CN210516748U

CN210516748U - Packaged high-power LED lamp based on aluminum nitride ceramic substrate

Info

Publication number: CN210516748U
Application number: CN201921823962.1U
Authority: CN
Inventors: 王焕卿; 陈克风
Original assignee: Shenzhen Jingyue Electronics Co Ltd
Current assignee: Shenzhen Jingyue Electronics Co Ltd
Priority date: 2019-10-28
Filing date: 2019-10-28
Publication date: 2020-05-12
Anticipated expiration: 2029-10-28

Abstract

The utility model belongs to the technical field of light emitting diodes and discloses a packaged high-power LED lamp based on an aluminum nitride ceramic substrate, which comprises a substrate, wherein a copper foil layer is arranged on the top of the substrate, and the top of the base plate is provided with a slot, the slot is internally provided with an inserting plate, the top of the inserting plate is connected with an LED chip, the top of the LED chip is provided with a colloid, gold wires are fixed on both sides of the LED chip, one end of each gold wire, which is far away from the LED chip, is connected with the copper foil layer, the end of the inserting plate extending to the outside of the base plate is fixed with a clamping block, the side wall of the base plate near one side of the slot is provided with a clamping groove matched with the clamping block, the inserting plate and the slot are mutually clamped, the clamping block and the clamping groove are mutually clamped, so that the inserting plate is firmly fixed on the base plate, and then make the LED chip can stabilize on the base plate, pull out the picture peg through the connector simultaneously and can demolish the LED chip of a certain row fast.

Description

Packaged high-power LED lamp based on aluminum nitride ceramic substrate

Technical Field

The utility model belongs to the technical field of emitting diode, concretely relates to high-power LED lamp of encapsulation based on aluminium nitride ceramic substrate.

Background

The basic structure of the LED lamp is an electroluminescent semiconductor material chip, silver glue or white glue is solidified on a support, then the chip and a circuit board are connected by silver wires or gold wires, then the periphery of the chip and the circuit board are sealed by epoxy resin, the effect of protecting an internal core wire is achieved, and finally a shell is installed.

But the high-power LED lamp of encapsulation based on aluminium nitride ceramic substrate in the existing market has more defect in the in-process of using, for example, because aluminium nitride ceramic substrate can install the more LED chip of quantity, it is inconvenient not only to lead to the operation when installing, and can't be quick demolish the LED chip, and in addition, the luminance of LED chip in the in-process light source that uses is lower, and the blue light that sends can cause serious harm to the human eye to influence the quality of LED lamp.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-power LED lamp of encapsulation based on aluminium nitride ceramic substrate to the installation operation of proposing is inconvenient in solving above-mentioned background art, and the luminance of light source is lower, and the blue light that sends can cause the problem of serious harm to the human eye.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-power LED lamp of encapsulation based on aluminium nitride ceramic substrate, includes the base plate, the copper foil layer is installed at the top of base plate, and the top of base plate begins to have the slot, the internally mounted of slot has the picture peg, the top of picture peg is connected with the LED chip, the colloid is installed at the top of LED chip, and the both sides of LED chip all are fixed with the gold thread, the one end that the LED chip was kept away from to the gold thread is connected with the copper foil layer, the picture peg extends to the outside one end of base plate and is fixed with the fixture block, the connector is installed to the one end that the picture peg was kept away from to the fixture block, the lateral wall of base plate is.

Preferably, a fixing seat is installed on the outer wall of the LED chip, the top of the fixing seat is connected with a glass transparent cover, a light reflecting sheet is installed on one side, close to the LED chip, of the inner wall of the fixing seat, the outer wall of the glass transparent cover is connected with a light filtering film, and a fluorescent coating is coated on the outer wall of the colloid.

Preferably, the inner wall of the slot is provided with a rubber pad, and the outer wall of the rubber pad is provided with an anti-slip groove.

Preferably, the outer wall of the connector is provided with an annular groove, and the outer wall of the connector is smooth.

Preferably, the heat dissipation holes are formed in the base plate, and the light reflecting sheet is of an arc-shaped structure.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses a picture peg and the mutual block of slot, fixture block and the mutual block of draw-in groove to make the picture peg firmly on the base plate, and then make the LED chip can stabilize on the base plate, extract the LED chip that the picture peg can demolish a certain row fast through the connector simultaneously.

(2) The utility model discloses a light that the inside reflection of light piece of fixing base can reflect the LED chip and send can assemble the light that jets out through the glass lens simultaneously to reduce the light diffusion, improve luminous luminance, can reduce the blue light through filter coating and fluorescence coating, thereby avoid people's eye damage.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention;

FIG. 3 is a schematic view of the internal structure of the fixing base of the present invention;

FIG. 4 is an enlarged view of portion A of FIG. 2

In the figure: 1-a substrate; 2-copper foil layer; 3-fixing the base; 4-glass transparent cover; 5-a light filtering film; 6-gold wire; 7-inserting plates; 8-slot; 9-a reflective sheet; 10-an LED chip; 11-a connector; 12-a colloid; 13-fluorescent coating; 14-a rubber pad; 15-a card slot; 16-an annular groove; 17-a fixture block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides the following technical solutions: a packaged high-power LED lamp based on an aluminum nitride ceramic substrate comprises a substrate 1, wherein a copper foil layer 2 is installed on the top of the substrate 1, a slot 8 is formed in the top of the substrate 1, an inserting plate 7 is installed inside the slot 8, an LED chip 10 is connected to the top of the inserting plate 7, a colloid 12 is installed on the top of the LED chip 10, gold wires 6 are fixed to two sides of the LED chip 10, one end, away from the LED chip 10, of each gold wire 6 is connected with the copper foil layer 2, a clamping block 17 is fixed to one end, extending to the outside of the substrate 1, of the inserting plate 7, a connecting head 11 is installed at one end, away from the inserting plate 7, of each clamping block 17, clamping grooves 15 matched with the clamping blocks 17 are formed in the position, close to one side of the slot 8, of the side wall of the substrate 1, the LED chips 10 are arranged in groups by mounting a plurality of inserting plates 7 on the substrate 1, then insert picture peg 7 respectively, through picture peg 7 and slot 8 block each other, block 17 and draw-in groove 15 block each other to make picture peg 7 firm on base plate 1, and then make LED chip 10 can stabilize on base plate 1, pull out picture peg 7 through connector 11 simultaneously and can dismantle the LED chip 10 of a certain row fast.

Further, fixing base 3 is installed to the outer wall of LED chip 10, the top of fixing base 3 is connected with glass lens 4, and reflector 9 is installed to one side that the inner wall of fixing base 3 is close to LED chip 10, the outer wall connection of glass lens 4 has filter coating 5, filter coating 5 adopts the nanometer layer to build up and prevents the blue light membrane material, itself has good blue light effect that blocks, can effectively filter the blue light that the LED lamp produced, phosphor coating 13 can receive to arouse when LED chip 10 is luminous and keep apart the blue light, phosphor coating 13 has been paintd on the outer wall of colloid 12, the light that LED chip 10 sent can be reflected through reflector 9 inside fixing base 3, simultaneously can assemble the light of emiting through glass lens 4, thereby reduce light diffusion, improve luminance, can reduce the blue light through filter coating 5 and phosphor coating 13, thereby avoid people's eye damage.

Furthermore, a rubber pad 14 is installed on the inner wall of the slot 8, the rubber pad 14 plays a role of skid resistance, and a skid-proof groove is formed in the outer wall of the rubber pad 14.

Specifically, the outer wall of the connector 11 is provided with an annular groove 16, the annular groove 16 plays a role in facilitating the buckling of the connector 11, and the outer wall of the connector 11 is smooth.

Specifically, heat dissipation holes are formed in the substrate 1, the heat dissipation holes play a role in heat dissipation, and the reflector 9 is of an arc-shaped structure.

The utility model discloses a theory of operation and use flow: when the utility model is used, firstly, the LED chip 10 is installed in the fixed seat 3 on the plug board 7, then the plug board 7 is inserted into the slot 8, then the plug board 7 is mutually clamped with the slot 8, the clamping block 17 is mutually clamped with the clamping groove 15, thus the plug board 7 is firmly arranged on the substrate 1, further the LED chip 10 can be firmly arranged on the substrate 1, then the LED chip is LED out of the fixed seat 3 through the gold thread 6 and is connected with the copper foil layer 2, in the using process, the light emitted by the LED chip 10 can be reflected through the reflecting sheet 9 in the fixed seat 3, meanwhile, the emitted light can be gathered through the glass through cover 4, thereby the light diffusion is reduced, the luminous brightness is improved, the blue light can be reduced through the filter film 5 and the fluorescent coating 13, thereby the damage of human eyes is avoided, the heat dissipation effect is achieved through the heat dissipation holes in the substrate 1, the substrate, the LED chip mounting structure has good heat dissipation performance, meanwhile, the LED chips 10 in a certain row can be quickly dismounted by pulling out the plug board 7 through the connector 11, and the operation is simple and convenient.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-power LED lamp of encapsulation based on aluminium nitride ceramic substrate which characterized in that: including base plate (1), copper foil layer (2) are installed at the top of base plate (1), and the top of base plate (1) begins to have slot (8), the internally mounted of slot (8) has picture peg (7), the top of picture peg (7) is connected with LED chip (10), colloid (12) are installed at the top of LED chip (10), and the both sides of LED chip (10) all are fixed with gold thread (6), the one end that LED chip (10) were kept away from in gold thread (6) is connected with copper foil layer (2), picture peg (7) extend to base plate (1) outside one end and are fixed with fixture block (17), fixture block (17) are kept away from the one end of picture peg (7) and are installed connector (11), the lateral wall of base plate (1) is close to the position department of slot (8) one side and offers with fixture block (17) assorted draw-in groove (15).

2. The packaged high-power LED lamp based on the aluminum nitride ceramic substrate as claimed in claim 1, wherein: fixing base (3) are installed to the outer wall of LED chip (10), the top of fixing base (3) is connected with glass translucent cover (4), and one side that the inner wall of fixing base (3) is close to LED chip (10) installs reflector panel (9), the outer wall of glass translucent cover (4) is connected with filter coating (5), fluorescent coating (13) have been paintd to the outer wall of colloid (12).

3. The packaged high-power LED lamp based on the aluminum nitride ceramic substrate as claimed in claim 1, wherein: the inner wall of the slot (8) is provided with a rubber pad (14), and the outer wall of the rubber pad (14) is provided with an anti-slip groove.

4. The packaged high-power LED lamp based on the aluminum nitride ceramic substrate as claimed in claim 1, wherein: the outer wall of the connector (11) is provided with an annular groove (16), and the outer wall of the connector (11) is smooth.

5. The packaged high-power LED lamp based on the aluminum nitride ceramic substrate as claimed in claim 1, wherein: the heat dissipation holes are formed in the base plate (1), and the light reflecting pieces (9) are of arc-shaped structures.