JP2005086051A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2005086051A
JP2005086051A JP2003317795A JP2003317795A JP2005086051A JP 2005086051 A JP2005086051 A JP 2005086051A JP 2003317795 A JP2003317795 A JP 2003317795A JP 2003317795 A JP2003317795 A JP 2003317795A JP 2005086051 A JP2005086051 A JP 2005086051A
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light
light emitting
emitting device
base material
emitting diode
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Keisuke Ono
桂輔 小野
Sumio Hashimoto
純男 橋本
Shigeru Osawa
滋 大澤
Hisayo Uetake
久代 植竹
Iwatomo Moriyama
厳與 森山
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

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  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a long-life light emitting device which does not use an epoxy resin, etc. as a binder of a fluorescent substance. <P>SOLUTION: A fluorescent layer 32 to be excited with a light emitted by a light emitting diode 12 is formed in a light transmission member 29 by burning. The light emitting diode 12 is mounted to a substrate 15 and the light transmission member 29 is disposed so as to cover the light emitting diode 12. The substrate 15 and the light transmission member 29 are sealed with a sealer 30, and an airtight space 31 is formed between the substrate 15 and the light transmission member 29, and an inactive gas is charged into the airtight space 31. As the fluorescent layer 32 is burnt in the light transmission member 29, the epoxy resin which is the binder of the fluorescent substance is saved, and a lifetime is prolonged as a light emitting device 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、発光素子を光源とする発光装置に関する。   The present invention relates to a light emitting device using a light emitting element as a light source.

従来、発光素子として例えば固体発光素子である発光ダイオードを光源とする照明装置などの発光装置では、例えば、白色の発光ダイオードが発光する特定の波長光で蛍光体を励起させ、所望の発光色を得ている。   Conventionally, in a light-emitting device such as a lighting device using a light-emitting diode as a light source as a light-emitting element, for example, a phosphor is excited by a specific wavelength light emitted by a white light-emitting diode, and a desired emission color is obtained. It has gained.

このような発光装置では、基材の表面に発光ダイオードを実装し、蛍光体を分散して含むバインダであるエポキシ樹脂などの透明樹脂で発光ダイオード全体を覆って成形している（例えば、特許文献１参照。）。   In such a light-emitting device, a light-emitting diode is mounted on the surface of a base material, and the entire light-emitting diode is covered with a transparent resin such as an epoxy resin that is a binder containing dispersed phosphors (for example, Patent Documents). 1).

また、基材の表面に発光ダイオードを実装し、この基材の表面に離間対向して光学部材を配置し、この光学部材の発光ダイオードに対向する内面に設けた凹所に蛍光体を分散して含むバインダである透明樹脂を充填して成形している（例えば、特許文献２参照。）。
特開２００３−３４７９１号公報（第５−６頁、図３） 特開２００３−１１０１４６号公報（第４頁、図１） In addition, a light emitting diode is mounted on the surface of the base material, an optical member is disposed so as to be opposed to the surface of the base material, and the phosphor is dispersed in a recess provided on the inner surface of the optical member facing the light emitting diode. A transparent resin, which is a binder, is filled and molded (for example, see Patent Document 2).
Japanese Patent Laying-Open No. 2003-34791 (page 5-6, FIG. 3) JP 2003-110146 A (page 4, FIG. 1)

従来は、蛍光体をバインダである透明樹脂に分散して含み、この透明樹脂で発光ダイオード全体を覆って成形したり、透明樹脂を光学部材の凹所に充填して成形しており、透明樹脂には形状を維持するために主としてエポキシ樹脂などが多く用いられている。   Conventionally, phosphors are dispersed in a transparent resin, which is a binder, and the entire light emitting diode is covered with the transparent resin, or the transparent resin is filled in the recess of the optical member. In order to maintain the shape, epoxy resin or the like is mainly used.

しかし、エポキシ樹脂は発光ダイオードの光照射によって劣化し、このエポキシ樹脂の劣化による光透過率の低下が発光ダイオード自体の寿命より早く進み、発光ダイオードが有する長寿命特性が十分に得られない問題がある。   However, the epoxy resin deteriorates due to light irradiation of the light emitting diode, and the decrease in light transmittance due to the deterioration of the epoxy resin proceeds faster than the life of the light emitting diode itself, and the long life characteristics possessed by the light emitting diode cannot be sufficiently obtained. is there.

また、エポキシ樹脂に比べて劣化しにくい透明樹脂としてシリコーン樹脂などもあるが、エポキシ樹脂に比べて線膨張係数が大きいため、硬度が高いと寿命中のヒートショックによる例えば発光ダイオードの電気接続用のボンディングワイヤの断線の原因となり、また、硬度を低くゲル状にすると、特定の形状を保てなくなり、大気に触れる構成であれば塵埃が付着しやすい問題がある。   In addition, there are silicone resins, etc. as transparent resins that are less likely to deteriorate than epoxy resins. However, since the linear expansion coefficient is large compared to epoxy resins, for example, for electrical connection of light-emitting diodes due to heat shock during the life when the hardness is high. It causes breakage of the bonding wire, and if the hardness is made low and gelled, a specific shape cannot be maintained, and there is a problem that dust is likely to adhere if the structure is in contact with the atmosphere.

本発明は、このような点に鑑みなされたもので、蛍光体のバインダとしてエポキシ樹脂などを使用せず、長寿命な発光装置を提供することを目的とする。   The present invention has been made in view of these points, and an object of the present invention is to provide a long-life light-emitting device without using an epoxy resin or the like as a phosphor binder.

請求項１記載の発光装置は、発光素子と；発光素子を実装した基材と；発光素子に対向し発光素子が発光する光で励起される蛍光体層が形成された光透過部材と；を具備しているものである。   The light-emitting device according to claim 1 includes: a light-emitting element; a base material on which the light-emitting element is mounted; and a light-transmitting member on which a phosphor layer that is opposed to the light-emitting element and is excited by light emitted from the light-emitting element is formed. It is equipped.

そして、この構成では、発光素子に対向する光透過部材に蛍光体層を形成したため、蛍光体のバインダとしてエポキシ樹脂などを使用せず、発光装置として長寿命になる。   And in this structure, since the fluorescent substance layer was formed in the light transmissive member facing a light emitting element, an epoxy resin etc. are not used as a binder of fluorescent substance, but it becomes a long lifetime as a light-emitting device.

請求項２記載の発光装置は、請求項１記載の発光装置において、基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に不活性ガスを封入したものである。   The light emitting device according to claim 2 is the light emitting device according to claim 1, wherein the base material and the light transmitting member are sealed with a sealing material to form a sealed space between the base material and the light transmitting member. In this sealed space, an inert gas is sealed.

そして、この構成では、基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に不活性ガスを封入したため、発光素子や発光体層の酸化が防止される。   In this configuration, the base material and the light transmission member are sealed with a sealing material to form a sealed space between the base material and the light transmission member, and an inert gas is sealed in the sealed space. Oxidation of the light emitting element and the light emitting layer is prevented.

請求項３記載の発光装置は、請求項１または２記載の発光装置において、基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に透明充填材を充填したものである。   The light emitting device according to claim 3 is the light emitting device according to claim 1 or 2, wherein the base material and the light transmission member are sealed with a sealing material, and a sealed space is formed between the base material and the light transmission member. It is formed and this sealed space is filled with a transparent filler.

そして、この構成では、基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に透明充填材を充填したため、基材と光透過部材との間に屈折率が高い大気が介在する場合に比べて、光の取出効率が向上する。また、請求項２の不活性ガスを封入することで、密閉空間内が所定圧力に保たれるので、透明充填材にゲル状シリコーンなどを使用しても、透明充填材が特定の形状に保たれる。   And in this configuration, the base material and the light transmission member are sealed with a sealing material to form a sealed space between the base material and the light transmission member, and this sealed space is filled with a transparent filler. The light extraction efficiency is improved as compared with the case where an atmosphere having a high refractive index is interposed between the base material and the light transmission member. In addition, since the inside of the sealed space is maintained at a predetermined pressure by enclosing the inert gas according to claim 2, even if gel-like silicone or the like is used for the transparent filler, the transparent filler is maintained in a specific shape. Be drunk.

請求項４記載の発光装置は、請求項１ないし３いずれか一記載の発光装置において、光透過部材の発光素子に対向する内面に紫外線吸収層を設けたものである。   The light emitting device according to claim 4 is the light emitting device according to any one of claims 1 to 3, wherein an ultraviolet absorbing layer is provided on an inner surface of the light transmitting member facing the light emitting element.

そして、この構成では、光透過部材の発光素子に対向する内面に紫外線吸収層を設けたため、例えば光透過部材が樹脂製であっても紫外線による劣化が防止され、発光装置として長寿命になる。   In this configuration, since the ultraviolet absorbing layer is provided on the inner surface of the light transmitting member facing the light emitting element, for example, even if the light transmitting member is made of resin, deterioration due to ultraviolet light is prevented, and the life of the light emitting device is extended.

請求項５記載の発光装置は、請求項１ないし４いずれか一記載の発光装置において、発光素子を実装する基材の表面に反射面を兼ねる電極パターンを形成し、この基材の電極パターン上に複数の発光素子を絶縁状態に実装し、ボンディングワイヤによって複数の発光素子を直列に接続するとともに両端の発光素子を電極パターンに接続したものである。   The light-emitting device according to claim 5 is the light-emitting device according to any one of claims 1 to 4, wherein an electrode pattern that also serves as a reflective surface is formed on the surface of the substrate on which the light-emitting element is mounted. A plurality of light emitting elements are mounted in an insulated state, a plurality of light emitting elements are connected in series by bonding wires, and light emitting elements at both ends are connected to an electrode pattern.

そして、この構成では、発光素子を実装する基材の表面に反射面を兼ねる電極パターンを形成し、この基材の電極パターン上に複数の発光素子を絶縁状態に実装し、ボンディングワイヤによって複数の発光素子を直列に接続するとともに両端の発光素子を電極パターンに接続したため、反射面を兼ねる電極パターンによって発光素子が発光した光の取出効率が向上し、この反射面を兼ねたうえで電極パターンとして確実に機能する。   In this configuration, an electrode pattern that also serves as a reflecting surface is formed on the surface of the base material on which the light emitting element is mounted, and a plurality of light emitting elements are mounted in an insulating state on the electrode pattern of the base material, and a plurality of bonding elements are formed by bonding wires. Since the light emitting elements are connected in series and the light emitting elements at both ends are connected to the electrode pattern, the light extraction efficiency of the light emitted from the light emitting element is improved by the electrode pattern that also serves as the reflecting surface. Works reliably.

請求項１記載の発光装置によれば、発光素子に対向する光透過部材に蛍光体層を形成したため、蛍光体のバインダとしてエポキシ樹脂などを使用せず、発光装置として長寿命にできる。   According to the light emitting device of the first aspect, since the phosphor layer is formed on the light transmitting member facing the light emitting element, an epoxy resin or the like is not used as the binder of the phosphor, and the lifetime of the light emitting device can be increased.

請求項２記載の発光装置によれば、請求項１記載の発光装置の効果に加えて、基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に不活性ガスを封入したため、発光素子や発光体層の酸化を防止できる。   According to the light emitting device of the second aspect, in addition to the effect of the light emitting device of the first aspect, the base material and the light transmission member are sealed with a sealing material, and the space between the base material and the light transmission member. Since a sealed space is formed in the sealed space and an inert gas is sealed in the sealed space, oxidation of the light emitting element and the light emitting layer can be prevented.

請求項３記載の発光装置によれば、請求項１または２記載の発光装置の効果に加えて、基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に透明充填材を充填したため、基材と光透過部材との間に屈折率が高い大気が介在する場合に比べて、光の取出効率を向上できる。また、請求項２の不活性ガスを封入することで、密閉空間内が所定圧力に保たれるので、透明充填材にゲル状シリコーンなどを使用しても、透明充填材を特定の形状に保つことができる。   According to the light emitting device of claim 3, in addition to the effect of the light emitting device of claim 1 or 2, the base material and the light transmitting member are sealed with a sealing material, and the base material and the light transmitting member are Since a sealed space is formed between the two and the transparent space is filled in the sealed space, the light extraction efficiency can be improved as compared with the case where an atmosphere having a high refractive index is interposed between the base material and the light transmitting member. . Further, since the inside of the sealed space is maintained at a predetermined pressure by enclosing the inert gas according to claim 2, even if gel-like silicone or the like is used for the transparent filler, the transparent filler is maintained in a specific shape. be able to.

請求項４記載の発光装置によれば、請求項１ないし３いずれか一記載の発光装置の効果に加えて、光透過部材の発光素子に対向する内面に紫外線吸収層を設けたため、例えば光透過部材が樹脂製であっても紫外線による劣化を防止でき、発光装置として長寿命にできる。   According to the light emitting device of the fourth aspect, in addition to the effect of the light emitting device of any one of the first to third aspects, the ultraviolet absorbing layer is provided on the inner surface of the light transmitting member facing the light emitting element. Even if the member is made of resin, deterioration due to ultraviolet rays can be prevented, and the life of the light emitting device can be extended.

請求項５記載の発光装置によれば、請求項１ないし４いずれか一記載の発光装置の効果に加えて、発光素子を実装する基材の表面に反射面を兼ねる電極パターンを形成し、この基材の電極パターン上に複数の発光素子を絶縁状態に実装し、ボンディングワイヤによって複数の発光素子を直列に接続するとともに両端の発光素子を電極パターンに接続したため、反射面を兼ねる電極パターンによって発光素子が発光した光の取出効率を向上でき、反射面を兼ねたうえで電極パターンとして確実に機能させることができる。   According to the light emitting device according to claim 5, in addition to the effect of the light emitting device according to any one of claims 1 to 4, an electrode pattern that also serves as a reflective surface is formed on the surface of the substrate on which the light emitting element is mounted. Since a plurality of light emitting elements are mounted in an insulating state on the electrode pattern of the base material, a plurality of light emitting elements are connected in series by bonding wires, and the light emitting elements at both ends are connected to the electrode pattern. The extraction efficiency of light emitted from the element can be improved, and it can function reliably as an electrode pattern while also serving as a reflective surface.

以下、本発明の一実施の形態を図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１ないし図３に第１の実施の形態を示し、図１は発光装置の断面図、図２は発光装置の光透過部材を外した状態の正面図、図３は発光装置の発光ダイオードの配線回路を示す模式図である。   1 to 3 show a first embodiment, FIG. 1 is a sectional view of a light emitting device, FIG. 2 is a front view of a light emitting device with a light transmitting member removed, and FIG. 3 is a diagram of a light emitting diode of the light emitting device. It is a schematic diagram which shows a wiring circuit.

図１および図２において、11は発光装置で、この発光装置11は、発光素子として固定発光素子である複数の例えばＧａＮ系の発光ダイオード12を配列した発光モジュールとして構成されている。   1 and 2, reference numeral 11 denotes a light emitting device. The light emitting device 11 is configured as a light emitting module in which a plurality of, for example, GaN-based light emitting diodes 12 which are fixed light emitting elements are arranged as light emitting elements.

発光装置11は、例えば樹脂、ガラス、セラミックスなどの絶縁性を有する材料で形成された四角形状の基材15を有し、この基材15の表面16には、複数の発光ダイオード12が配置される複数の凹状でかつ溝状の収容部17が平行に形成されている。各収容部17は、発光ダイオード12が取り付けられる取付面18、この取付面18から表面16側へ向けて拡開する両側の傾斜面19を有し、収容部17の溝の長手方向に沿って複数の発光ダイオード12が等間隔に配列されている。この収容部17の内面は反射面17aに構成されている。   The light emitting device 11 includes a rectangular base material 15 formed of an insulating material such as resin, glass, ceramics, and the like, and a plurality of light emitting diodes 12 are disposed on the surface 16 of the base material 15. A plurality of concave and groove-like accommodation portions 17 are formed in parallel. Each accommodating portion 17 has an attachment surface 18 to which the light emitting diode 12 is attached, and inclined surfaces 19 on both sides that expand from the attachment surface 18 toward the surface 16, and along the longitudinal direction of the groove of the accommodation portion 17. A plurality of light emitting diodes 12 are arranged at equal intervals. The inner surface of the accommodating portion 17 is configured as a reflecting surface 17a.

基材15の表面16には、収容部17が並ぶ並設方向の両端の表面16の位置に収容部17の長手方向に沿って電極パターン20が形成され、収容部17間の表面16の位置に発光ダイオード12の位置に対応して電極パターン21が形成されている。基材15の両端には各電極パターン20に接続されたプラス電極とマイナス電極とである両極の各電極部22が突設されている。   On the surface 16 of the base material 15, the electrode pattern 20 is formed along the longitudinal direction of the accommodating portion 17 at the positions of the surfaces 16 at both ends in the juxtaposed direction in which the accommodating portions 17 are arranged, and the position of the surface 16 between the accommodating portions 17 An electrode pattern 21 is formed corresponding to the position of the light emitting diode 12. At both ends of the base material 15, electrode portions 22 of both electrodes, which are a plus electrode and a minus electrode, connected to each electrode pattern 20 are projected.

基材15は周囲に密着固定される四角形枠状の枠部23を有し、この枠部23は例えば樹脂、ガラス、セラミックスなどの絶縁性を有する材料で形成され、枠部23の先端は基材15の表面16より突出されており、両側面から電極部22がそれぞれ突出されている。なお、枠部23は基材15に一体に形成していてもよい。   The base material 15 has a rectangular frame-like frame portion 23 that is closely fixed to the periphery. The frame portion 23 is formed of an insulating material such as resin, glass, ceramics, and the tip of the frame portion 23 is based on the base. It protrudes from the surface 16 of the material 15, and electrode portions 22 protrude from both side surfaces. The frame portion 23 may be formed integrally with the base material 15.

また、発光ダイオード12は、チップ状で、両端にアノードおよびカソードの電極がそれぞれ形成されているとともにこれら電極間の表面に光を発光する発光部が形成されている。発光ダイオード12の裏面が絶縁状態で基材15の収容部17に取り付けられ、基材15の収容部17の長手方向と交差する方向に並ぶ複数の発光ダイオード12の電極と電極パターン20，21とをボンディングワイヤ26によって接続し、複数の発光ダイオード12が直列に接続されている。すなわち、図３に示すように、複数の発光ダイオード12が直列に接続された直列回路が、電極部22間に並列に形成された状態となる。   The light emitting diode 12 has a chip shape, and anode and cathode electrodes are formed on both ends, and a light emitting portion for emitting light is formed on the surface between these electrodes. The back surface of the light emitting diode 12 is attached to the housing portion 17 of the base material 15 in an insulated state, and the electrodes of the plurality of light emitting diodes 12 arranged in the direction intersecting the longitudinal direction of the housing portion 17 of the base material 15 and the electrode patterns 20, 21 Are connected by a bonding wire 26, and a plurality of light emitting diodes 12 are connected in series. That is, as shown in FIG. 3, a series circuit in which a plurality of light emitting diodes 12 are connected in series is formed in parallel between the electrode portions 22.

また、基材15の表面16側を覆って光透過部材29が配設されている。この光透過部材29は、例えば透明なガラス板や透明な樹脂板で構成され、枠部23を含む基材15の外形状に対応して四角形板状に形成されており、光透過部材29の周辺部が基材15の枠部23の先端に封着材30によって封着され、光透過部材29と基材15との間に密閉空間31を形成している。   Further, a light transmitting member 29 is disposed so as to cover the surface 16 side of the substrate 15. The light transmissive member 29 is made of, for example, a transparent glass plate or a transparent resin plate, and is formed in a rectangular plate shape corresponding to the outer shape of the base material 15 including the frame portion 23. The peripheral portion is sealed with the sealing material 30 at the tip of the frame portion 23 of the base material 15, and a sealed space 31 is formed between the light transmitting member 29 and the base material 15.

封着材30は、光透過部材29および基材15の枠部23がガラス系の場合、フリットガラス、低融点ガラス、セラミック、合金（Ｆｅ−Ｎｉ、Ｆｅ−Ｃｒ、Ｆｅ−Ｎｉ−Ｃｒ、コバールなど）、ロウ材（金錫合金、金ゲルマニウム合金、銀ロウなど）、はんだ（錫鉛など）のいずれか１つまたはこれらを組み合わせた無機材料にて構成されている。また、光透過部材29および基材15の枠部23が樹脂系の場合、エポキシ樹脂、ポリウレタン樹脂、メラミン樹脂、フェノール樹脂、アクリル樹脂、シリコーン樹脂、ポリアミド樹脂、ポリオレフィン樹脂、およびポリエステル樹脂のいずれか１つまたはこれらを組み合わせた有機材料にて構成されている。これら基材15と光透過部材29との封着に適した封着材30を選択することにより、確実な封着機能を得ることができる。   In the case where the light transmitting member 29 and the frame portion 23 of the base material 15 are made of glass, the sealing material 30 is made of frit glass, low melting glass, ceramic, alloy (Fe—Ni, Fe—Cr, Fe—Ni—Cr, Kovar). Etc.), brazing material (gold-tin alloy, gold-germanium alloy, silver brazing, etc.), solder (tin-lead, etc.), or an inorganic material combining these. Further, when the light transmitting member 29 and the frame portion 23 of the base material 15 are resin-based, any of epoxy resin, polyurethane resin, melamine resin, phenol resin, acrylic resin, silicone resin, polyamide resin, polyolefin resin, and polyester resin It is comprised with the organic material which combined one or these. By selecting a sealing material 30 suitable for sealing the base material 15 and the light transmitting member 29, a reliable sealing function can be obtained.

光透過部材29の内面には蛍光体層32の膜が形成されている。この蛍光体層32は、Ｃｅ付活アルミン酸塩（Ｙ）、Ｓｍ−Ｅｕ付活硫酸化ランタン、Ｅｕ付活リン酸塩（Ｓｒ、Ｃａ、Ｂａ）、Ｅｕ−Ｍｎ付活アルミン酸塩（Ｂａ、Ｍｇ）などの蛍光体を光透過部材29の内面に塗布し、焼成することで焼き付けている。   A film of the phosphor layer 32 is formed on the inner surface of the light transmitting member 29. This phosphor layer 32 is made of Ce-activated aluminate (Y), Sm-Eu activated sulfated lanthanum, Eu activated phosphate (Sr, Ca, Ba), Eu-Mn activated aluminate (Ba). , Mg) or the like is applied to the inner surface of the light transmitting member 29 and baked by baking.

光透過部材29の内面にはこの光透過部材29と蛍光体層32との間に紫外線吸収層33の膜が形成されている。この紫外線吸収層33は、酸化チタン、酸化亜鉛、酸化セリウムなどの微粒子を光透過部材29の内面に塗布し、焼成することで焼き付けている。   On the inner surface of the light transmitting member 29, a film of an ultraviolet absorbing layer 33 is formed between the light transmitting member 29 and the phosphor layer 32. The ultraviolet absorbing layer 33 is baked by applying fine particles such as titanium oxide, zinc oxide, cerium oxide or the like on the inner surface of the light transmitting member 29 and baking it.

密閉空間31には、大気圧程度に加圧した不活性ガス34が封入されている。   The sealed space 31 is filled with an inert gas 34 pressurized to about atmospheric pressure.

そして、両電極部22間に発光電流を流すことにより、これら両電極部22間に並列に接続された直列回路の各発光ダイオード12が発光する。各発光ダイオード12が発光した光は、光透過部材29へ直接向うか、収容部17の反射面17aで反射して光透過部材29へ向かい、光透過部材29の内面に形成された蛍光体層32を励起し、励起した発光体層32から所望の光色の光が光透過部材29を透過して光透過部材29の外面から出射する。   Then, by causing a light emission current to flow between the electrode portions 22, the light emitting diodes 12 of the series circuit connected in parallel between the electrode portions 22 emit light. The light emitted by each light emitting diode 12 is directed directly to the light transmitting member 29 or reflected by the reflecting surface 17a of the housing portion 17 toward the light transmitting member 29, and the phosphor layer formed on the inner surface of the light transmitting member 29 The light 32 having the desired light color is transmitted through the light transmitting member 29 and emitted from the outer surface of the light transmitting member 29.

光透過部材29の内面に蛍光体層32の膜を焼成形成したため、蛍光体のバインダとしてエポキシ樹脂などを使用せず、エポキシ樹脂の劣化による光透過率の低下を防止でき、発光ダイオード12の長寿命な特長を十分に活かせて、発光装置11として長寿命にできる。   Since the phosphor layer 32 film is baked and formed on the inner surface of the light transmitting member 29, no epoxy resin or the like is used as the phosphor binder, so that the light transmittance can be prevented from being lowered due to the deterioration of the epoxy resin. By making full use of the long-life features, the light-emitting device 11 can have a long life.

光透過部材29の内面に紫外線吸収層33の膜を形成したため、蛍光体層32に吸収されずに透過する紫外線を紫外線吸収層33で吸収し、光透過部材29に到達する紫外線を低減することにより、特に樹脂製の光透過部材29の場合に紫外線による劣化を防止でき、発光装置11として長寿命にできる。   Since the film of the ultraviolet absorbing layer 33 is formed on the inner surface of the light transmitting member 29, the ultraviolet absorbing layer 33 absorbs the ultraviolet light that is transmitted without being absorbed by the phosphor layer 32, and reduces the ultraviolet light reaching the light transmitting member 29. Therefore, in particular, in the case of the resin-made light transmitting member 29, deterioration due to ultraviolet rays can be prevented, and the life of the light emitting device 11 can be extended.

また、基材15と光透過部材29とを封着材30で封着してこれら基材15と光透過部材29との間に密閉空間31を形成し、この密閉空間31に不活性ガス34を封入したため、発光ダイオード12、電極パターン20，21、ボンディングワイヤ26、蛍光体層32などが大気に触れないので、これらの酸化を防止できる。なお、密閉空間31を真空にしても同様の作用効果が得られる。   Further, the base material 15 and the light transmitting member 29 are sealed with a sealing material 30 to form a sealed space 31 between the base material 15 and the light transmitting member 29, and an inert gas 34 is formed in the sealed space 31. Since the LED is enclosed, the light emitting diode 12, the electrode patterns 20, 21, the bonding wire 26, the phosphor layer 32, and the like do not come into contact with the atmosphere, so that oxidation thereof can be prevented. The same effect can be obtained even if the sealed space 31 is evacuated.

なお、密閉空間31には、不活性ガス34に代えて、例えばゲル状のシリコーン樹脂などの透明充填材を充填してもよい。この場合には、基材15と光透過部材29との間に屈折率が高い大気が介在する場合に比べて、発光ダイオード12が発光した光の取出効率を向上できる。さらに、発光ダイオード12、電極パターン20，21、ボンディングワイヤ26、蛍光体層32などが大気に触れないので、これらの酸化を防止できる。また、ゲル状のシリコーン樹脂を用いる場合でも、密閉空間31に充填することで、外部からの塵埃などの付着のおそれがない。   The sealed space 31 may be filled with a transparent filler such as a gel silicone resin instead of the inert gas 34. In this case, the light extraction efficiency of the light emitted by the light emitting diode 12 can be improved as compared with the case where an atmosphere having a high refractive index is interposed between the base material 15 and the light transmitting member 29. Furthermore, since the light emitting diode 12, the electrode patterns 20, 21, the bonding wire 26, the phosphor layer 32, and the like do not come into contact with the atmosphere, their oxidation can be prevented. Even when a gel-like silicone resin is used, filling the sealed space 31 eliminates the possibility of adhesion of dust and the like from the outside.

また、密閉空間31には、発光ダイオード12などを覆う特定の形状に透明充填材を形成するとともに、密閉空間31の透明充填材との隙間に不活性ガス34を封入してもよい。この場合には、不活性ガス34を封入することで、密閉空間31内が所定圧力に保たれるので、透明充填材にゲル状シリコーンなどを使用しても、透明充填材を特定の形状に保つことができる。   Further, in the sealed space 31, a transparent filler may be formed in a specific shape that covers the light emitting diode 12 and the like, and an inert gas 34 may be enclosed in a gap between the sealed space 31 and the transparent filler. In this case, since the inside of the sealed space 31 is maintained at a predetermined pressure by enclosing the inert gas 34, even if gel-like silicone or the like is used for the transparent filler, the transparent filler has a specific shape. Can keep.

次に、図４に第２の実施の形態を示す。各発光ダイオード12の周囲を例えばゲル状のシリコーン樹脂などの透明樹脂41で覆い、密閉空間31には例えば２気圧程度の不活性ガス34を封入する。   Next, FIG. 4 shows a second embodiment. The periphery of each light emitting diode 12 is covered with a transparent resin 41 such as a gel-like silicone resin, and an inert gas 34 of about 2 atm, for example, is sealed in the sealed space 31.

発光ダイオード12の周囲を透明樹脂41で覆うことにより、発光ダイオード12の周囲を屈折率が高い大気が囲む場合に比べて、発光ダイオード12が発光した光の取出効率を向上できる。また、ゲル状のシリコーン樹脂を用いる場合でも、密閉空間31に位置することで、外部からの塵埃などの付着のおそれがない。   By covering the periphery of the light emitting diode 12 with the transparent resin 41, it is possible to improve the light extraction efficiency of the light emitted by the light emitting diode 12 as compared to the case where the periphery of the light emitting diode 12 is surrounded by an atmosphere having a high refractive index. Even when a gel-like silicone resin is used, since it is located in the sealed space 31, there is no risk of adhesion of dust and the like from the outside.

密閉空間31には例えば２気圧程度の不活性ガス34を封入することにより、酸化防止できるほかに、透明樹脂41の形状を保つことができるとともに、透明樹脂41が発光ダイオード12から脱落するのを防止できる。   In addition to preventing oxidation by sealing an inert gas 34 of, for example, about 2 atmospheres in the sealed space 31, the shape of the transparent resin 41 can be maintained, and the transparent resin 41 can be prevented from dropping from the light emitting diode 12. Can be prevented.

次に、図５および図６に第３の実施の形態を示す。基材15の収容部17の取付面18で各発光ダイオード12の両側位置に、基材15の表面側と裏面側とに貫通する一対のスルーホール44を設け、これらスルーホール44を通じて発光ダイオード12の両電極に接続された各ワイヤ45を通して基材15の外部に引き出して配線し、各スルーホール44内を封止材46で封止する。基材15の枠部23は一体に形成する。   Next, FIGS. 5 and 6 show a third embodiment. A pair of through-holes 44 penetrating the front surface side and the back surface side of the base material 15 are provided on both sides of each light-emitting diode 12 on the mounting surface 18 of the housing portion 17 of the base material 15, and the light-emitting diode 12 passes through these through-holes 44. The wires 45 connected to both the electrodes are drawn out to the outside of the base material 15 and wired, and the inside of each through hole 44 is sealed with a sealing material 46. The frame portion 23 of the base material 15 is integrally formed.

このように発光ダイオード12のワイヤ45を発光ダイオード12の取付面18から基材15の外部に引き出して配線することにより、発光ダイオード12の表面から発光した光に対するワイヤ45の影響を低減でき、光取出効率を向上できる。   In this way, by drawing the wire 45 of the light emitting diode 12 from the mounting surface 18 of the light emitting diode 12 to the outside of the base material 15 and wiring it, the influence of the wire 45 on the light emitted from the surface of the light emitting diode 12 can be reduced, and the light Extraction efficiency can be improved.

次に、図７および図８に第４の実施の形態を示す。基材15の収容部17を各発光ダイオード12毎に個別に形成する。各収容部17は、正方形の取付面18の４辺から傾斜面19が表面16側に拡開して形成され、これら取付面18および４面の傾斜面19によって反射面17aが形成されている。   Next, FIGS. 7 and 8 show a fourth embodiment. The accommodating portion 17 of the base material 15 is individually formed for each light emitting diode 12. Each accommodating portion 17 is formed by expanding the inclined surface 19 from the four sides of the square mounting surface 18 to the surface 16 side, and a reflecting surface 17a is formed by the mounting surface 18 and the four inclined surfaces 19. .

このように基材15の収容部17つまり反射面17aを発光ダイオード12毎に個別に形成することにより、発光ダイオード12が発光した光の反射効率を向上させ、光取出効率を向上できる。   Thus, by forming the accommodating portion 17 of the base material 15, that is, the reflection surface 17a for each light emitting diode 12, the reflection efficiency of the light emitted from the light emitting diode 12 can be improved, and the light extraction efficiency can be improved.

次に、図９に第５の実施の形態を示す。基材15の表面の中央全域に１つの収容部17が形成され、この収容部17の取付面18に複数の発光ダイオード12が配列されている。   Next, FIG. 9 shows a fifth embodiment. One housing portion 17 is formed over the entire center of the surface of the base material 15, and a plurality of light emitting diodes 12 are arranged on the mounting surface 18 of the housing portion 17.

収容部17内を含む基材15の表面16側の全域には、例えばアルミニウムなどの反射率の高い金属が蒸着、またはその金属で被覆されて、反射面17aが構成されているとともに、プラス側の電極部22に接続された電極パターン49とマイナス側の電極部22に接続された電極パターン50とが形成されている。   The entire region on the surface 16 side of the base material 15 including the inside of the accommodating portion 17 is vapor-deposited or covered with a metal having a high reflectivity such as aluminum, for example, and a reflective surface 17a is formed. An electrode pattern 49 connected to the electrode portion 22 and an electrode pattern 50 connected to the negative electrode portion 22 are formed.

プラス側の電極部22とマイナス側の電極部22との間であって、プラス側の電極部22に近い位置には、プラス側の電極パターン49とマイナス側の電極パターン50とを電気的に分断するスリット51が形成されている。   The positive electrode pattern 49 and the negative electrode pattern 50 are electrically connected between the positive electrode portion 22 and the negative electrode portion 22 and close to the positive electrode portion 22. A slit 51 for dividing is formed.

各発光ダイオード12はマイナス側の電極パターン50上に絶縁状態で実装され、複数の発光ダイオード12がボンディングワイヤ52によって直列に接続されているとともに、両端の各発光ダイオード12がボンディングワイヤ52によって各電極パターン49，50に接続されている。   Each light-emitting diode 12 is mounted in an insulated state on the negative electrode pattern 50, a plurality of light-emitting diodes 12 are connected in series by bonding wires 52, and each light-emitting diode 12 at both ends is connected to each electrode by bonding wires 52 Connected to patterns 49 and 50.

このように、反射面17aを兼ねる電極パターン49，50によって発光ダイオード12が発光した光の取出効率を向上でき、しかも、反射面17aを兼ねたうえで、電極パターン49，50として確実に機能させることができる。   As described above, the extraction efficiency of light emitted from the light emitting diode 12 can be improved by the electrode patterns 49 and 50 also serving as the reflecting surface 17a, and the electrode patterns 49 and 50 can function reliably while also serving as the reflecting surface 17a. be able to.

高圧側であるプラス側の電極パターン49を小さく、低圧側であるマイナス側の電極パターン50を大きくすることにより、発光ダイオード12などに対する電気的な影響を低減できる。   By making the positive electrode pattern 49 on the high voltage side small and the negative electrode pattern 50 on the low voltage side large, the electrical influence on the light emitting diode 12 and the like can be reduced.

なお、光透過部材29は、板体に限らず、各発光ダイオード12毎に制光するレンズを形成したレンズ体でもよい。   The light transmissive member 29 is not limited to a plate body, and may be a lens body in which a lens for controlling light for each light emitting diode 12 is formed.

本発明の第１の実施の形態を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows the 1st Embodiment of this invention. 同上発光装置の光透過部材を外した状態の正面図である。It is a front view of the state which removed the light transmissive member of the light-emitting device same as the above. 同上発光装置の発光ダイオードの配線回路を示す模式図である。It is a schematic diagram which shows the wiring circuit of the light emitting diode of a light emitting device same as the above. 本発明の第２の実施の形態を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows the 2nd Embodiment of this invention. 本発明の第３の実施の形態を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows the 3rd Embodiment of this invention. 同上発光装置の光透過部材を外した状態の正面図である。It is a front view of the state which removed the light transmissive member of the light-emitting device same as the above. 本発明の第４の実施の形態を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows the 4th Embodiment of this invention. 同上発光装置の光透過部材を外した状態の正面図である。It is a front view of the state which removed the light transmissive member of the light-emitting device same as the above. 本発明の第５の実施の形態を示す発光装置の断面図である。It is sectional drawing of the light-emitting device which shows the 5th Embodiment of this invention.

符号の説明Explanation of symbols

11 発光装置
12 発光素子としての発光ダイオード
15 基材
17a 反射面
29 光透過部材
30 封着材
31 密閉空間
32 蛍光体層
33 紫外線吸収層
34 不活性ガス
49，50 電極パターン
52 ボンディングワイヤ 11 Light emitting device
12 Light-emitting diodes as light-emitting elements
15 Base material
17a Reflective surface
29 Light transmissive member
30 Sealing material
31 Sealed space
32 Phosphor layer
33 UV absorbing layer
34 Inert gas
49, 50 electrode pattern
52 Bonding wire

Claims (5)

発光素子と；
発光素子を実装した基材と；
発光素子に対向し発光素子が発光する光で励起される蛍光体層が形成された光透過部材と；
を具備していることを特徴とする発光装置。 A light emitting element;
A substrate on which a light emitting element is mounted;
A light transmissive member formed with a phosphor layer facing the light emitting element and excited by light emitted from the light emitting element;
A light-emitting device comprising: 基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に不活性ガスを封入したことを特徴とする請求項１記載の発光装置。   The base material and the light transmissive member are sealed with a sealing material to form a sealed space between the base material and the light transmissive member, and an inert gas is sealed in the sealed space. The light emitting device according to 1. 基材と光透過部材とを封着材で封着してこれら基材と光透過部材との間に密閉空間を形成し、この密閉空間に透明充填材を充填したことを特徴とする請求項１または２記載の発光装置。   The base material and the light transmissive member are sealed with a sealing material to form a sealed space between the base material and the light transmissive member, and the sealed space is filled with a transparent filler. 3. The light emitting device according to 1 or 2. 光透過部材の発光素子に対向する内面に紫外線吸収層を設けたことを特徴とする請求項１ないし３いずれか一記載の発光装置。   4. The light emitting device according to claim 1, wherein an ultraviolet absorbing layer is provided on an inner surface of the light transmitting member facing the light emitting element. 発光素子を実装する基材の表面に反射面を兼ねる電極パターンを形成し、この基材の電極パターン上に複数の発光素子を絶縁状態に実装し、ボンディングワイヤによって複数の発光素子を直列に接続するとともに両端の発光素子を電極パターンに接続したことを特徴とする請求項１ないし４いずれか一記載の発光装置。   An electrode pattern that also serves as a reflective surface is formed on the surface of the substrate on which the light-emitting element is mounted. A plurality of light-emitting elements are mounted in an insulating state on the electrode pattern of the substrate, and the plurality of light-emitting elements are connected in series by bonding wires. The light emitting device according to claim 1, wherein the light emitting elements at both ends are connected to the electrode pattern.
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