JP2006339060A - Lighting system - Google Patents

Lighting system Download PDF

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Publication number
JP2006339060A
JP2006339060A JP2005163728A JP2005163728A JP2006339060A JP 2006339060 A JP2006339060 A JP 2006339060A JP 2005163728 A JP2005163728 A JP 2005163728A JP 2005163728 A JP2005163728 A JP 2005163728A JP 2006339060 A JP2006339060 A JP 2006339060A
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Japan
Prior art keywords
emitting diode
light emitting
diode chip
wiring
light
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Pending
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JP2005163728A
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Japanese (ja)
Inventor
Hajime Takasaki
一 高崎
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Akita Denshi Systems:Kk
株式会社アキタ電子システムズ
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Priority to JP2005163728A priority Critical patent/JP2006339060A/en
Publication of JP2006339060A publication Critical patent/JP2006339060A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a long-life and high-output white LED lighting system. <P>SOLUTION: In this lighting system, a plurality of light emitting diode chips are mounted on a wiring substrate facing an opening part of a case to irradiate illumination light out of a lens attached to the opening part. The wiring substrate is comprised of a metal plate and a wiring structure part provided in a first surface of the metal plate, a flat surface in which height does not change concentrically and first and second inclined face which are inclined to the flat surface are provided in the first surface of the metal plate and the light emitting diode chips are mounted on the surface of the wiring structure part corresponding to the surfaces. A metal body has a heat radiating fin in its outer periphery. A reflection film is formed in a surface of the wiring structure part 20 to reflect light from the light emitting diode chip to a lens. An optical output is increased by a plurality of light emitting diode chips and the reflected light. Heat generated by the light emitting diode chips is diffused outside through the metal body. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technology effective when applied to an illumination device, particularly an LED illumination device incorporating a plurality of light emitting diodes (LEDs).

  The light emitting diode can emit a desired color depending on the difference in the compound semiconductor used. These light emitting diodes are also used for illumination (for example, Patent Document 1).

  Patent Document 1 discloses an LED lighting device in which a substrate in which a plurality of light emitting diodes are arranged on one surface is attached to the inner bottom of a resin case via a heat radiation fixing plate. Light emitted from the plurality of light emitting diodes is transmitted through a transparent cover attached to the front surface of the resin case. In recent years, white LEDs with good color development have been developed (for example, Patent Document 2).

JP 2002-299700 A Japanese Patent Laid-Open No. 10-228249

  It is known that a white LED with good color can be produced by sealing an ultraviolet light emitting diode chip having a wavelength of around 400 nm with a transparent resin containing RGB (R: red, G: green, B: blue) phosphors. It has been. This is generally a structure sealed with a transparent resin such as an epoxy resin containing a phosphor. However, when heat dissipation is poor, deterioration occurs and the life is shortened. For this reason, a white LED lamp has the difficulty which cannot raise an output.

An object of the present invention is to provide a high-power white LED lighting device having a long lifetime.
The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

The following is a brief description of an outline of typical inventions disclosed in the present application.
(1) The lighting device
A case having an opening in part,
A wiring board disposed facing the opening in the case;
A plurality of light emitting diode chips mounted on a surface facing the opening of the wiring board;
A lighting device having a transparent body attached to the opening and transmitting light emitted from the light emitting diode chip;
The wiring board is formed of a metal plate and a wiring structure portion formed on a first surface facing the opening of the metal plate and formed of a plurality of insulating layers and wiring, respectively.
The metal plate is formed concentrically on the first surface and has a flat surface that does not change in height, a first inclined surface that is inclined with respect to the flat surface, and a first inclined surface that is inclined with respect to the flat surface. 2 inclined surfaces,
A plurality of electrode pads connected to each electrode of the light emitting diode chip by the wiring are provided on the surface of the wiring structure portion corresponding to the flat surface, the first inclined surface, and the second inclined surface,
A reflective film that reflects light is provided on the surface of the wiring structure portion corresponding to the flat surface, the first inclined surface, and the second inclined surface,
Each electrode of the light emitting diode chip is connected to the electrode pad.

  The light emitting diode chip is a light emitting diode having a wavelength of 400 nm, the transparent body is a lens, and a phosphor plate kneaded with RGB phosphors is disposed between the lens and the wiring board. . The light emitting diode chip is a light emitting diode chip having an electrode of a flip chip connection structure having electrodes of different polarities on the lower surface, and the electrode pad provided on the surface of the wiring structure portion has an electrode of the flip chip connection structure. The array is connectable, and the predetermined electrode of the light emitting diode chip is overlapped and connected to the predetermined electrode pad. A plurality of the flat surface, the first inclined surface, and the second inclined surface are provided. The first inclined surface and the second inclined surface have an inclination of 45 degrees with respect to the flat surface. A part of the metal body is exposed on the outer peripheral surface of the case, and the surface is provided with unevenness to form a heat radiating fin. The case is provided with a battery accommodating portion for accommodating a battery for causing the light emitting diode chip to emit light, a wiring for connecting the battery and the light emitting diode chip is provided in the case, and an outer wall of the case is provided. A switch connected to the wiring for turning on and off the light emitting diode chip is provided.

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.
According to the means of (1), (a) light is emitted from each of the plurality of light emitting diode chips mounted on the wiring board, and the chip mounting surface is concentrically with the first surface of the metal plate. Light is reflected on the surface of the wiring structure portion formed to be the flat surface, the first inclined surface, and the second inclined surface, and corresponding to the flat surface, the first inclined surface, and the second inclined surface. A reflection film is provided, and part of the light emitted from the light-emitting diode chip mounted on each surface is reflected by the surface of the reflection film and travels in the lens direction, thereby increasing the light output of white light. be able to.

  (B) Since the light-emitting diode chip is not covered with a resin containing a phosphor, the ultraviolet light-emitting diode chip having a wavelength of 400 nm band hardly deteriorates, and the life of the lighting device can be extended.

  (C) The wiring board is composed of a metal plate and a wiring structure formed on the metal plate, a part of the metal plate is exposed on the outer peripheral surface of the case, and the surface is provided with unevenness to dissipate heat. It has a structure for forming fins. Accordingly, heat generated in each light emitting diode chip mounted on the wiring structure is quickly dissipated to the outside by the metal plate. As a result, since the light emission efficiency of the light emitting diode chip is maintained high, the output of the lighting device can be improved.

  (D) Since the reflection film has a structure formed on the surface of the wiring structure portion corresponding to the first inclined surface, the flat surface, and the second inclined surface formed concentrically, each of the light emitting diode chips. In comparison, a structure in which a reflection film (reflection plate) is formed is inexpensive.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment of the invention, and the repetitive description thereof is omitted.

  1 to 6 are diagrams related to the illumination apparatus of the first embodiment. FIG. 1 is a side view showing an external view of a part of the lighting device as a cross section, and FIG. 2 is a schematic diagram showing an electrical connection configuration in the lighting device. FIG. 3 is a schematic cross-sectional view showing a light emitting state of a plurality of light emitting diode chips mounted on a wiring board. FIGS. 4A to 4B are a plan view, a bottom view, and a side view showing the light emitting diode chip. FIG. 5 is a schematic view showing an arrangement state of a plurality of light emitting diode chips by flip-chip connection with respect to a wiring board. FIG. 6 is a cross-sectional view showing a flip chip connection structure of a light emitting diode chip.

  The illumination device according to the first embodiment relates to an LED illumination device using a light emitting diode chip as a light source. The illumination device 1 has a configuration in which a lens 3 made of a transparent body is attached to the front end side of the case 2 and the illumination light 4 having a predetermined irradiation angle is irradiated on the front surface side of the lens 3. In addition, a detachable lid 5 is attached to the rear end of the case 2. The dry battery 6 can be stored in the case 2 by removing the lid 5. Although not shown, the lid 5 can be attached and removed by, for example, screwing with a screw structure.

  As shown in FIG. 1, the case 2 has a structure having a disk-shaped metal body (metal plate) 10 near the front end. As shown in FIGS. 1 and 3, the metal body 10 has a front end fitting portion 11 and a rear end fitting portion 12 having a slightly smaller diameter on the front end side and the rear end side. As shown in FIG. 3, a recess 13 is provided on the surface of the rear end fitting portion 12. A guide hole 14 communicating with the recess 13 is provided along the radial direction of the metal body 10. The outer end of the guide hole 14 is exposed and opened on the outer peripheral surface of the front end fitting portion 11.

  Further, as shown in FIG. 3, one end side of a cylindrical body 15 made of a resin cylinder is inserted into and fitted into the rear end fitting portion 12 and fixed by an adhesive (not shown) or the like. The lid 5 is detachably attached to the other end of the cylindrical body 15. A switch 16 is attached to the outer peripheral surface of the cylinder 15 as shown in FIG. In addition, as shown in FIG. 2, a plurality of dry batteries 6 can be inserted into the cylinder 15 in series. In the figure, three dry batteries 6 are accommodated in series. Although not shown, a terminal that is in electrical contact with the cathode of the dry battery 6 is provided on the inner bottom of the lid 5. This terminal is connected to one electrode terminal of the switch 16 by a wiring 17 made of a cord or the like (see FIG. 2).

  On the surface of the front end fitting portion 11 of the metal body 10, that is, the first surface 10a, a wiring structure portion 20 having a predetermined thickness is provided as schematically shown in FIG. As shown in FIG. 6, the wiring structure portion 20 is formed of a plurality of layers of insulating films 21 a to 21 c and a wiring 22 formed of a plurality of layers of conductor layers 22 a, 22 b, 22 c, and is exposed to the surface. The electrode 25 of the light emitting diode chip 23 is connected to 22e. The electrode pad 22e is a portion where the conductor layer 22b is exposed at a portion where the uppermost insulating film 21c is opened. In order to improve the flip-chip connection on the surface of the electrode pad 22e, a plating film such as Au may be formed. The insulating film is formed of a resin having a thickness of about 40 to 100 μm, and the conductor layer is formed of a plating film of Cu and Au having a thickness of about 20 to 40 μm. These layers are formed by, for example, a screen printing method or the like and subsequent baking treatment. Alternatively, details are formed by plating, photolithography, or etching.

  As shown in FIG. 4, the light-emitting diode chip 23 has a flip-chip connection structure in which all the electrodes 25 are provided on one surface of the semiconductor chip 24 (lower surface: see FIG. 4C). As shown in FIG. 4, the electrode 25 includes two different types of electrodes, that is, an anode electrode 25a and a cathode electrode 25b. In the first embodiment, one anode electrode 25a and three cathode electrodes 25b are provided. However, the present invention is not limited to this. By applying a predetermined voltage to the anode electrode 25a and the cathode electrode 25b, the light emitting diode chip 23 emits light 26 from the upper surface of the semiconductor chip 24 as shown by the arrows in FIG. The light emitting diode chip 23 emits near ultraviolet light in the 370 to 400 nm band as the light 26.

  In terms of structure, the electrode 25 includes a base electrode 25f provided on the lower surface of the semiconductor chip 24 and a bump electrode 25g formed over the base electrode 25f, as shown in FIG. As the bump electrode 25g, for example, a hemispherical bump electrode 25g can be formed by stacking solder balls on the base electrode 25f and temporarily melting (reflowing) the solder balls.

  This is one of the features of the present invention. As shown in FIG. 6, a reflective film 27 is provided on the surface of the wiring structure portion 20 outside the mounting region of the light emitting diode chip 23. The reflective film 27 is a film that reflects light 26 emitted around the light-emitting diode chip 23, and is formed of, for example, a silver (Ag) film having good reflectivity. This film is selectively formed on the surface of the wiring structure portion 20, that is, on the insulating film 21c. In other words, the conductive Ag layer is widely formed as long as it does not contact the wiring. The reflective film 27 is formed in a desired pattern by forming a film (Ag layer) having a thickness of about 20 μm by sputtering or vapor deposition and selective etching.

  The wiring structure portion 20 includes conductor layers 22a and 22c (wiring) electrically connected to the anode electrode 25a of the light-emitting diode chip 23 and a conductor layer 22b (wiring) electrically connected to the cathode electrode 25b. However, some of these conductor layers 22b and 22c also extend to the surface of the wiring structure portion 20, and are electrically connected to wirings 30 and 31 (see FIG. 3) such as cords, respectively. And the wiring 30 connected to the conductor layers 22a and 22c is connected to the other electrode of the switch 16 and the anode electrode side of the dry battery 6 as shown in FIG. Moreover, the wiring 31 connected to the conductor layer 22b is connected to the cathode electrode side of the dry battery 6 as shown in FIG. As shown in FIG. 3, the wires 30 and 31 extend from the outer peripheral surface side of the front end fitting portion 11 through the guide hole 14 and the recess 13 toward the dry battery 6 and the switch 16. FIG. 2 is a diagram schematically showing a state in which each electrode 25 of each light-emitting diode chip 23 is electrically connected to one of the wirings 30 and 31.

  In the first embodiment, the wiring board 35 is formed by the above-described metal body 10 and the above-described wiring structure portion 20 provided on the first surface 10a side of the metal body 10.

  On the other hand, an opening 36 is formed on the front end side of the case 2. This opening portion 36 is a space portion on the inner peripheral surface side of the front portion of the cylindrical cover 37 whose rear inner peripheral surface is fixed to the outer peripheral surface of the front end fitting portion 11 of the metal body 10 via the engaging portion 38. Is formed by. The lens 3 is fitted in the front portion of the cover 37. A phosphor plate 39 is disposed between the lens 3 and the wiring board 35. The phosphor plate 39 is a transparent plate in which red (R), green (G), and blue (B) phosphors are kneaded. The phosphor plate 39 emits light from the light-emitting diode chip 23 and passes (transmits) the phosphor plate 39. In doing so, there is an effect of making white light with good color developability by the action of the RGB phosphor.

  The locking portion 38 that fixes the cover 37 to the front end fitting portion 11 of the metal body 10 includes, for example, a male screw provided on the outer peripheral surface of the front end fitting portion 11 and a female screw provided on the inner peripheral surface of the cover 37. It is formed by screwing. Further, the locking portion 38 may be fixed by an adhesive.

  As shown in FIG. 1, the cover 37 has a holding portion 37 a that supports the outer peripheral surface portion of the outer side of the lens 3. The restraining surface facing the lens 3 of the restraining portion 37 a is formed with a curvature substantially the same as the curvature of the lens 3 and is in close contact with the lens 3.

  A support ring 40 that supports a ring-shaped phosphor plate is placed on the front end fitting portion 11. The outer periphery of the support ring 40 has substantially the same dimensions as the inner peripheral surface of the cylindrical cover 37 and is accommodated in the cover 37. A fitting recess 40 a that fits and supports the outer peripheral portion of the phosphor plate 39 is provided on the inner peripheral upper surface of the support ring 40. The depth of the fitting recess 40 a is substantially the same as the thickness of the phosphor plate 39. Therefore, the phosphor plate 39 is positioned by inserting the phosphor plate 39 so as to fit the outer peripheral portion into the fitting recess 40a.

  On the support ring 40, a separator 41 made of a ring having substantially the same shape as the support ring 40 is placed. The separator 41 serves to set the distance between the lens 3 and the phosphor plate 39. Further, the separator 41 is made of a material having high elasticity. As a result, the support ring 40, the phosphor plate 39 and the separator 41 are overlapped on the surface side of the front end fitting portion 11, and the cover 37 is fixed to the front end fitting portion 11, thereby supporting the support ring 40, the phosphor plate 39 and the separator. 41 is elastically held between the holding portion 37a and the front end fitting portion 11 by the elasticity of the separator 41.

  On the other hand, the front end fitting portion 11 of the metal body 10 is an uneven surface. That is, the upper surface of the front end fitting portion 11 that is the first surface 10a of the metal body 10 is formed as a concentric circle as shown in FIGS. A first inclined surface 45; a flat surface 46 that continues to the first inclined surface 45 and does not change in height; and a flat second inclined surface 47 that continues to the flat surface 46 and gradually increases toward the outside. ing. In the cross section in the right radial direction from the center in FIG. 3, the first inclined surface 45 is 135 ° and the second inclined surface 47 is a 45 ° surface with respect to the flat surface 46.

  Since the first inclined surface 45, the flat surface 46, and the second inclined surface 47 are formed concentrically, the portion formed by the first inclined surface 45 is centered upward as shown in FIG. Protruding conical shape. The first inclined surface 45 and the second inclined surface 47 are inclined surfaces of 45 ° with respect to the flat surface 46, respectively.

  As a result, the upper surface of the wiring structure 20 formed on the first inclined surface 45, the flat surface 46, and the second inclined surface 47 is also changed to the first inclined surface 45, the flat surface 46, and the second inclined surface 47. It becomes the imitated surface. Further, the light emitting diode chip 23 is fixed to the upper surface of the wiring structure portion 20 corresponding to the first inclined surface 45, the flat surface 46, and the second inclined surface 47, respectively. A reflective film 27 is formed on the upper surface of the wiring structure portion 20 corresponding to the first inclined surface 45, the flat surface 46 and the second inclined surface 47. Therefore, the light 26 emitted from each light emitting diode chip 23 is reflected by the inclined surface and the flat surface. That is, the upper surface of the wiring structure portion 20 corresponding to the first inclined surface 45, the flat surface 46, and the second inclined surface 47 directs the light 26 emitted from the light emitting diode chip 23 toward the opening where the lens 3 is located. Thus, a reflecting mirror (reflector) is formed.

  FIG. 5 is a schematic view showing a mounting state of the light emitting diode chip 23 having the flip chip connection structure on the surface of the wiring structure portion 20. The state is shown in which the anode electrode 25a of the light-emitting diode chip 23 is connected to the wiring 30 indicated by a thin solid line, and the cathode electrode 25b of the light-emitting diode chip 23 is connected to the wiring 31 indicated by a thick solid line.

  On the other hand, in the illuminating device 1 according to the first embodiment, as shown in FIG. 3, the metal body 10 is partially exposed on the outer peripheral surface of the case 2, and the surface thereof is provided with irregularities so that the heat radiating fin 50. Is forming. Therefore, the heat generated in each light emitting diode chip 23 mounted on the wiring structure 20 is quickly dissipated to the outside by the metal body 10.

The lighting device of the first embodiment has the following effects.
(1) The light 26 is emitted from each of the plurality of light emitting diode chips 23 mounted on the wiring substrate 35, and the chip mounting surface is formed concentrically on the first surface 10a of the metal body 10, respectively. The surface 46, the first inclined surface 45, and the second inclined surface 47, and light is applied to the surface of the wiring structure unit 20 corresponding to the flat surface 46, the first inclined surface 45, and the second inclined surface 47. A reflective film 27 is provided to reflect, and part of the light 26 emitted from the light-emitting diode chip 23 mounted on each surface is reflected by the surface of the reflective film 27 and travels in the direction of the lens 3. The light output can be increased.

  (2) Since the light-emitting diode chip 23 is not covered with a resin containing a phosphor, the ultraviolet light-emitting diode chip 23 having a wavelength of 400 nm is unlikely to deteriorate and the life of the lighting device 1 can be extended.

  (3) The wiring board 35 includes a metal body (metal plate) 10 and a wiring structure portion 20 formed on the metal body 10, and a part of the metal body 10 is exposed on the outer peripheral surface of the case 2, And the surface is provided with the unevenness | corrugation, and it has the structure which forms the radiation fin 50. FIG. Therefore, the heat generated in each light emitting diode chip 23 mounted on the wiring structure 20 is quickly dissipated to the outside by the metal body 10. As a result, since the light emission efficiency of the light emitting diode chip 23 is maintained high, the output of the lighting device 1 can be improved.

  (4) The reflective film 27 has a structure formed on the surface of the wiring structure portion 20 corresponding to the first inclined surface 45, the flat surface 46, and the second second inclined surface 47 formed concentrically. In comparison with a structure in which a reflection film (reflection plate) is formed on each of the light emitting diode chips 23, the cost becomes lower.

  (5) Since the flat surface 46, the first inclined surface 45, and the second inclined surface 47 are further increased and the light emitting diode chip 23 is mounted on these surfaces, the light emitting area can be increased. Applicable to high output backlight.

  7 and 8 are partial views of the lighting device 1 according to the second embodiment of the present invention. The present embodiment 2 has the same configuration as that of the lighting device 1 of the embodiment 1 except that a structure in which the electrode of the light emitting diode chip is connected to an electrode pad provided on the surface of the wiring structure portion with a conductive wire. It is.

  In the second embodiment, the light-emitting diode chip 23 is a light-emitting diode chip having a structure having electrodes (anode electrode 25a and cathode electrode 25b) having different polarities on the upper surface, as shown in FIG. Then, the lower surface of the light emitting diode chip 23 on which no electrode is provided is connected to the surface of the wiring structure 20 (the surface of the insulating film 21c) via the adhesive 55.

The anode electrode 25a is electrically connected to the electrode pad 22e connected to the conductor layers 22a and 22c by a conductive wire 56. The cathode electrode 25b is electrically connected to the electrode pad 22e of the conductor layer 22b by a conductive wire 56. FIG. 7 is a schematic view showing a mounting state of the light emitting diode chip 23 having a wire bonding structure on the surface of the wiring structure portion 20. A state in which the anode electrode 25a of the light emitting diode chip 23 and the wiring 30 indicated by a thin solid line are connected by a wire 56, and the cathode electrode 25b of the light emitting diode chip 23 and a wiring 31 indicated by a thick solid line are connected by the wire 56 Indicates.
The lighting device 1 of the first embodiment also has the effect that the lighting device 1 of the first embodiment has.

FIG. 9 is a diagram of a part of the illumination device 1 according to the third embodiment. As shown in FIG. 9, the third embodiment has a structure in which a plurality of light emitting diode chips 23 having different emission colors are mounted on the surface of the wiring structure portion 20. In FIG. 9, R represents the light emitting diode chip 23 that emits red light, G represents the light emitting diode chip 23 that emits green light, and B represents the light emitting diode chip 23 that emits blue light. The light emitting diode chip 23 that emits red light is shown with dots, the light emitting diode chip 23 that emits blue light is shown with a thick diagonal line, and the light emitting diode chip 23 that emits green light is simply shown as a rectangle. is there. The arrangement of each color is not limited to the embodiment.
The illuminating device 1 according to the third embodiment can be used as illumination depending on the emission color (difference in color scheme).

  Further, in the third embodiment, as shown in the circuit block of FIG. 10, the R, G, and B light emitting diode chips 23 are connected to the control integrated circuit device 60 and the power supply integrated circuit 61, respectively. , And controlled by the control integrated circuit device 60 and the power supply integrated circuit 61, respectively, the lighting device 1 can be used as a white lamp and illumination.

  Light control is the function of constant current source, RBG dimming, feedback of current drop due to temperature, etc. to supply stable light and display the RBG in chronological order. A system that can express any color tone.

  Although the invention made by the present inventor has been specifically described based on the embodiment, the present invention is not limited to the embodiment described above, and various modifications can be made without departing from the scope of the invention. Nor. In the embodiment, the lens is arranged on the front end side of the case, but the transparent body may be a cover having no lens effect made of glass or transparent plastic.

It is a side view which makes a part of lighting device which is Example 1 of the present invention a section. It is a schematic diagram which shows the structure of the illuminating device of Example 1. FIG. FIG. 3 is a schematic cross-sectional view showing a light emitting state of a plurality of light emitting diode chips mounted on a wiring board in the illumination device of Example 1. It is a figure which shows the light emitting diode chip | tip incorporated in the illuminating device of Example 1. FIG. It is a schematic diagram which shows the arrangement | positioning state by the flip-chip connection of the several light emitting diode chip with respect to the wiring board in the illuminating device of Example 1. FIG. It is sectional drawing which shows the flip-chip connection structure of the said light emitting diode chip. It is a schematic diagram which shows the arrangement | positioning state by the wire bonding connection of the several light emitting diode chip | tip in the illuminating device which is Example 2 of this invention. It is sectional drawing which shows the wire bonding connection structure of the light emitting diode chip in the illuminating device of the present Example 2. It is a block diagram which shows the arrangement | positioning state of the light emitting diode chip | tip from which the light emission wavelength differs in the illuminating device of the present Example 3. It is a block diagram which shows the circuit structure of the illuminating device of the present Example 3.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Illuminating device, 2 ... Case, 3 ... Lens, 4 ... Illumination light, 5 ... Cover body, 6 ... Dry battery, 10 ... Metal body, 11 ... Front end fitting part, 12 ... Rear end fitting part, 13 ... Dimple , 14 ... guide hole, 15 ... cylinder, 16 ... switch, 17 ... wiring, 20 ... wiring structure, 21a-21c ... insulating film, 22 ... wiring, 22a, 22b, 22c ... conductor layer, 22e ... electrode pad, 23 ... Light emitting diode chip, 24 ... Semiconductor chip, 25 ... Electrode, 25a ... Anode electrode, 25b ... Cathode electrode, 25f ... Base electrode, 25g ... Bump electrode, 26 ... Light, 27 ... Reflective film, 30, 31 ... Wiring, 35 ... wiring board, 36 ... opening, 37 ... cover, 38 ... locking part, 39 ... phosphor plate, 40 ... support ring, 40a ... fitting recess, 41 ... separator, 45 ... first inclined surface, 46 ... Flat surface, 47 ... Second inclined surface, 50 Radiation fins 55 ... adhesive, 56 ... wire, 60 ... control integrated circuit device, 61 ... power supply integrated circuit, 62a to 62f ... wiring.

Claims (12)

  1. A case having an opening in part,
    A wiring board disposed facing the opening in the case;
    A plurality of light emitting diode chips mounted on a surface facing the opening of the wiring board;
    A lighting device having a transparent body attached to the opening and transmitting light emitted from the light emitting diode chip;
    The wiring board is formed of a metal plate and a wiring structure portion formed on a first surface facing the opening of the metal plate and formed of a plurality of insulating layers and wiring, respectively.
    The metal plate is formed concentrically on the first surface and has a flat surface that does not change in height, a first inclined surface that is inclined with respect to the flat surface, and a first inclined surface that is inclined with respect to the flat surface. 2 inclined surfaces,
    A plurality of electrode pads connected to each electrode of the light emitting diode chip by the wiring are provided on the surface of the wiring structure portion corresponding to the flat surface, the first inclined surface, and the second inclined surface,
    A reflective film that reflects light is provided on the surface of the wiring structure portion corresponding to the flat surface, the first inclined surface, and the second inclined surface,
    Each electrode of the light emitting diode chip is connected to the electrode pad.
  2.   The lighting device according to claim 1, wherein the transparent body is a lens.
  3. The light emitting diode chip is a light emitting diode having a wavelength of 400 nm,
    The transparent body is a lens;
    The illuminating device according to claim 1, wherein a phosphor plate kneaded with RGB phosphors is disposed between the lens and the wiring board.
  4. The light emitting diode chip is a light emitting diode chip having an electrode of a flip chip connection structure having electrodes of different polarities on the lower surface,
    The electrode pads provided on the surface of the wiring structure portion are arranged so that the electrodes of the flip-chip connection structure can be connected,
    The lighting device according to claim 1, wherein the predetermined electrode of the light emitting diode chip is overlapped and connected to the predetermined electrode pad.
  5. The light emitting diode chip is a light emitting diode chip having a structure having electrodes of different polarities on the upper surface and the lower surface which is the opposite surface,
    The electrode on the lower surface of the light emitting diode chip is connected to be overlapped on the predetermined electrode pad of the wiring structure part,
    The lighting device according to claim 1, wherein the electrode on the upper surface of the light emitting diode chip and the predetermined electrode pad of the wiring structure portion are connected by a conductive wire.
  6. The light emitting diode chip is a light emitting diode chip having a structure having electrodes of different polarities on the upper surface,
    The light emitting diode chip is connected to the surface of the wiring structure part via an adhesive,
    The lighting device according to claim 1, wherein the electrode of the light emitting diode chip is connected to a predetermined electrode pad of the wiring structure portion with a conductive wire.
  7.   The lighting device according to claim 1, wherein a plurality of the flat surface, the first inclined surface, and the second inclined surface are provided.
  8.   The lighting device according to claim 1, wherein the first inclined surface and the second inclined surface have an inclination of 45 degrees with respect to the flat surface.
  9.   2. The lighting device according to claim 1, wherein a part of the metal body is exposed on an outer peripheral surface of the case, and the surface is provided with unevenness to form a heat radiation fin.
  10.   The lighting device according to claim 1, wherein the light emitting diode chip is a light emitting diode chip of three types of light emitted in blue, red, and green.
  11. The case is provided with a battery accommodating portion for accommodating a battery for causing the light emitting diode chip to emit light,
    In the case, a wiring for connecting the battery and the light emitting diode chip is provided,
    The lighting device according to claim 1, wherein a switch connected to the wiring to turn on and off the light emitting diode chip is provided on an outer wall of the case.
  12. The light-emitting diode chip is a light-emitting diode chip of three kinds of blue, red and green colors of emitted light,
    The wiring structure section has a wiring structure in which the three types of light emission systems of blue, red, and green are divided.
    The three types of light emitting systems are connected to a power supply integrated circuit device and a control integrated circuit device, respectively.
    The control integrated circuit device controls light emission of the three types of light emission systems,
    The lighting device according to claim 1, wherein the integrated circuit device for power supply is configured to control power of three types of light emitting systems.
JP2005163728A 2005-06-03 2005-06-03 Lighting system Pending JP2006339060A (en)

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004503A (en) * 2007-06-20 2009-01-08 Sharp Corp Surface mounting light emitting diode and method of manufacturing the same
WO2009015524A1 (en) * 2007-07-27 2009-02-05 Si Chuan Sunfor Light Co., Ltd. A led illuminating lamp
JP2009302239A (en) * 2008-06-12 2009-12-24 Alps Electric Co Ltd Light source module
JP2010098313A (en) * 2008-10-15 2010-04-30 Samsung Led Co Ltd Led package module
JP2010526421A (en) * 2007-05-04 2010-07-29 ルード ライティング,インコーポレーテッド Sealing and heat adaptive configuration in LED elements
JP2010526408A (en) * 2007-05-02 2010-07-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Solid state lighting device
CN101840986A (en) * 2009-03-18 2010-09-22 株式会社东芝 Light emitting semiconductor device and manufacture method thereof
KR101020807B1 (en) * 2008-06-05 2011-03-09 주식회사 루미시스 Lamp device using LED
CN101463981B (en) * 2007-12-19 2011-03-23 富准精密工业(深圳)有限公司 LED module group with cooling structure
JP2013518415A (en) * 2010-01-25 2013-05-20 ヴィシャイ スプレイグ,インコーポレイテッドVishay Sprague,Inc. Metal substrate electronic element component package and manufacturing method thereof
KR101323401B1 (en) * 2006-12-29 2013-10-29 엘지디스플레이 주식회사 Light divice, method of fabricating the same, backlight unit and liquid crystal display divice having the same
JP2015022955A (en) * 2013-07-22 2015-02-02 日立金属株式会社 Light source device
JP2015029120A (en) * 2006-03-03 2015-02-12 株式会社半導体エネルギー研究所 Light-emitting device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139017U (en) * 1986-02-05 1987-09-02
JPS62285307A (en) * 1986-06-03 1987-12-11 Yamaha Motor Co Ltd Lamp apparatus for vehicle
JPH04163973A (en) * 1990-10-27 1992-06-09 Res Dev Corp Of Japan Variable color light emitting diode
JPH051598U (en) * 1991-06-28 1993-01-14 豊田合成株式会社 Car room light
JPH10144126A (en) * 1996-11-08 1998-05-29 Matsushita Electric Works Ltd Lighting system
JPH11162233A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Light source device
JP2003331601A (en) * 2002-04-04 2003-11-21 Aitec Co Ltd Light emitting diode flashlight
JP2005118207A (en) * 2003-10-15 2005-05-12 Nitride Semiconductor Co Ltd Ultraviolet irradiator and ultraviolet irradiation unit
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139017U (en) * 1986-02-05 1987-09-02
JPS62285307A (en) * 1986-06-03 1987-12-11 Yamaha Motor Co Ltd Lamp apparatus for vehicle
JPH04163973A (en) * 1990-10-27 1992-06-09 Res Dev Corp Of Japan Variable color light emitting diode
JPH051598U (en) * 1991-06-28 1993-01-14 豊田合成株式会社 Car room light
JPH10144126A (en) * 1996-11-08 1998-05-29 Matsushita Electric Works Ltd Lighting system
JPH11162233A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Light source device
JP2003331601A (en) * 2002-04-04 2003-11-21 Aitec Co Ltd Light emitting diode flashlight
JP2005118207A (en) * 2003-10-15 2005-05-12 Nitride Semiconductor Co Ltd Ultraviolet irradiator and ultraviolet irradiation unit
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10229940B2 (en) 2006-03-03 2019-03-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9793150B2 (en) 2006-03-03 2017-10-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9436036B2 (en) 2006-03-03 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2015029120A (en) * 2006-03-03 2015-02-12 株式会社半導体エネルギー研究所 Light-emitting device
KR101323401B1 (en) * 2006-12-29 2013-10-29 엘지디스플레이 주식회사 Light divice, method of fabricating the same, backlight unit and liquid crystal display divice having the same
JP2010526408A (en) * 2007-05-02 2010-07-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Solid state lighting device
JP2010526421A (en) * 2007-05-04 2010-07-29 ルード ライティング,インコーポレーテッド Sealing and heat adaptive configuration in LED elements
JP2009004503A (en) * 2007-06-20 2009-01-08 Sharp Corp Surface mounting light emitting diode and method of manufacturing the same
EP2180246A1 (en) * 2007-07-27 2010-04-28 Sichuan Sunfor Light Co., Ltd. A led illuminating lamp
EP2180246A4 (en) * 2007-07-27 2013-03-27 Sichuan Sunfor Light Co Ltd A led illuminating lamp
WO2009015524A1 (en) * 2007-07-27 2009-02-05 Si Chuan Sunfor Light Co., Ltd. A led illuminating lamp
CN101463981B (en) * 2007-12-19 2011-03-23 富准精密工业(深圳)有限公司 LED module group with cooling structure
KR101020807B1 (en) * 2008-06-05 2011-03-09 주식회사 루미시스 Lamp device using LED
JP2009302239A (en) * 2008-06-12 2009-12-24 Alps Electric Co Ltd Light source module
JP2010098313A (en) * 2008-10-15 2010-04-30 Samsung Led Co Ltd Led package module
CN101840986A (en) * 2009-03-18 2010-09-22 株式会社东芝 Light emitting semiconductor device and manufacture method thereof
US8174027B2 (en) 2009-03-18 2012-05-08 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
JP2013518415A (en) * 2010-01-25 2013-05-20 ヴィシャイ スプレイグ,インコーポレイテッドVishay Sprague,Inc. Metal substrate electronic element component package and manufacturing method thereof
JP2015022955A (en) * 2013-07-22 2015-02-02 日立金属株式会社 Light source device

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