CN211293530U

CN211293530U - Backlight module and display device

Info

Publication number: CN211293530U
Application number: CN201922455487.3U
Authority: CN
Inventors: 李泽龙; 王代青; 强科文; 季洪雷
Original assignee: Shenzhen TCL New Technology Co Ltd
Current assignee: Shenzhen TCL New Technology Co Ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-08-18
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a backlight module and display device, this backlight module includes: the LED chip module comprises a circuit board, a light source and a light source, wherein an LED chip assembly is arranged on the circuit board; the sealing adhesive layer is arranged above the circuit board and covers the LED chip assembly; and the first reflecting layer is arranged on the adhesive sealing layer and is right opposite to the LED chip assembly, and reflecting particles are arranged in the first reflecting layer. This application is through sealing the glue with the adhesive tape layer with the LED chip subassembly and is sealed the glue and handle on the circuit board to set up first reflection stratum directly over the LED chip subassembly, in order to reach the exit angle of increase LED chip light, enlarge the purpose of the interval between the LED chip, thereby reduced the quantity of LED chip, and then reduced manufacturing cost.

Description

Backlight module and display device

Technical Field

The utility model belongs to the technical field of the display technology and specifically relates to a backlight module and display device.

Background

The conventional direct-type backlight TV uses a lens to perform secondary optical distribution on a Light-Emitting Diode (LED) Light source, so that compared with a lateral TV using a Light guide plate, the direct-type backlight TV can realize uniformity of a Light-Emitting surface with fewer lamp beads, but due to the existence of the lens, an ultra-thin design cannot be realized, and due to the fact that the distance between the lamp beads is large, the number of partitions is small, so that an area Dimming (LD) effect is poor, and a display picture is not fine enough. One of them thinking is to adopt straight following formula to remove lens, and the mode that directly distributes Printed Circuit Board (PCB) with the Chip realizes the super many subregion and the slimming of being shaded, adopts COB (Chip On Board) light source technique promptly, but because there is not lens to carry out the angle with the light that the Chip sent and enlarges, needs the grain number that increases the Chip from this to make more even being shaded, therefore leads to manufacturing cost higher.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art not enough, the utility model aims to provide a backlight module and display device to reach the exit angle of increase LED chip light, enlarge the purpose of the interval between the LED chip, thereby reduced the quantity of LED chip, and then reduced manufacturing cost.

The technical scheme of the utility model as follows:

a backlight module includes:

the LED chip module comprises a circuit board, a light source and a light source, wherein an LED chip assembly is arranged on the circuit board;

the sealing adhesive layer is arranged above the circuit board and covers the LED chip assembly; and

the first reflecting layer is arranged on the adhesive sealing layer and is right opposite to the LED chip assembly, and reflecting particles are arranged in the first reflecting layer.

The utility model discloses a further setting, be provided with the LED chip subassembly that a plurality of arrays were arranged on the circuit board, LED chip subassembly includes three LED chips that the interval set up; grooves are arranged on one surface of the adhesive sealing layer, back to the LED chip assembly, at intervals, the grooves correspond to the LED chip assembly, and the first reflecting layer is contained in the grooves.

The utility model discloses a further setting, the recess is in projection area on the circuit board is greater than the LED chip subassembly is in projection area on the circuit board.

The utility model discloses a further setting, the lower side of LED chip subassembly with same one side the last side of first reflection stratum constitutes a plane, the plane has a contained angle alpha with vertical direction, wherein, the size of contained angle alpha is 30-80.

The utility model discloses a further setting, the reflection particle is the silica material.

According to a further arrangement of the present invention, the backlight module further comprises a diffusion plate and an optical film, wherein the diffusion plate is disposed above the first reflective layer, and the optical film is disposed above the diffusion plate; the LED chip assembly comprises a blue light LED chip, a green light LED chip and a red light LED chip, and the optical membrane is a brightening membrane and a composite brightening membrane which are sequentially stacked.

According to a further arrangement of the present invention, the backlight module further comprises a diffusion plate and an optical film, wherein the diffusion plate is disposed above the first reflective layer, and the optical film is disposed above the diffusion plate; the LED chip assembly comprises a blue light LED chip and a green light LED chip, and the optical diaphragm is a red quantum dot diaphragm, a brightening diaphragm and a composite brightening diaphragm which are sequentially stacked.

According to a further arrangement of the present invention, the backlight module further comprises a diffusion plate and an optical film, wherein the diffusion plate is disposed above the first reflective layer, and the optical film is disposed above the diffusion plate; the LED chip component is a blue light LED chip, and the optical diaphragm is a red quantum dot diaphragm, a green quantum dot diaphragm, a brightening diaphragm and a composite brightening diaphragm which are sequentially stacked.

In a further aspect of the present invention, a second reflective layer is disposed on the circuit board, the second reflective layer is disposed between the circuit board and the sealant layer, and the height of the second reflective layer is lower than that of the LED chip assembly; wherein the second reflecting layer is a white ink layer; a support column is arranged between the diffusion plate and the adhesive sealing layer; a third reflecting layer is arranged on the surface of the supporting column, or the supporting column is made of a transparent material; wherein the third reflective layer is a white ink layer.

A display device comprises a display screen and a backlight module.

The utility model provides a backlight module and display device, this backlight module includes: the LED chip module comprises a circuit board, a light source and a light source, wherein an LED chip assembly is arranged on the circuit board; the sealing adhesive layer is arranged above the circuit board and covers the LED chip assembly; and the first reflecting layer is arranged on the adhesive sealing layer and is right opposite to the LED chip assembly, and reflecting particles are arranged in the first reflecting layer. This application is through sealing the glue with the adhesive tape layer with the LED chip subassembly and is sealed the glue and handle on the circuit board to set up first reflection stratum directly over the LED chip subassembly, in order to reach the exit angle of increase LED chip light, enlarge the purpose of the interval between the LED chip, thereby reduced the quantity of LED chip, and then reduced manufacturing cost.

Drawings

Fig. 1 is a schematic cross-sectional view of a backlight module according to the present invention.

FIG. 2 is a schematic cross-sectional view of another backlight module of the present invention

The various symbols in the drawings: 1. a circuit board; 2. a first reflective layer; 21. reflective particles; 3. an LED chip assembly; 4. a glue sealing layer; 5. a second reflective layer; 6. a diffusion plate; 7. an optical film; 8. a support pillar; 9. and (4) a groove.

Detailed Description

The utility model provides a backlight module and display device provides a COB backlight module very much, adopt COB's form promptly, glue the back on the circuit board, glue in LED chip top and seal and do the reflection configuration, enlarge the light angle that the LED chip sent, with the interval that increases the LED chip, thereby reduce the use of LED chip, propose multiple form simultaneously and realize high gamut and show, when realizing the ultra-thin backlight of COB and show, the effectual application cost that has reduced, ultrahigh display color gamut has been realized simultaneously. In addition, the display device of the present invention may be a television, or may be another liquid crystal display device. In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the embodiments and claims, the terms "a" and "an" can mean "one or more" unless the article is specifically limited.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 and 2, the present invention provides a backlight module according to a preferred embodiment.

As shown in fig. 1 and 2, a backlight module includes a circuit board 1, a first reflective layer 2, an LED chip assembly 3, a sealant layer 4, a diffuser 6, and an optical film 7. Specifically, the plurality of LED chip assemblies 3 are arranged on the circuit board 1 in an array, wherein the LED chip assemblies 3 include three LED chips arranged at intervals, which are a blue LED chip, a green LED chip, and a red LED chip, respectively. The sealing adhesive layer 4 is arranged on the circuit board 1 and covers the LED chip assembly 3, the first reflecting layer 2 is arranged on the sealing adhesive layer 4, the first reflecting layer 2 is right opposite to the LED chip assembly 3, and reflecting particles 21 are arranged in the first reflecting layer 2. The diffusion plate 6 is disposed above the first reflective layer 2, and the optical film 7 is disposed above the diffusion plate 6. The utility model discloses an adopt the form of COB, be promptly directly pass through on the circuit board 1 the adhesive tape layer 4 will LED chip subassembly 3 seals in order to protect LED chip (blue light LED chip, green glow LED chip and ruddiness LED chip), and adhesive tape layer 4 top sets up the first reflection stratum 2 that has reflection particle 21 as reflection configuration for enlarge the light angle of LED chip, in order to reach the interval between the increase LED chip, thereby can reduce the use quantity of LED chip, reduce application cost.

In a further implementation manner of an embodiment, a groove 9 is provided at an interval on a surface of the encapsulant layer 4 opposite to the LED chip assembly 3, the groove 9 is disposed corresponding to the LED chip assembly 4, and the first reflective layer 2 is accommodated in the groove 9. Specifically, the adhesive sealing layer 4 is made of a silica gel material, and may also be transparent silica gel such as epoxy resin. The first reflective layer 2 is glue mixed with reflective particles 21, the material of the glue is preferably the same as that of the sealant layer 4, that is, a silica gel material is selected, wherein the reflective particles 21 are preferably silica, and may be other reflective particle materials. The manufacturing process comprises the following steps: after the front surface of the circuit board 1 is sealed with glue, namely the glue sealing layer 4 is arranged on the circuit board 1, a groove 9 is formed on the upper end surface of the glue sealing layer 4 after baking through a die pressing process, then silica gel glue mixed with silicon dioxide is packaged in the groove 9 through a glue dispensing process, and then the first reflection layer 2 is formed after baking and shaping, and the first reflection layer 2 is used as a reflection structure of the LED chip assembly 3.

In a further implementation manner of an embodiment, a projected area of the groove 9 on the circuit board 1 is larger than a projected area of the LED chip assembly 3 on the circuit board 1, so that the first reflective layer 2 accommodated in the groove 9 can enlarge a light angle of the LED chip assembly 3. Furthermore, the lower side of the LED chip assembly 3 and the upper side of the first reflective layer 2 on the same side form a plane, and the plane and the vertical direction form an included angle α, that is, the plane where the edge of the LED chip assembly 3 and the edge of the first reflective layer 2 on the same side are located and the vertical direction form an included angle α, where the included angle α is 30 ° to 80 °. Because of being provided with multiunit LED chip subassembly 3 on the circuit board 1, the first reflection stratum 2 that so corresponds also is provided with a plurality ofly, the plane that makes the edge of first reflection stratum 2 and the edge place at the same side of LED chip subassembly 3 have the contained angle of certain size with vertical direction, make the reflection zone not too little, in order to avoid can not enlarge the light angle of LED chip, and simultaneously, the contained angle between the edge of first reflection stratum 2 and the edge of LED chip subassembly 3 also can not be too big, the contained angle too big can lead to the reflection zone coincidence of one of them first reflection stratum 2 and another first reflection stratum 2. Wherein, in the utility model discloses in the edge of LED chip subassembly 3 with the plane at the edge place of first reflection stratum 2 has an contained angle alpha with vertical direction and is 60.

In a further implementation of an embodiment, a second reflective layer 5 is disposed on the circuit board 1, the second reflective layer 5 being disposed between the circuit board 1 and the sealant layer 4. Specifically, the second reflective layer 5 is a white ink layer, and may also be a silica gel material doped with reflective substances such as silicon dioxide, and after the LED chip assembly 3 is mounted on the circuit board 1, the white ink layer is sprayed on the upper surface of the circuit board 1 to increase the reflectivity of the LED chip. Further, the height of the second reflective layer 5 is lower than the height of the LED chip assembly 3, so as to avoid the second reflective layer 5 covering the LED chip assembly 3 to block the light emitted from the LED chip.

In a further implementation manner of an embodiment, a support pillar 8 is disposed between the diffuser plate 6 and the sealant layer 4, and a third reflective layer (not shown) is disposed on a surface of the support pillar 8. The support column 8 is used for connecting the sealant layer 4 and the diffuser plate 6 and has a supporting function on the diffuser plate 6, wherein the third reflective layer is a white ink layer to improve reflectivity. It should be noted that the supporting column 8 may also be made of transparent material directly.

In one embodiment, the LED chip assembly 3 includes a blue chip, a green chip and a red chip, and the optical film 7 is a brightness enhancement film and a composite brightness enhancement film (DBEF) stacked in sequence from bottom to top. The brightening membrane comprises a vertical prism sheet and a horizontal prism sheet, the composite brightening membrane is a 3M composite brightening membrane, the emitted polarized light is, the vertical prism sheet, the horizontal prism sheet and the DBEF membrane are sequentially stacked on the diffusion plate 6, and the diffusion membrane can be additionally arranged on the diffusion plate 6 in actual use. Because the traditional backlight television adopts the mode that the blue light chip excites the fluorescent powder to obtain the white light LED, if the LED chip is directly packaged on the circuit board 1, the fluorescent powder coating becomes a big problem, and the traditional direct type television cannot adopt the mode of packaging the fluorescent powder to directly emit white light from the LED, thereby causing poor display color gamut. This application sets up LED chip subassembly 3 into blue light chip, green glow chip and ruddiness chip to solve the problem that LED can not directly send white light under the effect of composite membrane, realized the super high display color gamut.

The utility model discloses can also set up to: LED chip module 3 includes blue light chip and green glow chip, optics diaphragm 7 is for piling up red quantum dot diaphragm, brightening diaphragm and DBEF diaphragm from bottom to top in proper order. In actual use, a diffusion film may be added to the diffusion plate 6. Specifically, when the LED chip assembly 3 is a blue LED chip and a green LED chip, the optical film 7 may further include a quantum dot film, and the quantum dot film is a red quantum dot film. The problem that the LED cannot directly emit white light is solved by adding the red quantum diaphragm on the optical diaphragm 7, and ultrahigh display color gamut is realized.

The utility model discloses can also set up to: LED chip module 3 is blue light LED chip, optics diaphragm 7 is red quantum dot diaphragm, green quantum dot diaphragm, brightening diaphragm and DBEF diaphragm from bottom to top piles up in proper order. In actual use, a diffusion film may be added to the diffusion plate 6. Specifically, when the LED chip assembly 3 is only a blue LED chip, the optical film 7 may further include a quantum dot film, the quantum dot film includes a green quantum dot film and a red quantum dot film, and the problem that the LED cannot directly emit white light is solved by adding the green quantum dot film and the red quantum dot film to the optical film 7, so that an ultrahigh display color gamut is realized.

The quantum dot material can be a first compound composed of III-V group elements and including any one of CdSe, SrSe, ZnSe, CdTe, CaSe, ZnS, CaS, MgS, SrS, BaS, MgTe, ZnTe, SrTe, MgSe, CaTe, BaSe, BaTe and CdS, or a second compound composed of II-VI group elements and including any one of GaAs, GaP, InP, InN, GaN and InAs, or a third compound and including organic-inorganic hybrid perovskite (CH3NH3PbX3, X ═ Cl, Br, I) materials, or a fourth compound and including all-inorganic cesium lead halide quantum dots (PbX 3, X ═ Cl, Br, I), or a core-shell structure compound or doped nanocrystal formed by coating multiple of the first compound, the second compound, the third compound and the fourth compound. The utility model discloses well quantum dot material is the CdSe quantum dot material preferably, and its green quantum dot size is preferred between 2-6 nm, and the green glow peak wavelength of arousing is between 510-550 nm, and the red quantum dot size is preferred between 4-9 nm, and the red light peak wavelength of arousing is between 620-650 nm.

To sum up, the utility model provides a backlight module and display device, this backlight module includes: the LED chip module comprises a circuit board, a light source and a light source, wherein an LED chip assembly is arranged on the circuit board; the sealing adhesive layer is arranged above the circuit board and covers the LED chip assembly; and the first reflecting layer is arranged on the adhesive sealing layer and is right opposite to the LED chip assembly, and the first reflecting layer is provided with reflecting particles. The backlight module also comprises a diffusion plate and an optical film, wherein the diffusion plate is arranged above the first reflecting layer, and the optical film is arranged above the diffusion plate. This application is through sealing the glue with the adhesive tape layer with the LED chip subassembly on the circuit board and is sealed the glue and handle to set up first reflection stratum directly over the LED chip subassembly, in order to reach the exit angle that increases LED chip light, enlarge the purpose of the interval between the LED chip, thereby reduced the quantity of LED chip, when realizing the ultra-thin demonstration in a poor light of COB, reduced manufacturing cost. In addition, this application has realized high color gamut display through setting up the LED chip subassembly into blue light LED chip, green glow LED chip and ruddiness LED chip, or with blue light LED chip, green glow LED chip and increase red quantum dot diaphragm on the optics diaphragm, or with blue light LED chip and increase the form of red quantum dot diaphragm and green quantum dot diaphragm on the optics diaphragm.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. A backlight module, comprising:

2. The backlight module as claimed in claim 1, wherein the circuit board is provided with a plurality of LED chip assemblies arranged in an array, and the LED chip assemblies comprise three LED chips arranged at intervals; grooves are arranged on one surface of the adhesive sealing layer, back to the LED chip assembly, at intervals, the grooves correspond to the LED chip assembly, and the first reflecting layer is contained in the grooves.

3. The backlight module as claimed in claim 2, wherein the projected area of the groove on the circuit board is larger than the projected area of the LED chip assembly on the circuit board.

4. The backlight module according to claim 3, wherein the lower side of the LED chip assembly and the upper side of the first reflective layer on the same side form a plane, and the plane and the vertical direction form an included angle α, wherein the included angle α is 30 ° to 80 °.

5. The backlight module as claimed in claim 1, wherein the reflective particles are made of silicon dioxide.

6. The backlight module according to claim 1, further comprising a diffuser plate disposed over the first reflective layer and an optical film disposed over the diffuser plate; the LED chip assembly comprises a blue light LED chip, a green light LED chip and a red light LED chip, and the optical membrane is a brightening membrane and a composite brightening membrane which are sequentially stacked.

7. The backlight module according to claim 1, further comprising a diffuser plate disposed over the first reflective layer and an optical film disposed over the diffuser plate; the LED chip assembly comprises a blue light LED chip and a green light LED chip, and the optical diaphragm is a red quantum dot diaphragm, a brightening diaphragm and a composite brightening diaphragm which are sequentially stacked.

8. The backlight module according to claim 1, further comprising a diffuser plate disposed over the first reflective layer and an optical film disposed over the diffuser plate; the LED chip component is a blue light LED chip, and the optical diaphragm is a red quantum dot diaphragm, a green quantum dot diaphragm, a brightening diaphragm and a composite brightening diaphragm which are sequentially stacked.

9. The backlight module according to any one of claims 6-8, wherein a second reflective layer is disposed on the circuit board, the second reflective layer is disposed between the circuit board and the encapsulant layer, and the height of the second reflective layer is lower than that of the LED chip assembly; wherein the second reflecting layer is a white ink layer; a support column is arranged between the diffusion plate and the adhesive sealing layer; a third reflecting layer is arranged on the surface of the supporting column, or the supporting column is made of a transparent material; wherein the third reflective layer is a white ink layer.

10. A display device comprising a display screen, and further comprising the backlight module according to any one of claims 1 to 9.