CN103855283A - LED packaging body and illumination device - Google Patents
LED packaging body and illumination device Download PDFInfo
- Publication number
- CN103855283A CN103855283A CN201410038643.5A CN201410038643A CN103855283A CN 103855283 A CN103855283 A CN 103855283A CN 201410038643 A CN201410038643 A CN 201410038643A CN 103855283 A CN103855283 A CN 103855283A
- Authority
- CN
- China
- Prior art keywords
- packaging body
- led packaging
- adhesives
- expansion
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 53
- 238000005286 illumination Methods 0.000 title 1
- 239000003292 glue Substances 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000013078 crystal Substances 0.000 claims description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 239000000843 powder Substances 0.000 abstract description 2
- 229910015363 Au—Sn Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED packaging body suitable for the LED product field. The LED packaging body comprises a flip-chip wafer, fluorescent adhesives and transparent packaging adhesives, wherein the flip-chip wafer is coated with the fluorescent adhesives and the fluorescent adhesives are coated with the transparent packaging adhesives. A positive electrode and a negative electrode are arranged at the bottom of the flip-chip wafer, the periphery of the fluorescent adhesives extends outwards to form a brim-shaped outer edge, and the periphery of the transparent packaging adhesives extends to be arranged on the outer edge. The whole LED packaging body is only composed of the flip-chip wafer, the fluorescent adhesives, the transparent packaging adhesives and the expansion electrodes, reliability is high, materials are saved, cost is low and the productivity is high; because the packaging body is not limited by supports, large-scale integrated packaging is facilitated; bowl or cup glue ejection is not adopted, loss caused by scattering-in of photons in fluorescent powder can be reduced, and therefore product brightness can be conveniently improved; because it is not needed that the positive electrode and negative electrode of the wafer are coated with Au-Sn alloy layers, cost is reduced.
Description
Technical field
The present invention relates to LED lighting technical field, relate in particular to a kind of LED packaging body and lighting device.
Background technology
The packaged type of conventional white light LED product is that the mode of LED wafer is bonding by crystal-bonding adhesive or eutectic welding is fixed in the bowl cup on support, adopt gold thread the positive pole of wafer to be connected in to the positive pole of support, the negative pole of wafer is connected in to the negative pole of support, then fills the fluorescent glue that meets aim colour district in bowl cup.Due to support, fluorescent glue, for the thermal coefficient of expansion difference of the colloid of bonding wafer, easily there is integrity problem at aspects such as support, fluorescent glue, gold thread, colloids in LED packaging body; And LED support is of a great variety, the material of bonding wafer and support both positive and negative polarity mostly is PPA, PCT and EMC material, and its heat-resisting quantity, air-tightness all has larger defect, and then affects the reliability of LED product.Although ceramics bracket has good heat-resisting quantity and good air-tightness, support cost approaches wafer cost, and ceramics bracket packaged LED system take costliness, and equipment investment is large, causes the LED product production capacity of ceramics bracket little, and price is high.Therefore, the LED product of support encapsulated structure is in reliability, and in useful life, manufacturing cost and defect are in price all larger obstructions of LED products substitution traditional lighting product.
Summary of the invention
The object of the present invention is to provide a kind of LED packaging body, be intended to improve the reliability of LED product, ensure the useful life that it is grown, reduce costs simultaneously, improve production capacity.
The present invention is achieved in that a kind of LED packaging body, comprises overlay crystal chip, is coated on the fluorescent glue outside described overlay crystal chip and is coated on the transparent enclosure glue outside described fluorescent glue; The bottom of described overlay crystal chip is provided with positive electrode and negative electrode; The periphery of described fluorescent glue stretches out and forms the outer of a shade type, and the periphery of described transparent enclosure glue extends on described outer.
Another object of the present invention is to provide a kind of lighting device, comprise described LED packaging body.
Compared with the LED product that LED packaging body provided by the invention encapsulates with conventional stent, tool has the following advantages:
The first, whole packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue and bottom of wafer expansion electrode, save the material such as support, gold thread, and overlay crystal chip, fluorescent glue and transparent enclosure colloidality be stabilizer pole all, reliability is far above the encapsulation mode of support and gold thread, and then avoid the different product reliability problems that cause of thermal coefficient of expansion due to support and colloid, ensure the useful life of its overlength, and can save great amount of cost, improve production capacity;
The second, fluorescent glue and transparent encapsulated layer do not adopt the cup-shaped formula of bowl, do not need to adopt point gum machine to one one glue in bowl cup when manufacture, and utilization of materials is high, has reduced packaging cost;
Three, do not adopt support encapsulation, while carrying out the coating of fluorescent glue and transparent enclosure glue, without the restriction of support shape, be beneficial to the large-scale integrated encapsulation of LED product, be beneficial to the cost of packaging;
Four, fluorescent glue is directly coated on overlay crystal chip surface, is different from the mode of support bowl cup carrying fluorescent glue, reduces in a large number the scattering-in equal loss of photon between fluorescent material, is beneficial to the brightness of improving product;
Five,, owing to not adopting rack bearing wafer, overlay crystal chip bottom both positive and negative polarity is without the gold-tin alloy layer of expensive certain thickness (3 μ m left and right), only gold evaporation layer or silver layer expansion electrode can with the scolder welding such as application end tin cream, significantly saved cost.
Brief description of the drawings
Fig. 1 is the structural representation () of the LED packaging body that provides of the embodiment of the present invention;
Fig. 2 is the structural representation (two) of the LED packaging body that provides of the embodiment of the present invention;
Fig. 3 is the structural representation (three) of the LED packaging body that provides of the embodiment of the present invention;
Fig. 4 is the structural representation (four) of the LED packaging body that provides of the embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Fig. 1～4 show three kinds of structural representations of the LED packaging body that the embodiment of the present invention provides, and for convenience of explanation, only show the part relevant to the present embodiment.
Refer to Fig. 1, the LED packaging body that the embodiment of the present invention provides comprises: overlay crystal chip 1, be coated on the fluorescent glue 2 outside overlay crystal chip 1 and be coated on the transparent enclosure glue 3 outside fluorescent glue 2, the bottom of overlay crystal chip 1 is provided with positive electrode 11 and negative electrode 12, further, can also be provided with expansion positive electrode 41 in the surface of this positive electrode 11, also be provided with expansion negative electrode 42 in the surface of this negative electrode 12, this expansion positive electrode 41 and expansion negative electrode 42 extend to respectively the two ends of the bottom of whole LED packaging body.In addition, the periphery of fluorescent glue 2 stretches out and forms the outer 21 of a shade type, and the periphery of transparent enclosure glue 3 extends on the outer 21 of fluorescent glue 2, and expansion positive electrode 41 and expansion negative electrode 42 extend to the outer end of this outer 21.The light that the overlay crystal chip 1 of this LED packaging body sends is through excitated fluorescent powder in the process of fluorescent glue 2, and the light that the fluorescence that fluorescent material produces and overlay crystal chip 1 send is mixed to form white light.White light changes transmission path after top transparent enclosure glue 3, and then changes transmission direction and the dispersion angle of light beam, finally penetrates with the angle of presetting.
With further reference to Fig. 1～3, transparent enclosure glue 3 can be planar structure, can be also lens arrangement, can also be other Rational structure, and concrete shape is according to the Location of requirement of application end.
Further, this expansion positive electrode 41 and expansion negative electrode 42 can adopt the mode of surperficial evaporation to be formed at respectively the surface of the bottom electrode of overlay crystal chip 1, and extend out to the outer end of the whole bottom of LED packaging body.The material of expansion positive electrode 41 and expansion negative electrode 42 can be selected the high conductive material such as gold or silver, and thickness is only 0.05～3 μ m.
With further reference to Fig. 4, between the positive electrode and negative electrode of this LED package bottom, and can also fill anti-scolder 5 in expansion positive electrode and the region of expansion between negative electrode, both positive and negative polarity short circuit when preventing application end welding.
This LED packaging body can be manufactured by the following method:
The first step, is fixed on overlay crystal chip on workbench, is array and arranges;
Second step applies fluorescent glue on workbench, and overlay crystal chip is covered, and forms the fluorescent adhesive layer of integrative-structure in wafer array top;
The 3rd step, removes the fluorescent glue part between adjacent overlay crystal chip, and reservation certain thickness (10～100 μ m, preferably 20 μ fluorescent glue m), to protect workbench;
In the present embodiment, it is necessary and favourable retaining certain thickness fluorescent glue, because be easy to damage workbench in the process of cutting fluorescent glue, retain a part of fluorescent glue and can prevent that this situation from occurring; In addition, if fluorescent glue will be cut apart completely, for fear of damage workbench, conventionally encapsulating products is taken off, outside workbench, the fluorescent glue between wafer is all removed, and then be put into the coating work of carrying out transparent enclosure glue on workbench, and a large amount of single LED packaging parts need to be positioned over to workbench one by one and place according to default spacing like this, be extremely complicated process; If cut apart completely on workbench, workbench will be damaged, and need to adopt unclassified stores repaired, and must cause workbench surface rough and uneven in surface, affects subsequent operation.Therefore, the fluorescent glue between adjacent overlay crystal chip is retained to certain thickness, just can avoid the problems referred to above, and can not increase cost or increase technology difficulty.This step is embodied in the structure of LED packaging body, is the outer part of fluorescent glue.
The 4th step, to fluorescent glue surface-coated transparent enclosure glue, makes transparent enclosure glue fill the area of absence between adjacent overlay crystal chip, and on fluorescent glue, forms transparent encapsulated layer, obtains array-type LED packaging body;
The transparent encapsulated layer that this step forms can be planar structure, can be also array structure thereof, and each lens of lens arra are corresponding one by one with overlay crystal chip.
The 5th step, takes off array-type LED packaging body from workbench, the bottom positive and negative electrode of overlay crystal chip is carried out to the operation of evaporation metal expansion electrode, to expand electrode, is convenient to and application end electrode welding;
In this step, the metal expansion electrode of evaporation can adopt the high conductive materials such as gold, silver, do not need to adopt expensive gold-tin alloy, this point is different from the LED packaging body of conventional stent designs, thicker (approximately 3 μ gold-tin alloy layer m) is to be welded on wafer on support in the setting of bottom of wafer electrode for the LED product needed of conventional stent encapsulation, only need evaporation thin layer electric conducting material can meet the welding requirements of application end herein, a large amount of saving material and cost.
The 5th step, is divided into multiple LED encapsulation monomers by array-type LED packaging body.
Can obtain the LED encapsulation monomer of separation through above-mentioned steps, the LED packaging body that embodiment of the present invention provides.This encapsulation monomer comprises four parts, overlay crystal chip 1, fluorescent glue 2, transparent enclosure glue 3 and expansion positive electrode 41 and expansion negative electrode 42.The front of fluorescent glue and side are crossing to be not less than the angle of 90 °.
Compared with the LED product that the LED packaging body that the embodiment of the present invention provides encapsulates with conventional stent, tool has the following advantages:
The first, whole packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue and bottom of wafer expansion electrode, save the material such as support, gold thread, and overlay crystal chip, fluorescent glue and transparent enclosure colloidality be stabilizer pole all, reliability is far above the encapsulation mode of support and gold thread, and then avoid the different product reliability problems that cause of thermal coefficient of expansion due to support and colloid, ensure the useful life of its overlength, and can save great amount of cost, improve production capacity;
The second, fluorescent glue and transparent encapsulated layer do not adopt the cup-shaped formula of bowl, do not need to adopt point gum machine to one one glue in bowl cup when manufacture, and utilization of materials is high, has reduced packaging cost;
Three, do not adopt support encapsulation, while carrying out the coating of fluorescent glue and transparent enclosure glue, without the restriction of support shape, be beneficial to the large-scale integrated encapsulation of LED product, be beneficial to the cost of packaging;
Four, fluorescent glue is directly coated on overlay crystal chip surface, is different from the mode of support bowl cup carrying fluorescent glue, reduces in a large number the scattering-in equal loss of photon between fluorescent material, is beneficial to the brightness of improving product;
Five,, owing to not adopting rack bearing wafer, overlay crystal chip bottom both positive and negative polarity is without the gold-tin alloy layer of expensive certain thickness (3 μ m left and right), only gold evaporation layer or silver layer expansion electrode can with the scolder welding such as application end tin cream, significantly saved cost.
This LED packaging body is applicable in various lighting devices, comprises that the lighting device of this LED packaging body is also in protection scope of the present invention.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (9)
1. a LED packaging body, is characterized in that, comprises overlay crystal chip, is coated on the fluorescent glue outside described overlay crystal chip and is coated on the transparent enclosure glue outside described fluorescent glue; The bottom of described overlay crystal chip is provided with positive electrode and negative electrode, and the periphery of described fluorescent glue stretches out and forms the outer of a shade type, and the periphery of described transparent enclosure glue extends on described outer.
2. LED packaging body as claimed in claim 1, it is characterized in that, be respectively equipped with expansion positive electrode and expansion negative electrode in the surface of described positive electrode and negative electrode, described expansion positive electrode and expansion negative electrode extend to respectively the two ends of the bottom of described LED packaging body.
3. LED packaging body as claimed in claim 1, is characterized in that, the material of described expansion positive electrode and expansion negative electrode is gold or silver-colored, and thickness is 0.05～3 μ m.
4. LED packaging body as claimed in claim 1, is characterized in that, the thickness of the outer of described fluorescent glue is 10～100 μ m.
5. LED packaging body as claimed in claim 1, is characterized in that, described transparent enclosure glue is planar structure.
6. LED packaging body as claimed in claim 1, is characterized in that, described transparent enclosure glue is lens arrangement.
7. the LED packaging body as described in claim 1 to 6 any one, is characterized in that, in being filled with anti-scolder between described positive electrode and negative electrode and between expansion positive electrode and expansion negative electrode.
8. the LED packaging body as described in claim 1 to 6 any one, is characterized in that, the front of described fluorescent glue and side are crossing to be not less than the angle of 90 °.
9. a lighting device, is characterized in that, comprises the LED packaging body described in claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038643.5A CN103855283B (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038643.5A CN103855283B (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855283A true CN103855283A (en) | 2014-06-11 |
| CN103855283B CN103855283B (en) | 2017-05-10 |
Family
ID=50862690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410038643.5A Active CN103855283B (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103855283B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016037466A1 (en) * | 2014-09-09 | 2016-03-17 | 厦门市三安光电科技有限公司 | Light emitting diode device and manufacturing method therefor |
| CN114497318A (en) * | 2021-12-31 | 2022-05-13 | 江苏泓冠光电科技有限公司 | CSP packaging process |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299427A (en) * | 2007-04-30 | 2008-11-05 | 启萌科技有限公司 | Luminescence module |
| CN101551068A (en) * | 2009-04-30 | 2009-10-07 | 旭丽电子(广州)有限公司 | Light emitting diode device and encapsulating method thereof |
| CN101771024A (en) * | 2008-12-30 | 2010-07-07 | 京东方科技集团股份有限公司 | Light-emitting diode (LED) and packaging method thereof |
| US20100237375A1 (en) * | 2007-12-07 | 2010-09-23 | Panasonic Electric Works Co., Ltd. | Light Emitting Device |
| CN102270730A (en) * | 2011-07-27 | 2011-12-07 | 晶科电子（广州）有限公司 | LED (light emitting diode) device free of gold wires |
| CN103474542A (en) * | 2012-06-05 | 2013-12-25 | 华新丽华股份有限公司 | Light emitting diode and method for manufacturing the same |
| CN203746898U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | LED packaging body and illumination equipment |
-
2014
- 2014-01-26 CN CN201410038643.5A patent/CN103855283B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299427A (en) * | 2007-04-30 | 2008-11-05 | 启萌科技有限公司 | Luminescence module |
| US20100237375A1 (en) * | 2007-12-07 | 2010-09-23 | Panasonic Electric Works Co., Ltd. | Light Emitting Device |
| CN101771024A (en) * | 2008-12-30 | 2010-07-07 | 京东方科技集团股份有限公司 | Light-emitting diode (LED) and packaging method thereof |
| CN101551068A (en) * | 2009-04-30 | 2009-10-07 | 旭丽电子(广州)有限公司 | Light emitting diode device and encapsulating method thereof |
| CN102270730A (en) * | 2011-07-27 | 2011-12-07 | 晶科电子（广州）有限公司 | LED (light emitting diode) device free of gold wires |
| CN103474542A (en) * | 2012-06-05 | 2013-12-25 | 华新丽华股份有限公司 | Light emitting diode and method for manufacturing the same |
| CN203746898U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | LED packaging body and illumination equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016037466A1 (en) * | 2014-09-09 | 2016-03-17 | 厦门市三安光电科技有限公司 | Light emitting diode device and manufacturing method therefor |
| CN114497318A (en) * | 2021-12-31 | 2022-05-13 | 江苏泓冠光电科技有限公司 | CSP packaging process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103855283B (en) | 2017-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103855259B (en) | LED encapsulation method | |
| CN203746898U (en) | LED packaging body and illumination equipment | |
| CN102723423B (en) | Gold-wire-free double-faced light-emergence packaging method and packaging structure for high-power white-light light emitting diode (LED) device | |
| CN103872212B (en) | LED (light-emitting diode) packaging method | |
| CN106935694A (en) | A kind of CSP LED encapsulation methods | |
| CN103855278A (en) | LED packaging structure and illumination equipment | |
| CN105140374A (en) | Routing-free LED packaging structure and preparation method therefor | |
| CN103972360A (en) | Method for packaging LED chips | |
| CN103474551A (en) | High-power light-emitting diode (LED) substrate and packaging method thereof | |
| CN203746899U (en) | LED packaging structure and illumination equipment | |
| CN103855283A (en) | LED packaging body and illumination device | |
| CN103855279A (en) | LED packaging method | |
| CN107819065A (en) | A kind of flip LED luminescent device and preparation method thereof | |
| CN103855284B (en) | LED wafer packaging method | |
| CN105405777A (en) | Large-area parallel stacking type packaging structure and packaging method | |
| CN205028918U (en) | LED support and LED packaging body | |
| CN210429881U (en) | LED support packaging structure | |
| CN102403281A (en) | High-performance packaging structure of chip | |
| CN203746896U (en) | Led | |
| CN209232787U (en) | A kind of CHIP type LED packaging | |
| CN102832330B (en) | Wafer level LED packaging structure | |
| CN105161606A (en) | LED packaging method | |
| CN104112811A (en) | LED (light emitting diode) packaging method | |
| CN103280510A (en) | LED (light-emitting diode) packaging structure and packaging method thereof | |
| CN204403890U (en) | Forward LED lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210115 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758, Luchaogang Road, Luchaogang Town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right |