CN204905299U

CN204905299U - One -way luminous LED light emitting component COB packaging structure , LED light source and LED lamps and lanterns

Info

Publication number: CN204905299U
Application number: CN201420617130.5U
Authority: CN
Inventors: 赖勇清
Original assignee: FUJIAN YDJ LIGHT Co Ltd
Current assignee: FUJIAN YDJ LIGHT Co Ltd
Priority date: 2014-10-23
Filing date: 2014-10-23
Publication date: 2015-12-23
Anticipated expiration: 2024-10-23

Abstract

An object of the utility model is to provide a base plate simple process, can reduce material cost, and can improve production efficiency's one -way luminous LED light emitting component COB packaging structure, LED light source and LED lamps and lanterns. One -way luminous LED light emitting component COB packaging structure, including glass substrate, LED chip and fluorescence arogel, the last one deck reflection of light heat conduction conducting layer that sets up of glass substrate will reflection of light heat conduction conducting layer preparation forming circuit and power supply electrode, LED chip fixed mounting is at the upper surface of reflection of light heat conduction conducting layer to LED chip around surface covering fluorescence arogel is connected with circuit and power supply electrode. Reflection of light heat conduction conducting layer is mirror surface alumina layer or silver layer. Simultaneously the utility model discloses can also with LED light emitting component COB packaging structure be applied to LED lamp, LED integration lamps and lanterns or LED intelligent control lamps and lanterns, greatly the save material cost, can improve production efficiency.

Description

Unidirection luminous LED light-emitting component COB encapsulating structure, LED light source and LED lamp

Technical field

The utility model belongs to LED technology field, is specifically related to a kind of LED light-emitting component COB encapsulating structure.

Background technology

The COB structure of LED light-emitting component is owing to being directly encapsulated on substrate by LED chip, the packaging technology of lamp pearl support and complexity thereof is not needed with LED lamp bead structural rate, therefore have flow process simple, save material, along with COB packaging technology is constantly improved, inherently replace existing LED lamp bead structure, become the main flow packaging technology of LED.

The substrate that LED light-emitting component COB encapsulates, be generally aluminium base, as Fig. 1, its structure is aluminium sheet 10, insulating barrier 20, circuit layer 30, reflector layer 40, packaged chip 50 and phosphor gel 60 on aluminium base 10; Or be ceramic substrate, as Fig. 2, its structure is the ceramic wafer 100 with reflective surface 101, circuit layer 200, packaged chip 300 and phosphor gel 400 on the reflective surface 101 of ceramic substrate 100; .Existing LEDCOB light-emitting component mainly as in the point-source of light product required at optically focused, as PAR lamp, MR lamp.But LEDCOB light-emitting component is as the application of line source, area source, there is the shortcomings such as substrate process complexity, material cost is high, production efficiency is low in existing LEDCOB encapsulating structure.

Utility model content

The purpose of this utility model be to provide a kind of substrate process simple, can material cost be reduced and the unidirection luminous LED light-emitting component COB encapsulating structure that can enhance productivity and application thereof.

A kind of unidirection luminous LED light-emitting component COB encapsulating structure, comprise glass substrate, LED chip and phosphor gel, it is characterized in that, glass substrate is arranged the reflective heat-conductivity conducting layer of one deck, described reflective heat-conductivity conducting layer is made and forms circuit and power electrode, described LED chip is fixedly mounted on the upper surface of reflective heat-conductivity conducting layer, and is connected with circuit and power electrode, and LED chip circumferential surface covers phosphor gel.

Described reflective heat-conductivity conducting layer is minute surface alumina layer or silver layer.

The thickness of described reflective heat-conductivity conducting layer is 5-100 micron.

Described reflective heat-conductivity conducting layer makes the circuit formed can be set to formal dress chip circuit, also can be set to flip-chip circuit.

The application in LED light source of a kind of unidirection luminous LED light-emitting component COB encapsulating structure described in the utility model is as follows:

A kind of LED light source, comprise plastic casing, LED light-emitting component and transparent protective shield, described LED light-emitting component is arranged in the confined space of plastic casing and transparent protective shield formation, LED light-emitting component and also embedding heat conductive transparent glue between plastic casing and transparent protective shield, described LED light-emitting component adopts unidirection luminous LED light-emitting component COB encapsulating structure, comprise glass substrate, LED chip and phosphor gel, it is characterized in that, glass substrate is arranged the reflective heat-conductivity conducting layer of one deck, described reflective heat-conductivity conducting layer is made and forms circuit and power electrode, described LED chip is fixedly mounted on the upper surface of reflective heat-conductivity conducting layer, and be connected with circuit and power electrode, LED chip circumferential surface covers phosphor gel.

Unidirection luminous LED light-emitting component COB encapsulating structure described in the utility model can also be applied in LED, LED lamp and LED Based Intelligent Control light fixture respectively simultaneously.

The advantage of LED light-emitting component described in the utility model is: owing to glass substrate being arranged the reflective heat-conductivity conducting layer of one deck, is made by described reflective heat-conductivity conducting layer and forms circuit and power electrode, has following effect preferably:

1, glass substrate is as easily made the reflective heat-conductivity conducting layer of the very high minute surface of reflectivity above glass plate, minute surface aluminium oxide reflective rate can reach about 70%, the reflectivity of mirror-like silver can reach about 85%, the reflectivity of nanometer mirror can reach about 95%, reflectorised paint is coated with aluminium base surface, the reflective surface of ceramic base plate surface exceeds 10-30% than reflectivity, greatly improves the light extraction efficiency of LED light source.

2, due to aluminium and silver that the material of reflective heat-conductivity conducting layer is high thermal conductivity coefficient, the heat of LED chip can be diffused into above whole glass plate by aluminium, silver layer rapidly, particularly as LEDCOB line source, area source, because chip can disperse distribution on the glass substrate, concentrate unlike LEDCOB point-source of light heat, the LED chip Temperature Distribution requirement on substrate can be met by the thickness controlling luminous heat-conductivity conducting layer, compensate for the problem of glass substrate capacity of heat transmission difference.

3, the structures shape substrate area due to LED line source and area source is large, and material usage is large, uses insulating material as glass, plastic base, than aluminium base, ceramic substrate saves material, cost is low.

4, the technological process of glass substrate is simple, is applicable in enormous quantities, efficient mechanical, automated production.

5, formed because LED connecting circuit and power electrode can directly make on luminous heat-conductivity conducting layer, can be easy to like this meet personalization of product requirement, as for positive cartridge chip, no matter product size, as long as it is just passable as power electrode all to make independent two blockages on luminous heat-conductivity conducting layer, and for example for flip-chip, as long as it is just passable as circuit to make blockage at chip position periphery, technique is simple especially, and make efficiency is high especially.

Accompanying drawing explanation

The aluminum substrate structure schematic diagram that Fig. 1 is traditional.

The ceramic substrate structure schematic diagram that Fig. 2 is traditional.

The board structure schematic diagram of Fig. 3 LED light-emitting component described in the utility model.

Fig. 4 LED light-emitting component described in the utility model is made into the schematic diagram of planar LED light-emitting component.

Fig. 5-1 LED light-emitting component described in the utility model is made into the cutaway view of line LED light-emitting component.

Fig. 5-2 LED light-emitting component described in the utility model is made into the vertical view of line LED light-emitting component.

Fig. 6 LED light-emitting component described in the utility model is made into flat light source structure schematic diagram.

The exploded view of flat light source structure described in Fig. 7 Fig. 6.

Fig. 8 LED light-emitting component described in the utility model is made into LED lamp structure schematic diagram.

Fig. 9 LED light-emitting component described in the utility model is made into LED lamp structure schematic diagram.

Embodiment

As Fig. 3 and 4, it is the embodiment of a kind of unidirection luminous LED light-emitting component COB encapsulating structure described in the utility model, comprise glass substrate 1, LED chip 2 and phosphor gel 3, described glass substrate 1 is arranged one deck reflective/heat conduction/conductive layer 4, by described reflective/heat conduction/conductive layer 4 makes and forms circuit 41 and power electrode 42, described LED chip 2 is fixedly mounted on the upper surface of reflective/heat conduction/conductive layer 4, and with made the circuit 41 that formed by reflective/heat conduction/conductive layer 4 and power electrode 42 is connected, LED chip 2 circumferential surface covers phosphor gel 3.Described reflective/heat conduction/conductive layer 4 is minute surface alumina layer or silver layer.The thickness of described reflective heat-conductivity conducting layer is 5-100 micron.

Described reflective heat-conductivity conducting layer makes the circuit formed can be set to formal dress chip circuit, and also can be set to flip-chip circuit, as shown in Fig. 5-1 and 5-2, only in its structure, chip 2 is replaced with flip-chip 20, remainder is all identical.

The various application of a kind of unidirection luminous LED light-emitting component COB encapsulating structure described in the utility model are as follows:

As Fig. 6 and Fig. 7, be that LED light-emitting component described in the utility model is made into a kind of flat light source structure schematic diagram.Described planar LED light source, comprise housing 11, LED light-emitting component 12 and transparent cover plate 13 and external electrode 14, described LED light-emitting component 12 is arranged in the confined space of housing and transparent cover plate formation, described LED light-emitting component also connects external electrode, and described LED light-emitting component adopts the unidirection luminous LED light-emitting component COB encapsulating structure LED light-emitting component COB encapsulating structure described in above-described embodiment.

As Fig. 8 and Fig. 9, after the LED plane light source 21 that described unidirection luminous LED light-emitting component COB encapsulating structure can also be made by the utility model simultaneously adds lamp holder 22 and driving power 23, be applied to LED; Also form LED integrated lamp or LED Based Intelligent Control light fixture can add lamp bracket 24 in LED outside after, greatly can save material cost and can enhance productivity.

Claims

1. a unidirection luminous LED light-emitting component COB encapsulating structure, comprise glass substrate, LED chip and phosphor gel, it is characterized in that, glass substrate is arranged the reflective heat-conductivity conducting layer of one deck, described reflective heat-conductivity conducting layer is made and forms circuit and power electrode, described LED chip is fixedly mounted on the upper surface of reflective heat-conductivity conducting layer, and is connected with circuit and power electrode, and LED chip circumferential surface covers phosphor gel.

2. unidirection luminous LED light-emitting component COB encapsulating structure according to claim 1, it is characterized in that, described reflective heat-conductivity conducting layer is minute surface alumina layer or silver layer.

3. unidirection luminous LED light-emitting component COB encapsulating structure according to claim 1, it is characterized in that, the thickness of described reflective heat-conductivity conducting layer is 5-100 micron.

4. unidirection luminous LED light-emitting component COB encapsulating structure according to claim 1, is characterized in that, described reflective heat-conductivity conducting layer makes the circuit formed can be set to formal dress chip circuit or flip-chip circuit.

5. a LED light source, comprise plastic casing, LED light-emitting component and transparent protective shield, described LED light-emitting component is arranged in the confined space of plastic casing and transparent protective shield formation, LED light-emitting component and also embedding heat conductive transparent glue between plastic casing and transparent protective shield, described LED light-emitting component is unidirection luminous LED light-emitting component COB encapsulating structure, comprise glass substrate, LED chip and phosphor gel, it is characterized in that, glass substrate is arranged the reflective heat-conductivity conducting layer of one deck, described reflective heat-conductivity conducting layer is made and forms circuit and power electrode, described LED chip is fixedly mounted on the upper surface of reflective heat-conductivity conducting layer, and be connected with circuit and power electrode, LED chip circumferential surface covers phosphor gel.

6. a LED lamp, is characterized in that, comprises the unidirection luminous LED light-emitting component COB encapsulating structure described in any one of Claims 1-4.