CN110379911A - A kind of high colour developing degree white light LEDs lamp bead - Google Patents
A kind of high colour developing degree white light LEDs lamp bead Download PDFInfo
- Publication number
- CN110379911A CN110379911A CN201910648730.5A CN201910648730A CN110379911A CN 110379911 A CN110379911 A CN 110379911A CN 201910648730 A CN201910648730 A CN 201910648730A CN 110379911 A CN110379911 A CN 110379911A
- Authority
- CN
- China
- Prior art keywords
- glue
- substrate
- fluorescent glue
- fluorescent
- packaging plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Abstract
A kind of high colour developing degree white light LEDs lamp bead, the present invention relates to LED technology fields, wherein positive plate is fixedly installed on the upper surface of substrate, negative plate is fixedly installed on substrate, and the right side side of positive plate is arranged in negative plate, setting has the gap between positive plate and negative plate, fluorescent glue is integrally wrapped on positive plate and negative plate, the side of fluorescent glue is wrapped up in be located on the side of positive plate and the side of negative plate after, be fixed on the upper surface of substrate, fluorescent glue, which is filled out, to be located in gap；Covering is fixedly installed diffusion glue on the upper surface of fluorescent glue, spreads on the upper surface of glue covering and is provided with packaging plastic and is fixed on the upper surface of substrate after the side of packaging plastic is wrapped up on the side for be located at fluorescent glue；It is provided with diffusion glue-line in the covering of the upside of fluorescent glue, after electrode stimulating fluorescent glue shines, is diffused effect again to the light source of injection, can guarantee that lamp bead issues the gentle of light source while improving fluorescer accounting in fluorescent glue.
Description
Technical field
The present invention relates to LED technology fields, and in particular to a kind of high colour developing degree white light LEDs lamp bead.
Background technique
The colour developing degree of LED lamp bead is a standard for measuring LED lamp bead, and the high LED lamp bead of colour developing degree can be in irradiation object
The color of object is more truly restored when body.
LED lamp bead shines by positive and negative anodes and fluorescent glue ionization in the prior art, for the colour developing degree for improving LED lamp bead, meeting
The fluorescer concentration accounting in fluorescent glue is improved, this concentrates the luminous of lamp bead more, so that the light source issued is more
With irritation, to guarantee that light source is soft, and wider array of can spread, when production, can separately be mixed into diffusant in fluorescent glue, but
If being excessive diffusant to be added to reduce the brightness of light source, and then reduce its colour developing degree, need to improve.
Summary of the invention
In view of the defects and deficiencies of the prior art, the present invention intends to provide a kind of design is reasonable, easy to use
High colour developing degree white light LEDs lamp bead, in the upside of fluorescent glue, covering is provided with diffusion glue-line, shines in electrode stimulating fluorescent glue
Afterwards, effect is diffused to the light source of injection again, can guarantee that lamp bead issues while improving fluorescer accounting in fluorescent glue
Light source it is gentle.
To achieve the above object, the technical solution adopted by the present invention is that: it include substrate, positive plate, negative plate, fluorescence
Glue, diffusion glue, packaging plastic, are wherein fixedly installed positive plate, negative plate are fixedly installed on substrate on the upper surface of substrate, and
The right side side of positive plate is arranged in negative plate, and setting has the gap between positive plate and negative plate, uniform on positive plate and negative plate
Body is wrapped with fluorescent glue, the side of fluorescent glue is wrapped up in be located on the side of positive plate and the side of negative plate after, be fixed at base
On the upper surface of plate, fluorescent glue, which is filled out, to be located in gap；Covering is fixedly installed diffusion glue on the upper surface of fluorescent glue, spreads glue
Covering is provided with packaging plastic and is fixed at substrate after the side of packaging plastic is wrapped up on the side for be located at fluorescent glue on upper surface
On upper surface.
Further, several positive terminals are fixedly installed in the right edge of the positive plate, and positive terminal is threaded through and sets
It is placed in the fluorescent glue in gap, several negative terminals is fixedly installed on the left side of negative plate, and negative terminal is threaded through setting
In in the fluorescent glue in gap, positive terminal and negative terminal interlocking are arranged.
Further, sandwiched is fixed with insulating cement between the fluorescent glue and diffusion glue, and the side of insulating cement is fixed
It is arranged on the lower surface of packaging plastic.
Further, the top covering of the packaging plastic is provided with shade, is provided with annular groove on the upper surface of substrate,
And annular groove is circumferentially positioned on the outside of the edge of packaging plastic, is fixedly installed cushion rubber on the side of shade, cushion rubber is embedded in
In annular groove, anti-blue light coating is coated on the medial surface of shade.
Further, threaded hole has been penetrated on the lower surface of the substrate, it is thermally conductive that threaded hole internal screw thread is installed with No.1
Column, the length of No.1 heating column is between 5mm~10mm.
Further, the No.1 heating column replaces with No. two heating columns, and No. two thermally conductive male screw rotations are located at threaded hole
It is interior, and the lower surface of No. two heating columns flushes setting with the lower surface of substrate.
Production method of the invention are as follows: distinguish etched circuit on positive plate and on negative plate, etched circuit is processed
At positive plate and negative plate be separately fixed on substrate；Using epoxy resin as substrate glue, fluorescent powder tune is added in substrate glue
With fluorescent glue is made, spread powder reconciliation is added in substrate glue and is made diffusion glue, packaging plastic is made in the directly cooling of substrate glue；It will stream
Body shape fluorescent glue drips on positive plate and negative plate, and probe is made to stir fluorescent glue, is filled up completely it into gap, continues
Fluorescent glue is added, so that positive plate and negative plate are completely covered fluorescent glue, until stopping when fluorescent glue edge drops on substrate
The addition of fluorescent glue, it is quiet at this time to put so that fluorescent glue curing molding；Stablize in fluorescent glue base shape, and the shape not being fully cured
Under state, will diffusion glue drop on fluorescent glue, this process should be noted that diffusion glue edge be located on the upper surface of fluorescent glue not with base
Plate contact, it is quiet to put waiting diffusion adhesive curing molding；After fluorescent glue and the diffusion equal curing molding of glue, packaging plastic is dropped in diffusion
The upper layer of glue, and the edge of packaging plastic is dropped on substrate, so that packaging plastic and substrate cooperate, by fluorescent glue and diffusion glue
Package is fully sealed, quiet put waits packaging plastic curing molding, and production is completed；Outside is set or is adhesive at this point, substrate can be welded
On lamp body, lamp bead is fixed in realization.
After adopting the above structure, the invention has the following beneficial effects: a kind of high colour developing degree white light LEDs lamp bead of the present invention,
It is provided with diffusion glue-line in the covering of the upside of fluorescent glue, after electrode stimulating fluorescent glue shines, to the light source of injection again into
Row diffusion can guarantee that lamp bead issues the gentle of light source, the present invention has while improving fluorescer accounting in fluorescent glue
The advantages that structure is simple, and setting is reasonable, low manufacture cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is structural schematic diagram of the invention.
Fig. 2 is cross section structure schematic diagram of the invention.
Fig. 3 is the structural schematic diagram of specific embodiment two in the present invention.
Description of symbols:
Substrate 1, positive plate 2, negative plate 3, gap 4, fluorescent glue 5, diffusion glue 6, packaging plastic 7, positive terminal 8, negative terminal 9, insulation
16, No. two glue 10, shade 11, annular groove 12, cushion rubber 13, anti-blue light coating 14, threaded hole 15, No.1 heating column heating columns 17.
Specific embodiment
The present invention will be further described below with reference to the drawings.
Specific embodiment 1:
Referring to as Figure 1-Figure 2, present embodiment includes substrate 1, positive plate 2, negative plate 3, fluorescent glue 5, diffusion glue
6, packaging plastic 7, wherein weldering is equipped with positive plate 2 on the upper surface of substrate 1, and weldering is equipped with negative plate 3 on substrate 1, and negative plate 3 is arranged
In the right side side of positive plate 2, setting has the gap 4 between positive plate 2 and negative plate 3, integrally wraps up on positive plate 2 and negative plate 3
Equipped with fluorescent glue 5, after the side of fluorescent glue 5 is wrapped up on the side for being located at positive plate 2 and the side of negative plate 3, sealing sticks in base
On the upper surface of plate 1, fluorescent glue 5, which is filled out, to be located in gap 4；Covering, which adheres, on the upper surface of fluorescent glue 5 is provided with diffusion glue 6, expands
It dissipates covering on the upper surface of glue 6 and is provided with packaging plastic 7, after the side of packaging plastic 7 is wrapped up on the side for being located at fluorescent glue 5, sealing is viscous
If on the top surface of the substrate 1.
Further, positive terminal 8 there are four setting is welded in the right edge of the positive plate 2, and positive terminal 8 is threaded through setting
In in the fluorescent glue 5 in gap 4, weldering sets that there are three negative terminals 9 on the left side of negative plate 3, and negative terminal 9 is threaded through and is set to
In fluorescent glue 5 in gap 4, positive terminal 8 and the indenting setting of negative terminal 9；Positive terminal 8 and positive plate 2 are conductively connected, cathode
Column 9 and negative electrode tab 3 are conductively connected, and positive terminal 8 and negative terminal 9 cooperate the fluorescent glue 5 filled out and set between them to generate ionization, Neng Gougao
Shine to effect.
Further, sandwiched is fixed with insulating cement 10, and the side of insulating cement 10 between the fluorescent glue 5 and diffusion glue 6
Side integrally sticks on the lower surface of packaging plastic 7, and diffusion glue 6 can be isolated with fluorescent glue 5 for insulating cement 10, avoid positive plate 2 and
3 pairs of diffusion glue 6 of negative electrode tab generate ionization, it is ensured that diffusion glue 6 only generates diffusion to the light source of sending from physical property.
Further, the top covering of the packaging plastic 7 is provided with shade 11, is provided on the upper surface of substrate 1
Annular groove 12, and annular groove 12 is circumferentially positioned on the outside of the edge of packaging plastic 7, the side gluing of shade 11 is viscous to be fixed with cushion rubber 13,
Cushion rubber 13 is full of conjunction and is embedded in annular groove 12, and anti-blue light coating 14 is coated on the medial surface of shade 11, and shade 11 uses
Transparent epoxy resin is made, and can protect the packaging plastic 7 of internal layer, and anti-blue light coating 14 can be by the higher source luminance of sending
In the blue light that is mingled with filter out.
Further, threaded hole 15 has been penetrated on the lower surface of the substrate 1,15 internal screw thread of threaded hole is installed with No.1
Heating column 16, the length of No.1 heating column 16 is between 5mm~10mm, and when installing lamp bead, substrate 1 is welded in external modulation
On body, and No.1 heating column 16 is plugged in lamp body, and is contacted with the thermally conductive sheet on lamp body, the heat dissipation effect of lamp bead can be accelerated
Rate.
The production method of present embodiment are as follows: distinguish etched circuit on positive plate 2 and on negative plate 3, will etch
The positive plate 2 and negative plate 3 that circuit fabrication is completed are separately fixed on substrate 1；Using epoxy resin as substrate glue, in substrate glue
Fluorescent glue 5 is made in addition fluorescent powder reconciliation, spread powder reconciliation is added in substrate glue, diffusion glue 6 is made, substrate glue is directly cooling
Packaging plastic 7 is made；By the drop of flow-like fluorescent glue 5 on positive plate 2 and negative plate 3, and probe is made to stir fluorescent glue 5, makes it
It is filled up completely into gap 4, continues to add fluorescent glue 5, so that positive plate 2 and negative plate 3 are completely covered fluorescent glue 5, until glimmering
Stop the addition of fluorescent glue 5 when 5 edge of optical cement drops on substrate 1, it is quiet at this time to put so that 5 curing molding of fluorescent glue；In fluorescence
5 base shape of glue is stablized, and in the state of not being fully cured, will the diffusion drop of glue 6 on fluorescent glue 5, this process should be noted that diffusion
The edge of glue 6 is located on the upper surface of fluorescent glue 5 not to be contacted with substrate 1, quiet to put waiting diffusion 6 curing molding of glue；To fluorescent glue 5
And after the diffusion equal curing molding of glue 6, packaging plastic 7 is dropped in the upper layer of diffusion glue 6, and the edge of packaging plastic 7 is dropped to
On substrate 1, so that packaging plastic 7 and substrate 1 cooperate, package is fully sealed in fluorescent glue 5 and diffusion glue 6, quiet put waits packaging plastic 7
Curing molding, production are completed；It sets or is adhesive on external lamp body at this point, substrate 1 can be welded, lamp bead is fixed in realization.
After adopting the above structure, present embodiment has the beneficial effect that a kind of high aobvious described in present embodiment
Coloration white light LEDs lamp bead, in the upside of fluorescent glue, covering is provided with diffusion glue-line, right after electrode stimulating fluorescent glue shines
The light source of injection is diffused effect again, can guarantee that lamp bead issues light source while improving fluorescer accounting in fluorescent glue
It is gentle.
Specific embodiment 2:
Referring to as shown in figure 3, present embodiment and specific embodiment one the difference is that, the No.1 is thermally conductive
Column 16 replaces with No. two heating columns 17, and No. two 17 screw thread of heating column rotations are located in threaded hole 15, and the following table of No. two heating columns 17
Face flushes setting with the lower surface of substrate 1, and No. two heating columns 17 can fill and lead up threaded hole 15, without being inserted into heating column to lamp body
When interior, substrate 1 can pass through No. two heating columns 17 and light body surface transmission of heat by contact, remaining structure of present embodiment, production
Method, making material and specific embodiment one are all the same.
The above is only used to illustrate the technical scheme of the present invention and not to limit it, and those of ordinary skill in the art are to this hair
The other modifications or equivalent replacement that bright technical solution is made, as long as it does not depart from the spirit and scope of the technical scheme of the present invention,
It is intended to be within the scope of the claims of the invention.
Claims (7)
1. a kind of high colour developing degree white light LEDs lamp bead, it is characterised in that: it includes substrate (1), positive plate (2), negative plate (3), glimmering
Optical cement (5), diffusion glue (6), packaging plastic (7), are wherein fixedly installed positive plate (2) on the upper surface of substrate (1), substrate (1)
On be fixedly installed negative plate (3), and negative plate (3) setting is in the right side side of positive plate (2), positive plate (2) and negative plate (3)
Between be arranged and have the gap (4), be integrally wrapped with fluorescent glue (5) on positive plate (2) and negative plate (3), the side of fluorescent glue (5)
After wrapping up on the side for being located at positive plate (2) and the side of negative plate (3), it is fixed on the upper surface of substrate (1), fluorescent glue
(5) it fills out and is located in gap (4)；Covering is fixedly installed diffusion glue (6) on the upper surface of fluorescent glue (5), spreads the upper table of glue (6)
Covering is provided with packaging plastic (7) on face, after the side of packaging plastic (7) is wrapped up on the side for being located at fluorescent glue (5), is fixed at base
On the upper surface of plate (1).
2. a kind of high colour developing degree white light LEDs lamp bead according to claim 1, it is characterised in that: the positive plate (2)
It is fixedly installed in right edge several positive terminals (8), and positive terminal (8) is threaded through the fluorescent glue (5) being set in gap (4)
It is interior, it is fixedly installed on the left side of negative plate (3) several negative terminals (9), and negative terminal (9) is threaded through and is set to gap (4)
In interior fluorescent glue (5), positive terminal (8) and negative terminal (9) indenting setting.
3. a kind of high colour developing degree white light LEDs lamp bead according to claim 1, it is characterised in that: the fluorescent glue (5) with
Sandwiched is fixed with insulating cement (10) between diffusion glue (6), and the side of insulating cement (10) is fixed at the following table of packaging plastic (7)
On face.
4. a kind of high colour developing degree white light LEDs lamp bead according to claim 1, it is characterised in that: the packaging plastic (7)
Top covering is provided with shade (11), is provided on the upper surface of substrate (1) annular groove (12), and annular groove (12) is circumferentially positioned at
On the outside of the edge of packaging plastic (7), it is fixedly installed cushion rubber (13) on the side of shade (11), cushion rubber (13) is embedded in ring
In slot (12), anti-blue light coating (14) are coated on the medial surface of shade (11).
5. a kind of high colour developing degree white light LEDs lamp bead according to claim 1, it is characterised in that: under the substrate (1)
It has been penetrated on surface threaded hole (15), threaded hole (15) internal screw thread is installed with No.1 heating column (16), No.1 heating column (16)
Length is between 5mm~10mm.
6. a kind of high colour developing degree white light LEDs lamp bead according to claim 5, it is characterised in that: the No.1 heating column
(16) No. two heating columns (17) are replaced with, No. two heating column (17) screw thread rotations are located in threaded hole (15), and No. two heating columns
(17) lower surface flushes setting with the lower surface of substrate (1).
7. a kind of high colour developing degree white light LEDs lamp bead according to claim 1, it is characterised in that: its production method are as follows:
Etched circuit, the positive plate that etched circuit is completed the process (2) and negative plate (3) are distinguished on positive plate (2) and on negative plate (3)
It is separately fixed on substrate (1)；Using epoxy resin as substrate glue, fluorescent powder reconciliation is added in substrate glue, fluorescent glue (5) is made,
Spread powder reconciliation being added in substrate glue, diffusion glue (6) being made, packaging plastic (7) are made in the directly cooling of substrate glue；Flow-like is glimmering
Optical cement (5) drips on positive plate (2) and negative plate (3), and probe is made to stir fluorescent glue (5), is filled up completely it into gap
(4) in, continue to add fluorescent glue (5), so that positive plate (2) and negative plate (3) are completely covered fluorescent glue (5), until fluorescent glue
(5) stop the addition of fluorescent glue (5) when edge drops on substrate (1), it is quiet at this time to put so that fluorescent glue (5) curing molding；?
Fluorescent glue (5) base shape is stablized, and in the state of not being fully cured, will diffusion glue (6) drop on fluorescent glue (5), this process
It is not contacted with substrate (1) it should be noted that the edge of diffusion glue (6) is located on the upper surface of fluorescent glue (5), it is quiet to put waiting diffusion glue (6)
Curing molding；After fluorescent glue (5) and diffusion glue (6) curing molding, packaging plastic (7) is dropped in the upper layer of diffusion glue (6),
And the edge of packaging plastic (7) is dropped on substrate (1) so that packaging plastic (7) and substrate (1) cooperate, by fluorescent glue (5) and
Package is fully sealed in diffusion glue (6), and quiet put waits packaging plastic (7) curing molding, and production is completed；It is set at this point, substrate (1) can be welded
Or be adhesive on external lamp body, lamp bead is fixed in realization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910648730.5A CN110379911B (en) | 2019-07-18 | 2019-07-18 | High-color-rendering-degree white-light LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910648730.5A CN110379911B (en) | 2019-07-18 | 2019-07-18 | High-color-rendering-degree white-light LED lamp bead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110379911A true CN110379911A (en) | 2019-10-25 |
| CN110379911B CN110379911B (en) | 2022-04-15 |
Family
ID=68253805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910648730.5A Active CN110379911B (en) | 2019-07-18 | 2019-07-18 | High-color-rendering-degree white-light LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110379911B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090302342A1 (en) * | 2008-06-09 | 2009-12-10 | Kondo Ryosuke | Semiconductor Light-Emitting Device and Manufacturing Method |
| CN103560202A (en) * | 2013-11-08 | 2014-02-05 | 厦门厦荣达电子有限公司 | White light LED lamp and manufacturing method thereof |
| CN103840057A (en) * | 2012-11-20 | 2014-06-04 | 展晶科技(深圳)有限公司 | Light-emitting diode and manufacturing method thereof |
| CN103855279A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED packaging method |
| CN203746898U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | LED packaging body and illumination equipment |
| CN104205377A (en) * | 2012-08-31 | 2014-12-10 | 松下电器产业株式会社 | Light-emitting apparatus |
| CN205900592U (en) * | 2016-05-17 | 2017-01-18 | 深圳市卓翼科技股份有限公司 | LED wafer packaging hardware |
| CN106531857A (en) * | 2016-12-28 | 2017-03-22 | 芜湖聚飞光电科技有限公司 | Chip scale LED packaging structure and packaging technology |
| CN207422021U (en) * | 2017-10-26 | 2018-05-29 | 湖北协进半导体科技有限公司 | A kind of large area light emitting LED light |
| CN207962198U (en) * | 2018-03-06 | 2018-10-12 | 东莞市伊伯光电科技有限公司 | A kind of novel flexible lamp bar |
-
2019
- 2019-07-18 CN CN201910648730.5A patent/CN110379911B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090302342A1 (en) * | 2008-06-09 | 2009-12-10 | Kondo Ryosuke | Semiconductor Light-Emitting Device and Manufacturing Method |
| CN104205377A (en) * | 2012-08-31 | 2014-12-10 | 松下电器产业株式会社 | Light-emitting apparatus |
| CN103840057A (en) * | 2012-11-20 | 2014-06-04 | 展晶科技(深圳)有限公司 | Light-emitting diode and manufacturing method thereof |
| CN103560202A (en) * | 2013-11-08 | 2014-02-05 | 厦门厦荣达电子有限公司 | White light LED lamp and manufacturing method thereof |
| CN103855279A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | LED packaging method |
| CN203746898U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | LED packaging body and illumination equipment |
| CN205900592U (en) * | 2016-05-17 | 2017-01-18 | 深圳市卓翼科技股份有限公司 | LED wafer packaging hardware |
| CN106531857A (en) * | 2016-12-28 | 2017-03-22 | 芜湖聚飞光电科技有限公司 | Chip scale LED packaging structure and packaging technology |
| CN207422021U (en) * | 2017-10-26 | 2018-05-29 | 湖北协进半导体科技有限公司 | A kind of large area light emitting LED light |
| CN207962198U (en) * | 2018-03-06 | 2018-10-12 | 东莞市伊伯光电科技有限公司 | A kind of novel flexible lamp bar |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110379911B (en) | 2022-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107093659B (en) | Flexible surface light source and its manufacturing method and electronic equipment | |
| US20180315902A1 (en) | Efficient led intelligent light source | |
| CN103840071B (en) | A kind of LED lamp bar manufacture method and LED lamp bar | |
| WO2007077869A1 (en) | Thin-type light emitting diode lamp, and its manufacturing | |
| US20130170174A1 (en) | Multi-cavities light emitting device | |
| CN102148296A (en) | LED (Light Emitting Diode) manufacturing method and LED device | |
| TWM407494U (en) | LED package structure | |
| WO2009140829A1 (en) | A led lighting device with low attenuation and high luminous efficiency and manufacturing method thereof | |
| CN105633248B (en) | LED lamp and preparation method thereof | |
| JP2007220737A (en) | Light emitting device | |
| WO2019148934A1 (en) | Lighting fixture, in-line led bead, and manufacturing method | |
| CN110379911A (en) | A kind of high colour developing degree white light LEDs lamp bead | |
| CN208422911U (en) | A kind of LED component | |
| CN204966535U (en) | Take area source of lens | |
| CN103423673A (en) | Full spectrum LED light source module for LCD backlight | |
| CN102322572A (en) | High-power LED (light-emitting diode) lamp packaged with ceramics | |
| CN202216200U (en) | Ceramic packaged high-power LED lamp | |
| JP2003077318A (en) | Led lamp | |
| KR20180003956A (en) | LED Package type of exposure | |
| CN105336835A (en) | LED packaging structure and packaging method thereof | |
| CN205428917U (en) | LED PACKER MODULE and have this LED PACKER MODULE's straight following formula LED lamp strip | |
| KR20100114181A (en) | Light emitting diode pakage and method for manufacturing the same | |
| CN106653769A (en) | White-light LED display and fabrication method thereof | |
| CN209169183U (en) | A kind of LED lamp | |
| CN102270729A (en) | White-light LED (light emitting diode) package structure and package method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |