CN117133851A - LED packaging diaphragm and LED packaging structure - Google Patents
LED packaging diaphragm and LED packaging structure Download PDFInfo
- Publication number
- CN117133851A CN117133851A CN202311393422.5A CN202311393422A CN117133851A CN 117133851 A CN117133851 A CN 117133851A CN 202311393422 A CN202311393422 A CN 202311393422A CN 117133851 A CN117133851 A CN 117133851A
- Authority
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- Prior art keywords
- led
- light guide
- led chip
- package
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000012528 membrane Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000002845 discoloration Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The application provides an LED packaging membrane and an LED packaging structure. The LED packaging membrane comprises an outer packaging body and is of a cuboid structure, wherein the outer packaging body comprises a first surface, a second surface and four side walls, the first surface and the second surface are oppositely arranged, and the four side walls are connected between the first surface and the second surface; the first surface is provided with an accommodating groove in the middle area, four side walls are respectively provided with four light guide grooves, and the light guide grooves respectively penetrate through the four side walls and are communicated with the accommodating groove; the inner seal is integrally formed by fluorescent resin materials and fills the accommodating groove and the four light guide grooves; the fluidity of the whole inner package is greater than that of the outer package in the temperature range of 60-150 ℃. The packaging membrane can ensure the stability of the inner packaging body and prevent deterioration and discoloration during use.
Description
Technical Field
The application relates to a fluorescent packaging layer and a packaging structure of a photoelectric device, in particular to an LED packaging membrane and an LED packaging structure.
Background
Optoelectronic devices, particularly LED devices as specified herein, require different color schemes to be achieved by matching LED chips of different colors with corresponding phosphors. For example, a white light color development scheme can be realized by matching a blue LED chip with a yellow-green fluorescent material, and the current LED lamp beads mostly adopt silica gel to be directly doped with fluorescent powder to form sealing glue or a sealing molding sheet, and then the blue LED chip is sealed to realize a white LED packaging structure. However, this structure has the following problems: 1. the silica gel is exposed to the external environment in a sealing way, so that the aging is easy to generate, and a large amount of silica gel aging can lead to the final light emitting display to be yellowish light and color distortion; 2. the silica gel dispensing scheme is not easy to control the dispensing shape and the manufacturing process parameters; 3. the silica gel seals that the area of the light beam that is emitted is too concentrated, creating a dark area between the multiple beads during display, which is undesirable.
Disclosure of Invention
It is an object of the present application to overcome the drawbacks described in the prior art and to provide a prefabricated LED package membrane which prevents deterioration of the fluorescent silica gel and ensures uniformity of the brightness of the light emitting area.
In order to achieve the above object, the present application provides the following technical solutions:
an LED package diaphragm, comprising:
the outer packaging body is in a cuboid structure and comprises a first surface and a second surface which are oppositely arranged, and four side walls connecting the first surface and the second surface; the first surface is provided with an accommodating groove in the middle area, four side walls are respectively provided with four light guide grooves, and the light guide grooves respectively penetrate through the four side walls and are communicated with the accommodating groove;
the inner seal is integrally formed by fluorescent resin materials and fills the accommodating groove and the four light guide grooves;
the fluidity of the whole inner package is greater than that of the outer package in the temperature range of 60-150 ℃.
Preferably, the material of the outer package is a pre-crosslinked ethylene-vinyl acetate copolymer material (EVA) having a degree of crosslinking of 40% or more.
Preferably, the material of the inner seal is silica gel dispersed with fluorescent powder.
Preferably, the projection area of the accommodating groove on the first surface accounts for 60% -75% of the area of the first surface.
Preferably, the depth of the light guide groove is smaller than the depth of the receiving groove.
Preferably, the projection of the light guide groove on the first surface is rectangular.
Preferably, the projection of the light guide groove on the first surface is horn-shaped, and the opening of the horn-shape becomes gradually larger in a direction away from the receiving groove.
The application also provides an LED packaging structure which comprises an LED chip and the LED packaging membrane, wherein the LED chip is embedded in the inner packaging body, the lower surface of the LED chip is flush with the first surface, and the light emitting surface of the LED chip faces to the second surface.
Preferably, the LED chip has an electrode provided on the lower surface of the LED chip.
Preferably, the height of the LED chip is the same as the depth of the light guide groove.
The application protects the inner packaging body by utilizing the structure of the outer packaging body and the inner packaging body, and the inner packaging body is made of fluorescent resin, so that the stability of the inner packaging body can be ensured and deterioration and discoloration can be prevented when the fluorescent resin is used. Further, the fluidity of the inner packaging body is larger than that of the outer packaging body, and the prefabricated film can directly heat and melt the inner packaging body to seal the LED chip when in use. The packaging film also comprises a light guide groove penetrating through the side wall, and the uniformity of side light can be realized by the light guide groove, so that the brightness uniformity of the light area is realized.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a three-dimensional schematic diagram of an LED package membrane;
FIG. 2 is a three-dimensional schematic of an outer package;
FIG. 3 is a cross-sectional view of an outer package;
FIG. 4 is a bottom view of the outer package;
FIG. 5 is a cross-sectional view of an LED package structure;
fig. 6 is a bottom view of an outer package of another embodiment.
Reference numerals illustrate:
10. packaging the membrane; 11. a second surface; 12. a first surface; 13. a sidewall; 14. a receiving groove; 15. an inner package; 16. a light guide groove; 20. an LED chip; 21. an electrode.
Description of the embodiments
The following will describe embodiments of the present application in detail with reference to the drawings and examples, thereby solving the technical problems by applying technical means to the present application, and realizing the corresponding technical effects can be fully understood and implemented accordingly. The embodiment of the application and the characteristics in the embodiment can be mutually combined on the premise of no conflict, and the formed technical scheme is within the protection scope of the application. In the drawings, the size of layers and regions, as well as the relative sizes, may be exaggerated for clarity. Like numbers refer to like elements throughout.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
In the following description, for the purpose of providing a thorough understanding of the present application, detailed structures and steps are presented in order to illustrate the technical solution presented by the present application. Preferred embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.
Specifically, the LED packaging membrane comprises an outer packaging body, is in a cuboid structure, and comprises a first surface, a second surface and four side walls, wherein the first surface and the second surface are oppositely arranged, and the four side walls are connected between the first surface and the second surface; the first surface is provided with an accommodating groove in the middle area, four side walls are respectively provided with four light guide grooves, and the light guide grooves respectively penetrate through the four side walls and are communicated with the accommodating groove; the inner seal is integrally formed by fluorescent resin materials and fills the accommodating groove and the four light guide grooves; the fluidity of the whole inner package is greater than that of the outer package in the temperature range of 60-150 ℃.
Referring to fig. 1, the LED package film 10 of the present application includes an outer package and an inner package, wherein the inner package and the outer package are made of a light-transmitting polymer material, and the specific materials may be selected according to the needs, and may be silica gel, epoxy resin, polymethacrylate, polycarbonate, polyacrylate, polyethylene acid ester, and the like, but it should be noted that the fluidity of the whole material of the inner package is greater than that of the material of the outer package in the temperature range of 60-150 ℃.
In particular, referring to fig. 2 and 3, the outer package has a rectangular parallelepiped shape including opposite first and second surfaces 12 and 11 and four sidewalls 13 connecting the first and second surfaces 12 and 11. The first surface 12 is used for embedding the LED chip, and the second surface 11 is used as a light emitting surface of the package. Preferably, the first surface 12 is planar, and the second surface 11 is convex, curved, which allows light to be concentrated. The inner package may be pre-molded with the first surface 12 having a receiving recess 14, the receiving recess 14 for receiving the inner package and subsequently the LED chip.
Wherein the thickness of the outer package may be 1-1.5mm, and the depth of the receiving groove 14 may be 50-75% of the thickness of the outer package, and the depth of the receiving groove 14 is not less than 800 μm. The first surface 12 of the outer package is approximately 1 square centimeter in size, and the projected area of the receiving groove on the first surface 12 is 60% -75% of the area of the first surface 12.
Referring again to fig. 2 and 3, each of the four side walls 13 has a light guiding groove 16 thereon, and the projection of the light guiding groove 16 on the first surface 12 is rectangular. The light guiding groove 16 communicates between the receiving groove 14 and the outside of the side walls 13, i.e. the light guiding groove 16 penetrates the four side walls 13 in a direction parallel to the first surface 12. The depth of the light guide groove 16 is smaller than the depth of the receiving groove 14, and the width of the light guide groove 16 in the direction perpendicular to the thickness direction of the side wall 13 is 300 to 600 micrometers, preferably 500 micrometers. The light guide groove 16 is used for side light mixing, increases the path of side light mixing and the angle adjustment of light emission, so that light rays emit light with a given color at the side, improves the brightness of the side light, and ensures the brightness uniformity.
Further, referring to fig. 1, the receiving groove 14 and the four light guide grooves 16 are filled with the inner package 15, and the bottom surface of the inner package 15 is substantially flush with the first surface 12. The inner package 15 is made of polymer material dispersed with fluorescent powder for realizing color conversion of light.
Referring to fig. 1, the inner package 15 is formed at a predetermined position by a second molding, the inner package 15 is a thermoplastic material having a heat absorption peak of 60-150 degrees celsius, and at this temperature, the material of the inner package 15 is deformed by heat and has good fluidity. Further, the fluidity of the outer package is poor at 60-150 degrees celsius, because of the special consideration of the selection of materials, on one hand, in order to achieve the plasticity of the inner package 15 to seal the LED chip, and on the other hand, in order to ensure the shape of the outer package, and further, in order to ensure the shape fixation of the LED package structure during the hot pressing process.
Preferably, the material of the outer package is a pre-crosslinked ethylene-vinyl acetate copolymer material (EVA) having a degree of crosslinking of 40% or more. The material of the inner sealing body 15 is silica gel dispersed with fluorescent powder. The specific materials may vary according to actual needs.
The LED packaging membrane 10 is a prefabricated membrane, can be conveniently transported during transportation, and is used for packaging an LED chip through a hot-pressing process, and is controllable in shape.
When the LED chip is packaged, the LED chip is only required to be fixed in advance, then the prefabricated LED packaging film 10 is hot-pressed, the temperature is 60-150 ℃, preferably 100 ℃, during hot pressing, the pressure is more than 100Mpa, so that the inner packaging body 15 is melted, the LED chip is embedded into the inner packaging body 15 under the action of pressure, and finally the LED packaging structure shown in fig. 5 is obtained through cooling and shaping. During the hot pressing, the material of the inner package flows to the outside along the light guiding groove 16, and the light guiding groove 16 also functions as an overflow.
Referring to fig. 5, the LED package structure includes the above-mentioned LED package film 10 and the LED chip 20 sealed in the package film 10, the LED chip 20 is embedded in the inner package body 15, and the bottom surface of the inner package body 15, the bottom surface of the LED chip 20 and the first surface 12 are all flush, and the bottom of the LED chip is not externally connected with a substrate or a circuit pattern or a frame, so as to ensure the thinning. The bottom surface of the LED chip 20 has an electrode 21, and the electrode 21 is exposed from the first surface 11.
The light emitting surface of the LED chip 20 faces the second surface 11, and the height of the LED chip 20 is the same as the depth of the light guiding groove 16, so that the side light of the LED chip 20 can emit light along the light guiding groove 16, the light in the light guiding groove 16 is scattered by the fluorescent powder particles, and the light can be mixed at a large angle on the side wall, so as to prevent the non-uniformity of the side light.
In this embodiment, the projection of the light guiding groove 16 on the first surface 11 is rectangular, however, the shape of the light guiding groove may also be other shapes, preferably, referring to fig. 6, the projection of the light guiding groove 16 on the first surface 11 is trumpet-shaped, and the opening of the trumpet-shape becomes gradually larger in a direction away from the receiving groove 14.
The application protects the inner packaging body by utilizing the structure of the outer packaging body and the inner packaging body, and the inner packaging body is made of fluorescent resin, so that the stability of the inner packaging body can be ensured and deterioration and discoloration can be prevented when the fluorescent resin is used. Further, the fluidity of the inner packaging body is larger than that of the outer packaging body, and the prefabricated film can directly heat and melt the inner packaging body to seal the LED chip when in use. The packaging film also comprises a light guide groove penetrating through the side wall, and the uniformity of side light can be realized by the light guide groove, so that the brightness uniformity of the light area is realized.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (10)
1. An LED package diaphragm, comprising:
the outer packaging body is in a cuboid structure and comprises a first surface and a second surface which are oppositely arranged, and four side walls connecting the first surface and the second surface; the first surface is provided with an accommodating groove in the middle area, four side walls are respectively provided with four light guide grooves, and the light guide grooves respectively penetrate through the four side walls and are communicated with the accommodating groove;
the inner seal is integrally formed by fluorescent resin materials and fills the accommodating groove and the four light guide grooves;
the method is characterized in that the fluidity of the whole inner package is larger than that of the outer package in the temperature range of 60-150 ℃.
2. The LED package film of claim 1, wherein the material of the outer encapsulant is a pre-crosslinked ethylene-vinyl acetate copolymer material (EVA) having a degree of crosslinking of greater than or equal to 40%.
3. The LED package film of claim 1, wherein said encapsulant is silica gel with phosphor dispersed therein.
4. The LED package film of claim 1, wherein the projected area of the receiving groove on the first surface is 60% -75% of the first surface area.
5. The LED package film of claim 1, wherein the light guide groove has a depth less than a depth of the receiving groove.
6. The LED package film of claim 1, wherein the projection of the light guide groove on the first surface is rectangular.
7. The LED package film of claim 1, wherein the projection of the light guiding groove on the first surface is horn-shaped, and the opening of the horn-shape becomes gradually larger in a direction away from the receiving groove.
8. An LED package structure comprising an LED chip and the LED package membrane of any one of claims 1-7, wherein the LED chip is embedded in the inner package body, and a lower surface of the LED chip is flush with the first surface, and a light emitting surface of the LED chip faces the second surface.
9. The LED package structure of claim 8, wherein,
the LED chip has an electrode disposed on the lower surface of the LED chip.
10. The LED package structure of claim 8, wherein,
the height of the LED chip is the same as the depth of the light guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311393422.5A CN117133851A (en) | 2023-10-26 | 2023-10-26 | LED packaging diaphragm and LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311393422.5A CN117133851A (en) | 2023-10-26 | 2023-10-26 | LED packaging diaphragm and LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117133851A true CN117133851A (en) | 2023-11-28 |
Family
ID=88856731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311393422.5A Pending CN117133851A (en) | 2023-10-26 | 2023-10-26 | LED packaging diaphragm and LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117133851A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101162750A (en) * | 2007-11-26 | 2008-04-16 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| JP2009246353A (en) * | 2008-03-10 | 2009-10-22 | Opt Link Co Ltd | Low-profile led light source device and low-profile led light source device manufacturing method |
| CN101894896A (en) * | 2010-06-13 | 2010-11-24 | 东南大学 | Glass ball cavity encapsulation method of light emitting diode |
| CN103855259A (en) * | 2014-01-26 | 2014-06-11 | 上海瑞丰光电子有限公司 | Led packaging method |
| CN105402630A (en) * | 2015-12-15 | 2016-03-16 | 晶科电子（广州）有限公司 | LED module light source |
| CN105449078A (en) * | 2015-12-21 | 2016-03-30 | 华中科技大学 | White light LED and preparation method thereof |
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| CN109690181A (en) * | 2016-09-08 | 2019-04-26 | 晶元光电股份有限公司 | Thin slice is used in optical-semiconductor element covering |
| CN112563396A (en) * | 2019-09-25 | 2021-03-26 | 天津德高化成新材料股份有限公司 | Chip-scale packaging structure for moisture-sensitive high-color-gamut backlight application and manufacturing method |
| CN218957765U (en) * | 2022-12-28 | 2023-05-02 | 罗化芯显示科技开发(江苏)有限公司 | Light guide element and LED packaging structure |
-
2023
- 2023-10-26 CN CN202311393422.5A patent/CN117133851A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101162750A (en) * | 2007-11-26 | 2008-04-16 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| JP2009246353A (en) * | 2008-03-10 | 2009-10-22 | Opt Link Co Ltd | Low-profile led light source device and low-profile led light source device manufacturing method |
| CN101894896A (en) * | 2010-06-13 | 2010-11-24 | 东南大学 | Glass ball cavity encapsulation method of light emitting diode |
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| CN105402630A (en) * | 2015-12-15 | 2016-03-16 | 晶科电子（广州）有限公司 | LED module light source |
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