CN106299079A - The method for packing of a kind of composite LED glass base plane and panel - Google Patents
The method for packing of a kind of composite LED glass base plane and panel Download PDFInfo
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- CN106299079A CN106299079A CN201510355337.9A CN201510355337A CN106299079A CN 106299079 A CN106299079 A CN 106299079A CN 201510355337 A CN201510355337 A CN 201510355337A CN 106299079 A CN106299079 A CN 106299079A
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- 239000011521 glass Substances 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 238000012856 packing Methods 0.000 title claims abstract description 13
- 239000011159 matrix material Substances 0.000 claims abstract description 36
- 239000000843 powder Substances 0.000 claims abstract description 29
- 238000001816 cooling Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000012768 molten material Substances 0.000 claims abstract description 5
- 238000013461 design Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 238000012360 testing method Methods 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 claims 1
- 241000209202 Bromus secalinus Species 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to method for packing and the panel of a kind of composite LED glass base plane, including: preparing glass substrate, glass substrate includes that multiple matrix cheats position；According to design, multiple LED wafer are arranged into cell array, and the position one_to_one corresponding of position is cheated with matrix in the multiple LED wafer positions in cell array；Cheat to the matrix of glass substrate and position loads low glass powder；The glass substrate that will be loaded with low glass powder is placed in heating and cooling system, on the master mold of heating and cooling system, with under the temperature conditionss of 300 DEG C 500 DEG C, is melted by low glass powder for liquid low glass powder melt；By the suction nozzle of the vacuum slot matrix die head on the male model of heating and cooling system, pick up multiple LED wafer, move to and master mold opposite position, make the exiting surface of multiple LED wafer combine with the molten material of low glass powder in position, corresponding matrix hole；Control heating and cooling system cooling, make multiple LED wafer die bond cheat in position to corresponding matrix, obtain composite LED glass base plane.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to the encapsulation side of a kind of composite LED glass base plane
Method and panel.
Background technology
The processing technology of traditional semiconductor light emitting wafer, first to encapsulate before downstream application
(PACKAGE), the wafer after encapsulation is fixed on the circuit carrier (such as PCB) of application product the most again
Realize relevant electric connection and function up.
Encapsulation process, mainly at the elargol that the upper use of rational support (FRAME) is the most conductive
Deng, fixedly mount one of them electrode of wafer and realize being electrically connected with, passing through supersonic welding the most again
Another independence that line machine is welded and connected to support another electrode gold thread or aluminum steel etc. of wafer is electrically drawn
Foot；The most again with materials such as transparent epoxy resins wafer, a part for support and the gold thread connecting them
Or aluminum steel etc. reinstates the casting moulds cast of well in advance and seals.The pin having a part electrically support is
Expose, can be connected as carrying out surface mount (SMT) with other electronic devices when supporting the use or
Dual-inline package (DIP) etc. is arranged on the conductive support (such as PCB) of application product and uses.
In traditional packaging process, owing to needing lead-in wire welding, will necessarily stay not in light-emitting area
The melting welding points such as transparent gold thread or aluminum steel, these melting welding points can cover the light injection of part, and can be at list
" black " heart point of withered sky is left in the hot spot of only point source, thus the luminescent wafer being obtained by this method
It it is not uniform light spots as preferable point source.
Meanwhile, in the case of semiconductor light emitting application is more universal, light emitting semiconductor device is existed
Application under Small Distance high density size, and low cost etc., it is proposed huge requirement.
Summary of the invention
In view of this, the invention provides method for packing and the panel of a kind of composite LED glass base plane,
Described method technique is simple, is suitable to large-scale production and application, by using melted cryogenic glass powder conduct
Die bond medium so that be transparent after its solidification, the hot spot affecting printing opacity will not be formed, prepare
Panel transmission is not less than 85%, and display effect and concordance are good, and process costs is low, it is possible to meet LED
The needs that Display Technique is applied in high density field.
First aspect, the invention provides the method for packing of a kind of composite LED glass base plane, including:
Preparing glass substrate, described glass substrate includes the position, matrix hole for loading multiple LED wafer；
The plurality of LED wafer is arranged into cell array according to design, the multiple LED in described cell array
Wafer position cheats the position one_to_one corresponding of position with described matrix；
Cheat to the matrix of described glass substrate and position loads low glass powder；
The glass substrate that will be loaded with low glass powder is placed in heating and cooling system, at the master mold of heating and cooling system
On, with under the temperature conditionss of 300 DEG C-500 DEG C, low glass powder is melted for liquid low glass powder melt；
The plurality of LED is picked up by the suction nozzle of the vacuum slot matrix die head on the male model of heating and cooling system
Wafer, moves to and master mold opposite position, makes the exiting surface of the plurality of LED wafer cheat with corresponding matrix
The molten material of low glass powder in Wei combines；
Control the cooling of described heating and cooling system, make multiple described LED wafer die bond cheat in position to corresponding matrix,
Obtain described composite LED glass base plane.
Preferably, in the described phase that the plurality of LED wafer is loaded according to designing and arranging cloth position, described matrix hole
Also include before answering position:
Preparation LED wafer；
LED wafer is tested, in order to described LED wafer is grouped according to different test results；
Wafer matrix will be formed on described LED wafer reverse mould to expanded film；Described expanded film is brilliant with described LED
The exiting surface of sheet is pasted mutually；
Stretch described expanded film, carry out described wafer matrix expanding crystalline substance, form described cell array.
It is further preferred that described LED wafer includes multi-colored led wafer.
It is further preferred that described multi-colored led wafer includes: red LED wafer, blue led wafer and
Green LED wafer；
In described cell array, described red LED wafer, blue led wafer and green LED wafer etc.
Interval equidistantly arrangement.
Preferably, described method also includes:
The electrode side of the LED wafer in described composite LED glass base plane is ground polishing；
Described composite LED glass base plane is annealed；
Clean, dried, test；
The composite LED glass base plane packed for standby use that test is passed through.
Second aspect, composite LED prepared by a kind of method that embodiments providing first aspect provides
Glass base plane.
The method for packing of a kind of composite LED glass base plane that the embodiment of the present invention provides, technique is simple,
Be suitable to large-scale production and application, by using melted cryogenic glass powder as die bond medium so that it is solid
Being transparent after change, will not form the hot spot affecting printing opacity, the panel transmission prepared is not less than
85%, display effect and concordance are good, and process costs is low, it is possible to meet LED Display Technique in high density
The needs of field application.
Accompanying drawing explanation
The flow chart of the method for packing of the composite LED glass base plane that Fig. 1 provides for the embodiment of the present invention；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 2 provides for the embodiment of the present invention it
One；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 3 provides for the embodiment of the present invention it
Two；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 4 provides for the embodiment of the present invention it
Three；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 5 provides for the embodiment of the present invention it
Four；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 6 a provides for the embodiment of the present invention it
Five；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 6 b provides for the embodiment of the present invention it
Six；
The encapsulation process schematic diagram of the composite LED glass base plane that Fig. 7 provides for the embodiment of the present invention it
Seven；
The schematic diagram of the composite LED glass base plane that Fig. 8 provides for the embodiment of the present invention.
Below by drawings and Examples, technical scheme is described in further detail.
Detailed description of the invention
The method for packing of the composite LED glass base plane of the present invention, is mainly used in LED display, extra small
Space distance LED display screen, VHD LED display, the just luminous TV of LED, the just luminous prison of LED
Visual organ, LED video wall, the fields such as LED indicates, LED special lighting.
The method for packing flow chart of the composite LED glass base plane that Fig. 1 provides for the embodiment of the present invention.Figure
2-Fig. 8 is the encapsulation process schematic diagram of the composite LED glass base plane of the embodiment of the present invention, each schematic diagram
Only it is used for being more fully understood that the intent of the present invention, but is not intended to limit protection scope of the present invention.
Below with Fig. 1 and combine Fig. 2-Fig. 8 the method for packing of the present invention is illustrated.
As it is shown in figure 1, the method for packing flow process of the composite LED glass base plane of embodiment of the present invention offer
Figure comprises the steps:
Step 110, prepares glass substrate；
Concrete, glass substrate 1 includes the position, matrix hole for loading multiple LED wafer；
As in figure 2 it is shown, in position, matrix hole, as the size of position, each hole 11, the degree of depth, interval pitch.
The cross sectional shape of position 11, hole is trapezoidal, consistent with the cross sectional shape of LED wafer.
Multiple LED wafer are arranged into cell array according to design by step 120；
Concrete, first, by multiple LED wafer reverse moulds to expanded film, form wafer as shown in Figure 3
Matrix.In wafer matrix, arrange at equal intervals between each LED wafer 2.Expanded film 3 and LED wafer 2
Exiting surface paste mutually.
LED wafer can be monochromatic LED wafer, it is also possible to include multi-colored led wafer.
If in the case of multi-colored led wafer, the LED wafer of different colours firstly the need of testing,
Multiple LED wafer of each color are grouped according to different test results, then arrange further according to needs
Row are placed.In the example shown in Fig. 3, it is row's red LED wafer (representing with R in figure), a row
Green LED wafer (represents with G in figure), row's blue led wafer (representing with B in figure).
Subsequently, stretch expanded film, carry out described wafer matrix expanding crystalline substance, form described cell array, such as Fig. 4
Shown in.In cell array, red LED wafer, blue led wafer and green LED wafer are at equal intervals etc.
Spacing is arranged.Further, the multiple LED wafer positions in cell array and matrix cheat the position one_to_one corresponding of position.
Step 130, cheats to the matrix of described glass substrate and loads low glass powder in position；
Concrete, the loading of low glass powder can be completed by powder loader.Low glass powder 5 is in position 11, hole
State is as shown in Figure 6 a.
Step 140, the glass substrate that will be loaded with low glass powder is placed in heating and cooling system, at heating cooling system
On the master mold of system, with under the temperature conditionss of 300 DEG C-500 DEG C, low glass powder is melted for liquid low glass powder melt；
Concrete, heating and cooling system 4 can be as it is shown in figure 5, include male model 41 and master mold 42.
Master mold 42 is used for loading glass substrate, and bottom has and adds heat pipe 421, can add by adding heat pipe 421
Hot graphite 422.Male model 41 has vacuum pump 411 and suction nozzle 412, and suction nozzle 412 adsorbs LED wafer 2.
By graphite 422, glass substrate 1 is heated so that it is in low glass powder be molten state.The low glass of molten state
The molten material of powder 51 state in position 11, hole is as shown in Figure 6 b.
Step 150, by the suction nozzle of the vacuum slot matrix die head on the male model of heating and cooling system, picks up institute
State multiple LED wafer, move to and master mold opposite position, make the exiting surface of the plurality of LED wafer with right
The molten material of low glass powder in the position, matrix hole answered combines；
Concrete, vacuum slot matrix die head combines shown in Fig. 7, and multiple suction nozzles 412 equidistantly arrange, spacing
And the spacing between position, matrix hole arranges identical in glass substrate.
By vacuum pump 411, suction nozzle 412 is maintained under certain vacuum degree, by LED wafer 2 by expanded film
It is drawn on 3 on suction nozzle 412.
The die head stepping controlling male model 41 subsequently moves down, until coincideing with master mold 42.At this moment, male model
The exiting surface of the LED wafer 2 on the suction nozzle 412 of 41 die heads has been immersed in low glass liquation.
Step 160, controls the cooling of described heating and cooling system, makes multiple described LED wafer die bond to corresponding square
In position, battle array hole, obtain described composite LED glass base plane.
Concrete, after immersing, it is incubated the several seconds, then begins to cool down, be down to room temperature.Low glass powder 5 is gradually
Being solidified by molten state, make LED wafer 2 die bond cheat in position 11 to corresponding matrix, suction nozzle 412 discharges, i.e. shape
Become composite LED glass base plane.The most as shown in Figure 8.
After completing each step above-mentioned, in addition it is also necessary to brilliant to the LED in described composite LED glass base plane
The electrode side of sheet is ground polishing, may glue the glutinous cull stayed to remove from expanded film.
Finally, composite LED glass base plane is annealed, clean, dried, test, and will survey
The composite LED glass base plane packed for standby use pinged.
The method for packing of the composite LED glass base plane that the present invention provides, technique is simple, is suitable to large-scale production
Application, by using melted cryogenic glass powder as die bond medium so that is transparent after its solidification, will not
Forming the hot spot affecting printing opacity, the panel transmission prepared is not less than 85%, and display effect and concordance are good,
Process costs is low, it is possible to meet the needs that LED Display Technique is applied in high density field.
Composite LED glass base plane prepared by said method of the present invention is the glass base with emitting led wafer
Plate, can be used as the integrated component of VHD LED display module or be individually used for the parts of instrument display,
After parts, in integrated operation, in processing, opaque ITO drive circuit just can show video image character etc..
Above-described detailed description of the invention, is entered the purpose of the present invention, technical scheme and beneficial effect
One step describes in detail, be it should be understood that the detailed description of the invention that the foregoing is only the present invention, not
For limiting protection scope of the present invention, all within the spirit and principles in the present invention, any amendment of being made,
Equivalent, improvement etc., should be included within the scope of the present invention.
Claims (6)
1. the method for packing of a composite LED glass base plane, it is characterised in that described method includes:
Preparing glass substrate, described glass substrate includes the position, matrix hole for loading multiple LED wafer；
The plurality of LED wafer is arranged into cell array according to design, multiple in described cell array
The position one_to_one corresponding of position is cheated with described matrix in LED wafer position；
Cheat to the matrix of described glass substrate and position loads low glass powder；
The glass substrate that will be loaded with low glass powder is placed in heating and cooling system, the mother of heating and cooling system
On mould, with under the temperature conditionss of 300 DEG C-500 DEG C, low glass powder is melted for liquid low glass powder melt；
By the suction nozzle of the vacuum slot matrix die head on the male model of heating and cooling system, pick up the plurality of
LED wafer, moves to and master mold opposite position, makes the exiting surface of the plurality of LED wafer with corresponding
The molten material of low glass powder in position, matrix hole combines；
Control the cooling of described heating and cooling system, make multiple described LED wafer die bond cheat position to corresponding matrix
In, obtain described composite LED glass base plane.
Method the most according to claim 1, it is characterised in that described by the plurality of LED
Wafer also includes before loading the relevant position of position, described matrix hole according to designing and arranging cloth:
Preparation LED wafer；
LED wafer is tested, in order to described LED wafer carried out point according to different test results
Group；
Wafer matrix will be formed on described LED wafer reverse mould to expanded film；Described expanded film and described LED
The exiting surface of wafer is pasted mutually；
Stretch described expanded film, carry out described wafer matrix expanding crystalline substance, form described cell array.
Method the most according to claim 2, it is characterised in that described LED wafer includes polychrome
LED wafer.
Method the most according to claim 3, it is characterised in that described multi-colored led wafer includes:
Red LED wafer, blue led wafer and green LED wafer；
In described cell array, described red LED wafer, blue led wafer and green LED are brilliant
Sheet is the most equidistantly arranged.
Method the most according to claim 1, it is characterised in that described method also includes:
The electrode side of the LED wafer in described composite LED glass base plane is ground polishing；
Described composite LED glass base plane is annealed；
Clean, dried, test；
The composite LED glass base plane packed for standby use that test is passed through.
6. the composite LED glass basal plane that a kind is applied method described in any one of the claims 1-5 to prepare
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510355337.9A CN106299079A (en) | 2015-06-24 | 2015-06-24 | The method for packing of a kind of composite LED glass base plane and panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510355337.9A CN106299079A (en) | 2015-06-24 | 2015-06-24 | The method for packing of a kind of composite LED glass base plane and panel |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107146769A (en) * | 2017-05-23 | 2017-09-08 | 深圳市华星光电技术有限公司 | The transfer equipment and transfer method of micro- light emitting diode |
| CN107564929A (en) * | 2017-09-22 | 2018-01-09 | 厦门乾照光电股份有限公司 | A kind of array base palte and preparation method thereof, display panel, display device |
| WO2019042031A1 (en) * | 2017-08-30 | 2019-03-07 | 深圳市奥拓电子股份有限公司 | Temperature and humidity control panel and led display screen |
| CN110911543A (en) * | 2019-11-28 | 2020-03-24 | 南京百富润玻璃有限公司 | Manufacturing method of LED photoelectric display glass for large display screen |
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| CN110911543A (en) * | 2019-11-28 | 2020-03-24 | 南京百富润玻璃有限公司 | Manufacturing method of LED photoelectric display glass for large display screen |
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Application publication date: 20170104 |