CN103855259A - Led packaging method - Google Patents
Led packaging method Download PDFInfo
- Publication number
- CN103855259A CN103855259A CN201410038645.4A CN201410038645A CN103855259A CN 103855259 A CN103855259 A CN 103855259A CN 201410038645 A CN201410038645 A CN 201410038645A CN 103855259 A CN103855259 A CN 103855259A
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- led
- chip
- depression
- packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention is applied to the field of LED manufacturing and provides an LED packaging method. The method includes the first step of manufacturing transparent packaging films with array-type pits or transparent glass sheets, the second step of filling fluorescence gel into the pits, wherein the amount of the fluorescence gel filled in each pit is the difference between the volume of the pit and the volume of a flip-chip wafer to be packaged, the third step of fixing the flip-chip wafers into the fluorescence gel, enabling the bottoms of the flip-chip wafers to be exposed to form an array-type LED packaging sheet, and the fourth step of dividing the LED packaging sheet into a plurality of LED packaging single bodies. According to the method, the flip-chip wafers are packaged on the transparent packaging films or the transparent glass sheets, the packaging body is only composed of the flip-chip wafers, the fluorescence gel and transparent packaging gel and is high in reliability, low in cost, high in productivity, free from limitation of the support shape, beneficial for large-scale integrated packaging, and capable of saving materials; the fluorescence gel does not need to be separated, so manufacturing procedures are reduced; losses like internal scattering of photons in fluorescent powder are reduced, so product luminance can be promoted beneficially; gold plated tin alloy layers are not need in the positive electrodes and the negative electrodes of the wafers, so the cost is saved.
Description
Technical field
The present invention relates to LED product manufacturing technology field, relate in particular to a kind of LED method for packing.
Background technology
The packaged type of conventional white light LED product is that the mode of LED wafer is bonding by crystal-bonding adhesive or eutectic welding is fixed in the bowl cup on support, adopt gold thread the positive pole of wafer to be connected in to the positive pole of support, the negative pole of wafer is connected in to the negative pole of support, then fills the fluorescent glue that meets aim colour district in bowl cup.Due to support, fluorescent glue, for the thermal coefficient of expansion difference of the colloid of bonding wafer, easily there is integrity problem at aspects such as support, fluorescent glue, gold thread, colloids; And LED support is of a great variety, the material of bonding wafer and support both positive and negative polarity mostly is PPA, PCT and EMC material, and its heat-resisting quantity, air-tightness all has larger defect, and then affects the reliability of LED product.Although ceramics bracket has good heat-resisting quantity and good air-tightness, support cost approaches wafer cost, and ceramics bracket packaged LED system take costliness, and equipment investment is large, causes the LED product production capacity of ceramics bracket little, and price is high.Therefore, the LED product of support encapsulated structure is in reliability, and in useful life, manufacturing cost and defect are in price all larger obstructions of LED products substitution traditional lighting product.
Summary of the invention
The object of the present invention is to provide a kind of LED method for packing, be intended to improve the reliability of LED product, guarantee the useful life that it is grown, reduce costs simultaneously, improve production capacity.
The present invention is achieved in that LED method for packing, comprises the steps:
Making has transparent enclosure film or the transparent glass sheet of the depression that array arranges;
In described depression, fill fluorescent glue, the volume of the volume that the fluorescent glue amount that each depression is filled is depression and overlay crystal chip to be packaged poor;
Described overlay crystal chip is fixed in described fluorescent glue, and the bottom electrode of described overlay crystal chip is exposed, other faces immerse in described fluorescent glue, form full wafer array-type LED case chip;
Described array-type LED case chip is divided into multiple LED encapsulation monomers.
Compared with the method that the present invention adopts support encapsulation with tradition, tool has the following advantages:
The first, the LED encapsulation monomer that the method is made is only made up of overlay crystal chip 2, fluorescent glue 3, transparent enclosure glue 1, save the material such as support, gold thread, and overlay crystal chip 2, fluorescent glue 3 and the equal stabilizer pole of transparent enclosure glue 1 performance, reliability is far above the encapsulation mode of support and gold thread, and then avoid the different product reliability problems that cause of thermal coefficient of expansion due to support and colloid, guarantee the useful life of its overlength, and can save great amount of cost, improve production capacity;
The second, using transparent enclosure glue or clear glass as operation base material, without separately establishing encapsulation work platform, easy to operate; Directly on transparent enclosure glue 1 or polymethyl methacrylate, offer depression 11, fluorescent glue 3 is filled in depression 11, directly form independently fluorescent adhesive layer, compare with the mode that applies fluorescent glue and separate again fluorescent glue above wafer, omit the operation that separates fluorescent glue, significantly simplified manufacturing process;
Three, encapsulation process is directly carried out on transparent enclosure film or clear glass, easy to operate, and adopts point gum machine to compared with the method for one one glue in bowl cup, and utilization of materials is high, has reduced packaging cost;
Four, without the restriction of support shape, encapsulation process is simpler, is beneficial to the large-scale integrated encapsulation of LED product, is beneficial to the cost of packaging;
Five, owing to not adopting the encapsulation of bowl cup, reduce in a large number the scattering-in equal loss of photon between fluorescent material, be beneficial to the brightness of improving product;
Six,, owing to not adopting rack bearing wafer, overlay crystal chip bottom both positive and negative polarity, without the gold-tin alloy layer (conventional method need to arrange gold-tin alloy layer in bottom of wafer and be welded on support) of expensive certain thickness (3 μ m left and right), has significantly been saved cost.
Accompanying drawing explanation
Fig. 1 is the LED method for packing flow chart that first embodiment of the invention provides;
Fig. 2 a is the encapsulating structure schematic diagram () corresponding with LED method for packing;
Fig. 2 b is the encapsulating structure schematic diagram (two) corresponding with LED method for packing;
Fig. 2 c is the encapsulating structure schematic diagram (three) corresponding with LED method for packing;
Fig. 2 d is the encapsulating structure schematic diagram (four) corresponding with LED method for packing;
Fig. 2 e is the encapsulating structure schematic diagram (five) corresponding with LED method for packing;
Fig. 2 f is the enlarged drawing of a-quadrant in Fig. 2 e;
Fig. 2 g is the encapsulating structure schematic diagram (six) corresponding with LED method for packing;
Fig. 2 h is the encapsulating structure schematic diagram (seven) corresponding with LED method for packing;
Fig. 2 i is the encapsulating structure schematic diagram (eight) corresponding with LED method for packing;
Fig. 2 j is the structural representation () of the LED encapsulation monomer that obtained by LED method for packing;
Fig. 2 k is the structural representation (two) of the LED encapsulation monomer that obtained by LED method for packing.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Fig. 1 shows the flow chart of the LED method for packing that the embodiment of the present invention provides, and Fig. 2 a～2i shows the product encapsulating structure figure corresponding with the method, for convenience of explanation, only shows the part relevant to the present embodiment.
In conjunction with Fig. 1, the LED method for packing that the embodiment of the present invention provides comprises the steps:
Step S101, makes transparent enclosure film 1 or the transparent glass sheet with the depression 11 that array arranges;
In the present embodiment, this transparent enclosure film 1 or transparent glass sheet are as the outermost layer encapsulating structure of packaged LED wafer, 11 of depressions are for filling fluorescent glue and placing LED overlay crystal chip 2, the shape of the shape of depression 11 and overlay crystal chip 2 is coincide, the back side of this transparent enclosure film 1 or transparent glass sheet is burnishing surface or lens arra, wherein lens 12 are corresponding one by one with depression 11, as Fig. 2 a and 2b.
Step S102 fills fluorescent glue in depression, the volume of the volume that the fluorescent glue amount that each depression is filled is depression and overlay crystal chip to be packaged poor; As Fig. 2 c and 2d;
Step S103, is fixed on overlay crystal chip in fluorescent glue, and the bottom electrode of overlay crystal chip is exposed, and other faces immerse in described fluorescent glue, forms full wafer array-type LED case chip; As Fig. 2 e, 2f, 2g;
By the accurate control to fluorescent glue amount, can make the bottom electrode 21 of overlay crystal chip 2 expose, other five surfaces are all immersed in fluorescent glue 3.In addition, the degree of depth of depression 11 can be rationally set, making the thickness of the fluorescent glue 3 directly over overlay crystal chip 2 is 30～500 μ m.
Step S104, is divided into multiple LED encapsulation monomers by array-type LED case chip; As Fig. 2 h and Fig. 2 i.
Through step S101～S104, can obtain the LED encapsulation monomer shown in Fig. 2 j or Fig. 2 k, each LED encapsulation monomer comprises an overlay crystal chip 2, be coated with fluorescent glue 3 in the periphery of this overlay crystal chip 2, outside fluorescent glue 3, be provided with transparent enclosure glue 1, the bottom electrode 21 of overlay crystal chip 2 exposes, for the electrode welding of application end.
Further, can also between the positive and negative electrode of overlay crystal chip 2 bottoms, fill anti-welding glue, to prevent application end when welding electric pole short circuit.
Compared with the method that the present invention adopts support encapsulation with tradition, tool has the following advantages:
The first, the LED encapsulation monomer that the method is made is only made up of overlay crystal chip 2, fluorescent glue 3, transparent enclosure glue 1, save the material such as support, gold thread, and overlay crystal chip 2, fluorescent glue 3 and the equal stabilizer pole of transparent enclosure glue 1 performance, reliability is far above the encapsulation mode of support and gold thread, and then avoid the different product reliability problems that cause of thermal coefficient of expansion due to support and colloid, guarantee the useful life of its overlength, and can save great amount of cost, improve production capacity;
The second, using transparent enclosure glue or clear glass as operation base material, without separately establishing encapsulation work platform, easy to operate; Directly on transparent enclosure glue 1 or clear glass, offer depression 11, fluorescent glue 3 is filled in depression 11, directly form independently fluorescent adhesive layer, compare with the mode that applies fluorescent glue and separate again fluorescent glue above wafer, omit the operation that separates fluorescent glue, significantly simplified manufacturing process;
Three, encapsulation process is directly carried out on transparent enclosure film or clear glass, easy to operate, and adopts point gum machine to compared with the method for one one glue in bowl cup, and utilization of materials is high, has reduced packaging cost;
Four, without the restriction of support shape, encapsulation process is simpler, is beneficial to the large-scale integrated encapsulation of LED product, is beneficial to the cost of packaging;
Five, owing to not adopting the encapsulation of bowl cup, reduce in a large number the scattering-in equal loss of photon between fluorescent material, be beneficial to the brightness of improving product;
Six,, owing to not adopting rack bearing wafer, overlay crystal chip bottom both positive and negative polarity, without the gold-tin alloy layer (conventional method need to arrange gold-tin alloy layer in bottom of wafer and be welded on support) of expensive certain thickness (3 μ m left and right), has significantly been saved cost.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
- The method for packing of 1.LED wafer, is characterized in that, comprises the steps:Making has transparent enclosure film or the transparent glass sheet of the depression that array arranges;In described depression, fill fluorescent glue, the volume of the volume that the fluorescent glue amount that each depression is filled is depression and overlay crystal chip to be packaged poor;Described overlay crystal chip is fixed in described fluorescent glue, and the bottom electrode of described overlay crystal chip is exposed, other faces immerse in described fluorescent glue, form full wafer array-type LED case chip;Described array-type LED case chip is divided into multiple LED encapsulation monomers.
- 2. method for packing as claimed in claim 1, is characterized in that, the shape of described depression and the shape of described overlay crystal chip are coincide.
- 3. method for packing as claimed in claim 1, is characterized in that, the back side of described transparent enclosure film or transparent glass sheet is burnishing surface.
- 4. method for packing as claimed in claim 1, is characterized in that, the back side of described transparent enclosure film or transparent glass sheet is lens arra, and wherein, each lens are corresponding one by one with depression.
- 5. method for packing as claimed in claim 1, is characterized in that, the thickness of the fluorescent glue directly over described overlay crystal chip is 30～500 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038645.4A CN103855259B (en) | 2014-01-26 | 2014-01-26 | LED encapsulation method |
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| CN201410038645.4A CN103855259B (en) | 2014-01-26 | 2014-01-26 | LED encapsulation method |
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| CN103855259A true CN103855259A (en) | 2014-06-11 |
| CN103855259B CN103855259B (en) | 2017-09-08 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015109580A1 (en) * | 2014-01-26 | 2015-07-30 | 上海瑞丰光电子有限公司 | Led encapsulation method |
| CN104900785A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN104900784A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN105161598A (en) * | 2015-07-27 | 2015-12-16 | 广州市鸿利光电股份有限公司 | Injection molding based CSP packaging structure and manufacturing process |
| CN105609622A (en) * | 2016-03-22 | 2016-05-25 | 武汉优炜星科技有限公司 | Ultraviolet LED packaging structure and packaging method therefor |
| CN105870292A (en) * | 2015-01-22 | 2016-08-17 | 深圳市斯迈得半导体有限公司 | High-sealing performance LED support |
| CN106299079A (en) * | 2015-06-24 | 2017-01-04 | 严敏 | The method for packing of a kind of composite LED glass base plane and panel |
| CN106299039A (en) * | 2015-06-24 | 2017-01-04 | 程君 | The packaging process of a kind of composite LED glass base plane and panel |
| CN106356438A (en) * | 2016-11-30 | 2017-01-25 | 东莞市良友五金制品有限公司 | LED (light emitting diode) support frame eutectic crystal encapsulation method |
| CN117133851A (en) * | 2023-10-26 | 2023-11-28 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging diaphragm and LED packaging structure |
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| JPH04338795A (en) * | 1991-05-15 | 1992-11-26 | Takiron Co Ltd | Light emitting display plate and its manufacture |
| CN101652868A (en) * | 2006-12-22 | 2010-02-17 | 皇家飞利浦电子股份有限公司 | Light emitting device including a filter |
| CN102569563A (en) * | 2012-01-20 | 2012-07-11 | 吕思远 | Wafer level packaging method of light emitting diode with adjustable lens focus |
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2014
- 2014-01-26 CN CN201410038645.4A patent/CN103855259B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH04338795A (en) * | 1991-05-15 | 1992-11-26 | Takiron Co Ltd | Light emitting display plate and its manufacture |
| CN101652868A (en) * | 2006-12-22 | 2010-02-17 | 皇家飞利浦电子股份有限公司 | Light emitting device including a filter |
| CN102569563A (en) * | 2012-01-20 | 2012-07-11 | 吕思远 | Wafer level packaging method of light emitting diode with adjustable lens focus |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015109580A1 (en) * | 2014-01-26 | 2015-07-30 | 上海瑞丰光电子有限公司 | Led encapsulation method |
| CN105870292B (en) * | 2015-01-22 | 2018-11-13 | 深圳市斯迈得半导体有限公司 | A kind of high leakproofness LED support |
| CN105870292A (en) * | 2015-01-22 | 2016-08-17 | 深圳市斯迈得半导体有限公司 | High-sealing performance LED support |
| CN104900785A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN104900784A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN104900784B (en) * | 2015-05-22 | 2017-12-05 | 厦门多彩光电子科技有限公司 | The manufacture method of LED encapsulation structure |
| CN106299079A (en) * | 2015-06-24 | 2017-01-04 | 严敏 | The method for packing of a kind of composite LED glass base plane and panel |
| CN106299039A (en) * | 2015-06-24 | 2017-01-04 | 程君 | The packaging process of a kind of composite LED glass base plane and panel |
| CN106299039B (en) * | 2015-06-24 | 2018-12-21 | 程君 | A kind of packaging process and panel of composite LED glass base plane |
| CN105161598A (en) * | 2015-07-27 | 2015-12-16 | 广州市鸿利光电股份有限公司 | Injection molding based CSP packaging structure and manufacturing process |
| CN105609622A (en) * | 2016-03-22 | 2016-05-25 | 武汉优炜星科技有限公司 | Ultraviolet LED packaging structure and packaging method therefor |
| CN106356438A (en) * | 2016-11-30 | 2017-01-25 | 东莞市良友五金制品有限公司 | LED (light emitting diode) support frame eutectic crystal encapsulation method |
| CN117133851A (en) * | 2023-10-26 | 2023-11-28 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging diaphragm and LED packaging structure |
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| CN103855259B (en) | 2017-09-08 |
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Effective date of registration: 20210118 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758, Luchaogang Road, Luchaogang Town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |
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