JP2017183301A - Led light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device that can be used as a general light source for illumination, which has a small size and higher luminance without decreasing the luminous efficiency.SOLUTION: A light-emitting device includes a substrate, a plurality of LED elements mounted on an upper surface of the substrate, a frame provided to surround the plurality of LED elements, a wavelength conversion member held by the frame and placed apart from an emission surface of the LED element, and a light-transmitting thermally conductive member that connects between a lower surface of the wavelength conversion member and the upper surface of the substrate. The substrate has a two-layer structure, and is formed of the light-transmitting thermally conductive member that connects through the substrate on the upper layer side between the lower surface of the wavelength conversion member and the upper surface of the substrate. Thus, the excited heat of the fluorescent body in the wavelength conversion member can be dissipated to the substrate efficiently, and therefore, the luminance can be increased without decreasing the luminous efficiency.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device that emits light of a color different from the light emitting color of an LED element, including white, by combining an LED element and various phosphors, and particularly improves the high luminance and heat dissipation while being small. The present invention relates to an LED light emitting device.

  In recent years, LED lighting has rapidly become widespread, replacing conventional incandescent lamps and fluorescent lamps. This is because there are advantages such as energy saving and long life, and further spread is expected in the future. There is a demand for further downsizing and higher brightness of LED light-emitting devices, and light-emitting devices related to these improvements have been proposed.

  The prior art shown in Patent Document 1 is a method of securely connecting LED elements that are mounted on a substrate by forming a plurality of blue light emitting LED elements and through-holes in a material with good heat dissipation such as silicon. Illumination provided with a mold having a partition wall to be separated into a light source and a phosphor filter plate (hereinafter referred to as a “wavelength conversion member”) that converts light emitted from the LED element disposed in the through hole into a predetermined wavelength. Device. In addition, since the LED element and the wavelength conversion member are arranged apart from each other, the wavelength conversion member is not affected by heat from the LED element.

JP 2009-134965 A (pages 5-6, FIG. 2)

  However, since the LED device and the wavelength conversion member are separated from each other by the partition wall in the illumination device described in Patent Document 1, a shadow is generated by the frame when used as an illumination light source. There was a problem of being unsuitable.

  Therefore, as a method for solving the above problem, it is conceivable to remove the partition wall from the illumination device described in Patent Document 1. However, by removing the partition wall, the heat generated when the phosphor in the wavelength conversion member is excited is efficiently used. Therefore, there is a new problem that the light emission efficiency decreases due to temperature quenching.

(Object of invention)
Therefore, the present invention has been made in view of the above-described problems, and an object of the present invention is to improve luminance in a predetermined substrate area without reducing luminous efficiency, and as a general illumination light source. It is an object to provide a useful light emitting device.

  A first LED element and a second LED element; a first substrate on which the first LED element is mounted; and a plurality of second LED elements on the upper surface. The second substrate mounted, the wavelength conversion member disposed above the second substrate and spaced from the light emitting surface of the second LED element, and the second LED element are provided so as to surround the wavelength conversion member. A frame supporting the member; and a translucent heat conducting member, the heat conducting member penetrating the second substrate and connecting the lower surface of the wavelength conversion member and the upper surface of the first substrate. It is characterized by.

Thereby, by making a board | substrate into a 2 layer structure, the excitation heat in a wavelength conversion member can be efficiently escaped to a 1st and 2nd board | substrate by a translucent heat conductive member. On the other hand, the light emitted from the LED element mounted on the first substrate in the lower layer is delivered to the wavelength conversion member via the heat conductive member having translucency penetrating the second substrate in the upper layer. Therefore, the luminance can be increased by increasing the light emission amount. As a result, it is possible to further increase the luminance in a predetermined substrate area without lowering the light emission efficiency and provide a light emitting device useful as a general illumination light source.

  The upper surface of the first substrate may be inclined so that the light emitting surface of the first LED element faces the heat conducting member.

  The upper surface of the first substrate may be provided with a recess surrounding the periphery of the heat conducting member, and the first LED element may be arranged and mounted on the inner wall surface of the recess so that the light emitting surface faces the heat conducting member.

  The heat conducting member may have a region where the cross-sectional area gradually increases from the second substrate toward the first LED element in a region above the light emitting surface of the first LED element and below the second substrate. .

  The heat conducting member may include a light scattering agent at an upper end connected to the wavelength conversion member.

  A substrate, a plurality of LED elements mounted on the upper surface of the substrate, a frame body provided so as to surround the plurality of LED elements, and held by the frame body and placed away from the light emitting surface of the LED element A wavelength conversion member and a translucent heat conduction member are provided, and the heat conduction member connects a lower surface of the wavelength conversion member and an upper surface of the substrate.

  As a result, the excitation heat in the wavelength conversion member placed away from the light emitting surface of the LED element is efficiently released to the substrate by the heat conducting member, thereby preventing a decrease in light emission efficiency and improving heat dissipation. Luminance can be increased by increasing the amount of light emission. Moreover, since the heat conductive member has translucency, it is difficult to make a shadow by the heat conductive member. As a result, it is possible to increase the luminance in a predetermined substrate area without reducing the light emission efficiency, and to provide a light emitting device useful as a general illumination light source.

  The heat conducting member may be separated from the frame.

  The heat conducting member may be disposed so as to be connected to the central portion of the wavelength converting member.

As described above, according to the present invention, the excitation heat in the wavelength conversion member placed away from the light emitting surface of the LED element is transferred to the substrate by the translucent heat conductive member that connects the wavelength conversion member and the substrate. Since it can escape efficiently, heat dissipation improves, thereby the luminance can be increased by increasing the amount of light emitted from the wavelength conversion member. In addition, the substrate has a two-layer structure to further increase the luminance by increasing the amount of light emitted, and the lower surface of the wavelength conversion member and the upper surface of the first substrate on the lower layer side penetrate the second substrate on the upper layer side. Then, the excitation heat in the wavelength conversion member can be efficiently released to the first and second substrates by connecting with the translucent heat conducting member.
Accordingly, it is possible to provide a light-emitting device that is useful as a general illumination light source while improving the luminance without reducing the light emission efficiency in a predetermined substrate area.

It is sectional drawing and perspective view which show 1st Embodiment of the LED light-emitting device of this invention. It is sectional drawing which shows 2nd Embodiment of the LED light-emitting device of this invention. It is sectional drawing which shows the modification of 2nd Embodiment of FIG. It is sectional drawing which shows 3rd Embodiment of the LED light-emitting device of this invention. It is sectional drawing which shows 4th Embodiment of the LED light-emitting device of this invention. It is sectional drawing which shows 5th Embodiment of the LED light-emitting device of this invention. It is sectional drawing which shows the modification of 5th Embodiment of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
However, the embodiment described below exemplifies an LED light emitting device for embodying the idea of the present invention, and the present invention is not limited to the configuration described below. In particular, the materials, shapes, relative arrangements, and the like of the constituent members described in the embodiments are merely illustrative examples, and are not intended to limit the scope of the present invention unless otherwise specified. In addition, the size and positional relationship of the members shown in each drawing may be exaggerated for easy understanding.

In the description, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted. Further, parts not related to the invention are omitted.
In each embodiment, “a cross-sectional view passing through the center line of the light emitting direction” is posted, but “light emitting direction” indicates the direction of arrow P in FIG. Further, “a cross-sectional view passing through the center line” indicates a YY ′ cross section of FIG.

[Description of First Embodiment: FIG. 1]
The LED light-emitting device 100 of 1st Embodiment is demonstrated using FIG. FIG. 1A shows a cross-sectional view passing through the center line in the light emitting direction of the LED light emitting device 100, and FIG. 1B shows a cross-sectional view taken along a cutting line AA ′ in FIG. Moreover, FIG.1 (c) is a perspective view explaining the cross section of Fig.1 (a) (common to each embodiment).

  The feature of the first embodiment is that the lower surface of the wavelength conversion member 3 and the upper surface of the substrate 20 are connected by a translucent heat conducting member 4.

  As shown in FIG. 1A, the LED light emitting device 100 includes a substrate 20 provided with a bonding pad (not shown) on an upper surface (mounting surface), a plurality of LED elements 1 mounted on the bonding pad, and a through hole 10. A frame body 2 joined to the substrate 20 so as to surround the plurality of LED elements 1, a wavelength conversion member 3 supported on the upper surface of the frame body 2 and joined apart from the light emitting surface of the LED element 1, and a wavelength The light-transmitting heat conductive member 4 connects the center of the lower surface of the conversion member 3 and the center of the upper surface of the substrate 20.

  As the plurality of LED elements 1 mounted on the substrate 20, for example, an ultraviolet LED element or a blue LED element having a light emitting layer made of a GaN-based material can be used. The plurality of LED elements 1 include, for example, Au bumps and can be mounted by flip chip mounting or the like. In the present embodiment, the light emitting surface of the LED element 1 and the lower surface of the wavelength conversion member 3 are spaced apart from each other, so that wire bonding mounting can be used without being limited to flip chip mounting.

  As the substrate 20, for example, a metal substrate having a high thermal conductivity whose surface is oxidized and insulated is used. A bonding pad, an input electrode, a wiring for connecting them, etc. are not shown using a through-hole technique, a photolithography technique, or the like. Is formed. A recess 12 for positioning the heat conducting member 4 is provided at the center of the substrate 20. The frame body 2 uses, for example, a metal having high thermal conductivity and light reflectivity, has a through hole 10, and is made of, for example, solder, low-melting glass, or an adhesive having high thermal conductivity on the substrate 20. It is joined.

The wavelength conversion member 3 is made of, for example, a glass that contains a predetermined amount of phosphor uniformly and is formed into a flat plate having a predetermined thickness, and is bonded to the frame 2 with, for example, low-melting glass or an adhesive. ing. The heat conducting member 4 is made of a light transmissive member having high heat conductivity, such as glass or light transmissive ceramics, and the lower end side is positioned by fitting into a recess 12 provided in the substrate 20, solder, The upper end side is bonded to the lower surface of the wavelength conversion member 3 or joined by a low melting glass or a transparent adhesive.

  Moreover, as shown in FIG.1 (b), the some LED element 1 is arrange | positioned at the upper surface of the board | substrate 20 at matrix form, and the translucent heat conductive member 4 is arrange | positioned in the center. Further, the outer peripheral portion of the substrate 20 is disposed so that the frame body 2 having the through holes 10 surrounds the plurality of LED elements 1.

[Description of Operation: FIG. 1]
As shown in FIG. 1A, in the LED light emitting device 100, a plurality of LED elements 1 are mounted on a substrate 20 having a predetermined area. When a driving voltage is supplied to an input electrode (not shown), each LED element 1 emits blue light, for example. Although the LED element 1 emits light and generates heat, the wavelength conversion member 3 is disposed away from the light emitting surface of each LED element 1, so that it is not directly affected by the heat of the LED element 1. Also, most of the light from each LED element 1 is incident on the wavelength conversion member 3 directly or after being reflected by the inner surface of the frame 2. The light emitted from the LED element 1 excites the phosphor in the wavelength conversion member 3, emits excitation light (for example, yellow light) of a color different from that of the LED element 1, and does not encounter the phosphor. The light of the LED element 1 is mixed to emit light of a color different from the light of the LED element 1 (eg, white light). Further, part of the light of each LED element 1 is taken into the heat conducting member 4 and guided to the wavelength conversion member 3 to excite the phosphor, and part of the light passes through the heat conducting member 4. Thereby, it is difficult to make a shadow by the heat conducting member 5.

  On the other hand, in the wavelength conversion member 3, excitation heat is generated along with the emission of excitation light. A part of this excitation heat is radiated from the outer periphery of the wavelength conversion member 3 to the substrate 20 via the frame 2, but the excitation heat accumulates near the center of the wavelength conversion member 3 away from the frame. Cheap. Here, the heat conduction member 4 provided so as to connect the center of the wavelength conversion member 4 and the center of the substrate 20 can efficiently release excitation heat from the heat conduction member 4 to the substrate 20. Thus, since the wavelength conversion member 3 improves heat dissipation, the brightness of the excitation light can be increased.

[Description of effects]
With the LED light emitting device 100 having such a structure, a part of emitted light is taken in by the heat conducting member 4 and guided to the wavelength conversion member 3, and a part of the light is transmitted. Thereby, the shadow by a heat conductive member can be made difficult. Further, in the conventional heat radiation route in which the heat of the wavelength conversion member is released only to the frame body, the excitation heat that tends to accumulate near the center of the wavelength conversion member 3 passes through the heat conduction member 4 in contact with the center of the wavelength conversion member. Thus, it can escape to the center of the substrate 20. As a result, the temperature quenching of the wavelength conversion member 3 is reduced, so that a reduction in luminous efficiency can be prevented. As a result, it is possible to increase the luminance in a predetermined substrate area without reducing the light emission efficiency, and to provide a light emitting device useful as a general illumination light source.

In addition, although the recessed part 12 was provided in the board | substrate 20, and the heat conductive member 4 was positioned, it is not limited to this, Even if it positions and adhere | attaches using a jig | tool etc., without providing the recessed part 12. Good. In addition, when using a low-melting glass or a transparent adhesive in joining the upper end surface of the heat conducting member 4 and the lower surface of the wavelength converting member 3, the refractive index is set to avoid adverse effects such as refraction or interface reflection on the joining surface. It is desirable to select materials that are close to each other. Further, the shape of the through hole 10 of the frame 2 is not limited to a square shape as shown in the figure, and may be a circular shape or other shapes. The plurality of LED elements 1 are not limited to the arrangement and number as shown in the figure, and are preferably determined in consideration of luminance and heat dissipation. Moreover, although the heat conductive member 4 was made into the column shape, it is not limited to this, A prism shape may be sufficient, and it is preferable to determine a diameter (or cross-sectional area) in consideration of a brightness | luminance and heat dissipation. Further, the heat conducting member 4 may be disposed at a position other than the center of the wavelength conversion member 3 and the substrate 20, for example, may be disposed so as to contact the frame, but is disposed at the center of the wavelength conversion member 3 and the substrate 20. Sometimes the heat of excitation of the wavelength conversion member 3 can be radiated most efficiently.

Here, although not particularly limited, main materials used for the substrate 20 are listed.
For example, a material in which an oxide film of Al ₂ O ₃ is formed on aluminum, which is a metal, or Al ₂ O ₃ , AlN, or the like, which is a material having higher thermal conductivity and high reflectivity. desirable.
Further, although not particularly limited, main materials used for the frame 2 are listed.
For example, aluminum, which is a metal, Al ₂ O ₃ , AlN, which is ceramic, or the like, which is preferably a material having higher thermal conductivity and high reflectivity.
Moreover, although not specifically limited, main materials used for the wavelength conversion member 3 are listed.
For example, glass containing a phosphor, a sheet containing a phosphor in a silicone resin affixed to sapphire, a silicone resin containing a phosphor, etc. A material having high thermal conductivity is desirable.
Further, although not particularly limited, main materials used for the heat conducting member 4 are listed.
For example, it is sapphire, glass, translucent ceramics, etc., and it is desirable that it has higher thermal conductivity and is more transparent.
The main material used for each member mentioned above is applicable also to the member used for other embodiment or the modification demonstrated below.

[Description of Second Embodiment: FIG. 2]
Next, the LED light-emitting device 200 of 2nd Embodiment is demonstrated using FIG. 2A shows a cross-sectional view passing through the center line in the light emitting direction of the LED light-emitting device 200, and FIG. 2B shows a cross-sectional view taken along the cutting line BB ′ in FIG. 2 (c) shows a cross-sectional view taken along the section line CC 'in FIG. 2 (a).

  The LED light emitting device 200 according to the second embodiment has a two-layer structure using two substrates, and heat conduction between the lower surface of the wavelength conversion member 3 and the upper surface of the lower substrate 30 (first substrate). This is the point that the upper substrate 40 (second substrate) is penetrated and connected by the member 5. Further, the heat conducting member 5 is also in contact with the second substrate 40. The upper layer side of the LED light emitting device 200 from the second substrate 40 is basically the same as that of the LED light emitting device 100, and therefore, the same elements are denoted by the same reference numerals or the same reference numerals and redundant description is omitted.

  As shown to Fig.2 (a), the LED light-emitting device 200 is equipped with the 2nd board | substrate 40 which provided the through-hole 14 in the center, and mounted several LED element 21 (2nd LED element), and the 2nd board | substrate 40. A substrate 30 having a recess 12 at the center and mounting a plurality of LED elements 11 (first LED elements), a frame 2 bonded to the upper surface of the second substrate 40, and a first substrate A frame 2a joined between the second substrate 40, a wavelength conversion member 3 joined to the upper surface of the frame 2 so as to be separated from the light emitting surface of the second LED element 21, and a wavelength conversion The lower surface of the member 3 and the upper surface of the first substrate 30 are connected to each other through the second substrate 40, and the light-transmitting heat conductive member 5 having the light scattering agent 9 at the upper end is formed. .

As shown in FIG. 2B, the arrangement and mounting method of the LED elements 1 mounted on the second substrate 40 are the same as those of the LED light emitting device 100 (see FIG. 1). As shown in FIG. 2C, the arrangement and mounting method of the LED elements 1 mounted on the first substrate 30 are the same as those of the LED light emitting device 100.
2A, the material used for the first substrate 30 and the second substrate 40 and the material used for the frame 2 and the frame 2a are the same as those of the LED light emitting device 100. The bonding method is the same.

  The heat conductive member 5 is made of a light-transmitting member having high heat conductivity such as glass or light-transmitting ceramics, and the lower end side passes through the through hole 14 provided in the second substrate 40. Furthermore, it is fitted and positioned in the concave portion 12 formed in the first substrate 30 and bonded by, for example, solder, low melting point glass, or an adhesive having high thermal conductivity. On the other hand, the upper end side of the heat conducting member 5 is provided with a light scattering agent 9 and is in contact with the wavelength conversion member 3 or joined by a low melting point glass, a transparent adhesive or the like. The light scattering agent 9 is used, for example, by adding a predetermined amount of a reflective member such as alumina particles to a translucent member similar to the heat conducting member 5.

[Description of Operation: FIG. 2]
As shown to Fig.2 (a), the some 1st LED element 11 and the 2nd LED element 21 are each mounted in the 1st board | substrate 30 and the 2nd board | substrate 40 which have a predetermined area, When a voltage is supplied to an input electrode (not shown), the first LED element 11 and the second LED element 21 mounted on the lower first substrate 30 and the upper second substrate 40 emit light. The light emitting operation of the second substrate 40 on the upper layer side is the same as that of the LED light emitting device 100 described above. Light emission from the first LED element 11 mounted on the first substrate 30 on the lower layer side is taken into the light-transmitting heat conductive member 5 and guided toward the wavelength conversion member 3 if not all. . And between the 2nd board | substrate 40 and the wavelength conversion member 3, the light taken in from each 1st LED element 11 of the 1st board | substrate 30, and each LED element 21 of the 2nd board | substrate 40 were taken in. Light merges. Therefore, as compared with the LED light emitting device 100 described above, the amount of light can be increased and the luminance can be increased at the joint between the wavelength conversion member 3 and the heat conducting member 5 (or the light scattering agent 9). Here, since the light scattering agent 9 is used by containing particles having reflectivity such as alumina particles, for example, a part of the increased light is diffused in a region (light scattering agent portion) below the bonding portion. be able to. As a result, the light guided to the heat conducting member 5 can be diffused and incident on a region away from the joint with the wavelength conversion member 3.

  On the other hand, in the wavelength conversion member 3, excitation heat is generated along with the emission of excitation light. Part of this excitation heat is radiated from the wavelength conversion member 3 to the first substrate 30 and the second substrate 40 through the frame 2 and the frame 2a, but the center of the wavelength conversion member 3 is away from the frame. Excitation heat tends to accumulate in the vicinity. Here, the heat conduction member 5 provided in contact with the center of the wavelength conversion member 3 can efficiently release the excitation heat from the heat conduction member 5 to the first substrate 30 and the second substrate 40. A part of light emitted from each LED element 21 on the upper layer side of the second substrate 40 is taken into the heat conducting member 5 and guided to the wavelength conversion member 3. At this time, the heat conducting member 5 Since it has optical properties, it is difficult to make a shadow by the heat conductive member 5.

[Description of effects]
With such a structure, the LED light emitting device 200 can increase luminance by increasing the amount of light emitted by the two-layer structure. In addition, the light scattering agent 9 diffuses the light entering the heat conducting member 5 out of the light emitted from the first LED element 11 and the second LED element 21, thereby reducing luminance unevenness and color unevenness. Can do. On the other hand, as in the LED light emitting device 100 described above, the heat dissipation route of the excitation heat of the wavelength conversion member 3 is conventionally only the frame body 2, whereas the first substrate via the heat conductive member 5. Since a heat dissipation route for escaping to the 30 and the second substrate 40 is formed, it is possible to prevent a decrease in light emission efficiency due to temperature quenching. Moreover, since the heat conductive member 5 has translucency, the shadow by a heat conductive member can be made difficult. As a result, it is possible to increase the luminance in a predetermined substrate area without reducing the light emission efficiency, and to provide a light emitting device useful as a general illumination light source.

The light scattering agent 9 may be formed by adhering a member containing light scattering particles uniformly to a translucent member similar to the heat conduction member 5 or light scattering particles in a predetermined region of the heat conduction member 5. It may be one containing. Moreover, although the position of the light scattering agent 9 is the upper end side of the heat conducting member 5, the present invention is not limited thereto, and may be any position between the lower surface of the wavelength conversion member 3 and the upper surface of the second substrate 40. Depending on the case, it may not be provided. Moreover, although the recessed part 12 was provided in the 1st board | substrate 30, and the heat conductive member 5 was positioned, it is not limited to this, It positions using a jig | tool etc. without providing a recessed part, and adhere | attaches with an adhesive agent etc. May be. Moreover, the shape of the through-hole 10 of the frame body 2 and the frame body 2a is not limited to a square shape as shown in the figure, and may be a circular shape or other shapes. Further, the plurality of first LED elements 11 and the second LEDs 21 mounted on the first substrate 30 and the second substrate 40 are not limited to the arrangement and the number as shown in the figure, and consider the luminance and heat dissipation. It is preferable to decide. Moreover, although the heat conductive member 4 was made into the column shape, it is not limited to this, It is good also as a prism shape or a polygonal column shape. In the present embodiment, a two-layer structure using two substrates is used. However, the present invention is not limited to this, and a plurality of layers of three or more layers may be used.

Here, although not particularly limited, main materials used for the light scattering agent are listed.
For example, alumina particles and titanium oxide particles.

[Description of Modification of Second Embodiment: FIG. 3]
Next, an LED light emitting device 210 according to a modification of the second embodiment will be described with reference to FIG.
3A shows a cross-sectional view passing through the center line in the light emitting direction of the LED light-emitting device 210, and FIG. 3B shows a cross-sectional view taken along the section line DD ′ of FIG. 3 (c) is a cross-sectional view taken along a cutting line EE ′ of FIG. 3 (a).

  The feature of the LED light emitting device 210 of the modification of the second embodiment is that the number of heat conducting members is increased with respect to the LED light emitting device 200. Since the LED light emitting device 210 has the same basic configuration as the LED light emitting device 200, the same elements are denoted by the same reference numerals or the same reference numerals, and redundant description is omitted.

  As shown in FIG. 3A, the LED light emitting device 210 is added with a heat conducting member 6 having translucency on both sides of the heat conducting member 5 as compared with the LED light emitting device 200 described in the second embodiment. ing. 3B and 3C, it can be seen that the heat conducting member 6 is disposed through the second substrate 45 at the four corners of the first substrate 35. FIG. Each of these four heat conducting members 6 passes through a through hole 14 (shown by a broken line) provided in the second substrate 45 and connects the lower surface of the wavelength conversion member 3 and the upper surface of the first substrate 35. doing. Further, the lower end sides of the four heat conducting members 6 are fitted and positioned in the recesses 12 (shown by broken lines) provided in the first substrate 35 in the same manner as the heat conducting members 5, solder, low melting glass, or Bonded with an adhesive having high thermal conductivity. Further, the upper end side is in contact with the wavelength conversion member 3 or joined by a low melting point glass, a transparent adhesive or the like.

  The LED light emitting device 210 has such a structure, so that the light from the upper-layer-side second LED element 21 and the lower-layer-side first LED element 11 is efficiently transmitted by the heat conducting member 5 and the heat conducting member 6. Since the light can be taken in and guided to the wavelength conversion member 3, the luminance can be further increased. In addition, since light is dispersed at the joint between the wavelength conversion member 3, the heat conducting member 5, and the plurality of heat conducting members 6, the heat conducting member reduces luminance unevenness and color unevenness more than in the second embodiment. I can do it. On the other hand, since the excitation heat generated in the wavelength conversion member 3 can be efficiently released from the heat conducting member 5 and the heat conducting member 6 to the first substrate 35 and the second substrate 45, the heat dissipation is further improved and the temperature is increased. A decrease in luminous efficiency due to quenching can be prevented. Moreover, since the heat conductive member 5 and the heat conductive member 6 have translucency, the shadow by a heat conductive member can be made difficult. As a result, the luminance can be further improved in a predetermined substrate area without reducing the light emission efficiency, and a light-emitting device useful as a general illumination light source can be provided.

The diameter of the heat conducting member 6 is slightly smaller than that of the heat conducting member 5. However, the diameter is not limited to this, and it is preferable to determine the respective cross-sectional areas in consideration of luminance and heat dissipation.
Moreover, although the heat conductive member 6 was arrange | positioned spaced apart with respect to the frame 2 or the frame 2a, it is not limited to this, You may make it contact the frame 2 or the frame 2a. Moreover, although the light-scattering agent 9 is not arrange | positioned at the upper end side of the four heat conductive members 6, you may arrange | position as needed in consideration of a brightness | luminance and heat dissipation. Moreover, although each heat conductive member 6 was made into the column shape, it is not limited to this, It is good also as a prism shape.

  Moreover, arrangement | positioning of the heat conductive member 5 and the heat conductive member 6 is not limited to arrangement | positioning as shown in FIG.3 (b), The heat conductive member 5 or the heat conductive member 6 can be arrange | positioned suitably. Moreover, since heat dissipation improves by arrange | positioning the heat conductive member 5 or the heat conductive member 6, you may use resin, such as silicone, for the frame 2 or the frame 2a, for example.

[Description of Third Embodiment: FIG. 4]
Next, the LED light-emitting device 300 of 3rd Embodiment is demonstrated using FIG. 4A shows a cross-sectional view passing through the center line in the light emitting direction of the LED light-emitting device 300, and FIG. 4B shows a cross-sectional view taken along the section line FF ′ in FIG. 4 (c) is a cross-sectional view taken along a cutting line GG ′ in FIG. 4 (a).

  The LED light emitting device 300 according to the third embodiment is characterized in that the light emitting surface of the first LED element 11 mounted on the lower substrate 50 faces the heat conducting member 5 with respect to the LED light emitting device 200. This is the point where the upper surface of 50 is inclined. Since the LED light emitting device 300 has the same basic configuration as that of the LED light emitting device 200, the same elements are denoted by the same reference numerals or the same reference numerals, and redundant description is omitted.

  As shown in FIG. 4A and FIG. 4B, the LED light emitting device 300 has the same structure as that of the LED light emitting device 200 described above (see FIG. 2). On the other hand, in the structure on the lower layer side than the second substrate 40, the two surfaces of the mounting surface of the first substrate 50 are inclined toward the heat conducting member 5. Further, as shown in FIG. 4C, the four inclined surfaces of the first substrate 50 are inclined to face each other. As described above, a predetermined number of first LED elements 11 are mounted on the four inclined mounting surfaces, and the light emitting surfaces of the first LED elements 11 are arranged toward the heat conducting member 5.

  Further, as shown in FIG. 4A, the frame 2b having the lower through-hole 10 has a lower surface that is inclined and comes into contact with four inclined surfaces of the substrate 50, and an upper surface that is in contact with the lower surface of the substrate 30. Each is joined by an adhesive or the like. Although not specifically shown, bonding pads, input electrodes, wirings for connecting them, and the like are formed on the substrate 30 and the substrate 50 using a through-hole technique, a photolithography technique, and the like, and the side surfaces of the substrate and the frame body are used. Thus, electrical connection with the outside can be made.

  With the LED light emitting device 300 having such a structure, the light emitted from the LED element 11 on the lower layer side than the second substrate 40 is more efficiently taken into the translucent heat conducting member 5. The brightness can be increased. As a result, in a predetermined substrate area, the luminance can be further improved without reducing the light emission efficiency, and a light emitting device useful as a general illumination light source can be provided.

  In addition, although the slope of the lower substrate 50 has been described as four slopes, the invention is not limited to this, and other slope shapes having the same purpose such as a mortar shape may be used.

[Explanation of Fourth Embodiment: FIG. 5]
Next, the LED light-emitting device 400 of 4th Embodiment is demonstrated using FIG. FIG. 5A shows a cross-sectional view through the center line of the light emitting direction of the LED light emitting device 400, and FIG.
FIG. 5C shows a cross-sectional view taken along a cutting line HH ′ in FIG. 5A, and FIG. 5C shows a cross-sectional view taken along a cutting line II ′ in FIG.

  The LED light emitting device 400 of the fourth embodiment is characterized in that the LED light emitting device 200 includes a recess surrounding the periphery of the heat conducting member 5 on the upper surface of the lower first substrate 60, and the inner wall surface of the recess. The light emitting surface of the first LED element 11 is arranged so as to face the heat conducting member 5. Since the LED light emitting device 400 has the same basic configuration as the LED light emitting device 200, the same elements are denoted by the same numbers or the same reference numerals, and redundant description is omitted.

  As shown in FIGS. 5A and 5B, the LED light emitting device 400 has the same structure as that of the LED light emitting device 200 described above (see FIG. 1). On the other hand, in the structure on the lower layer side of the second substrate 40, the recess 13 is formed in the central portion of the substrate 60, and the mounting surface of the LED element 1 is parallel to the longitudinal direction of the heat conducting member 5. Further, the light emitting surface of the LED element 1 is disposed so as to contact the outer peripheral surface of the heat conducting member 5. Further, as shown in FIG. 5C, the LED elements 1 mounted on the four inner wall surfaces of the recess 13 formed in the first substrate 60 on the lower layer side are in contact with the outer peripheral surface of the heat conducting member 5. Yes.

  As shown in FIG. 5A, in the present embodiment, since the second substrate 40 is directly disposed on the first substrate 60, the lower frame is not necessary. Although not shown in particular, the substrate 60 is divided in the longitudinal direction around the heat conducting member 5 (for example, divided into two, divided into four, etc.) to expose the mounting surface, thereby mounting the first LED element 11. Can be made easier. On the second substrate 40 and the first substrate 60, bonding pads, input electrodes, wirings for connecting them, and the like are formed by using a through-hole technique, a photolithography technique, and the like. Each divided surface can be electrically connected.

  Since the LED light emitting device 400 has such a structure, light can be directly incident from the first LED element 11 to the heat radiating member 5, so that the light is more efficiently taken into the heat conducting member 5 to increase the luminance. Can do. On the other hand, the excitation heat in the wavelength conversion member 3 can be efficiently released to the first substrate 60 and the second substrate 40 by the heat conducting member 5, and the heat of the first LED 11 can also be released from the first substrate 60. In addition, it can escape to the heat radiating member 5. Furthermore, since the second substrate 40 is directly disposed on the first substrate 60 without a frame as described above, the heat generated from the second LED element 21 is more than that of the second embodiment. It becomes easy to radiate heat to the first substrate 60. Accordingly, the light emission efficiency of the wavelength conversion member 3, the first LED element 11, and the second LED element 21 is improved. As a result, in a predetermined substrate area, the luminance can be further improved without reducing the light emission efficiency, and a light emitting device useful as a general illumination light source can be provided.

  In addition, although the description has been given with the concave portion 13 of the first substrate 60 being one place, the present invention is not limited to this, and as described in the modification of the second embodiment 2 (see FIG. 3), a plurality of heat conducting members 6 are provided. It is also possible to form recesses 13 corresponding to the respective portions so that the first LED element 11 can be mounted. In addition, the first LED element 11 and the heat conducting member 5 are brought into contact with each other. However, the present invention is not limited to this, and the first LED element 11 and the heat conducting member 5 are arranged apart from the heat conducting member 5. It is good also as a structure filled with transparent resin etc. Moreover, although the heat conductive member 5 was made into the column shape, it is not limited to this, It is good also as a prismatic shape.

[Explanation of Fifth Embodiment: FIG. 6]
Next, the LED light-emitting device 500 of 5th Embodiment is demonstrated using FIG. 6A shows a cross-sectional view through the center line of the light emitting direction of the LED light emitting device 500, FIG. 6B shows a cross-sectional view along the section line JJ ′ of FIG. 6 (c) is a cross-sectional view taken along the cutting line KK ′ of FIG. 6 (a).

  The LED light emitting device 500 of the fifth embodiment is characterized in that the LED light emitting device 200 has a cross-sectional area from the lower surface of the second substrate 40 on the upper layer side to the upper surface of the first substrate 70 on the lower layer side. The heat conductive member 7 having a gradually increasing region is provided. Since the basic configuration of the LED light emitting device 500 is the same as that of the LED light emitting device 200, the same elements are denoted by the same reference numerals or the same reference numerals, and redundant description is omitted.

  As shown in FIG. 6A and FIG. 6B, the LED light emitting device 500 has the same structure as that of the LED light emitting device 200 described above (see FIG. 2). On the other hand, as shown in FIG. 6A and FIG. 6C, the structure on the lower layer side of the second substrate 40 has a plurality of first LED elements 11 mounted on the mounting surface of the substrate 70 to conduct heat conduction. The member 7 forms a conical portion having a region S where the cross-sectional area gradually increases between the lower surface of the substrate 40 and the upper surface of the substrate 70. Further, the heat conducting member 7 has a wide bottom surface 16 on the lower end side, and the bottom surface 16 includes a plurality of recesses 15 into which the LED elements 1 are inserted, and the bottom surface 16 is in contact with the substrate 70.

  As shown in FIG. 6A, the lower frame 2c is formed so as to cover the region S in which the cross-sectional area of the heat conducting member 7 gradually increases, and radiates heat from the heat conducting member 7 to the frame 2c. I'm doing better. The frame 2c is disposed so as to connect the lower surface of the substrate 40 and the upper surface of the substrate 70, and is joined by an adhesive or the like. Moreover, as shown in FIG.6 (c), since the wide bottom face 16 of the heat-conducting member 7 is circular, there is a restriction | limiting in the mounting number of the 1st LED element 11, and the board | substrate 30 of the LED light-emitting device 200 is limited. It is slightly less than the number of implementations.

  Since the LED light emitting device 500 has such a structure, the LED element 1 can be inserted into the concave portion 15 of the heat conducting member 7 so that the light emitting surface and the bottom surface of the concave portion 15 can be closely opposed to each other. The light emitted from the LED element 1 can be more efficiently guided to the heat conducting member 7 to increase the luminance. On the other hand, the excitation heat in the wavelength conversion member 3 can be efficiently released from the heat conducting member 7 to the second substrate 40, the frame 2 c, and the first substrate 70. In particular, since the conical portion having the region S of the heat conducting member 7 is in contact with the inner wall surface of the frame 2c, heat can be radiated more efficiently. As a result, in a predetermined substrate area, the luminance can be further improved without reducing the light emission efficiency, and a light emitting device useful as a general illumination light source can be provided.

  In addition, the reflective surface by a metal film may be formed in the outer peripheral surface of the area | region S part of the heat conductive member 7, and the light guide in the heat conductive member 7 can be performed more efficiently.

[Explanation of Modification of Fifth Embodiment: FIG. 7]
Next, an LED light emitting device 510 according to a modification of the fifth embodiment will be described with reference to FIG.
7A shows a cross-sectional view through the center line in the light emitting direction of the LED light-emitting device 510, and FIG. 7B shows a cross-sectional view along the cutting line LL ′ in FIG. 7 (c) shows a cross-sectional view taken along the cutting line MM ′ in FIG. 7 (a).

  The LED light emitting device 510 of the modification of the fifth embodiment is characterized in that the lower frame 2d has an opening 10 with respect to the LED light emitting device 500, and the cross-sectional area of the heat conducting member 7 gradually increases. The air layer 8 is provided on the outer periphery of S. Since the basic configuration of the LED light emitting device 510 is the same as that of the LED light emitting device 500, the same elements are denoted by the same numbers or the same reference numerals, and redundant description is omitted.

As shown in FIG. 7A, the LED light-emitting device 510 has the same structure as that of the LED light-emitting device 500 described above (see FIG. 6). On the other hand, the lower frame 2d has a through hole 10 and forms an air layer 8 without covering the outer periphery of the region S where the cross-sectional area of the heat conducting member 7 gradually increases. Further, the heat conducting member 7 and the first substrate 70 are configured by the LED light emitting device 5.
Same as 00. As described above, when the air layer 8 is provided on the outer peripheral portion of the region S where the cross-sectional area of the heat conducting member 7 gradually increases, light emitted from the bottom surface 16 side of the heat conducting member 7 enters the slope of the region S. Therefore, it is easy to cause total reflection, and light guide can be improved.

  As the reason, for example, most of the emitted light taken into the heat conducting member 7 reaches the inner surface of the region S where the cross sectional area of the heat conducting member 7 gradually increases. Here, when glass is used for the heat conducting member 7, the reached light is incident on the lower medium (air layer: n = 1) from the medium having a higher refractive index (glass: n = 1.5). The well-known Snell's law can be applied. Although detailed calculation is omitted, if the critical angle for total reflection is θc, θc = about 41.8 °, and light incident at an incident angle larger than the critical angle θc can be totally reflected and taken into the interior. Thereby, in the area | region S where a cross-sectional area increases gradually, more efficient light guide can be performed and the light leakage to the outer side of the area | region S can be reduced.

  With such a configuration, the LED light-emitting device 510 guides light emitted from the LED element 1 that has entered from the concave portion 15 formed on the bottom surface 16 of the heat conducting member 7 to the upper end side more efficiently. Can be increased. On the other hand, the excitation heat in the wavelength conversion member 3 can be efficiently released from the heat conducting member 7 to the second substrate 40, the frame 2 c, and the first substrate 70. As a result, in a predetermined substrate area, the luminance can be further improved without reducing the light emission efficiency, and a light emitting device useful as a general illumination light source can be provided.

  Although the bottom surface 16 of the heat conducting member 7 in the LED light emitting devices 500 and 510 has been described as being circular, the bottom surface 16 is not limited to this and may be a polygon such as a triangle or a quadrangle. In addition, it has been described that the heat conducting member 7 forms a conical upper portion between the lower surface of the second substrate 40 and the upper surface of the first substrate 70. Good.

  As mentioned above, although various embodiment of the LED light-emitting device and its modification example were explained in detail, the present invention is not limited to such embodiment and modification example, and the present invention is not limited to the detailed configuration, material, and quantity. Any change, combination, and deletion can be made without departing from the spirit of the invention. That is, the present invention is not limited to the embodiment or modification of the LED light emitting device described above, and it is not necessary to perform all of them, and various modifications and combinations are possible within the scope of the contents described in the claims. Can be omitted.

  The present invention relates to a light-emitting device that can be used for general illumination that emits light of a color different from the emission color of an LED element, such as white, by combining an LED element and various phosphors. However, it is suitable for lighting products that require high brightness without lowering the luminous efficiency.

DESCRIPTION OF SYMBOLS 1 LED element 2, 2a, 2b, 2c, 2d Frame body 3 Wavelength conversion member 4, 5, 6, 7 Heat conductive member (translucency)
8 Air Layer 9 Light Scattering Agent (Translucent Heat Conducting Member Containing Light Scattering Agent)
10, 14 Through-hole 11 First LED element 12, 13, 15 Recess 16 Bottom surface 20 Substrate 30, 35, 50, 60, 70 First substrate 40, 45 Second substrate 21 Second LED element 100, 200 210, 300, 400, 500, 510 LED light emitting device

Claims (8)

A first LED element and a second LED element;
A first substrate on which a plurality of the first LED elements are mounted;
A second substrate on the first substrate, wherein a plurality of second LED elements are mounted on the upper surface;
A wavelength conversion member disposed above the second substrate and spaced from the light emitting surface of the second LED element;
A frame that is provided so as to surround the plurality of second LED elements and supports the wavelength conversion member;
A light-transmitting heat conductive member, wherein the heat conductive member penetrates the second substrate and connects the lower surface of the wavelength conversion member and the upper surface of the first substrate. LED light emitting device.   The LED light-emitting device according to claim 1, wherein the upper surface of the first substrate is inclined so that the light-emitting surface of the first LED element faces the heat conducting member.   The upper surface of the first substrate is provided with a recess surrounding the periphery of the heat conducting member, and the first LED element is disposed on the inner wall surface of the recess so that the light emitting surface faces the heat conducting member. The LED light-emitting device according to claim 1.   The heat conducting member gradually increases in cross-sectional area from the second substrate toward the first LED element in a region above the light emitting surface of the first LED element and below the second substrate. The LED light-emitting device according to claim 1, further comprising a region.   5. The LED light-emitting device according to claim 1, wherein the heat conducting member includes a light scattering agent at an upper end connected to the wavelength conversion member. A substrate,
A plurality of LED elements mounted on the upper surface of the substrate;
A frame provided so as to surround the plurality of LED elements;
A wavelength conversion member held on the frame and placed away from the light emitting surface of the LED element; and
A translucent heat conducting member,
The LED device according to claim 1, wherein the heat conducting member connects a lower surface of the wavelength conversion member and an upper surface of the substrate.   The LED light-emitting device according to claim 1, wherein the heat conducting member is separated from the frame.   The LED light-emitting device according to claim 7, wherein the heat conducting member is disposed so as to be connected to a central portion of the wavelength conversion member.

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