TWM309750U - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

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Publication number
TWM309750U
TWM309750U TW95218396U TW95218396U TWM309750U TW M309750 U TWM309750 U TW M309750U TW 95218396 U TW95218396 U TW 95218396U TW 95218396 U TW95218396 U TW 95218396U TW M309750 U TWM309750 U TW M309750U
Authority
TW
Taiwan
Prior art keywords
emitting diode
light emitting
diode package
light
regions
Prior art date
Application number
TW95218396U
Other languages
Chinese (zh)
Inventor
Hsin-Hua Ho
Wen-Jeng Hwang
Original Assignee
Lighthouse Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lighthouse Technology Co Ltd filed Critical Lighthouse Technology Co Ltd
Priority to TW95218396U priority Critical patent/TWM309750U/en
Publication of TWM309750U publication Critical patent/TWM309750U/en

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Description

M309750 97-11-05 一冰、’“,配置於該承载器之該些區域上,以 該些發光二極體晶片以及該第—螢光層。 風 6.—種發光二桎體封裝,包括: -承載器’該錢器具有_晶片錢面以及多個位於 該晶片承載面上之區域; 多個發光二極體晶片,與該承載器電性連接,其中各 該發光二極體晶片分別配置於其中/個區域内; 第螢光層,配置於其中一個區域上,以覆蓋住其 中一個發光二極體晶片; 里 ’、 一混光層,配置於該承載器之該些區域上,以覆蓋住 §亥些發光一極體晶片以及該第—螢光層;以及 弟一螢光層,配置於未覆蓋有該第一螢光層之其中 一個區域上,以覆蓋住其中一個發光二極體晶片。 7.如申請專利範圍第6項所述之發光二極體封裝,其 中該些發光二極體晶片包括二藍光發光二極體晶片,該些 監光發光二極體晶片被該第一螢光層以及該第二螢光層所 覆盍,而該第一螢光層與該第二螢光層適於受到該些藍光 發光二極體晶片所發出之藍光激發而分別發出紅光與綠 光。 8.如申請專利範圍第6項所述之發光二極體封裝,更 包括一第二螢光層,配置於未覆蓋有該第一螢光層與該第 二螢光層之其中一個區域上,以覆蓋住其中—個發光二極 體晶片。 9.如申請專利範圍第8項所述之發光二極體封裝,其 18 M309750 97-11-05 中該些發光二極體晶片包括三紫外光發光二極體晶片,各 該紫外光發光二極體晶片分別被該第一螢光層、該第二螢 光層與該第三螢光層所覆蓋,而該第一螢光層、該第二螢 光層與該第三螢光層適於受到該些紫外光發光二極體晶片 所發出之紫外光激發而分別發出紅光、綠光與藍光。 .10.—種發光二極體封裝,包括: 一承載器,該承載器具有一晶片承載面以及多個位於 該晶片承載面上之區域,且該些區域彼此連接; 多個發光二極體晶片,與該承載器電性連接,其中各 該發光二極體晶片分別配置於其中一個區域内; 一第一螢光層’配置於其中一個區域上’以覆蓋住其 中一個發光二極體晶片;以及 一混光層,配置於該承載器之該些區域上,以覆蓋住 該些發光二極體晶片以及該第一螢光層。 19M309750 97-11-05 an ice, '", disposed on the regions of the carrier, the light emitting diode chip and the first phosphor layer. Wind 6. - a light-emitting diode package, The method includes: - a carrier having a _ wafer surface and a plurality of regions on the wafer carrying surface; a plurality of LED chips electrically connected to the carrier, wherein each of the LED chips Each of the phosphor layers is disposed on one of the regions to cover one of the LED chips; and a light mixing layer is disposed on the regions of the carrier And covering the illuminating one-pole wafer and the first-light-emitting layer; and the phosphor layer, disposed on one of the regions not covered with the first phosphor layer to cover one of the illuminating layers The illuminating diode package of claim 6, wherein the illuminating diode chip comprises two blue illuminating diode chips, and the illuminating diode chips are The first phosphor layer and the second phosphor layer The first phosphor layer and the second phosphor layer are adapted to be excited by the blue light emitted by the blue light emitting diode chips to emit red light and green light, respectively. The light emitting diode package further includes a second phosphor layer disposed on one of the regions not covered with the first phosphor layer and the second phosphor layer to cover one of the phosphors A diode package as claimed in claim 8, wherein the light-emitting diode chips of the 18 M309750 97-11-05 comprise three ultraviolet light-emitting diode chips, each of which The ultraviolet light emitting diode chip is covered by the first fluorescent layer, the second fluorescent layer and the third fluorescent layer, respectively, and the first fluorescent layer, the second fluorescent layer and the first The three phosphor layers are adapted to be excited by the ultraviolet light emitted by the ultraviolet light emitting diode chips to respectively emit red light, green light and blue light. 10. A light emitting diode package comprising: a carrier, The carrier has a wafer carrying surface and a plurality of regions on the wafer carrying surface. The plurality of light emitting diode chips are electrically connected to the carrier, wherein each of the light emitting diode wafers is disposed in one of the regions; a first phosphor layer is disposed in one of the regions And a light-mixing layer disposed on the regions of the carrier to cover the LED chips and the first phosphor layer.

TW95218396U 2006-10-18 2006-10-18 Light emitting diode package TWM309750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95218396U TWM309750U (en) 2006-10-18 2006-10-18 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95218396U TWM309750U (en) 2006-10-18 2006-10-18 Light emitting diode package

Publications (1)

Publication Number Publication Date
TWM309750U true TWM309750U (en) 2007-04-11

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TW95218396U TWM309750U (en) 2006-10-18 2006-10-18 Light emitting diode package

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TW (1) TWM309750U (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8507926B2 (en) 2009-03-25 2013-08-13 Coretronic Corporation Light emitting diode package
US8882319B2 (en) 2011-05-18 2014-11-11 Samsung Electronics Co., Ltd. Light emitting device assembly and headlamp including the same
US9134595B2 (en) 2011-09-29 2015-09-15 Casio Computer Co., Ltd. Phosphor device, illumination apparatus and projector apparatus
TWI502150B (en) * 2009-03-19 2015-10-01 Koninkl Philips Electronics Nv Color adjusting arrangement
US9217544B2 (en) 2010-03-03 2015-12-22 Cree, Inc. LED based pedestal-type lighting structure
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US9310030B2 (en) 2010-03-03 2016-04-12 Cree, Inc. Non-uniform diffuser to scatter light into uniform emission pattern
US9316361B2 (en) 2010-03-03 2016-04-19 Cree, Inc. LED lamp with remote phosphor and diffuser configuration
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
US9500325B2 (en) 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
US9625105B2 (en) 2010-03-03 2017-04-18 Cree, Inc. LED lamp with active cooling element
TWI614919B (en) * 2013-02-07 2018-02-11 億光電子工業股份有限公司 Light-emitting device and lighting equipment having the same
US10359151B2 (en) 2010-03-03 2019-07-23 Ideal Industries Lighting Llc Solid state lamp with thermal spreading elements and light directing optics
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
US10665762B2 (en) 2010-03-03 2020-05-26 Ideal Industries Lighting Llc LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
TWI502150B (en) * 2009-03-19 2015-10-01 Koninkl Philips Electronics Nv Color adjusting arrangement
US8507926B2 (en) 2009-03-25 2013-08-13 Coretronic Corporation Light emitting diode package
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US10359151B2 (en) 2010-03-03 2019-07-23 Ideal Industries Lighting Llc Solid state lamp with thermal spreading elements and light directing optics
US9625105B2 (en) 2010-03-03 2017-04-18 Cree, Inc. LED lamp with active cooling element
US9217544B2 (en) 2010-03-03 2015-12-22 Cree, Inc. LED based pedestal-type lighting structure
US10665762B2 (en) 2010-03-03 2020-05-26 Ideal Industries Lighting Llc LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US9310030B2 (en) 2010-03-03 2016-04-12 Cree, Inc. Non-uniform diffuser to scatter light into uniform emission pattern
US9316361B2 (en) 2010-03-03 2016-04-19 Cree, Inc. LED lamp with remote phosphor and diffuser configuration
US9500325B2 (en) 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
TWI558944B (en) * 2011-05-18 2016-11-21 三星電子股份有限公司 Light emitting device assembly and headlamp including the same
US9188300B2 (en) 2011-05-18 2015-11-17 Samsung Electronics Co., Ltd. Light emitting device assembly and headlamp including the same
US8921883B2 (en) 2011-05-18 2014-12-30 Samsung Electronics Co., Ltd. Light emitting device assembly and headlamp including the same
US8882319B2 (en) 2011-05-18 2014-11-11 Samsung Electronics Co., Ltd. Light emitting device assembly and headlamp including the same
TWI506222B (en) * 2011-09-29 2015-11-01 Casio Computer Co Ltd Luminophor device, illuminating device and projecting device
US9134595B2 (en) 2011-09-29 2015-09-15 Casio Computer Co., Ltd. Phosphor device, illumination apparatus and projector apparatus
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
TWI614919B (en) * 2013-02-07 2018-02-11 億光電子工業股份有限公司 Light-emitting device and lighting equipment having the same
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements

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