CN110379911B - High-color-rendering-degree white-light LED lamp bead - Google Patents
High-color-rendering-degree white-light LED lamp bead Download PDFInfo
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- CN110379911B CN110379911B CN201910648730.5A CN201910648730A CN110379911B CN 110379911 B CN110379911 B CN 110379911B CN 201910648730 A CN201910648730 A CN 201910648730A CN 110379911 B CN110379911 B CN 110379911B
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- fluorescent glue
- diffusion
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- 239000011324 bead Substances 0.000 title abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 180
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 238000009792 diffusion process Methods 0.000 claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 claims abstract description 32
- 238000009877 rendering Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 240000005002 Erythronium dens canis Species 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 230000000638 stimulation Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 206010022998 Irritability Diseases 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a white light LED lamp bead with high color rendering, which relates to the technical field of LEDs, wherein a positive plate is fixedly arranged on the upper surface of a substrate, a negative plate is fixedly arranged on the substrate, the negative plate is arranged on the right side of the positive plate, a gap is arranged between the positive plate and the negative plate, fluorescent glue is uniformly wrapped on the positive plate and the negative plate, the side edges of the fluorescent glue are fixedly arranged on the upper surface of the substrate after being wrapped on the side edges of the positive plate and the negative plate, and the fluorescent glue is filled in the gap; the upper surface of the fluorescent glue is fixedly covered with diffusion glue, the upper surface of the diffusion glue is fixedly covered with packaging glue, and the side edge of the packaging glue is fixedly arranged on the upper surface of the substrate after being wrapped on the side edge of the fluorescent glue; it covers at the upside of fluorescent glue and is provided with the diffusion glue layer, after the luminous back of electrode stimulation fluorescent glue, carries out the diffusion effect once more to the light source that jets out, can guarantee that the lamp pearl sends the peaceful of light source when improving fluorescent glue inner fluorescent agent and accounting for the ratio.
Description
Technical Field
The invention relates to the technical field of LEDs (light-emitting diodes), in particular to a white-light LED lamp bead with high color rendering.
Background
The color rendering of the LED lamp beads is a standard for measuring the LED lamp beads, and the LED lamp beads with high color rendering can more truly reduce the color of an object when irradiating the object.
LED lamp pearl relies on positive negative pole and fluorescent glue ionization to give out light among the prior art, for the colour rendering of improving LED lamp pearl, can improve the fluorescent agent concentration in the fluorescent glue and account for the ratio, this makes the luminous of lamp pearl concentrate more, thereby make the light source that sends have irritability more, soft for guaranteeing the light source, and diffusion that can be wider, can sneak into the diffusant in addition in the fluorescent glue during production, but if add the luminance that too much diffusant can reduce the light source, and then reduce its colour rendering, need improve.
Disclosure of Invention
The invention aims to provide a white light LED lamp bead with high color rendering degree, which is reasonable in design and convenient to use, aiming at the defects and shortcomings of the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: the packaging structure comprises a substrate, a positive plate, a negative plate, fluorescent glue, diffusion glue and packaging glue, wherein the positive plate is fixedly arranged on the upper surface of the substrate, the negative plate is fixedly arranged on the substrate, the negative plate is arranged on the right side of the positive plate, a gap is formed between the positive plate and the negative plate, the fluorescent glue is uniformly wrapped on the positive plate and the negative plate, the side edges of the fluorescent glue are fixedly arranged on the upper surface of the substrate after being wrapped on the side edges of the positive plate and the negative plate, and the fluorescent glue is filled in the gap; the upper surface of fluorescent glue is covered fixedly and is provided with the diffusion glue, covers on the upper surface of diffusion glue and is provided with the encapsulation glue, and the side that the encapsulation was glued is wrapped up in and is established the back on the side of fluorescent glue, and the fixed setting is on the upper surface of base plate.
Further, the right side edge of positive plate fixed several positive post that is provided with, and the positive post wears to establish in the fluorescent glue that sets up in the gap, the left side edge of negative plate is fixed to be provided with several negative pole post, and the negative pole post wears to establish in the fluorescent glue that sets up in the gap, the positive post sets up with the crisscross dog tooth of negative pole post.
Furthermore, the fluorescent glue and the diffusion glue are fixedly clamped by insulating glue, and the side edge of the insulating glue is fixedly arranged on the lower surface of the packaging glue.
Further, encapsulation glue's top cover be provided with the filter cover, be provided with the annular on the upper surface of base plate, and the annular encircles and sets up in the border outside that the encapsulation was glued, the fixed rubber ring that is provided with on the side of filter cover, the rubber ring inlays to establish and fixes in the annular, plated on the medial surface of filter cover and prevents the blue light coating.
Furthermore, a threaded hole is formed in the lower surface of the base plate in a penetrating mode, a first heat-conducting column is arranged in the threaded hole in a rotating mode, and the length of the first heat-conducting column ranges from 5mm to 10 mm.
Furthermore, a heat conduction post substitute for No. two heat conduction posts, No. two heat conduction post screw threads are established in the screwed hole soon, and the lower surface of No. two heat conduction posts flushes the setting with the lower surface of base plate.
The production method comprises the following steps: respectively etching circuits on the positive plate and the negative plate, and respectively fixing the positive plate and the negative plate which are processed by the etching circuits on the substrate; taking epoxy resin as a substrate adhesive, adding fluorescent powder into the substrate adhesive, blending to prepare fluorescent adhesive, adding diffusion powder into the substrate adhesive, blending to prepare diffusion adhesive, and directly cooling the substrate adhesive to prepare packaging adhesive; dripping fluid fluorescent glue on the positive plate and the negative plate, enabling the probe to stir the fluorescent glue to enable the fluorescent glue to be completely filled in the gap, continuously adding the fluorescent glue to enable the fluorescent glue to completely cover the positive plate and the negative plate, stopping adding the fluorescent glue when the edge of the fluorescent glue is dripped on the substrate, and standing to enable the fluorescent glue to be cured and molded; dripping the diffusion glue on the fluorescent glue under the state that the basic shape of the fluorescent glue is stable and the fluorescent glue is not completely cured, wherein in the process, the edge of the diffusion glue is positioned on the upper surface of the fluorescent glue and is not contacted with the substrate, and standing to wait for the curing and forming of the diffusion glue; after the fluorescent glue and the diffusion glue are cured and molded, dropping the packaging glue on the upper layer of the diffusion glue, dropping the edge of the packaging glue on the substrate, matching the packaging glue with the substrate, completely sealing and packaging the fluorescent glue and the diffusion glue, standing for curing and molding the packaging glue, and completing production; at the moment, the substrate can be welded or glued on the external lamp body, and the lamp bead can be fixed.
After adopting the structure, the invention has the beneficial effects that: according to the high-color-rendering-degree white light LED lamp bead, the diffusion glue layer is covered on the upper side of the fluorescent glue, the emitted light source is diffused again after the fluorescent glue is stimulated by the electrode to emit light, the ratio of fluorescent agents in the fluorescent glue can be improved, and the light source emitted by the lamp bead is guaranteed to be gentle.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic cross-sectional structure of the present invention.
Fig. 3 is a schematic structural diagram of a second embodiment of the present invention.
Description of reference numerals:
the solar cell module comprises a substrate 1, a positive plate 2, a negative plate 3, a gap 4, fluorescent glue 5, diffusion glue 6, packaging glue 7, a positive post 8, a negative post 9, insulating glue 10, a filter cover 11, a ring groove 12, a rubber ring 13, a blue light prevention coating 14, a threaded hole 15, a first heat conduction post 16 and a second heat conduction post 17.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
The first embodiment is as follows:
as shown in fig. 1-2, the present embodiment includes a substrate 1, a positive plate 2, a negative plate 3, a fluorescent glue 5, a diffusion glue 6, and a packaging glue 7, wherein the positive plate 2 is welded on the upper surface of the substrate 1, the negative plate 3 is welded on the substrate 1, the negative plate 3 is disposed on the right side of the positive plate 2, a gap 4 is disposed between the positive plate 2 and the negative plate 3, the fluorescent glue 5 is integrally wrapped on both the positive plate 2 and the negative plate 3, the fluorescent glue 5 is hermetically adhered to the upper surface of the substrate 1 after the sides of the fluorescent glue 5 are wrapped on the sides of the positive plate 2 and the negative plate 3, and the fluorescent glue 5 is filled in the gap 4; cover on the upper surface of fluorescent glue 5 and firmly glue and be provided with diffusion glue 6, cover on the upper surface of diffusion glue 6 and be provided with encapsulation glue 7, the side of encapsulation glue 7 is wrapped up in and is established back on the side of fluorescent glue 5, seals to glue and establishes on the upper surface of base plate 1.
Furthermore, four positive posts 8 are welded on the right side edge of the positive plate 2, the positive posts 8 penetrate through the fluorescent glue 5 arranged in the gap 4, three negative posts 9 are welded on the left side edge of the negative plate 3, the negative posts 9 penetrate through the fluorescent glue 5 arranged in the gap 4, and the positive posts 8 and the negative posts 9 are arranged in a zigzag manner; the positive pole 8 is in conductive connection with the positive plate 2, the negative pole 9 is in conductive connection with the negative plate 3, the positive pole 8 and the negative pole 9 are matched with the fluorescent glue 5 filled between the positive pole and the negative pole to generate ionization, and the light can efficiently emit light.
Further, the fluorescent glue 5 and the diffusion glue 6 are fixedly clamped by the insulating glue 10, the side edge of the insulating glue 10 is integrally adhered to the lower surface of the packaging glue 7, the diffusion glue 6 and the fluorescent glue 5 can be isolated by the insulating glue 10, the positive plate 2 and the negative plate 3 are prevented from ionizing the diffusion glue 6, and the diffusion glue 6 can be ensured to diffuse the emitted light source only from the physical property.
Further, encapsulation glue 7's top cover be provided with filter cover 11, be provided with annular 12 on the upper surface of base plate 1, and annular 12 encircles the border outside that sets up at encapsulation glue 7, adhesive fixation has rubber ring 13 on filter cover 11's the side, rubber ring 13 is full of to be amalgamated to inlay and fixes in annular 12, blue light prevention coating 14 has been plated on filter cover 11's the medial surface, filter cover 11 adopts transparent epoxy to make, it can protect the encapsulating glue 7 of inlayer, and prevent the blue light filtering that blue light coating 14 can mix with in the high luminance light source that sends.
Furthermore, the lower surface of the base plate 1 is provided with a threaded hole 15, a heat conducting column 16 is screwed in the threaded hole 15, the length of the heat conducting column 16 is 5 mm-10 mm, when the lamp bead is installed, the base plate 1 is welded on an external lamp body, the heat conducting column 16 is inserted into the lamp body and is in contact with a heat conducting fin on the lamp body, and the heat radiating efficiency of the lamp bead can be improved.
The production method of the specific embodiment comprises the following steps: etching circuits on the positive plate 2 and the negative plate 3 respectively, and fixing the positive plate 2 and the negative plate 3 processed by etching circuits on the substrate 1 respectively; taking epoxy resin as substrate glue, adding fluorescent powder into the substrate glue, blending to prepare fluorescent glue 5, adding diffusion powder into the substrate glue, blending to prepare diffusion glue 6, and directly cooling the substrate glue to prepare packaging glue 7; dripping fluid fluorescent glue 5 on the positive plate 2 and the negative plate 3, shifting the fluorescent glue 5 by the probe to completely fill the gap 4, continuously adding the fluorescent glue 5 to completely cover the positive plate 2 and the negative plate 3 by the fluorescent glue 5, stopping adding the fluorescent glue 5 when the edge of the fluorescent glue 5 is dripped on the substrate 1, and standing to enable the fluorescent glue 5 to be cured and molded; in the state that the basic shape of the fluorescent glue 5 is stable and the fluorescent glue is not completely cured, the diffusion glue 6 is dripped on the fluorescent glue 5, the process is to be noticed that the edge of the diffusion glue 6 is positioned on the upper surface of the fluorescent glue 5 and is not contacted with the substrate 1, and the process is statically placed to wait for the curing and forming of the diffusion glue 6; after the fluorescent glue 5 and the diffusion glue 6 are cured and molded, dropping the packaging glue 7 on the upper layer of the diffusion glue 6, dropping the edge of the packaging glue 7 on the substrate 1, matching the packaging glue 7 with the substrate 1, completely sealing and wrapping the fluorescent glue 5 and the diffusion glue 6, standing for curing and molding of the packaging glue 7, and completing production; at this moment, can weld base plate 1 and establish or sticky on the outside lamp body, realize fixing the lamp pearl.
After adopting above-mentioned structure, this embodiment beneficial effect does: this embodiment a high colour rendering degree white light LED lamp pearl, its upside at the fluorescence glue covers and is provided with the diffusion glue layer, after the electrode amazing fluorescence glue is luminous, carries out the diffusion effect once more to the light source that jets out, can guarantee that the lamp pearl sends the peaceful of light source when improving fluorescence glue interior fluorescent agent and accounting for the ratio.
The second embodiment is as follows:
referring to fig. 3, the difference between the first embodiment and the first embodiment is that the first heat-conducting pillar 16 is replaced by a second heat-conducting pillar 17, the second heat-conducting pillar 17 is screwed in the threaded hole 15, the lower surface of the second heat-conducting pillar 17 is flush with the lower surface of the substrate 1, the second heat-conducting pillar 17 can fill the threaded hole 15, and the substrate 1 can contact with the surface of the lamp body to transfer heat through the second heat-conducting pillar 17 when the heat-conducting pillar is not required to be inserted into the lamp body.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (1)
1. The utility model provides a high colour rendering white light LED lamp pearl which characterized in that: the packaging structure comprises a substrate (1), a positive plate (2), a negative plate (3), fluorescent glue (5), diffusion glue (6) and packaging glue (7), wherein the positive plate (2) is fixedly arranged on the upper surface of the substrate (1), the negative plate (3) is fixedly arranged on the substrate (1), the negative plate (3) is arranged on the right side of the positive plate (2), a gap (4) is formed between the positive plate (2) and the negative plate (3), the fluorescent glue (5) is integrally wrapped on the positive plate (2) and the negative plate (3), the side edge of the fluorescent glue (5) is fixedly arranged on the upper surface of the substrate (1) after being wrapped on the side edge of the positive plate (2) and the side edge of the negative plate (3), and the fluorescent glue (5) is filled in the gap (4); the upper surface of the fluorescent glue (5) is fixedly covered with a diffusion glue (6), the upper surface of the diffusion glue (6) is covered with a packaging glue (7), and the side edge of the packaging glue (7) is fixedly arranged on the upper surface of the substrate (1) after being wrapped on the side edge of the fluorescent glue (5);
a plurality of positive posts (8) are fixedly arranged on the right side edge of the positive plate (2), the positive posts (8) are arranged in the fluorescent glue (5) arranged in the gap (4) in a penetrating manner, a plurality of negative posts (9) are fixedly arranged on the left side edge of the negative plate (3), the negative posts (9) are arranged in the fluorescent glue (5) arranged in the gap (4) in a penetrating manner, and the positive posts (8) and the negative posts (9) are arranged in a dog-tooth staggered manner;
an insulating glue (10) is fixedly clamped between the fluorescent glue (5) and the diffusion glue (6), and the side edge of the insulating glue (10) is fixedly arranged on the lower surface of the packaging glue (7);
a filter cover (11) is covered above the packaging adhesive (7), a ring groove (12) is formed in the upper surface of the substrate (1), the ring groove (12) is arranged on the outer side of the edge of the packaging adhesive (7) in a surrounding mode, a rubber ring (13) is fixedly arranged on the side edge of the filter cover (11), the rubber ring (13) is fixedly embedded in the ring groove (12), and a blue-light-proof coating (14) is plated on the inner side surface of the filter cover (11);
a threaded hole (15) is formed in the lower surface of the base plate (1), a first heat-conducting column (16) is screwed in the threaded hole (15), and the length of the first heat-conducting column (16) is 5-10 mm;
the first heat-conducting column (16) is replaced by a second heat-conducting column (17), the second heat-conducting column (17) is screwed in the threaded hole (15), and the lower surface of the second heat-conducting column (17) is flush with the lower surface of the substrate (1);
circuits are respectively etched on the positive plate (2) and the negative plate (3), and the positive plate (2) and the negative plate (3) which are processed by the etching circuits are respectively fixed on the substrate (1); taking epoxy resin as substrate glue, adding fluorescent powder into the substrate glue to be blended to prepare fluorescent glue (5), adding diffusion powder into the substrate glue to be blended to prepare diffusion glue (6), and directly cooling the substrate glue to prepare packaging glue (7); dripping fluid fluorescent glue (5) on the positive plate (2) and the negative plate (3), shifting the fluorescent glue (5) by the probe to completely fill the gap (4), continuously adding the fluorescent glue (5), completely covering the positive plate (2) and the negative plate (3) by the fluorescent glue (5), stopping adding the fluorescent glue (5) when the edge of the fluorescent glue (5) is dripped on the substrate (1), and statically placing to enable the fluorescent glue (5) to be cured and molded; dripping the diffusion glue (6) on the fluorescent glue (5) under the condition that the basic shape of the fluorescent glue (5) is stable and is not completely cured, wherein in the process, the edge of the diffusion glue (6) is positioned on the upper surface of the fluorescent glue (5) and is not contacted with the substrate (1), and standing to wait for the curing and forming of the diffusion glue (6); after the fluorescent glue (5) and the diffusion glue (6) are cured and molded, dripping the packaging glue (7) on the upper layer of the diffusion glue (6), dripping the edge of the packaging glue (7) on the substrate (1), matching the packaging glue (7) with the substrate (1), completely sealing and packaging the fluorescent glue (5) and the diffusion glue (6), standing for curing and molding of the packaging glue (7), and completing production; at this moment, weld base plate (1) and establish or sticky on the outside lamp body, realize fixing the lamp pearl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910648730.5A CN110379911B (en) | 2019-07-18 | 2019-07-18 | High-color-rendering-degree white-light LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910648730.5A CN110379911B (en) | 2019-07-18 | 2019-07-18 | High-color-rendering-degree white-light LED lamp bead |
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| Publication Number | Publication Date |
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| CN110379911A CN110379911A (en) | 2019-10-25 |
| CN110379911B true CN110379911B (en) | 2022-04-15 |
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| CN201910648730.5A Active CN110379911B (en) | 2019-07-18 | 2019-07-18 | High-color-rendering-degree white-light LED lamp bead |
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| CN207962198U (en) * | 2018-03-06 | 2018-10-12 | 东莞市伊伯光电科技有限公司 | A kind of novel flexible lamp bar |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5238366B2 (en) * | 2008-06-09 | 2013-07-17 | スタンレー電気株式会社 | Semiconductor light emitting device |
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2019
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|---|---|---|---|---|
| CN104205377A (en) * | 2012-08-31 | 2014-12-10 | 松下电器产业株式会社 | Light-emitting apparatus |
| CN103840057A (en) * | 2012-11-20 | 2014-06-04 | 展晶科技(深圳)有限公司 | Light-emitting diode and manufacturing method thereof |
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| CN203746898U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | LED packaging body and illumination equipment |
| CN205900592U (en) * | 2016-05-17 | 2017-01-18 | 深圳市卓翼科技股份有限公司 | LED wafer packaging hardware |
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| CN110379911A (en) | 2019-10-25 |
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