CN202662597U - Integrated multilayer lighting device - Google Patents
Integrated multilayer lighting device Download PDFInfo
- Publication number
- CN202662597U CN202662597U CN2012200827913U CN201220082791U CN202662597U CN 202662597 U CN202662597 U CN 202662597U CN 2012200827913 U CN2012200827913 U CN 2012200827913U CN 201220082791 U CN201220082791 U CN 201220082791U CN 202662597 U CN202662597 U CN 202662597U
- Authority
- CN
- China
- Prior art keywords
- lighting device
- integrated
- level formula
- formula lighting
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides an integrated multilayer lighting device. The integrated multilayer lighting device comprises a base, a light emitting component and a lead frame, wherein the base can be formed integrally; the base capable of directly accommodating a light emitting unit inside can be formed by proper forming mode, and the base comprises a chamber for directly arranging the light emitting unit inside; the base is made of metal material, by the excellent thermal conduction efficiency of the metal material, the base can directly absorb the heat energy generated by the light emitting component when emitting light and quickly conduct the heat energy to the external environment space, thus, use of packaging materials can be reduced greatly, and the manufacturing steps are simplified.
Description
Technical field
The utility model relates to a kind of lighting device, especially a kind of integrated, multi-level formula lighting device.
Background technology
The principle of luminosity of LED is to utilize the semiconductor inherent characteristic, the discharge of the incandescent lamp tube that it is different from the past, heating luminous principle, but just can emit beam when electric current forward flowed into semi-conductive PN junction, so LED is called as cold light source.Because LED has advantages of that high-durability, life-span are long, light and handy, power consumption is low and does not contain the harmful substance such as mercury etc., therefore can be widely used in the lighting apparatus industry, and it is applied in the commercial fields such as electronic bill-board, traffic sign usually with the led array packaged type.
Please refer to TaiWan, China new patent notification number M387375, it relates to a kind of encapsulating structure of multi-layer array type light emitting diode, consist predominantly of a metal substrate, one package module, one lead frame and a cover body, this metal substrate is located at the orlop of this encapsulating structure, this package module is in order to respectively with this metal substrate and this lead frame sealing and form one, LED crystal particle and the metal substrate of the promising arrayed of installing are metal material on this metal substrate, light-emitting diode and this lead frame also form to be electrically connected, this cover body then cover cap among this package module.
Yet the shortcoming of prior art is that doing encapsulation by each light-emitting diode the time can use encapsulating material to remove to make package module, encapsulating material adopts plastic resin to make mostly, but the heat-sinking capability of general plastic resin is far away from metal material, the heat-sinking capability deficiency can have a strong impact on length and the luminous efficacy in the useful life of light-emitting diode, and metal substrate and package module can't be produced once integrally formed, cause making step complicated, therefore must be improved above-mentioned shortcoming, significantly be promoted the use of heat conduction efficiency and minimizing encapsulating material.
The utility model content
Main purpose of the present utility model is to provide a kind of integrated, multi-level formula lighting device, include a pedestal, have a centerbody and a plurality of radiating fin, the top of this centerbody is formed with a chamber, the bottom surface of this chamber is an exiting surface, the internal face of this chamber is a reflective surface, and wherein this centerbody provides two hollow pipelines; A plurality of luminescence components are arranged on this exiting surface, and described luminescence component each other mat routing engages to consist of electrical connection; And two lead frames, be arranged at respectively among this two pipeline, and with described luminescence component between the mat routing engage and consist of electrical connection, wherein have at least one seal in the pipeline, this at least one seal is in order to fix a lead frame and to seal this pipeline.
Wherein pedestal can be integrally formed, utilize suitable forming mode to set out and luminescence unit directly can be arranged at interior pedestal, specifically, the chamber of pedestal can directly arrange wherein for luminescence unit, especially pedestal integral body is to utilize metal material to be made, excellent heat conduction efficiency by metal material, the heat energy that produces when can be directly luminous luminescence component directly absorbs and conducts to fast Outdoor Space, therefore do not need to set out again in addition package module, the consumption of encapsulating material can significantly reduce, and also can simplify manufacturing step.
In an embodiment of the present utility model, with a cover cap cover cap on this chamber, and with this centerbody sealed engagement; can seal chamber; make chamber form confined space, so aqueous vapor or particulate can't enter in chamber, use protection luminescence component and optical module and avoid rotten deteriorated.
Moreover, the relative angle that consists of between exiting surface and the reflective surface can be selected the wherein angle between 20～70 degree, and determine reflective surface corresponding to the angle that arranges of exiting surface, and see through above-mentioned configuration relation, use the rising angle scope that the control luminescence component can throw.
Description of drawings
Fig. 1 is the schematic perspective view of integrated, multi-level formula lighting device of the present utility model;
Fig. 2 is the generalized section of integrated, multi-level formula lighting device of the present utility model; And
Fig. 3 is the first embodiment schematic diagram of integrated, multi-level formula lighting device of the present utility model.
The primary clustering symbol description
1 pedestal
11 centerbodies
111 exiting surfaces
113 reflective surfaces
115 pipelines
13 radiating fins
131 branched structures
133 fixtures
3 luminescence components
4 plain conductors
5 lead frames
6 seals
7 fluorescence coatings
8 cover caps
133 fixtures
The 133a fixed part
The θ angle
Embodiment
Those skilled in the art below cooperate graphic and element numbers is done more detailed description to execution mode of the present utility model, so that can implement after studying this specification carefully according to this.
With reference to figure 1, Fig. 1 is the schematic perspective view of integrated, multi-level formula lighting device of the present utility model, and with reference to figure 2, Fig. 2 is the generalized section of integrated, multi-level formula lighting device of the present utility model.The utility model relates to a kind of integrated, multi-level formula lighting device, and it includes pedestal 1, a plurality of luminescence component 3 and two lead frames 5.
Radiating fin 13 is centered by centerbody 11 and outwards with radial spread configuration, be separated with all mutually a spacing between the adjacent radiating fin 13, wherein the outer end of radiating fin 13 outwards and extended branched structure 131, the setting of branched structure 131 can increase the area of dissipation of radiating fin 13, and the two sides of radiating fin 13 be the height shape that rises and falls, above-mentioned height fluctuating shape generally is wavy and zigzag, when the two sides of radiating fin 13 present height when rising and falling shape, be flat surface by contrast with two sides, the two sides of radiating fin 13 can increase many for the contoured surface area of height, in other words, radiating fin 13 has more multiplex area with dissipation heat energy, so 1 heat-sinking capability of pedestal significantly improves.Wherein, centerbody 11 and radiating fin 13 are made with solid aluminium.
Wherein, the outer rim of radiating fin 13 also can further arrange fixture 133, the two side walls of fixture 133 also presents the shape that just rises and falls, each inwardly projects out fixed part 133a fixture 133 upper and lower sides, the usefulness that fixed part is combined with article or other assembly in order to conduct is such as diffuser or housing etc.
In a preferred embodiment of the present utility model, exiting surface 111 and reflective surface 113 power on and plate out the chromium metal level (figure does not show) that promotes the light reflection effect, and can further electroplate out silver metal layer (figure does not show) on the chromium metal level on the exiting surface 111, the silver metal layer can make things convenient for the LED crystal particle adhesion.
In an embodiment of the present utility model, reflector (figure show) wherein also can further be set on the reflective surface 113, the light that reflector is used for receiving and reflection luminescence component 3 sends is to space outerpace.Moreover, the relative angle θ that consists of between exiting surface 111 and the reflective surface 113 can select the wherein angle between 20～70 degree, and determine reflective surface 113 corresponding to the angle that arranges of exiting surface 111, and see through above-mentioned configuration relation, can control the rising angle scope that luminescence component 3 throws.
Please refer to Fig. 2, two lead frames 5 are arranged at respectively among two pipelines 115, and with luminescence component 3 between mat wire 4 do routing and engage to consist of electrical connection, the both ends of better lead frame 5 also can plate silver, help lead frame 5 to do routing with luminescence component 3 and engage.
Wherein have seal 6 in the pipeline 115, in the embodiment of Fig. 2, pipeline 115 locate up and down also can respectively fill out the envelope seal 6 is arranged, with closed conduct 115.Seal 6 is except in order to fixing cord frame 5 and lead frame 5 is electrically isolated from the centerbody 11, can also closed conduct 115 uses to prevent that aqueous vapor from entering in chamber.Wherein two lead frames 5 are done routing with luminescence component 3 with gold thread and are engaged.
The material of seal 6 can be any one of glass, pottery and epoxy resin.Wherein the formation of seal 6 is glass, pottery and the epoxy resin of filling in liquid state in hot environment, namely forms seal 6 when glass, pottery and the epoxy resin of liquid state solidifies.
With reference to figure 3, Fig. 3 is the first embodiment schematic diagram of integrated, multi-level formula lighting device of the present utility model.Integrated, multi-level formula lighting device of the present utility model can further arrange fluorescence coating 7, and fluorescence coating 7 covers luminescence component 3, all can pass through fluorescence coating 7 such as the light when luminescence component 3, thereby produces the mixed light effect with fluorescence coating 7.Integrated, multi-level formula lighting device of the present utility model also can be provided with cover cap 8, cover cap 8 cover caps on chamber, and with centerbody 11 sealed engagement with the sealing chamber.Wherein the form of cover cap can ball shape and plane at least one of them, the material of cover cap can be any one of glass and silica gel.
The above person only is in order to explain preferred embodiment of the present utility model; be not that attempt is done any pro forma restriction to the utility model according to this; therefore; all have identical invention spirit is lower do relevant any modification of the present utility model or change, all must be included in the category of the utility model intention protection.
Claims (16)
1. an integrated, multi-level formula lighting device is characterized in that, includes:
One pedestal has a centerbody and a plurality of radiating fin, and the top of this centerbody is formed with a chamber, and the bottom surface of this chamber is an exiting surface, and the internal face of this chamber is a reflective surface, and wherein this centerbody provides two hollow pipelines;
A plurality of luminescence components are arranged on this exiting surface, and described luminescence component each other mat routing engages to consist of electrical connection; And
Two lead frames are arranged at respectively among this two pipeline, and with described luminescence component between the mat routing engage and consist of electrical connection, wherein have at least one seal in the pipeline, this at least one seal is in order to fix a lead frame and to seal this pipeline.
2. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, the material of making this centerbody and this radiating fin is aluminium.
3. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, this chamber with impact style and milling cutter mode at least one of them and make.
4. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, described luminescence component is disposed on this exiting surface in the arrayed mode.
5. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, described luminescence component is light-emitting diode.
6. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, this exiting surface and this reflective surface power on and plate out a chromium metal level.
7. integrated, multi-level formula lighting device as claimed in claim 3 is characterized in that, a silver metal layer is further electroplated out in the top that is positioned at this chromium metal level on this exiting surface.
8. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, this two lead frame is done routing with described luminescence component with gold thread and engaged.
9. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, the material of this at least one sealant is any one of glass, pottery and epoxy resin.
10. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, the both ends of this lead frame plate silver.
11. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that also include a reflector, this reflector is arranged on this reflective surface.
12. integrated, multi-level formula lighting device as claimed in claim 10 is characterized in that, the angle that consists of between this exiting surface and this reflective surface is between 20～70 degree.
13. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that also include a fluorescence coating, this fluorescence coating covers described luminescence component.
14. integrated, multi-level formula lighting device as claimed in claim 1 is characterized in that, includes a cover cap, this cover cap cover cap on this chamber, and with this centerbody sealed engagement with the sealing chamber.
15. integrated, multi-level formula lighting device as claimed in claim 14 is characterized in that, the form of this cover cap be ball shape and plane at least one of them.
16. integrated, multi-level formula lighting device as claimed in claim 14 is characterized in that the material of this cover cap is any one of glass and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200827913U CN202662597U (en) | 2012-03-07 | 2012-03-07 | Integrated multilayer lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200827913U CN202662597U (en) | 2012-03-07 | 2012-03-07 | Integrated multilayer lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202662597U true CN202662597U (en) | 2013-01-09 |
Family
ID=47457482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200827913U Expired - Fee Related CN202662597U (en) | 2012-03-07 | 2012-03-07 | Integrated multilayer lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202662597U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104033744A (en) * | 2013-03-05 | 2014-09-10 | 盈胜科技股份有限公司 | Integrated multi-layer LED (light emitting diode) lamp tube |
-
2012
- 2012-03-07 CN CN2012200827913U patent/CN202662597U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104033744A (en) * | 2013-03-05 | 2014-09-10 | 盈胜科技股份有限公司 | Integrated multi-layer LED (light emitting diode) lamp tube |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9234655B2 (en) | Lamp with remote LED light source and heat dissipating elements | |
| US9605844B2 (en) | Lighting device with heat dissipation elements | |
| US9068701B2 (en) | Lamp structure with remote LED light source | |
| TWI615578B (en) | Led light lamps using stack effect for improving heat dissipation | |
| KR20130114578A (en) | Led light source and manufacturing method thereof | |
| EP2337987A1 (en) | Lighting device, heat transfer structure and heat transfer element | |
| JP2010108768A (en) | Light source unit and lighting device | |
| CN102913787A (en) | Novel LED (light emitting diode) light source and bulb manufactured by using same | |
| TW201506296A (en) | Light emitting diode bulb | |
| CN202662597U (en) | Integrated multilayer lighting device | |
| KR101401919B1 (en) | Lighting device of multi level type for integrated high-efficiency | |
| JP3171377U (en) | Light-emitting diode explosion-proof light | |
| WO2014039405A1 (en) | Lamp with remote led light source and heat dissipating elements | |
| JP3180453U (en) | Integrated high-efficiency lighting device with multilayer structure | |
| CN202721186U (en) | Integrated high-efficiency lighting device provided with multi-layer structure | |
| JP3180453U7 (en) | ||
| CN203413588U (en) | LED (Light Emitting Diode) light source board assembly, LED lamp wick and LED lighting device | |
| KR101315703B1 (en) | Lighting device | |
| CN102214645A (en) | Multi-layer array type light emitting diode | |
| CN103311232A (en) | Integrated multilayer lighting device | |
| KR102089625B1 (en) | Lighting device | |
| KR20130088950A (en) | Lighting device | |
| CN216928616U (en) | Sidelight-free LED packaging support plate | |
| CN205645869U (en) | LED support, LED packaging body and LED lamps and lanterns | |
| JP2013162121A (en) | Integrated multilayer type lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20190307 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |