CN203746898U - LED packaging body and illumination equipment - Google Patents
LED packaging body and illumination equipment Download PDFInfo
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- CN203746898U CN203746898U CN201420051766.8U CN201420051766U CN203746898U CN 203746898 U CN203746898 U CN 203746898U CN 201420051766 U CN201420051766 U CN 201420051766U CN 203746898 U CN203746898 U CN 203746898U
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- packaging body
- fluorescent glue
- led packaging
- expansion
- glue
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Abstract
The utility model provides an LED packaging body and illumination equipment, and is suitable for the field of LED products. The LED packaging body comprises a flip chip, fluorescent glue and transparent packaging adhesive, wherein the flip chip is wrapped in the fluorescent glue, and the fluorescent glue is wrapped in the transparent packaging adhesive. The bottom of the flip chip is provided with a positive electrode and a negative electrode, the periphery of the fluorescent glue extends outwardly to form a brim-shaped outer edge, and the periphery of the transparent packaging adhesive extends to positions on the outer edge. The whole packaging body is only composed of the flip chip, the fluorescent glue, the transparent packaging adhesive and expanded electrodes, so that the reliability is high, materials are saved, the cost is low and the capacity is high; the packaging body is not limited by a support, which is conducive to large-scale integrated packaging; a bowl dispensing manner can reduce loss of photons caused by scattering in fluorescent powder and is helpful for improving the brightness of products; and the positive and negative electrodes of the chip are not required to be coated with a gold and tin alloy layer, and the cost is saved.
Description
Technical field
The utility model relates to LED lighting technical field, relates in particular to a kind of LED packaging body and lighting device.
Background technology
The packaged type of conventional white light LED product is that the mode of LED wafer is bonding by crystal-bonding adhesive or eutectic welding is fixed in the bowl cup on support, adopt gold thread the positive pole of wafer to be connected in to the positive pole of support, the negative pole of wafer is connected in to the negative pole of support, then fills the fluorescent glue that meets aim colour district in bowl cup.Due to support, fluorescent glue, for the thermal coefficient of expansion difference of the colloid of bonding wafer, easily there is integrity problem at aspects such as support, fluorescent glue, gold thread, colloids in LED packaging body; And LED support is of a great variety, the material of bonding wafer and support both positive and negative polarity mostly is PPA, PCT and EMC material, and its heat-resisting quantity, air-tightness all has larger defect, and then affects the reliability of LED product.Although ceramics bracket has good heat-resisting quantity and good air-tightness, support cost approaches wafer cost, and ceramics bracket packaged LED system take costliness, and equipment investment is large, causes the LED product production capacity of ceramics bracket little, and price is high.Therefore, the LED product of support encapsulated structure is in reliability, and in useful life, manufacturing cost and defect are in price all larger obstructions of LED products substitution traditional lighting product.
Utility model content
The purpose of this utility model is to provide a kind of LED packaging body, is intended to improve the reliability of LED product, ensures the useful life that it is grown, and reduces costs simultaneously, improves production capacity.
The utility model is achieved in that a kind of LED packaging body, comprises overlay crystal chip, is coated on the fluorescent glue outside described overlay crystal chip and is coated on the transparent enclosure glue outside described fluorescent glue; The bottom of described overlay crystal chip is provided with positive electrode and negative electrode; The periphery of described fluorescent glue stretches out and forms the outer of a shade type, and the periphery of described transparent enclosure glue extends on described outer.
As optimal technical scheme of the present utility model:
Be respectively equipped with expansion positive electrode and expansion negative electrode in the surface of described positive electrode and negative electrode, described expansion positive electrode and expansion negative electrode extend to respectively the two ends of the bottom of described LED packaging body.
The material of described expansion positive electrode and expansion negative electrode is gold or silver-colored, and thickness is 0.05～3 μ m.
The thickness of the outer of described fluorescent glue is 10～100 μ m.
Described transparent enclosure glue is planar structure.
Described transparent enclosure glue is lens arrangement.
In being filled with anti-scolder between described positive electrode and negative electrode and between expansion positive electrode and expansion negative electrode.
The front of described fluorescent glue and side are crossing to be not less than the angle of 90 °.
Another object of the present utility model is to provide a kind of lighting device, comprises described LED packaging body.
Compared with the LED product that the LED packaging body that the utility model provides encapsulates with conventional stent, tool has the following advantages:
The first, whole packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue and bottom of wafer expansion electrode, save the material such as support, gold thread, and overlay crystal chip, fluorescent glue and transparent enclosure colloidality be stabilizer pole all, reliability is far above the encapsulation mode of support and gold thread, and then avoid the different product reliability problems that cause of thermal coefficient of expansion due to support and colloid, ensure the useful life of its overlength, and can save great amount of cost, improve production capacity;
The second, fluorescent glue and transparent encapsulated layer do not adopt the cup-shaped formula of bowl, do not need to adopt point gum machine to one one glue in bowl cup when manufacture, and utilization of materials is high, has reduced packaging cost;
Three, do not adopt support encapsulation, while carrying out the coating of fluorescent glue and transparent enclosure glue, without the restriction of support shape, be beneficial to the large-scale integrated encapsulation of LED product, be beneficial to the cost of packaging;
Four, fluorescent glue is directly coated on overlay crystal chip surface, is different from the mode of support bowl cup carrying fluorescent glue, reduces in a large number the scattering-in equal loss of photon between fluorescent material, is beneficial to the brightness of improving product;
Five,, owing to not adopting rack bearing wafer, overlay crystal chip bottom both positive and negative polarity is without the gold-tin alloy layer of expensive certain thickness (3 μ m left and right), only gold evaporation layer or silver layer expansion electrode can with the scolder welding such as application end tin cream, significantly saved cost.
Brief description of the drawings
Fig. 1 is the structural representation () of the LED packaging body that provides of the utility model embodiment;
Fig. 2 is the structural representation (two) of the LED packaging body that provides of the utility model embodiment;
Fig. 3 is the structural representation (three) of the LED packaging body that provides of the utility model embodiment;
Fig. 4 is the structural representation (four) of the LED packaging body that provides of the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Fig. 1～4 show three kinds of structural representations of the LED packaging body that the utility model embodiment provides, and for convenience of explanation, only show the part relevant to the present embodiment.
Refer to Fig. 1, the LED packaging body that the utility model embodiment provides comprises: overlay crystal chip 1, be coated on the fluorescent glue 2 outside overlay crystal chip 1 and be coated on the transparent enclosure glue 3 outside fluorescent glue 2, the bottom of overlay crystal chip 1 is provided with positive electrode 11 and negative electrode 12, further, can also be provided with expansion positive electrode 41 in the surface of this positive electrode 11, also be provided with expansion negative electrode 42 in the surface of this negative electrode 12, this expansion positive electrode 41 and expansion negative electrode 42 extend to respectively the two ends of the bottom of whole LED packaging body.In addition, the periphery of fluorescent glue 2 stretches out and forms the outer 21 of a shade type, and the periphery of transparent enclosure glue 3 extends on the outer 21 of fluorescent glue 2, and expansion positive electrode 41 and expansion negative electrode 42 extend to the outer end of this outer 21.The light that the overlay crystal chip 1 of this LED packaging body sends is through excitated fluorescent powder in the process of fluorescent glue 2, and the light that the fluorescence that fluorescent material produces and overlay crystal chip 1 send is mixed to form white light.White light changes transmission path after top transparent enclosure glue 3, and then changes transmission direction and the dispersion angle of light beam, finally penetrates with the angle of presetting.
With further reference to Fig. 1～3, transparent enclosure glue 3 can be planar structure, can be also lens arrangement, can also be other Rational structure, and concrete shape is according to the Location of requirement of application end.
Further, this expansion positive electrode 41 and expansion negative electrode 42 can adopt the mode of surperficial evaporation to be formed at respectively the surface of the bottom electrode of overlay crystal chip 1, and extend out to the outer end of the whole bottom of LED packaging body.The material of expansion positive electrode 41 and expansion negative electrode 42 can be selected the high conductive material such as gold or silver, and thickness is only 0.05～3 μ m.
With further reference to Fig. 4, between the positive electrode and negative electrode of this LED package bottom, and can also fill anti-scolder 5 in expansion positive electrode and the region of expansion between negative electrode, both positive and negative polarity short circuit when preventing application end welding.
This LED packaging body can be manufactured by the following method:
The first step, is fixed on overlay crystal chip on workbench, is array and arranges;
Second step applies fluorescent glue on workbench, and overlay crystal chip is covered, and forms the fluorescent adhesive layer of integrative-structure in wafer array top;
The 3rd step, removes the fluorescent glue part between adjacent overlay crystal chip, and reservation certain thickness (10～100 μ m, preferably 20 μ fluorescent glue m), to protect workbench;
In the present embodiment, it is necessary and favourable retaining certain thickness fluorescent glue, because be easy to damage workbench in the process of cutting fluorescent glue, retain a part of fluorescent glue and can prevent that this situation from occurring; In addition, if fluorescent glue will be cut apart completely, for fear of damage workbench, conventionally encapsulating products is taken off, outside workbench, the fluorescent glue between wafer is all removed, and then be put into the coating work of carrying out transparent enclosure glue on workbench, and a large amount of single LED packaging parts need to be positioned over to workbench one by one and place according to default spacing like this, be extremely complicated process; If cut apart completely on workbench, workbench will be damaged, and need to adopt unclassified stores repaired, and must cause workbench surface rough and uneven in surface, affects subsequent operation.Therefore, the fluorescent glue between adjacent overlay crystal chip is retained to certain thickness, just can avoid the problems referred to above, and can not increase cost or increase technology difficulty.This step is embodied in the structure of LED packaging body, is the outer part of fluorescent glue.
The 4th step, to fluorescent glue surface-coated transparent enclosure glue, makes transparent enclosure glue fill the area of absence between adjacent overlay crystal chip, and on fluorescent glue, forms transparent encapsulated layer, obtains array-type LED packaging body;
The transparent encapsulated layer that this step forms can be planar structure, can be also array structure thereof, and each lens of lens arra are corresponding one by one with overlay crystal chip.
The 5th step, takes off array-type LED packaging body from workbench, the bottom positive and negative electrode of overlay crystal chip is carried out to the operation of evaporation metal expansion electrode, to expand electrode, is convenient to and application end electrode welding;
In this step, the metal expansion electrode of evaporation can adopt the high conductive materials such as gold, silver, do not need to adopt expensive gold-tin alloy, this point is different from the LED packaging body of conventional stent designs, thicker (approximately 3 μ gold-tin alloy layer m) is to be welded on wafer on support in the setting of bottom of wafer electrode for the LED product needed of conventional stent encapsulation, only need evaporation thin layer electric conducting material can meet the welding requirements of application end herein, a large amount of saving material and cost.
The 5th step, is divided into multiple LED encapsulation monomers by array-type LED packaging body.
Can obtain the LED encapsulation monomer of separation through above-mentioned steps, the LED packaging body that the utility model embodiment provides.This encapsulation monomer comprises four parts, overlay crystal chip 1, fluorescent glue 2, transparent enclosure glue 3 and expansion positive electrode 41 and expansion negative electrode 42.The front of fluorescent glue and side are crossing to be not less than the angle of 90 °.
Compared with the LED product that the LED packaging body that the utility model embodiment provides encapsulates with conventional stent, tool has the following advantages:
The first, whole packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue and bottom of wafer expansion electrode, save the material such as support, gold thread, and overlay crystal chip, fluorescent glue and transparent enclosure colloidality be stabilizer pole all, reliability is far above the encapsulation mode of support and gold thread, and then avoid the different product reliability problems that cause of thermal coefficient of expansion due to support and colloid, ensure the useful life of its overlength, and can save great amount of cost, improve production capacity;
The second, fluorescent glue and transparent encapsulated layer do not adopt the cup-shaped formula of bowl, do not need to adopt point gum machine to one one glue in bowl cup when manufacture, and utilization of materials is high, has reduced packaging cost;
Three, do not adopt support encapsulation, while carrying out the coating of fluorescent glue and transparent enclosure glue, without the restriction of support shape, be beneficial to the large-scale integrated encapsulation of LED product, be beneficial to the cost of packaging;
Four, fluorescent glue is directly coated on overlay crystal chip surface, is different from the mode of support bowl cup carrying fluorescent glue, reduces in a large number the scattering-in equal loss of photon between fluorescent material, is beneficial to the brightness of improving product;
Five,, owing to not adopting rack bearing wafer, overlay crystal chip bottom both positive and negative polarity is without the gold-tin alloy layer of expensive certain thickness (3 μ m left and right), only gold evaporation layer or silver layer expansion electrode can with the scolder welding such as application end tin cream, significantly saved cost.
This LED packaging body is applicable in various lighting devices, comprises that the lighting device of this LED packaging body is also in protection scope of the present invention.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (9)
1. a LED packaging body, is characterized in that, comprises overlay crystal chip, is coated on the fluorescent glue outside described overlay crystal chip and is coated on the transparent enclosure glue outside described fluorescent glue; The bottom of described overlay crystal chip is provided with positive electrode and negative electrode, and the periphery of described fluorescent glue stretches out and forms the outer of a shade type, and the periphery of described transparent enclosure glue extends on described outer.
2. LED packaging body as claimed in claim 1, it is characterized in that, be respectively equipped with expansion positive electrode and expansion negative electrode in the surface of described positive electrode and negative electrode, described expansion positive electrode and expansion negative electrode extend to respectively the two ends of the bottom of described LED packaging body.
3. LED packaging body as claimed in claim 2, is characterized in that, the material of described expansion positive electrode and expansion negative electrode is gold or silver-colored, and thickness is 0.05～3 μ m.
4. LED packaging body as claimed in claim 1, is characterized in that, the thickness of the outer of described fluorescent glue is 10～100 μ m.
5. LED packaging body as claimed in claim 1, is characterized in that, described transparent enclosure glue is planar structure.
6. LED packaging body as claimed in claim 1, is characterized in that, described transparent enclosure glue is lens arrangement.
7. the LED packaging body as described in claim 1 to 6 any one, is characterized in that, in being filled with anti-scolder between described positive electrode and negative electrode and between expansion positive electrode and expansion negative electrode.
8. the LED packaging body as described in claim 1 to 6 any one, is characterized in that, the front of described fluorescent glue and side are crossing to be not less than the angle of 90 °.
9. a lighting device, is characterized in that, comprises the LED packaging body described in claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420051766.8U CN203746898U (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420051766.8U CN203746898U (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203746898U true CN203746898U (en) | 2014-07-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420051766.8U Expired - Fee Related CN203746898U (en) | 2014-01-26 | 2014-01-26 | LED packaging body and illumination equipment |
Country Status (1)
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| CN (1) | CN203746898U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855283A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED packaging body and illumination device |
| WO2016037466A1 (en) * | 2014-09-09 | 2016-03-17 | 厦门市三安光电科技有限公司 | Light emitting diode device and manufacturing method therefor |
| CN107611238A (en) * | 2017-08-21 | 2018-01-19 | 中山市立体光电科技有限公司 | A kind of LED core chip level packaging and preparation method thereof |
| CN110379911A (en) * | 2019-07-18 | 2019-10-25 | 深圳市协进光电有限公司 | A kind of high colour developing degree white light LEDs lamp bead |
-
2014
- 2014-01-26 CN CN201420051766.8U patent/CN203746898U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855283A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED packaging body and illumination device |
| WO2016037466A1 (en) * | 2014-09-09 | 2016-03-17 | 厦门市三安光电科技有限公司 | Light emitting diode device and manufacturing method therefor |
| CN107611238A (en) * | 2017-08-21 | 2018-01-19 | 中山市立体光电科技有限公司 | A kind of LED core chip level packaging and preparation method thereof |
| CN110379911A (en) * | 2019-07-18 | 2019-10-25 | 深圳市协进光电有限公司 | A kind of high colour developing degree white light LEDs lamp bead |
| CN110379911B (en) * | 2019-07-18 | 2022-04-15 | 深圳市协进光电有限公司 | High-color-rendering-degree white-light LED lamp bead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210108 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758, Luchaogang Road, Luchaogang Town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140730 Termination date: 20220126 |