CN103258938B - A kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material - Google Patents
A kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material Download PDFInfo
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- CN103258938B CN103258938B CN201310160623.0A CN201310160623A CN103258938B CN 103258938 B CN103258938 B CN 103258938B CN 201310160623 A CN201310160623 A CN 201310160623A CN 103258938 B CN103258938 B CN 103258938B
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- lamp bar
- fluorescent material
- led lamp
- base plate
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention belongs to field of photoelectric technology, be specifically related to a kind of method for packing of high-heat dissipation LED lamp bar.The present invention is a kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material, 10-15% fluorescent material, 70-75% Heat Conduction Material and 10-20% binding agent is mixed; By the powder mixed, by mechanical die casting, forming length and width thick is the rectangular substrate of (20-40) * (0.6-1.0) * (0.3-0.5) mm; By rectangular substrate, be that 150-400 DEG C of scope is annealed in temperature, make it have good mechanical strength, not easily broken; Fluorescent material is put into led base plate for packaging by the present invention, if when encapsulating side phosphor gel, add the heat dispersion of lamp bar, decrease technological process.High conductivity material is put into led base plate for packaging, effectively increase LED lamp bar heat dispersion operationally.Adopt the LED lamp bar of this substrate package to realize lighting at two sides, add the output of light, improve the luminous efficiency of led.<!--1-->
Description
Technical field
The invention belongs to field of photoelectric technology, be specifically related to a kind of method for packing of high-heat dissipation LED lamp bar.
Background technology
White light led is the solid-state illumination light source of new generation of green environmental protection, and have efficiency high, the life-span is long, volume is little, Stability Analysis of Structures, not mercurous, adapt to the advantages such as adverse circumstances, be subject to scientific research institution, the great attention of business and government, drops into a large amount of capitals and energy Development and Production promotes white light LEDs product, through this fast development of several years and progress, White-light LED illumination product is accepted extensively by market, and demand increases fast.Along with popularizing of LED illumination product, people also propose higher requirement to Led illumination, not only require better energy-conserving and environment-protective performance, and product appearance, photochromic in meet the visual demand of people to a greater extent.The present invention relates to the encapsulation technology of LEDbulb lamp luminous lamp strip, this lamp bar can positive and negative and side 4 π luminous, and adopt the led of traditional led encapsulation technology encapsulation, can only one side luminous, the light that other direction is launched is blocked or through multiple reflections, greatly reduces light extraction efficiency.The led of this technology encapsulation can improve the light extraction efficiency of led effectively.The heat dispersion of this encapsulation technology is fine in addition, does not need to use the fin of aluminium and so on to dispel the heat, and effectively alleviates the weight of led etc., improves its exterior appearance simultaneously.
Summary of the invention
The heat dissipation problem of the problem to be solved in the present invention mainly LED lamp bar, by by fluorescent material, Heat Conduction Material is distributed on substrate, reduce the use of the silica gel of heat conductivility difference when encapsulating, achieve the encapsulation of the luminous LED lamp bar of high-efficiency long-life 4 π, solve the problem of the luminescence of conventional packaging techniques one side and weak heat-dissipating, for popularizing of led illumination has done technically significantly lifting.
Concrete technical scheme of the present invention is as follows:
The present invention is a kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material, and concrete steps are as follows:
(1) 10-15% fluorescent material, 70-75% Heat Conduction Material and 10-20% binding agent are mixed;
(2) by the powder that step (1) mixes, by mechanical die casting, forming length and width thick is the rectangular substrate of (20-40) * (0.6-1.0) * (0.3-0.5) mm;
(3) by the rectangular substrate of step (2), be that 150-400 DEG C of scope is annealed in temperature, make it have good mechanical strength, not easily broken;
(4) substrate that step (3) has been annealed is carried out polishing, improve its surface smoothness, be easy to later stage chip attach;
(5) led blue chip, is pasted onto on heat-conducting substrate by the form of series connection, is then together in series by every chips with gold thread;
(6) on the substrate described in step (5), the opposite side of chip, is coated with by silica gel and is covered with fluorescent material.
As further improvement, fluorescent material chemical composition of the present invention is yttrium aluminium garnet YAG or nitride series.
As further improvement, Heat Conduction Material of the present invention is aluminium oxide or aluminium nitride material.
As further improvement, binding agent of the present invention is silica gel or cryogenic glass powder.
As further improvement, the annealing in step of the present invention (2) is carried out in air atmosphere, and annealing time is 30 minutes.
As further improvement, in step of the present invention (5), led blue chip is 20-30.
Beneficial effect of the present invention is as follows:
Fluorescent material is put into led base plate for packaging by the present invention, if when encapsulating side phosphor gel, add the heat dispersion of lamp bar, decrease technological process.High conductivity material is put into led base plate for packaging, effectively increase LED lamp bar heat dispersion operationally.Adopt the LED lamp bar of this substrate package to realize lighting at two sides, add the output of light, improve the luminous efficiency of led.
Accompanying drawing explanation
Fig. 1 is: containing fluorescent material, the structural representation of the substrate of high conductivity material;
Fig. 2 is: weldering wire, the structural representation of the substrate after die bond;
Fig. 3 is: the structural representation of packaged led light-emitting section.
Specific embodiments
Technical scheme of the present invention is described further by specific embodiment below in conjunction with accompanying drawing.
Embodiment 1
High-heat dissipation LED lamp bar of the present invention can make by the following method:
By 10gYAG yellow fluorescent powder, 80g alumina powder, after 10g silica gel weighs, puts into glass beaker, then stir with glass bar, make it fully mix, the material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 35*0.8*0.5mm, the baking oven that the substrate that die casting is good puts into 150 DEG C is toasted, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends soldering copper wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.4gYAG bloom and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
Embodiment 2
By 9gYAG yellow fluorescent powder, 1g nitride rouge and powder, 80g alumina powder, after 10g silica gel weighs, put into glass beaker, then stir with glass bar, make it fully mix, material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 35*0.8*0.5mm, are toasted by the baking oven that the substrate that die casting is good puts into 150 DEG C, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends soldering copper wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.3.6gYAG bloom, 0.4g nitride rouge and powder and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
Embodiment 3
By 10gYAG yellow fluorescent powder, 80g aluminium nitride powder, after 10g silica gel weighs, puts into glass beaker, then stir with glass bar, make it fully mix, the material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 35*0.8*0.5mm, the baking oven that the substrate that die casting is good puts into 150 DEG C is toasted, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends soldering copper wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.4gYAG bloom and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
Embodiment 4
By 10gYAG yellow fluorescent powder, 80g alumina powder, after 10g silica gel weighs, puts into glass beaker, then stir with glass bar, make it fully mix, the material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 30*0.8*0.5mm, the baking oven that the substrate that die casting is good puts into 150 DEG C is toasted, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends soldering copper wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.4gYAG bloom and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
Embodiment 5
By 10gYAG yellow fluorescent powder, 80g alumina powder, after 10g glass dust weighs, puts into glass beaker, then stir with glass bar, make it fully mix, the material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 35*0.8*0.5mm, the Muffle furnace that the substrate that die casting is good puts into 500 DEG C is annealed, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends soldering copper wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.4gYAG bloom and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
Embodiment 6
By 10gYAG yellow fluorescent powder, 80g alumina powder, 10gPE plastic pellet, weigh well, put into glass beaker, then stir with glass bar, make it fully mix, material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 35*0.8*0.5mm, are toasted by the baking oven that the substrate that die casting is good puts into 150 DEG C, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends welding iron wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.4gYAG bloom and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
Embodiment 7
By 10gYAG yellow fluorescent powder, 80g alumina powder, after 10g silica gel weighs, puts into glass beaker, then stir with glass bar, make it fully mix, the material after mixing is put into die casting and carries out die casting, the length, width and height of mould are of a size of 35*0.8*0.5mm, the baking oven that the substrate that die casting is good puts into 150 DEG C is toasted, make it solidify, then by its polishing, obtain as Fig. 1 substrate.At two ends welding iron wire, 30 blue light led chip die bonds are pasted onto on polished substrate, as Fig. 2.4gYAG bloom and 6g silica gel are mixed, by automatic dispensing machine, powder slurry is coated on the substrate of die bond side, puts into the baking that baking oven carries out 150 DEG C, make it solidify, as Fig. 3.
What more than enumerate is only several specific embodiment of the present invention; obviously, the invention is not restricted to above embodiment, many distortion can also be had; all distortion that those of ordinary skill in the art can directly derive from content disclosed by the invention or associate, all should think protection scope of the present invention.
Claims (5)
1., containing a manufacture method for the thermally conductive LED lamp bar base plate for packaging of fluorescent material, it is characterized in that, concrete steps are as follows:
(1) 10-15% fluorescent material, 70-75% Heat Conduction Material and 10-20% binding agent are mixed;
(2) by the powder that step (1) mixes, by mechanical die casting, forming length and width thick is the rectangular substrate of (20-40) * (0.6-1.0) * (0.3-0.5) mm;
(3) by the rectangular substrate of step (2), be that 150-400 DEG C of scope is annealed in temperature, make it have good mechanical strength, not easily broken;
(4) substrate that step (3) has been annealed is carried out polishing, improve its surface smoothness, be easy to later stage chip attach;
(5) led blue chip, is pasted onto on heat-conducting substrate by the form of series connection, is then together in series by every chips with gold thread;
(6) on the substrate described in step (5), the opposite side of chip, is coated with by silica gel and is covered with fluorescent material;
Described Heat Conduction Material is aluminium oxide or aluminium nitride material, and described binding agent is cryogenic glass powder.
2. the manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material according to claim 1, is characterized in that, described fluorescent material chemical composition is yttrium aluminium garnet YAG or nitride series.
3. the manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material according to claim 1 and 2, it is characterized in that, the annealing in described step (2) is carried out in air atmosphere, and annealing time is 30 minutes.
4., according to the manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material according to claim 1, it is characterized in that, in described step (5), led blue chip is 20-30.
5., according to the manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material according to claim 3, it is characterized in that, in described step (5), led blue chip is 20-30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310160623.0A CN103258938B (en) | 2013-05-03 | 2013-05-03 | A kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310160623.0A CN103258938B (en) | 2013-05-03 | 2013-05-03 | A kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material |
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| CN103258938A CN103258938A (en) | 2013-08-21 |
| CN103258938B true CN103258938B (en) | 2016-04-13 |
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| CN201310160623.0A Expired - Fee Related CN103258938B (en) | 2013-05-03 | 2013-05-03 | A kind of manufacture method of the thermally conductive LED lamp bar base plate for packaging containing fluorescent material |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840063A (en) * | 2013-11-15 | 2014-06-04 | 芜湖德豪润达光电科技有限公司 | LED package substrate and manufacturing method thereof |
| CN103855260A (en) * | 2014-03-20 | 2014-06-11 | 杭州耀迪科技有限公司 | Method for manufacturing light switching device for high-heat-dissipating and high-light-transmitting LED illumination |
| US9537058B2 (en) * | 2014-06-05 | 2017-01-03 | Shanghai Fudi Lighting Electronic Co., Ltd. | Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof |
| CN106328792B (en) * | 2015-06-24 | 2018-12-21 | 周鸣波 | A kind of direct packaging method and panel of composite LED glass base plane |
| CN106299079A (en) * | 2015-06-24 | 2017-01-04 | 严敏 | The method for packing of a kind of composite LED glass base plane and panel |
| CN106299081A (en) * | 2016-08-05 | 2017-01-04 | 张恒钦 | A kind of preparation method containing fluorescent material flexible LED filament base plate for packaging |
| CN108716618B (en) * | 2018-04-19 | 2021-01-15 | 深圳市丰功文化传播有限公司 | Fluorescent glue for LED light-emitting strip and LED bulb lamp thereof |
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| CN101697367A (en) * | 2009-09-30 | 2010-04-21 | 烁光特晶科技有限公司 | Method for preparing LED by using transparent ceramics |
| CN102718492A (en) * | 2012-05-21 | 2012-10-10 | 苏州晶品光电科技有限公司 | Method for producing transparent ceramic fluorescence substrate used for LED |
| CN102832327A (en) * | 2011-06-16 | 2012-12-19 | 日东电工株式会社 | Phosphor adhesive sheet, light emitting diode element, light emitting diode device, and producing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012039031A (en) * | 2010-08-11 | 2012-02-23 | Nitto Denko Corp | Light emitting device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697367A (en) * | 2009-09-30 | 2010-04-21 | 烁光特晶科技有限公司 | Method for preparing LED by using transparent ceramics |
| CN102832327A (en) * | 2011-06-16 | 2012-12-19 | 日东电工株式会社 | Phosphor adhesive sheet, light emitting diode element, light emitting diode device, and producing method thereof |
| CN102718492A (en) * | 2012-05-21 | 2012-10-10 | 苏州晶品光电科技有限公司 | Method for producing transparent ceramic fluorescence substrate used for LED |
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