a metal substrate with high heat conductivity as mentioned above, and is closely_contact | adhered to the housing | casing part 2 (holding surface 41). Moreover, the housing | casing part 2 is also comprised with the metal (The inventors employ | adopted aluminum) with high heat conduction and high heat dissipation. Therefore, in the lighting device 1, it is possible to appropriately dissipate the heat generated in the solid light emitting element 32.

  The protective translucent plate 51 corresponds to the protective plate of the present invention, protects the solid light emitting element 32 and the like, and is attached to the opening 57 included in the hollow portion 56 of the housing portion 2. It has translucency and is arranged in the light emitting direction of the lighting device 1. The protective translucent plate 51 is formed in a flat plate shape, for example. The protective translucent plate 51 is made of transparent glass, acrylic resin, polycarbonate, or the like.

  In addition, fine irregularities may be formed unevenly on the front surface and / or back surface of the protective translucent plate 51 by surface treatment. This surface treatment can be easily performed, for example, by applying a sandblast method. This diffuses the light emitted from the solid state light emitting device 32 (corresponding to the diffusing means of the present invention). The light emitted from the solid state light emitting element 32 has a strong directivity and therefore tends to be irradiated locally. By diffusing the light emitted from the solid state light emitting element 32 with the surface-treated protective translucent plate 51, the directivity of the light can be weakened and the light can be irradiated uniformly over a wide area. This is particularly effective when the lighting device 1 is used as a downlight.

  The protective translucent plate 51 may diffuse light emitted from the solid light emitting element 32 by adding a diffusing agent to the constituent material. Further, after the diffusion agent is added and configured, surface treatment may be performed on the front surface and / or the back surface to form fine unevenness unevenly, thereby enhancing the diffusion effect.

  The power supply unit 52 converts alternating current supplied from a commercial power supply (not shown) into direct current and supplies power to the solid-state light emitting element 32. The power supply unit 52 preferably has a long life. This is because when the solid state light emitting device 32 is a high power LED, the high power LED has a very long life. Therefore, it is preferable to employ the power supply unit 52 having the same life as that.

  In this case, it is also preferable that the power supplied to the high power LED (solid light emitting element 32) can be arbitrarily controlled. This is because the high power LED can be dimmed freely by controlling the power supplied. By dimming the high-power LED, the necessary brightness can be set freely, and the convenience of the user of the lighting device 1 can be improved.

  The wiring cable 53 is an electric cable that electrically connects the power supply unit 52 and the substrate 31. The direct current generated in the power supply unit 52 is distributed to the wiring pad 67 provided on the substrate 31. Thereby, direct current is supplied to the solid state light emitting device 32. Note that the connection between the wiring cable 53 and the wiring pad 67 is connected via the relay component 71.

  The reflection unit 54 corresponds to the reflection means of the present invention, and is disposed inside the hollow portion 56 included in the housing portion 2.

  The reflection unit 54 includes a plurality of reflection surfaces 55. As shown in the figure, it is preferable that the reflecting surface 55 is arranged to be opposed to the holding surface 41 in a one-to-one relationship. Here, the plurality of holding surfaces 41 may be set so as to face one reflecting surface 55. However, in order to efficiently guide the light emitted from the solid light emitting element 32 to the opening 57, the reflecting surface is used. It is preferable that 55 be arranged on the holding surface 41 so as to be opposed to the holding surface 41 on a one-to-one basis.

  The reflecting surface 55 reflects light emitted from the solid state light emitting elements 32 disposed on the opposing holding surface 41, and passes through a protective translucent plate 51 provided in the opening 57 of the housing portion 2, thereby illuminating device. It plays the role of guiding light to the outside of 1. FIG. 11 is a cross-sectional view showing the structure of the lighting device 1 on the surface along the central axis of the housing portion 2, as in FIG. 4, and shows the locus of light emitted from the solid state light emitting element 32 in the lighting device 1. Is.

  Thus, in the illuminating device 1, the light emitted from the solid light emitting element 32 is reflected by the reflecting surface 55 toward the opening 57. This light is guided to the outside of the lighting device 1 through the protective translucent plate 51 and used for illumination.

  Here, an angle α formed by the surface axis, which is an axis along the inclination of the surface of the reflecting surface 55, with respect to the central axis of the housing portion 2 may be arbitrary, but is appropriately emitted from the solid light emitting element 32. It is important that the angle is such that the light can be reflected and guided to the outside of the lighting device 1 through the protective translucent plate 51 provided in the opening 57 of the housing 2.

  Although the angle α may be determined according to the size of the housing portion 2 and the like, according to the trial production by the inventors, good results are obtained in the range of approximately 40 degrees to 50 degrees.

  Here, in the LED lighting apparatus disclosed in Patent Document 1, as shown in FIG. 22, a housing 1310 having an opening on the lower surface and a dome shape having a recessed central portion compared to the peripheral portion. A plurality of LEDs 1302 are arranged along the concave mirror 1314 housed in the housing 1310 with the central portion on the upper side, and the peripheral surface of the concave mirror 1314 with the light emitting surface on the central portion side of the concave mirror 1314. Then, the light from the LED 1302 is reflected by the concave mirror 1314 to illuminate through the opening of the housing 1310.

  However, the LED lighting apparatus disclosed in Patent Document 1 is considered problematic in the following respects. Although it is not explicitly described in Patent Document 1, it is general that the LED 1302 is mounted on a substrate and then placed on the LED lighting fixture. At this time, it is desirable to mount a plurality of LEDs 1302 on a planar substrate and then place them on the LED lighting fixture. By doing in this way, there exists a merit, such as aiming at the reduction of the cost concerning manufacture. However, in the LED lighting device disclosed in Patent Document 1, although the LED 1302 is attached to the cap portion 1312 as shown in FIG. 22, the light emitting surface is arranged at the center of the concave mirror 1314 along the circumference. Arranged on the side. Therefore, it is necessary to arrange the LEDs 1302 three-dimensionally.

  For this reason, it is considered difficult to mount a plurality of LEDs 1302 on a flat substrate as described above and then place the LEDs 1302 in the LED lighting apparatus. Therefore, it is estimated that it is necessary to mount each LED 1302 on another individual board. This directly leads to an increase in manufacturing costs.

  On the other hand, the illuminating device 1 is arrange | positioned so that the holding surface 41 may form a regular polygonal column space in the circumferential direction of the central axis of the housing part 2 (so as to be a side surface of the regular polygonal column space). Moreover, the board | substrate 31 used for the illuminating device 1 has a softness | flexibility, Comprising: With respect to all the holding surfaces 41 which form the side surface of regular polygonal column space, it can arrange | position closely closely. That is, the board | substrate 31 is arrange | positioned along the side surface (several holding surface 41) of regular polygonal column space, Therefore It is also possible to comprise the illuminating device 1 with the board | substrate 31 of only one object. This leads to cost reduction.

  Moreover, the illuminating device 1 is an illuminating device which replaces conventional products (downlights and spotlights configured using conventional lamps). For this reason, the lighting device 1 is required to have a brightness that is equal to or higher than that of the conventional product and that is equal in size to the conventional product.

  First, regarding brightness, a high power LED is employed as the solid state light emitting element 32. In this case, it is necessary to use a large number of high power LEDs. The lighting device 1 includes a large number of high-power LEDs, and therefore can satisfy the brightness requirement.

  However, by adopting a large number of high power LEDs as described above, if the size of the lighting device is increased, the demand for the size cannot be satisfied. Therefore, in the lighting device 1, the holding surface 41 that is the side surface of the hollow portion 56 holds the solid light emitting element 32 (high power LED).

  Here, the total area of the holding surfaces 41 can be easily made larger than the area of the bottom surface 43 of the housing part 2. Therefore, the lighting device 1 can arrange a large number of solid-state light emitting elements 32 (high power LEDs) in a compact manner without enlarging the housing portion 2. Therefore, it is possible to meet the demand for the above size.

(Modification 1)
The illumination device 121 according to the first modification of the first embodiment of the present invention is different from the illumination device 1 only in that the reflection unit 54 is changed to the reflection unit 122. Therefore, the other components are denoted by the same reference numerals and description thereof is omitted.

  FIG. 12 is a cross-sectional view illustrating a structure of a surface along the central axis of the housing unit 2 of the lighting device 121. Similar to the reflection unit 54, the reflection unit 122 includes a reflection surface 123 so as to face the holding surface 41. The reflecting surface 123 is provided with a fine dimple shape (spherical dent).

  The reason for providing such a shape on the reflecting surface 123 is to diffuse the light emitted from the solid state light emitting device 32. It is provided for the purpose of relaxing the directivity of light.

(Modification 2)
The illumination device 131 according to the second modification of the first embodiment of the present invention is different from the illumination device 1 only in that the reflection unit 54 is changed to the reflection unit 132. Therefore, the other components are denoted by the same reference numerals and description thereof is omitted.

  FIG. 13 is a cross-sectional view illustrating a structure of a surface along the central axis of the housing unit 2 of the lighting device 131. Similar to the reflection unit 54, the reflection unit 132 includes a reflection surface 133 so as to face the holding surface 41. The reflecting surface 133 has a fine uneven shape.

  The reason for providing such a shape on the reflecting surface 133 is to diffuse the light emitted from the solid-state light emitting element 32 as in the case of the reflecting surface 123 of the lighting device 121 shown in the first modification of the first embodiment. It is provided for the purpose of relaxing the directivity of light.

(Modification 3)
The illumination device 141 according to the third modification of the first embodiment of the present invention is different from the illumination device 1 only in that the reflection unit 54 is changed to the reflection unit 142. Therefore, the other components are denoted by the same reference numerals and description thereof is omitted.

  FIG. 14 is a plan view seen from the light emitting direction of the illumination device 141. Here, for the sake of explanation, the protective translucent plate 51 is shown in a removed state.

  Similar to the reflection unit 54, the reflection unit 142 includes a reflection surface 143 so as to face the holding surface 41. The reflective surface 143 is provided with a concave surface in the circumferential direction of the central axis of the housing unit 2. By providing the concave surface, the light emitted from the solid state light emitting element 32 is collected at the focal point of the concave surface, but after passing through the focal point, the light is diverged in the circumferential direction of the central axis of the housing unit 2 (after passing through the focal point). Light is used for lighting).

  Thereby, the illuminating device 141 can improve the uniformity of the light in the circumferential direction of the central axis of the housing unit 2.

  In the above description, the concave surface is provided in the circumferential direction of the central axis of the housing portion 2, but it may be a convex surface. In this case, substantially the same effect can be obtained.

  The surface of the reflecting surface 143 may have a dimple shape or an uneven shape.

(Embodiment 2)
In the illumination device 151 according to Embodiment 2 of the present invention, the reflecting surface 153 has an elliptical arc shape. A desired light distribution characteristic can be obtained by arbitrarily setting the ellipticity of the elliptical arc shape.

  The illumination device 151 according to the second embodiment of the present invention is different from the illumination device 1 only in the reflection unit 152. About the other structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  FIG. 15 is a perspective view showing the appearance of the illumination device 151, and FIG. 16 is a plan view of the illumination device 151 as viewed from the G direction (light emission direction side) in FIG. The plate 51 is shown in a removed state). 17A and 17B are cross-sectional views showing the structure of the surface of the housing 2 along the central axis.

  Similar to the reflection unit 54, the reflection unit 152 includes a reflection surface 153 so as to face the holding surface 41. The reflection surface 153 has an elliptical arc shape in which the solid light-emitting element 32 is one focal point, and an angle β formed between the long side axis and the central axis of the housing portion 2 is within a predetermined range (see FIG. 17A). ).

  The angle β formed by the long side axis and the central axis of the housing portion 2 may be arbitrarily set based on the shape of the housing portion 2 and the like, but in the prototype of the inventors, it is approximately 40 degrees to 50 degrees. If it is within the range, good results are obtained.

  Here, the illumination device 151 has a feature that the illumination range (light distribution characteristic) can be arbitrarily set by setting the ellipticity of the reflection surface 153. The ellipticity is the ratio of the short radius to the long radius of an ellipse (elliptical arc shape). This will be described by comparing with the illumination device 151-1 using the reflection unit 152-1 having the reflection surface 153-1 instead of the reflection unit 152. 18A and 18B are cross-sectional views showing the structure of the surface along the center of the housing part 2 in the lighting device 151-1.

  The difference between the reflecting surface 153 and the reflecting surface 153-1 is that the ellipticity is different. The ellipticity of the reflective surface 153 is a large value compared to the ellipticity of the reflective surface 153-1.

  In this case, the light emitted from the solid state light emitting device 32 and reflected by the reflecting surface 153 is wider than the light reflected by the reflecting surface 153-1 as shown in the locus of light shown in FIGS. 17B and 18B. Delivered to the range. That is, the illumination range is widened.

  Therefore, in the illumination device 151, the ellipticity of the reflecting surface 153 is set according to a desired illumination range (light distribution characteristic). Thereby, a desired illumination range (light distribution characteristic) can be easily obtained.

  However, at this time, one focus of the ellipse (elliptical arc shape) is the solid light emitting element 32, but the position of the other focus 154 (154-1) is set near the opening 57 or outside the opening 57 (illumination device). 1 outside and light emission direction side). That is, it is necessary to set the ellipticity so that the position of the focal point 154 (154-1) is near the opening 57 or outside the opening 57.

  For this reason, the light emitted from the solid-state light emitting element 32 and collected at the focal point 154 (154-1) is the focal point 154 (154-1) according to the locus of light shown in FIGS. 17B and 18B. It spreads again (diverges) after passing. Therefore, if the focal point 154 (154-1) is set inside the hollow portion 56, the light condensed at the focal point 154 (154-1) spreads again inside the hollow portion 56, and the reflecting surface 153 (153) -The light comes into contact with portions other than (1) (such as the holding surface 41). This is because a desired illumination range (light distribution characteristic) cannot be obtained, and a loss of light emitted by the solid state light emitting element 32 is caused.

  Note that light emitted from the solid state light emitting device 32 may be diffused by providing the reflecting surface 153 with a dimple shape or an uneven shape. Further, by providing a concave surface or a convex surface in the circumferential direction of the central axis of the casing 2 of the reflecting surface 153, the uniformity of light in the circumferential direction of the central axis of the casing 2 may be improved.

(Embodiment 3)
The illumination device 211 according to Embodiment 3 of the present invention is an illumination device that uses light emitted from the bare chip semiconductor 213. The bare chip semiconductor 213 has a feature that it can be densely arranged. For this reason, a plurality of bare chip semiconductors 213 having different emission colors are densely provided on each holding surface 41, and a desired color tone can be obtained by independently controlling the emission for each emission color.

  The illumination device 211 according to the third embodiment of the present invention is different from the illumination device 1 only in that the substrate 31 is changed to the substrate 212 and that the solid light emitting element 32 is changed to the bare chip semiconductor 213. . About the other structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  19 is a perspective view showing the appearance of the lighting device 211, and FIG. 20 is a plan view of the lighting device 211 as viewed from the H direction (light emission direction side) in FIG. The plate 51 is shown in a removed state). FIG. 21 is a diagram illustrating a configuration of the substrate 212.

  The only difference between the substrate 212 and the substrate 31 is that the wiring layer 63 is changed to the wiring layer 231. Other configurations are the same as those of the substrate 31, and therefore, the same reference numerals are given and the description thereof is omitted.

  The wiring layer 231 is provided with a mounting pad (not shown) so that the bare chip semiconductor 213 can be disposed, and the bare chip semiconductor 213 is mounted on the mounting pad (not shown).

  The bare chip semiconductors 213 are arranged on the substrate 212 so that the same number (here, nine bare chip semiconductors 213 are provided, but not limited thereto) can be arranged on each holding surface 41.

  Moreover, the bare chip semiconductor 213 employs an LED bare chip that is also used for high-power LEDs. Such an LED bare chip can emit light with high luminous intensity, and is suitable for lighting applications.

  Further, the bare chip semiconductor 213 can arbitrarily set the emission color depending on its composition. Therefore, a plurality of types of bare chip semiconductors 213 having different emission colors are arranged at the same ratio on each holding surface 41, and emission control is performed independently for each type (that is, power supplied independently for each type is set). It is also preferable to do.

  For example, three types of bare chip semiconductors 213a, 213b, and 213c are mounted on a mounting pad (not shown) so that three of them can be arranged on each holding surface 41. By setting 213a to emit blue light, 213b to emit red light, and 213c to emit green light, the lighting device 211 can realize any light emission color.

  This means that the lighting device 211 can have a light emission color according to the scene (time, season, etc.), which leads to providing convenience to the user.

  Needless to say, in the illumination device 211, the reflection unit 54 can be changed to the reflection units 122, 132, 142, 152, and the like.

  Note that the lighting devices 1, 121, 131, 141, 151, and 211 of the present invention are not limited to the above embodiment, and can be freely modified and implemented without departing from the spirit of the present invention. it can.

  For example, although the use of an LED has been exemplified as the solid light emitting element 32, an EL may be used. EL is a new light source that attracts attention as well as LEDs.

  Moreover, in the illuminating device 151, the reflective unit (reflective surface) which has the some reflective area from which the ellipticity of the elliptical arc shape differs is used. In addition, by making it possible to select a reflection region to be used for reflection, it is possible to realize an illumination device 151 that can select a light distribution characteristic as necessary.

  The present invention can be applied to an illuminating device, and particularly applicable to an illuminating device using a solid light emitting element such as an LED as a light source.

It is a perspective view which shows the external appearance of the illuminating device 1 which concerns on Embodiment 1 of this invention. It is the top view seen from the A direction of the illuminating device 1 which concerns on Embodiment 1 of this invention. It is the top view (state which removed the translucent board 51 for protection) seen from the B direction of the illuminating device 1 which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the structure in the C1-C2 surface (surface along the central axis of the housing | casing part 2) of the illuminating device 1 which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the structure in D1-D2 surface of the illuminating device 1 which concerns on Embodiment 1 of this invention. It is the top view which looked at the housing | casing part 2 from the opening part 57 direction. 3 is a cross-sectional view showing a structure of a surface along a central axis of a housing unit 2. FIG. 3 is a plan view showing a configuration of a substrate 31. FIG. FIG. 6 is a perspective view showing an appearance of a relay component 71. FIG. 6 is a perspective view showing a state of connection between a substrate 31 and a wiring cable 53. It is sectional drawing in the C1-C2 surface (surface along the central axis of the housing | casing part 2) of the illuminating device 1 which concerns on Embodiment 1 of this invention, Comprising: It is a figure which shows the locus | trajectory of light. FIG. 6 is a cross-sectional view showing a structure on a surface along the central axis of casing 2, which is lighting apparatus 121 according to Modification 1 of Embodiment 1 of the present invention. FIG. 11 is a cross-sectional view illustrating a structure of a lighting device 131 according to a second modification of the first embodiment of the present invention on a surface along the central axis of the housing unit 2. It is the illuminating device 141 which concerns on the modification 3 of Embodiment 1 of this invention, and is a top view which shows the structure seen from the light emission direction of the illuminating device 141. FIG. It is a perspective view which shows the external appearance of the illuminating device 151 which concerns on Embodiment 2 of this invention. It is the top view seen from the G direction of the illuminating device 151 which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the structure in the surface along the central axis of the housing | casing part 2 of the illuminating device 151 which concerns on Embodiment 2 of this invention. It is sectional drawing in the surface along the central axis of the housing | casing part 2 of the illuminating device 151 which concerns on Embodiment 2 of this invention, Comprising: It is a figure which shows the locus | trajectory of light. It is sectional drawing which shows the structure in the surface along the central axis of the housing | casing part 2 of the illuminating device 151-1 which concerns on the modification of Embodiment 2 of this invention. It is sectional drawing in the surface along the central axis of the housing | casing part 2 of the illuminating device 151-1 which concerns on the modification of Embodiment 2 of this invention, Comprising: It is a figure which shows the locus | trajectory of light. It is a perspective view which shows the external appearance of the illuminating device 211 which concerns on Embodiment 3 of this invention. It is the top view seen from the H direction of the illuminating device 211 which concerns on Embodiment 3 of this invention. 3 is a plan view showing a configuration of a substrate 212. FIG. It is a figure which shows the structure of the conventional LED lighting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 121, 131, 141, 151, 211 Illuminating device 2 Case part 31, 212 Substrate 32 Solid light emitting element 41 Holding surface 42 Boundary position 43 Bottom surface 51 Translucent plate for protection 52 Power supply unit 53 Wiring cable 54, 122, 132 , 142, 152 Reflective unit 55, 123, 133, 143, 153 Reflective surface 56 Hollow part 57 Opening part 61 Base part 62 Insulating layer 63, 231 Wiring layer 65 Cutting part 66 Element mounting pad 66a Anode pad part 66b Cathode pad Part 67 wiring pad 68 lug terminal 71 relay part 72 spire part 73 stage 154 focus 213, 213a, 213b, 213c bare chip semiconductor 1302 LED
1310 Housing 1312 Cap part 1314 Concave mirror

Claims (10)

An illumination device that performs illumination using light emitted from a plurality of surface-mounted solid-state light emitting elements,
Housing means having a hollow structure in which the plurality of solid state light emitting elements are arranged, and having an opening in one direction of the hollow structure;
Support means on which some of the plurality of solid state light emitting elements are mounted for each of the predetermined distance areas;
A reflecting means disposed in the hollow structure and reflecting light emitted from the plurality of solid state light emitting elements;
Part of the inner wall surface of the hollow structure, wherein Ri Do from the normal line is directed at a right angle plane to the central axis is an axis passing through the center of the housing means, said plurality of solid state light emitting devices via said support means a holding surface for holding a plurality of configuration,
The plurality of holding surfaces are arranged to form a regular polygonal column space in a circumferential direction of the central axis,
The support means is arranged to be in close contact with the holding surface for each region,
The said reflection means reflects the light which the said solid light emitting element emitted toward the said opening part. The illuminating device characterized by the above-mentioned. Said support means, Ri substantially rectangular der,
A base portion made of a flexible metal;
An electrically insulating layer having a thermal conductivity of 1 [W / (m · K)] or more;
A notch portion located on a boundary between any two surfaces of the holding surface and penetrating into a predetermined shape along an arbitrary axis parallel to the short side direction of the support means ,
The housing means is made of metal,
The region is a region between adjacent axes in the short side direction passing through the cut portion,
2. The lighting device according to claim 1 , wherein the support unit is arranged by being bent at the notch portion so that a long side extends along a circumferential direction of the central axis . Said supporting means, the lighting device according to claim 1 or claim 2, characterized in that it is provided only one individual. The solid state light emitting device is a packaged product having an anode electrode and a cathode electrode,
The support means further includes:
An anode pad portion which is a pad to which the anode electrode is bonded;
A cathode pad portion that is a pad to which the cathode electrode is bonded;
The lighting device according to any one of claims 1 to 3 , wherein the anode pad portion and the cathode pad portion are located on a predetermined axis parallel to a short side direction of the support means. All the said holding surfaces hold | maintain the same number of said solid light emitting elements. The illuminating device of any one of Claims 1-4 characterized by the above-mentioned. It said reflecting means, the lighting device according to any one of claim 1 to 5, characterized in that a reflective surface facing to the holding surface for each of the holding surface. The lighting device further includes:
The illuminating device according to claim 6 , further comprising a diffusing unit that diffuses light emitted from the solid state light emitting device. The lighting device according to claim 7 , wherein the diffusing unit is provided on a surface of the reflecting surface and has a dimple shape or an uneven shape. In the cross section along the central axis, the reflecting surface has an elliptical arc shape;
The lighting device according to any one of claims 6 to 8 , wherein the solid-state light emitting element is disposed on one focal point of the elliptical arc shape. The angle formed by the central axis and the long-side axis of the elliptical arc shape is a value within a predetermined range,
The illumination device according to claim 9 , wherein the other focal point of the elliptical arc shape is disposed in the vicinity of the opening or outside the opening.

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