JP6789650B2 - LED light emitting device - Google Patents

Description

The present invention relates to a light emitting device that emits light of a color different from the emission color of the LED element, including white, by combining the LED element and various phosphors, and improves high brightness and heat dissipation, particularly in a small size. It relates to the LED light emitting device.

In recent years, LED lighting has replaced conventional incandescent lamps and fluorescent lamps and is rapidly becoming widespread. This is because it has advantages such as energy saving and long life, and further spread is expected in the future. There is a demand for further miniaturization and higher brightness of LED light emitting devices, and light emitting devices related to these improvements have been proposed.

In the prior art shown in Patent Document 1, a plurality of LED elements that emit blue light mounted on a substrate and a through hole are formed in a material having good heat dissipation such as silicon to join the LED element to the substrate to ensure the LED element. Illumination equipped with a mold having a partition wall that separates the two, and a phosphor filter plate (hereinafter referred to as a "wavelength conversion member") that is arranged in a through hole and converts light emitted from an LED element into a predetermined wavelength. It is a device. Further, since the LED element and the wavelength conversion member are arranged apart from each other, the wavelength conversion member is not affected by the heat from the LED element.

JP-A-2009-134965 (pages 5-6, FIG. 2)

However, in the lighting device described in Patent Document 1, since the LED element and the wavelength conversion member are separated by the partition wall, when the LED element and the wavelength conversion member are separated, a shadow is formed by the frame when the lighting device is used as the lighting light source, so that a general lighting light source is used. There was a problem that it was not suitable for.

Therefore, as a method for solving the above-mentioned problems, it is conceivable to remove the partition wall from the lighting device described in Patent Document 1, but by removing the partition wall, the heat generated when the phosphor in the wavelength conversion member is excited is efficient. There is a new problem that the luminous efficiency is lowered due to the temperature quenching.

(Purpose of Invention)
Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to improve the brightness in a predetermined substrate area without lowering the luminous efficiency and as a general lighting light source. It is to provide a useful light emitting device.

A first LED element, a second LED element, a first substrate on which the first LED element is mounted on the upper surface, and a plurality of second LED elements on the first substrate on the upper surface. A second substrate mounted, a wavelength conversion member arranged above the second substrate at a distance from the light emitting surface of the second LED element, and a wavelength conversion member provided so as to surround the second LED element for wavelength conversion. A frame body that supports the member and a translucent heat conductive member are provided, and the heat conductive member penetrates the second substrate and connects the lower surface of the wavelength conversion member and the upper surface of the first substrate. It is characterized by being.

As a result, by forming the substrate into a two-layer structure, the excitation heat in the wavelength conversion member can be efficiently released to the first and second substrates by the translucent heat conductive member. On the other hand, the light emitted from the LED element mounted on the first substrate in the lower layer is delivered to the wavelength conversion member via the heat conductive member having translucency penetrating the second substrate in the upper layer. Therefore, the amount of light emitted can be increased to increase the brightness. As a result, it is possible to provide a light emitting device useful as a general lighting light source while further increasing the brightness in a predetermined substrate area without lowering the luminous efficiency.

It is preferable to incline the upper surface of the first substrate so that the light emitting surface of the first LED element faces the heat conductive member.

In the first LED element, the light emitting surface of the first LED element faces the heat conductive member on the inner wall surface of a recess provided on the upper surface of the first substrate so as to surround the periphery of the heat conductive member. as that have been placed.

The heat conductive member may have a region above the light emitting surface of the first LED element and below the second substrate, in which the cross-sectional area gradually increases from the second substrate toward the first LED element. ..

The heat conductive member may be provided with a light scattering agent at the upper end portion connected to the wavelength conversion member.

As a result, the excitation heat in the wavelength conversion member placed apart from the light emitting surface of the LED element is efficiently released to the substrate by the heat conductive member, thereby preventing the decrease in luminous efficiency and improving the heat dissipation. The amount of light emitted can be increased to increase the brightness. Further, since the heat conductive member has translucency, it is possible to make it difficult for the heat conductive member to cast a shadow. As a result, it is possible to provide a light emitting device useful as a general lighting light source while increasing the brightness in a predetermined substrate area without lowering the luminous efficiency.

The heat conductive member may be arranged so as to be separated from the frame and connected to the central portion of the wavelength conversion member .

As described above, according to the present invention, the excitation heat in the wavelength conversion member placed apart from the light emitting surface of the LED element is transferred to the substrate by the translucent heat conductive member that connects the wavelength conversion member and the substrate. Since it can be efficiently released, heat dissipation is improved, which makes it possible to increase the amount of light emitted from the wavelength conversion member and increase the brightness. Further, the brightness is further increased by increasing the amount of light emitted by forming the substrate into a two-layer structure, and the lower surface of the wavelength conversion member and the upper surface of the first substrate on the lower layer side pass through the second substrate on the upper layer side. By connecting with a translucent heat conductive member, the excitation heat in the wavelength conversion member can be efficiently released to the first and second substrates.
As a result, it is possible to provide a light emitting device that is useful as a general lighting light source while improving the brightness in a predetermined substrate area without lowering the luminous efficiency.

It is sectional drawing and perspective view which show 1st Embodiment of the LED light emitting device of this invention. It is sectional drawing which shows the 2nd Embodiment of the LED light emitting device of this invention. It is sectional drawing which shows the modification of the 2nd Embodiment of FIG. It is sectional drawing which shows the 3rd Embodiment of the LED light emitting device of this invention. It is sectional drawing which shows the 4th Embodiment of the LED light emitting device of this invention. It is sectional drawing which shows the 5th Embodiment of the LED light emitting device of this invention. It is sectional drawing which shows the modification of 5th Embodiment of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
However, the embodiments shown below exemplify an LED light emitting device for embodying the idea of the present invention, and the present invention does not specify the configuration described below. In particular, the materials, shapes, relative arrangements, and the like of the constituent members described in the embodiments are merely explanatory examples, not intended to limit the scope of the present invention to those, unless otherwise specified. In addition, the size and positional relationship of the members shown in each drawing may be exaggerated to make the explanation easier to understand.

In the explanation, the same elements are given the same number, and duplicate explanations are omitted. In addition, parts not related to the invention are omitted.
In each embodiment, a "cross-sectional view passing through the center line of the light emitting direction" is posted, and the "light emitting direction" indicates the direction of the arrow P in FIG. 1 (c). Further, the "cross-sectional view passing through the center line" indicates a YY'cross section of FIG. 1 (c).

[Explanation of First Embodiment: FIG. 1]
The LED light emitting device 100 of the first embodiment will be described with reference to FIG. FIG. 1A shows a cross-sectional view of the LED light emitting device 100 passing through the center line in the light emitting direction, and FIG. 1B shows a cross-sectional view taken along the cutting line AA'of FIG. 1A. Further, FIG. 1 (c) is a perspective view illustrating a cross section of FIG. 1 (a) (common to each embodiment).

The feature of the first embodiment is that the lower surface of the wavelength conversion member 3 and the upper surface of the substrate 20 are connected by a translucent heat conductive member 4.

As shown in FIG. 1A, the LED light emitting device 100 includes a substrate 20 provided with a bonding pad (not shown) on the upper surface (mounting surface), a plurality of LED elements 1 mounted on the bonding pad, and a through hole 10. A frame 2 joined to a substrate 20 so as to surround a plurality of LED elements 1, a wavelength conversion member 3 supported on the upper surface of the frame 2 and joined away from the light emitting surface of the LED element 1, and wavelengths. It is composed of a translucent heat conductive member 4 that connects the center of the lower surface of the conversion member 3 and the center of the upper surface of the substrate 20.

As the plurality of LED elements 1 mounted on the substrate 20, for example, an ultraviolet LED element or a blue LED element having a light emitting layer made of a GaN-based material can be used. The plurality of LED elements 1 are provided with Au bumps, for example, and can be mounted by flip-chip mounting or the like. In this embodiment, since the light emitting surface of the LED element 1 and the lower surface of the wavelength conversion member 3 are arranged apart from each other, wire bonding mounting is not limited to flip chip mounting, and wire bonding mounting can be used.

For the substrate 20, for example, a metal substrate having a high thermal conductivity whose surface is oxidatively insulated is used, and bonding pads, input electrodes, wirings connecting them, etc., which are not shown, are subjected to through-hole technology, photolithography technology, or the like. It is formed. Further, a recess 12 for positioning the heat conductive member 4 is provided in the center of the substrate 20. The frame 2 is made of, for example, a metal having high thermal conductivity and light reflectivity, has through holes 10, and is formed on the substrate 20 by, for example, solder, low melting point glass, or an adhesive having high thermal conductivity. It is joined.

As the wavelength conversion member 3, for example, a glass in which a predetermined amount of phosphor is uniformly contained and formed into a flat plate having a predetermined thickness is used, and the wavelength conversion member 3 is bonded to the frame 2 with, for example, low melting point glass or an adhesive. ing. The heat conductive member 4 is made of a heat conductive member having high heat conductivity such as glass or translucent ceramics, and its lower end side is positioned by being fitted into a recess 12 provided in the substrate 20 to be soldered. It is bonded with low melting point glass or an adhesive having high thermal conductivity, and the upper end side is abutted with the lower surface of the wavelength conversion member 3 or is joined with low melting point glass, a transparent adhesive or the like.

Further, as shown in FIG. 1B, the plurality of LED elements 1 are arranged in a matrix on the upper surface of the substrate 20, and the translucent heat conductive member 4 is arranged in the center. Further, on the outer peripheral portion of the substrate 20, a frame body 2 having a through hole 10 is arranged so as to surround a plurality of LED elements 1.

[Explanation of operation: Fig. 1]
As shown in FIG. 1A, in the LED light emitting device 100, a plurality of LED elements 1 are mounted on a substrate 20 having a predetermined area, and when a drive voltage is supplied to an input electrode (not shown), each LED element 1 emits blue light, for example. The LED element 1 emits light and generates heat, but since the wavelength conversion member 3 is arranged away from the light emitting surface of each LED element 1, it is not directly affected by the heat of the LED element 1. Further, most of the light of each LED element 1 is reflected directly or on the inner surface of the frame body 2 and is incident on the wavelength conversion member 3. Then, the light emitted from the LED element 1 excites the phosphor in the wavelength conversion member 3, emits excitation light (for example, yellow light) having a color different from that of the light of the LED element 1, and does not encounter the phosphor. It mixes with the light of the LED element 1 and emits light of a color different from that of the LED element 1 (for example, white light). Further, a part of the light of each LED element 1 is taken into the heat conductive member 4 and guided to the wavelength conversion member 3 to excite the phosphor, and a part of the light is transmitted through the heat conductive member 4. This makes it difficult for the heat conductive member 5 to cast a shadow.

On the other hand, in the wavelength conversion member 3, excitation heat is generated along with emission of excitation light. A part of this excitation heat is dissipated from the outer peripheral portion of the wavelength conversion member 3 to the substrate 20 via the frame body 2, but the excitation heat accumulates near the center away from the frame body of the wavelength conversion member 3. Cheap. Here, the heat conduction member 4 provided so as to connect the center of the wavelength conversion member 4 and the center of the substrate 20 allows the excitation heat to be efficiently released from the heat conduction member 4 to the substrate 20. In this way, the wavelength conversion member 3 has improved heat dissipation, so that the brightness of the excitation light can be increased.

[Explanation of effect]
With such a structure, the LED light emitting device 100 takes in a part of the light emission by the heat conductive member 4 and guides the light to the wavelength conversion member 3, and the part is transmitted. This makes it difficult for the heat conductive member to cast a shadow. Further, in the conventional heat dissipation route in which the heat of the wavelength conversion member is released only to the frame, the excitation heat that tends to accumulate near the center of the wavelength conversion member 3 passes through the heat conductive member 4 in contact with the center of the wavelength conversion member 3. Then, it can be released to the center of the substrate 20. As a result, the temperature quenching of the wavelength conversion member 3 is reduced, so that the reduction in luminous efficiency can be prevented. As a result, it is possible to provide a light emitting device useful as a general lighting light source while increasing the brightness in a predetermined substrate area without lowering the luminous efficiency.

The heat conductive member 4 is positioned by providing the recess 12 on the substrate 20, but the present invention is not limited to this, and the substrate 20 may be positioned and bonded using a jig or the like without providing the recess 12. Good. Further, when low melting point glass, a transparent adhesive or the like is used for joining the upper end surface of the heat conductive member 4 and the lower surface of the wavelength conversion member 3, the refractive index is increased in order to avoid adverse effects such as refraction or interfacial reflection on the joint surface. It is desirable to select materials that are close to each other. Further, the shape of the through hole 10 of the frame body 2 is not limited to the square shape as shown in the figure, and may be a circular shape or another shape. Further, the plurality of LED elements 1 are not limited to the arrangement and the number as shown in the figure, and are preferably determined in consideration of brightness and heat dissipation. Further, the heat conductive member 4 has a columnar shape, but is not limited to this, and may be a prismatic shape, and the diameter (or cross-sectional area) is preferably determined in consideration of brightness and heat dissipation. Further, the heat conductive member 4 may be arranged outside the center of the wavelength conversion member 3 and the substrate 20, for example, may be arranged so as to be in contact with the frame, but may be arranged at the center of the wavelength conversion member 3 and the substrate 20. Sometimes, the excitation heat of the wavelength conversion member 3 can be dissipated most efficiently.

Here, although not particularly limited, the main materials used for the substrate 20 are listed.
For example, metal and that to form an oxide film of Al ₂ O ₃ in aluminum is, and the like Al 2 _{O 3, AlN} is ceramic, it is a material with more high thermal conductivity highly reflective desirable.
Further, although not particularly limited, the main materials used for the frame 2 are listed.
For example, aluminum which is a metal, Al ₂ O ₃ which is a ceramic, Al N, and the like, and it is desirable that the material has higher thermal conductivity and high reflectivity.
Further, although not particularly limited, the main materials used for the wavelength conversion member 3 are listed.
For example, a glass containing a fluorescent substance, a sheet containing a fluorescent substance in a silicone resin attached to sapphire, a silicone resin containing a fluorescent substance, and the like having translucency. It is desirable that the material has high thermal conductivity.
Further, although not particularly limited, the main materials used for the heat conductive member 4 are listed.
For example, sapphire, glass, translucent ceramics, etc., which have higher thermal conductivity and are more transparent.
The main materials used for each of the above-mentioned members can also be applied to the members used in other embodiments or modifications described below.

[Explanation of the Second Embodiment: FIG. 2]
Next, the LED light emitting device 200 of the second embodiment will be described with reference to FIG. FIG. 2A shows a cross-sectional view of the LED light emitting device 200 passing through the center line in the light emitting direction, and FIG. 2B shows a cross-sectional view taken along the cutting line BB'of FIG. 2A. 2 (c) shows a cross-sectional view taken along the cutting line CC'of FIG. 2 (a).

The feature of the LED light emitting device 200 of the second embodiment is that it has a two-layer structure using two substrates, and heat conduction between the lower surface of the wavelength conversion member 3 and the upper surface of the lower substrate 30 (first substrate). This is a point where the member 5 penetrates and connects the upper layer side substrate 40 (second substrate). The heat conductive member 5 is also in contact with the second substrate 40. Since the upper layer side of the LED light emitting device 200 above the second substrate 40 is basically the same as the LED light emitting device 100, the same elements are given the same number or the same reference numeral, and the overlapping description will be omitted.

As shown in FIG. 2A, the LED light emitting device 200 includes a second substrate 40 having a through hole 14 in the center and mounting a plurality of LED elements 21 (second LED elements), and a second substrate 40. A substrate 30 underneath and having a recess 12 in the center and mounted with a plurality of LED elements 11 (first LED elements), a frame 2 joined to the upper surface of the second substrate 40, and a first substrate. The frame body 2a joined between the 30 and the second substrate 40, the wavelength conversion member 3 joined to the upper surface of the frame body 2 so as to be separated from the light emitting surface of the second LED element 21, and the wavelength conversion. The lower surface of the member 3 and the upper surface of the first substrate 30 are connected through the second substrate 40, and are composed of a translucent heat conductive member 5 having a light scattering agent 9 at the upper end portion. ..

As shown in FIG. 2B, the arrangement and mounting method of the LED elements 1 mounted on the second substrate 40 are the same as those of the LED light emitting device 100 (see FIG. 1). Further, as shown in FIG. 2C, the arrangement and mounting method of the LED elements 1 mounted on the first substrate 30 are the same as those of the LED light emitting device 100.
Further, as shown in FIG. 2A, the materials used for the first substrate 30 and the second substrate 40, and the materials used for the frame body 2 and the frame body 2a are the same as those of the LED light emitting device 100. The same applies to the joining method and the like.

The heat conductive member 5 is made of a heat conductive member having high heat conductivity such as glass or translucent ceramics, and the lower end side penetrates through a through hole 14 provided in the second substrate 40. Further, it is fitted and positioned in the recess 12 formed in the first substrate 30, and is bonded with, for example, solder, low melting point glass, or an adhesive having high thermal conductivity. On the other hand, the upper end side of the heat conductive member 5 is provided with a light scattering agent 9, and is in contact with the wavelength conversion member 3 or is bonded to the wavelength conversion member 3 with low melting point glass, a transparent adhesive or the like. The light scattering agent 9 is used, for example, by including a predetermined amount of a reflective member such as alumina particles in a translucent member similar to the heat conductive member 5.

[Explanation of operation: Fig. 2]
As shown in FIG. 2A, a plurality of first LED elements 11 and second LED elements 21 are mounted on the first substrate 30 and the second substrate 40 having a predetermined area, respectively. When a voltage is supplied to an input electrode (not shown), the first LED element 11 and the second LED element 21 mounted on the first substrate 30 on the lower layer side and the second substrate 40 on the upper layer side emit light. The light emitting operation of the second substrate 40 on the upper layer side is the same as that of the LED light emitting device 100 described above. The light emitted from the first LED element 11 mounted on the first substrate 30 on the lower layer side is taken in by the translucent heat conductive member 5 and guided toward the wavelength conversion member 3. .. Then, between the second substrate 40 and the wavelength conversion member 3, the light captured from each of the first LED elements 11 of the first substrate 30 and the light captured from each LED element 21 of the second substrate 40 are captured. The light merges. Therefore, as compared with the LED light emitting device 100 described above, the amount of light can be increased and the brightness can be increased at the joint portion between the wavelength conversion member 3 and the heat conductive member 5 (or the light scattering agent 9). Here, since the light scattering agent 9 contains particles having reflectivity such as alumina particles, a part of the increased light is diffused in a region below the junction (light scattering agent portion). be able to. As a result, the light guided by the heat conductive member 5 can be diffused and incident on a region away from the junction with the wavelength conversion member 3.

On the other hand, in the wavelength conversion member 3, excitation heat is generated along with emission of excitation light. A part of this excitation heat is dissipated from the wavelength conversion member 3 to the first substrate 30 and the second substrate 40 via the frame body 2 and the frame body 2a, but the center away from the frame body of the wavelength conversion member 3. Excitation heat tends to accumulate in the vicinity. Here, the heat conductive member 5 provided so as to be in contact with the center of the wavelength conversion member 3 can efficiently release the excitation heat from the heat conductive member 5 to the first substrate 30 and the second substrate 40. A part of the light emitted from each LED element 21 on the upper layer side of the second substrate 40 is taken into the heat conductive member 5 and guided to the wavelength conversion member 3. At this time, the heat conductive member 5 is transparent. Since it has lightness, it is difficult for the heat conductive member 5 to cast a shadow.

[Explanation of effect]
By having such a structure, the LED light emitting device 200 can increase the light emitting amount and increase the brightness by the two-layer structure. Further, among the light emitted from the first LED element 11 and the second LED element 21, the light entering the heat conductive member 5 is diffused by the light scattering agent 9, thereby reducing the brightness unevenness and the color unevenness. Can be done. On the other hand, similarly to the LED light emitting device 100 described above, the heat dissipation route of the excitation heat of the wavelength conversion member 3 is conventionally only the frame 2, but further via the heat conductive member 5 to the first substrate. Since a heat dissipation route is provided to the 30 and the second substrate 40, it is possible to prevent a decrease in luminous efficiency due to temperature quenching. Further, since the heat conductive member 5 has translucency, it is possible to make it difficult for the heat conductive member to cast a shadow. As a result, it is possible to provide a light emitting device useful as a general lighting light source while increasing the brightness in a predetermined substrate area without lowering the luminous efficiency.

The light scattering agent 9 may be a light-transmitting member similar to the heat-conducting member 5 to which a member uniformly containing the light-scattering particles is adhered, or the light-scattering particles may be formed in a predetermined region of the heat-conducting member 5. May be contained. Further, the position of the light scattering agent 9 is set to the upper end side of the heat conductive member 5, but the position is not limited to this, and any position between the lower surface of the wavelength conversion member 3 and the upper surface of the second substrate 40 may be used. It may not be provided depending on the case. Further, the first substrate 30 is provided with a recess 12 to position the heat conductive member 5, but the present invention is not limited to this, and the heat conductive member 5 is positioned by using a jig or the like without providing the recess and adhered with an adhesive or the like. You may. Further, the shape of the through hole 10 of the frame body 2 and the frame body 2a is not limited to the square shape as shown in the figure, and may be a circular shape or another shape. Further, the plurality of first LED elements 11 and the second LED 21 mounted on the first substrate 30 and the second substrate 40 are not limited to the arrangement and the number as shown in the figure, and the brightness and heat dissipation are taken into consideration. It is preferable to decide. Further, the heat conductive member 4 has a columnar shape, but is not limited to this, and may be a prismatic columnar shape or a polygonal columnar shape. Further, in the present embodiment, a two-layer structure using two substrates is used, but the present invention is not limited to this, and a plurality of three or more layers may be used.

Here, although not particularly limited, the main materials used for the light scattering agent are listed.
For example, alumina particles, titanium oxide particles and the like.

[Explanation of a modified example of the second embodiment: FIG. 3]
Next, the LED light emitting device 210 of the modified example of the second embodiment will be described with reference to FIG.
FIG. 3 (a) shows a cross-sectional view of the LED light emitting device 210 passing through the center line in the light emitting direction, and FIG. 3 (b) shows a cross-sectional view taken along the cutting line DD'of FIG. 3 (a). 3 (c) shows a cross-sectional view taken along the cutting line EE'of FIG. 3 (a).

The feature of the LED light emitting device 210 of the modified example of the second embodiment is that the number of heat conductive members is increased with respect to the LED light emitting device 200. Since the LED light emitting device 210 has the same basic configuration as the LED light emitting device 200, the same elements are designated by the same number or the same reference numerals, and duplicate description will be omitted.

As shown in FIG. 3A, compared to the LED light emitting device 200 described in the second embodiment, the LED light emitting device 210 has additional heat conductive members 6 having translucency on both sides of the heat conductive member 5. ing. Looking at this in FIGS. 3B and 3C, it can be seen that the heat conductive members 6 are arranged at the four corners of the first substrate 35 so as to penetrate the second substrate 45. Each of these four heat conductive members 6 penetrates a through hole 14 (indicated by a broken line) provided in the second substrate 45 and connects the lower surface of the wavelength conversion member 3 and the upper surface of the first substrate 35. doing. Further, the lower end sides of the four heat conductive members 6 are positioned by being fitted into the recesses 12 (indicated by the broken lines) provided in the first substrate 35 like the heat conductive member 5, and are soldered, low melting point glass, or It is bonded with an adhesive or the like having high thermal conductivity. Further, the upper end side is in contact with the wavelength conversion member 3 or is joined with a low melting point glass, a transparent adhesive or the like.

By adopting such a structure, the LED light emitting device 210 efficiently transmits light from the second LED element 21 on the upper layer side and the first LED element 11 on the lower layer side by the heat conductive member 5 and the heat conductive member 6. Since it can be taken into the light and guided to the wavelength conversion member 3, the brightness can be further increased. Further, since the light is dispersed at the joint portion between the wavelength conversion member 3, the heat conductive member 5, and the plurality of heat conductive members 6, the heat conductive member further reduces brightness unevenness and color unevenness as compared with the second embodiment. Can be done. On the other hand, the excitation heat generated in the wavelength conversion member 3 can be efficiently released from the heat conductive member 5 and the heat conductive member 6 to the first substrate 35 and the second substrate 45, so that the heat dissipation is further improved and the temperature is improved. It is possible to prevent a decrease in luminous efficiency due to quenching. Further, since the heat conductive member 5 and the heat conductive member 6 have translucency, it is possible to make it difficult for the heat conductive member to cast a shadow. As a result, it is possible to provide a light emitting device useful as a general lighting light source while further improving the brightness in a predetermined substrate area without lowering the luminous efficiency.

The diameter of the heat conductive member 6 is slightly smaller than that of the heat conductive member 5, but the diameter is not limited to this, and it is preferable to determine the cross-sectional area of each in consideration of brightness and heat dissipation.
Further, the heat conductive member 6 is arranged apart from the frame body 2 or the frame body 2a, but the present invention is not limited to this, and the heat conductive member 6 may be in contact with the frame body 2 or the frame body 2a. Further, although the light scattering agent 9 is not arranged on the upper end side of the four heat conductive members 6, it may be arranged as needed in consideration of brightness and heat dissipation. Further, each heat conductive member 6 has a columnar shape, but the present invention is not limited to this and may be a prismatic shape.

Further, the arrangement of the heat conductive member 5 and the heat conductive member 6 is not limited to the arrangement as shown in FIG. 3 (b), and the heat conductive member 5 or the heat conductive member 6 can be preferably arranged. Further, since the heat dissipation is improved by arranging the heat conductive member 5 or the heat conductive member 6, a resin such as silicone may be used for the frame 2 or the frame 2a.

[Explanation of the Third Embodiment: FIG. 4]
Next, the LED light emitting device 300 of the third embodiment will be described with reference to FIG. FIG. 4A shows a cross-sectional view of the LED light emitting device 300 passing through the center line in the light emitting direction, and FIG. 4B shows a cross-sectional view taken along the cutting line FF'of FIG. 4A. 4 (c) shows a cross-sectional view taken along the cutting line GG'in FIG. 4 (a).

The feature of the LED light emitting device 300 of the third embodiment is that the light emitting surface of the first LED element 11 mounted on the substrate 50 on the lower layer side faces the heat conductive member 5 with respect to the LED light emitting device 200. It is a point where the upper surface of 50 is inclined. Since the LED light emitting device 300 has the same basic configuration as the LED light emitting device 200, the same elements are designated by the same number or the same reference numerals, and duplicate description will be omitted.

As shown in FIGS. 4A and 4B, the structure of the LED light emitting device 300 on the upper layer side of the second substrate 40 is the same as that of the LED light emitting device 200 described above (see FIG. 2). On the other hand, in the structure on the lower layer side of the second substrate 40, the mounting surface of the first substrate 50 is inclined toward the heat conductive member 5. Further, as shown in FIG. 4C, it is shown that the four inclined surfaces of the first substrate 50 are inclined and face each other. In this way, a predetermined number of first LED elements 11 are mounted on each of the four inclined mounting surfaces, and the light emitting surfaces of the first LED elements 11 are arranged toward the heat conductive member 5.

Further, as shown in FIG. 4A, the lower surface of the frame body 2b having the through hole 10 on the lower layer side is inclined and abuts on the four slopes of the substrate 50, and the upper surface abuts on the lower surface of the substrate 30. Each is joined with an adhesive or the like. Although not shown in particular, bonding pads, input electrodes, wirings connecting them, etc. are formed on the substrate 30 and the substrate 50 by using through-hole technology, photolithography technology, etc., and the side surfaces of the substrate and the side surface of the frame are used. It is possible to make an electrical connection with the outside.

With such a structure, the LED light emitting device 300 more efficiently takes in the light emitted from the LED element 11 on the lower layer side of the second substrate 40 into the translucent heat conductive member 5. The brightness can be increased with. As a result, it is possible to provide a light emitting device useful as a general lighting light source while further improving the brightness in a predetermined substrate area without lowering the luminous efficiency.

Although the slope of the substrate 50 on the lower layer side has been described as four slopes, the present invention is not limited to this, and other slope shapes having the same purpose such as a mortar shape may be used.

[Explanation of Fourth Embodiment: FIG. 5]
Next, the LED light emitting device 400 of the fourth embodiment will be described with reference to FIG. FIG. 5A shows a cross-sectional view of the LED light emitting device 400 passing through the center line in the light emitting direction, and FIG. 5B is FIG.
A cross-sectional view taken along the cutting line HH ′ of FIG. 5A is shown, and FIG. 5C shows a cross-sectional view taken along the cutting line I-I ′ of FIG. 5A.

The feature of the LED light emitting device 400 of the fourth embodiment is that the LED light emitting device 200 is provided with a recess that surrounds the periphery of the heat conductive member 5 on the upper surface of the first substrate 60 on the lower layer side, and is formed on the inner wall surface of the recess. This is a point where the light emitting surface of the first LED element 11 is arranged so as to face the heat conductive member 5. Since the LED light emitting device 400 has the same basic configuration as the LED light emitting device 200, the same elements are assigned the same number or the same reference numeral, and duplicate description will be omitted.

As shown in FIGS. 5A and 5B, the structure of the LED light emitting device 400 on the upper layer side of the second substrate 40 is the same as that of the LED light emitting device 200 described above (see FIG. 1). On the other hand, in the structure on the lower layer side of the second substrate 40, a recess 13 is formed in the central portion of the substrate 60, and the mounting surface of the LED element 1 is parallel to the longitudinal direction of the heat conductive member 5. Further, the light emitting surface of the LED element 1 is arranged so as to abut on the outer peripheral surface of the heat conductive member 5. Further, as shown in FIG. 5C, the LED element 1 mounted on the four inner wall surfaces of the recess 13 formed in the first substrate 60 on the lower layer side comes into contact with the outer peripheral surface of the heat conductive member 5. There is.

As shown in FIG. 5A, in the present embodiment, since the second substrate 40 is directly arranged on the first substrate 60, the frame on the lower layer side is unnecessary. Although not particularly shown, the substrate 60 is divided in the longitudinal direction (for example, divided into two, four, etc.) around the heat conductive member 5 to expose the mounting surface, thereby mounting the first LED element 11. Can be facilitated. Bonding pads, input electrodes, wirings connecting them, etc. are formed on the second substrate 40 and the first substrate 60 by using through-hole technology, photolithography technology, etc., and the side surfaces of the substrate and the side surface of the frame are used. Electrical connection of each dividing surface is possible.

With such a structure, the LED light emitting device 400 can directly inject light from the first LED element 11 into the heat radiating member 5, so that the light can be taken into the heat conductive member 5 more efficiently to increase the brightness. Can be done. On the other hand, not only the excitation heat in the wavelength conversion member 3 can be efficiently released to the first substrate 60 and the second substrate 40 by the heat conductive member 5, but also the heat of the first LED 11 is also transferred to the first substrate 60. In addition, it can be released to the heat radiating member 5. Further, since the second substrate 40 is directly arranged on the first substrate 60 without passing through the frame as described above, the heat generated from the second LED element 21 is more than that of the second embodiment. Heat is easily dissipated to the first substrate 60. As a result, the luminous efficiency of the wavelength conversion member 3, the first LED element 11, and the second LED element 21 is improved. As a result, it is possible to provide a light emitting device useful as a general lighting light source while further improving the brightness in a predetermined substrate area without lowering the luminous efficiency.

Although the recess 13 of the first substrate 60 has been described as one place, the present invention is not limited to this, and as described in the modified example of the second embodiment (see FIG. 3), a plurality of heat conductive members 6 are provided. A recess 13 corresponding to each of the recesses 13 may be provided so that the first LED element 11 can be mounted. Further, the first LED element 11 and the heat conductive member 5 are brought into contact with each other, but the present invention is not limited to this, and the first LED element 11 and the heat conductive member 5 are arranged apart from each other and between the first LED element and the heat conductive member 5. May be a structure in which is filled with a transparent resin or the like. Further, the heat conductive member 5 has a columnar shape, but the present invention is not limited to this and may be a prismatic shape.

[Explanation of Fifth Embodiment: FIG. 6]
Next, the LED light emitting device 500 of the fifth embodiment will be described with reference to FIG. FIG. 6 (a) shows a cross-sectional view of the LED light emitting device 500 passing through the center line in the light emitting direction, and FIG. 6 (b) shows a cross-sectional view taken along the cutting line JJ'of FIG. 6 (a). 6 (c) shows a cross-sectional view taken along the cutting line KK'of FIG. 6 (a).

The feature of the LED light emitting device 500 of the fifth embodiment is that the cross-sectional area of the LED light emitting device 200 is larger than that of the LED light emitting device 200 from the lower surface of the second substrate 40 on the upper layer side to the upper surface of the first substrate 70 on the lower layer side. This is a point where the heat conductive member 7 having a gradually increasing area is provided. Since the LED light emitting device 500 has the same basic configuration as the LED light emitting device 200, the same elements are designated by the same number or the same reference numerals, and duplicate description will be omitted.

As shown in FIGS. 6A and 6B, the LED light emitting device 500 has the same structure as the LED light emitting device 200 described above in the structure on the upper layer side of the second substrate 40 (see FIG. 2). On the other hand, as shown in FIGS. 6A and 6C, in the structure on the lower layer side of the second substrate 40, a plurality of first LED elements 11 are mounted on the mounting surface of the substrate 70, and heat conduction The member 7 forms a conical portion having a region S in which the cross-sectional area gradually increases between the lower surface of the substrate 40 and the upper surface of the substrate 70. Further, the heat conductive member 7 has a wide bottom surface 16 on the lower end side, the bottom surface 16 is provided with a plurality of recesses 15 into which each LED element 1 is inserted, and the bottom surface 16 is in contact with the substrate 70.

As shown in FIG. 6A, the lower layer side frame 2c is formed so as to cover the region S where the cross-sectional area of the heat conductive member 7 gradually increases, and heat is dissipated from the heat conductive member 7 to the frame 2c. I'm doing well. Further, the frame body 2c is arranged so as to connect the lower surface of the substrate 40 and the upper surface of the substrate 70, and is joined by an adhesive or the like. Further, as shown in FIG. 6C, since the wide bottom surface 16 of the heat conductive member 7 has a circular shape, the number of mounted first LED elements 11 is limited, and the substrate 30 of the LED light emitting device 200 has a limitation. It is slightly less than the number of implementations.

With such a structure, the LED light emitting device 500 can insert the LED element 1 into the recess 15 of the heat conductive member 7 so that the light emitting surface and the bottom surface of the recess 15 face each other in close proximity to each other. The light emission of the LED element 1 can be more efficiently guided to the heat conductive member 7 to increase the brightness. On the other hand, the excitation heat in the wavelength conversion member 3 can be efficiently released from the heat conductive member 7 to the second substrate 40, the frame body 2c and the first substrate 70. In particular, since the conical portion having the region S of the heat conductive member 7 is in contact with the inner wall surface of the frame body 2c, heat can be dissipated more efficiently. As a result, it is possible to provide a light emitting device useful as a general lighting light source while further improving the brightness in a predetermined substrate area without lowering the luminous efficiency.

It should be noted that a reflective surface made of a metal film may be formed on the outer peripheral surface of the region S portion of the heat conductive member 7 so that the light guiding in the heat conductive member 7 can be performed more efficiently.

[Explanation of Modified Example of Fifth Embodiment: FIG. 7]
Next, the LED light emitting device 510 of the modified example of the fifth embodiment will be described with reference to FIG. 7.
FIG. 7 (a) shows a cross-sectional view of the LED light emitting device 510 passing through the center line in the light emitting direction, and FIG. 7 (b) shows a cross-sectional view taken along the cutting line LL'of FIG. 7 (a). 7 (c) shows a cross-sectional view taken along the line MM'of FIG. 7 (a).

The feature of the LED light emitting device 510 of the modified example of the fifth embodiment is that the frame body 2d on the lower layer side has an opening 10 with respect to the LED light emitting device 500, and the cross-sectional area of the heat conductive member 7 gradually increases. This is a point where the air layer 8 is provided on the outer peripheral portion of S. Since the LED light emitting device 510 has the same basic configuration as the LED light emitting device 500, the same elements are designated by the same number or the same reference numerals, and duplicate description will be omitted.

As shown in FIG. 7A, the structure of the LED light emitting device 510 on the upper layer side of the second substrate 40 is the same as that of the LED light emitting device 500 described above (see FIG. 6). On the other hand, the frame body 2d on the lower layer side has a through hole 10 and forms the air layer 8 without covering the outer peripheral portion of the region S where the cross-sectional area of the heat conductive member 7 gradually increases. Further, the structure of the heat conductive member 7 and the first substrate 70 is the LED light emitting device 5.
Same as 00. In this way, when the air layer 8 is provided on the outer peripheral portion of the region S where the cross-sectional area of the heat conductive member 7 gradually increases, the light emitted from the bottom surface 16 side of the heat conductive member 7 is incident on the slope of the region S. It is possible to improve the light guide by easily causing total reflection.

The reason is that, for example, most of the light emitted inside the heat conductive member 7 reaches the inner surface of the region S where the cross-sectional area of the heat conductive member 7 gradually increases. Here, when glass is used for the heat conductive member 7, the light that reaches is incident on the medium having a high refractive index (glass: n = 1.5) to the medium having a low refractive index (air layer: n = 1). The well-known Snell's law can be applied, which corresponds to the interfacial reflection. Although detailed calculation is omitted, if the critical angle for total reflection is θc, θc = about 41.8 °, and light incident at an incident angle larger than the critical angle θc can be totally reflected and taken into the inside. As a result, more efficient light guiding can be performed in the region S where the cross-sectional area gradually increases, and light leakage to the outside of the region S can be reduced.

With such a configuration, the LED light emitting device 510 more efficiently guides the light emitted from the LED element 1 incident from the recess 15 formed in the bottom surface 16 of the heat conductive member 7 to the upper end side and has brightness. Can be enhanced. On the other hand, the excitation heat in the wavelength conversion member 3 can be efficiently released from the heat conductive member 7 to the second substrate 40, the frame body 2c and the first substrate 70. As a result, it is possible to provide a light emitting device useful as a general lighting light source while further improving the brightness in a predetermined substrate area without lowering the luminous efficiency.

The bottom surface 16 of the heat conductive member 7 in the LED light emitting devices 500 and 510 has been described as having a circular shape, but the bottom surface 16 is not limited to this and may be a polygon such as a triangle or a quadrangle. Further, although it has been explained that the heat conductive member 7 forms the upper part of the cone between the lower surface of the second substrate 40 and the upper surface of the first substrate 70, the present invention is not limited to this, and the heat conductive member 7 may be formed into a polygonal weight shape according to the bottom surface 16. Good.

Although various embodiments of the LED light emitting device and modifications thereof have been described in detail above, the present invention is not limited to such embodiments and modifications, and the present invention is not limited to such embodiments and modifications, and the present invention is described in terms of detailed configuration, material, and quantity. It can be arbitrarily changed, combined, or deleted without departing from the idea of the invention. That is, the present invention is not limited to the above-described embodiment or modification of the LED light emitting device, and it is not necessary to perform all of them, and various changes and combinations are made within the scope of the contents described in each claim. , Can be omitted.

The present invention is a light emitting device that can be used for general lighting that emits light of a color different from the emission color of the LED element, including white, by combining the LED element and various phosphors, particularly small size. However, it is suitable for lighting products that require high brightness without lowering the luminous efficiency.

1 LED element 2, 2a, 2b, 2c, 2d frame 3 Wavelength conversion member 4, 5, 6, 7 Heat conductive member (translucency)
8 Air layer 9 Light scattering agent (translucent heat conductive member containing light scattering agent)
10, 14 Through holes 11 First LED element 12, 13, 15 Recessed 16 Bottom surface 20 Substrate 30, 35, 50, 60, 70 First substrate 40, 45 Second substrate 21 Second LED element 100, 200 , 210, 300, 400, 500, 510 LED light emitting device

Claims (6)

The first LED element and the second LED element,
A first substrate on which a plurality of the first LED elements are mounted on the upper surface,
A second substrate on the first substrate on which a plurality of second LED elements are mounted on the upper surface.
A wavelength conversion member arranged above the second substrate and separated from the light emitting surface of the second LED element.
A frame body provided so as to surround the plurality of the second LED elements and supporting the wavelength conversion member, and
Translucent heat conductive member and
The LED light emitting device is characterized in that the heat conductive member penetrates the second substrate and connects the lower surface of the wavelength conversion member and the upper surface of the first substrate. The LED light emitting device according to claim 1, wherein the upper surface of the first substrate is inclined so that the light emitting surface of the first LED element faces the heat conductive member. The first LED element and the second LED element,
A first substrate having a recess on which the plurality of first LED elements are mounted,
A second substrate on the first substrate on which a plurality of second LED elements are mounted on the upper surface.
A wavelength conversion member arranged above the second substrate and separated from the light emitting surface of the second LED element.
A frame body provided so as to surround the plurality of the second LED elements and supporting the wavelength conversion member, and
Equipped with a translucent heat conductive member
The heat conductive member penetrates the second substrate and connects the lower surface of the wavelength conversion member and the first substrate.
The first LED element has a heat emitting surface of the first LED element on the inner wall surface of the recess provided on the upper surface of the first substrate so as to surround the periphery of the heat conductive member. L ED light emitting device you characterized in that it is arranged so as to face the. The cross-sectional area of the heat conductive member gradually increases from the second substrate toward the first LED element in a region above the light emitting surface of the first LED element and below the second substrate. The LED light emitting device according to claim 1, wherein the LED light emitting device has a region. The LED light emitting device according to any one of claims 1 to 4, wherein the heat conductive member includes a light scattering agent at an upper end portion connected to the wavelength conversion member. The LED light emitting device according to any one of claims 1 to 5 , wherein the heat conductive member is arranged so as to be separated from the frame body and connected to a central portion of the wavelength conversion member. ..

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