CN103855283B - LED packaging body and illumination device - Google Patents
LED packaging body and illumination device Download PDFInfo
- Publication number
- CN103855283B CN103855283B CN201410038643.5A CN201410038643A CN103855283B CN 103855283 B CN103855283 B CN 103855283B CN 201410038643 A CN201410038643 A CN 201410038643A CN 103855283 B CN103855283 B CN 103855283B
- Authority
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- China
- Prior art keywords
- led package
- fluorescent
- adhesives
- negative electrode
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract description 19
- 238000005286 illumination Methods 0.000 title description 2
- 239000003292 glue Substances 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000013078 crystal Substances 0.000 claims description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 9
- 230000001070 adhesive effect Effects 0.000 abstract 9
- 229910015363 Au—Sn Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED packaging body suitable for the LED product field. The LED packaging body comprises a flip-chip wafer, fluorescent adhesives and transparent packaging adhesives, wherein the flip-chip wafer is coated with the fluorescent adhesives and the fluorescent adhesives are coated with the transparent packaging adhesives. A positive electrode and a negative electrode are arranged at the bottom of the flip-chip wafer, the periphery of the fluorescent adhesives extends outwards to form a brim-shaped outer edge, and the periphery of the transparent packaging adhesives extends to be arranged on the outer edge. The whole LED packaging body is only composed of the flip-chip wafer, the fluorescent adhesives, the transparent packaging adhesives and the expansion electrodes, reliability is high, materials are saved, cost is low and the productivity is high; because the packaging body is not limited by supports, large-scale integrated packaging is facilitated; bowl or cup glue ejection is not adopted, loss caused by scattering-in of photons in fluorescent powder can be reduced, and therefore product brightness can be conveniently improved; because it is not needed that the positive electrode and negative electrode of the wafer are coated with Au-Sn alloy layers, cost is reduced.
Description
Technical field
The present invention relates to technical field of LED illumination, more particularly to a kind of LED package and illuminator.
Background technology
The packaged type of conventional white light LED product is to consolidate LED wafer by way of crystal-bonding adhesive bonding or eutectic welding
It is scheduled in the bowl on support, the positive pole of chip is connected to using gold thread for the positive pole of support, the negative pole of chip is connected to and is propped up
The negative pole of frame, then filling meets the fluorescent glue in aim colour area in bowl.Due to support, fluorescent glue, for the glue of bonding chip
The thermal coefficient of expansion of body is different, and LED package easily integrity problem occurs at aspects such as support, fluorescent glue, gold thread, colloids；
And LED support species is various, the material of bonding chip and support both positive and negative polarity mostly is PPA, PCT and EMC materials, its
Heat-resisting quantity, air-tightness has larger defect, and then affects the reliability of LED product.Although ceramics bracket has preferable
Heat-resisting quantity and preferable air-tightness, but the close chip cost of support cost, and ceramics bracket encapsulation LED systems take costliness, if
Standby input is big, causes the LED product production capacity of ceramics bracket little, and price is high.Therefore, the LED product of support encapsulated structure is can
By property, service life, manufacturing cost and defect in price are the larger resistances that LED product substitutes traditional lighting products
Hinder.
The content of the invention
It is an object of the invention to provide a kind of LED package, it is intended to improve the reliability of LED product, it is ensured that it is longer
Service life, while reduces cost, improve production capacity.
The present invention is achieved in that a kind of LED package, including overlay crystal chip, is coated on outside the overlay crystal chip
Fluorescent glue and the transparent enclosure glue that is coated on outside the fluorescent glue；The bottom of the overlay crystal chip is provided with anelectrode and negative electricity
Pole；The periphery of the fluorescent glue stretches out to form the outer of a shade type, and the periphery of the transparent enclosure glue extends to described
On outer.
Another object of the present invention is to a kind of illuminator is provided, including described LED package.
The LED package that the present invention is provided has the advantage that compared with the LED product that conventional stent is encapsulated：
Firstth, whole packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue and bottom of wafer expansion electrode,
The materials such as support, gold thread, and overlay crystal chip, fluorescent glue and transparent enclosure colloidality energy stabilizer pole are saved, reliability is far above props up
The encapsulation mode of frame and gold thread, and then avoid because support product reliability different and caused with the thermal coefficient of expansion of colloid is asked
Topic, it is ensured that the service life of its overlength, and great amount of cost can be saved, improve production capacity；
Secondth, fluorescent glue and transparent encapsulated layer do not adopt bowl form, need not be using point gum machine into bowl during manufacture
Dispensing one by one, utilization of materials is high, reduces packaging cost；
3rd, support is not adopted to encapsulate, when carrying out the coating of fluorescent glue and transparent enclosure glue, the restriction without support shape,
Encapsulate beneficial to the large-scale integrated of LED product, reduce beneficial to the cost of packaging；
4th, fluorescent glue is directly coated on overlay crystal chip surface, carries the mode of fluorescent glue different from support bowl, in a large number
Scattering-in equal loss of the photon between fluorescent material is reduced, beneficial to the brightness of improving product；
5th, due to not adopting rack bearing chip, overlay crystal chip bottom both positive and negative polarity is without the need for expensive certain thickness（3μm
Left and right）Gold-tin alloy layer, being only deposited with layer gold or silver layer expansion electrode can significantly save with the solder welding such as application end tin cream
Cost.
Description of the drawings
Fig. 1 is the structural representation of LED package provided in an embodiment of the present invention（One）；
Fig. 2 is the structural representation of LED package provided in an embodiment of the present invention（Two）；
Fig. 3 is the structural representation of LED package provided in an embodiment of the present invention（Three）；
Fig. 4 is the structural representation of LED package provided in an embodiment of the present invention（Four）.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, and
It is not used in the restriction present invention.
Fig. 1～4 show three kinds of structural representations of LED package provided in an embodiment of the present invention, for convenience of description,
Illustrate only part related to the present embodiment.
Fig. 1 is referred to, LED package provided in an embodiment of the present invention includes：Overlay crystal chip 1, be coated on overlay crystal chip 1 it
Outer fluorescent glue 2 and the transparent enclosure glue 3 being coated on outside fluorescent glue 2, the bottom of overlay crystal chip 1 is provided with anelectrode 11 and negative electricity
Pole 12, further, is also provided with extending anelectrode 41 in the surface of the anelectrode 11, also sets in the surface of the negative electrode 12
There is extension negative electrode 42, the extension anelectrode 41 and extension negative electrode 42 extend respectively to the two of the bottom of whole LED package
End.In addition, the periphery of fluorescent glue 2 stretches out to form the outer 21 of a shade type, the periphery of transparent enclosure glue 3 extends to fluorescence
On the outer 21 of glue 2, extend anelectrode 41 and extension negative electrode 42 extends to the outer end of the outer 21.The LED package
The light that sends of overlay crystal chip 1 during fluorescent glue 2 excitated fluorescent powder, the fluorescence that fluorescent material is produced and overlay crystal chip 1
The light for sending is mixed to form white light.White light changes transmission path after top transparent enclosure glue 3, and then changes the transmission of light beam
Direction and dispersion angle, finally with the injection of default angle.
With further reference to Fig. 1～3, transparent enclosure glue 3 can be planar structure, or lens arrangement, can also be
Other Rational structure, concrete shape determines according to the demand of application end.
Further, the extension anelectrode 41 and extension negative electrode 42 can be being respectively formed in by the way of being deposited with using surface
The surface of the bottom electrode of overlay crystal chip 1, and extend out to the outer end of the whole bottom of LED package.The extension He of anelectrode 41
The material of extension negative electrode 42 can select the high conductive materials such as gold or silver, and thickness is only 0.05～3 μm.
With further reference to Fig. 4, between the anelectrode and negative electrode of the LED package bottom, and extension anelectrode and expansion
Anti- solder 5 can also be filled in region between exhibition negative electrode, both positive and negative polarity short circuit during preventing application end from welding.
The LED package can be manufactured by the following method：
The first step, overlay crystal chip is fixed on workbench, in array arrangement；
Second step, on workbench fluorescent glue is coated, and overlay crystal chip is covered, and in cell array top integrative-structure is formed
Fluorescent adhesive layer；
3rd step, the fluorescent glue part between adjacent overlay crystal chip is removed, and retains certain thickness（10～100 μm, preferably
20μm）Fluorescent glue, to protect workbench；
In the present embodiment, it is necessary and favourable to retain certain thickness fluorescent glue, because in the mistake of cutting fluorescent glue
It is easy to damage workbench in journey, retaining a part of fluorescent glue can prevent the situation from occurring；In addition, to fluorescent glue is complete
Segmentation, in order to avoid damaging workbench, generally removes encapsulating products, all removes the fluorescent glue between chip outside workbench
Remove, being then put into again on workbench carries out the coating work of transparent enclosure glue, so need a large amount of single LED encapsulation pieces one
One is positioned over workbench and places according to preset pitch, is extremely complex process；If carrying out complete parttion, work on the table
Making platform will be damaged, and need to be repaired using unclassified stores, necessarily cause table surface rough and uneven in surface, affect follow-up behaviour
Make.Therefore, the fluorescent glue between adjacent overlay crystal chip is retained into certain thickness, it is possible to avoid the problems referred to above, and will not increase into
This increases technology difficulty.This step is embodied in the structure of LED package, is the peripheral rim portion of fluorescent glue.
4th step, to fluorescent glue surface-coated transparent enclosure glue, makes transparent enclosure glue fill the sky between adjacent overlay crystal chip
Missing plot domain, and transparent encapsulated layer is formed on fluorescent glue, obtain array-type LED packaging body；
The transparent encapsulated layer that the step is formed can be planar structure, or array structure thereof, lens arra
Each lens is corresponded with overlay crystal chip.
5th step, array-type LED packaging body is removed from workbench, and the bottom positive and negative electrode of overlay crystal chip is steamed
The expansion electrode operation of plating metal, to expand electrode, is easy to and application end electrode welding；
The metal expansion electrode being deposited with this step can be not required to using expensive gold using high conductive materials such as gold, silver
Tin alloy, different from the LED package of conventional stent designses, the LED product needs of conventional stent encapsulation are in bottom of wafer for this point
Electrode arranges thicker（About 3 μm）Gold-tin alloy layer that thin layer need to be only deposited with so that chip is welded on support, herein is conductive
Material can meet the welding requirements of application end, substantial amounts of to have saved material and cost.
5th step, by array-type LED packaging body multiple LED encapsulation monomers are divided into.
Detached LED encapsulation monomer, i.e., LED package provided in an embodiment of the present invention can be obtained through above-mentioned steps.Should
Encapsulation monomer includes four parts, overlay crystal chip 1, fluorescent glue 2, transparent enclosure glue 3 and extension anelectrode 41 and extension negative electrode 42.
Intersected with the angle not less than 90 ° with side in the front of fluorescent glue.
LED package provided in an embodiment of the present invention has the advantage that compared with the LED product that conventional stent is encapsulated：
Firstth, whole packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue and bottom of wafer expansion electrode,
The materials such as support, gold thread, and overlay crystal chip, fluorescent glue and transparent enclosure colloidality energy stabilizer pole are saved, reliability is far above props up
The encapsulation mode of frame and gold thread, and then avoid because support product reliability different and caused with the thermal coefficient of expansion of colloid is asked
Topic, it is ensured that the service life of its overlength, and great amount of cost can be saved, improve production capacity；
Secondth, fluorescent glue and transparent encapsulated layer do not adopt bowl form, need not be using point gum machine into bowl during manufacture
Dispensing one by one, utilization of materials is high, reduces packaging cost；
3rd, support is not adopted to encapsulate, when carrying out the coating of fluorescent glue and transparent enclosure glue, the restriction without support shape,
Encapsulate beneficial to the large-scale integrated of LED product, reduce beneficial to the cost of packaging；
4th, fluorescent glue is directly coated on overlay crystal chip surface, carries the mode of fluorescent glue different from support bowl, in a large number
Scattering-in equal loss of the photon between fluorescent material is reduced, beneficial to the brightness of improving product；
5th, due to not adopting rack bearing chip, overlay crystal chip bottom both positive and negative polarity is without the need for expensive certain thickness（3μm
Left and right）Gold-tin alloy layer, being only deposited with layer gold or silver layer expansion electrode can significantly save with the solder welding such as application end tin cream
Cost.
The LED package is suitable for various illuminators, including the illuminator of the LED package is also the present invention's
In protection domain.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (9)
1. a kind of LED package, it is characterised in that including overlay crystal chip, the fluorescent glue being coated on outside the overlay crystal chip and
The transparent enclosure glue being coated on outside the fluorescent glue；The bottom of the overlay crystal chip is provided with anelectrode and negative electrode, described glimmering
The periphery of optical cement stretches out to form the outer of a shade type, and the periphery of the transparent enclosure glue is extended on the outer；
The lateral surface of the outer aligns with the lateral surface of the transparent enclosure glue.
2. LED package as claimed in claim 1, it is characterised in that set respectively in the surface of the anelectrode and negative electrode
There are extension anelectrode and extension negative electrode, the extension anelectrode and extension negative electrode extend respectively to the LED package
The two ends of bottom.
3. LED package as claimed in claim 2, it is characterised in that the material of the extension anelectrode and extension negative electrode
For gold or silver, thickness is 0.05～3 μm.
4. LED package as claimed in claim 1, it is characterised in that the thickness of the outer of the fluorescent glue is 10～100 μ
m。
5. LED package as claimed in claim 1, it is characterised in that the transparent enclosure glue is planar structure.
6. LED package as claimed in claim 1, it is characterised in that the transparent enclosure glue is lens arrangement.
7. the LED package as described in any one of claim 1 to 6, it is characterised in that between the anelectrode and negative electrode
And it is filled with anti-solder between extension anelectrode and extension negative electrode.
8. the LED package as described in any one of claim 1 to 6, it is characterised in that the front of the fluorescent glue and side with
Angle not less than 90 ° intersects.
9. a kind of illuminator, it is characterised in that including the LED package described in any one of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038643.5A CN103855283B (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038643.5A CN103855283B (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855283A CN103855283A (en) | 2014-06-11 |
| CN103855283B true CN103855283B (en) | 2017-05-10 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410038643.5A Active CN103855283B (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183686B (en) * | 2014-09-09 | 2018-02-02 | 厦门市三安光电科技有限公司 | LED device and preparation method thereof |
| CN114497318A (en) * | 2021-12-31 | 2022-05-13 | 江苏泓冠光电科技有限公司 | CSP packaging process |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299427A (en) * | 2007-04-30 | 2008-11-05 | 启萌科技有限公司 | Luminescence module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010074117A (en) * | 2007-12-07 | 2010-04-02 | Panasonic Electric Works Co Ltd | Light emitting device |
| CN101771024B (en) * | 2008-12-30 | 2012-10-10 | 京东方科技集团股份有限公司 | Light-emitting diode (LED) and packaging method thereof |
| CN101551068A (en) * | 2009-04-30 | 2009-10-07 | 旭丽电子(广州)有限公司 | Light emitting diode device and encapsulating method thereof |
| CN102270730A (en) * | 2011-07-27 | 2011-12-07 | 晶科电子（广州）有限公司 | LED (light emitting diode) device free of gold wires |
| TW201351700A (en) * | 2012-06-05 | 2013-12-16 | Walsin Lihwa Corp | Light emitting diode and manufacturing method thereof |
| CN203746898U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | LED packaging body and illumination equipment |
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2014
- 2014-01-26 CN CN201410038643.5A patent/CN103855283B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299427A (en) * | 2007-04-30 | 2008-11-05 | 启萌科技有限公司 | Luminescence module |
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Effective date of registration: 20210115 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758, Luchaogang Road, Luchaogang Town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |
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