TWM309750U - Light emitting diode package - Google Patents
Light emitting diode package Download PDFInfo
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- TWM309750U TWM309750U TW95218396U TW95218396U TWM309750U TW M309750 U TWM309750 U TW M309750U TW 95218396 U TW95218396 U TW 95218396U TW 95218396 U TW95218396 U TW 95218396U TW M309750 U TWM309750 U TW M309750U
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- emitting diode
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- diode package
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Description
M309750 97-11-05 一冰、’“,配置於該承载器之該些區域上,以 該些發光二極體晶片以及該第—螢光層。 風 6.—種發光二桎體封裝,包括: -承載器’該錢器具有_晶片錢面以及多個位於 該晶片承載面上之區域; 多個發光二極體晶片,與該承載器電性連接,其中各 該發光二極體晶片分別配置於其中/個區域内; 第螢光層,配置於其中一個區域上,以覆蓋住其 中一個發光二極體晶片; 里 ’、 一混光層,配置於該承載器之該些區域上,以覆蓋住 §亥些發光一極體晶片以及該第—螢光層;以及 弟一螢光層,配置於未覆蓋有該第一螢光層之其中 一個區域上,以覆蓋住其中一個發光二極體晶片。 7.如申請專利範圍第6項所述之發光二極體封裝,其 中該些發光二極體晶片包括二藍光發光二極體晶片,該些 監光發光二極體晶片被該第一螢光層以及該第二螢光層所 覆盍,而該第一螢光層與該第二螢光層適於受到該些藍光 發光二極體晶片所發出之藍光激發而分別發出紅光與綠 光。 8.如申請專利範圍第6項所述之發光二極體封裝,更 包括一第二螢光層,配置於未覆蓋有該第一螢光層與該第 二螢光層之其中一個區域上,以覆蓋住其中—個發光二極 體晶片。 9.如申請專利範圍第8項所述之發光二極體封裝,其 18 M309750 97-11-05 中該些發光二極體晶片包括三紫外光發光二極體晶片,各 該紫外光發光二極體晶片分別被該第一螢光層、該第二螢 光層與該第三螢光層所覆蓋,而該第一螢光層、該第二螢 光層與該第三螢光層適於受到該些紫外光發光二極體晶片 所發出之紫外光激發而分別發出紅光、綠光與藍光。 .10.—種發光二極體封裝,包括: 一承載器,該承載器具有一晶片承載面以及多個位於 該晶片承載面上之區域,且該些區域彼此連接; 多個發光二極體晶片,與該承載器電性連接,其中各 該發光二極體晶片分別配置於其中一個區域内; 一第一螢光層’配置於其中一個區域上’以覆蓋住其 中一個發光二極體晶片;以及 一混光層,配置於該承載器之該些區域上,以覆蓋住 該些發光二極體晶片以及該第一螢光層。 19M309750 97-11-05 an ice, '", disposed on the regions of the carrier, the light emitting diode chip and the first phosphor layer. Wind 6. - a light-emitting diode package, The method includes: - a carrier having a _ wafer surface and a plurality of regions on the wafer carrying surface; a plurality of LED chips electrically connected to the carrier, wherein each of the LED chips Each of the phosphor layers is disposed on one of the regions to cover one of the LED chips; and a light mixing layer is disposed on the regions of the carrier And covering the illuminating one-pole wafer and the first-light-emitting layer; and the phosphor layer, disposed on one of the regions not covered with the first phosphor layer to cover one of the illuminating layers The illuminating diode package of claim 6, wherein the illuminating diode chip comprises two blue illuminating diode chips, and the illuminating diode chips are The first phosphor layer and the second phosphor layer The first phosphor layer and the second phosphor layer are adapted to be excited by the blue light emitted by the blue light emitting diode chips to emit red light and green light, respectively. The light emitting diode package further includes a second phosphor layer disposed on one of the regions not covered with the first phosphor layer and the second phosphor layer to cover one of the phosphors A diode package as claimed in claim 8, wherein the light-emitting diode chips of the 18 M309750 97-11-05 comprise three ultraviolet light-emitting diode chips, each of which The ultraviolet light emitting diode chip is covered by the first fluorescent layer, the second fluorescent layer and the third fluorescent layer, respectively, and the first fluorescent layer, the second fluorescent layer and the first The three phosphor layers are adapted to be excited by the ultraviolet light emitted by the ultraviolet light emitting diode chips to respectively emit red light, green light and blue light. 10. A light emitting diode package comprising: a carrier, The carrier has a wafer carrying surface and a plurality of regions on the wafer carrying surface. The plurality of light emitting diode chips are electrically connected to the carrier, wherein each of the light emitting diode wafers is disposed in one of the regions; a first phosphor layer is disposed in one of the regions And a light-mixing layer disposed on the regions of the carrier to cover the LED chips and the first phosphor layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95218396U TWM309750U (en) | 2006-10-18 | 2006-10-18 | Light emitting diode package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95218396U TWM309750U (en) | 2006-10-18 | 2006-10-18 | Light emitting diode package |
Publications (1)
Publication Number | Publication Date |
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TWM309750U true TWM309750U (en) | 2007-04-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW95218396U TWM309750U (en) | 2006-10-18 | 2006-10-18 | Light emitting diode package |
Country Status (1)
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TW (1) | TWM309750U (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8507926B2 (en) | 2009-03-25 | 2013-08-13 | Coretronic Corporation | Light emitting diode package |
US8882319B2 (en) | 2011-05-18 | 2014-11-11 | Samsung Electronics Co., Ltd. | Light emitting device assembly and headlamp including the same |
US9134595B2 (en) | 2011-09-29 | 2015-09-15 | Casio Computer Co., Ltd. | Phosphor device, illumination apparatus and projector apparatus |
TWI502150B (en) * | 2009-03-19 | 2015-10-01 | Koninkl Philips Electronics Nv | Color adjusting arrangement |
US9217544B2 (en) | 2010-03-03 | 2015-12-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
TWI614919B (en) * | 2013-02-07 | 2018-02-11 | 億光電子工業股份有限公司 | Light-emitting device and lighting equipment having the same |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US10665762B2 (en) | 2010-03-03 | 2020-05-26 | Ideal Industries Lighting Llc | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
-
2006
- 2006-10-18 TW TW95218396U patent/TWM309750U/en not_active IP Right Cessation
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
TWI502150B (en) * | 2009-03-19 | 2015-10-01 | Koninkl Philips Electronics Nv | Color adjusting arrangement |
US8507926B2 (en) | 2009-03-25 | 2013-08-13 | Coretronic Corporation | Light emitting diode package |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
US9217544B2 (en) | 2010-03-03 | 2015-12-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US10665762B2 (en) | 2010-03-03 | 2020-05-26 | Ideal Industries Lighting Llc | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
TWI558944B (en) * | 2011-05-18 | 2016-11-21 | 三星電子股份有限公司 | Light emitting device assembly and headlamp including the same |
US9188300B2 (en) | 2011-05-18 | 2015-11-17 | Samsung Electronics Co., Ltd. | Light emitting device assembly and headlamp including the same |
US8921883B2 (en) | 2011-05-18 | 2014-12-30 | Samsung Electronics Co., Ltd. | Light emitting device assembly and headlamp including the same |
US8882319B2 (en) | 2011-05-18 | 2014-11-11 | Samsung Electronics Co., Ltd. | Light emitting device assembly and headlamp including the same |
TWI506222B (en) * | 2011-09-29 | 2015-11-01 | Casio Computer Co Ltd | Luminophor device, illuminating device and projecting device |
US9134595B2 (en) | 2011-09-29 | 2015-09-15 | Casio Computer Co., Ltd. | Phosphor device, illumination apparatus and projector apparatus |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
TWI614919B (en) * | 2013-02-07 | 2018-02-11 | 億光電子工業股份有限公司 | Light-emitting device and lighting equipment having the same |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
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