CN103855259B - LED encapsulation method - Google Patents
LED encapsulation method Download PDFInfo
- Publication number
- CN103855259B CN103855259B CN201410038645.4A CN201410038645A CN103855259B CN 103855259 B CN103855259 B CN 103855259B CN 201410038645 A CN201410038645 A CN 201410038645A CN 103855259 B CN103855259 B CN 103855259B
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- China
- Prior art keywords
- fluorescent glue
- depression
- chip
- crystal chip
- overlay crystal
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005538 encapsulation Methods 0.000 title claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 62
- 239000013078 crystal Substances 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 12
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000002386 leaching Methods 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims 5
- 239000000463 material Substances 0.000 abstract description 12
- 239000011521 glass Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 229910001128 Sn alloy Inorganic materials 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 8
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920005479 Lucite® Polymers 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention is applied to LED and manufactures field there is provided a kind of LED encapsulation method, including：Make transparent enclosure film or transparent glass sheet with array depression；Fluorescent glue is filled into depression, the fluorescent glue amount of each depression filling is depression volume and the difference of the volume of overlay crystal chip to be packaged；Overlay crystal chip is fixed in fluorescent glue, makes the bottom electrode of overlay crystal chip exposed, array-type LED case chip is formed；Array-type LED case chip is divided into multiple LED encapsulation monomers.The present invention is packaged on transparent enclosure film or transparent glass sheet to overlay crystal chip, and packaging body is only made up of overlay crystal chip, fluorescent glue, transparent enclosure glue, and reliability is high, saving material, cost, low, production capacity is high；Without the limitation of support shape, encapsulated beneficial to large-scale integrated；Fluorescent glue need not be separated, processing procedure has been saved；Scattering-in equal loss of the photon between fluorescent material can be reduced, beneficial to lifting product brightness；Chip both positive and negative polarity is cost-effective without gold-plated tin alloy layers.
Description
Technical field
The present invention relates to LED product manufacturing technology field, more particularly to a kind of LED encapsulation method.
Background technology
The packaged type of conventional white light LED product is to consolidate LED wafer by way of die bond glue sticking or eutectic welding
It is scheduled in the bowl on support, the positive pole of chip is connected to the positive pole of support using gold thread, the negative pole of chip is connected to branch
The negative pole of frame, then filling meets the fluorescent glue in aim colour area into bowl.Due to support, fluorescent glue, the glue for being bonded chip
The thermal coefficient of expansion of body is different, easily integrity problem occurs in terms of support, fluorescent glue, gold thread, colloid；And LED support
Species is various, and the material of bonding chip and support both positive and negative polarity is generally PPA, PCT and EMC materials, its heat-resisting quantity, air-tightness has
Larger defect, and then influence the reliability of LED product.Although ceramics bracket has preferable heat-resisting quantity and preferably airtight
Property, but support cost takes costliness close to chip cost, and ceramics bracket encapsulation LED systems, and equipment investment is big, causes ceramics bracket
LED product production capacity is small, and price is high.Therefore, the LED product of support encapsulated structure is in reliability, service life, manufacturing cost and valency
Defect in terms of lattice is the larger obstruction that LED product substitutes traditional lighting products.
The content of the invention
It is an object of the invention to provide a kind of LED encapsulation method, it is intended to improves the reliability of LED product, it is ensured that its compared with
Long service life, while reducing cost, improves production capacity.
The present invention is achieved in that LED encapsulation method, comprises the steps：
Make the transparent enclosure film for the depression arranged with array；
Fluorescent glue is filled into the depression and forms independent fluorescent adhesive layer to omit the process for separating the fluorescent glue, often
The fluorescent glue amount of individual depression filling for depression volume and overlay crystal chip to be packaged volume difference；
The overlay crystal chip is fixed in the fluorescent glue, and makes the bottom electrode of the overlay crystal chip exposed, other
Face is immersed in the fluorescent glue, forms full wafer array-type LED case chip；
The array-type LED case chip is divided into multiple LED encapsulation monomers, wherein, each LED encapsulation monomer bag
An overlay crystal chip is included, the fluorescent glue is coated with the periphery of the overlay crystal chip, in being externally provided with for the fluorescent glue
The transparent enclosure film, the transparent enclosure film is surrounded on above the fluorescent glue and side entirely.
It is of the invention with conventionally employed support encapsulate method compared with, have the following advantages that：
Firstth, the LED encapsulation monomers that this method makes only are made up of overlay crystal chip 2, fluorescent glue 3, transparent enclosure glue 1, are saved
The materials such as support, gold thread, and overlay crystal chip 2, fluorescent glue 3 and the equal stabilizer pole of the performance of transparent enclosure glue 1 are removed, reliability is far above branch
The encapsulation mode of frame and gold thread, and then avoid because product reliability is asked caused by support is different with the thermal coefficient of expansion of colloid
Topic, it is ensured that the service life of its overlength, and great amount of cost can be saved, improve production capacity；
Secondth, it is easy to operate without separately setting encapsulation work platform using transparent enclosure glue or clear glass as operation base material；
Depression 11 is directly opened up on transparent enclosure glue 1 or lucite, fluorescent glue 3 is filled into depression 11, directly forms independent
Fluorescent adhesive layer, with being coated above chip compared with fluorescent glue carries out separating the mode of fluorescent glue again, eliminate separation fluorescent glue
Process, significantly simplify manufacturing process；
3rd, encapsulation process is carried out directly on transparent enclosure film or clear glass, easy to operate, with using point gum machine to
Method for dispensing glue is compared one by one in bowl, and utilization of materials is high, reduces packaging cost；
4th, the limitation without support shape, encapsulation process is simpler, is encapsulated beneficial to the large-scale integrated of LED product, profit
Reduced in the cost of packaging；
5th, due to not using bowl to encapsulate, scattering-in equal loss of the photon between fluorescent material is substantially reduce the number, is beneficial to
Lift the brightness of product；
6th, due to not using rack bearing chip, overlay crystal chip bottom both positive and negative polarity is without (3 μm expensive of certain thickness
Left and right) gold-tin alloy layer (conventional method need bottom of wafer set gold-tin alloy layer be welded on support), significantly save
Cost.
Brief description of the drawings
Fig. 1 is the LED encapsulation method flow chart that first embodiment of the invention is provided；
Fig. 2 a are the encapsulating structure schematic diagrames (one) corresponding with LED encapsulation method；
Fig. 2 b are the encapsulating structure schematic diagrames (two) corresponding with LED encapsulation method；
Fig. 2 c are the encapsulating structure schematic diagrames (three) corresponding with LED encapsulation method；
Fig. 2 d are the encapsulating structure schematic diagrames (four) corresponding with LED encapsulation method；
Fig. 2 e are the encapsulating structure schematic diagrames (five) corresponding with LED encapsulation method；
Fig. 2 f are the enlarged drawings of a-quadrant in Fig. 2 e；
Fig. 2 g are the encapsulating structure schematic diagrames (six) corresponding with LED encapsulation method；
Fig. 2 h are the encapsulating structure schematic diagrames (seven) corresponding with LED encapsulation method；
Fig. 2 i are the encapsulating structure schematic diagrames (eight) corresponding with LED encapsulation method；
Fig. 2 j are the structural representations (one) that the LED obtained by LED encapsulation method encapsulates monomer；
Fig. 2 k are the structural representations (two) that the LED obtained by LED encapsulation method encapsulates monomer.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Fig. 1 shows the flow chart of LED encapsulation method provided in an embodiment of the present invention, and Fig. 2 a~2i is shown and this method
Corresponding product encapsulating structure figure, for convenience of description, illustrate only part related to the present embodiment.
With reference to Fig. 1, LED encapsulation method provided in an embodiment of the present invention comprises the steps：
Step S101, makes the transparent enclosure film 1 or transparent glass sheet for the depression 11 arranged with array；
In the present embodiment, the transparent enclosure film 1 or transparent glass sheet are encapsulated as the outermost layer of encapsulation LED wafer ties
Structure, depression 11 is then used to fill fluorescent glue and places LED overlay crystal chips 2, and the shape of depression 11 is kissed with the shape of overlay crystal chip 2
Close, the back side of the transparent enclosure film 1 or transparent glass sheet is burnishing surface or lens array, wherein lens 12 with depression 11 one by one
Correspondence, such as Fig. 2 a and 2b.
Step S102, fluorescent glue is filled into depression, and the fluorescent glue amount of each depression filling is sealed for the volume of depression with waiting
The difference of the volume of the overlay crystal chip of dress；Such as Fig. 2 c and 2d；
Step S103, overlay crystal chip is fixed in fluorescent glue, and makes the bottom electrode of overlay crystal chip exposed, the leaching of other faces
Enter in the fluorescent glue, form full wafer array-type LED case chip；Such as Fig. 2 e, 2f, 2g；
By the accurate control to fluorescent glue amount, the bottom electrode 21 of overlay crystal chip 2 can be made exposed, other five surfaces are equal
Immerse in fluorescent glue 3.Furthermore it is possible to rationally set the depth of depression 11, make the thickness of the fluorescent glue 3 directly over overlay crystal chip 2
For 30~500 μm.
Step S104, is divided into multiple LED to encapsulate monomer array-type LED case chip；Such as Fig. 2 h and Fig. 2 i.
By step S101~S104, the LED encapsulation monomers shown in Fig. 2 j or Fig. 2 k can be obtained, each LED encapsulates monomer
Including an overlay crystal chip 2, fluorescent glue 3 is coated with the periphery of the overlay crystal chip 2, transparent enclosure is externally provided with fluorescent glue 3
Glue 1, the bottom electrode 21 of overlay crystal chip 2 is exposed, for the electrode welding with application end.
Further, anti-welding glue can also be filled between the positive and negative electrode of the bottom of overlay crystal chip 2, to prevent application end from welding
Electric pole short circuit when connecing.
It is of the invention with conventionally employed support encapsulate method compared with, have the following advantages that：
Firstth, the LED encapsulation monomers that this method makes only are made up of overlay crystal chip 2, fluorescent glue 3, transparent enclosure glue 1, are saved
The materials such as support, gold thread, and overlay crystal chip 2, fluorescent glue 3 and the equal stabilizer pole of the performance of transparent enclosure glue 1 are removed, reliability is far above branch
The encapsulation mode of frame and gold thread, and then avoid because product reliability is asked caused by support is different with the thermal coefficient of expansion of colloid
Topic, it is ensured that the service life of its overlength, and great amount of cost can be saved, improve production capacity；
Secondth, it is easy to operate without separately setting encapsulation work platform using transparent enclosure glue or clear glass as operation base material；
Depression 11 is directly opened up on transparent enclosure glue 1 or clear glass, fluorescent glue 3 is filled into depression 11, directly forms independent
Fluorescent adhesive layer, with being coated above chip compared with fluorescent glue carries out separating the mode of fluorescent glue again, eliminate separation fluorescent glue
Process, significantly simplify manufacturing process；
3rd, encapsulation process is carried out directly on transparent enclosure film or clear glass, easy to operate, with using point gum machine to
Method for dispensing glue is compared one by one in bowl, and utilization of materials is high, reduces packaging cost；
4th, the limitation without support shape, encapsulation process is simpler, is encapsulated beneficial to the large-scale integrated of LED product, profit
Reduced in the cost of packaging；
5th, due to not using bowl to encapsulate, scattering-in equal loss of the photon between fluorescent material is substantially reduce the number, is beneficial to
Lift the brightness of product；
6th, due to not using rack bearing chip, overlay crystal chip bottom both positive and negative polarity is without (3 μm expensive of certain thickness
Left and right) gold-tin alloy layer (conventional method need bottom of wafer set gold-tin alloy layer be welded on support), significantly save
Cost.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (5)
- The method for packing of 1.LED chips, it is characterised in that comprise the steps：Make the transparent enclosure film for the depression arranged with array；Fluorescent glue is filled into the depression and directly forms independent fluorescent adhesive layer to omit the process for separating the fluorescent glue, often The fluorescent glue amount of individual depression filling for depression volume and overlay crystal chip to be packaged volume difference；The overlay crystal chip is fixed in the fluorescent glue, and makes the bottom electrode of the overlay crystal chip exposed, the leaching of other faces Enter in the fluorescent glue, form full wafer array-type LED case chip；The array-type LED case chip is divided into multiple LED encapsulation monomers, wherein, each LED encapsulation monomer includes one The individual overlay crystal chip, the fluorescent glue is coated with the periphery of the overlay crystal chip, described in being externally provided with for the fluorescent glue Transparent enclosure film, the transparent enclosure film is surrounded on above the fluorescent glue and side entirely.
- 2. method for packing as claimed in claim 1, it is characterised in that the shape of the depression and the shape of the overlay crystal chip It coincide.
- 3. method for packing as claimed in claim 1, it is characterised in that the back side of the transparent enclosure film is burnishing surface.
- 4. method for packing as claimed in claim 1, it is characterised in that the transparent enclosure film back side is lens array, its In, each lens are corresponded with depression.
- 5. method for packing as claimed in claim 1, it is characterised in that the thickness of the fluorescent glue directly over the overlay crystal chip is 30~500 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038645.4A CN103855259B (en) | 2014-01-26 | 2014-01-26 | LED encapsulation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038645.4A CN103855259B (en) | 2014-01-26 | 2014-01-26 | LED encapsulation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855259A CN103855259A (en) | 2014-06-11 |
| CN103855259B true CN103855259B (en) | 2017-09-08 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410038645.4A Active CN103855259B (en) | 2014-01-26 | 2014-01-26 | LED encapsulation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN103855259B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015109580A1 (en) * | 2014-01-26 | 2015-07-30 | 上海瑞丰光电子有限公司 | Led encapsulation method |
| CN105870292B (en) * | 2015-01-22 | 2018-11-13 | 深圳市斯迈得半导体有限公司 | A kind of high leakproofness LED support |
| CN104900784B (en) * | 2015-05-22 | 2017-12-05 | 厦门多彩光电子科技有限公司 | The manufacture method of LED encapsulation structure |
| CN104900785A (en) * | 2015-05-22 | 2015-09-09 | 厦门多彩光电子科技有限公司 | Led packaging structure and manufacturing method thereof |
| CN106299079A (en) * | 2015-06-24 | 2017-01-04 | 严敏 | The method for packing of a kind of composite LED glass base plane and panel |
| CN106299039B (en) * | 2015-06-24 | 2018-12-21 | 程君 | A kind of packaging process and panel of composite LED glass base plane |
| CN105161598B (en) * | 2015-07-27 | 2019-01-01 | 鸿利智汇集团股份有限公司 | A kind of CSP encapsulating structure and manufacturing process based on moulding |
| CN105609622A (en) * | 2016-03-22 | 2016-05-25 | 武汉优炜星科技有限公司 | Ultraviolet LED packaging structure and packaging method therefor |
| CN106356438A (en) * | 2016-11-30 | 2017-01-25 | 东莞市良友五金制品有限公司 | LED (light emitting diode) support frame eutectic crystal encapsulation method |
| CN117133851A (en) * | 2023-10-26 | 2023-11-28 | 罗化芯显示科技开发(江苏)有限公司 | LED packaging diaphragm and LED packaging structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652868A (en) * | 2006-12-22 | 2010-02-17 | 皇家飞利浦电子股份有限公司 | Light emitting device including a filter |
| CN102569563A (en) * | 2012-01-20 | 2012-07-11 | 吕思远 | Wafer level packaging method of light emitting diode with adjustable lens focus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2899999B2 (en) * | 1991-05-15 | 1999-06-02 | タキロン株式会社 | Light emitting display plate and method of manufacturing the same |
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2014
- 2014-01-26 CN CN201410038645.4A patent/CN103855259B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652868A (en) * | 2006-12-22 | 2010-02-17 | 皇家飞利浦电子股份有限公司 | Light emitting device including a filter |
| CN102569563A (en) * | 2012-01-20 | 2012-07-11 | 吕思远 | Wafer level packaging method of light emitting diode with adjustable lens focus |
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| CN103855259A (en) | 2014-06-11 |
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Effective date of registration: 20210118 Address after: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: 201306 room 8650, building 1, 1758, Luchaogang Road, Luchaogang Town, Pudong New Area, Shanghai Patentee before: SHANGHAI RUIFENG OPTOELECTRONICS Co.,Ltd. |